A thermal shock test device and method for automotive electronic components

Abstract

The invention discloses a hot and cold shock test device and method for automotive electronic components, belonging to the technical field of hot and cold shock test equipment. The hot and cold shock test device for automotive electronic components comprises a test box, wherein a mounting column is rotatably provided inside the test box, six partitions are evenly distributed circumferentially on the mounting column, one end of the partition away from the mounting column is in active contact with the inner wall of the test box, and the six partitions divide the internal space of the test box into a thermal shock test area, a buffer zone one, a buffer zone two, a cold shock test area, a buffer zone three and a buffer zone four. A thermal shock assembly is provided on the test box, a cold shock assembly is provided on the test box, an intermittent rotating assembly connected to the mounting column is provided at the bottom of the test box, a placement assembly is provided between two adjacent partitions, and a clamping assembly for fixing the electronic component body is provided on the placement assembly. The test box has the advantages of effective placement, stable clamping, rapid hot and cold shock cycle testing, stable structure and convenient operation.

Description

Technical Field

[0001] The invention relates to the technical field of thermal shock test equipment, and in particular to a thermal shock test device and method for automotive electronic components. Background Art

[0002] The main purpose of thermal shock test is to evaluate the product's tolerance to rapid temperature changes. By simulating the rapid conversion process between high and low temperatures, the structural integrity and performance stability of the product under extreme environmental conditions are tested. This test plays an important role in the identification test of equipment design finalization and routine tests in the batch production stage, and is sometimes also used for environmental stress screening tests. During the use of automotive electronic components, some extreme environmental problems are often encountered. In order to determine their normal working performance, thermal shock tests are often required during the production process of automotive electronic components.

[0003] In the process of performing a thermal shock test on electronic components, the existing thermal shock test device for automotive electronic components generally sets a thermal shock test chamber and a cold shock test chamber. The electronic components are subjected to a thermal shock test in the thermal shock test chamber. After the thermal shock test, the staff manually transfers the electronic components to the cold shock test chamber and performs a cold shock test. After the cold shock test, the staff manually transfers the electronic components to the thermal shock test chamber and performs a thermal shock test. In this way, multiple thermal shock cycle tests are performed to improve the test accuracy.

[0004] However, this testing method requires manual transfer by staff. When multiple hot and cold shock cycle tests are required, staff are required to transfer multiple times. The operation steps are cumbersome, which increases the workload of staff. Moreover, manual transfer by staff may pose safety risks. During the transfer of electronic components, they may be collided or scratched by external factors, affecting the test accuracy. Moreover, each time the thermal shock test chamber or the cold shock test chamber is opened, it will cause heat or cold air loss, increasing energy consumption.

[0005] Therefore, it is necessary to provide a thermal shock test device and method for automotive electronic components to solve the above problems. Summary of the invention

[0006] In view of the shortcomings of the prior art, an object of the embodiments of the present invention is to provide a thermal shock test device and method for automotive electronic components to solve the problems in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A hot and cold shock test device for automotive electronic components, comprising a test box, wherein pillars are symmetrically arranged at the bottom of the test box, a mounting column is rotatably arranged inside the test box, six partitions are evenly distributed circumferentially on the mounting column, one end of the partition away from the mounting column is in active contact with the inner wall of the test box, and the six partitions divide the internal space of the test box into a thermal shock test area, a buffer zone 1, a buffer zone 2, a cold shock test area, a buffer zone 3 and a buffer zone 4 in sequence, wherein the buffer zone 1 and the buffer zone 4 are respectively located on both sides of the thermal shock test area, the buffer zone 2 and the buffer zone 3 are respectively located on both sides of the cold shock test area, the thermal shock test area and the cold shock test area are respectively located at both ends of the test box, the buffer zone 1 and the buffer zone 4 are connected by a three-phase air duct, and the buffer zone 2 and the buffer zone 3 are connected by a four-phase air duct;

[0009] The experimental box is provided with a thermal shock component corresponding to the thermal shock test area, the experimental box is provided with a cold shock component corresponding to the cold shock test area, the experimental box is hinged with a flip cover, the bottom of the experimental box is provided with an intermittent rotating component connected to the mounting column, a placement component is provided between two adjacent partitions, and the placement component is provided with a clamping component for fixing the electronic component body.

[0010] As a further solution of the present invention, the intermittent rotating component includes an intermittent turntable rotatably arranged at the bottom of the experimental box, the intermittent turntable is connected to the mounting column, a plurality of arc grooves are circumferentially distributed on the intermittent turntable, a slide groove is provided between two adjacent arc grooves, a bracket is installed on the pillar, a motor is provided on the bracket, the output end of the motor is connected to a residual circular disc that slides with the arc groove, a horizontal plate is installed on the residual circular disc, and the outer end of the horizontal plate is connected to a sliding column that movably cooperates with the slide groove.

