Intelligent ring

Abstract

The invention discloses an intelligent ring, and relates to the technical field of wearable device.The intelligent ring comprises a body, a thermoelectric power generation module and a boosting module, a wearing hole is defined by the inner side of the body, the body can be worn outside a wearer through the wearing hole, a containing cavity is formed in the body, and a battery is arranged in the containing cavity; the thermoelectric power generation module is arranged in the accommodating cavity and comprises an input semiconductor and an output semiconductor, the input semiconductor is arranged close to the inner side of the body, and the output semiconductor is arranged close to the outer side of the body; the boosting module is connected with the output semiconductor and is used for charging the battery; the thermoelectric power generation module is arranged on the ring surface on the outer side of the body, and the shape of the output semiconductor is matched with that of the ring surface. According to the technical scheme, the temperature difference power generation module is arranged on the ring surface of the body, the contact area between the output semiconductor and the external environment can be increased, the heat dissipation effect of the output semiconductor is improved, and therefore the power generation effect of the temperature difference power generation module is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wearable devices, and in particular to a smart ring. Background Art

[0002] Smart rings are beautiful, compact, lightweight, and have strong privacy, and have received widespread attention. However, due to their size limitations and the increasing number of functions such as NFC, heart rate, blood oxygen, sleep monitoring, blood pressure, and blood sugar testing, the power consumption of ring products is also increasing. The smart rings in the existing technology have insufficient battery life and often need to be charged after a few hours of use, resulting in a poor user experience. Summary of the invention

[0003] The main purpose of the present invention is to propose a smart ring, aiming to solve the problem of insufficient battery life of smart rings in the prior art, resulting in poor user experience.

[0004] To achieve the above object, the smart ring proposed by the present invention includes:

[0005] A body, wherein the inner side of the body is surrounded by a wearing hole, the body can be worn outside the wearer's body through the wearing hole, and a receiving cavity is formed in the body, and a battery is arranged in the receiving cavity;

[0006] A temperature difference power generation module, the temperature difference power generation module is arranged in the accommodating cavity, the temperature difference power generation module comprises an input semiconductor and an output semiconductor, the input semiconductor is arranged close to the inner side of the body, and the output semiconductor is arranged close to the outer side of the body;

[0007] A boost module, which is connected to the output semiconductor and is used to charge the battery;

[0008] The temperature difference power generation module is arranged at the ring face outside the body, and the shape of the output semiconductor is adapted to the shape of the ring face.

[0009] In one embodiment, a heat dissipation structure for dissipating heat from the output semiconductor is provided on the outer side of the body corresponding to the output semiconductor, so as to expand the temperature difference between the input semiconductor and the output semiconductor through the heat dissipation structure, and the heat dissipation structure is provided on the outer side of the ring surface.

[0010] In one embodiment, an opening communicating with the accommodating cavity is formed at the main body corresponding to the ring surface, the output semiconductor is arranged close to the opening, a sealing cover is provided at the opening, the sealing cover blocks the opening and shields the output semiconductor, and the heat dissipation structure shields the opening.

[0011] In one embodiment, the heat dissipation structure includes a heat conductive member and a heat dissipating member connected to each other, the heat conductive member passes through the sealing cover and extends into the accommodating cavity to be connected to the output semiconductor, the heat dissipating member is located outside the opening and blocks the opening, and the heat dissipating member forms a plurality of heat dissipating openings arranged at intervals.

[0012] In one embodiment, the heat conducting member includes a heat conducting plate and a contact plate, the first end of the heat conducting plate is connected to the heat sink, the second end of the heat conducting plate passes through the sealing cover and extends into the accommodating cavity, the second end of the heat conducting plate is provided with the contact plate, the contact plate is used to be connected to the output semiconductor, and the shape of the contact plate is adapted to the shape of the output semiconductor.

[0013] In one embodiment, the heat conducting plate is an annular heat conducting plate embedded in the opening, the sealing cover is sealed to the inner periphery of the heat conducting plate, the first end of the heat conducting plate is connected to the outer periphery of the heat sink, and the second end of the heat conducting plate extends inward to form the contact plate.

