Heat insulation assembly, electronic equipment, shell assembly and functional module

Abstract

The invention discloses a heat insulation assembly, electronic equipment, a shell assembly and a functional module, and belongs to the technical field of electronic heat dissipation. The heat insulation assembly comprises a first cover plate and a second cover plate, the first cover plate and the second cover plate are stacked in the thickness direction, and a closed space is defined by the first cover plate and the second cover plate; wherein the closed space is a vacuum space; and / or the closed space is filled with a heat insulation medium. According to the heat insulation assembly, heat insulation is achieved through the vacuum environment and / or the heat insulation medium, the heat insulation problem of different functional modules (such as a screen module) can be better solved, and the use experience of a user is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic heat dissipation, and in particular to a thermal insulation component, an electronic device, a housing component and a functional module. Background Art

[0002] In the field of electronic heat dissipation, especially as portable electronic devices such as mobile phones and tablets are becoming increasingly ultra-light and thin, the issue of effective heat dissipation of portable electronic devices has become increasingly prominent due to their size.

[0003] In the related art, foam or aerogel insulation films are usually used under the screen of electronic devices to insulate heat to prevent the heat from the motherboard area from being directly transferred to the screen. However, the thickness of foam and aerogel insulation films is often relatively thin, usually less than 0.3mm. Due to the thermal conductivity of the material itself, foam or aerogel cannot achieve effective heat insulation, and screen hot spots are prone to occur, affecting the user experience. Summary of the invention

[0004] The present application provides a thermal insulation component, an electronic device, a housing component and a functional module, which have good thermal insulation effect.

[0005] Specifically, the following technical solutions are included:

[0006] In a first aspect, an embodiment of the present application provides a heat insulation assembly, wherein the heat insulation assembly includes a first cover plate and a second cover plate.

[0007] The first cover plate and the second cover plate are stacked in a thickness direction, and the first cover plate and the second cover plate enclose a closed space;

[0008] The enclosed space is a vacuum space; and / or the enclosed space is filled with a heat insulating medium.

[0009] In some embodiments, at least one side wall of the enclosed space is provided with a heat insulating medium.

[0010] In some embodiments, the heat insulating medium is disposed on a first side wall of the first cover plate in a first direction; and / or, the heat insulating medium is disposed on a second side wall of the second cover plate in a second direction.

[0011] In some embodiments, the thickness of the thermal insulation medium ranges from 0.03 mm to 0.1 mm.

[0012] In some embodiments, the thermal insulation assembly further includes: a support portion, the support portion is located in the enclosed space and meets the following conditions:

[0013] The heat insulating medium is located on the first side wall of the first cover plate, the support portion is located on the first side wall of the first cover plate and extends toward the second side wall of the second cover plate; and / or,

[0014] The heat insulating medium is located on the second side wall of the second cover plate, and the supporting portion is located on the first side wall of the first cover plate and extends toward one side of the second side wall of the second cover plate.

[0015] In some embodiments, the support portion extends from the first side wall of the first cover plate to the thermal insulation medium located at the second side wall of the second cover plate; and / or,

[0016] The support portion extends from the second side wall of the second cover plate to the heat insulating medium located on the first side wall of the first cover plate.

[0017] In some embodiments, the support portion includes at least one protrusion, a support column, or a support plate;

[0018] When the support portion includes a plurality of protrusions, the plurality of protrusions protrude and are spaced apart from each other on the first cover plate and / or the second cover plate;

[0019] When the support portion includes a plurality of support columns, the plurality of support columns are arranged at intervals;

[0020] When the support portion includes a plurality of support plates, the plurality of support plates are arranged crosswise and / or side by side.

[0021] In some embodiments, the height of the support portion ranges from 0.01 mm to 0.1 mm.

[0022] In some embodiments, the circumference of the second cover plate has a bent edge extending toward the first cover plate, and the bent edge is connected to the first cover plate.

[0023] In some embodiments, a connecting edge is formed at one end of the bending edge away from the second cover plate, the extending direction of the connecting edge is the same as the extending direction of the second cover plate, and the connecting edge is connected to the first cover plate.

[0024] In some embodiments, the thickness of the first cover plate ranges from 0.01 mm to 0.05 mm, and / or the thickness of the second cover plate ranges from 0.01 mm to 0.05 mm.