[0011] As a further solution of the present invention, the thermal shock assembly includes an installation frame 1 arranged on the top of the test box, the installation frame 1 corresponds to the thermal shock test area, an electric heating tube is installed in the installation frame 1, a fan 1 is installed on the outside of the installation frame 1, an air guide pipe 1 is connected to the fan 1, one end of the air guide pipe 1 is connected to the interior of the installation frame 1 and is located on the side of the electric heating tube away from the thermal shock test area, the other end of the air guide pipe 1 is connected to the interior of the test box and is located below the thermal shock test area, and an air intake pipe is connected to the end of the air guide pipe close to the test box, and a valve is provided on the air intake pipe.

[0012] As a further solution of the present invention, the cold shock component includes an installation frame 2 arranged on the top of the test box, the installation frame 2 is located at one end of the test box away from the heat shock component, a cooling box is installed on the outer wall of the test box, a refrigerator is provided in the cooling box, the bottom of the cooling box is connected to the bottom of the cold shock test area through a return air pipe, the top of the cooling box is connected to the inside of the installation frame 2 through an air duct 2, a fan 2 connected to the air duct 2 is installed on the outer wall of the installation frame 2, and the air duct 2 is located above the cold shock test area and has a plurality of air outlets facing downward.

[0013] As a further solution of the present invention, the placement component includes side grooves symmetrically arranged on both sides of the partition, vertical columns are arranged at the side grooves, and a placement net disk slidably cooperated with the columns is movably provided between adjacent partitions, and a spring 1 mounted on the outside of the column is connected between the side grooves and the placement net disk.

[0014] As a further scheme of the present invention, the clamping assembly includes electric push rods respectively arranged at two ends of the network disk, and the ends of the electric push rods close to each other are connected with clamping plates for clamping the electronic component body, and the sides of the clamping plates close to each other are symmetrically provided with wedge blocks, and the two ends of the clamping plates are symmetrically and movably provided with sliding rods, one end of the sliding rod is connected with a sliding plate that slides with the clamping plate, and the other end of the sliding rod is connected with a clamping plate movably arranged on the outside of the clamping plate, and two springs sleeved on the outside of the sliding rod are connected between the sliding plate and the clamping plate, and two sliding grooves are symmetrically provided on the side of the clamping plate away from the wedge block, and a lever connected to the corresponding sliding plate is slidably provided in the two sliding grooves.

[0015] As a further solution of the present invention, a controller is provided on the outside of the experimental box, and the controller is electrically connected to the electrical equipment in the device. A laser temperature measurement sensor electrically connected to the controller is provided on the side wall of the partition.

[0016] As a further solution of the present invention, six arc grooves and six slide grooves are provided.

[0017] As a further solution of the present invention, a plurality of arc-shaped through grooves are provided on the placement mesh plate.

[0018] A method for thermal shock testing of automotive electronic components, applicable to the thermal shock testing device for automotive electronic components described above, comprises the following steps:

[0019] S1. Open the flip cover, place the first electronic component body on the placement assembly corresponding to the flip cover, the corresponding clamping assembly locates the position of the first electronic component body, and the intermittent rotating assembly drives the placement assembly and the clamping assembly to rotate synchronously by driving the mounting column to rotate intermittently, so that the first electronic component body moves to the end of the experimental box away from the flip cover;

[0020] S2, placing the second electronic component body on the placement assembly corresponding to the flip cover at this time, positioning the second electronic component body through the corresponding clamping assembly, driving the intermittent rotation assembly to drive the first electronic component body and the second electronic component body to rotate synchronously by driving the installation column to rotate intermittently and the placement assembly and the clamping assembly to cooperate, so that the first electronic component body corresponds to the thermal shock test area, and the second electronic component body corresponds to the cold shock test area, controlling the thermal shock assembly and the cold shock assembly to work, the thermal shock assembly performs a thermal shock test on the first electronic component body, and the cold shock assembly performs a cold shock test on the second electronic component body;

[0021] S3. After a thermal shock test of the first electronic component body and a cold shock test of the second electronic component body are completed, the intermittent rotating assembly drives the first electronic component body and the second electronic component body to rotate by driving the installation column to rotate intermittently and the placement assembly and the clamping assembly cooperate to make the first electronic component body correspond to the cold shock test area and the second electronic component body correspond to the thermal shock test area, and the thermal shock assembly and the cold shock assembly are controlled to work, the thermal shock assembly performs a thermal shock test on the second electronic component body, and the cold shock assembly performs a cold shock test on the first electronic component body;

[0022] S4. According to the number of thermal shock tests required, the positions of the first electronic component body and the second electronic component body are continuously replaced by controlling the intermittent rotating assembly to perform thermal shock alternating cycle tests on the electronic component bodies.

