Machining system and method for laser machining workpiece

Abstract

The invention relates to a machining system for laser machining of a workpiece (104), comprising at least one laser beam source (106) for providing a plurality of coherent laser beams (110), a phase adjustment device (114) for adjusting a respective phase difference between the coherent laser beams (110), an amplification device (118) for amplifying the coherent laser beams (110), the invention relates to a laser processing apparatus (100) comprising a plurality of coherent laser beams (110), a respective amplified coherent laser beam (122) formed by amplifying the respective coherent laser beam (110), processing optics (124) for combining the amplified coherent laser beams (122) to form at least one processing laser beam (102), and for applying the at least one processing laser beam (102) to a workpiece (104), a feeding device (128) for feeding the workpiece (104) to the processing optics (124), the invention relates to a device (100) for controlling a position (x0, y0, z0) and / or an orientation (alpha0) and / or a movement state (v0, a0) of a workpiece (104) relative to at least one machining laser beam (102), a detection device (134) for determining a state of the feed device (128), and a control device (140) for controlling the phase adjustment device (114), the control device (140) being designed to control the phase adjustment device (114) as a function of the state of the feed device (128) determined by the detection device (134).

Description

Technical Field

[0001] The present invention relates to a processing system and method for laser processing a workpiece. Background Art

[0002] DE 10 2020 201 161 A1 discloses a device for combining multiple coherent laser beams, the device comprising: a separation device for separating an input laser beam into multiple coherent laser beams; multiple phase adjustment devices for adjusting the corresponding phase of one of the coherent laser beams; and a beam combining device for combining coherent laser beams emitted from multiple grid positions of a grid arrangement to form at least one combined laser beam, wherein the beam combining device has a microlens arrangement having exactly one microlens array for forming the at least one combined laser beam.

[0003] From WO 2017 / 125345 A1 a phase control system is known for controlling the relative phase of two laser beams of a laser system to be coherently combined, which is intended to provide a phase-controlled overall laser beam.

[0004] A method for determining the phase shift of several beams of a coherent beam combining device that impinge on a target is known from WO 2020 / 016824 A1.

[0005] From EP 3 597 405 A1 a device for additively manufacturing three-dimensional objects by continuously irradiating and curing layers of building material by means of an energy beam is known, wherein an irradiation device is provided, which is designed to generate at least two coherently excited energy beams, wherein the irradiation device includes a modulation unit, which is designed to combine the at least two energy beams into a combined energy beam and adjust at least one combined beam characteristic of the combined energy beam.

[0006] A laser system is known from WO 2019 / 092702 A2, which comprises: a seed laser; a subsystem for separating and combining laser beams, which receives the output from the seed laser and provides a combined laser output with noise; and a noise suppression subsystem, which is used to provide a noise-suppressed phase-corrected output based on taking into account the noise at a noise sampling rate, wherein the subsystem for separating and combining laser beams changes the phase of the combined laser output at a phase change rate that exceeds the noise sampling rate. Summary of the invention

[0007] The invention is based on the object of providing a processing system for laser processing of a workpiece as mentioned above, which processing system enables universal and flexible laser processing of a workpiece with dynamically adjustable beam parameters.

[0008] This object is achieved by the processing system mentioned at the beginning, which comprises: at least one laser beam source for providing a plurality of coherent laser beams; a phase adjustment device for adjusting the respective phase differences between the coherent laser beams; an amplification device for amplifying the coherent laser beams, wherein respective amplified coherent laser beams are formed by amplifying respective coherent laser beams; a processing optical device for combining the amplified coherent laser beams to form at least one processing laser beam, and for applying at least one processing laser beam to a workpiece; a feeding device for controlling the position and / or orientation and / or movement state of the workpiece relative to at least one processing laser beam; a detection device for determining the state of the feeding device; and a control device for controlling the phase adjustment device, wherein the control device is designed to control the phase adjustment device according to the state of the feeding device determined by the detection device.

[0009] The machining system according to the invention makes it possible to control the phase adjustment device and thus the phase difference between the coherent laser beam and the amplified coherent laser beam depending on the state of the feed device, for example depending on the position or speed of the at least one machining laser beam relative to the workpiece. By adjusting the phase difference between the coherent laser beam and the amplified coherent laser beam, the properties and / or beam parameters of the at least one machining laser beam can be adjusted. This makes it possible to adjust the properties and / or beam parameters of the at least one machining laser beam depending on the state of the feed device.

[0010] By adjusting the respective phase differences between the coherent laser beams, different beam parameters and / or properties of the at least one machining laser beam can be adjusted. This makes it possible, for example, to dynamically adjust the beam parameters and / or properties of the at least one machining laser beam as a function of the position or speed of the at least one machining laser beam relative to the workpiece. For example, the phase differences can be varied by means of a control device such that the machining laser beam has different beam parameters and / or properties in different spatial regions of the workpiece.

