Cleaning, detecting and feeding equipment and camera module assembly line

Abstract

The invention provides cleaning, detecting and feeding equipment and a camera module assembly line. The cleaning, detecting and feeding equipment comprises an equipment platform, wherein the equipment platform comprises a mounting base plate, a transfer assembly which is mounted on the mounting base plate and extends in the first direction, a circulation assembly which is mounted on the mounting base plate and is spaced from the transfer assembly in the second direction, and a feeding assembly which is mounted on the mounting base plate and is spaced from the transfer assembly and the circulation assembly; the stock bin assembly is mounted on the mounting base plate and located at one end of the transfer assembly; the cleaning assembly is mounted on the mounting base plate and corresponds to the middle of the transfer assembly; the material taking and placing assembly is installed on the installation base plate and extends to the middle of the circulation assembly from the other end of the material taking and placing assembly in the second direction. The rear channel feeding assembly is mounted on the mounting base plate and extends to the feeding assembly from one end of the circulation assembly in the second direction; and the cleaning detection mechanism is mounted on the mounting base plate and corresponds to the position, between the material taking and placing assembly and the rear channel feeding assembly, of the circulation assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a cleaning detection feeding device and a camera module assembly line. Background Art

[0002] With the rapid development of smart cars, vehicle camera modules are also booming under this background. With the rapid advancement of autonomous driving technology, the requirements for camera modules are getting higher and higher, which requires that vehicle camera modules should not be defective during the assembly process to avoid affecting the safety performance index of the car and the user experience due to defective vehicle camera modules.

[0003] Existing vehicle camera modules are mainly composed of optical lenses and photosensitive chips. Currently, most manufacturers usually manually wipe the lenses and chips for manual cleaning during the assembly process of camera modules, or directly load the materials without wiping. There is a great risk of mixing in dirty and defective products, and the downstream equipment needs to detect the dirt again. At the same time, since the existing downstream equipment usually has no automatic cleaning function, the existing downstream equipment usually throws dirty and defective products away or uses dust sticks and other contact methods to manually remove dust and dirt, which has defects such as product waste, low efficiency, incomplete dust removal or product damage. Summary of the invention

[0004] One advantage of the present invention is that it provides a cleaning inspection loading device and a camera module assembly line, which can perform pre-processing before the product enters the back-end equipment for assembly, ensuring that the surface of the product entering the back-end equipment is clean, improving the assembly efficiency of the back-end equipment, and improving the product yield.

[0005] Another advantage of the present invention is that it provides a cleaning detection and loading equipment and a camera module assembly line. In one embodiment of the present invention, the cleaning detection and loading equipment can integrate automatic film tearing function and automatic loading function, which can not only save labor and reduce the intensity of manual work, but also eliminate human interference and ensure the cleanliness of the product.

[0006] Another advantage of the present invention is that it provides a cleaning, detection and loading equipment and a camera module assembly line. In one embodiment of the present invention, the cleaning, detection and loading equipment can use a plasma cleaning mechanism to clean multiple products at one time, which can not only improve the equipment's production capacity, but also is pollution-free and free of discharge interference.

[0007] Another advantage of the present invention is to provide a cleaning detection feeding device and a camera module assembly line, wherein in order to achieve the above-mentioned purpose, no complicated structure and system are required in the present invention. Therefore, the present invention successfully and effectively provides a solution, not only providing a simple cleaning detection feeding device and a camera module assembly line, but also increasing the practicality and reliability of the cleaning detection feeding device and the camera module assembly line.

[0008] In order to achieve at least one of the above advantages or other advantages and purposes of the present invention, the present invention provides a cleaning detection feeding device, comprising:

[0009] The equipment platform comprises a mounting base, a transfer assembly mounted on the mounting base and extending along a first direction, a circulation assembly mounted on the mounting base and spaced apart from the transfer assembly along a second direction perpendicular to the first direction, and a loading assembly mounted on the mounting base and spaced apart from both the transfer assembly and the circulation assembly;

[0010] A silo assembly, mounted on the mounting base and located at one end of the transfer assembly, for providing a product blister tray to the transfer assembly;

[0011] A cleaning component is installed on the installation base plate and corresponds to the middle of the transfer component, and is used to simultaneously clean a plurality of products in the product blister tray transferred via the transfer component;

[0012] A material taking and placing component is installed on the installation base plate and extends from the other end of the transfer component along the second direction to the middle of the circulation component, and is used to take out the product from the cleaned product blister tray and put it into the product fixture of the circulation component;

[0013] A back-end feeding assembly is mounted on the mounting substrate and extends from one end of the circulation assembly along the second direction to the loading assembly, and is used to take out products from the product fixture circulating through the circulation assembly and convey them to the loading assembly; and

[0014] A cleaning detection mechanism is installed on the mounting substrate and corresponds to a position on the circulation component between the material picking and placing component and the back-end material feeding component, and is used for cleaning and detecting the surface of a single product circulating through the circulation component.

[0015] According to one embodiment of the present application, the transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side by side along the second direction; the silo assembly includes a lens silo mechanism corresponding to the lens transfer mechanism and a chip silo mechanism corresponding to the chip transfer mechanism; the cleaning assembly includes a lens cleaning mechanism located above the lens transfer mechanism and a chip cleaning mechanism located above the chip transfer mechanism; the lens cleaning mechanism and the chip cleaning mechanism are independent plasma cleaners.

[0016] According to one embodiment of the present application, the plasma cleaner includes a plasma cleaning body located above the lens transport mechanism or the chip transport mechanism and a cleaning cylinder drivingly connected to the plasma cleaning body, and the plasma cleaning body is lifted and lowered by the driving of the cleaning cylinder.

[0017] According to one embodiment of the present application, the chip silo mechanism includes a pair of silo opening cylinders, a pair of silo opening and closing plates, a silo Z-axis elevator installed on the mounting substrate, and a blister tray silo corresponding to the chip transfer mechanism and used to stack multiple blister trays; the blister tray silo is fixedly mounted on the silo Z-axis elevator; the two silo opening and closing plates are respectively movably arranged on the front and rear sides of the blister tray silo; the two silo opening cylinders are respectively and correspondingly driven and connected to the two silo opening and closing plates to drive the silo opening and closing plates to open or close the blister tray silo.

[0018] According to one embodiment of the present application, the lens transport mechanism and the chip transport mechanism are both push-pull rod mechanisms; the push-pull rod mechanism includes a push-pull rod member, a push-pull rod cylinder that is driven connected to the push-pull rod member and extends up and down, and a push-pull rod X-axis traverse machine that is driven connected to the push-pull rod cylinder and extends along the first direction.

[0019] According to one embodiment of the present application, the transfer assembly further includes a pair of blister tray reflow mechanisms corresponding one-to-one to the lens transfer mechanism and the chip transfer mechanism respectively; the blister tray reflow mechanism includes a blister tray X-axis reflow machine located below the lens transfer mechanism or the chip transfer mechanism, a blister tray Z-axis reflow machine drivingly connected to the blister tray X-axis reflow machine, a blister tray clamping mechanism installed on the blister tray Z-axis reflow machine and located below the material loading and unloading assembly, and a blister tray push rod cylinder drivingly connected to the blister tray clamping mechanism.

[0020] According to one embodiment of the present application, the material picking and placing assembly includes a material picking and placing track spanning the transfer assembly and the circulation assembly, a lens clamping mechanism drivingly connected to the material picking and placing track, a chip suction mechanism drivingly connected to the material picking and placing track and arranged side by side with the lens clamping mechanism, and a visual positioning mechanism drivingly connected to the material picking and placing track and located between the lens clamping mechanism and the chip suction mechanism.

[0021] According to one embodiment of the present application, the material picking and placing component further includes a material picking and placing lower and upper mechanism arranged below the material picking and placing track and between the transfer component and the circulation component; the material picking and placing lower and upper mechanism includes an optical camera and a QR code scanner arranged side by side; the optical camera is used to take pictures and locate the lens product and the chip product respectively; the QR code scanner is used to scan and record the QR code of the lens product and the chip product.