[0023] In summary, compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0024] 1. In the present invention, by setting the spring 1, the height of the net disk can be elastically supported, the space above the net disk can be automatically adjusted, and the placement of electronic component bodies of different specifications and weights can be satisfied. By means of the clamping assembly, electronic component bodies of different shapes can be stably clamped. By means of the thermal shock assembly, the electronic component body can be subjected to a thermal shock test. By means of the cold shock assembly, the electronic component body can be subjected to a cold shock test, thereby performing a hot and cold shock test operation on the electronic component body;

[0025] 2. In the present invention, the controller controls the start of the intermittent rotating assembly to adjust the electronic component body to the corresponding thermal shock test area or cold shock test area, and the corresponding thermal shock assembly or cold shock assembly performs a sufficient thermal shock or cold shock test on the electronic component body. When the corresponding thermal shock or cold shock test is completed, the controller controls the start of the intermittent rotating assembly to adjust the electronic component body that has completed the thermal shock test or cold shock test to the cold shock test area or thermal shock test area, and performs a corresponding shock test on the corresponding electronic component body, thereby simply and quickly realizing the thermal and cold shock cycle test of the electronic component body, and accurately controlling the rotation angle of the electronic component body, avoiding the low efficiency of the existing staff manually transferring the electronic component body, and reducing safety risks;

[0026] 3. In the present invention, during the rotation of the electronic component body, when the electronic component body is transferred from the thermal shock test area to the buffer zone one, the corresponding partition will push a part of the heat in the thermal shock test area to the buffer zone one, and the heat located in the buffer zone one will be moved to the buffer zone four through the air duct three, thereby preheating the space corresponding to the buffer zone; when the electronic component body is transferred from the cold shock test area to the buffer zone three, the corresponding partition will push a part of the cold air in the cold shock test area to the buffer zone three, and the cold air located in the buffer zone three will be moved to the buffer zone two through the air duct four, thereby precooling the space corresponding to the buffer zone, which can effectively reduce energy loss, pre-treat the electronic component body rotated to the corresponding buffer zone, and accelerate the hot and cold shock test speed of the electronic component body.

[0027] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional diagram of a thermal shock test device for automotive electronic components in an embodiment of the invention.

[0029] Figure 2 It is a bottom view of the thermal shock test device for automotive electronic components in an embodiment of the invention.

[0030] Figure 3 for Figure 1 A partial enlarged view of point A in the middle.

[0031] Figure 4 for Figure 1 A partial enlarged view of point B in the middle.

[0032] Figure 5 It is a cross-sectional view of a thermal shock test device for automotive electronic components in an embodiment of the invention.

[0033] Figure 6 It is a top cross-sectional view of the experimental box in the embodiment of the invention.

[0034] Figure 7 It is a schematic diagram of the coordination of the placing component and the clamping component in the embodiment of the invention.

[0035] Figure 8 It is a schematic diagram of the structure of the clamping assembly in an embodiment of the invention.

[0036] Fig. 9 It is a cross-sectional view of a clamping assembly in an embodiment of the invention.

[0037] Fig.10 It is a schematic structural diagram of the intermittent rotating component in an embodiment of the invention.

[0038] Figure numerals: 1, experimental box; 11, flip cover; 12, support; 13, controller; 2, intermittent rotating assembly; 21, motor; 22, bracket; 23, residual disc; 24, horizontal plate; 25, sliding column; 26, intermittent rotating disk; 261, arc groove; 262, sliding groove one; 3, thermal shock assembly; 31, mounting frame one; 32, air guide pipe one; 33, fan one; 34, air intake pipe; 35, valve; 36, electric heating pipe; 4, cold shock assembly; 41, mounting frame two; 42, air guide pipe two; 43, fan two; 44. Cooling box; 45. Return air duct; 46. Refrigerator; 47. Air outlet; 5. Mounting column; 51. Partition; 6. Placement component; 61. Side groove; 62. Vertical column; 63. Spring one; 64. Placement network disk; 7. Clamping component; 71. Electric push rod; 72. Clamping plate; 721. Slide groove two; 73. Clamping plate; 74. Slide rod; 75. Slide plate; 76. Spring two; 77. Lever; 78. Wedge block; 8. Air duct three; 9. Air duct four; 10. Laser temperature sensor; 20. Electronic component body. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0041] In one embodiment of the present invention, see Figure 1-Figure 6A thermal shock test device for automotive electronic components comprises a test box 1, wherein pillars 12 are symmetrically arranged at the bottom of the test box 1, a mounting column 5 is rotatably arranged inside the test box 1, and six partitions 51 are evenly distributed circumferentially on the mounting column 5, and one end of the partition 51 away from the mounting column 5 is in active contact with the inner wall of the test box 1, and the six partitions 51 divide the internal space of the test box 1 into a thermal shock test area, a buffer zone 1, a buffer zone 2, a cold shock test area, a buffer zone 3 and a buffer zone 4 in sequence, wherein the buffer zone 1 and the buffer zone 4 are respectively located on both sides of the thermal shock test area, the buffer zone 2 and the buffer zone 3 are respectively located on both sides of the cold shock test area, and the thermal shock The thermal shock test area and the cold shock test area are respectively located at the two ends of the test box 1, and the test box 1 is provided with a thermal shock component 3 corresponding to the thermal shock test area, and the test box 1 is provided with a cold shock component 4 corresponding to the cold shock test area. The test box 1 is hinged with a flip cover 11, and the bottom of the test box 1 is provided with an intermittent rotating component 2 connected to the mounting column 5, and a placement component 6 is provided between two adjacent partitions 51, and a clamping component 7 for fixing the electronic component body 20 is provided on the placement component 6, and the buffer zone 1 and the buffer zone 4 are connected by an air duct 3 8, and the buffer zone 2 and the buffer zone 3 are connected by an air duct 4 9.

