An automatic adjustment system for an electron beam exposure apparatus

Abstract

This application provides an automatic adjustment system for an electron beam exposure device. During operation, the host computer can use an external camera to image the real image magnified by the objective lens. After analyzing the image, the system drives adjustment components or a robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope. The system also controls the robot to zero the XYZ axes of the electron beam exposure device to adjust the sample on the stage. This process requires no manual operation and can be automated through the host computer, effectively saving equipment operation time and improving operational accuracy. It allows for precise control of electron beam exposure at different positions. Furthermore, this application uses an external camera instead of the original camera in the electron beam exposure device, effectively improving image transmission efficiency and automatic adjustment efficiency.

Description

Technical Field

[0001] This application relates to the field of automatic control technology, and in particular to an automatic adjustment system for electron beam exposure equipment. Background Technology

[0002] Electron beam lithography equipment is a high-precision, large-scale instrument used in micro- and nano-fabrication. Its components can only be imported from the original manufacturers. Damage to these components can significantly impact equipment use and delay research progress. Furthermore, the expensive components and high maintenance costs make it essential to train specialized personnel to operate such equipment.

[0003] Currently, electron beam exposure equipment requires a clear reference position to ensure the accuracy and repeatability of each operation. For example, zeroing the XYZ axes of the equipment establishes such a fixed reference point. Once the equipment has completed the zeroing operation, all subsequent movements and operations can be measured and positioned relative to this origin, allowing operators to accurately know the current position of the equipment and precisely control the electron beam exposure at different locations.

[0004] However, due to the high operational requirements of this equipment, operators need a long period of training before they are allowed to use it. If operators are not familiar with the zeroing operation procedure, not only will operational errors or excessive operation time prevent subsequent experimenters from conducting experiments normally, but the accuracy of subsequent electron beam exposure operations will also be uncontrollable. Furthermore, the camera installed under the microscope of this equipment has excessive image delay due to performance reasons, which further prolongs the operation time and makes the management and maintenance costs of the laboratory high. Summary of the Invention

[0005] The purpose of this application is to at least solve one of the above-mentioned technical defects, in particular the technical defect that the use of manual operation of electron beam exposure equipment in the prior art not only makes it impossible for subsequent experimental personnel to carry out experiments normally due to operational errors or excessive operation time, but also makes it impossible to control the accuracy of subsequent electron beam exposure operations.

[0006] This application provides an automatic adjustment system for an electron beam exposure device. The system includes a host computer, an external camera, an optical stage, an adjustment component disposed on the optical stage, and an operating robot disposed on one side of the optical stage.

[0007] The optical microscope and optical microscope stage of the electron beam exposure equipment are set on the optical microscope stage. The optical microscope stage is used to load a sample holder with a fixed sample. The adjustment component and the operating robot are set around the optical microscope. The lens of the external camera is docked with the objective lens of the optical microscope. The input and output terminals of the host computer are respectively connected to the external camera, the adjustment component and the operating robot.

[0008] When the host computer is working, it calls the external camera to image the real image obtained by magnification of the objective lens, and analyzes the image of the optical microscope after imaging. Based on the analysis results, it drives the adjustment component or the operating robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope. It also controls the operating robot to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment in order to adjust the sample on the sample stage.

[0009] Optionally, the system further includes: a tray docking assembly disposed between the optical stage and the operating robot, the tray docking assembly being disposed opposite to the optical stage;

[0010] Before the host computer calls the external camera to image the real image magnified by the objective lens, it also performs the following operations:

[0011] Send a sample rack handling command to the operating robot to drive the operating robot to move the sample rack with the fixed sample in the designated area to the tray docking assembly;

[0012] Send a sample rack import command to the tray docking assembly to drive the tray docking assembly to import the sample rack into the optical microscope stage;

[0013] Send a sample holder locking command to the operating robot to drive the operating robot to lock the sample holder to the optical microscope stage.

[0014] Optionally, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical microscope, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results, including:

[0015] When the host computer adjusts the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnifying the objective lens, and uses the first algorithm SDK to analyze the image of the first optical mirror after imaging to determine the sample stage type on the sample holder, and drives the operating robot to adjust the sample stage according to the sample stage type.