[0022] According to one embodiment of the present application, the circulation assembly includes a lens circulation mechanism and a chip circulation mechanism arranged side by side along the second direction; the lens circulation mechanism includes a lens X-axis circulation machine installed on the mounting substrate and a lens fixing fixture which is driven and connected to the lens X-axis circulation machine and is used to temporarily fix the lens product; the chip circulation mechanism includes a chip X-axis circulation machine installed on the mounting substrate and a chip adsorption fixture which is driven and connected to the chip X-axis circulation machine and is used to temporarily adsorb the chip product.

[0023] According to one embodiment of the present application, the cleaning detection loading equipment further includes a film tearing mechanism, which is installed on the mounting substrate and is located on one end of the chip circulation mechanism adjacent to the material picking and unloading assembly; the film tearing mechanism includes a film tearing X-axis motor installed on the mounting substrate, a film tearing Z-axis motor drivingly connected to the film tearing X-axis motor, a film tearing substrate drivingly connected to the film tearing Z-axis motor, a unwinding reel rotatably arranged on the film tearing substrate and used to release the tape, a receiving reel rotatably arranged on the film tearing substrate and used to recycle the tape, a film tearing U-axis rotating motor installed on the film tearing substrate and drivingly connected to the receiving reel, and a pressing mechanism installed on the film tearing substrate and used to press the tape to the surface of the chip product.

[0024] According to one embodiment of the present application, the pressing mechanism includes an X-axis cylinder installed on the film tearing substrate, a pressure sensor fixed at the bottom of the X-axis cylinder, a flexible roller slidably arranged on the film tearing substrate and located below the pressure sensor, and a spring arranged between the pressure sensor and the flexible roller; the film tearing mechanism further includes a plurality of tape tensioning wheels installed on the film tearing substrate, the tape tensioning wheels are respectively located between the unwinding roll and the receiving roll and the flexible roller, and the tape tensioning wheels and the flexible roller are distributed in a triangular shape on the film tearing substrate.

[0025] According to one embodiment of the present application, the cleaning detection mechanism includes a gantry installed on the mounting substrate and spanning the lens circulation mechanism and the chip circulation mechanism, a detection Z-axis motor installed on the gantry, a detection camera drivingly connected to the detection Z-axis motor, a pair of dust removal Z-axis motors installed side by side on the gantry, and a pair of dust removal heads respectively drivingly connected to the dust removal Z-axis motors and corresponding to the lens circulation mechanism and the chip circulation mechanism; the dust removal heads are dry ultrasonic dust collectors.

[0026] According to one embodiment of the present application, the cleaning inspection and loading equipment further includes a flipping mechanism, which is installed on a flipping Z-axis motor of the mounting substrate, an electric platform drivingly connected to the flipping Z-axis motor, a flipping motor fixedly mounted on the electric platform, and a clamping cylinder fixedly connected to the flipping motor and used to clamp the lens product.

[0027] According to one embodiment of the present application, the back-end feeding assembly includes a feeding Y-axis track spanning the circulation assembly and the loading assembly, a feeding X-axis motor drivingly connected to the feeding Y-axis track, a chip adsorption mechanism drivingly connected to the feeding X-axis motor, a lens clamping mechanism drivingly connected to the feeding X-axis motor, and a camera shooting mechanism drivingly connected to the feeding X-axis motor.

[0028] According to one embodiment of the present application, the back-end feeding assembly further includes a material tray Y-axis track arranged side by side with the feeding Y-axis track, a lens NG material tray drivingly connected to the material tray Y-axis track and used to hold defective lens products, a chip NG material tray drivingly connected to the material tray Y-axis track and used to hold defective chips, and a back-end feeding lower and upper mechanism, and the back-end feeding lower and upper mechanism is installed on the mounting substrate and is located below the feeding Y-axis track.

[0029] According to one embodiment of the present application, the loading assembly includes a back-end loading front track mechanism and a back-end loading rear track mechanism arranged side by side along the second direction below the feeding Y-axis track; the back-end loading front track mechanism includes a front track frame installed on the mounting base plate, a front track scanner arranged on the front track frame and used to scan the back-end pallet fixture, a front track upper layer transmission mechanism installed on the front track frame and used to transfer the back-end pallet fixture backward to the back-end equipment, a front track fixture opening mechanism installed on the front track frame and used to open the back-end pallet fixture, a front track upper limit plate fixedly installed on the front track frame and located above the front track fixture opening mechanism, and a front track position sensor fixedly installed on the front track frame.

[0030] According to one embodiment of the present application, the back-end loading front track mechanism also includes an ion wind pump installed on the front track frame and arranged toward the back-end loading rear track mechanism, and a front track lower-layer conveying mechanism installed on the front track frame and located below the front track upper-layer conveying mechanism; the loading assembly further includes a back-end return track mechanism, which is arranged on the front side of the back-end loading front track mechanism and the back-end loading rear track mechanism, and is used to return the back-end pallet fixture returned via the front track lower-layer conveying mechanism to the front track upper-layer conveying mechanism and the back-end loading rear track mechanism.

[0031] According to one embodiment of the present application, the back-end return track mechanism includes a return track frame fixed to the mounting substrate, a back-end return Y-axis motor installed on the return track frame, a back-end return Z-axis motor drivingly connected to the back-end return Y-axis motor, and a back-end return transmission mechanism drivingly connected to the back-end return Z-axis motor.

[0032] According to another aspect of the present application, the present application further provides a camera module assembly line, comprising:

[0033] Back-end equipment for assembling lens products and chip products; and

[0034] Any of the above-mentioned cleaning inspection loading equipment is arranged at the loading end of the back-end equipment, and is used to automatically load the lens products and chip products after cleaning inspection to the back-end equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a three-dimensional schematic diagram of a cleaning detection and feeding device according to an embodiment of the present application;

[0036] Figure 2 A schematic top view of a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0037] Figure 3 A schematic structural diagram of a cleaning component in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0038] Figure 4 A schematic structural diagram of a chip bin mechanism in a cleaning, inspection and loading device according to the above embodiment of the present application is shown;

[0039] Figure 5 A schematic structural diagram of a push-pull rod mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0040] Figure 6 A schematic structural diagram of a material taking and placing assembly in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0041] Figure 7 A schematic structural diagram of a blister tray reflux mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0042] Figure 8 A schematic diagram of the structure of the material taking, discharging, lowering and upper mechanism in the cleaning detection and loading equipment according to the above embodiment of the present application is shown;

[0043] Fig. 9 A schematic structural diagram of a lens transfer mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0044] Fig.10 A schematic structural diagram of a chip circulation mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0045] Fig.11 A schematic structural diagram of a film tearing mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0046] Fig.12 A schematic structural diagram of a cleaning detection mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0047] Fig.13 A schematic structural diagram of a flipping mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0048] Fig.14 A schematic structural diagram of a back-end feeding assembly in a cleaning detection feeding device according to the above embodiment of the present application is shown;

[0049] Fig.15 A schematic structural diagram of a back-end feeding lower and upper mechanism in a back-end feeding assembly according to the above embodiment of the present application is shown;

[0050] Fig.16A schematic structural diagram of a front track mechanism for rear-track feeding in a cleaning inspection feeding device according to the above embodiment of the present application is shown;

[0051] Fig.17 A schematic structural diagram of a rear track mechanism for rear-track feeding in a cleaning inspection feeding device according to the above embodiment of the present application is shown;

[0052] Fig.18 A schematic structural diagram of a back-end return track mechanism in a cleaning detection and feeding device according to the above embodiment of the present application is shown;

[0053] Fig.19 The present invention is a schematic diagram of the module structure of a camera module assembly line according to an embodiment of the present application.

