Tension testing device for wafer production

Abstract

The invention discloses a tensile force testing device for wafer production, and provides the following scheme: the tensile force testing device comprises a bottom plate, a device main body is arranged on the bottom plate, a base is mounted at the bottom of the bottom plate, a transmission mechanism is arranged on the device main body, and a testing mechanism is arranged on the transmission mechanism; the transmission mechanism and the test mechanism are arranged, a first motor drives a rotating block and a connecting rod to rotate, then a mounting disc is driven to rotate, then four placement frames are driven to rotate together, and then electric push rods and corresponding pressing blocks or drag hooks in the placement frames are driven to rotate together until appropriate test assemblies are rotated to corresponding test parts. Therefore, in actual operation, when a large amount of tedious detection work occurs, all the detection assemblies can be used in turn, mechanical fatigue is avoided, corresponding detection errors are reduced, meanwhile, when different types of detection requirements are met, the detection assemblies do not need to be integrally disassembled, assembled and replaced, and the operation process is more convenient.

Description

Technical Field

[0001] The invention relates to the technical field of round wafer production, and in particular to a tensile testing device for round wafer production. Background Art

[0002] A round crystal, also known as a wafer, refers to a silicon wafer used to make silicon semiconductor integrated circuits. Various circuit element structures can be processed on silicon wafers to become integrated circuit products with specific electrical functions. On a wafer, there are usually hundreds to thousands of chips connected together. In the actual processing process, after the crystalline silicon is purified, it needs to be tensile tested to ensure its structural strength and stability. During specific testing, the corresponding push-pull force testing machine is generally used for detection. In the existing patent with patent number CN116380656A, a push-pull force testing machine for wafer bump production with a protective storage function is disclosed.

[0003] However, in actual operation, the push-pull force tester for wafer bump production in the above patent can only provide a set of corresponding wafer push-pull force test components. In this way, when a large number of detection tasks are performed, the detection components are prone to mechanical fatigue, resulting in large errors in the detection. At the same time, when different types of detection requirements are required, the detection components must be replaced accordingly before continuing, which makes the operation process more complicated. In addition, when fixing the position of the semiconductor wafer bump, the traditional method is mostly to clamp and limit the two parts of the surface of the wafer bump in batches. This not only lacks the number of force points on the wafer bump, but also makes it difficult to control the clamping force of each clamping component on the wafer bump. If the clamping force of the clamping component on the semiconductor wafer bump is too low, the wafer bump is prone to loosening or even falling during the detection process. On the other hand, most of the current push-pull force test devices for semiconductor wafer bumps can only test the semiconductor wafer bump in a single direction, and it is difficult to perform multi-angle detection according to actual conditions, which will result in a small test range and inaccurate data, affecting the actual test effect. In view of the above problems, the present invention document proposes a tensile testing device for round wafer production. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings existing in the prior art, and to propose a tensile testing device for wafer production that can assemble multiple detection components at the same time to facilitate detection needs, can clamp the wafer bumps at multiple angles, and can conveniently adjust the placement angle of the wafer, so as to facilitate multi-angle detection of the wafer.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A tensile testing device for wafer production, comprising a bottom plate, a device body is arranged on the bottom plate, a base is installed at the bottom of the bottom plate, a transmission mechanism is arranged on the device body, a testing mechanism is arranged on the transmission mechanism, a driving mechanism is arranged on the top of the bottom plate, a placing mechanism is arranged on the driving mechanism, and an adjusting mechanism is arranged on both the driving mechanism and the placing mechanism;

[0007] The transmission mechanism comprises a first motor, the first motor is installed inside the device body, a rotating block is connected to the transmission end of the first motor, the rotating block is slidably connected to the inside of the device body through a limit block, and a connecting rod is fixedly connected to the bottom of the rotating block, and a mounting plate is fixedly connected to the connecting rod;

[0008] The testing mechanism comprises a placement frame, four placement frames are fixedly connected to the bottom of the mounting plate, electric push rods are arranged inside the placement frame, two of the electric push rods are connected to pressure blocks on their output ends, and the other two electric push rods are connected to hooks on their output ends.

[0009] Preferably, the mounting disk is in the shape of a circular disk, and two auxiliary rods are fixedly connected to the mounting disk, and the auxiliary rods are fixedly connected to the rotating block.

