Surface-mounted semiconductor refrigeration air conditioning garment

Abstract

A patch semiconductor refrigeration air conditioning garment relates to the technical field of semiconductor refrigeration and comprises a garment body and a refrigeration body. The refrigerating body is located in the hollow interlayer, and an opening is formed in the position, corresponding to the refrigerating body, of the outer surface layer. The refrigeration body comprises a semiconductor refrigeration sheet, a flexible porous screen plate and a reflective heat insulation film; the flexible porous screen plate is correspondingly connected with the clothes body, and a reflective heat insulation film is arranged on the plate surface, corresponding to the outer surface layer, of the flexible porous screen plate; a plurality of through holes penetrating through the flexible porous screen plate are formed in the reflective heat insulation film area in an array mode, semiconductor chilling plates are connected into the through holes in a fastened mode, and the refrigeration faces of the semiconductor chilling plates face the lining layer; a heat dissipation body is arranged on the heating surface of the semiconductor chilling plate; the area, corresponding to the refrigerating body, of the clothes body still has good air permeability, and therefore the overall wearing comfort is effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a patch semiconductor refrigeration air-conditioning suit. Background Art

[0002] In the hot summer, especially for those who work in special outdoor industries, they cannot enjoy the coolness brought by fans and air conditioners like office workers. For example, chefs, workers in open-air construction, construction sites, steel mills and other fields, due to the limitations of the working environment, it is difficult for them to use air conditioners and other equipment to lower their body temperature. For people working outdoors, these indoor cooling and heatstroke prevention facilities are often difficult to be effective. Therefore, the development of practical and effective personal cooling equipment has become a common goal pursued by researchers at home and abroad; A Chinese patent (publication number: CN211211537U) discloses a new type of cooling and heating air-conditioning clothing; the patent includes: two cooling and heat dissipation mechanisms are arranged on the clothing body, and the cooling and heat dissipation mechanisms also include an insulation box and a semiconductor cooling sheet; when the patent is in use, the outer layer of the clothing will swell due to inflation, causing inconvenience to the user's movement, and the clothing body has poor air permeability when the cooling and heat dissipation mechanism is not working, resulting in a poor wearing experience for the user; the above defects are problems that need to be urgently solved by technical personnel in this field. Summary of the invention

[0003] In order to overcome the deficiencies in the background technology, the present invention discloses a patch semiconductor refrigeration and air-conditioning clothing.

[0004] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A patch semiconductor refrigeration and air-conditioning clothing, comprising a clothing body, the clothing body comprising an inner layer and an outer layer, the inner layer being arranged inside the outer layer, and a hollow interlayer being arranged on the rear side of the clothing body corresponding to the outer layer and the inner layer; it also comprises a refrigeration body; the refrigeration body is located in the hollow interlayer, and the outer layer has an opening at the position corresponding to the refrigeration body; the refrigeration body comprises a semiconductor refrigeration sheet, a flexible porous mesh plate and a reflective insulation film; the flexible porous mesh plate is connected to the clothing body correspondingly, the plate surface of the flexible porous mesh plate corresponding to the outer layer is provided with a reflective insulation film, and the area of ​​the reflective insulation film is smaller than that of the flexible porous mesh plate, and a plurality of air holes are arranged in an array in the flexible porous mesh plate area corresponding to the outside of the reflective insulation film of the outer layer; a plurality of through holes penetrating the flexible porous mesh plate are arranged in an array in the reflective insulation film area, and a semiconductor refrigeration sheet is fastened to the through hole, and the cooling surface of the semiconductor refrigeration sheet faces the inner layer; a heat sink is provided on the heating surface of the semiconductor refrigeration sheet.

[0005] Preferably, the heat sink is heat dissipation bumps, heat dissipation fins or heat dissipation metal wires arranged in a row.

[0006] Preferably, a flexible isolation film capable of covering the semiconductor refrigeration film is provided on one side of the reflective insulation film corresponding to the heating surface of the semiconductor refrigeration film. The flexible isolation film is sealed with the reflective insulation film on all sides, and ventilation holes are provided at both ends of the flexible isolation film. A first fan for supplying air to the interlayer between the flexible isolation film and the reflective insulation film is installed in one of the ventilation holes.