[0054] Main component symbol description: 1. Cleaning, testing and feeding equipment; 10. Equipment platform; 11. Mounting substrate; 12. Transfer assembly; 120. Push-pull rod mechanism; 1201. Push-pull rod; 1202. Push-pull rod cylinder; 1203. Push-pull rod X-axis traverse machine; 121. Lens transfer mechanism; 122. Chip transfer mechanism; 123. Blister tray reflow mechanism; 1231. Blister tray X-axis reflow machine; 1232. Blister tray Z-axis reflow machine; 1233. Blister tray clamping mechanism; 1234. Blister tray push rod cylinder; 13. Circulation assembly; 131. Lens circulation mechanism; 1311. Lens X-axis circulation machine; 1312. Lens fixing fixture; 132. Chip circulation mechanism; 1321. Chip X-axis circulation machine; 1322 , chip adsorption fixture; 14, feeding assembly; 141, front track mechanism for back-end feeding; 1411, front track frame; 1412, front track scanner; 1413, front track upper transmission mechanism; 1414, front track fixture opening mechanism; 1415, front track upper limit plate; 1416, front track position sensor; 1417, ion wind pump; 1418, front track lower transmission mechanism; 142, back track mechanism for back-end feeding; 1421, back track frame; 1422, back track scanner; 1423, back track upper transmission mechanism; 1424, back track fixture opening mechanism; 1425, back track upper limit plate; 1426, back track position sensor; 143, back-end return track mechanism; 1431, return track Frame; 1432, Y-axis motor for back-channel reflow; 1433, Z-axis motor for back-channel reflow; 1434, transmission mechanism for back-channel reflow; 20, silo assembly; 21, lens silo mechanism; 22, chip silo mechanism; 221, silo opening cylinder; 222, silo opening and closing plate; 223, silo Z-axis elevator; 224, blister tray silo; 30, cleaning assembly; 31, lens cleaning mechanism; 32, chip cleaning mechanism; 300, plasma cleaner; 301, plasma cleaning body; 302, cleaning cylinder; 40, material loading and unloading assembly; 41, material loading and unloading track; 42, lens clamping mechanism; 43, chip suction mechanism; 44, visual positioning mechanism; 45, material loading and unloading down and up mechanism; 451, optical camera equipment; 452, QR code scanner; 50, back-end feeding assembly; 51, feeding Y-axis track; 52, feeding X-axis motor; 53, chip adsorption mechanism; 54, lens clamping mechanism; 55, camera shooting mechanism; 56, material tray Y-axis track; 57, lens NG material tray; 58, chip NG material tray; 59, back-end feeding down-shooting and up-shooting mechanism; 60, cleaning and detection mechanism; 61, door frame; 62, detection Z-axis motor; 63, detection camera; 64, dust removal Z-axis motor; 65, dust removal head; 70, film tearing mechanism; 71, film tearing X-axis motor; 72, film tearing Z-axis motor; 73, film tearing substrate; 74, unwinding roll; 75, rewinding roll; 76, film tearing U-axis rotating motor; 77, pressing mechanism; 771, X-axis cylinder;772, pressure sensor; 773, flexible roller; 774, spring; 78, tape tensioning wheel; 80, flip mechanism; 81, flip Z-axis motor; 82, electric platform; 83, flip motor; 84, clamping cylinder. ;

[0055] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0056] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0057] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0058] In the present invention, the term "one" in the claims and the specification should be understood as "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "one" cannot be understood as unique or single, and the term "one" cannot be understood as a limitation on the quantity.

[0059] In the description of the present invention, it should be understood that "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0061] Considering that the existing vehicle-mounted camera modules usually use manual wiping of lenses and chips for manual cleaning during the assembly of camera modules, or directly load materials without wiping, there is a greater risk of dirty and defective products being mixed in, and the back-end equipment needs to detect dirt again; at the same time, the existing back-end equipment usually throws dirty and defective products or uses contact forms such as dust pumps to manually pick up dust and dirt, which has defects such as waste of products, low efficiency, incomplete dust removal or damage to products. The present application provides a cleaning detection and loading equipment, which can perform pre-treatment before the product enters the back-end equipment for assembly, ensure the surface of the product entering the back-end equipment is clean, improve the assembly efficiency of the back-end equipment, and improve the product yield.

[0062] Specifically, refer to the accompanying drawings of the specification of this application. Figures 1 to 19 According to an embodiment of the present application, a camera module assembly line is provided, which may include a back-end device (not shown in the figure) for assembling lenses and chips and a cleaning inspection loading device 1, which is arranged at the loading end of the back-end device and is used to automatically load the products (including lenses and / or chips) after cleaning inspection to the back-end device. It can be understood that the camera module mentioned in the present application can be implemented as a vehicle-mounted camera but is not limited to it.

[0063] More specifically, if Figure 1 and Figure 2As shown, the cleaning detection and feeding equipment 1 may include an equipment platform 10, a silo assembly 20, a cleaning assembly 30, a material picking and placing assembly 40, a back-end feeding assembly 50, and a cleaning detection mechanism 60. The equipment platform 10 includes a mounting base plate 11, a transfer assembly 12 mounted on the mounting base plate 11 and extending along a first direction, a circulation assembly 13 mounted on the mounting base plate 11 and arranged at intervals with the transfer assembly 12 along a second direction perpendicular to the first direction, and a feeding assembly 14 mounted on the mounting base plate 11 and arranged at intervals with both the transfer assembly 12 and the circulation assembly 13. The silo assembly 20 is mounted on the mounting base plate 11 and located at one end of the transfer assembly 12, and is used to provide a product blister tray to the transfer assembly 12. The cleaning assembly 30 is mounted on the mounting base plate 11 and corresponds to the middle of the transfer assembly 12, and is used to simultaneously clean multiple products in the product blister tray transferred via the transfer assembly 12. The material taking and placing component 40 is installed on the mounting substrate 11 and extends from the other end of the transfer component 12 along the second direction to the middle of the circulation component 13, and is used to take out the product from the cleaned product blister tray and put it into the product fixture of the circulation component 13. The back-end feeding component 50 is installed on the mounting substrate 11 and extends from one end of the circulation component 13 along the second direction to the loading component 14, and is used to take out the product from the product fixture circulating through the circulation component 13 and convey it to the loading component 14, so as to automatically load the back-end equipment. The cleaning detection mechanism 60 is installed on the mounting substrate 11 and corresponds to the position between the material taking and placing component 40 and the back-end feeding component 50 on the circulation component 13, and is used to clean and detect the surface of a single product circulating through the circulation component 13 to screen out good products.

[0064] In this way, the product blister tray (carrying lenses or chips) supplied through the silo component 20 is first transferred to the cleaning component 30 through the transfer component 12 to batch clean multiple products carried by the product blister tray, and then the cleaned product blister tray is transferred to the loading and unloading component 40 through the transfer component 12; then, the loading and unloading component 40 takes out each cleaned product from the product blister tray separately and puts it into the product fixture of the circulation component 13; thereafter, the circulation component 13 first transfers the product fixture carrying a single lens or a single chip to the cleaning detection mechanism 60 to screen out good products (including good lenses and good chips), and then transfers it to the back-end feeding component 50 to supply it to the loading component 14; finally, the loading component 14 automatically loads the good lenses and good chips to the back-end equipment for subsequent product assembly.

[0065] It is worth noting that since the cleaning, inspection and loading equipment 1 of the present application performs pre-processing such as cleaning and inspection before the product enters the downstream equipment for assembly, ensuring that the surface of the product entering the downstream equipment is clean, the downstream equipment does not need to perform cleaning and inspection when assembling the product, which helps to improve the assembly efficiency of the downstream equipment and improve the product yield; at the same time, the cleaning, inspection and loading equipment 1 of the present application can not only automatically clean and inspect the product, but also provide automatic loading for the downstream equipment, which can not only eliminate human interference and ensure the cleanliness of the product, but also save labor and reduce the intensity of manual work.

[0066] In addition, the transfer component 12, circulation component 13 and loading component 14 in the cleaning detection and loading equipment 1 of the present application are reasonably arranged on the mounting substrate 11, and the silo component 20, cleaning component 30, material picking and placing component 40, back-end feeding component 50 and cleaning detection mechanism 60 are arranged along the conveying routes of the transfer component 12 and the circulation component 13, which can not only enhance the overall compactness of the equipment, but also avoid overlapping of conveying routes as much as possible, shorten the conveying stroke, and improve the conveying efficiency.