[0016] Optionally, the process of the host computer driving the operating robot to adjust the sample stage according to the sample stage type includes:

[0017] When the host computer determines that the sample stage type is a press-type, it drives the operating robot to adjust the height and level of the sample stage using the calibration method of the press-type.

[0018] When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

[0019] Optionally, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical microscope, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results, including:

[0020] When the host computer adjusts the angle of the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the second algorithm SDK to analyze the image of the second optical mirror after imaging to determine the angle information of the sample on the sample stage in the image of the second optical mirror after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

[0021] Optionally, the process of the host computer driving the operating robot to adjust the sample stage according to the angle information includes:

[0022] The host computer determines the rotation angle and rotation direction to make the edge of the sample orthogonal to the image of the second optical mirror after imaging based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and rotation direction.

[0023] Optionally, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image from the optical microscope, and drives the adjustment component to adjust the sample holder on the optical microscope stage based on the analysis results. It also controls the operating robot to perform a zeroing operation on the XY axes of the electron beam exposure equipment, including:

[0024] When the host computer adjusts the planar reference coordinates of the electron beam exposure equipment, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the third algorithm SDK to analyze the image of the third optical mirror after imaging to determine the position information of the Faraday cup on the sample holder in the image of the third optical mirror after imaging. Based on the position information, it drives the adjustment component to adjust the sample holder and then controls the operation robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment.

[0025] Optionally, the adjustment component includes an X-axis automatic adjustment component and a Y-axis automatic adjustment component;

[0026] The process by which the host computer drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment, includes:

[0027] The host computer determines the X-axis and Y-axis movement distances when the Faraday cup is positioned at the center of the scale in the image of the third optical mirror after imaging, based on the position information.

[0028] The host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis movement distance, and then controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure equipment.

[0029] The host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis movement distance, and then controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure equipment.

[0030] Optionally, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image after imaging, drives the adjustment component to adjust the optical microscope according to the analysis results, and controls the Z-axis of the electron beam exposure device of the operating robot to perform a zeroing operation, including:

[0031] When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the fourth algorithm SDK to analyze the image of the fourth optical mirror after imaging. After determining the clarity of the mark on the sample holder in the image of the fourth optical mirror after imaging, it drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

[0032] Optionally, the adjustment assembly further includes a large knob adjustment assembly and a small knob adjustment assembly;

[0033] The process by which the host computer drives the adjustment component to adjust the optical microscope according to the resolution, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment, includes:

[0034] The host computer determines the focusing data that makes the mark reach a preset clarity threshold based on the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope and the small knob adjustment component to adjust the fine adjustment knob on the optical microscope based on the focusing data, so as to adjust the height of the sample holder, and controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment.

[0035] Optionally, after the host computer controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment, it also performs the following operations:

[0036] The external camera is used to image the real image obtained by magnification of the objective lens. After analyzing the image obtained by the fifth optical mirror using the fifth algorithm SDK, the position coordinates of all the marks on the sample holder located around the sample are determined and the position coordinates are saved.

[0037] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0038] This application provides an automatic adjustment system for an electron beam exposure apparatus. The system includes a host computer, an external camera, an optical stage, an adjustment component mounted on the optical stage, and an operating robot positioned to one side of the optical stage. The optical microscope and optical stage of the electron beam exposure apparatus are mounted on the optical stage. The optical stage is used to mount a sample holder with a fixed sample. The adjustment component and operating robot are positioned around the optical microscope. The lens of the external camera is connected to the objective lens of the optical microscope. The input / output terminals of the host computer are connected to the external camera, the adjustment component, and the operating robot, respectively. During operation, the host computer can use the external camera to image the real image magnified by the objective lens. After analyzing the image from the optical stage, the host computer drives the adjustment component or operating robot to adjust the sample holder on the optical stage, the sample stage on the sample holder, and the optical microscope based on the analysis results. The host computer also controls the operating robot to zero the XYZ axes of the electron beam exposure apparatus to adjust the sample on the sample stage. This process requires no manual operation and can be automated through a host computer for calibration and adjustment, thereby effectively saving equipment operation time and improving operational accuracy. This allows for precise control of electron beam exposure at different positions. Furthermore, this application uses an external camera to replace the original camera in the electron beam exposure equipment and connects it to the host computer for image processing. This process not only does not affect the operation of the original host in the electron beam exposure equipment, but also effectively improves image transmission efficiency, thereby improving automatic adjustment efficiency. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This application provides an architecture diagram of an automatic adjustment system for an electron beam exposure apparatus, as shown in the embodiments of the present application.