[0025] In some embodiments, one side of the first cover plate has at least one first opening, one side of the second cover plate has at least one second opening, and the first opening and the second opening correspond one to one.

[0026] In a second aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the thermal insulation assembly as described in the first aspect above.

[0027] In some embodiments, the electronic device further includes a screen and a temperature vapor chamber, wherein the screen, the thermal insulation assembly, and the temperature vapor chamber are stacked in sequence.

[0028] In some embodiments, the electronic device further includes a screen and a middle frame, wherein the thermal insulation component and the screen are both fixed on the middle frame, and the screen cover is disposed on the thermal insulation component.

[0029] In some embodiments, the electronic device further includes a middle frame and a battery cover, wherein the thermal insulation assembly and the battery cover are both fixed on the middle frame, and the battery cover is located on the thermal insulation assembly.

[0030] In some embodiments, the electronic device further comprises a battery cover, wherein the thermal insulation assembly and the battery cover are stacked.

[0031] In a third aspect, an embodiment of the present application provides a shell assembly, comprising a shell and a thermal insulation assembly as described in the first aspect above, wherein the thermal insulation assembly is covered on the shell.

[0032] In a fourth aspect, an embodiment of the present application provides a functional module, comprising a base and a thermal insulation component as described in the first aspect above, wherein the thermal insulation component is disposed on the base.

[0033] The thermal insulation component provided in the embodiment of the present application forms an enclosed space between the first cover plate and the second cover plate, and the enclosed space is set as a vacuum space or filled with a thermal insulation medium, so as to utilize the vacuum environment and / or the thermal insulation medium to achieve thermal insulation. Compared with the foam or aerogel in the prior art, it has lower thermal conductivity and better thermal insulation effect, and can better solve the thermal insulation problems of different functional modules (for example: screen modules) to improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic diagram of the structure of a heat insulation assembly provided in an embodiment of the present application;

[0036] Figure 2 A schematic structural diagram of another thermal insulation assembly provided in an embodiment of the present application;

[0037] Figure 3 A schematic structural diagram of another thermal insulation assembly provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the disassembled structure of a heat insulation component provided in an embodiment of the present application;

[0039] Figure 5 A schematic diagram of the structure of a heat insulation component arrangement method in an electronic device provided in an embodiment of the present application;

[0040] Figure 6 A schematic diagram of another configuration of a heat insulation component in an electronic device provided in an embodiment of the present application;

[0041] Figure 7 A structural schematic diagram of another arrangement of a heat insulation component in an electronic device provided in an embodiment of the present application;

[0042] Figure 8 A structural schematic diagram of another configuration of a thermal insulation component in an electronic device provided in an embodiment of the present application.

[0043] The reference numerals in the figures represent respectively:

[0044] 1- thermal insulation assembly, 11- first cover plate, 111- first opening, 12- second cover plate, 121- bent edge, 122- connecting edge, 123- second opening, 13- thermal insulation medium, 14- enclosed space, 15- supporting part, 2- screen, 3- temperature averaging plate, 4- middle frame, 5- battery cover. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those of ordinary skill in the art.

[0048] At present, ultra-thin temperature spreaders are widely used in the heat dissipation of portable electronic devices as phase change heat conduction components due to their excellent heat transfer performance and temperature uniformity. Its working principle is: the working substance in the low vacuum cavity evaporates after being heated in the evaporation zone, diffuses to the condensation zone and condenses, and then flows back to the evaporation zone by the capillary structure, and achieves temperature uniformity through gas-liquid circulation. While the temperature spreader transfers heat to the width and length directions of the electronic device, it also transfers heat to the thickness direction. As the thickness of mobile phones tends to be thinner and lighter, the thermal resistance in the thickness direction is getting smaller and smaller, which leads to the problem of local hot spots in the screen projection area of ​​the motherboard, affecting the thermal experience of users.

[0049] For example, in order to solve the problem of local hot spots on the motherboard in the projection area of ​​the screen, foam or aerogel insulation film can be used under the screen of the electronic device to insulate the heat to prevent the heat from the motherboard area from being directly transferred to the screen. However, the thermal conductivity of foam or aerogel insulation film is close to that of air. In a space with a thickness of less than 0.5mm, its insulation effect is very limited, and screen hot spots are prone to occur, affecting the user experience.

