Method for evaluating cofiring matching of metal conductor layer and non-metal dielectric layer

Abstract

The invention provides a metal conductor layer and non-metal dielectric layer co-firing matching evaluation method, which comprises the following steps: preparing a metal conductor layer sample: drying conductive slurry, grinding into powder, and carrying out compression molding at a preset temperature and a preset pressure to obtain the metal conductor layer sample; preparing a non-metal dielectric layer sample: drying the dielectric layer slurry, grinding the dried dielectric layer slurry into powder, and carrying out compression molding at a preset temperature and a preset pressure to obtain the non-metal dielectric layer sample; and evaluation of cofiring matching: performing TMA test on the prepared metal conductor layer sample and the nonmetal dielectric layer sample to obtain a shrinkage curve, and evaluating the cofiring matching of the metal conductor layer and the nonmetal dielectric layer according to the shrinkage curve. According to the co-firing matching evaluation method for the metal conductor layer and the non-metal dielectric layer provided by the invention, the shrinkage behavior of the conductor layer under different process conditions (under different hydrostatic pressures) can be effectively simulated, and the co-firing behavior of the conductor layer and the dielectric layer of the laminated device can be more intuitively evaluated.

Description

Technical Field

[0001] The present invention relates to the technical field of laminated devices, and in particular to a method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer. Background Art

[0002] With the miniaturization of stacked devices and the diversification of internal electrode circuit designs, the adverse effects of the mismatch between the conductor layer and the dielectric layer in co-firing have become increasingly prominent, which manifests itself in the deterioration of product electrical performance, the decrease in reliability life, and the growth of internal cracks; even worse, it manifests itself in poor sintering exposure and external cracking of products during the co-firing stage. The process of stacked device products is complex, with 13 major processes involved, so it often takes several months of preliminary evaluation time to match the conductive paste. Summary of the invention

[0003] In view of the defects in the prior art, the purpose of the present invention is to provide a method for evaluating the co-firing matching of a metal conductor layer and a non-metallic dielectric layer. The method can be used to preliminarily evaluate the co-firing matching or consistency of the conductor layer and the dielectric layer, and can also be used to predict the sintering behavior of the conductive paste in different application scenarios. The method can be carried out in the laboratory and greatly shortens the evaluation time.

[0004] The present invention provides a method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer, comprising the following steps:

[0005] Preparation of metal conductor layer samples: Grind the conductive paste into powder after drying, and press it into powder at a preset temperature and a preset pressure to obtain a metal conductor layer sample;

[0006] Preparation of non-metallic dielectric layer samples: drying the dielectric layer slurry and grinding it into powder, pressing and molding it at a preset temperature and a preset pressure to obtain a non-metallic dielectric layer sample;

[0007] Co-firing matching evaluation: The prepared metal conductor layer samples and non-metallic dielectric layer samples are subjected to TMA testing to obtain shrinkage curves, and the co-firing matching of the metal conductor layer and the non-metallic dielectric layer is evaluated based on the shrinkage curves.

[0008] In one embodiment of the present invention, during the preparation of the metal conductor layer sample, the conductive paste is spread on the PET film and then dried at 80° C.-120° C.

[0009] In one embodiment of the present invention, during the preparation of the metal conductor layer sample, the preset temperature during pressing is 60-90° C., and the preset pressure is 5-40 MPa.

[0010] In one embodiment of the present invention, during the preparation of the non-metallic dielectric layer sample, the dielectric layer slurry is placed in an open container and dried at 110° C.-150° C.

[0011] In one embodiment of the present invention, during the preparation of the non-metallic dielectric layer sample, the preset temperature during pressing and molding is 60-90° C., and the preset pressure is 5-40 MPa.

[0012] In one embodiment of the present invention, when preparing the metal conductor layer sample and the non-metal dielectric layer sample, the pressing and molding jig during pressing and molding includes:

[0013] Tablet press;

[0014] A tablet pressing mold, wherein the inner diameter of the tablet pressing mold is 1-3 mm;

[0015] Circulating water insulation device;

[0016] Among them, the conductive slurry is dried and ground into powder, or the dielectric layer slurry is dried and ground into powder and then placed in a tablet pressing mold, vibrated, placed in a circulating water insulation device, kept warm for 20-40 minutes, taken out, pressed into shape using a tablet press, and demolded to obtain metal conductor layer samples and non-metallic dielectric layer samples.