[0042] In this embodiment, the flip cover 11 is opened, and the staff places the first electronic component body 20 on the placement component 6 corresponding to the flip cover 11 at this time, and the position of the first electronic component body 20 is positioned by the corresponding clamping component 7. The intermittent rotating component 2 drives the placement component 6 and the clamping component 7 to rotate synchronously by driving the mounting column 5 to rotate intermittently, so that the first electronic component body 20 moves to the end of the experimental box 1 away from the flip cover 11, and the second electronic component body 20 is placed on the placement component 6 corresponding to the flip cover 11 at this time, and the second electronic component body 20 is positioned by the corresponding clamping component 7. 0, the intermittent rotating assembly 2 drives the installation column 5 to rotate intermittently, and the placement assembly 6 and the clamping assembly 7 cooperate to drive the first electronic component body 20 and the second electronic component body 20 to rotate synchronously, so that the first electronic component body 20 corresponds to the thermal shock test area, and the second electronic component body 20 corresponds to the cold shock test area. The thermal shock test can be performed on the first electronic component body 20 through the thermal shock assembly 3, and the cold shock test can be performed on the second electronic component body 20 through the cold shock assembly 4. After the first electronic component body 20 is subjected to a thermal shock test and the second electronic component body 20 is subjected to a cold shock test, After a cold shock test of the two electronic component bodies 20 is completed, the intermittent rotating component 2 drives the first electronic component body 20 and the second electronic component body 20 to rotate by driving the installation column 5 to rotate intermittently and the placement component 6 and the clamping component 7 cooperate to make the first electronic component body 20 correspond to the cold shock test area, and the second electronic component body 20 corresponds to the thermal shock test area. The thermal shock test can be performed on the second electronic component body 20 through the thermal shock component 3, and the cold shock test can be performed on the first electronic component body 20 through the cold shock component 4. A heat and cold shock cycle test of the first electronic component body 20 and the second electronic component body 20 can be performed. The positions of the first electronic component body 20 and the second electronic component body 20 can be replaced again by the intermittent rotating assembly 2, and the two electronic component bodies 20 can be subjected to multiple heat and cold shock rapid cycle tests, thereby avoiding the tedious operation of manual transfer and improving the work efficiency of the heat and cold shock test. At the same time, during the transfer process of the electronic component body 20, the risk of the electronic component body 20 being affected by external factors during the transfer process is effectively reduced through the effective protection of the experimental box 1 and the stable clamping of the clamping assembly 7, thereby improving the test accuracy.

[0043] During the rotation of the electronic component body 20, when the electronic component body 20 is transferred from the thermal shock test area to the buffer zone one, the corresponding partition 51 will move part of the heat in the thermal shock test area to the buffer zone one, and the heat in the buffer zone one will be moved to the buffer zone four through the air guide pipe three 8, thereby preheating the space corresponding to the buffer zone; when the electronic component body 20 is transferred from the cold shock test area to the buffer zone three, the corresponding partition 51 will move part of the cold air in the cold shock test area to the buffer zone three, and the cold air in the buffer zone three will be moved to the buffer zone two through the air guide pipe four 9, thereby precooling the space corresponding to the buffer zone, which can effectively reduce energy loss, pre-treat the electronic component body 20 rotated to the corresponding buffer zone, and accelerate the cold and hot shock test speed of the electronic component body 20;

[0044] Among them, a controller 13 is arranged on the outside of the experimental box 1, and the controller 13 is electrically connected to the electrical equipment in the device. The staff controls the start and stop of the electrical equipment in the device by operating the controller 13. A laser temperature sensor 10 electrically connected to the controller 13 is arranged on the side wall of the partition 51. The surface temperature of the electronic component body 20 can be detected by the laser temperature sensor 10. The laser temperature sensor 10 transmits the detected temperature data to the controller 13 and displays it in real time through the controller 13, so that the staff can observe it in real time.

