Silicon-based liquid crystal component and display device

Abstract

The present invention belongs to the field of liquid crystal display technology, and particularly relates to a silicon-based liquid crystal component and a display device, including a chip component, wherein the chip component includes a transparent substrate, a semiconductor substrate of the same size as the transparent substrate is arranged at the bottom of the transparent substrate, a liquid crystal layer is arranged between the semiconductor substrate and the transparent substrate, a packaging glue layer is arranged at the periphery of the liquid crystal layer, and the semiconductor substrate and the transparent substrate are bonded together by the packaging glue layer, and a metal substrate is arranged at the bottom of the semiconductor substrate. The present invention is provided with a heat dissipation component, when the chip component is fixed on the top of the metal substrate by the packaging frame, the second heat conductive plate can be tightly pressed on the bottom of the chip component under the pushing action of the first heat conductive bar on the second heat conductive bar, thereby ensuring that the heat generated by the chip component can be timely transferred to the radiator through the heat conductive component, and ensuring the heat dissipation effect of the radiator on the chip component.

Description

Technical Field

[0001] The present invention belongs to the technical field of liquid crystal display, and in particular relates to a silicon-based liquid crystal component and a display device. Background Art

[0002] Liquid Crystal On Silicon (LCOS) is a new type of reflective micro-liquid crystal projection technology, which uses a CMOS integrated circuit chip coated with liquid crystal silicon as the substrate of the reflective LCD. It is ground flat using advanced technology and plated with aluminum as a reflector to form a CMOS substrate, which is then bonded to a glass substrate containing a transparent electrode and then injected with liquid crystal for packaging. LCOS places the control circuit behind the display device, which can improve light transmittance, thereby achieving greater light output and higher resolution.

[0003] During the use of the existing silicon-based liquid crystal chip, as the working temperature increases, its working performance also decreases. In order to ensure the working efficiency of the silicon-based liquid crystal chip, a Chinese patent with a publication number of CN217932341U proposes a silicon-based liquid crystal chip component and a display device, including: a chip, including a light-incoming side, a light-incoming area and a non-light-incoming area arranged around the light-incoming area on the light-incoming side; and a heat sink, which is arranged on the light-incoming side of the chip, and the orthographic projection of the light-incoming side of the chip is located in the non-light-incoming area. "The patent dissipates heat from the silicon-based liquid crystal chip through the heat sink, so that it maintains a high working performance. Although the patent improves the heat dissipation effect of the silicon-based liquid crystal chip to a certain extent, it still has the following shortcomings in specific use:

[0004] Since there is a metal substrate between the heat sink and the LCSi chip in the above invention, the heat conduction efficiency between the LCSi chip and the heat sink is reduced, and when the LCSi chip and the metal substrate are attached together, it is impossible to ensure that the LCSi chip and the metal substrate are tightly attached, which results in the heat sink failing to dissipate heat for the LCSi chip in a timely manner.

[0005] Therefore, it is necessary to invent a silicon-based liquid crystal component and a display device to solve the above problems. Summary of the invention

[0006] In view of the above problems, the present invention provides a liquid crystal on silicon component and a display device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon-based liquid crystal component and a display device, comprising a chip component, the chip component comprising a transparent substrate, a semiconductor substrate of the same size as the transparent substrate is arranged at the bottom of the transparent substrate, a liquid crystal layer is arranged between the semiconductor substrate and the transparent substrate, a packaging glue layer is arranged at the periphery of the liquid crystal layer, and the semiconductor substrate and the transparent substrate are bonded together by the packaging glue layer, a metal substrate is arranged at the bottom of the semiconductor substrate, a rectangular packaging frame is arranged at the periphery of the chip component, the top edge and the bottom edge of the packaging frame protrude inwardly and outwardly thereof respectively, the inwardly protruding portion of the top of the packaging frame is pressed tightly against the top edge position of the transparent substrate, a plurality of first fixing members are connected between the outwardly protruding portion of the bottom of the packaging frame and the metal substrate, a heat sink is arranged at the bottom of the metal substrate, a plurality of second fixing members are connected between the heat sink and the metal substrate, a rectangular through hole is opened through the top center area of ​​the metal substrate, and a heat conducting component is arranged in the through hole.