[0011] For example, by adjusting the respective phase differences between the coherent laser beams, the following beam parameters and / or characteristics of the existing one or more processing laser beams may be adjusted:

[0012] -Number of processing laser beams available

[0013] - the processing laser beam or respectively the intensity and / or polarization of the processing laser beam

[0014] - the processing laser beam or a corresponding spatial beam shape and / or spatial beam profile of the processing laser beam

[0015] - the temporal sequence and / or the temporal pulse shape of the pulses assigned to the machining laser beam or the corresponding machining laser beam

[0016] In particular, the processing optics are suitable for focusing the at least one processing laser beam on and / or in the workpiece.

[0017] The feed device is particularly suitable for applying the machining laser beam to the workpiece at a predetermined position as a function of time and / or for applying the machining laser beam with a predetermined orientation and / or state of motion. For example, a trajectory can be specified along which at least one machining laser beam moves relative to the workpiece. For example, the feed device can be programmed to apply the machining laser beam to the workpiece accordingly within the framework of a determined laser machining process.

[0018] For example, the amplification device may include a fiber amplifier, a slab amplifier, a rod amplifier, or a disk amplifier.

[0019] It can be provided that the amplification device comprises a frequency conversion stage or that the amplification device is assigned a frequency conversion stage of the processing system.

[0020] In particular, the phase adjustment device can be used to adjust the corresponding phase difference between the coherent laser beams and / or between the amplified coherent laser beams. In particular, the change of the phase difference between the coherent laser beams implemented by the phase adjustment device brings about a change of the phase difference between the corresponding amplified coherent laser beams.

[0021] In particular, the minimum time interval within which the state of the feed device can be determined by means of the detection device or during operation of the processing system is in the range of 1 ns to 1 μs. On this time scale, the control of the phase adjustment device and the resulting adjustment of the corresponding phase difference between the coherent laser beams can be performed in particular by means of the control device.

[0022] For example, the amplification device is arranged after the phase adjustment device. In particular, the phase adjustment device is then used to adjust the respective phase differences between the coherent laser beams before they are coupled into the amplification device. However, as an alternative, the phase adjustment device can also be arranged after the amplification device in principle.

[0023] For the wavelength of at least one machining laser beam, the workpiece can be, for example, transparent, partially transparent or opaque. For example, the workpiece can include or consist of a ceramic material and / or a metallic material and / or an organic material and / or a polymer material and / or a glass material and / or a crystalline material and / or a semiconductor material.

[0024] In particular, the state of the feed device is or includes a position of the workpiece relative to the at least one machining laser beam.

[0025] In particular, the state of the feed device is or includes the orientation of the workpiece relative to the at least one machining laser beam. For example, the state of the feed device is or includes the angle of incidence of the at least one machining laser beam relative to a reference plane of the workpiece.

[0026] In particular, the state of the feed device is or includes a state of motion of the workpiece relative to the at least one machining laser beam, such as a speed and / or acceleration of the workpiece relative to the at least one machining laser beam. The state of the feed device may in particular include a speed and / or acceleration with respect to a translation and / or rotation of the workpiece.

[0027] In particular, it can be provided that the control device is designed to adjust the respective phase difference between the coherent laser beam and / or the amplified coherent laser beam by controlling the phase adjustment device as a function of the state of the feed device. In particular, the respective phase difference can be adjusted to a predetermined target value by means of the control device as a function of the state of the feed device. This enables different characteristics of the at least one machining laser beam to be adjusted as a function of the state of the feed device.

[0028] In particular, it can be provided that the state of the feed device that can be determined or determined by means of the detection device is the actual state and / or the target state of the feed device. The control of the phase adjustment device or the adjustment of the corresponding phase difference between the coherent laser beams can then be performed as a function of the determined actual state and / or the target state of the feed device.

[0029] A target state is to be understood in particular as a state of the feed device to be achieved based on the current settings of the feed device, for example a position or speed to be achieved of the at least one machining laser beam relative to the workpiece. An actual state is to be understood in particular as a measured state of the feed device, preferably by means of a sensor device, and / or an actual state, for example a measured position or speed of the at least one machining laser beam relative to the workpiece.

[0030] It may be advantageous if the feed device has a scanner device, wherein the scanner device comprises in particular an acousto-optic deflector and / or a scanner mirror and / or a galvanometer scanner. This enables at least one output laser beam to be positioned and / or moved relative to the workpiece by means of the feed device.