[0067] For example, Figure 1 and Figure 2 As shown, the transfer assembly 12 may include a lens transfer mechanism 121 and a chip transfer mechanism 122 arranged side by side along the second direction; the silo assembly 20 includes a lens silo mechanism 21 corresponding to the lens transfer mechanism 121 and a chip silo mechanism 22 corresponding to the chip transfer mechanism 122; the cleaning assembly 30 includes a lens cleaning mechanism 31 located above the lens transfer mechanism 121 and a chip cleaning mechanism 32 located above the chip transfer mechanism 122. In this way, the blister tray carrying multiple lens products and the blister tray carrying multiple chip products can be supplied to the lens transfer mechanism 121 and the chip transfer mechanism 122 respectively through the lens silo mechanism 21 and the chip silo mechanism 22 at the same time; and then, after being cleaned simultaneously through the lens cleaning mechanism 31 and the chip cleaning mechanism 32 respectively, they are transferred to the pick-and-place assembly 40 through the lens transfer mechanism 121 and the chip transfer mechanism 122 respectively, which helps to synchronously transfer and clean multiple lens products and multiple chip products, improve product cleaning efficiency, and make the equipment more productive.

[0068] Alternatively, if Figure 3As shown, the lens cleaning mechanism 31 and the chip cleaning mechanism 32 are implemented as independent plasma cleaners 300, so that each plasma cleaner 300 can clean multiple lens products or multiple chip products at the same time, avoiding interference or contamination between lens products and chip products when cleaning dirty surfaces, without pollution or discharge interference. It can be understood that the plasma cleaner 300 mentioned in the present application can be implemented as a vacuum plasma cleaner (i.e., a vacuum plasma module), or as an atmospheric plasma cleaner (i.e., an atmospheric plasma module).

[0069] Alternatively, if Figure 3 As shown, each plasma cleaner 300 includes a plasma cleaning body 301 located above the lens transport mechanism 121 or the chip transport mechanism 122 and a cleaning cylinder 302 drivingly connected to the plasma cleaning body 301. The plasma cleaning body 301 is raised and lowered by the drive of the cleaning cylinder 302, so that when it is close to the lens transport mechanism 121 or the chip transport mechanism 122, it is used to perform surface cleaning on multiple lens products or multiple chip products in the entire blister tray, and when it is far away from the lens transport mechanism 121 or the chip transport mechanism 122, it avoids the blister tray or other moving parts carrying the lens products or chip products, so as to ensure that the lens transport mechanism 121 and the chip transport mechanism 122 can transport the blister tray normally.

[0070] It is worth noting that the lens bin mechanism 21 and the chip bin mechanism 22 mentioned in the present application can have the same structure, the size of the internal blister trays is the same, and the bearing details can be designed differently according to the differences in actual products (lens products and chip products). It can be understood that the first direction mentioned in the present application can refer to the front-to-back direction, that is, the X-axis direction; the second direction mentioned in the present application can refer to the left-to-right direction, that is, the Y-axis direction; accordingly, the up-down direction corresponds to the Z-axis direction.

[0071] For example, Figure 4As shown, taking the chip hopper mechanism 22 as an example, the chip hopper mechanism 22 may include a pair of hopper opening cylinders 221, a pair of hopper opening and closing plates 222, a hopper Z-axis elevator 223 installed on the mounting substrate 11, and a blister tray hopper 224 corresponding to the chip transfer mechanism 122 and used for stacking a plurality of blister trays; the blister tray hopper 224 is fixedly mounted on the hopper Z-axis elevator 223, so as to be lifted and lowered under the drive of the hopper Z-axis elevator 223, so that the plurality of blister trays in the blister tray hopper 224 are flush with the chip transfer mechanism 122 in sequence, which is convenient for transferring the blister trays. Plastic tray; two silo opening and closing plates 222 are respectively movably arranged on the front and rear sides of the blister tray silo 224, and two silo opening cylinders 221 are respectively and correspondingly driven and connected to the two silo opening and closing plates 222 to drive the silo opening and closing plates 222 to open or close the blister tray silo 224, so that the multiple blister trays in the blister tray silo 224 can keep the front and back flush when the two silo opening and closing plates 222 close the blister tray silo 224, ensuring that the front and rear positions of each blister tray in the blister tray silo 224 are consistent, which helps to reduce the risk of collision or inability to remove. It is understandable that when the bin opening and closing plate 222 opens the blister tray bin 224 under the action of the bin opening cylinder 221, the blister tray carrying the chip product can be manually put into or taken out of the blister tray bin 224, or can be automatically taken out from the blister tray bin 224 by the chip transfer mechanism 122 to be transferred to the bottom of the chip cleaning mechanism 32. It is understandable that the bin Z-axis lift 223 mentioned in the present application can be implemented as, but not limited to, a linear motor, a cylinder, a push rod motor or a screw nut, etc., which moves the bin along the Z-axis direction.

[0072] Alternatively, if Figure 5 As shown, the lens transport mechanism 121 and the chip transport mechanism 122 are both implemented as a push-pull rod mechanism 120; the push-pull rod mechanism 120 may include a push-pull rod member 1201, a push-pull rod cylinder 1202 that is drive-connected to the push-pull rod member 1201 and can be extended up and down, and a push-pull rod X-axis transverse machine 1203 that is drive-connected to the push-pull rod cylinder 1202 and extends along the first direction. In this way, the push-pull rod 1201 can move up and down under the action of the push-pull rod cylinder 1202 to lift or lower the blister tray; the push-pull rod 1201 can push and pull the blister tray along the first direction together with the push-pull rod cylinder 1202 under the action of the push-pull rod X-axis transverse machine 1203; in other words, the push-pull rod cylinder 1202 and the push-pull rod X-axis transverse machine 1203 cooperate with each other to first pull the blister tray from the silo assembly 20 to the cleaning assembly 30 through the push-pull rod 1201, and then push the blister tray from the cleaning assembly 30 to the material picking and placing assembly 40.

[0073] Alternatively, if Figure 6As shown, the material picking and placing component 40 includes a material picking and placing track 41 spanning the transfer component 12 and the circulation component 13, a lens clamping mechanism 42 drivingly connected to the material picking and placing track 41, a chip suction mechanism 43 drivingly connected to the material picking and placing track 41 and arranged side by side with the lens clamping mechanism 42, and a visual positioning mechanism 44 drivingly connected to the material picking and placing track 41 and located between the lens clamping mechanism 42 and the chip suction mechanism 43. In this way, the material picking and unloading track 41 is used to drive the lens clamping mechanism 42, the chip suction mechanism 43 and the visual positioning mechanism 44 to move horizontally between the transfer component 12 and the circulation component 13; the visual positioning mechanism 44 is used to take pictures of the lens product and the chip product before picking up the material for precise positioning; the lens clamping mechanism 42 is used to clamp a single lens product from the blister tray to complete the lens picking up, and put the single lens product into the lens fixture of the circulation component 13 to complete the lens unloading; the chip suction mechanism 43 is used to suck a single chip product from the blister tray to complete the chip picking up, and put the single chip product into the chip fixture of the circulation component 13 to complete the chip unloading.

[0074] It is worth noting that the lens clamping mechanism 42 mentioned in the present application is mainly composed of a U-axis rotary machine, a pneumatic clamp and a Z-axis motor, the pneumatic clamp is installed on the U-axis rotary machine, the rear end of the U-axis rotary machine is connected to the Z-axis motor, the Z-axis motor is installed on the pick-up and discharge track 41, so as to drive the U-axis rotary machine and the pneumatic clamp to rise and fall as a whole through the Z-axis motor. Similarly, the chip suction mechanism 43 is mainly composed of a U-axis rotary machine with high precision of micron-level jump, a suction cup and a Z-axis motor, the suction cup is installed on the U-axis rotary machine, the rear end of the U-axis rotary machine is connected to the Z-axis motor, and the Z-axis motor is installed on the pick-up and discharge track 41, so as to drive the U-axis rotary machine and the suction cup to rise and fall as a whole through the Z-axis motor.

[0075] In addition, if Figure 1 and Figure 7 As shown, the transfer component 12 may further include a pair of blister tray reflux mechanisms 123 corresponding to the lens transfer mechanism 121 and the chip transfer mechanism 122 , respectively, for transporting the empty blister tray from the material loading and unloading component 40 back to the silo component 20 .