[0008] Further, the heat conducting component includes a first heat conducting plate, and the width of the first heat conducting plate is smaller than the width of the through hole, the bottom of the first heat conducting plate is fixedly connected with two sliders in a direction parallel to the front side of the metal substrate, the top of the radiator is provided with a slide groove matching the two sliders, and the two sliders are slidably installed in the two slide grooves respectively, a second heat conducting plate is arranged in parallel on the top of the first heat conducting plate, and the length and width of the second heat conducting plate are respectively matched with the length and width of the through hole, a first bow-shaped spring piece is arranged on one side of the first heat conducting plate, and the first bow-shaped spring piece can always be attached to the side of the first heat conducting plate, The first bow-shaped spring piece is fixedly connected to the inner wall of the through hole on the corresponding side, the middle part of the first bow-shaped spring piece protrudes toward the direction close to the first heat conducting plate, and the free end of the first bow-shaped spring piece faces upward, a plurality of first heat conducting bars are fixedly connected in parallel to the top of the first heat conducting plate, and the length direction of the first heat conducting bar is perpendicular to the length direction of the slide groove, the top of the first heat conducting bar gradually tilts upward toward the direction close to the first bow-shaped spring piece, a second heat conducting bar is arranged on the top of the first heat conducting bar, the second heat conducting bar is fixedly connected to the bottom of the second heat conducting plate, and the bottom of the second heat conducting bar is parallel to and fits together with the top of the first heat conducting bar.

[0009] Furthermore, slots are provided on both sides of the top of the second heat conducting plate, and limiting slots are provided on both sides of the top of the metal substrate, and the two limiting slots are respectively opposite to the two slots, a card plate is slidably installed in the limiting slot, and the top surface of the card plate close to the second heat conducting plate is designed as an inclined surface, and an inclined surface pressure block is fixedly connected to the top position of the card plate away from the second heat conducting plate, and the inclined surface of the inclined surface pressure block is parallel to the inclined surface of the card plate close to the second heat conducting plate, and a second bow-shaped spring piece is provided on the side of the card plate away from the second heat conducting plate, and one end of the second bow-shaped spring piece is fixedly connected to the slot wall on the side of the limiting slot facing the second heat conducting plate.

[0010] Furthermore, the radiator includes a heat dissipation base, and a plurality of heat dissipation fins are fixedly connected in parallel to the bottom of the heat dissipation base.

[0011] Furthermore, cooling tubes are provided between the two heat sinks at the outermost edges of both sides of the bottom of the heat sink base. The cooling tubes are plugged together with two adjacent heat sinks by interference fit. A plurality of connecting tubes are connected in parallel between the opposite sides of the two cooling tubes. Notches are provided at positions relative to the heat sinks and the connecting tubes, and the connecting tubes are tightly clamped in the notches. A water injection hole is provided at the front end of one of the cooling tubes, and a sealing plug is plugged into the water injection hole.

[0012] Furthermore, the connecting tube is evenly penetrated and plugged with multiple heat dissipation tubes along the front-to-back direction, and the multiple heat dissipation tubes are distributed one-to-one between two adjacent heat dissipation fins. The two ends of the heat dissipation tube are flush with the front and rear sides of the connecting tube, and the heat dissipation tube is not connected to the inside of the connecting tube.

[0013] Furthermore, a plurality of heat dissipation holes are uniformly provided between the front and rear sides of the metal substrate, and the plurality of heat dissipation holes are distributed one by one between two adjacent first heat conducting strips.

[0014] Furthermore, a flexible pressing ring is fixedly connected to the bottom of the inwardly protruding portion of the top of the packaging frame, and the width of the flexible pressing ring matches the width of the inwardly protruding portion of the top of the packaging frame.

[0015] Furthermore, the clamping plate can be completely received in the limiting groove, and the inclined surface portion of the inclined surface pressing block can contact the edge of the outwardly protruding portion of the bottom of the packaging frame.

[0016] A display device comprises the above-mentioned silicon-based liquid crystal component.