[0031] It may be advantageous if the machining system comprises a mount for arranging and / or fixing the workpiece. In particular, the feed device is then assigned to the mount and is designed to move and / or orient the workpiece arranged on the mount relative to the at least one machining laser beam.

[0032] The fact that the feed device is assigned to the mounting and is designed to move and / or orient the workpiece arranged on the mounting relative to the at least one processing laser beam does not necessarily mean that the mounting (as viewed in the laboratory system) is actually moved and / or displaced in space. It is also possible that other components of the processing system (as viewed in the laboratory system) are moved and / or displaced in space in order to move the at least one processing laser beam relative to the workpiece. For example, a gantry system can be provided for this purpose.

[0033] The relative movement between the mounting and the workpiece arranged thereon on the one hand and at least one machining laser beam on the other hand can be achieved with the aid of a feed device (observed in a laboratory system), for example by moving the mounting and / or by moving a beam guiding component of at least one machining laser beam and / or by moving the machining optical device.

[0034] For example, the workpiece can be moved translationally and / or rotationally relative to the processing laser beam by means of the mounting. The translation movement occurs, for example, along two spatial axes and preferably along three spatial axes. The rotation movement occurs, for example, about at least two spatial axes.

[0035] It may be advantageous if the detection device has a sensor device for determining the actual state of the feed device, wherein the sensor device is in particular assigned to one or more components of the machining system, which are designed to move and / or orient the at least one machining laser beam relative to the workpiece. These components are assigned to the feed device and / or are part of the feed device and by means of which the position and / or orientation and / or the state of movement of the workpiece relative to the at least one machining laser beam can be adjusted.

[0036] For example, these components can be a scanner device of the feed device and / or an acousto-optic deflector of the feed device and / or a mount assigned to the feed device for arranging the workpiece and / or a beam guiding device of at least one processing laser beam and / or a processing optical device.

[0037] For example, the sensor device comprises one or more sensor elements to determine the actual state of the feed device.This makes it possible to determine the actual state of the feed device in a technically simple and reliable manner.

[0038] In particular, the sensor device can include one or more sensor elements designed as position sensors and / or speed sensors. This enables, for example, technically simple detection of positions and speeds on a scanner mirror and / or on a galvanometer scanner and / or on a mounting to determine the actual state of the feed device.

[0039] Furthermore, the sensor device can have, for example, one or more sensor elements formed as temperature sensors. This makes it possible, for example, to determine temperature-related deviations of the position or velocity of the at least one machining laser beam relative to the workpiece in the case of an acousto-optic deflector.

[0040] It may be advantageous if the detection device is designed to read and / or process data from the feed device to determine a target state of the feed device. In particular, the data read out and / or processed by means of the detection device are data relevant for adjusting the target state of the feed device. In particular, the data read out and / or processed contain the target state of the feed device at a specific point in time.

[0041] In particular, it can be provided that the control of the phase adjustment device is performed by means of the control device based on a predetermined assignment rule. It may be advantageous if the assignment rule has at least two different predefined parameter sets, which are selected depending on the state of the feed device determined by means of the detection device.

[0042] The assignment rule contains in particular an assignment of a state of the feed device to a phase difference to be set between the coherent laser beams.

[0043] The predefined parameter set is or contains specifications for adjusting the phase difference between the respective coherent laser beams according to the determined state of the feed device, ie, for adjusting the phase difference by controlling the phase adjustment device by means of the control device according to the determined state of the feed device.

[0044] During operation of the machining system, the parameter set is in particular selected on a minimum time scale in the range of 1 ns to 1 μs.

[0045] In a variant, it can be provided that the allocation rule and / or the predefined parameter set does not change during operation of the machining system.

[0046] Alternatively, the allocation rule and / or the predefined parameter set can also be adapted and / or optimized during operation of the machining system, whereby this can be done in particular on a minimum time scale of 1 μs to 1 μs.

[0047] In particular, it can be provided that the coherent laser beam provided by means of the laser beam source is a pulsed laser beam and in particular an ultrashort pulse laser beam and / or that at least one machining laser beam is a pulsed laser beam and in particular an ultrashort pulse laser beam. Ultrashort pulse laser beams can advantageously be used for precise and low-damage micro-material processing.

[0048] In principle, the coherent laser beam and / or the at least one machining laser beam can also be a continuous wave laser beam.

[0049] According to the present invention, a method for laser processing a workpiece is provided, wherein a plurality of coherent laser beams are provided, respective phase differences between the coherent laser beams are adjusted, the coherent laser beams are amplified, wherein respective amplified coherent laser beams are formed by amplifying respective coherent laser beams, the amplified coherent laser beams are combined to form at least one processing laser beam, and at least one processing laser beam is applied to the workpiece, the position and / or orientation and / or movement state of the workpiece relative to the at least one processing laser beam is controlled by means of a feed device, the state of the feed device is determined by means of a detection device, and a phase adjustment device is controlled by means of a control device, wherein the control device controls the phase adjustment device according to the state of the feed device determined by means of the detection device.