[0010] Preferably, the driving mechanism comprises a mounting block, and two ends of one side of the top of the base plate are respectively fixedly connected with a mounting block, and an operating table is provided between the two mounting blocks, and the operating table is slidably connected to the base plate.

[0011] Preferably, a second motor is provided on one side of one of the mounting blocks, a first screw rod is connected to a transmission end of the second motor, the first screw rod rotates between the two mounting blocks, and the first screw rod is threadedly connected to the inside of the operating table.

[0012] Preferably, a telescopic protective cover is fixedly connected to each of the two sides of the operating table, and the other ends of the two telescopic protective covers are fixedly connected to two mounting blocks, and the telescopic protective covers surround the first screw rod.

[0013] Preferably, the placement mechanism includes a support rod, the support rod is provided on the operating table, the placement table is fixedly connected to the support rod, the placement table is internally rotatably connected to a first gear, a third motor is provided inside the support rod, and the transmission end of the third motor is connected to the first gear.

[0014] Preferably, the placing table is rotatably connected to a plurality of second gears inside, the first gear is meshed with a plurality of second gears, the second gear is fixedly connected to a third gear, the third gear is meshed with a fourth gear, the fourth gear is fixedly connected to a second screw rod, the second screw rod is rotatably connected to the inside of the placing table, a plurality of moving blocks are slidably connected to the placing table, the plurality of second screw rods are respectively threadedly connected to the inside of the plurality of moving blocks, and a clamping block is fixedly connected to the moving block.

[0015] Preferably, the moving block is in an arc shape, a plurality of the moving blocks are distributed in a ring array, and the third gear and the fourth gear are both in the shape of bevel gears.

[0016] Preferably, the adjustment mechanism includes a fourth motor, and a fourth motor is provided on one side of the operating table. A rotating rod is connected to the transmission end of the fourth motor, and the rotating rod passes through the support rod and is rotatably connected to the inside of the operating table. The support rod is fixedly connected to the rotating rod.

[0017] Preferably, a fixing block is provided inside the operating table, an adjusting rope runs through the inside of the fixing block, and the adjusting rope is fixedly connected to the bottom of the supporting rod.

[0018] Compared with the prior art, the present invention provides a tensile testing device for round wafer production, which has the following beneficial effects:

[0019] 1. The tensile testing device for round wafer production is provided with a first motor, a rotating block, a connecting rod, a mounting plate, a placement frame, an electric push rod, a pressure block and a hook. The first motor drives the rotating block to rotate, and the rotating block drives the connecting rod to rotate, and then drives the mounting plate to rotate. As the mounting plate rotates, the four placement frames are driven to rotate together, and then the electric push rod and the corresponding pressure block or the hook inside are driven to rotate together, until the appropriate test component is rotated to the corresponding test position. In actual operation, when a large number of tedious detection work occurs, each detection component can be used in turn, so that mechanical fatigue is avoided and the corresponding detection error is reduced. At the same time, when there are different types of detection requirements, there is no need to disassemble and replace the detection component as a whole, making the operation process more convenient.

[0020] 2. The tensile testing device for round wafer production places the round wafer bump on the placing table by setting a placing table, a third motor, a first gear, a second gear, a third gear, a fourth gear, a second screw, a moving block and a clamping block. Then, the first gear is driven to rotate by the third motor, and then multiple second gears are driven to rotate together, and then multiple third gears are driven to rotate respectively, and then multiple fourth gears are driven to rotate together, and further multiple second screws are driven to rotate together, and then the corresponding moving blocks are driven to move back and forth on the placing table, and the clamping blocks are driven to move together. Through the synchronous displacement of multiple clamping blocks, the corresponding round wafers can be conveniently clamped and limited at multiple angles, thereby ensuring a sufficient number of force points on the wafer bumps, and at the same time it is also convenient to control the clamping force of the wafer bumps, so that the clamping of the wafer bumps is more stable, avoiding the wafer bumps from loosening or even falling off during the detection process.