[0076] Alternatively, if Figure 7As shown, the blister tray reflow mechanism 123 includes a blister tray X-axis reflow machine 1231 located below the lens transport mechanism 121 or the chip transport mechanism 122, a blister tray Z-axis reflow machine 1232 drivingly connected to the blister tray X-axis reflow machine 1231, a blister tray clamping mechanism 1233 installed on the blister tray Z-axis reflow machine 1232 and located below the material loading and unloading assembly 40, and a blister tray push rod cylinder 1234 drivingly connected to the blister tray clamping mechanism 1233. In this way, after the blister tray carrying the lens product or the chip product is cleaned by the cleaning component 30, it is first transported to the material taking and placing component 40 through the lens transport mechanism 121 or the chip transport mechanism 122, and then clamped by the blister tray clamping mechanism 1233 for temporary fixation; thereafter, the material taking and placing component 40 first takes a photo through the visual positioning mechanism 44 to drive the position of the lens product or the chip product in the blister tray, and then takes the material from the blister tray through the lens clamping mechanism 42 or the chip suction mechanism 43; then, after the lens product or the chip product in the blister tray is taken out, the blister tray Z-axis reflow machine 1232 and the blister tray X-axis reflow machine 1231 cooperate to make the blister tray clamping mechanism 1233 descend with the empty blister tray and return it to the silo component 20; finally, the blister tray push rod cylinder 1234 pushes the empty blister tray clamped by the blister tray clamping mechanism 1233 into the silo of the silo component 20.

[0077] According to the embodiments of the present application, Figure 1 and Figure 8 As shown, the material picking and placing component 40 may further include a material picking and placing lower and upper mechanism 45 disposed below the material picking and placing track 41, and the material picking and placing lower and upper mechanism 45 is located between the transfer component 12 and the circulation component 13, and is used for photographing and locating the lens product or the chip product and scanning the QR code of the lens product or the chip product during the process of the material picking and placing track 41 transporting the lens product or the chip product from the transfer component 12 to the circulation component 13.

[0078] Alternatively, if Figure 8 As shown, the material loading and unloading mechanism 45 of the present application includes an optical camera device 451 and a QR code scanner 452 arranged side by side; the optical camera device 451 is used to take pictures and locate the lens product and the chip product respectively; the QR code scanner 452 is used to scan and record the QR code of the lens product and the chip product.

[0079] It is worth noting that, similar to the transport component 12, Figure 1 , Fig. 9 as well as Fig.10As shown, the circulation assembly 13 may include a lens circulation mechanism 131 and a chip circulation mechanism 132 arranged side by side along the second direction; the lens circulation mechanism 131 may include a lens X-axis circulation machine 1311 installed on the mounting substrate 11 and a lens fixing fixture 1312 drivingly connected to the lens X-axis circulation machine 1311 and used for temporarily fixing the lens product, and the lens fixing fixture 1312 drives the lens product from the pick-up and place assembly 40 in sequence under the drive of the lens X-axis circulation machine 1311 Flows to the cleaning and inspection mechanism 60 and the back-end feeding component 50; the chip circulation mechanism 132 may include a chip X-axis flow machine 1321 installed on the mounting substrate 11 and a chip adsorption fixture 1322 which is driven and connected to the chip X-axis flow machine 1321 and is used for temporarily adsorbing chip products. The chip adsorption fixture 1322 drives the chip product from the loading and unloading component 40 to flow to the cleaning and inspection mechanism 60 and the back-end feeding component 50 in sequence under the drive of the chip X-axis flow machine 1321.

[0080] In addition, since chip products are usually covered with a film to protect the chip, and the film needs to be torn off before assembling the module, Figure 1 and Fig.11 As shown, the cleaning inspection and loading equipment 1 of the present application may further include a film tearing mechanism 70, which is installed on the mounting substrate 11 and is located on one end of the chip circulation mechanism 132 adjacent to the loading and unloading assembly 40, and is used to automatically tear off the protective film on the chip product circulating through the chip circulation mechanism 132.

[0081] Alternatively, if Fig.11 As shown, the film tearing mechanism 70 includes a film tearing X-axis motor 71 installed on the mounting substrate 11, a film tearing Z-axis motor 72 drivingly connected to the film tearing X-axis motor 71, a film tearing substrate 73 drivingly connected to the film tearing Z-axis motor 72, a unwinding reel 74 rotatably arranged on the film tearing substrate 73 and used for releasing the tape, a receiving reel 75 rotatably arranged on the film tearing substrate 73 and used for recovering the tape, a film tearing U-axis rotating motor 76 installed on the film tearing substrate 73 and drivingly connected to the receiving reel 75, and a pressing mechanism 77 installed on the film tearing substrate 73 and used for pressing the tape to the surface of the chip product. In this way, the film tearing X-axis motor 71 can adjust the overall position of the film tearing substrate 73 together with the pressing mechanism 77, so that the pressing mechanism 77 can be aligned with the protective film of the chip product; the film tearing Z-axis motor 72 can lift and lower the film tearing substrate 73 together with the pressing mechanism 77, so that the pressing mechanism 77 can press the tape down to contact the protective film on the chip product; the film tearing U-axis rotation motor 76 can drive the receiving reel 75 to rotate to wind and recycle the tape with the protective film, and drive the unwinding reel 74 to rotate to release new tape (i.e., tape without the protective film).

[0082] Alternatively, if Fig.11 As shown, the pressing mechanism 77 includes an X-axis cylinder 771 installed on the film tearing substrate 73, a pressure sensor 772 fixed at the bottom of the X-axis cylinder 771, a flexible roller 773 slidably arranged on the film tearing substrate 73 and located below the pressure sensor 772, and a spring 774 arranged between the pressure sensor 772 and the flexible roller 773. In this way, since the pressure sensor 772 can detect the downward pressure of the flexible roller 773, the spring 774 can play a downward pressure buffering role to prevent damage to the chip product; therefore, when the film tearing Z-axis motor 72 adjusts the pressing mechanism 77 to descend to press the tape and contact the protective film on the chip product, the pressure sensor 772 can detect the downward pressure of the flexible roller 773 so as to control the pressure value within the set range; then, the X-axis cylinder 771 moves laterally to drive the pressure sensor 772, the spring 774 and the flexible roller 773 to move laterally together so as to stick and tear off the protective film covering the surface of the chip product.

[0083] Alternatively, if Fig.11 As shown, the film-tearing mechanism 70 further includes a plurality of adhesive tape tensioning wheels 78 mounted on the film-tearing substrate 73, the adhesive tape tensioning wheels 78 are respectively located between the unwinding roll 74 and the rewinding roll 75 and the flexible roller 773, and the adhesive tape tensioning wheels 78 and the flexible roller 773 are distributed in a triangular shape on the film-tearing substrate 73, and are used to ensure that the adhesive tape is distributed in a V-shape between the adhesive tape tensioning wheels 78 and the flexible roller 773 while tensioning the adhesive tape between the unwinding roll 74 and the rewinding roll 75. In this way, when the X-axis cylinder 771 moves laterally to drive the pressure sensor 772, the spring 774 and the flexible roller 773 to move laterally together, the adhesive tape can start to tear the film from one end of the protective film, so as to imitate the process of tearing the film by hand and improve the film-tearing efficiency.

[0084] According to the above embodiments of the present application, Fig.12 As shown, the cleaning inspection mechanism 60 may include a gantry 61 mounted on the mounting substrate 11 and spanning the lens transfer mechanism 131 and the chip transfer mechanism 132, an inspection Z-axis motor 62 mounted on the gantry 61, and an inspection camera 63 drivingly connected to the inspection Z-axis motor 62. In this way, the inspection Z-axis motor 62 can drive the inspection camera 63 to rise and fall, so as to accurately adjust the height of the inspection camera 63 relative to the lens transfer mechanism 131 and the chip transfer mechanism 132, so as to facilitate the inspection of micron-level dirt and damage on the surface of the lens product and the chip product through the inspection camera 63, and perform automatic optical inspection (Automated Optical Inspection; abbreviated AOI) on the lens product and the chip product.

[0085] Alternatively, if Fig.12 As shown, the cleaning detection mechanism 60 further includes a pair of dust removal Z-axis motors 64 installed side by side on the gantry 61 and a pair of dust removal heads 65 respectively connected to the dust removal Z-axis motors 64 and corresponding to the lens circulation mechanism 131 and the chip circulation mechanism 132. In this way, the dust removal Z-axis motor 64 can drive the dust removal head 65 to move up and down to approach or move away from the lens product or the chip product, so that the dust removal head 65 can accurately clean the dust and other dirt on the surface of a single lens product or a single chip product, further ensuring the cleanliness of the products fed to the back-end equipment.