[0050] In particular, the method according to the invention has one or more further features and / or advantages of the processing system according to the invention. Advantageous embodiments of the method according to the invention have been described in conjunction with the processing system according to the invention. In particular, the method according to the invention is carried out by means of the processing system according to the invention and / or the processing system according to the invention is suitable for carrying out the method according to the invention.

[0051] The fact that a first device and / or a first element of a processing system is arranged after a second device and / or a second element of the processing system should in this case be understood to mean that a laser beam guided in the processing system, for example an input laser beam and / or a coherent laser beam and / or an amplified coherent laser beam, first impinges on the second device and / or the second element and then on the first device and / or the first element. The second device and / or the second element is then arranged upstream of the first device and / or the first element. These specifications must always relate to the main propagation direction of the laser beam guided through the processing system. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The following description of the preferred embodiments serves to explain the present invention in more detail with reference to the accompanying drawings.

[0053] In the attached picture:

[0054] Figure 1 A schematic representation of an exemplary embodiment of a processing system is shown; and

[0055] Figure 2 A plan view of a workpiece arranged on a mount of a machining system is shown.

[0056] In all the figures, elements which are identical or have equivalent functions are provided with the same reference numerals. DETAILED DESCRIPTION

[0057] exist Figure 1 An exemplary embodiment of a processing system is schematically shown in Figure 1 A machining system is denoted by 100 . By means of the machining system 100 , at least one machining laser beam 102 can be provided, which is intended for laser machining of a workpiece 104 .

[0058] exist Figure 1 In the exemplary embodiment shown, the processing system 100 comprises a laser beam source 106 , by means of which an input laser beam 108 is provided, wherein a plurality of coherent laser beams 110 are formed by splitting the input laser beam 108 .

[0059] In principle, several laser beam sources 106 can also be provided for providing a coherent laser beam 110. For example, by means of individual laser beam sources 106 one or more coherent laser beams are then provided.

[0060] For example, a separation device 112 is provided for separating the input laser beam 108 into a plurality of coherent laser beams 110. For example, Figure 1 Three coherent laser beams 110 are shown, which are formed by splitting the input laser beam 108 by means of the splitting device 110 .

[0061] The input laser beam 108 and / or the coherent laser beam 110 is, for example, a pulsed laser beam, and in particular an ultrashort pulsed laser beam.

[0062] In particular, the coherent laser beams 110 have the same characteristics, such as the same wavelength and / or the same spectrum.

[0063] A phase adjustment device 114 is provided for adjusting the respective phase differences between the respective coherent laser beams 110. In particular, the phase adjustment device 114 comprises a plurality of phase adjustment elements 116, wherein the phase of the coherent laser beam 110 assigned to the phase adjustment element 116 can be adjusted by means of a specific phase adjustment element 116. For example, a plurality or all of the coherent laser beams 110 are assigned corresponding phase adjustment elements 116.

[0064] In the case of N coherent laser beams 110 , the phase adjustment device 114 comprises, for example, N−1 or N phase adjustment elements 116 . In particular, this makes it possible to adjust the respective phase differences between all existing coherent laser beams 110 .

[0065] For technical details of combining coherent laser beams, please refer to the following scientific publications: “Coherent combination of ultrafast fiber amplifiers” by Hanna et al., Journal of Physics B: Atomic, Molecular and Optical Physics 49(6) (2016), 062004; “Performance scaling of laser amplifiers via coherent combination of ultrashort pulses”, Klenke, Mensch and Buch Verlag; “Coherent beam combining with an ultrafast multicore Yb-doped fiber amplifier” by Ramirez et al., Optics Express 23(5), (2015), 5406-5416; and “Highly scalable femtosecond coherent beam combining demonstrated with 19 fibers” by Le Dortz et al., Optics Letters 42(10), (2017), 1887-1890.

[0066] The processing system 100 comprises an amplification device 118 for amplifying the coherent laser beams 110, so as to amplify the respective coherent laser beams 110. In particular, the amplification device 118 comprises a plurality of amplification elements 120, wherein, for example, one amplification element 120 is respectively assigned to each of the coherent laser beams 110.