[0021] 3. The tensile testing device for round wafer production is provided with a fourth motor, a rotating rod, a fixed block and an adjusting rope. According to actual needs, the fourth motor can drive the rotating rod to rotate, and the rotation of the rotating rod drives the support rod to rotate, thereby driving the wafer bumps placed on the support rod to rotate together. The adjusting rope on the fixed block makes it more convenient to limit the adjustment of the support rod until the support rod and the wafer bumps placed thereon are adjusted to a suitable placement angle, so that the corresponding wafer bumps can be detected from multiple angles according to actual conditions, so that the test range is wider and the data is more accurate, thereby improving the actual test effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional view of the tensile testing device for wafer production proposed by the present invention;

[0023] Figure 2 A view of the bottom plate, the device body, the base, the transmission mechanism and the driving mechanism connection structure of the present invention;

[0024] Figure 3 A view of the connection structure between the transmission mechanism and the testing mechanism of the present invention;

[0025] Figure 4 A view of the connection structure of the bottom plate, base, driving mechanism and placement mechanism of the present invention;

[0026] Figure 5 A view of the connection structure between the driving mechanism and the placing mechanism of the present invention;

[0027] Figure 6 A view of the connection structure of the operating table, the placement mechanism and the adjustment mechanism of the present invention;

[0028] Figure 7 A view of the connection structure of the operating table, the support rod and the adjustment mechanism of the present invention;

[0029] Figure 8 A view of the placement mechanism structure of the present invention;

[0030] Fig. 9 A view of the connection structure of the placement table, the second gear, the third gear, the fourth gear, the second screw rod, the moving block and the clamping block of the present invention;

[0031] Fig.10 This is a view of the connection structure of the third motor, the first gear, the second gear, the third gear, the fourth gear, the second screw rod, the moving block and the clamping block of the present invention.

[0032] In the figure: 1, bottom plate; 2, device body; 3, base; 4, transmission mechanism; 401, first motor; 402, rotating block; 403, limit block; 404, connecting rod; 405, mounting plate; 406, auxiliary rod; 5, testing mechanism; 501, placement frame; 502, electric push rod; 503, pressing block; 504, hook; 6, driving mechanism; 601, mounting block; 602, operating table; 603, second motor; 604 , the first screw rod; 605, the telescopic protective cover; 7, the placement mechanism; 701, the support rod; 702, the placement table; 703, the third motor; 704, the first gear; 705, the second gear; 706, the third gear; 707, the fourth gear; 708, the second screw rod; 709, the moving block; 710, the clamping block; 8, the adjustment mechanism; 801, the fourth motor; 802, the rotating rod; 803, the fixed block; 804, the adjustment rope. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Embodiment 1:

[0036] Reference Figure 1-Figure 10A tensile testing device for round wafer production includes a base plate 1, a device body 2 is provided on the base plate 1, and a base 3 is installed at the bottom of the base plate 1, a transmission mechanism 4 is provided on the device body 2, a testing mechanism 5 is provided on the transmission mechanism 4, a driving mechanism 6 is provided on the top of the base plate 1, a placing mechanism 7 is provided on the driving mechanism 6, and an adjusting mechanism 8 is provided on both the driving mechanism 6 and the placing mechanism 7.

[0037] The transmission mechanism 4 includes a first motor 401, which is installed inside the device body 2. A rotating block 402 is connected to the transmission end of the first motor 401. The rotating block 402 is slidably connected to the inside of the device body 2 through a limit block 403, and a connecting rod 404 is fixedly connected to the bottom of the rotating block 402. A mounting disk 405 is fixedly connected to the connecting rod 404. The mounting disk 405 is disc-shaped, and two auxiliary rods 406 are fixedly connected to the mounting disk 405. The auxiliary rods 406 are fixedly connected to the rotating block 402. By setting the first motor 401, in actual operation, the first motor 401 can be connected to the power supply, and the first motor 401 drives the rotating block 402 to rotate through the limit block 403, and the rotation of the rotating block 402 drives the connecting rod 404 to rotate, and the rotation of the connecting rod 404 drives the mounting disk 405 to rotate, thereby driving the corresponding test component to rotate and adjust.