[0041] Figure 2 A schematic diagram showing the positional relationship of laboratory equipment such as optical stage and operating robot provided in the embodiments of this application;

[0042] Figure 3 This is a schematic diagram of the structure of the operating robot provided in the embodiments of this application;

[0043] Figure 4 This is a schematic diagram of the structure of various grippers of the operating robot provided in the embodiments of this application;

[0044] Figure 5This is a schematic diagram of the structure of the press-type sample stage provided in the embodiments of this application;

[0045] Figure 6 This is a schematic diagram of the structure of the knob-type sample stage provided in the embodiments of this application;

[0046] Figure 7 A schematic diagram of the second optical mirror image after the external camera magnifies the real image obtained by the objective lens, as provided in the embodiments of this application;

[0047] Figure 8 A schematic diagram illustrating the process of focusing an image using an image sharpness recognition algorithm, provided in an embodiment of this application.

[0048] Figure 9 A schematic diagram illustrating the process of using a contour recognition algorithm to perform contour recognition on a Faraday cup, as provided in an embodiment of this application.

[0049] Figure 10 A schematic diagram showing the positional relationship between various adjustment components provided in the embodiments of this application, the optical microscope, and the optical microscope stage;

[0050] Figure 11 A schematic diagram showing the positional relationship between the X-axis automatic adjustment component and other devices on the optical stage provided in this embodiment of the application;

[0051] Figure 12 A schematic diagram showing the positional relationship between the Y-axis automatic adjustment component and other devices on the optical stage provided in this embodiment of the application;

[0052] Figure 13 This is a schematic diagram of the structure of the size knob adjustment assembly provided in the embodiments of this application. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] In one embodiment, this application provides an automatic adjustment system for an electron beam exposure device, the system including a host computer, an external camera, an optical stage, an adjustment component disposed on the optical stage, and an operating robot disposed on one side of the optical stage.

[0055] The optical microscope and optical microscope stage of the electron beam exposure equipment are mounted on the optical microscope stage. The optical microscope stage is used to load a sample holder with a fixed sample. The adjustment component and the operating robot are arranged around the optical microscope. The lens of the external camera is docked with the objective lens of the optical microscope. The input and output terminals of the host computer are respectively connected to the external camera, the adjustment component and the operating robot.

[0056] When the host computer is working, it calls the external camera to image the real image obtained by magnification of the objective lens, and analyzes the image of the optical microscope after imaging. Based on the analysis results, it drives the adjustment component or the operating robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope. It also controls the operating robot to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment in order to adjust the sample on the sample stage.

[0057] In this embodiment, as Figure 1 , 2 As shown, Figure 1 This is an architecture diagram of an automatic adjustment system for an electron beam exposure apparatus provided in an embodiment of this application. Figure 2 This is a schematic diagram showing the positional relationship of laboratory equipment such as the optical stage and the operating robot provided in the embodiments of this application; by Figure 2 As can be seen, this application has multiple adjustment components on the optical microscope stage, and an operating robot is located on one side of the optical microscope stage. The optical microscope and optical microscope stage of the electron beam exposure equipment (EBL equipment) are both located on the optical microscope stage, and the various adjustment components and the operating robot are arranged around it to adjust the optical microscope and the sample holder on the optical microscope stage with the sample fixed thereon. In addition, the microscope of the EBL equipment is originally equipped with a camera for capturing images under the optical microscope objective, but due to performance limitations, the image delay is too large. Therefore, this application allows for the replacement of this camera by interfacing an external camera with the objective and connecting it to an external host computer (i.e., a host computer) for processing, without affecting the operation of the original host equipment.

[0058] The aforementioned optical microscope and optical stage are the microscope and stage that come with the electron beam exposure equipment. When the coarse adjustment or fine adjustment knob of the optical microscope is adjusted, the optical stage can be raised or lowered, which in turn raises or lowers the sample holder mounted on the optical stage. This process adjusts the distance between the objective lens and the sample by raising or lowering the optical stage, thereby achieving focusing and other purposes.