[0067] exist Figure 1 In the example shown, the amplification device 118 or the amplification element 120 is arranged after the phase adjustment device 114 or the phase adjustment element 116. For example, the coherent laser beam 110 coupled out from the phase adjustment device 114 is coupled into the amplification device 118. In particular, before the coherent laser beam 110 is coupled into the amplification device 118, the respective phase differences between the coherent laser beams are adjusted by means of the phase adjustment device 114.

[0068] The coherent laser beams 110 amplified by means of the amplification device 118 are referred to below as amplified coherent laser beams 122. In the example shown, the number of coherent laser beams 110 present corresponds to the number of amplified coherent laser beams 122 present.

[0069] To combine the amplified coherent laser beams 122 into the machining laser beam 102 , the machining system 100 includes machining optics 124 .

[0070] For example, the amplified coherent laser beams 122 coupled out of the amplification device 118 are coupled into the processing optical device 124. Then, the processing laser beam 102 is formed by combining these amplified coherent laser beams 122 by means of the processing optical device 124.

[0071] For example, the processing optics 124 may include a diffractive optical element and / or a grating structure and / or a microlens array and / or a focusing element.

[0072] For technical details on combining coherent laser beams using diffractive optical elements, please refer to the following scientific publications: "Coherent combination of ultrashort pulse beams using twodiffractive optics" by Zhou et al., Opt. Latvian. 42, 4422-4425 (2017); and "Diffractive-optics-based beam combination of a phase-locked fiber laserarray" by Cheung et al., Opt. Latvian. 33, 354-356 (2008), and for combining coherent laser beams with the aid of one or more microlens arrays, refer to WO 2020 / 016336 A1 and DE 102020 201 161A1.

[0073] The processing optics 124 are specifically designed to direct and / or focus the formed processing laser beam 102 into the workpiece 102 .

[0074] The workpiece 104 to be laser processed is arranged and / or fixed and / or secured, for example, to a mount 126 of the processing system 100. In particular, the workpiece 102 can be positioned and / or moved and / or tilted and / or rotated relative to the processing laser beam 102 by means of the mount 126.

[0075] For example, the workpiece 104 can be moved in three different spatial directions and / or along three different spatial axes (defined by Figure 1 , which here correspond, for example, to the x-axis, y-axis and z-axis). For example, the workpiece 104 can then be rotatable around one or more of these spatial axes by means of the mounting 126.

[0076] For example, it can be provided that one or more mounting elements 126 are arranged on a conveyor belt and / or that one or more mounting elements are formed on a conveyor belt. For example, a plurality of workpieces 104 can be arranged one after another on a conveyor belt so that they can be processed one after another by means of a processing laser beam 102.

[0077] The processing system 100 has a feed device 128, by means of which the position x0, y0, z0 and / or the orientation and / or the state of motion of the workpiece 104 relative to the processing laser beam 102 can be controlled. In particular, a translation and / or a rotation of the workpiece 104 relative to the processing laser beam 102 can be controlled by means of the feed device 128.

[0078] The position x0, y0, z0 or the state of motion is to be understood in particular as a position or a state of motion which is assigned to the focus of the machining laser beam 102 or to the focal region of the machining laser beam 102 relative to the workpiece 104. Thus, the orientation can be understood as the orientation of the focus or the focal region of the machining laser beam 102 relative to the workpiece 104.

[0079] The feed device 128 is designed in particular to introduce the at least one machining laser beam 102 into the workpiece 104 at a predetermined position and / or in a predetermined orientation and / or in a predetermined state of motion as a function of time.

[0080] The movement state of the workpiece 104 is understood to mean, for example, a velocity v0 and / or an acceleration a0 of the workpiece 104 relative to the machining laser beam 102 with respect to translation or rotation.

[0081] The orientation of the workpiece 104 may be understood as, for example, an angle of incidence α0 of the machining laser beam 102 relative to a reference plane 130 of the workpiece 104 on which the machining laser beam 102 is incident. In the example shown, the reference plane 130 is the outer side of the workpiece 104 on which the machining laser beam 102 is incident.

[0082] In one embodiment, the feed device 128 is assigned to the mount 126 and / or the mount 126 is part of the feed device 128. The feed device 128 is then designed to move the mount 126, on which the workpiece 104 is arranged, relative to the machining laser beam 102, whereby the position and / or orientation and / or the state of movement of the workpiece 104 relative to the machining laser beam 102 can be controlled by means of the feed device 128.

[0083] Alternatively or additionally, it can be provided that a feed device 128 is assigned to the processing optics 124 of the processing system 100 and / or to a beam guide of the processing laser beam 102 in order to control the position, orientation and / or the state of motion of the processing laser beam 102 relative to the workpiece 104. In particular, the processing optics 124 and / or the beam guide can then be controlled and / or moved by means of the feed device 128 in order to control the position, orientation and / or the state of motion.