[0017] Technical effects and advantages of the present invention:

[0018] 1. The present invention is provided with a heat dissipation component. When the chip component is fixed on the top of the metal substrate by the packaging frame, the second heat conducting plate can be tightly pressed on the bottom of the chip component under the pushing action of the first heat conducting bar on the second heat conducting bar, thereby ensuring that the heat generated by the chip component can be timely transferred to the radiator through the heat conducting component, ensuring the heat dissipation effect of the radiator on the chip component;

[0019] 2. The present invention provides a card board, and when the second heat conducting plate is placed in the through hole, the card board can be used to temporarily fix the second heat conducting plate, thereby improving the convenience of applying silicone grease on the top of the second heat conducting plate and installing the chip assembly;

[0020] 3. The present invention is provided with a cooling pipe. When the heat generated by the chip assembly is transferred to the radiator, the cooling water in the connecting pipe and the cooling pipe can absorb the heat, thereby improving the heat dissipation effect of the radiator on the chip assembly. In addition, the inner wall of the heat dissipation pipe can increase the contact area between the connecting pipe and the outside air, thereby facilitating the improvement of the heat exchange efficiency between the cooling water in the connecting pipe and the outside air, so that the cooling water can be cooled faster, thereby improving the heat absorption efficiency of the cooling water and the heat dissipation effect on the chip assembly;

[0021] 4. The present invention is provided with heat dissipation holes. When the heat sink dissipates heat for the chip assembly, the heat transferred to the first heat conductive bar and the second heat conductive bar can also be discharged through the heat dissipation holes, thereby improving the heat dissipation efficiency of the chip assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a three-dimensional schematic diagram of the radiator and its bottom structure in the present invention;

[0024] Figure 3 It is a three-dimensional schematic diagram of the heat sink and some heat-conducting components in the present invention;

[0025] Figure 4 is a three-dimensional cross-sectional view of the metal substrate in the present invention;

[0026] Figure 5 The present invention Figure 4 A magnified view of part A;

[0027] Figure 6 It is a three-dimensional schematic diagram of the first heat conducting plate, the sliding block and the first heat conducting strip in the present invention;

[0028] Figure 7 is a top three-dimensional schematic diagram of a radiator in the present invention;

[0029] Figure 8It is a bottom stereoscopic schematic diagram of the packaging frame and the flexible pressure ring in the present invention;

[0030] Fig. 9 It is a three-dimensional cross-sectional view of the cooling pipe, the connecting pipe and the heat dissipation pipe in the present invention;

[0031] Fig.10 It is an exploded view of the chip assembly in the present invention.

[0032] In the figure: 1. chip component; 101. transparent substrate; 102. semiconductor substrate; 103. liquid crystal layer; 104. packaging glue layer; 2. metal substrate; 3. packaging frame; 4. first fixing member; 5. heat sink; 51. heat dissipation base; 52. heat dissipation fins; 6. second fixing member; 7. heat conduction component; 71. first heat conduction plate; 72. slider; 73. slide groove; 74. second heat conduction plate; 75. first bow-shaped spring piece; 76. first heat conduction strip; 77. second heat conduction strip; 8. card slot; 9. card plate; 10. inclined surface pressing block; 11. second bow-shaped spring piece; 12. cooling pipe; 13. connecting pipe; 14. sealing plug; 15. heat dissipation pipe; 16. heat dissipation hole; 17. flexible pressure ring. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0034] The present invention provides Figures 1 to 10 A silicon-based liquid crystal component and a display device shown in the figure include a chip component 1, wherein the chip component 1 includes a transparent substrate 101, a semiconductor substrate 102 of the same size as the transparent substrate 101 is arranged at the bottom of the transparent substrate 101, a liquid crystal layer 103 is arranged between the semiconductor substrate 102 and the transparent substrate 101, a packaging glue layer 104 is arranged on the periphery of the liquid crystal layer 103, and the semiconductor substrate 102 and the transparent substrate 101 are bonded together by the packaging glue layer 104, a metal substrate 2 is arranged at the bottom of the semiconductor substrate 102, and the outer surface of the chip component 1 A rectangular encapsulation frame 3 is provided around the metal substrate 2, the top edge and the bottom edge of the encapsulation frame 3 protrude inwardly and outwardly thereof respectively, the inwardly protruding portion of the top of the encapsulation frame 3 is pressed tightly against the top edge of the transparent substrate 101, a plurality of first fixing members 4 are connected between the outwardly protruding portion of the bottom of the encapsulation frame 3 and the metal substrate 2, a heat sink 5 is provided at the bottom of the metal substrate 2, a plurality of second fixing members 6 are connected between the heat sink 5 and the metal substrate 2, a rectangular through hole is provided through the top center area of ​​the metal substrate 2, a heat conducting component 7 is provided in the through hole;