[0086] Optionally, the dust removal head 65 is implemented as a dry ultrasonic dust collector to clean the lens product or chip product in a non-contact manner and ensure that the lens product or chip product remains clean and dry after cleaning, so as to meet the requirements of post-process module assembly.

[0087] It is worth noting that, since the lens product needs to be turned over before being transferred to the back-end feeding assembly 50, Figure 1 and Fig.13 As shown, the cleaning inspection loading equipment 1 of the present application may further include a flipping mechanism 80, which is installed on the mounting substrate 11 and is located on one end of the lens circulation mechanism 131 adjacent to the back-end feeding assembly 50, and is used to automatically flip the lens product circulating through the lens circulation mechanism 131.

[0088] Alternatively, if Fig.13 As shown, the flip mechanism 80 includes a flip Z-axis motor 81 mounted on the mounting substrate 11, an electric platform 82 drivingly connected to the flip Z-axis motor 81, a flip motor 83 fixedly mounted on the electric platform 82, and a clamping cylinder 84 fixedly connected to the flip motor 83 and used to clamp the lens product. In this way, the flip Z-axis motor 81 can drive the electric platform 82, the flip motor 83 and the clamping cylinder 84 to rise and fall as a whole; the electric platform 82 can fine-tune the clamping position of the clamping cylinder 84 so that the clamping position can be calibrated with one key when switching different lens products; the flip motor 83 can rotate the clamping cylinder 84 180° to flip the lens product clamped by the clamping cylinder 84, thereby realizing the clamping and flipping of the lens product.

[0089] According to the above embodiments of the present application, Fig.14As shown, the back-end feeding assembly 50 may include a feeding Y-axis track 51 spanning the circulation assembly 13 and the loading assembly 14, a feeding X-axis motor 52 drivingly connected to the feeding Y-axis track 51, a chip adsorption mechanism 53 drivingly connected to the feeding X-axis motor 52, a lens clamping mechanism 54 drivingly connected to the feeding X-axis motor 52, and a camera photographing mechanism 55 drivingly connected to the feeding X-axis motor 52. It can be understood that the chip adsorption mechanism 53 mentioned in the present application may have the same structure as the chip suction mechanism 43, which is used to lift and lower the chip product; the lens clamping mechanism 54 may have the same structure as the lens clamping mechanism 42, which is used to lift and lower the lens product; the camera photographing mechanism 55 may have the same structure as the visual positioning mechanism 44, which is used to take pictures of the back-end fixture for accurate positioning, so as to ensure that the back-end fixtures at different positions can accurately put the lens product or chip product.

[0090] Alternatively, if Fig.14 As shown, the back-end feeding assembly 50 further includes a tray Y-axis track 56 arranged side by side with the feeding Y-axis track 51, a lens NG tray 57 drivingly connected to the tray Y-axis track 56 and used to hold defective lenses, and a chip NG tray 58 drivingly connected to the tray Y-axis track 56 and used to hold defective chips. In this way, the tray Y-axis track 56 can move the lens NG tray 57 and the chip NG tray 58 between the loading assembly 14 and the front end of the device, so as to facilitate the discharge of the lens NG tray 57 and the chip NG tray 58.

[0091] Optionally, the lens NG tray 57 and the chip NG tray 58 are both provided with fool-proof structures, so that the storage positions of the lens NG tray 57 and the chip NG tray 58 cannot be swapped, and the front and rear directions of the trays cannot be swapped, so that defective lens inspection products and defective chip inspection products can be accurately identified.

[0092] Alternatively, if Figure 1 and Fig.15 As shown, the back-end feeding assembly 50 also includes a back-end feeding lower and upper mechanism 59, which is installed on the mounting substrate 11 and located below the feeding Y-axis track 51, and is used to take pictures and position the lens product clamped by the lens clamping mechanism 54 and the chip product adsorbed by the chip adsorption mechanism 53. It can be understood that compared with the above-mentioned material taking and placing lower and upper mechanism 45 of the present application, the back-end feeding lower and upper mechanism 59 mentioned in the present application only includes an optical camera detection system, and there is no need to set up an additional QR code scanner.

[0093] According to the above embodiments of the present application, Figure 1 and Figure 2As shown, the loading assembly 14 may include a front track mechanism 141 for back-end loading and a rear track mechanism 142 for back-end loading. The front track mechanism 141 for back-end loading and the rear track mechanism 142 for back-end loading are arranged side by side along the second direction below the feeding Y-axis track 51, and are used for automatically loading good lenses and good chips supplied via the back-end feeding assembly 50 to the back-end equipment.

[0094] Alternatively, if Fig.16 As shown, the back-end loading front track mechanism 141 includes a front track frame 1411 installed on the mounting substrate 11, a front track code scanner 1412 arranged on the front track frame 1411 and used to scan the back-end pallet jig, a front track upper layer transmission mechanism 1413 installed on the front track frame 1411 and used to transmit the back-end pallet jig backward to the back-end equipment, and a front track jig opening mechanism 1414 installed on the front track frame 1411 and used to open the back-end pallet jig to take and place the lens product and the chip product. It can be understood that the back-end pallet jig mentioned in this application is mainly used to temporarily fix a single lens product and a single chip product for circulation in the equipment; after scanning the back-end pallet jig, the front track code scanner 1412 mentioned in this application can cooperate with the QR code that has been scanned and entered by the lens product and the chip product carried by the back-end pallet jig to perform one-to-one binding of the product and the jig.

[0095] Alternatively, if Fig.16 As shown, the back-end loading front track mechanism 141 also includes a front track upper limit plate 1415 fixedly mounted on the front track frame 1411 and located above the front track fixture opening mechanism 1414, and a front track position sensor 1416 fixedly mounted on the front track frame 1411. The front track upper limit plate 1415 is used to block the back-end pallet fixture that is lifted upward by the front track fixture opening mechanism 1414, so that the pressure cover of the chip product on the back-end pallet fixture is first pushed open by the front track fixture opening mechanism 1414, and then removed by the front track fixture opening mechanism 1414, so as to play the role of opening the fixture. The front track position sensor 1416 is used to sense the running position of the back-end pallet fixture on the front track upper transmission mechanism 1413, so as to ensure the safe transmission of the back-end pallet fixture.

[0096] It is worth noting that the rear track mechanism 142 for rear-track loading can have a similar structure to the front track mechanism 141 for rear-track loading, that is, Fig.17As shown, the rear track mechanism 142 for back-end loading may include a rear track frame 1421 mounted on the mounting substrate 11, a rear track scanner 1422 disposed on the rear track frame 1421 and used for scanning the back-end pallet fixture, a rear track upper transmission mechanism 1423 mounted on the rear track frame 1421 and used for transmitting the back-end pallet fixture backward to the back-end equipment, a rear track fixture opening mechanism 1424 mounted on the rear track frame 1421 and used for opening the back-end pallet fixture to take and place lens products and chip products, a rear track upper limit plate 1425 fixedly mounted on the rear track frame 1421 and located above the rear track fixture opening mechanism 1424, and a rear track position sensor 1426 fixedly mounted on the rear track frame 1421.

[0097] However, in order to reduce costs and improve the compactness of the structure, such as Figure 1 and Fig.16 As shown, the back-end loading front track mechanism 141 of the present application further includes an ion wind pump 1417 installed on the front track frame 1411 and arranged toward the back-end loading rear track mechanism 142, and a front track lower layer transmission mechanism 1418 installed on the front track frame 1411 and located below the front track upper layer transmission mechanism 1413; the ion wind pump 1417 is used to simultaneously clean the surface and remove static electricity of the back-end pallet fixtures transmitted via the front track upper layer transmission mechanism 1413 and the rear track upper layer transmission mechanism 1423; the front track lower layer transmission mechanism 1418 is used to transmit empty back-end pallet fixtures from the back-end equipment back to the front.

[0098] Alternatively, if Figure 1 and Fig.18 As shown, the loading component 14 further includes a back-end return track mechanism 143, which is arranged on the front side of the back-end loading front track mechanism 141 and the back-end loading rear track mechanism 142, and is used to return the back-end pallet fixture returned via the front track lower layer transmission mechanism 1418 to the front track upper layer transmission mechanism 1413 and the rear track upper layer transmission mechanism 1423, so as to realize the recycling of the back-end pallet fixture.