[0014] In one embodiment, a heat-conducting layer is provided between the contact plate and the output semiconductor, and the heat-conducting layer is a heat-conducting gel or a heat-conducting pad.

[0015] In one embodiment, the heat sink is an outwardly protruding arc-shaped heat sink, a heat dissipation space is formed between the heat sink and the sealing cover, and the heat sink is provided with a plurality of heat dissipation ports connected to the heat dissipation space.

[0016] In one embodiment, the heat dissipation opening is arranged in a long strip shape, and a plurality of the heat dissipation openings are arranged on the heat dissipation element at intervals and cover the heat dissipation element.

[0017] In one embodiment, the smart ring is further provided with a protection chip, which is connected in series between the boost module and the battery and is used to control the on and off of the boost module and the battery.

[0018] The technical solution of the present invention is to set a temperature difference power generation module in the smart ring, set the input semiconductor close to the inner side of the body, so that it is close to the human body surface and absorbs the heat from the human body surface, and set the output semiconductor close to the outer side of the body, so that it is close to the external environment. It can be understood that in most cases, the human body surface temperature is higher than the ambient temperature, so there will be a temperature difference between the input semiconductor and the output semiconductor, thereby forming a voltage, which is boosted by the boost module to power the battery of the body, so that the smart ring does not need to be taken off and can be charged through the wearer's own heat, thereby improving the battery life of the smart ring, reducing the number of charging times, and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of the smart ring provided by the present invention;

[0021] Figure 2 A schematic diagram of a partial cross-sectional structure of a smart ring provided by the present invention;

[0022] Figure 3 A schematic diagram of the heat dissipation structure of the smart ring provided by the present invention;

[0023] Figure 4 This is a schematic cross-sectional structure diagram of the heat dissipation structure of the smart ring provided by the present invention.

[0024] Description of Figure Numbers:

[0025] 100. Smart ring; 1. Main body; 11. Wearing hole; 12. Accommodation cavity; 13. Battery; 14. Opening; 15. Sealing cover; 2. Temperature difference power generation module; 21. Input semiconductor; 22. Output semiconductor; 3. Heat dissipation structure; 31. Heat conductor; 311. Heat conduction plate; 312. Contact plate; 32. Heat dissipation element; 33. Heat dissipation port.

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0030] The smart rings in the prior art have insufficient battery life and often need to be charged after a few hours of use, resulting in a poor user experience.

[0031] In order to solve the above problems, the present invention proposes a smart ring 100.

[0032] Please combine Figure 1 and Figure 2 The smart ring 100 of this embodiment includes a main body 1, a temperature difference power generation module 2 and a boost module (not shown). The inner side of the main body 1 is surrounded by a wearing hole 11, and the main body 1 can be worn outside the wearer's body through the wearing hole 11. A receiving cavity 12 is formed in the main body 1, and a battery 13 is arranged in the receiving cavity 12; the temperature difference power generation module 2 is arranged in the receiving cavity 12, and the temperature difference power generation module 2 includes an input semiconductor 21 and an output semiconductor 22. The input semiconductor 21 is arranged close to the inner side of the main body 1, and the output semiconductor 22 is arranged close to the outer side of the main body 1; the boost module is connected to the output semiconductor 22 and is used to charge the battery 13; the temperature difference power generation module 2 is arranged at the ring surface on the outer side of the main body 1, and the shape of the output semiconductor 22 is adapted to the shape of the ring surface.

[0033] The technical solution of the present invention is to set a temperature difference power generation module 2 in the smart ring 100, set the input semiconductor 21 close to the inner side of the main body 1, so that it is close to the human body surface and absorbs the heat from the human body surface, and set the output semiconductor 22 close to the outer side of the main body 1, so that it is close to the external environment. It can be understood that in most cases, the human body surface temperature is higher than the ambient temperature, so there will be a temperature difference between the input semiconductor 21 and the output semiconductor 22, thereby forming a voltage. After being boosted by the boost module, it supplies power to the battery 13 of the main body 1, so that the smart ring 100 does not need to be taken off and can be charged through the wearer's own heat, thereby improving the battery life of the smart ring 100, reducing the number of charging times, and improving the user experience. At the same time, the ring face of the ring is the part with the largest area. Setting the thermoelectric power generation module 2 on the ring face of the main body 1 can increase the contact area between the output semiconductor 22 and the external environment, and improve the heat dissipation effect of the output semiconductor 22. It can be understood that the greater the temperature difference between the input semiconductor 21 and the output semiconductor 22, the better the power generation effect. Therefore, the better the heat dissipation effect of the output semiconductor 22, the greater the temperature difference, thereby improving the power generation effect of the thermoelectric power generation module 2.