[0035] The heat conducting assembly 7 includes a first heat conducting plate 71, and the width of the first heat conducting plate 71 is smaller than the width of the through hole. The bottom of the first heat conducting plate 71 is fixedly connected with two sliders 72 in a direction parallel to the front side of the metal substrate 2. The top of the radiator 5 is provided with a slide groove 73 matching the two sliders 72, and the two sliders 72 are slidably installed in the two slide grooves 73 respectively. A second heat conducting plate 74 is arranged in parallel with the top of the first heat conducting plate 71, and the length and width of the second heat conducting plate 74 are respectively matched with the length and width of the through hole. A first bow-shaped spring piece 75 is arranged on one side of the first heat conducting plate 71, and the first bow-shaped spring piece 75 can always be attached to the side of the first heat conducting plate 71. The first bow-shaped spring piece 75 is fixedly connected to the inner wall of the through hole on the corresponding side, the middle part of the first bow-shaped spring piece 75 protrudes in the direction close to the first heat conducting plate 71, and the free end of the first bow-shaped spring piece 75 faces upward, a plurality of first heat conducting bars 76 are fixedly connected in parallel to the top of the first heat conducting plate 71, and the length direction of the first heat conducting bar 76 is perpendicular to the length direction of the slide slot 73, the top of the first heat conducting bar 76 gradually tilts upward in the direction close to the first bow-shaped spring piece 75, and a second heat conducting bar 77 is arranged on the top of the first heat conducting bar 76, the second heat conducting bar 77 is fixedly connected to the bottom of the second heat conducting plate 74, and the bottom of the second heat conducting bar 77 is parallel to and fits with the top of the first heat conducting bar 76;

[0036] During assembly, the heat sink 5 is first connected to the bottom of the metal substrate 2, and before the heat sink 5 is installed on the bottom of the metal substrate 2, the position of the first heat conducting plate 71 is first adjusted so that it can be located in the through hole of the metal substrate 2, and then the heat sink 5 is connected to the metal substrate 2 using the second fixing member 6, and then the second heat conducting plate 74 is placed into the through hole, and a plurality of second heat conducting strips 77 and a plurality of first heat conducting strips 76 are fitted together one by one, and then thermal grease is evenly applied on the top of the second heat conducting plate 74, and then the chip assembly 1 is placed on the top of the second heat conducting plate 74 and the chip assembly 1 is pressed and fixed using the packaging frame 3, and as the packaging frame 3 gradually presses the chip assembly 1, the chip assembly 1 can press the second heat conducting plate 74 downward, and as the second heat conducting plate 74 moves upward When the first heat conducting bar 76 moves downward, the second heat conducting bar 77 can press the first heat conducting bar 76 through the bottom inclined surface thereof, and as the first heat conducting bar 76 is squeezed by the second heat conducting bar 77, the first heat conducting bar 76 can drive the first heat conducting plate 71 and the slider 72 to move along the slide groove 73 toward the direction close to the first bow-shaped spring piece 75 and compress the first bow-shaped spring piece 75. When the packaging frame 3 is fixed on the top of the metal substrate 2, the reaction force of the first bow-shaped spring piece 75 on the first heat conducting plate 71 can make the first heat conducting bar 76 on the top of the first heat conducting plate 71 always push the second heat conducting bar 77 upward, so that the second heat conducting plate 74 can always keep close to the bottom of the chip assembly 1, thereby ensuring that the heat generated by the chip assembly 1 can be timely transferred to the heat sink 5 through the heat conducting assembly 7, thereby ensuring the heat dissipation effect of the heat sink 5 on the chip assembly 1.

[0037] like Figures 3 to 5 As shown, both sides of the top of the second heat conducting plate 74 are provided with card slots 8, both sides of the top of the metal substrate 2 are provided with limit slots, and the two limit slots are respectively opposite to the two card slots 8, a card plate 9 is slidably installed in the limit slot, the top surface of the card plate 9 close to the second heat conducting plate 74 is designed as an inclined surface, and the top position of the card plate 9 away from the second heat conducting plate 74 is fixedly connected with an inclined surface pressing block 10, and the inclined surface of the inclined surface pressing block 10 is parallel to the inclined surface of the card plate 9 close to the second heat conducting plate 74, and a second bow-shaped spring piece 11 is provided on the side of the card plate 9 away from the second heat conducting plate 74, one end of the second bow-shaped spring piece 11 is fixedly connected to the groove wall of the limit slot facing the second heat conducting plate 74, the card plate 9 can be completely received in the limit slot, and the inclined surface part of the inclined surface pressing block 10 can contact the edge of the outward protruding part of the bottom of the packaging frame 3;