[0059] The aforementioned samples refer to silicon wafers, wafers, or photomasks pre-fixed on a sample holder. The samples used when loading and unloading the EBL equipment in this application include, but are not limited to, 1cm silicon wafers, 2cm silicon wafers, 4-inch wafers, 6-inch wafers, 8-inch wafers, and 150mm x 150mm photomasks. When different samples are selected for photolithography in this application, different sample holders can be used for fixing; the specific settings can be determined according to the actual situation and are not limited here.

[0060] The aforementioned adjustment components include, but are not limited to, an automatic X-axis adjustment component, an automatic Y-axis adjustment component, a large knob adjustment component, and a small knob adjustment component. Each adjustment component can be set according to its function to meet different needs when performing zeroing operations on the XYZ axes of the electron beam exposure equipment.

[0061] The aforementioned operating robot refers to a robot that performs horizontal, height, and angle adjustments on the sample holder on the optical microscope stage and the sample stage within the sample holder. This robot can consist of a 10kg robot, a handling gripper, a camera, and a robot base. (Illustratively, for example...) Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the operating robot provided in the embodiments of this application; Figure 3 The robot's base is a platform upon which a 10kg robot is mounted. The 10kg robot's end is equipped with a camera and a handling gripper. This allows the robot to perform handling operations through the coordination of the camera and the handling gripper. Additionally, as... Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of various grippers of the operating robot provided in the embodiments of this application; combined with Figure 2 As can be seen, this application can provide a quick-change mechanism on one side of the operating robot. This quick-change mechanism is equipped with various types of grippers, such as 1cm and 2cm silicon wafer height adjustment grippers, tray locking grippers, 1cm and 2cm silicon wafer angle adjustment grippers, tray grippers, and tray pull-out grippers. When the operating robot performs different types of operations, the quick-change mechanism can meet the process operations of the optical stage, thereby effectively improving the work efficiency.

[0062] The aforementioned external camera refers to a camera that docks with the objective lens of the optical microscope in the EBL device. This external camera can image the real image obtained by magnification of the objective lens, and compared with the original camera, the external camera of this application has less image latency, thus enabling rapid adjustment after being connected to a host computer. Figure 1As shown, the external camera in this application can be an optical CCD. This optical CCD can be connected to the objective lens in the optical microscope of the EBL device through a corresponding interface to obtain the real image magnified by the objective lens. After imaging, the image is sent to the host computer so that the host computer can call a specific algorithm SDK for analysis and send corresponding motion commands to the robot based on the obtained results. The robot here includes the adjustment component and the operating robot of this application. The robot then adjusts the EBL device. This process is continuously corrected and iterated to finally achieve the required business results.

[0063] In one specific implementation, the host computer of this application can be integrated into the optical microscope stage or set up in other convenient operating environments. The input and output terminals of the host computer are connected to the external camera, adjustment components, and operating robot, respectively. When the host computer is working, it can call the external camera to image the real image obtained by magnifying the objective lens of the optical microscope, analyze the image after imaging, and drive the adjustment components or operating robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope according to the analysis results. After the adjustment is completed, the operating robot is controlled to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment. This can unify the coordinate system of the electron beam exposure equipment with the coordinate system required by the design or process, so that the positional relationship between different layers can be more accurately corresponded when performing complex pattern exposure or multi-layer exposure, avoiding positional deviations caused by inconsistencies in the coordinate system; it can also eliminate the accumulation of equipment errors by zeroing the XYZ axis, ensuring that the equipment always maintains a high-precision working state; in addition, the zeroing operation before performing the exposure task allows the operator or exposure robot to clearly know the initial state of the equipment, making it easier to plan and execute the exposure path.

[0064] In this application, the host computer can drive different robots to perform different tasks. For example, when adjusting the sample stage on the sample holder, the host computer can drive the operating robot to adjust the sample stage; when adjusting the angle of the sample stage on the sample holder, it can also drive the operating robot to adjust the angle of the sample stage; and when adjusting the Z-axis reference coordinate of the electron beam exposure equipment, it can drive the adjustment component to adjust the optical microscope and then control the operating robot to zero the Z-axis of the electron beam exposure equipment. The specific driving object and motion commands can be set according to the actual operation type and are not limited here.