[0050] In order to solve the technical problems existing in the related technology, the embodiment of the present application provides a thermal insulation component with good thermal insulation effect, which can better solve the thermal insulation problems of different functional modules. For example: it can effectively prevent the occurrence of screen hot spots, thereby significantly improving the user experience.

[0051] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0052] Figure 1 This is a schematic diagram of the structure of a heat insulation assembly provided in an embodiment of the present application. Figure 1, wherein the left side figure is a schematic diagram of the thermal insulation assembly as a whole, and the right side figure is a schematic cross-sectional diagram of the left side figure cut along line AA. It can be seen that the thermal insulation assembly 1 includes a first cover plate 11 and a second cover plate 12.

[0053] The first cover plate 11 and the second cover plate 12 are stacked in the thickness direction, and the first cover plate 11 and the second cover plate 12 enclose a closed space 14 ; the closed space 14 is a vacuum space; and / or the closed space 14 is filled with a heat insulating medium 13 .

[0054] Therefore, by forming an enclosed space 14 between the first cover plate 11 and the second cover plate 12, the enclosed space 14 is set as a vacuum space or filled with a thermal insulation medium 13, so as to utilize the vacuum environment and / or the thermal insulation medium to achieve thermal insulation. Compared with the foam or aerogel in the prior art, the thermal insulation component 1 has a lower thermal conductivity and a better thermal insulation effect.

[0055] In some embodiments, at least one side wall of the enclosed space 14 is provided with a heat insulating medium 13. For example, a heat insulating medium 13 (such as Figure 1 As shown in FIG. 1 , a heat insulating medium 13 may also be provided on at least one side wall along the thickness direction. It should be noted that the embodiment of the present disclosure does not specifically limit the location of the heat insulating medium 13.

[0056] In some embodiments, Figure 1 As shown, the heat insulating medium 13 is disposed on a first side wall of the first cover plate 11 in a first direction; and / or, the heat insulating medium 13 is disposed on a second side wall of the second cover plate 12 in a second direction.

[0057] Among them, the first direction can be the length direction, width direction or thickness direction of the first cover plate 11, and the second direction can be the length direction, width direction or thickness direction of the second cover plate 12; the first side wall can be any side wall of the first cover plate 11, and the second side wall can be any side wall of the second cover plate 12.

[0058] In some embodiments, the heat insulating medium 13 is made of a material with heat insulating function. When the heat insulating medium 13 is a heat insulating sheet, the heat insulating sheet can be a prefabricated sheet-like heat insulating material connected to the first side wall and / or the second side wall by bonding or other connection methods. When the heat insulating medium 13 is a heat insulating layer, the heat insulating layer can be coated on the first side wall and / or the second side wall by coating.

[0059] In some embodiments, the heat insulating medium 13 can be made of low thermal conductivity and high specific surface area materials such as glass fiber mesh / cloth, aerogel, nylon mesh, plastic mesh, non-woven fabric, etc.

[0060] In some embodiments, the thickness of the thermal insulation medium 13 ranges from 0.03 mm to 0.1 mm, which is convenient for being arranged in the enclosed space 14 . At the same time, the overall thickness of the thermal insulation assembly 1 provided in the embodiment of the present application is relatively thin.

[0061] Figure 2 A schematic diagram of another thermal insulation assembly provided in an embodiment of the present application. The left side diagram is a schematic diagram of the thermal insulation assembly as a whole, and the right side diagram is a schematic diagram of a cross section of the left side diagram taken along line AA. Figure 2 The thermal insulation assembly 1 also includes: a support portion 15, the support portion 15 is located in the enclosed space 14 and satisfies the following conditions: the thermal insulation medium 13 is located on the first side wall of the first cover plate 11, the support portion 15 is located on the first side wall of the first cover plate 11 and extends to the second side wall of the second cover plate 12; and / or, the thermal insulation medium 13 is located on the second side wall of the second cover plate 12, the support portion 15 is located on the first side wall of the first cover plate 11 and extends to the second side wall of the second cover plate 12.

[0062] The support portion 15 is provided to support and maintain the sealed space 14 between the first cover plate 11 and the second cover plate 12 .