[0038] After the heat sink 5 is mounted on the bottom of the metal substrate 2 through the second fixing member 6, the second heat conducting plate 74 is placed in the through hole, and the plurality of second heat conducting strips 77 are pressed together with the plurality of first heat conducting strips 76. As the first heat conducting strips 76 are squeezed by the second heat conducting strips 77, the first heat conducting strips 76 can drive the first heat conducting plate 71 to move toward the direction close to the first bow-shaped spring piece 75 and compress the first bow-shaped spring piece 75. At the same time, as the second heat conducting plate 74 moves downward, the bottom edges on both sides of the second heat conducting plate 74 can respectively press the top inclined surfaces on the opposite sides of the two card plates 9, so that the two card plates 9 can move away from each other. and compress the corresponding second bow-shaped spring pieces 11. When the two card plates 9 are completely compressed back into the corresponding limiting grooves, as the second heat conducting plate 74 continues to move downward, when the card slots 8 on both sides of the second heat conducting plate 74 are at the same height as the two card plates 9, the two card plates 9 can move toward each other under the elastic force of the corresponding second bow-shaped spring pieces 11 and insert into the corresponding card slots 8, so that the second heat conducting plate 74 is fixed by the limiting effect of the card plates 9 on the card slots 8. At this time, the locking operation of the second heat conducting plate 74 can be achieved without pressing the second heat conducting plate 74 by hand, thereby improving the convenience of applying silicone grease and installing the chip assembly 1;

[0039] After the second heat conducting plate 74 and the top are coated with thermal grease, the chip assembly 1 is placed on the top of the second heat conducting plate 74 and the chip assembly 1 is pressed and fixed using the packaging frame 3. As the packaging frame 3 is fixed on the top of the metal substrate 2, the bottom edges of both sides of the packaging frame 3 can press the inclined surface pressing block 10. As the inclined surface of the inclined surface pressing block 10 is squeezed, the inclined surface pressing block 10 can drive the card plate 9 to move away from the second heat conducting plate 74. As the card plate 9 gradually moves, when the bottom of the packaging frame 3 is attached to the top of the metal substrate 2, the two card plates 9 can also just completely enter the corresponding limit grooves, thereby releasing the limit on the second heat conducting plate 74. As the restriction of the second heat conducting plate 74 is released, the first bow-shaped spring piece 75 can push the first heat conducting plate 71, so that it drives the slider 72 to move along the slide groove 73. As the first heat conducting plate 71 moves, the first heat conducting bar 76 on the first heat conducting plate 71 can push the second heat conducting bar 77 upward through its inclined surface, so that the second heat conducting plate 74 can move upward and keep close to the bottom of the chip assembly 1, thereby ensuring that the chip assembly 1 transfers heat to the heat sink 5 in time through the second heat conducting plate 74, the second heat conducting bar 77, the first heat conducting bar 76 and the first heat conducting plate 71, thereby ensuring the heat dissipation effect of the heat sink 5 on the chip assembly 1.

[0040] like Figure 1 , Figure 2 and Fig. 9As shown, the radiator 5 includes a heat dissipation base 51, a plurality of heat dissipation fins 52 are fixedly connected in parallel to the bottom of the heat dissipation base 51, a cooling tube 12 is arranged between the two heat dissipation fins 52 at the edges of the two sides of the bottom of the heat dissipation base 51, the cooling tube 12 and the two adjacent heat dissipation fins 52 are plugged together by interference fit, a plurality of connecting tubes 13 are connected in parallel between the opposite sides of the two cooling tubes 12, a notch is provided at the position where the heat dissipation fins 52 and the connecting tube 13 are opposite to each other, and the connecting tube 13 is tightly clamped in the notch, a water injection hole is provided at the front end of one of the cooling tubes 12, a sealing plug 14 is plugged at the water injection hole, a plurality of heat dissipation tubes 15 are uniformly penetrated and plugged into the connecting tube 13 along the front-to-back direction, and the plurality of heat dissipation tubes 15 are distributed one by one between the two adjacent heat dissipation fins 52, the two ends of the heat dissipation tube 15 are flush with the front and rear sides of the connecting tube 13, and the heat dissipation tube 15 is not connected with the inside of the connecting tube 13;