[0038] The testing mechanism 5 includes a placement frame 501, and four placement frames 501 are fixedly connected to the bottom of the installation disk 405. Electric push rods 502 are arranged inside the placement frame 501, wherein the output ends of two electric push rods 502 are connected to pressure blocks 503, and the output ends of the other two electric push rods 502 are connected to hooks 504. By setting the placement frame 501, in actual operation, as the installation disk 405 rotates, the four placement frames 501 will be driven to rotate together, and then the electric push rods 502 and the corresponding pressure blocks 503 or hooks 504 inside will be driven to rotate together until the appropriate test component is rotated to the corresponding test position. Therefore, in actual operation, when a large amount of tedious detection work occurs, each detection component can be used in turn, so that mechanical fatigue is avoided and the corresponding detection error is reduced. At the same time, when there are different types of detection requirements, there is no need to disassemble and replace the detection component as a whole, which makes the operation process more convenient.

[0039] By setting the first motor 401, the rotating block 402, the limit block 403, the connecting rod 404, the installation disk 405, the placement frame 501, the electric push rod 502, the pressure block 503 and the hook 504, in actual operation, the first motor 401 can be connected to the power supply, and the first motor 401 drives the rotating block 402 to rotate through the limit block 403, and the rotation of the rotating block 402 drives the connecting rod 404 to rotate, and the rotation of the connecting rod 404 drives the installation disk 405 to rotate.

[0040] As the mounting plate 405 rotates, the four mounting frames 501 will be driven to rotate together, and then the electric push rod 502 and the corresponding pressure block 503 or hook 504 inside will be driven to rotate together, until the appropriate test component is rotated to the corresponding test position. In actual operation, when a large amount of tedious testing work occurs, the various testing components can be used in turn, thereby avoiding the occurrence of mechanical fatigue and reducing the corresponding testing errors. At the same time, when meeting different types of testing requirements, there is no need to disassemble and replace the testing components as a whole, making the operation process more convenient.

[0041] In the present invention, the driving mechanism 6 includes a mounting block 601, and the two ends of one side of the top of the bottom plate 1 are respectively fixedly connected with a mounting block 601, an operating table 602 is provided between the two mounting blocks 601, and the operating table 602 is slidably connected to the bottom plate 1, and a second motor 603 is provided on one side of one of the mounting blocks 601, and a first screw rod 604 is connected to the transmission end of the second motor 603, the first screw rod 604 rotates between the two mounting blocks 601, and the first screw rod 604 is threadedly connected to the inside of the operating table 602, and a telescopic protective cover 605 is respectively fixedly connected to the two sides of the operating table 602, and the other ends of the two telescopic protective covers 605 are respectively fixedly connected to the two mounting blocks 601, and The telescopic protective cover 605 surrounds the first screw rod 604; by setting the mounting block 601, the operating table 602, the second motor 603, the first screw rod 604 and the telescopic protective cover 605, when the wafer to be placed needs to be placed, the second motor 603 can be connected to the power supply, and the second motor 603 rotates to drive the first screw rod 604 to rotate. As the first screw rod 604 rotates, the operating table 602 will be driven to move back and forth on the base plate 1 continuously. The two mounting blocks 601 play a protective limit role for the operating table 602, and the telescopic protective cover 605 facilitates the protection of the first screw rod 604 until the operating table 602 is moved to the required suitable position, which is convenient for the subsequent placement of the wafer.

[0042] In the present invention, the placement mechanism 7 includes a support rod 701, a support rod 701 is provided on the operating table 602, a placement table 702 is fixedly connected to the support rod 701, the interior of the placement table 702 is rotatably connected to a first gear 704, a third motor 703 is provided inside the support rod 701, a transmission end of the third motor 703 is connected to the first gear 704, a plurality of second gears 705 are rotatably connected to the interior of the placement table 702, the first gear 704 is meshed with the plurality of second gears 705, a third gear 706 is fixedly connected to the second gear 705, and the third gear 706 is meshed with the first gear 704. The fourth gear 707 is fixedly connected with a second screw rod 708, and the second screw rod 708 is rotatably connected to the inside of the placement table 702. The placement table 702 is slidably connected with a plurality of moving blocks 709, and the plurality of second screw rods 708 are respectively threadedly connected to the inside of the plurality of moving blocks 709, and the moving blocks 709 are fixedly connected with a clamping block 710, the moving blocks 709 are in an arc shape, and the plurality of moving blocks 709 are distributed in a ring array, and the third gear 706 and the fourth gear 707 are both in the shape of bevel gears. By setting the support rod 701, the placement table 702, and the third motor 70 3. The first gear 704, the second gear 705, the third gear 706, the fourth gear 707, the second screw rod 708, the moving block 709 and the clamping block 710. In operation, according to the actual situation, the wafer bump can be directly placed on the placement table 702 on the support rod 701. Then, the third motor 703 is powered on, and the third motor 703 rotates to drive the first gear 704 to rotate. As the first gear 704 rotates, it will drive multiple second gears 705 to rotate together. Then, the multiple second gears 705 respectively drive the multiple third gears 706 to rotate, thereby driving multiple The fourth gear 707 rotates together, and then drives multiple second screw rods 708 to rotate together. As the second screw rods 708 rotate, they will drive the moving block 709 to move back and forth on the placement table 702, and then drive the clamping block 710 to move together. Through the synchronous displacement of multiple clamping blocks 710, the corresponding wafer can be conveniently clamped and limited at multiple angles, thereby ensuring a sufficient number of force points for the wafer bumps, and at the same time it is also convenient to control the clamping force of the wafer bumps, making the clamping of the wafer bumps more stable, avoiding the wafer bumps from loosening or even falling off during the detection process.