[0045] In one embodiment of the present invention, see Figure 1-Figure 2 and Fig.10 The intermittent rotating component 2 includes an intermittent turntable 26 rotatably arranged at the bottom of the experimental box 1, and the intermittent turntable 26 is connected to the mounting column 5. A plurality of arc grooves 261 are distributed circumferentially on the intermittent turntable 26, and a slide groove 262 is provided between two adjacent arc grooves 261. A bracket 22 is installed on the pillar 12, and a motor 21 is provided on the bracket 22. The output end of the motor 21 is connected to a residual circular disc 23 that slides with the arc groove 261, and a horizontal plate 24 is installed on the residual circular disc 23. The outer end of the horizontal plate 24 is connected to a sliding column 25 that movably cooperates with the slide groove 262.

[0046] In this embodiment, in the initial state, the residual disc 23 slides with the arc groove 261, the slide post 25 is away from the slide groove 262, the motor 21 drives the residual disc 23 to rotate, and the residual disc 23 drives the slide post 25 to rotate synchronously by connecting with the cross plate 24. When the slide post 25 is movably matched with the slide groove 262, the slide post 25 drives the intermittent turntable 26 to rotate by movably contacting with the slide groove 262. The intermittent turntable 26 drives the partition 51 to rotate synchronously through the mounting column 5. The partition 51 is movably connected with the placement component 6 and The clamping assembly 7 cooperates with the electronic component body 20 to drive the electronic component body 20 to rotate synchronously, so that the rotation of the electronic component body 20 can be realized. When the slide column 25 continues to rotate, when the cooperation between the slide column 25 and the slide groove 262 is released, the residual disc 23 and the arc groove 261 slide and cooperate, so that the angle of the intermittent rotating disk 26 can be limited, thereby limiting the position of the mounting column 5, thereby realizing the intermittent rotation of the electronic component body 20, and the rotation angle of the electronic component body 20 can be accurately controlled;

[0047] First, the staff controls the start of the motor 21 through the controller 13 to adjust the electronic component body 20 to the corresponding thermal shock test area or cold shock test area. Then, the staff controls the stop of the motor 21 through the controller 13 to facilitate a full thermal shock or cold shock test on the electronic component body 20. When the corresponding thermal shock or cold shock test is completed, the staff controls the start of the motor 21 through the controller 13 to adjust the electronic component body 20 that has completed the thermal shock test or cold shock test to the cold shock test area or thermal shock test area, and performs a corresponding shock test on the corresponding electronic component body 20, thereby simply realizing the thermal and cold shock cycle test of the electronic component body 20, avoiding the inefficiency and safety risks of manual transfer by the staff;

[0048] There are six arc grooves 261 and six slide grooves 262, which correspond to the thermal shock test area, buffer zone 1, buffer zone 2, cold shock test area, buffer zone 3 and buffer zone 4 respectively.

[0049] In one embodiment of the present invention, see Figure 1-Figure 3 , Figure 5 and Figure 6The thermal shock assembly 3 includes a mounting frame 31 arranged on the top of the test box 1, the mounting frame 31 corresponds to the thermal shock test area, an electric heating pipe 36 is installed in the mounting frame 31, a fan 33 is installed on the outside of the mounting frame 31, an air duct 32 is connected to the fan 33, one end of the air duct 32 is connected to the interior of the mounting frame 31 and is located on the side of the electric heating pipe 36 away from the thermal shock test area, the other end of the air duct 32 is connected to the interior of the test box 1 and is located below the thermal shock test area, an air intake pipe 34 is connected to the end of the air duct 32 close to the test box 1, and a valve 35 is provided on the air intake pipe 34.

[0050] In this embodiment, when the electronic component body 20 moves to the thermal shock test area, the electric heating tube 36 is powered on and emits heat. The staff controls the fan 33 to work through the controller 13. The fan 33 draws the air below the thermal shock test area to the top of the electric heating tube 36 through the air guide tube 32. The air above the electric heating tube 36 blows the heat generated by the electric heating tube 36 after the electric heating tube 36 is powered on to the electronic component body 20, which can perform a rapid thermal shock treatment on the electronic component body 20, reducing the heat loss during the air flow process inside the thermal shock test area. At the same time, the circulation of heat can evenly thermally shock the surface of the electronic component body 20, avoiding the problem of uneven heating on the surface of the electronic component body 20. The surface temperature of the corresponding electronic component body 20 can be detected by the laser temperature sensor 10, which is convenient for the staff to understand the temperature of the thermal shock test area in real time.

[0051] When the device needs to be cooled, the electric heating tube 36 is stopped, the valve 35 is opened, and the fan 33 draws external air into the thermal shock test area through the cooperation of the air guide pipe 32 and the air inlet pipe 34, so that the thermal shock test area can be effectively cooled.

[0052] In one embodiment of the present invention, see Figure 1-Figure 2 , Figure 4-Figure 6 The cold shock component 4 includes an installation frame 41 arranged on the top of the test box 1, and the installation frame 41 is located at one end of the test box 1 away from the thermal shock component 3. A cooling box 44 is installed on the outer wall of the test box 1, and a refrigerator 46 is arranged in the cooling box 44. The bottom of the cooling box 44 is connected to the bottom of the cold shock test area through a return air pipe 45, and the top of the cooling box 44 is connected to the inside of the installation frame 41 through an air guide pipe 42. A fan 43 connected to the air guide pipe 42 is installed on the outer wall of the installation frame 41. The air guide pipe 42 is located above the cold shock test area and has a plurality of air outlets 47 facing downward.