[0041] By providing the cooling tube 12, before the radiator 5 is installed on the bottom of the metal substrate 2, cooling water can be injected into the cooling tube 12 through the water injection hole. When the cooling tube 12 and the connecting tube 13 are filled, the water injection hole is closed with the sealing plug 14, and then the cooling tube 12 filled with cooling water is installed between the heat dissipation fins 52 of the radiator 5. Finally, the radiator 5 is connected to the metal substrate 2 through the second fixing member 6. During the use of the chip assembly 1, when the heat generated by the chip assembly 1 is transferred to the radiator 5, the heat dissipation fins 52 and the heat dissipation base 51 of the radiator 5 can transfer the heat to the connecting tube 13 and the cooling tube 12 through the part of the notch contacting the connecting tube 13 and the part of the heat dissipation base 51 contacting the cooling tube 12, respectively, so that the heat transferred to the connecting tube 13 and the cooling tube 12 can be absorbed by the cooling water, thereby improving the heat dissipation effect of the radiator 5 on the chip assembly 1;

[0042] In addition, by providing a heat dissipation pipe 15, when the cooling water absorbs heat, the inner wall of the heat dissipation pipe 15 can increase the contact area between the connecting pipe 13 and the outside air, thereby facilitating the improvement of the heat exchange efficiency between the cooling water in the connecting pipe 13 and the outside air, so that the cooling water can be cooled faster, thereby improving the cooling water's heat absorption efficiency and the heat dissipation effect on the chip component 1.

[0043] like Figure 1 and Figure 4 As shown, a plurality of heat dissipation holes 16 are evenly opened between the front and rear sides of the metal substrate 2, and the plurality of heat dissipation holes 16 are distributed one by one between two adjacent first heat conducting strips 76;

[0044] By providing the heat dissipation holes 16 , while the heat sink 5 dissipates heat for the chip assembly 1 , the heat transferred to the first heat conducting bar 76 and the second heat conducting bar 77 can also be discharged through the heat dissipation holes 16 , thereby improving the heat dissipation efficiency of the chip assembly 1 .

[0045] like Figure 8 As shown, a flexible pressing ring 17 is fixedly connected to the bottom of the inwardly protruding portion of the top of the packaging frame 3, and the width of the flexible pressing ring 17 matches the width of the inwardly protruding portion of the top of the packaging frame 3;

[0046] By providing the flexible pressure ring 17, when the packaging frame 3 presses the transparent substrate 101 from the top, the flexible pressure ring 17 can protect the contact position between the transparent substrate 101 and the packaging frame 3, thereby preventing the transparent substrate 101 from being crushed, and at the same time, the flexible pressure ring 17 can also better contact the transparent substrate 101, thereby ensuring that the transparent substrate 101 is pressed. The present invention also provides a display device, including the above-mentioned silicon-based liquid crystal assembly.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A liquid crystal on silicon component, comprising a chip component (1), characterized in that: The chip assembly (1) comprises a transparent substrate (101); a semiconductor substrate (102) of the same size as the transparent substrate (101) is arranged at the bottom of the transparent substrate (101); a liquid crystal layer (103) is arranged between the semiconductor substrate (102) and the transparent substrate (101); a packaging glue layer (104) is arranged at the periphery of the liquid crystal layer (103); the semiconductor substrate (102) and the transparent substrate (101) are bonded together by the packaging glue layer (104); a metal substrate (2) is arranged at the bottom of the semiconductor substrate (102); and a rectangular packaging frame ( 3), the top edge and the bottom edge of the packaging frame (3) protrude inwardly and outwardly respectively, the inwardly protruding portion of the top of the packaging frame (3) is pressed tightly against the top edge of the transparent substrate (101), a plurality of first fixing members (4) are connected between the outwardly protruding portion of the bottom of the packaging frame (3) and the metal substrate (2), a heat sink (5) is provided at the bottom of the metal substrate (2), a plurality of second fixing members (6) are connected between the heat sink (5) and the metal substrate (2), a rectangular through hole is provided through the top center area of ​​the metal substrate (2), and a heat conducting component (7) is provided in the through hole; The heat conducting component (7) comprises a first heat conducting plate (71), and the width of the first heat conducting plate (71) is smaller than the width of the through hole; the bottom of the first heat conducting plate (71) is fixedly connected to two sliders (72) in a direction parallel to the front side of the metal substrate (2); the top of the heat sink (5) is provided with a slide groove (73) matching the two sliders (72), and the two sliders (72) are respectively slidably installed in the two slide grooves (73); the top of the first heat conducting plate (71) is provided with a second heat conducting plate (74) in parallel, and the length and width of the second heat conducting plate (74) are respectively matched with the length and width of the through hole; a first bow-shaped spring sheet (75) is provided on one side of the first heat conducting plate (71), and the first bow-shaped spring sheet (75) can always be attached to the side of the first heat conducting plate (71); The first bow-shaped spring piece (75) is fixedly connected to the inner wall of the through hole on the corresponding side, the middle part of the first bow-shaped spring piece (75) protrudes in a direction close to the first heat conducting plate (71), and the free end of the first bow-shaped spring piece (75) faces upwards, a plurality of first heat conducting strips (76) are fixedly connected in parallel to the top of the first heat conducting plate (71), and the length direction of the first heat conducting strips (76) is perpendicular to the length direction of the slide groove (73), the top of the first heat conducting strip (76) gradually tilts upward in a direction close to the first bow-shaped spring piece (75), a second heat conducting strip (77) is arranged on the top of the first heat conducting strip (76), the second heat conducting strip (77) is fixedly connected to the bottom of the second heat conducting plate (74), and the bottom of the second heat conducting strip (77) is parallel to and fits with the top of the first heat conducting strip (76).