[0043] Embodiment 2:

[0044] Reference Figure 1-Figure 10 A tensile testing device for round wafer production includes a base plate 1, a device body 2 is provided on the base plate 1, and a base 3 is installed at the bottom of the base plate 1, a transmission mechanism 4 is provided on the device body 2, a testing mechanism 5 is provided on the transmission mechanism 4, a driving mechanism 6 is provided on the top of the base plate 1, a placing mechanism 7 is provided on the driving mechanism 6, and an adjusting mechanism 8 is provided on both the driving mechanism 6 and the placing mechanism 7.

[0045] The transmission mechanism 4 includes a first motor 401, which is installed inside the device body 2. A rotating block 402 is connected to the transmission end of the first motor 401. The rotating block 402 is slidably connected to the inside of the device body 2 through a limit block 403, and a connecting rod 404 is fixedly connected to the bottom of the rotating block 402. A mounting disk 405 is fixedly connected to the connecting rod 404. The mounting disk 405 is disc-shaped, and two auxiliary rods 406 are fixedly connected to the mounting disk 405. The auxiliary rods 406 are fixedly connected to the rotating block 402. By setting the first motor 401, in actual operation, the first motor 401 can be connected to the power supply, and the first motor 401 drives the rotating block 402 to rotate through the limit block 403, and the rotation of the rotating block 402 drives the connecting rod 404 to rotate, and the rotation of the connecting rod 404 drives the mounting disk 405 to rotate, thereby driving the corresponding test component to rotate and adjust.

[0046] The testing mechanism 5 includes a placement frame 501, and four placement frames 501 are fixedly connected to the bottom of the installation disk 405. Electric push rods 502 are arranged inside the placement frame 501, wherein the output ends of two electric push rods 502 are connected to pressure blocks 503, and the output ends of the other two electric push rods 502 are connected to hooks 504. By setting the placement frame 501, in actual operation, as the installation disk 405 rotates, the four placement frames 501 will be driven to rotate together, and then the electric push rods 502 and the corresponding pressure blocks 503 or hooks 504 inside will be driven to rotate together until the appropriate test component is rotated to the corresponding test position. Therefore, in actual operation, when a large amount of tedious detection work occurs, each detection component can be used in turn, so that mechanical fatigue is avoided and the corresponding detection error is reduced. At the same time, when there are different types of detection requirements, there is no need to disassemble and replace the detection component as a whole, which makes the operation process more convenient.

[0047] By setting the first motor 401, the rotating block 402, the limit block 403, the connecting rod 404, the installation disk 405, the placement frame 501, the electric push rod 502, the pressure block 503 and the hook 504, in actual operation, the first motor 401 can be connected to the power supply, and the first motor 401 drives the rotating block 402 to rotate through the limit block 403, and the rotation of the rotating block 402 drives the connecting rod 404 to rotate, and the rotation of the connecting rod 404 drives the installation disk 405 to rotate.

[0048] As the mounting plate 405 rotates, the four mounting frames 501 will be driven to rotate together, and then the electric push rod 502 and the corresponding pressure block 503 or hook 504 inside will be driven to rotate together, until the appropriate test component is rotated to the corresponding test position. In actual operation, when a large amount of tedious testing work occurs, the various testing components can be used in turn, thereby avoiding the occurrence of mechanical fatigue and reducing the corresponding testing errors. At the same time, when meeting different types of testing requirements, there is no need to disassemble and replace the testing components as a whole, making the operation process more convenient.