[0063] In some embodiments, the support portion 15 extends from the first side wall of the first cover plate 11 to the insulation medium 13 located on the second side wall of the second cover plate 12; and / or, the support portion 15 extends from the second side wall of the second cover plate 12 to the insulation medium 13 located on the first side wall of the first cover plate 11.

[0064] In some embodiments, the support portion 15 includes at least one protrusion, a support column or a support plate.

[0065] Among them, when the support portion 15 includes multiple protrusions, the multiple protrusions protrude and are spaced apart on the first cover plate 11 and / or the second cover plate 12; when the support portion 15 includes multiple support columns, the multiple support columns are spaced apart; when the support portion 15 includes multiple support plates, the multiple support plates are cross-arranged and / or side by side.

[0066] In some embodiments, the support portion 15 and the first cover plate 11 are integrally formed, or the support portion 16 and the first cover plate 11 are separately formed. In the embodiments of the present application, both of these two forming methods are acceptable and are not specifically limited herein.

[0067] In some embodiments, the height of the support portion 15 ranges from 0.01 mm to 0.1 mm, so as to ensure that the overall thickness of the first cover plate 11 is relatively thin.

[0068] In some embodiments, the thickness of the first cover plate 11 ranges from 0.01 mm to 0.05 mm, and / or the thickness of the second cover plate 12 ranges from 0.01 mm to 0.05 mm, to ensure that the overall thickness of the thermal insulation assembly 1 provided in the embodiment of the present application is relatively thin.

[0069] In some embodiments, the first cover plate 11 and the second cover plate 12 can be made of one or more of stainless steel, copper-clad laminate, polymer material, titanium alloy, aluminum alloy, pure copper and alloy copper.

[0070] In some embodiments, the first cover plate 11 and the second cover plate 12 can be prepared by stamping, etching, injection molding or 3D printing.

[0071] The structure of the heat insulation assembly 1 provided in the embodiment of the present application is described below by taking the first cover plate 11 and the second cover plate 12 prepared by etching and stamping as an example:

[0072] (1) When the first cover plate 11 and the second cover plate 12 are prepared by etching, the schematic diagram after preparation is as follows: Figure 2 shown.

[0073] In this case, the first cover plate 11 is etched to obtain the support portion 15, and the support portion 15 is composed of a plurality of support columns or a plurality of support plates, and a closed chamber is formed between two adjacent support columns or support plates. The support column or support plate at the outermost edge of the first cover plate 11 is attached to the edge of the second cover plate 12.

[0074] Optionally, the support column or support plate at the outermost edge of the first cover plate 11 may be connected to the edge of the second cover plate 12 by welding. The welding method may be one of laser welding, brazing or diffusion welding.

[0075] (2) When the first cover plate 11 and the second cover plate 12 are prepared by stamping, the schematic diagram after preparation is as follows: Figure 3 shown.

[0076] In this case, the first cover plate 11 is punched to obtain the support portion 15 , and the support portion 15 at this time is composed of a plurality of support columns.

[0077] In some embodiments, Figure 3 This is a schematic diagram of another thermal insulation assembly provided in an embodiment of the present application, wherein the left side diagram is a schematic diagram of the thermal insulation assembly as a whole, and the right side diagram is a schematic diagram of a partial cross section of the left side diagram cut along line AA. Figure 3The second cover plate 12 has a bending edge 121 extending toward the first cover plate 11 on its circumference. The bending edge 121 is connected to the first cover plate 11 , so that the second cover plate 12 forms a groove-like structure, which facilitates the formation of a closed space 14 .

[0078] In some embodiments, see Figure 3 A connecting edge 122 is formed at one end of the bent edge 121 away from the second cover plate 12. The extending direction of the connecting edge 122 is the same as the extending direction of the second cover plate 12. The connecting edge 122 is connected to the first cover plate 11, so that there is a larger contact area between the first cover plate 11 and the second cover plate 12, which is convenient for connection.

[0079] In some embodiments, see Figure 4 One side of the first cover plate 11 has at least one first opening 111 , and one side of the second cover plate 12 has at least one second opening 123 , and the first opening 111 and the second opening 123 correspond to each other one by one.

[0080] By providing the first opening 111 and the second opening 123 , it is convenient to remove the air in the space between the first cover plate 11 and the second cover plate 12 when preparing the thermal insulation assembly 1 , so as to form a closed space 14 .