[0034] In the prior art, some smart rings use the temperature difference between the human body and the outside temperature to generate electricity by setting a temperature difference power generation module inside the smart ring to improve the endurance of the smart ring. However, due to the small size of the smart ring, the temperature of the human body will cover the entire smart ring under the effect of heat conduction, causing the temperature of the input semiconductor and the output semiconductor of the temperature difference power generation module to approach the body temperature. The power generation effect of the temperature difference power generation module depends on the temperature difference between the input semiconductor and the output semiconductor. Therefore, the power generation effect of the temperature difference power generation module of the smart ring in the prior art is not good.

[0035] Please combine Figures 1 to 4 In one embodiment, a heat dissipation structure 3 for dissipating heat from the output semiconductor 22 is provided on the outer side of the main body 1 corresponding to the output semiconductor 22, so as to expand the temperature difference between the input semiconductor 21 and the output semiconductor 22 through the heat dissipation structure 3, and the heat dissipation structure 3 is provided on the outer side of the ring surface.

[0036] By dissipating heat from the output semiconductor 22 through the heat dissipation structure 3 , the operating temperature of the output semiconductor 22 can be effectively reduced, thereby maintaining the temperature difference between the input semiconductor 21 and the output semiconductor 22 . A larger temperature difference helps to improve the power generation efficiency of the thermoelectric power generation module 2 .

[0037] Furthermore, an opening 14 communicating with the accommodating cavity 12 is formed at the corresponding ring surface of the main body 1, the output semiconductor 22 is arranged near the opening 14, a sealing cover 15 is provided at the opening 14, the sealing cover 15 blocks the opening 14 and shields the output semiconductor 22, and the heat dissipation structure 3 shields the opening 14.

[0038] By arranging the output semiconductor 22 close to the opening 14, the output semiconductor 22 reduces the portion blocked by the main body 1, and the output semiconductor 22 can better exchange heat with the air to dissipate heat. The heat dissipation structure 3 blocks the opening 14, and the heat accumulated at the opening 14 can be dissipated in time, thereby ensuring that the output semiconductor 22 is at a lower temperature and ensuring the temperature difference between the input semiconductor 21 and the output semiconductor 22; at the same time, the sealing cover 15 can effectively prevent dust, moisture and other external substances from entering, protect the output semiconductor 22 from damage, and extend its service life.

[0039] It should be noted that the material of the sealing cover 15 needs to be selected to have better thermal conductivity than the thermal conductivity of the body 1 (that is, the thermal conductivity of the sealing cover 15 is higher than the thermal conductivity of the body 1), so that the body 1 provides internal support and the sealing cover 15 is used for heat dissipation.

[0040] Please combine Figure 3 and Figure 4 Specifically, the heat dissipation structure 3 includes a heat conductive member 31 and a heat dissipating member 32 that are connected to each other. The heat conductive member 31 passes through the sealing cover 15 and extends into the accommodating cavity 12 to be connected to the output semiconductor 22. The heat dissipating member 32 is located outside the opening 14 and blocks the opening 14, and the heat dissipating member 32 forms a plurality of heat dissipating ports 33 that are spaced apart.

[0041] By passing the heat conductor 31 through the sealing cover 15 and directly connecting with the output semiconductor 22, heat can be transferred more effectively, and heat accumulation caused by the heat being blocked by the sealing cover 15 and unable to be dissipated in time can be reduced, ensuring that heat is quickly transferred from the semiconductor to the heat dissipation structure 3, thereby enhancing the heat dissipation capacity, reducing the operating temperature of the output semiconductor 22, and ensuring the temperature difference between the input semiconductor 21 and the output semiconductor 22.