[0007] Preferably, a second fan for extracting air is installed at the air vent of the flexible isolation membrane away from the first fan.

[0008] Preferably, the flexible porous mesh plate is detachably connected to the clothing body.

[0009] Preferably, the flexible porous mesh plate is a flexible plate made of loofah.

[0010] Preferably, the flexible porous mesh is provided with a reinforcement structure, which is a nylon thread inserted into the flexible porous mesh; or the reinforcement structure is a nylon mesh pasted on the side away from the reflective insulation film.

[0011] Preferably, the clothing body is provided with pockets for holding a mobile power source and a temperature controller.

[0012] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects: The present invention discloses a patch semiconductor refrigeration and air-conditioning clothing, which has a simple structure and a low production cost; a plurality of air holes are arranged in an array in the flexible porous mesh area corresponding to the outer side of the reflective heat insulation film on the outer surface of the clothing body, that is, the reflective heat insulation film does not completely cover the flexible porous mesh, and the area of ​​the flexible porous mesh that is not covered by the reflective heat insulation film has good air permeability, so that the area of ​​the flexible porous mesh that is covered by the reflective heat insulation film can still be connected to the external environment through the air permeability, so that the area of ​​the clothing body corresponding to the refrigeration body still has good air permeability, thereby effectively improving the overall wearing comfort; The present invention further provides a flexible isolation film capable of covering the semiconductor refrigeration plate on one side of the reflective insulation film corresponding to the heating surface of the semiconductor refrigeration plate, and forms a sandwich cavity structure that completely covers the heat sink through the flexible isolation film and the reflective insulation film. A heat dissipation airflow is delivered into the sandwich cavity structure through a first fan, and the heat dissipation airflow is discharged from another vent, thereby forced air cooling of the heat sink, effectively improving the heat dissipation effect, and improving the reliability of refrigeration of the semiconductor refrigeration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the cooling surface structure of the cooling body; Figure 3 It is a schematic diagram of the heating surface structure of the refrigeration body; Figure 4 Schematic diagram of the structure of the flexible isolation membrane.

[0014] In the figure: 1. Clothes body; 2. Refrigeration body; 2-1. Semiconductor refrigeration sheet; 2-2. Flexible porous mesh; 2-3. Reflective heat insulation film; 2-4. Heat dissipation body; 2-5. Flexible isolation film; 2-6. First fan; 2-7. Second fan; 3. Air vents. DETAILED DESCRIPTION

[0015] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0016] Embodiment 1, in combination with Figures 1 to 3 A patch semiconductor refrigeration and air-conditioning clothing comprises a clothing body 1, the clothing body 1 comprises an inner village layer and an outer layer, the inner village layer is arranged inside the outer layer, and a hollow interlayer is arranged on the rear side of the clothing body 1 corresponding to the inner village layer, that is, the inner village layer and the outer layer are arranged at intervals on the rear side of the clothing body 1; it also comprises a refrigeration body 2; the refrigeration body 2 is located in the hollow interlayer, and the outer layer has an opening at the position corresponding to the refrigeration body 2, that is, the refrigeration body 2 is arranged at the opening; it should be noted that the edges of the outer layer corresponding to the opening are fitted with the refrigeration body 2 to avoid direct exposure of the inner village layer from the opening.

[0017] The refrigeration body 2 includes a semiconductor refrigeration sheet 2-1, a flexible porous mesh plate 2-2 and a reflective insulation film 2-3; the flexible porous mesh plate 2-2 is connected to the clothing body 1, and the plate surface of the flexible porous mesh plate 2-2 corresponding to the outer layer is provided with a reflective insulation film 2-3, and the area of ​​the reflective insulation film 2-3 is smaller than the area of ​​the flexible porous mesh plate 2-2, and the outer layer corresponds to the flexible porous mesh plate 2-2 area outside the reflective insulation film 2-3. The array is provided with a plurality of air holes 3, that is, the reflective insulation film 2-3 does not completely cover the flexible porous mesh plate 2-2, and the area of ​​the flexible porous mesh plate 2-2 not covered by the reflective insulation film 2-3 has good air permeability, so that the area of ​​the flexible porous mesh plate 2-2 covered by the reflective insulation film 2-3 can still be connected to the external environment through the air holes 3, so that the area of ​​the clothing body 1 corresponding to the refrigeration body 2 still has good air permeability, thereby effectively improving the overall wearing comfort.