[0081] In some examples, the preparation method of the thermal insulation assembly 1 may include the following steps: raw material cutting, stamping / etching / supporting part, stamping degassing port, attaching a thermal insulation sheet to the second cover plate, welding the first cover plate and the second cover plate together, vacuum degassing, and cutting out the degassing port.

[0082] An embodiment of the present application also provides an electronic device, which includes the thermal insulation component 1 as mentioned in the above embodiment.

[0083] Based on the use of the thermal insulation component 1 involved in the above embodiment, the electronic device provided in the embodiment of the present application has a better thermal insulation effect.

[0084] In some embodiments, see Figure 5 The electronic device also includes a screen 2 and a temperature vapor chamber 3, wherein the screen 2, the heat insulation component 1 and the temperature vapor chamber 3 are stacked in sequence, and the heat insulation component 1 is used to insulate the screen 2, which can effectively prevent the occurrence of screen hot spot problems, thereby significantly improving the user experience.

[0085] In some embodiments, see Figure 6 The electronic device also includes a screen 2 and a middle frame 4, wherein the heat insulation component 1 and the screen 2 are both fixed on the middle frame 4, and the screen 2 is covered on the heat insulation component 1.

[0086] Using the heat insulation component 1 to insulate the screen 2 can effectively prevent the occurrence of screen hot spots, thereby significantly improving the user experience.

[0087] In some embodiments, see Figure 7 The electronic device also includes a middle frame 4 and a battery cover 5 . The heat insulation component 1 and the battery cover 5 are both fixed on the middle frame 4 , and the battery cover 5 is located on the heat insulation component 1 .

[0088] The thermal insulation component 1 is used to insulate the battery to prevent the battery from overheating and affecting user use, thereby significantly improving the user experience.

[0089] In some embodiments, see Figure 8 The electronic device further includes a battery cover 5, wherein the heat insulation component 1 and the battery cover 5 are stacked.

[0090] The thermal insulation component 1 is used to insulate the battery to prevent the battery from overheating and affecting user use, thereby significantly improving the user experience.

[0091] In some embodiments, the temperature homogenizing plate 3 is an ultra-thin temperature homogenizing plate, which can be composed of one or more combinations of high thermal conductivity materials such as graphite.

[0092] In some embodiments, the thermal insulation assembly 1 can be fixed to the middle frame 4 of the electronic device by gluing, spot welding or screw connection, and can be bonded and connected to the temperature homogenizing plate 3 by double-sided tape.

[0093] In some embodiments, the electronic device further comprises foam, which is located between the screen 2 and the temperature equalizer 3 together with the heat insulation component 1. The setting size of the foam and the setting size of the heat insulation component 1 can be selectively set according to actual needs. For example, the size of the foam can be the same as the size of the heat insulation component 1.

[0094] The embodiment of the present application further provides a shell assembly, which includes a shell and a heat insulation assembly 1 as mentioned in the above embodiment, wherein the heat insulation assembly 1 is covered on the shell.

[0095] Based on the use of the thermal insulation assembly 1 involved in the above-mentioned embodiment, the shell assembly provided in the embodiment of the present application has a better thermal insulation effect.

[0096] The embodiment of the present application further provides a functional module, which includes a base and a thermal insulation component 1 as mentioned in the above embodiment, wherein the thermal insulation component 1 is arranged on the base.

[0097] Based on the use of the thermal insulation component 1 involved in the above embodiment, the functional module provided in the embodiment of the present application has a better thermal insulation effect.

[0098] It should be noted that the "several" and "at least one" mentioned in this article refer to one or more, and "multiple" and "at least two" refer to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0099] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0100] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0101] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0102] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application.

[0103] The above description is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A thermal insulation assembly (1), characterized in that: The thermal insulation assembly (1) comprises a first cover plate (11) and a second cover plate (12), The first cover plate (11) and the second cover plate (12) are stacked in a thickness direction, and the first cover plate (11) and the second cover plate (12) enclose a closed space (14); The enclosed space (14) is a vacuum space; and / or the enclosed space (14) is filled with a heat insulating medium (13).

2. The thermal insulation assembly (1) according to claim 1, characterized in that: At least one side wall of the enclosed space (14) is provided with a heat insulating medium (13).