[0084] It can be provided that the processing system 100 has a scanner device 132, by means of which the position, orientation and / or movement of the processing laser beam 102 relative to the workpiece 104 can be controlled. By means of the scanner device 132, the processing laser beam 102 can be positioned and / or moved and / or aligned relative to the workpiece 104.

[0085] The scanner device 132 is arranged, for example, after the amplified coherent laser beam 122 is combined by means of the processing optical device 124 and / or before the amplified coherent laser beam 122 is focused by means of the processing optical device 124 ( Figure 1 For example, the scanner device 132 is part of the processing optical device 124 or is integrated into the processing optical device 124.

[0086] The scanner device 132 includes, for example, an acousto-optic deflector and / or a scanner mirror and / or a galvanometer scanner.

[0087] The processing system 100 further comprises a detection device 134, by means of which the state of the feed device 128 can be determined. The state of the feed device 128 is understood to mean in particular the position x0, y0, z0, orientation α0 and / or movement state v0, a0 of the workpiece 104 relative to the processing laser beam 102.

[0088] In particular, an actual value and / or a target value of the state of the feed device 128 may be determined by means of the detection device 134 , ie an actual state and / or a target state of the feed device 128 may be determined.

[0089] In order to determine the target state of the feed device 128, data are read out from the feed device 128 by means of the detection device 134, based on which, for example, the workpiece 104 is controlled at a specific point in time with respect to its position and / or orientation and / or movement state relative to the processing laser beam 102 by means of the feed device 128. For this purpose, the detection device 134 is connected to the feed device 128 in a signal-effective manner ( Figure 1 as indicated).

[0090] In principle, the detection device 134 can also be part of the feed device 128 and / or integrated into the feed device 128. The detection device 134 then has in particular data of the feed device 128, based on which the workpiece 104 is controlled at a specific point in time.

[0091] In any case, detection device 134 provides determined or existing data about the target state of feed device 128 for further processing.

[0092] To determine the actual state of the feed device 128 , the detection device 134 may have a sensor device 136 . By means of the sensor device 136 , the actual state of the feed device 128 with respect to the position, orientation and / or movement of the workpiece 104 relative to the machining laser beam 102 may be measured.

[0093] The sensor device 136 is designed, for example, to detect measured values ​​associated with the mounting 126 and / or the scanner device 132, from which the actual state of the feed device 128 can be determined. In particular, the sensor device 136 has one or more sensor elements 138, which are assigned to the mounting 126 and / or the scanner device 132, for example.

[0094] Certain sensor elements 138 may be formed, for example, as position sensors, orientation sensors, speed sensors, acceleration sensors or temperature sensors.

[0095] During operation of the processing system 100, it is provided that the phase adjustment device 114 is controlled to adjust the respective phase differences between the coherent laser beams 110 and / or the amplified coherent laser beams 122. Using the phase adjustment device 114, in the example shown, the respective phase differences between the coherent laser beams 110 coupled into the amplification device 118 can be adjusted, which results in a change and / or adjustment of the respective phase differences between the respective amplified coherent laser beams 122.

[0096] In order to control the phase adjustment device 114, the processing system 100 has a control device 140, which is connected to the phase adjustment device 114 in a signal-effective manner. The control device 140 is designed to control the phase adjustment device 114 using specific control values ​​based on an assignment rule. The assignment rule contains the assignment of a target value of a corresponding phase difference between the coherent laser beam 110 and / or the amplified coherent laser beam 122 to a specific control value. For example, the assignment rule is or includes an assignment table.

[0097] The respective phase difference between the coherent laser beam 110 and / or the amplified coherent laser beam 122 can thus be adjusted to a predetermined target value by means of the control device 140 . This makes it possible to provide the machining laser beam 102 with predetermined characteristics for laser machining of the workpiece 104 .

[0098] Furthermore, the control device 140 is designed to control the phase adjustment device 114 during operation of the processing system 100 as a function of the state, in particular the target state and / or the actual state, of the feed device 128. In particular, the control device 140 is designed to adjust the respective phase difference between the coherent laser beam 110 and / or the amplified coherent laser beam 122 as a function of the state of the feed device 128.

[0099] The control device 140 is connected to the detection device 134, for example, in a signal-effective manner, in order to obtain information about the state, in particular the target state and / or the actual state, of the feed device 128 during operation of the machining system 100. Based on this information, the control device 140 then adjusts the respective phase difference between the coherent laser beam 110 or the amplified coherent laser beam 122 to a predetermined target value by correspondingly controlling the phase adjustment device 114.