[0018] A plurality of through holes penetrating the flexible porous mesh plate 2-2 are arranged in an array in the area of ​​the reflective heat-insulating film 2-3, and a semiconductor refrigeration sheet 2-1 is fastened and connected in the through hole, and the cooling surface of the semiconductor refrigeration sheet 2-1 faces the inner village layer; a heat sink 2-4 is provided on the heating surface of the semiconductor refrigeration sheet 2-1; the semiconductor refrigeration sheet 2-1 is an existing device, so its structure and working principle are not described in detail; when in use, the semiconductor refrigeration sheet 2-1 is connected to a power source, and the power source can be a mobile power source to provide convenience for the user, and a cooling effect is generated through the cooling surface of the semiconductor refrigeration sheet 2-1 to cool the user, and the semiconductor refrigeration sheet 2-1 is cooled by the heat sink 2-4 to ensure that it can work normally; the heat sink 2-4 is a heat dissipation bump, heat dissipation fin or heat dissipation wire arranged in a row, that is, the heat dissipation area of ​​the heating surface of the semiconductor refrigeration sheet 2-1 is increased by the heat sink 2-4, thereby achieving a better heat dissipation effect; As needed, the clothing body 1 is provided with pockets for holding a mobile power source and a temperature controller, which can further improve convenience.

[0019] It should be noted that the reflective heat-insulating film 2-3 can prevent the heat emitted by the heat sink 2-4 from being radiated to the user through the flexible porous mesh plate 2-2, thereby ensuring the cooling effect.

[0020] It should be noted that the flexible porous mesh plate 2-2 not only improves air permeability but also takes into account the function of fixing the semiconductor cooling sheet 2-1. The flexible porous mesh plate 2-2 needs to have good thermal insulation performance to prevent the heat generated by the semiconductor cooling sheet 2-1 from being transferred to the user along the flexible porous mesh plate 2-2. The flexible porous mesh plate 2-2 is preferably a flexible plate made of loofah, which is a natural porous material and has a certain structural strength and good thermal insulation performance. In order to further improve the structural strength of the flexible board made of loofah, a reinforcing structure is provided in the flexible porous mesh plate 2-2. The reinforcing structure is a nylon thread inserted into the flexible porous mesh plate 2-2, that is, multiple nylon threads can be criss-crossed along the flexible porous mesh plate 2-2, and the structural strength of the flexible porous mesh plate 2-2 is improved by weaving a nylon thread net; or the reinforcing structure is a nylon mesh pasted on the side away from the reflective insulation film 2-3, that is, a composite material is formed by pasting the nylon mesh and the loofah, thereby ensuring the structural strength of the flexible porous mesh plate 2-2 and improving the overall service life.

[0021] Embodiment 2: In actual use, it is found that when the ambient temperature is high, the heat dissipation effect of the heat sink 2-4 is poor, and it is difficult to ensure that the semiconductor refrigeration sheet 2-1 can operate normally; in order to solve this technical problem, this embodiment is further improved; Combined with Figures 1 to 4, a patch semiconductor refrigeration air-conditioning clothing, which is different from Example 1 in that, on the basis of Example 1, a side of the reflective insulation film 2-3 corresponding to the heating surface of the semiconductor refrigeration sheet 2-1 is provided with a flexible isolation film 2-5 capable of covering the semiconductor refrigeration sheet 2-1, and the four sides of the flexible isolation film 2-5 are sealed with the reflective insulation film 2-3, and both ends of the flexible isolation film 2-5 are provided with vents, one of the vents is equipped with a first fan 2-6 for supplying air to the interlayer between the flexible isolation film 2-5 and the reflective insulation film 2-3, that is, a sandwich cavity structure that can completely cover the heat sink 2-4 can be formed by the flexible isolation film 2-5 and the reflective insulation film 2-3, and a heat dissipation airflow is supplied into the sandwich cavity structure by the first fan 2-6, and the heat dissipation airflow is discharged from another vent, thereby forcing the heat sink 2-4 to be cooled by air, effectively improving the heat dissipation effect, and improving the reliability of the refrigeration of the semiconductor refrigeration sheet 2-1; In order to further enhance the heat dissipation effect, the flexible isolation membrane 2-5 is provided with a second fan 2-7 for exhausting air at the vent hole away from the first fan 2-6, which can further enhance the heat dissipation airflow and thus improve the heat dissipation effect; It should be noted that the reflective insulation film 2-3 is sealed and connected to the semiconductor cooling sheet 2-1 at the edges around it corresponding to the semiconductor cooling sheet 2-1, so as to prevent the heat dissipation airflow from entering the flexible porous mesh plate 2-2 and then spreading to the user.