[0053] In this embodiment, the refrigerator 46 works and cools the air inside the cooling box 44. The fan 43 draws the cold air inside the cooling box 44 through the air duct 42 and blows it toward the electronic component body 20 located in the cold shock test area through the air outlet 47. The air pressure inside the cold shock test area increases, and the internal gas flows back to the cooling box 44 through the return air pipe 45. The refrigerator 46 cools the returned air, which is convenient for continuous cold shock to the electronic component body 20. The setting of the air outlet 47 facilitates uniform cold shock treatment on the surface of the electronic component body 20.

[0054] In one embodiment of the present invention, see Figure 5 , Figure 7-Figure 8 The placement component 6 includes side grooves 61 symmetrically arranged on both sides of the partition 51, and a vertical column 62 is arranged at the side groove 61. A placement net plate 64 that slides with the column 62 is movably arranged between adjacent partitions 51, and a spring 63 that is sleeved on the outside of the column 62 is connected between the side groove 61 and the placement net plate 64.

[0055] In this embodiment, the net tray 64 is provided as a fan-shaped slot box. The height of the net tray 64 can be elastically supported by the arrangement of a spring 63, and the space above the net tray 64 can be automatically adjusted to meet the placement of electronic component bodies 20 of different specifications and weights, thereby improving the applicability of the device.

[0056] The mesh tray 64 is provided with a plurality of arc-shaped through slots, through which the air above and below the mesh tray 64 can be easily circulated, so as to facilitate the hot and cold shock test of the electronic component body 20 .

[0057] In one embodiment of the present invention, see Figure 5 , Figure 7-Figure 9 The clamping assembly 7 includes electric push rods 71 ​​respectively arranged at the two ends of the net disk 64, and the ends of the electric push rods 71 ​​close to each other are connected with clamping plates 72 for clamping the electronic component body 20, and the sides of the clamping plates 72 close to each other are symmetrically provided with wedge blocks 78, and the two ends of the clamping plates 72 are symmetrically and movably provided with sliding rods 74, one end of the sliding rod 74 is connected with a sliding plate 75 that slides with the clamping plate 72, and the other end of the sliding rod 74 is connected with a clamping plate 73 movably arranged on the outside of the clamping plate 72, and a spring 2 76 that is sleeved on the outside of the sliding rod 74 is connected between the sliding plate 75 and the clamping plate 72, and a sliding groove 2 721 is symmetrically provided on the side of the clamping plate 72 away from the wedge block 78, and a lever 77 connected to the corresponding sliding plate 75 is slidably provided in the sliding groove 2 721.

[0058] In this embodiment, in the initial state, the second spring 76 is at its original length, the clamping plate 73 is close to the end of the clamping plate 72, and pushes the lever 77 outward. The lever 77 pushes the slide bar 74 outward by sliding with the second slide groove 721 and the slide plate 75 and the clamping plate 72. The second spring 76 is stressed and contracts. The slide bar 74 expands the distance between the symmetrically arranged clamping plates 73 by driving the clamping plates 73 to move synchronously, placing the electronic component body 20 between the two clamping plates 72 so that the electronic component body 20 is located Inside the space surrounded by the four clamping plates 73, the lever 77 is released to release the squeezing of the second spring 76, the second spring 76 stretches and pushes the two slide plates 75 to approach each other, the slide plates 75 are connected to the clamping plates 73 by the slide rod 74, and the clamping plates 73 at both ends are driven to approach each other, so that the two ends of the electronic component body 20 can be clamped, and the electric push rod 71 stretches and pushes the clamping plate 72 to approach the side wall of the electronic component body 20, so as to fix the four sides of the electronic component body 20 and improve the stability of the positioning of the electronic component body 20;

[0059] Among them, the symmetrically arranged wedge blocks 78 can meet the clamping and positioning processing of the cylindrical or disc-shaped electronic component body 20, thereby meeting the positioning requirements of electronic component bodies 20 of different specifications and improving the applicability of the device.