[0049] In the present invention, the driving mechanism 6 includes a mounting block 601, and the two ends of one side of the top of the bottom plate 1 are respectively fixedly connected with a mounting block 601, an operating table 602 is provided between the two mounting blocks 601, and the operating table 602 is slidably connected to the bottom plate 1, and a second motor 603 is provided on one side of one of the mounting blocks 601, and a first screw rod 604 is connected to the transmission end of the second motor 603, the first screw rod 604 rotates between the two mounting blocks 601, and the first screw rod 604 is threadedly connected to the inside of the operating table 602, and a telescopic protective cover 605 is respectively fixedly connected to the two sides of the operating table 602, and the other ends of the two telescopic protective covers 605 are respectively fixedly connected to the two mounting blocks 601, and The telescopic protective cover 605 surrounds the first screw rod 604; by setting the mounting block 601, the operating table 602, the second motor 603, the first screw rod 604 and the telescopic protective cover 605, when the wafer to be placed needs to be placed, the second motor 603 can be connected to the power supply, and the second motor 603 rotates to drive the first screw rod 604 to rotate. As the first screw rod 604 rotates, the operating table 602 will be driven to move back and forth on the base plate 1 continuously. The two mounting blocks 601 play a protective limit role for the operating table 602, and the telescopic protective cover 605 facilitates the protection of the first screw rod 604 until the operating table 602 is moved to the required suitable position, which is convenient for the subsequent placement of the wafer.

[0050] In the present invention, the placement mechanism 7 includes a support rod 701, a support rod 701 is provided on the operating table 602, a placement table 702 is fixedly connected to the support rod 701, the interior of the placement table 702 is rotatably connected to a first gear 704, a third motor 703 is provided inside the support rod 701, a transmission end of the third motor 703 is connected to the first gear 704, a plurality of second gears 705 are rotatably connected to the interior of the placement table 702, the first gear 704 is meshed with the plurality of second gears 705, a third gear 706 is fixedly connected to the second gear 705, and the third gear 706 is meshed with the first gear 704. The fourth gear 707 is fixedly connected with a second screw rod 708, and the second screw rod 708 is rotatably connected to the inside of the placement table 702. The placement table 702 is slidably connected with a plurality of moving blocks 709, and the plurality of second screw rods 708 are respectively threadedly connected to the inside of the plurality of moving blocks 709, and the moving blocks 709 are fixedly connected with a clamping block 710, the moving blocks 709 are in an arc shape, and the plurality of moving blocks 709 are distributed in a ring array, and the third gear 706 and the fourth gear 707 are both in the shape of bevel gears. By setting the support rod 701, the placement table 702, and the third motor 70 3. The first gear 704, the second gear 705, the third gear 706, the fourth gear 707, the second screw rod 708, the moving block 709 and the clamping block 710. In operation, according to the actual situation, the wafer bump can be directly placed on the placement table 702 on the support rod 701. Then, the third motor 703 is powered on, and the third motor 703 rotates to drive the first gear 704 to rotate. As the first gear 704 rotates, it will drive multiple second gears 705 to rotate together. Then, the multiple second gears 705 respectively drive the multiple third gears 706 to rotate, thereby driving multiple The fourth gear 707 rotates together, and then drives multiple second screw rods 708 to rotate together. As the second screw rods 708 rotate, they will drive the moving block 709 to move back and forth on the placement table 702, and then drive the clamping block 710 to move together. Through the synchronous displacement of multiple clamping blocks 710, the corresponding wafer can be conveniently clamped and limited at multiple angles, thereby ensuring a sufficient number of force points for the wafer bumps, and at the same time it is also convenient to control the clamping force of the wafer bumps, making the clamping of the wafer bumps more stable, avoiding the wafer bumps from loosening or even falling off during the detection process.