[0022] Embodiment 3, in combination with Figure 1 , a patch semiconductor refrigeration and air-conditioning clothing, based on embodiment 1 or 2, the flexible porous mesh plate 2-2 is detachably connected to the clothing body 1, and the flexible porous mesh plate 2-2 is detachably connected to the inner layer and the outer layer of the clothing body 1 by Velcro or hidden buttons. When the clothing body 1 needs to be washed, the flexible porous mesh plate 2-2 can be separated from the clothing body 1, and then the refrigeration body 2 can be removed, thereby facilitating the washing operation of the clothing body 1.

[0023] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A patch semiconductor refrigeration and air conditioning clothing, comprising a clothing body (1), the clothing body (1) comprising an inner village layer and an outer layer, the outer layer is provided with an inner village layer, and the outer layer and the inner village layer correspond to a hollow interlayer on the back side of the clothing body (1); the characteristics are: The invention also comprises a refrigeration body (2); the refrigeration body (2) is located in the hollow interlayer, and the outer layer has an opening at a position corresponding to the refrigeration body (2); the refrigeration body (2) comprises a semiconductor refrigeration sheet (2-1), a flexible porous mesh plate (2-2) and a reflective heat insulation film (2-3); the flexible porous mesh plate (2-2) is connected to the clothing body (1) correspondingly, and the reflective heat insulation film (2-3) is provided on the plate surface corresponding to the outer layer of the flexible porous mesh plate (2-2), and the area of ​​the reflective heat insulation film (2-3) is smaller than that of the flexible porous mesh plate (2-2). The porous mesh plate (2-2) has an area, and the outer layer corresponds to a flexible porous mesh plate (2-2) outside the reflective insulation film (2-3) and is arranged in an array with a plurality of air holes (3); the reflective insulation film (2-3) has a plurality of through holes arranged in an array that penetrate the flexible porous mesh plate (2-2); a semiconductor cooling sheet (2-1) is fastened and connected in the through hole, and the cooling surface of the semiconductor cooling sheet (2-1) faces the inner layer; and a heat sink (2-4) is provided on the heating surface of the semiconductor cooling sheet (2-1).

2. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 1, characterized in that: The heat sink (2-4) is heat sink bumps, heat sink fins or heat sink metal wires arranged in a row.

3. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 1, characterized in that: A flexible isolation film (2-5) capable of covering the semiconductor refrigeration film (2-1) is provided on one side of the reflective insulation film (2-3) corresponding to the heating surface of the semiconductor refrigeration film (2-1); the four sides of the flexible isolation film (2-5) are sealed with the reflective insulation film (2-3); both ends of the flexible isolation film (2-5) are provided with ventilation holes, and a first fan (2-6) for supplying air into the interlayer between the flexible isolation film (2-5) and the reflective insulation film (2-3) is installed in one of the ventilation holes.

4. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 3, characterized in that: A second fan (2-7) for extracting air is installed at a vent hole of the flexible isolation membrane (2-5) away from the first fan (2-6).

5. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 1, characterized in that: The flexible porous mesh plate (2-2) is detachably connected to the clothing body (1).

6. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 1, characterized in that: The flexible porous mesh plate (2-2) is a flexible plate made of loofah.

7. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 6, characterized in that: The flexible porous mesh plate (2-2) is provided with a reinforcement structure, which is a nylon line inserted into the flexible porous mesh plate (2-2); or the reinforcement structure is a nylon mesh pasted on the side away from the reflective heat insulation film (2-3).

8. The patch semiconductor refrigeration and air conditioning clothing as claimed in claim 1, characterized in that: The clothing body (1) is provided with pockets for containing a mobile power source and a temperature control controller.

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