[0017] In one embodiment of the present invention, the insulation temperature of the circulating water insulation device is 80°C.

[0018] In one embodiment of the present invention, a plurality of metal conductor layer samples are prepared and / or a plurality of non-metal dielectric layer samples are prepared.

[0019] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0020] 1. The method for evaluating the co-firing matching of a metal conductor layer and a non-metallic dielectric layer provided in the present invention can be used to preliminarily evaluate the co-firing matching or consistency of the conductor layer and the dielectric layer, and can also be used to predict the sintering behavior of the conductive paste in different application scenarios.

[0021] 2. The present invention provides a method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer. The method can be performed in a laboratory and greatly shortens the evaluation time.

[0022] 3. The co-firing matching evaluation method of the metal conductor layer and the non-metallic dielectric layer provided by the present invention can effectively simulate the shrinkage behavior of the conductor layer under different process conditions (under different hydrostatic pressures) and more intuitively evaluate the co-firing behavior of the conductor layer and the dielectric layer of the stacked device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0024] Figure 11 is the thermal shrinkage curve of different slurries under the same evaluation conditions in Example 1 of the present invention;

[0025] Figure 2 1 is the thermal shrinkage curve of the conductive paste B in Example 1 of the present invention under different evaluation conditions. DETAILED DESCRIPTION

[0026] The following examples will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0027] The present invention is described in detail below with reference to specific embodiments.

[0028] Example 1

[0029] This embodiment provides a method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer, comprising the following steps:

[0030] S1. Preparation of metal conductor layer samples:

[0031] S11, spreading the conductive paste on the PET film, and drying it at 80°C-120°C;

[0032] S12, grinding the conductive paste dried in step S11 into powder;

[0033] S13, placing the powder in step S12 into a tableting mold and manually compacting it;

[0034] S14, installing the tableting mold containing the powder in a circulating water heat preservation device, and setting the required temperature and time;

[0035] S15. After the holding time is sufficient, the tablets are manually pressed into tablets using a tablet press. The required pressure can be obtained by reading the pressure gauge.

[0036] S16, removing the tablet pressing mold, cooling to room temperature, and demoulding to obtain a metal conductor layer sample with a certain strength.

[0037] S2. Preparation of non-metallic dielectric layer samples:

[0038] S21. Place the dielectric layer slurry in an evaporating dish and dry it at 110-150°C.

[0039] S22, placing the dielectric layer slurry dried in step S21 in an agate mortar and grinding it into powder;

[0040] S23, placing the powder in step S22 into a tableting mold and manually compacting it;

[0041] S24, installing the tableting mold containing the powder in a circulating water heat preservation device, and setting the required temperature and time;

[0042] S25. After the holding time is sufficient, the tablets are manually pressed into tablets by a tablet press, and the required pressure can be obtained by reading the pressure gauge;

[0043] S26, removing the tablet pressing mold, cooling to room temperature, and demolding to obtain a non-metallic dielectric layer sample with a certain strength.

[0044] S3. Co-firing matching evaluation: The prepared metal conductor layer samples and non-metallic dielectric layer samples are subjected to TMA test to obtain shrinkage curves, and the co-firing matching of the metal conductor layer and the non-metallic dielectric layer is evaluated based on the shrinkage curves.

[0045] In the present embodiment, when preparing the metal conductor layer sample and the non-metal dielectric layer sample, the pressing and molding jig during pressing and molding includes:

[0046] Tablet press;

[0047] A tablet pressing mold, wherein the inner diameter of the tablet pressing mold is 1-3 mm;

[0048] Circulating water insulation device.

[0049] In one embodiment, the circulating water device includes a circulating water container, and the circulating water container is externally connected to a temperature increasing device.