[0051] In the present invention, the adjustment mechanism 8 includes a fourth motor 801, a fourth motor 801 is provided on one side of the operating table 602, a rotating rod 802 is connected to the transmission end of the fourth motor 801, the rotating rod 802 passes through the support rod 701 and is rotatably connected to the inside of the operating table 602, the support rod 701 is fixedly connected to the rotating rod 802, a fixing block 803 is provided inside the operating table 602, an adjusting rope 804 is passed through the inside of the fixing block 803, and the adjusting rope 804 is fixedly connected to the bottom of the supporting rod 701; by arranging the fourth motor 801, the rotating rod 802, the fixing block 803 and the adjusting rope 804, further, in actual inspection During the test, according to actual needs, the fourth motor 801 can be connected to the power supply, and the fourth motor 801 rotates to drive the rotating rod 802 to rotate, and the rotating rod 802 rotates to drive the support rod 701 to rotate, and then drives the wafer bump placed on the support rod 701 to rotate together. The adjustment rope 804 on the fixed block 803 makes it more convenient to limit the adjustment of the support rod 701 until the support rod 701 and the wafer bump placed thereon are adjusted to a suitable placement angle, so that the corresponding wafer bump can be detected from multiple angles according to actual conditions, so that the test range is wider and the data is more accurate, thereby improving the actual test effect.

[0052] Working principle: In actual operation, when the wafer to be processed needs to be placed, the second motor 603 can be connected to the power supply, and the second motor 603 rotates to drive the first screw rod 604 to rotate. As the first screw rod 604 rotates, it will drive the operating table 602 to move back and forth on the base plate 1. The two mounting blocks 601 play a protective and limiting role for the operating table 602, and the telescopic protective cover 605 facilitates the protection of the first screw rod 604 until the operating table 602 is moved to the required appropriate position, which is convenient for the subsequent placement of the wafer.

[0053] Then, the wafer bump can be directly placed on the placement table 702 on the support rod 701, and then, the third motor 703 is powered on, so that the third motor 703 rotates to drive the first gear 704 to rotate. As the first gear 704 rotates, multiple second gears 705 will be driven to rotate together. Then, the multiple second gears 705 will respectively drive multiple third gears 706 to rotate, and then drive multiple fourth gears 707 to rotate together, and then drive multiple second screw rods 708 to rotate together. As the second screw rod 708 rotates, it will drive the moving block 709 to move back and forth on the placement table 702, and then drive the clamping block 710 to move together. Through the synchronous displacement of multiple clamping blocks 710, the corresponding wafer can be conveniently clamped and limited at multiple angles, thereby ensuring a sufficient number of force points for the wafer bump, and at the same time it is also convenient to control the clamping force of the wafer bump, so that the clamping of the wafer bump is more stable, avoiding the wafer bump from loosening or even falling during the detection process.

[0054] On the other hand, the first motor 401 can be powered on, and the first motor 401 drives the rotating block 402 to rotate through the limit block 403, and the rotation of the rotating block 402 drives the connecting rod 404 to rotate, and the rotation of the connecting rod 404 drives the installation plate 405 to rotate.

[0055] As the mounting plate 405 rotates, the four mounting frames 501 will be driven to rotate together, and then the electric push rod 502 and the corresponding pressure block 503 or hook 504 inside will be driven to rotate together, until the appropriate test component is rotated to the corresponding test position. In actual operation, when a large amount of tedious testing work occurs, the various testing components can be used in turn, thereby avoiding the occurrence of mechanical fatigue and reducing the corresponding testing errors. At the same time, when meeting different types of testing requirements, there is no need to disassemble and replace the testing components as a whole, making the operation process more convenient.

[0056] Furthermore, in actual testing, according to actual needs, the fourth motor 801 can be connected to a power source, and the rotation of the fourth motor 801 drives the rotating rod 802 to rotate, and the rotation of the rotating rod 802 drives the support rod 701 to rotate, thereby driving the wafer bump placed on the support rod 701 to rotate together, and the adjustment rope 804 on the fixed block 803 makes it more convenient to limit the adjustment of the support rod 701 until the support rod 701 and the wafer bump placed thereon are adjusted to a suitable placement angle, so that the corresponding wafer bump can be detected from multiple angles according to actual conditions, so that the test range is wider and the data is more accurate, thereby improving the actual test effect.