[0042] In one embodiment, the heat conducting member 31 includes a heat conducting plate 311 and a contact plate 312. The first end of the heat conducting plate 311 is connected to the heat dissipating member 32. The second end of the heat conducting plate 311 passes through the sealing cover 15 and extends into the accommodating cavity 12. The second end of the heat conducting plate 311 is provided with a contact plate 312. The contact plate 312 is used to be connected to the output semiconductor 22. The shape of the contact plate 312 is adapted to the shape of the output semiconductor 22.

[0043] A contact plate 312 is provided at the second end of the heat conducting plate 311, and the shape of the contact plate 312 is set to match the shape of the output semiconductor 22. The shape-matched contact plate 312 can maximize the contact area with the output semiconductor 22, ensure more effective heat transfer, reduce thermal resistance, and improve heat dissipation efficiency. At the same time, the shape-matched contact plate 312 can fit tightly with the output semiconductor 22, and the contact plate 312 can quickly introduce the heat generated by the output semiconductor 22 into the heat dissipation structure 3, thereby enhancing the overall heat dissipation effect and ensuring the temperature difference between the input semiconductor 21 and the output semiconductor 22.

[0044] Furthermore, the heat conducting plate 311 is an annular heat conducting plate 311 embedded in the opening 14 , the sealing cover 15 is sealed to the inner periphery of the heat conducting plate 311 , the first end of the heat conducting plate 311 is connected to the outer periphery of the heat sink 32 , and the second end of the heat conducting plate 311 extends inward to form a contact plate 312 .

[0045] The heat conducting plate 311 is an annular heat conducting plate 311, which can evenly distribute the heat from the surrounding of the contact plate 312, avoid local overheating, and improve the heat dissipation efficiency. At the same time, the annular heat conducting plate 311 is larger in volume, which increases the heat conduction paths of the heat conducting element 31. Heat can be transferred from the contact plate 312 to the heat dissipation element 32 through more paths, thereby enhancing the heat conduction effect, reducing the accumulation of heat in a certain area, and improving the heat dissipation efficiency.

[0046] In one embodiment, a heat-conducting layer (not shown) is disposed between the contact plate 312 and the output semiconductor 22 , and the heat-conducting layer is a heat-conducting gel or a heat-conducting pad.

[0047] There is usually a tiny gap or uneven surface between the output semiconductor 22 and the contact plate 312, resulting in air being trapped between the two. The thermal conductivity of air is very poor, forming a large interface thermal resistance. Filling the gap with thermally conductive gel or thermally conductive pads can reduce the interface thermal resistance and improve the thermal conduction efficiency. At the same time, both thermally conductive gel and thermally conductive pads have good thermal conductivity, which can ensure that the heat generated by the output semiconductor 22 is quickly and efficiently transferred to the contact plate 312, thereby improving the heat dissipation performance.

[0048] In one embodiment, the heat sink 32 is an outwardly protruding arc-shaped heat sink, a heat dissipation space is formed between the heat sink 32 and the sealing cover 15 , and the heat sink 32 is provided with a plurality of heat dissipation ports 33 connected to the heat dissipation space.

[0049] The heat sink 32 protrudes outward, thereby forming a heat dissipation space between the sealing cover 15, and the heat dissipation port 33 is connected with the heat dissipation space to form a channel for air flow, thereby improving the air flow efficiency, allowing the high-temperature air after heat exchange to flow away, and new low-temperature air to flow in and fully contact the arc-shaped heat sink, exchanging the heat accumulated on the arc-shaped heat sink, thereby dissipating the heat for the output semiconductor 22 through the arc-shaped heat sink and the heat conductor 31, thereby improving the heat dissipation efficiency.

[0050] In one embodiment, the heat dissipation opening 33 is arranged in a long strip shape, and a plurality of the heat dissipation openings 33 are arranged at intervals on the heat dissipation element 32 and cover the heat dissipation element 32 .

[0051] Multiple long heat dissipation ports 33 can effectively increase the surface area of ​​the heat sink 32, thereby increasing the contact area with the surrounding air and enhancing the heat dissipation effect. Multiple heat dissipation ports 33 cover the heat sink 32, which can maximize the surface area of ​​the heat sink 32, help transfer heat to the air faster, and achieve better heat dissipation performance. At the same time, the long heat dissipation ports 33 increase the size of the opening 14 for air to enter the heat dissipation space, allowing air to pass through the heat dissipation channel more smoothly, thereby improving heat dissipation efficiency.