[0100] For this purpose, for example, a further assignment rule can be provided, which contains the assignment of the state of the feed device to the desired target value of the corresponding phase difference. This further assignment rule can, for example, contain several predefined parameter sets of the phase difference to be adjusted, which are selected according to the state of the feed device 128.

[0101] The coherent laser beam 110 and / or the amplified coherent laser beam 122 and / or the input laser beam 108 and / or the processing laser beam 102 are directed through the main propagation direction 142 of the processing system 100 by Figure 1 Indicated by the arrow in the .

[0102] The functions of the processing system 100 are as follows:

[0103] During operation of the processing system 100, a plurality of coherent laser beams 110 are provided by means of the laser beam source 106. Figure 1 In the example shown, an input laser beam 108 is initially generated by means of a laser beam source 106 and is separated into coherent laser beams 110 by means of a separation device 112 .

[0104] In the example shown, the provided coherent laser beam 110 then passes through a phase adjustment device 114 and then through an amplification device 118 , wherein an amplified coherent laser beam 122 is formed by amplifying the coherent laser beam 110 by means of the amplification device 118 .

[0105] The amplified coherent laser beams 122 are coupled into processing optics 124 and combined and focused by means of the processing optics to form at least one processing laser beam 102. The processing laser beam 102 is introduced into a workpiece 104 and / or focused on the workpiece for laser processing of the workpiece.

[0106] In order to form one or more machining laser beams 102 with desired characteristics, the respective phase differences between the amplified coherent laser beams need to be matched before combining the amplified coherent laser beams 124. To this end, these phase differences are adjusted by controlling the phase adjustment device 114 by means of the control device 140.

[0107] For laser processing of the workpiece 104, at least one processing laser beam 102 and in particular the focus or the focus region of the processing laser beam is introduced into the workpiece 104 at a predetermined position x0, y0, z0 and / or with a predetermined orientation α0 and / or motion state v0, a0 as a function of time, or at least one processing laser beam and in particular the focus or the focus region of the processing laser beam is oriented relative to the workpiece or moved relative to the workpiece. The corresponding control of the processing laser beam 102 relative to the workpiece 104 is performed by means of a feed device 128, which is correspondingly programmed, for example, for a specific laser processing of the workpiece 104.

[0108] As explained above, the control device 140 is designed to adjust the phase difference according to the state of the feeding device 128. To this end, the control device 140 receives corresponding information from the detection device 134.

[0109] The detection device 134 determines the state of the feed device 128 , ie the actual state and / or the target state of the feed device, by reading information from the feed device 128 itself and / or from the sensor elements 138 of the sensor device 136 .

[0110] The state of the feed device 128 is understood to mean in particular the position x0 , y0 , z0 and / or the orientation α0 and / or the state of movement v0 , a0 of the workpiece 104 relative to the machining laser beam 102 acting on the workpiece 104 .

[0111] For example, a workpiece may have four different regions A1, A2, B1, and B2, which are located at Figure 2 The feed device 128 can then be configured, for example, to expose the workpiece 104 to the machining laser beam 102 in time sequence in the areas A1 , B1 , B2 and A2 to perform the laser machining operation.

[0112] By detecting the current target position and / or actual position of the machining laser beam 102 by means of the detection device 134 and forwarding this information to the control device 140, the control device can control the phase adjustment device 114, for example, in such a way that the respective phase differences between the amplified coherent laser beams 122 are adjusted to different values ​​depending on the respective areas A1, A2, B1, B2 of the workpiece 104, in which the machining laser beam 102 is currently located. For example, it can be provided that a first predefined parameter set is adjusted for the respective phase differences of the areas A1 and A2, and a second predefined parameter set is adjusted for the areas B1 and B2.

[0113] By adjusting the respective phase differences, the characteristics of the existing machining laser beam 102, such as its respective intensity, can be defined. In the example shown, for example, a predefined parameter set can be selected such that the machining laser beam 102 in areas A1 and A2 or B1 and B2 has different intensities.