[0050] The following takes the testing of conductive paste A, conductive paste B (NSP-S1401), conductive paste C and dielectric layer paste D as examples to further illustrate the evaluation method provided in this embodiment:

[0051] The samples were prepared by using the metal conductor layer sample preparation steps and the non-metal dielectric layer sample preparation steps described above in this embodiment.

[0052] The samples were tested by TMA and the results were Figure 1 From the shrinkage curves in FIG. 1 , it can be seen that conductive paste B and dielectric paste D are the most compatible. Table 1 shows the compatibility of three conductive silver pastes (conductive silver paste A, conductive silver paste B, conductive silver paste C) and a specific dielectric material (dielectric paste D) under the same test conditions.

[0053] Table 1. Process parameters for evaluating the thermal shrinkage behavior of different slurries

[0054]

[0055] Conductive paste B was prepared and tested by TMA according to the conditions in Table 2. Figure 2The shrinkage curve in FIG. 2 can be used to estimate the performance of conductive paste B in different application scenarios. Table 2 shows the thermal shrinkage behavior of conductive paste B under different test conditions.

[0056] Table 2. Process parameters for evaluating the thermal shrinkage behavior of conductive paste B under different conditions

[0057]

[0058] In summary, the method for evaluating the co-firing matching of the metal conductor layer and the non-metallic dielectric layer provided by the present invention can be used to preliminarily evaluate the co-firing matching or consistency of the conductor layer and the dielectric layer, and can also be used to predict the sintering behavior of the conductive paste in different application scenarios. This method can be carried out in the laboratory and greatly shortens the evaluation time; in addition, this method can effectively simulate the shrinkage behavior of the conductor layer under different process conditions (under different hydrostatic pressures), and more intuitively evaluate the co-firing behavior of the conductor layer and the dielectric layer of the stacked device.

[0059] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer, characterized in that: The following steps are involved: Preparation of metal conductor layer samples: Grind the conductive paste into powder after drying, and press it into powder at a preset temperature and a preset pressure to obtain a metal conductor layer sample; Preparation of non-metallic dielectric layer samples: drying the dielectric layer slurry and grinding it into powder, pressing and molding it at a preset temperature and a preset pressure to obtain a non-metallic dielectric layer sample; Co-firing matching evaluation: The prepared metal conductor layer samples and non-metallic dielectric layer samples are subjected to TMA testing to obtain shrinkage curves, and the co-firing matching of the metal conductor layer and the non-metallic dielectric layer is evaluated based on the shrinkage curves.

2. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 1, characterized in that: During the preparation of the metal conductor layer sample, the conductive paste is spread on the PET film and then dried at 80°C-120°C.

3. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 2, characterized in that: During the preparation of the metal conductor layer sample, the preset temperature during pressing is 60-90°C and the preset pressure is 5-40MPa.

4. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 1, characterized in that: During the preparation of the non-metallic dielectric layer sample, the dielectric layer slurry is placed in an open container and dried at 110°C-150°C.

5. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 4, characterized in that: During the preparation of the non-metallic dielectric layer sample, the preset temperature during pressing is 60-90° C., and the preset pressure is 5-40 MPa.

6. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 3 or 5, characterized in that: When preparing the metal conductor layer sample and the non-metal dielectric layer sample, the pressing and molding jig during pressing and molding includes: Tablet press; A tablet pressing mold, wherein the inner diameter of the tablet pressing mold is 1-3 mm; Circulating water insulation device; Among them, the conductive slurry is dried and ground into powder, or the dielectric layer slurry is dried and ground into powder and then placed in a tablet pressing mold, vibrated, placed in a circulating water insulation device, kept warm for 20-40 minutes, taken out, pressed into shape using a tablet press, and demolded to obtain metal conductor layer samples and non-metallic dielectric layer samples.

7. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 6, characterized in that: The insulation temperature of the circulating water insulation device is 80℃.

8. The method for evaluating the co-firing matching of a metal conductor layer and a non-metal dielectric layer according to claim 1, characterized in that: A plurality of metal conductor layer samples and / or a plurality of non-metal dielectric layer samples are prepared.

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