[0060] In one embodiment of the present invention, see Figure 1-Figure 10 A method for thermal shock test of automotive electronic components is applicable to the thermal shock test device of automotive electronic components, and the method comprises the following steps:

[0061] Step S1, open the flip cover 11, place the first electronic component body 20 on the placement assembly 6 corresponding to the flip cover 11 at this time, the corresponding clamping assembly 7 locates the position of the first electronic component body 20, and the intermittent rotating assembly 2 drives the placement assembly 6 and the clamping assembly 7 to rotate synchronously by driving the mounting column 5 to rotate intermittently, so that the first electronic component body 20 moves to the end of the experimental box 1 away from the flip cover 11;

[0062] Step S2, placing the second electronic component body 20 on the placement component 6 corresponding to the flip cover 11 at this time, positioning the second electronic component body 20 by the corresponding clamping component 7, the intermittent rotating component 2 drives the first electronic component body 20 and the second electronic component body 20 to rotate synchronously by driving the installation column 5 to rotate intermittently and the placement component 6 and the clamping component 7 cooperate, so that the first electronic component body 20 corresponds to the thermal shock test area, and the second electronic component body 20 corresponds to the cold shock test area, and the thermal shock component 3 and the cold shock component 4 are controlled to work, the thermal shock component 3 performs a thermal shock test on the first electronic component body 20, and the cold shock component 4 performs a cold shock test on the second electronic component body 20;

[0063] Step S3, after a thermal shock test of the first electronic component body 20 and a cold shock test of the second electronic component body 20 are completed, the intermittent rotating assembly 2 drives the first electronic component body 20 and the second electronic component body 20 to rotate by driving the mounting column 5 to rotate intermittently and the placement assembly 6 and the clamping assembly 7 cooperate to make the first electronic component body 20 correspond to the cold shock test area and the second electronic component body 20 correspond to the thermal shock test area, and the thermal shock assembly 3 and the cold shock assembly 4 are controlled to work, the thermal shock assembly 3 performs a thermal shock test on the second electronic component body 20, and the cold shock assembly 4 performs a cold shock test on the first electronic component body 20;

[0064] Step S4 , according to the number of thermal shock tests required, the positions of the first electronic component body 20 and the second electronic component body 20 are continuously changed by controlling the intermittent rotating assembly 2 to perform thermal shock alternating cycle tests on the electronic component body 20 .

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal shock test device for automotive electronic components, comprising a test box (1), characterized in that: The bottom of the test box (1) is symmetrically provided with pillars (12), and a mounting column (5) is rotatably provided inside the test box (1). Six partitions (51) are evenly distributed circumferentially on the mounting column (5), and one end of the partition (51) away from the mounting column (5) is in active contact with the inner wall of the test box (1). The six partitions (51) divide the internal space of the test box (1) into a thermal shock test area, a buffer zone 1, a buffer zone 2, a cold shock test area, a buffer zone 3, and a buffer zone 4 in sequence. The buffer zone 1 and the buffer zone 4 are respectively located on both sides of the thermal shock test area, the buffer zone 2 and the buffer zone 3 are respectively located on both sides of the cold shock test area, and the thermal shock test area and the cold shock test area are respectively located at both ends of the test box (1). The buffer zone 1 and the buffer zone 4 are connected via an air guide tube 3 (8), and the buffer zone 2 and the buffer zone 3 are connected via an air guide tube 4 (9); The test box (1) is provided with a thermal shock component (3) corresponding to the thermal shock test area, the test box (1) is provided with a cold shock component (4) corresponding to the cold shock test area, the test box (1) is hinged with a flip cover (11), the bottom of the test box (1) is provided with an intermittent rotating component (2) connected to the mounting column (5), a placement component (6) is provided between two adjacent partitions (51), and the placement component (6) is provided with a clamping component (7) for fixing the electronic component body (20); The intermittent rotating assembly (2) comprises an intermittent turntable (26) rotatably arranged at the bottom of the experimental box (1), the intermittent turntable (26) being connected to the mounting column (5), a plurality of arc grooves (261) being distributed circumferentially on the intermittent turntable (26), a slide groove (262) being provided between two adjacent arc grooves (261), a bracket (22) being installed on the pillar (12), a motor (21) being provided on the bracket (22), an output end of the motor (21) being connected to a residual circular disc (23) slidably engaged with the arc groove (261), a transverse plate (24) being installed on the residual circular disc (23), and an outer end of the transverse plate (24) being connected to a slide column (25) movably engaged with the slide groove (262).

2. The thermal shock test device for automotive electronic components according to claim 1, characterized in that: The thermal shock assembly (3) comprises an installation frame (31) arranged on the top of the test box (1), the installation frame (31) corresponding to the thermal shock test area, an electric heating pipe (36) installed in the installation frame (31), a fan (33) installed outside the installation frame (31), an air guide pipe (32) connected to the fan (33), one end of the air guide pipe (32) communicating with the interior of the installation frame (31) and located on a side of the electric heating pipe (36) away from the thermal shock test area, the other end of the air guide pipe (32) communicating with the interior of the test box (1) and located below the thermal shock test area, an air intake pipe (34) connected to the end of the air guide pipe (32) close to the test box (1), and a valve (35) provided on the air intake pipe (34).