[0114] Reference numerals list

[0115] A1, A2 workpiece area

[0116] B1, B2 workpiece area

[0117] x0, y0, z0 position

[0118] v0 speed

[0119] a0 acceleration

[0120] α0 Angle of incidence

[0121] 100 processing systems

[0122] 102 Processing laser beam

[0123] 104 Workpieces

[0124] 106 Laser beam source

[0125] 108 Input laser beam

[0126] 110 coherent laser beam

[0127] 112 Separation device

[0128] 114 Phase adjustment device

[0129] 116 Phase adjustment element

[0130] 118 Amplification Device

[0131] 120 Amplifier Components

[0132] 122Amplified coherent laser beam

[0133] 124 Processing optical devices

[0134] 126 Mounting parts

[0135] 128 Feeding device

[0136] 130 Reference plane

[0137] 132 Scanner Device

[0138] 134 Detection device

[0139] 136 sensor device

[0140] 138 sensor elements

[0141] 140 Control Device

[0142] 142 Main propagation direction

Claims

1. A processing system for laser processing a workpiece (104), the processing system comprising: - at least one laser beam source (106) for providing a plurality of coherent laser beams (110), - a phase adjustment device (114) for adjusting the respective phase differences between the coherent laser beams (110), - an amplification device (118) for amplifying the coherent laser beam (110), wherein a corresponding amplified coherent laser beam (122) is formed by amplifying the corresponding coherent laser beam (110), - processing optics (124) for combining the amplified coherent laser beams (122) to form at least one processing laser beam (102), and for applying the at least one processing laser beam (102) to the workpiece (104), a feeding device (128) for controlling the position (x0, y0, z0) and / or the orientation (α0) and / or the state of motion (v0, a0) of the workpiece (104) relative to the at least one machining laser beam (102), - detection means (134) for determining the state of the feed means (128), and - a control device (140) for controlling the phase adjustment device (114), wherein the control device (140) is designed to control the phase adjustment device (114) as a function of the state of the feed device (128) determined by the detection device (134).

2. The processing system according to claim 1, characterized in that: The state of the feeding device (128) includes at least one of the following: - a position (x0, y0, z0) of the workpiece (104) relative to the at least one machining laser beam (102); - an orientation of the workpiece (104) relative to the at least one machining laser beam (102), in particular an angle of incidence (α0) of the at least one machining laser beam (102) with a reference plane (130) of the workpiece (104); - the state of motion of the workpiece (104) relative to the at least one machining laser beam (102), in particular the speed (v0) and / or the acceleration (a0) of the workpiece (104) relative to the at least one machining laser beam (102).

3. The processing system according to claim 1 or 2, characterized in that: The control device (140) is designed to adjust the corresponding phase difference between the coherent laser beam (110) and / or the amplified coherent laser beam (122) by controlling the phase adjustment device (114) according to the state of the feeding device (128).

4. Processing system according to one of the preceding claims, characterized in that The state of the feed device (128) determined by means of the detection device (134) is an actual state and / or a target state of the feed device (128).

5. Processing system according to one of the preceding claims, characterized in that The feed device (128) comprises a scanner device (132), which in particular has an acousto-optic deflector and / or a scanner mirror and / or a galvanometer scanner.

6. Processing system according to one of the preceding claims, characterized in that A mounting member (126) is provided for arranging and / or fixing the workpiece (104), wherein the feed device (128) is designed to move and / or orient the workpiece (104) arranged on the mounting member (126) relative to the at least one machining laser beam (102).

7. Processing system according to one of the preceding claims, characterized in that The detection device (134) has a sensor device (136) for determining the actual state of the feed device (128), wherein the sensor device (136) is in particular assigned to one or more components of the machining system, the one or more components being designed to move and / or orient the at least one machining laser beam (102) relative to the workpiece (104).

8. Processing system according to one of the preceding claims, characterized in that The detection device (134) is designed to read out and / or process data from the feeding device (128) to determine the target state of the feeding device (128).

9. Processing system according to one of the preceding claims, characterized in that The control of the phase adjustment device (114) by means of the control device (140) is carried out based on a predetermined allocation rule, wherein the allocation rule in particular has at least two different predefined parameter sets, and the at least two different predefined parameter sets are selected according to the state of the feed device (128) determined by means of the detection device (134).

10. Processing system according to one of the preceding claims, characterized in that The coherent laser beam (110) provided by means of the laser beam source (106) is a pulsed laser beam, in particular an ultrashort pulse laser beam, and / or the at least one machining laser beam (102) is a pulsed laser beam, in particular an ultrashort pulse laser beam.

11. A method for laser processing a workpiece (102), wherein - providing a plurality of coherent laser beams (110), - adjusting the respective phase differences between the coherent laser beams (110), - amplifying the coherent laser beam (110), wherein forming a corresponding amplified coherent laser beam (122) by amplifying the corresponding coherent laser beam (110), - combining the amplified coherent laser beams (122) to form at least one machining laser beam (102), and applying the at least one machining laser beam (102) to the workpiece (104), - controlling the position (x0, y0, z0) and / or orientation (α0) and / or state of motion (v0, a0) of the workpiece (104) relative to the at least one machining laser beam (102) by means of a feed device (128), - determining the state of the feed device (128) by means of a detection device (134), and - controlling the phase adjustment device (114) by means of a control device (140), wherein the control device (140) controls the phase adjustment device (114) as a function of the state of the feed device (128) determined by means of the detection device (134).

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