3. The thermal insulation assembly (1) according to claim 1, characterized in that: The heat insulating medium (13) is provided on a first side wall of the first cover plate (11) in a first direction; and / or the heat insulating medium (13) is provided on a second side wall of the second cover plate (12) in a second direction.

4. The thermal insulation assembly (1) according to claim 1, characterized in that The thickness of the heat insulating medium (13) ranges from 0.03 mm to 0.1 mm.

5. The thermal insulation assembly (1) according to claim 1, characterized in that: The thermal insulation assembly (1) further comprises a support portion (15), wherein the support portion (15) is located in the enclosed space (14) and meets the following conditions: The heat insulating medium (13) is located on the first side wall of the first cover plate (11), and the support portion (15) is located on the first side wall of the first cover plate (11) and extends toward the second side wall of the second cover plate (12); and / or, The heat insulating medium (13) is located on the second side wall of the second cover plate (12), and the support portion (15) is located on the first side wall of the first cover plate (11) and extends toward one side of the second side wall of the second cover plate (12).

6. The thermal insulation assembly (1) according to claim 5, characterized in that The support portion (15) extends from the first side wall of the first cover plate (11) to the heat insulating medium (13) located on the second side wall of the second cover plate (12); and / or, The support portion (15) extends from the second side wall of the second cover plate (12) to the heat insulating medium (13) located on the first side wall of the first cover plate (11).

7. The thermal insulation assembly (1) according to claim 5, characterized in that The support portion (15) comprises at least one protrusion, a support column or a support plate; When the support portion (15) includes a plurality of protrusions, the plurality of protrusions are protruding and arranged at intervals on the first cover plate (11) and / or the second cover plate (12); When the support portion (15) includes a plurality of support columns, the plurality of support columns are arranged at intervals; When the support portion (15) comprises a plurality of support plates, the plurality of support plates are arranged crosswise and / or side by side.

8. The thermal insulation assembly (1) according to claim 5, characterized in that The height of the support portion (15) ranges from 0.01 mm to 0.1 mm.

9. The thermal insulation assembly (1) according to claim 1, characterized in that: The circumference of the second cover plate (12) has a bent edge (121) extending toward the first cover plate (11), and the bent edge (121) is connected to the first cover plate (11).

10. The thermal insulation assembly (1) according to claim 9, characterized in that A connecting edge (122) is formed at one end of the bent edge (121) away from the second cover plate (12); the extending direction of the connecting edge (122) is the same as the extending direction of the second cover plate (12); and the connecting edge (122) is connected to the first cover plate (11).

11. The thermal insulation assembly (1) according to claim 1, characterized in that The thickness of the first cover plate (11) is in the range of 0.01 mm to 0.05 mm, and / or the thickness of the second cover plate (12) is in the range of 0.01 mm to 0.05 mm.

12. The thermal insulation assembly (1) according to claim 1, characterized in that One side of the first cover plate (11) has at least one first opening (111), and one side of the second cover plate (12) has at least one second opening (123), and the first opening (111) and the second opening (123) correspond one to one.

13. An electronic device, characterized in that: The electronic device comprises the thermal insulation assembly (1) according to any one of claims 1 to 12.

14. The electronic device according to claim 13, characterized in that: The electronic device further comprises a screen (2) and a temperature homogenizing plate (3), wherein the screen (2), the heat insulation component (1) and the temperature homogenizing plate (3) are stacked in sequence.

15. The electronic device according to claim 13, characterized in that: The electronic device further comprises a screen (2) and a middle frame (4), wherein the heat insulation component (1) and the screen (2) are both fixed on the middle frame (4), and the screen (2) is covered on the heat insulation component (1).

16. The electronic device according to claim 13, characterized in that: The electronic device further comprises a middle frame (4) and a battery cover (5), wherein the heat insulation component (1) and the battery cover (5) are both fixed on the middle frame (4), and the battery cover (5) is located on the heat insulation component (1).

17. The electronic device according to claim 13, characterized in that: The electronic device further comprises a battery cover (5), wherein the heat insulation component (1) and the battery cover (5) are stacked.

18. A housing assembly, characterized in that: It comprises a shell and a heat insulation component (1) according to any one of claims 1 to 12, wherein the heat insulation component (1) is covered on the shell.

19. A functional module, characterized in that: It comprises a base and a heat insulation component (1) according to any one of claims 1 to 12, wherein the heat insulation component (1) is arranged on the base.

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