2. The liquid crystal on silicon component according to claim 1, characterized in that: The second heat conducting plate (74) is provided with a card slot (8) at both sides of the top, the metal substrate (2) is provided with a limit slot at both sides of the top, and the two limit slots are respectively opposite to the two card slots (8), a card plate (9) is slidably mounted in the limit slot, the top surface of the card plate (9) close to the second heat conducting plate (74) is designed as an inclined surface, the top position of the card plate (9) away from the second heat conducting plate (74) is fixedly connected with an inclined surface pressing block (10), and the inclined surface of the inclined surface pressing block (10) is parallel to the inclined surface of the card plate (9) close to the second heat conducting plate (74), and a second bow-shaped spring piece (11) is provided on the side of the card plate (9) away from the second heat conducting plate (74), and one end of the second bow-shaped spring piece (11) is fixedly connected to the groove wall of the limit slot facing the second heat conducting plate (74).

3. The liquid crystal on silicon component according to claim 1, characterized in that: The heat sink (5) comprises a heat dissipation base (51), and a plurality of heat dissipation fins (52) are fixedly connected in parallel to the bottom of the heat dissipation base (51).

4. The liquid crystal on silicon component according to claim 3, characterized in that: A cooling tube (12) is provided between two heat dissipation fins (52) at the outermost edges of both sides of the bottom of the heat dissipation base (51); the cooling tube (12) and two adjacent heat dissipation fins (52) are plugged together by interference fit; a plurality of connecting tubes (13) are connected in parallel between opposite sides of the two cooling tubes (12); notches are provided at positions opposite to the heat dissipation fins (52) and the connecting tubes (13), and the connecting tubes (13) are tightly engaged in the notches; a water injection hole is provided at the front end of one of the cooling tubes (12), and a sealing plug (14) is plugged into the water injection hole.

5. The liquid crystal on silicon component according to claim 4, characterized in that: The connecting tube (13) is uniformly penetrated and plugged with a plurality of heat dissipation tubes (15) in the front-to-back direction, and the plurality of heat dissipation tubes (15) are distributed one-to-one between two adjacent heat dissipation fins (52), the two ends of the heat dissipation tube (15) are flush with the front and rear sides of the connecting tube (13), and the heat dissipation tube (15) is not connected to the interior of the connecting tube (13).

6. The liquid crystal on silicon component according to claim 1, characterized in that: A plurality of heat dissipation holes (16) are evenly provided between the front and rear sides of the metal substrate (2), and the plurality of heat dissipation holes (16) are distributed one-to-one between two adjacent first heat conducting strips (76).

7. The liquid crystal on silicon component according to claim 1, characterized in that: A flexible pressure ring (17) is fixedly connected to the bottom of the inwardly protruding portion at the top of the packaging frame (3), and the width of the flexible pressure ring (17) matches the width of the inwardly protruding portion at the top of the packaging frame (3).

8. The liquid crystal on silicon component according to claim 2, characterized in that: The clamping plate (9) can be completely received in the limiting groove, and the inclined surface portion of the inclined surface pressing block (10) can contact the edge of the outwardly protruding portion of the bottom of the packaging frame (3).

9. A display device, characterized in that: The invention comprises the liquid crystal on silicon component as claimed in any one of claims 1 to 8.

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