[0099] Alternatively, if Fig.18As shown, the back-end return track mechanism 143 includes a return track frame 1431 fixed to the mounting substrate 11, a back-end return Y-axis motor 1432 installed on the return track frame 1431, a back-end return Z-axis motor 1433 drivingly connected to the back-end return Y-axis motor 1432, and a back-end return transmission mechanism 1434 drivingly connected to the back-end return Z-axis motor 1433. The back-end reflow Y-axis motor 1432 and the back-end reflow Y-axis motor 1432 cooperate with each other to move the back-end reflow transmission mechanism 1434, so that the back-end reflow transmission mechanism 1434 receives the back-end pallet fixture returned by the front track lower layer transmission mechanism 1418 when it is aligned with the front track lower layer transmission mechanism 1418, and transmits the empty back-end pallet fixture to the front track upper layer transmission mechanism 1413 or the rear track upper layer transmission mechanism 1423 to wait for carrying good lens products and good chips when it is aligned with the front track upper layer transmission mechanism 1413 or the rear track upper layer transmission mechanism 1423.

[0100] In summary, if Fig.19 As shown, after the blister trays carrying the lens products and the chip products are manually placed into the blister tray bin (i.e., the lens bin module) of the lens bin mechanism 21 and the blister tray bin 224 (i.e., the chip bin module) of the chip bin mechanism 22 respectively:

[0101] The first step: the chip silo mechanism 22 will first lift up the blister tray silo 224 with chip products through the silo Z-axis elevator 223, and then open the blister tray silo 224 through the silo opening cylinder 221 and the silo opening and closing plate 222; at the same time, the lens silo mechanism 21 will first lift up the blister tray silo with lens products through the silo Z-axis elevator, and then open the blister tray silo through the silo opening cylinder and the silo opening and closing plate.

[0102] Step 2: The chip transport mechanism 122 (i.e., the chip push-pull rod module) in the transport component 12 pulls the blister tray with the chip product from the blister tray bin of the chip bin mechanism 22 to the cleaning component 30 (i.e., the PLASM module) for plasma cleaning of the product surface; at the same time, the lens transport mechanism 121 (i.e., the lens push-pull rod module) in the transport component 12 pulls the blister tray with the lens product from the blister tray bin of the lens bin mechanism 21 to the cleaning component 30 (i.e., the PLASM module) for plasma cleaning of the product surface.

[0103] Step 3: After the chip product is cleaned by PLASMA surface, the chip push-pull rod module pushes the blister tray with the chip product to the corresponding blister tray reflux mechanism 123 (i.e., the chip blister tray reflux module) to temporarily fix the blister tray; at the same time, after the lens product is cleaned by PLASMA surface, the lens push-pull rod module pushes the lens blister tray to the corresponding blister tray reflux mechanism 123 (i.e., the lens blister tray reflux module) to temporarily fix the blister tray.

[0104] Step 4: The material taking and placing component 40 (i.e., the material taking and placing module) first determines the position of the chip product in the blister tray through the visual positioning mechanism 44, and then absorbs the chip product through the chip absorption mechanism 43; at the same time, the material taking and placing component 40 (i.e., the material taking and placing module) first determines the position of the lens product in the blister tray through the visual positioning mechanism 44, and then clamps the lens product through the lens clamping mechanism 42; thereafter, the clamped lens product and the adsorbed chip product are photographed and positioned for the relative position of the lens and scanned for the QR code, and the chip product is photographed and positioned for the relative position of the lens and scanned for the QR code through the material taking and placing lower and upper mechanism 45 (i.e., the material taking and placing lower and upper module).

[0105] Step 5: The material taking and placing module puts the lens product into the fixture in the lens circulation mechanism 131 (i.e., the lens circulation module) for temporary fixation; and puts the chip product into the fixture in the chip circulation mechanism 132 (i.e., the chip circulation module) for temporary adsorption. At the same time, the blister trays of the lens product and the chip product are taken out and respectively transferred back to the lens silo module and the chip silo module through the blister tray reflux mechanism 123 (i.e., the chip blister tray reflux module and the lens blister tray reflux module);

[0106] Step 6: The product in the lens circulation module moves together with the fixture, first passes through the cleaning and detection mechanism 60 (i.e., the cleaning and detection module) for surface dry dust removal and AOI detection, and then passes through the flipping mechanism 80 (i.e., the flipping module) to flip the lens product over and over; at the same time, the product in the chip circulation module moves together with the fixture, first passes through the film tearing mechanism 70 (i.e., the film tearing module) to remove the chip surface protective film, and then passes through the cleaning and detection module for surface dry dust removal and AOI detection.

[0107] Step 7: After the lens and chip processing is completed, the back-end feeding component 50 (i.e., the back-end feeding module) clamps and takes out the lens product in the lens fixture, and absorbs and takes out the chip product in the chip fixture, and classifies them according to the AOI inspection results: defective products are placed in the defective material tray; good lens and chip products continue to the back-end feeding lower and upper mechanism 59 (i.e., the back-end feeding lower and upper module) for photography and positioning, and then the products are placed in the back-end fixture on the back-end feeding front track mechanism 141 (i.e., the back-end feeding front track module) or the back-end feeding rear track mechanism 142 (i.e., the back-end feeding rear track module) for temporary fixation;

[0108] Step 8: The back-end material loading rear track module or the back-end material loading front track module transfers the back-end fixture with the lens product and the chip product to the back-end equipment, and the empty fixture is transferred to the back-end track return mechanism 143 (i.e., the back-end track return module) through the lower layer of the back-end material loading front track module, and then the empty fixture is returned to the back-end material loading rear track module or the back-end material loading front track module through the back-end track return module.

[0109] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0110] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. Cleaning, testing and feeding equipment, characterized in that: include: The equipment platform comprises a mounting base, a transfer assembly mounted on the mounting base and extending along a first direction, a circulation assembly mounted on the mounting base and spaced apart from the transfer assembly along a second direction perpendicular to the first direction, and a loading assembly mounted on the mounting base and spaced apart from both the transfer assembly and the circulation assembly; A silo assembly, mounted on the mounting base and located at one end of the transfer assembly, for providing a product blister tray to the transfer assembly; A cleaning component is installed on the installation base plate and corresponds to the middle of the transfer component, and is used to simultaneously clean a plurality of products in the product blister tray transferred via the transfer component; A material taking and placing component is installed on the installation base plate and extends from the other end of the transfer component along the second direction to the middle of the circulation component, and is used to take out the product from the cleaned product blister tray and put it into the product fixture of the circulation component; A back-end feeding assembly is installed on the mounting substrate and extends from one end of the circulation assembly along the second direction to the loading assembly, and is used to take out the product in the product fixture circulating through the circulation assembly and convey it to the loading assembly; as well as A cleaning detection mechanism is installed on the mounting substrate and corresponds to a position on the circulation component between the material picking and placing component and the back-end material feeding component, and is used for cleaning and detecting the surface of a single product circulating through the circulation component.

2. The cleaning detection feeding equipment according to claim 1, characterized in that: The transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side by side along the second direction; the silo assembly includes a lens silo mechanism corresponding to the lens transfer mechanism and a chip silo mechanism corresponding to the chip transfer mechanism; the cleaning assembly includes a lens cleaning mechanism located above the lens transfer mechanism and a chip cleaning mechanism located above the chip transfer mechanism; the lens cleaning mechanism and the chip cleaning mechanism are independent plasma cleaners.

3. The cleaning detection feeding equipment according to claim 2 is characterized in that: The plasma cleaner comprises a plasma cleaning body located above the lens transport mechanism or the chip transport mechanism and a cleaning cylinder drivingly connected to the plasma cleaning body, and the plasma cleaning body is lifted and lowered under the driving of the cleaning cylinder.