[0057] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A tensile testing device for wafer production, comprising a base plate (1), characterized in that: A device body (2) is provided on the bottom plate (1), and a base (3) is installed at the bottom of the bottom plate (1); a transmission mechanism (4) is provided on the device body (2), and a testing mechanism (5) is provided on the transmission mechanism (4); a driving mechanism (6) is provided on the top of the bottom plate (1), and a placement mechanism (7) is provided on the driving mechanism (6), and an adjustment mechanism (8) is provided on both the driving mechanism (6) and the placement mechanism (7); The transmission mechanism (4) comprises a first motor (401), the first motor (401) is installed inside the device body (2), a rotating block (402) is connected to the transmission end of the first motor (401), the rotating block (402) is slidably connected to the inside of the device body (2) through a limit block (403), and a connecting rod (404) is fixedly connected to the bottom of the rotating block (402), and a mounting plate (405) is fixedly connected to the connecting rod (404); The testing mechanism (5) comprises a placement frame (501), four placement frames (501) are fixedly connected to the bottom of the mounting plate (405), electric push rods (502) are arranged inside the placement frame (501), two of the electric push rods (502) are connected to pressure blocks (503) at their output ends, and the other two of the electric push rods (502) are connected to hooks (504) at their output ends.

2. The tensile testing device for wafer production according to claim 1, characterized in that: The mounting plate (405) is in the shape of a circular plate, and two auxiliary rods (406) are fixedly connected to the mounting plate (405), and the auxiliary rods (406) are fixedly connected to the rotating block (402).

3. The tensile testing device for wafer production according to claim 1, characterized in that: The driving mechanism (6) comprises a mounting block (601), and two ends of one side of the top of the base plate (1) are respectively fixedly connected to a mounting block (601), and an operating table (602) is provided between the two mounting blocks (601), and the operating table (602) is slidably connected to the base plate (1).

4. The tensile testing device for wafer production according to claim 3, characterized in that: A second motor (603) is provided on one side of one of the mounting blocks (601), a first screw rod (604) is connected to a transmission end of the second motor (603), the first screw rod (604) rotates between the two mounting blocks (601), and the first screw rod (604) is threadedly connected to the inside of the operating table (602).

5. The tensile testing device for wafer production according to claim 4, characterized in that: A telescopic protective sleeve (605) is fixedly connected to each of the two sides of the operating table (602), and the other ends of the two telescopic protective sleeves (605) are fixedly connected to the two mounting blocks (601), respectively, and the telescopic protective sleeves (605) surround the first screw rod (604).

6. The tensile testing device for wafer production according to claim 5, characterized in that: The placement mechanism (7) comprises a support rod (701), the support rod (701) is provided on the operating table (602), the support rod (701) is fixedly connected to the placement table (702), the interior of the placement table (702) is rotatably connected to a first gear (704), the interior of the support rod (701) is provided with a third motor (703), and the transmission end of the third motor (703) is connected to the first gear (704).

7. The tensile testing device for wafer production according to claim 6, characterized in that: The placing platform (702) is rotatably connected to a plurality of second gears (705) inside, the first gear (704) is meshed with the plurality of second gears (705), the second gear (705) is fixedly connected to a third gear (706), the third gear (706) is meshed with a fourth gear (707), the fourth gear (707) is fixedly connected to a second screw rod (708), the second screw rod (708) is rotatably connected to the inside of the placing platform (702), the placing platform (702) is slidably connected to a plurality of moving blocks (709), the plurality of second screw rods (708) are respectively threadedly connected to the inside of the plurality of moving blocks (709), and the moving blocks (709) are fixedly connected to a clamping block (710).

8. The tensile testing device for wafer production according to claim 7, characterized in that: The moving block (709) is in an arc shape, a plurality of the moving blocks (709) are distributed in a ring array, and the third gear (706) and the fourth gear (707) are both in the shape of bevel gears.

9. The tensile testing device for wafer production according to claim 3, characterized in that: The adjusting mechanism (8) comprises a fourth motor (801), and the fourth motor (801) is provided on one side of the operating platform (602). A rotating rod (802) is connected to the transmission end of the fourth motor (801), and the rotating rod (802) passes through the support rod (701) and is rotatably connected to the inside of the operating platform (602). The support rod (701) is fixedly connected to the rotating rod (802).

10. The tensile testing device for wafer production according to claim 9, characterized in that: A fixing block (803) is provided inside the operating table (602), an adjusting rope (804) runs through the inside of the fixing block (803), and the adjusting rope (804) is fixedly connected to the bottom of the supporting rod (701).

Images