3. The thermal shock test device for automotive electronic components according to claim 1, characterized in that: The cold shock component (4) comprises a second installation frame (41) arranged on the top of the test box (1), the second installation frame (41) is located at one end of the test box (1) away from the heat shock component (3), a cooling box (44) is installed on the outer wall of the test box (1), a refrigerator (46) is arranged in the cooling box (44), the bottom of the cooling box (44) is connected to the bottom of the cold shock test area through a return air pipe (45), the top of the cooling box (44) is connected to the inside of the second installation frame (41) through a second air guide pipe (42), a second fan (43) connected to the second air guide pipe (42) is installed on the outer wall of the second installation frame (41), and the second air guide pipe (42) is located above the cold shock test area and has a plurality of air outlets (47) facing downward.

4. The thermal shock test device for automotive electronic components according to claim 1, characterized in that: The placement assembly (6) comprises side grooves (61) symmetrically arranged on both sides of the partition (51), and vertical columns (62) are arranged at the side grooves (61). A placement net disk (64) that slidably cooperates with the columns (62) is movably arranged between adjacent partitions (51), and a spring (63) that is sleeved on the outside of the columns (62) is connected between the side grooves (61) and the placement net disk (64).

5. The thermal shock test device for automotive electronic components according to claim 4, characterized in that: The clamping assembly (7) comprises electric push rods (71) respectively arranged at two ends of the network disk (64), the ends of the electric push rods (71) close to each other are connected to clamping plates (72) for clamping the electronic component body (20), the sides of the clamping plates (72) close to each other are symmetrically provided with wedge blocks (78), the two ends of the clamping plates (72) are symmetrically and movably provided with sliding rods (74), one end of the sliding rod (74) is connected to a sliding member that is slidable with the clamping plate (72), and the other end of the sliding rod (74) is connected to a sliding member that is slidable with the clamping plate (72). A slide plate (75) is movably matched with the slide bar (74), the other end of the slide bar (74) is connected to a clamping plate (73) movably arranged on the outside of the clamping plate (72), a second spring (76) sleeved on the outside of the slide bar (74) is connected between the slide bar (75) and the clamping plate (72), and a second slide groove (721) is symmetrically provided on one side of the clamping plate (72) away from the wedge block (78), and a lever (77) connected to the corresponding slide plate (75) is slidably provided in the second slide groove (721).

6. The thermal shock test device for automotive electronic components according to claim 1, characterized in that: A controller (13) is arranged outside the experimental box (1), and the controller (13) is electrically connected to the electrical equipment in the device. A laser temperature measurement sensor (10) electrically connected to the controller (13) is arranged on the side wall of the partition (51).

7. The thermal shock test device for automotive electronic components according to claim 1, characterized in that: The arc groove (261) and the first slide groove (262) are each provided with six.

8. The thermal shock test device for automotive electronic components according to claim 4, characterized in that: The placement net plate (64) is provided with a plurality of arc-shaped through grooves.

9. A method for thermal shock testing of automotive electronic components, applicable to the thermal shock testing device for automotive electronic components as claimed in any one of claims 1 to 8, characterized in that: The method comprises the following steps: S1, open the flip cover (11), place the first electronic component body (20) on the placement component (6) corresponding to the flip cover (11), the corresponding clamping component (7) locates the position of the first electronic component body (20), and the intermittent rotating component (2) drives the placement component (6) and the clamping component (7) to rotate synchronously by driving the installation column (5) to rotate intermittently, so that the first electronic component body (20) moves to the end of the experimental box (1) away from the flip cover (11); S2, placing the second electronic component body (20) on the placement component (6) corresponding to the flip cover (11) at this time, positioning the second electronic component body (20) by the corresponding clamping component (7), driving the installation column (5) to rotate intermittently by the intermittent rotating component (2), and driving the first electronic component body (20) and the second electronic component body (20) to rotate synchronously by the cooperation of the placement component (6) and the clamping component (7), so that the first electronic component body (20) corresponds to the thermal shock test area, and the second electronic component body (20) corresponds to the cold shock test area, and controlling the thermal shock component (3) and the cold shock component (4) to work, so that the thermal shock component (3) performs a thermal shock test on the first electronic component body (20), and the cold shock component (4) performs a cold shock test on the second electronic component body (20); S3. After a thermal shock test of the first electronic component body (20) and a cold shock test of the second electronic component body (20) are completed, the intermittent rotating component (2) drives the installation column (5) to rotate intermittently and the placement component (6) and the clamping component (7) cooperate to drive the first electronic component body (20) and the second electronic component body (20) to rotate, so that the first electronic component body (20) corresponds to the cold shock test area and the second electronic component body (20) corresponds to the thermal shock test area, and the thermal shock component (3) and the cold shock component (4) are controlled to work, the thermal shock component (3) performs a thermal shock test on the second electronic component body (20), and the cold shock component (4) performs a cold shock test on the first electronic component body (20); S4. According to the number of thermal shock tests required, the positions of the first electronic component body (20) and the second electronic component body (20) are continuously changed by controlling the intermittent rotating assembly (2) to perform a thermal shock alternating cycle test on the electronic component body (20).

Images