[0052] In one embodiment, the smart ring 100 is further provided with a protection chip, which is connected in series between the boost module and the battery 13 and is used to control the on-off of the boost module and the battery 13. The protection chip can monitor the voltage of the battery 13 to prevent the boost module from outputting an excessively high voltage, thereby protecting subsequent circuits and loads from damage. It can also quickly cut off the power supply when a short circuit is detected to prevent the battery 13 and other circuits from being seriously damaged, thereby improving the safety of the smart ring 100 and extending its service life.

[0053] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A smart ring, characterized in that: include: A body, wherein the inner side of the body is surrounded by a wearing hole, the body can be worn outside the wearer's body through the wearing hole, and a receiving cavity is formed in the body, and a battery is arranged in the receiving cavity; A temperature difference power generation module, the temperature difference power generation module is arranged in the accommodating cavity, the temperature difference power generation module comprises an input semiconductor and an output semiconductor, the input semiconductor is arranged close to the inner side of the body, and the output semiconductor is arranged close to the outer side of the body; A boost module, which is connected to the output semiconductor and is used to charge the battery; The temperature difference power generation module is arranged at the ring face outside the body, and the shape of the output semiconductor is adapted to the shape of the ring face.

2. The smart ring according to claim 1, characterized in that: A heat dissipation structure for dissipating heat from the output semiconductor is disposed on the outer side of the body corresponding to the output semiconductor, so as to expand the temperature difference between the input semiconductor and the output semiconductor through the heat dissipation structure, and the heat dissipation structure is disposed on the outer side of the ring face.

3. The smart ring according to claim 2, characterized in that: An opening communicating with the accommodating cavity is formed at the main body corresponding to the ring surface, the output semiconductor is arranged close to the opening, a sealing cover is arranged at the opening, the sealing cover blocks the opening and shields the output semiconductor, and the heat dissipation structure shields the opening.

4. The smart ring according to claim 3, characterized in that: The heat dissipation structure includes a heat conducting member and a heat dissipating member connected to each other. The heat conducting member passes through the sealing cover and extends into the accommodating cavity to be connected to the output semiconductor. The heat dissipating member is located outside the opening and blocks the opening, and the heat dissipating member forms a plurality of heat dissipating openings arranged at intervals.

5. The smart ring according to claim 4, characterized in that: The heat conducting member includes a heat conducting plate and a contact plate, wherein the first end of the heat conducting plate is connected to the heat dissipating member, the second end of the heat conducting plate passes through the sealing cover and extends into the accommodating cavity, the second end of the heat conducting plate is provided with the contact plate, the contact plate is used to be connected to the output semiconductor, and the shape of the contact plate is adapted to the shape of the output semiconductor.

6. The smart ring according to claim 5, characterized in that: The heat conducting plate is an annular heat conducting plate embedded in the opening, the sealing cover is sealed on the inner periphery of the heat conducting plate, the first end of the heat conducting plate is connected to the outer periphery of the heat sink, and the second end of the heat conducting plate extends inward to form the contact plate.

7. The smart ring according to claim 5, characterized in that: A heat-conducting layer is arranged between the contact plate and the output semiconductor, and the heat-conducting layer is a heat-conducting gel or a heat-conducting pad.

8. The smart ring according to claim 5, characterized in that: The heat sink is an outwardly protruding arc-shaped heat sink, a heat dissipation space is formed between the heat sink and the sealing cover, and the heat sink is provided with a plurality of heat dissipation openings connected to the heat dissipation space.

9. The smart ring according to claim 8, characterized in that: The heat dissipation opening is arranged in a long strip shape, and a plurality of the heat dissipation openings are arranged on the heat dissipation element at intervals and cover the heat dissipation element.

10. The smart ring according to any one of claims 1 to 9, characterized in that: The smart ring is also provided with a protection chip, which is connected in series between the boost module and the battery and is used to control the on and off of the boost module and the battery.

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