4. The cleaning detection feeding equipment according to claim 2, characterized in that: The chip silo mechanism includes a pair of silo opening cylinders, a pair of silo opening and closing plates, a silo Z-axis elevator installed on the mounting substrate, and a blister tray silo corresponding to the chip transfer mechanism and used for stacking multiple blister trays; the blister tray silo is fixedly mounted on the silo Z-axis elevator; the two silo opening and closing plates are respectively movably arranged on the front and rear sides of the blister tray silo; the two silo opening cylinders are respectively and correspondingly driven and connected to the two silo opening and closing plates to drive the silo opening and closing plates to open or close the blister tray silo.

5. The cleaning detection feeding equipment according to claim 2, characterized in that: The lens transport mechanism and the chip transport mechanism are both push-pull rod mechanisms; the push-pull rod mechanism includes a push-pull rod member, a push-pull rod cylinder that is driven connected to the push-pull rod member and extends up and down, and a push-pull rod X-axis traverse machine that is driven connected to the push-pull rod cylinder and extends along the first direction.

6. The cleaning detection feeding equipment according to claim 2, characterized in that: The transfer component further includes a pair of blister tray reflow mechanisms corresponding to the lens transfer mechanism and the chip transfer mechanism respectively; the blister tray reflow mechanism includes a blister tray X-axis reflow machine located below the lens transfer mechanism or the chip transfer mechanism, a blister tray Z-axis reflow machine drivingly connected to the blister tray X-axis reflow machine, a blister tray clamping mechanism installed on the blister tray Z-axis reflow machine and located below the material loading and unloading component, and a blister tray push rod cylinder drivingly connected to the blister tray clamping mechanism.

7. The cleaning detection feeding equipment according to any one of claims 1 to 6, characterized in that: The material picking and placing assembly includes a material picking and placing track spanning the transfer assembly and the circulation assembly, a lens clamping mechanism drivingly connected to the material picking and placing track, a chip suction mechanism drivingly connected to the material picking and placing track and arranged side by side with the lens clamping mechanism, and a visual positioning mechanism drivingly connected to the material picking and placing track and located between the lens clamping mechanism and the chip suction mechanism.

8. The cleaning detection feeding equipment according to claim 7, characterized in that: The material picking and placing component further includes a material picking and placing lower and upper mechanism arranged below the material picking and placing track and between the transfer component and the circulation component; the material picking and placing lower and upper mechanism includes an optical camera and a QR code scanner arranged side by side; the optical camera is used to take pictures and locate the lens product and the chip product respectively; the QR code scanner is used to scan and record the QR code of the lens product and the chip product.

9. The cleaning detection feeding equipment according to any one of claims 1 to 6, characterized in that: The circulation assembly includes a lens circulation mechanism and a chip circulation mechanism arranged side by side along the second direction; the lens circulation mechanism includes a lens X-axis circulation machine installed on the mounting substrate and a lens fixing fixture driven and connected to the lens X-axis circulation machine and used to temporarily fix the lens product; the chip circulation mechanism includes a chip X-axis circulation machine installed on the mounting substrate and a chip adsorption fixture driven and connected to the chip X-axis circulation machine and used to temporarily adsorb the chip product.

10. The cleaning detection feeding equipment according to claim 9, characterized in that: The cleaning detection loading equipment further includes a film tearing mechanism, which is installed on the mounting substrate and is located at one end of the chip circulation mechanism adjacent to the material loading and unloading assembly; the film tearing mechanism includes a film tearing X-axis motor installed on the mounting substrate, a film tearing Z-axis motor drivingly connected to the film tearing X-axis motor, a film tearing substrate drivingly connected to the film tearing Z-axis motor, a unwinding reel rotatably arranged on the film tearing substrate and used to release the tape, a receiving reel rotatably arranged on the film tearing substrate and used to recycle the tape, a film tearing U-axis rotating motor installed on the film tearing substrate and drivingly connected to the receiving reel, and a pressing mechanism installed on the film tearing substrate and used to press the tape to the surface of the chip product.

11. The cleaning detection feeding equipment according to claim 10, characterized in that: The pressing mechanism includes an X-axis cylinder installed on the film tearing substrate, a pressure sensor fixed at the bottom of the X-axis cylinder, a flexible roller slidably arranged on the film tearing substrate and located below the pressure sensor, and a spring arranged between the pressure sensor and the flexible roller; the film tearing mechanism further includes a plurality of tape tensioning wheels installed on the film tearing substrate, the tape tensioning wheels are respectively located between the unwinding roll and the receiving roll and the flexible roller, and the tape tensioning wheels and the flexible roller are distributed in a triangular shape on the film tearing substrate.

12. The cleaning detection feeding equipment according to claim 9, characterized in that: The cleaning detection mechanism includes a gantry installed on the mounting substrate and spanning the lens circulation mechanism and the chip circulation mechanism, a detection Z-axis motor installed on the gantry, a detection camera drivingly connected to the detection Z-axis motor, a pair of dust removal Z-axis motors installed side by side on the gantry, and a pair of dust removal heads respectively drivingly connected to the dust removal Z-axis motors and corresponding to the lens circulation mechanism and the chip circulation mechanism; the dust removal heads are dry ultrasonic dust collectors.

13. The cleaning detection feeding equipment according to claim 9, characterized in that: The cleaning inspection and loading equipment further includes a flipping mechanism, which is installed on a flipping Z-axis motor of the mounting substrate, an electric platform drivingly connected to the flipping Z-axis motor, a flipping motor fixedly mounted on the electric platform, and a clamping cylinder fixedly connected to the flipping motor and used to clamp the lens product.

14. The cleaning detection feeding equipment according to any one of claims 1 to 6, characterized in that: The back-end feeding assembly includes a feeding Y-axis track spanning the circulation assembly and the loading assembly, a feeding X-axis motor drivingly connected to the feeding Y-axis track, a chip adsorption mechanism drivingly connected to the feeding X-axis motor, a lens clamping mechanism drivingly connected to the feeding X-axis motor, and a camera shooting mechanism drivingly connected to the feeding X-axis motor.

15. The cleaning detection feeding equipment according to claim 14, characterized in that: The back-end feeding assembly further includes a material tray Y-axis track arranged side by side with the feeding Y-axis track, a lens NG material tray drivingly connected to the material tray Y-axis track and used for holding defective lenses, a chip NG material tray drivingly connected to the material tray Y-axis track and used for holding defective chips, and a back-end feeding lower and upper mechanism, and the back-end feeding lower and upper mechanism is installed on the mounting substrate and is located below the feeding Y-axis track.

16. The cleaning detection feeding equipment according to claim 14, characterized in that: The loading assembly includes a back-end loading front track mechanism and a back-end loading rear track mechanism arranged side by side along the second direction below the feeding Y-axis track; the back-end loading front track mechanism includes a front track frame installed on the mounting base plate, a front track scanner arranged on the front track frame and used to scan the back-end pallet fixture, a front track upper layer transmission mechanism installed on the front track frame and used to transmit the back-end pallet fixture backward to the back-end equipment, a front track fixture opening mechanism installed on the front track frame and used to open the back-end pallet fixture, a front track upper limit plate fixedly installed on the front track frame and located above the front track fixture opening mechanism, and a front track position sensor fixedly installed on the front track frame.

17. The cleaning detection feeding equipment according to claim 16, characterized in that: The back-end loading front track mechanism also includes an ion wind pump installed on the front track frame and arranged toward the back-end loading rear track mechanism, and a front track lower-layer transmission mechanism installed on the front track frame and located below the front track upper-layer transmission mechanism; the loading assembly further includes a back-end return track mechanism, which is arranged on the front side of the back-end loading front track mechanism and the back-end loading rear track mechanism, and is used to return the back-end pallet fixture returned via the front track lower-layer transmission mechanism to the front track upper-layer transmission mechanism and the back-end loading rear track mechanism.

18. The cleaning detection feeding equipment according to claim 17, characterized in that: The back-end return track mechanism includes a return track frame fixed to the mounting substrate, a back-end return Y-axis motor installed on the return track frame, a back-end return Z-axis motor drivingly connected to the back-end return Y-axis motor, and a back-end return transmission mechanism drivingly connected to the back-end return Z-axis motor.

19. Camera module assembly line, characterized in that: include: Back-end equipment, used to assemble lens products and chip products; and The cleaning inspection loading equipment as described in any one of claims 1 to 18 is arranged at the loading end of the back-end equipment, and is used to automatically load the lens products and chip products after cleaning inspection to the back-end equipment.

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