[0065] In the above embodiments, the system includes a host computer, an external camera, an optical microscope stage, an adjustment component mounted on the optical microscope stage, and an operating robot mounted on one side of the optical microscope stage. The optical microscope and optical microscope stage of the electron beam exposure equipment are mounted on the optical microscope stage. The optical microscope stage is used to load a sample holder with a fixed sample. The adjustment component and operating robot are positioned around the optical microscope. The lens of the external camera is connected to the objective lens of the optical microscope. The input and output terminals of the host computer are connected to the external camera, the adjustment component, and the operating robot, respectively. When the host computer is working, it can use the external camera to image the real image magnified by the objective lens, analyze the image from the optical microscope, and drive the adjustment component or operating robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope based on the analysis results. It also controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment to adjust the sample on the sample stage. This process requires no manual operation and can be automated through a host computer for calibration and adjustment, thereby effectively saving equipment operation time and improving operational accuracy. This allows for precise control of electron beam exposure at different positions. Furthermore, this application uses an external camera to replace the original camera in the electron beam exposure equipment and connects it to the host computer for image processing. This process not only does not affect the operation of the original host in the electron beam exposure equipment, but also effectively improves image transmission efficiency, thereby improving automatic adjustment efficiency.

[0066] In one embodiment, the system further includes a tray docking assembly disposed between the optical stage and the operating robot, the tray docking assembly being disposed opposite to the optical stage.

[0067] Before the host computer calls the external camera to image the real image magnified by the objective lens, it can also perform the following operations:

[0068] Send a sample rack handling command to the operating robot to drive the operating robot to move the sample rack with the fixed sample in the designated area to the tray docking assembly.

[0069] Send a sample holder import command to the tray docking assembly to drive the tray docking assembly to import the sample holder into the optical microscope stage.

[0070] Send a sample holder locking command to the operating robot to drive the operating robot to lock the sample holder to the optical microscope stage.

[0071] In this embodiment, as Figure 2As shown, the system may also include a tray docking assembly disposed between the optical microscope stage and the operating robot. The tray docking assembly is disposed opposite to the optical microscope stage and connected to the host computer, thereby guiding the sample holder onto the optical microscope stage according to the motion commands sent by the host computer.

[0072] Specifically, in this application, before the host computer calls the external camera to image the real image obtained by magnification of the objective lens, it can first guide the sample holder with the fixed sample onto the optical microscope stage by operating the robot and the tray docking assembly, and then observe the sample on the optical microscope stage through the objective lens of the optical microscope. In this application, when a sample holder with a fixed sample is introduced into the optical microscope stage via an operating robot and a tray docking assembly, the host computer can first send a sample holder handling instruction to the operating robot. After receiving the instruction, the operating robot can move the sample holder with the fixed sample in the designated area to the tray docking assembly. Then, the host computer can determine the position of the sample holder based on the real-time data fed back by the operating robot. When it is determined that the sample holder has been moved to the tray docking assembly, a sample holder import instruction can be sent to the tray docking assembly. This instruction can include the import direction and import speed. After receiving the instruction, the tray docking assembly can slowly import the sample holder into the optical microscope stage according to the import direction and import speed contained in the instruction. Furthermore, the optical microscope stage can also be equipped with a guide rail that matches the sample holder. This allows the sample holder to slide into the optical microscope stage via the guide rail, thereby reducing unnecessary shaking and maintaining the stability of the import stroke.

[0073] Furthermore, after the sample holder is imported into the optical microscope stage via the tray docking assembly, in order to further ensure the stability of the sample holder during subsequent operations, the host computer can also send a sample holder locking command to the operating robot after receiving the import completion command from the tray docking assembly. After receiving the command, the operating robot can replace its gripper with a tray locking gripper and use the tray locking gripper to lock the sample holder to the optical microscope stage. During this process, the host computer can send information such as locking direction and locking angle to the operating robot via the sample holder locking command so that the operating robot can quickly lock according to the command.

[0074] In one embodiment, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical microscope, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results. This may include:

[0075] When the host computer adjusts the height and level of the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the first algorithm SDK to analyze the image of the first optical mirror after imaging to determine the type of sample stage on the sample holder, and drives the operating robot to adjust the sample stage according to the sample stage type.

[0076] In this embodiment, when the host computer calls the external camera to work, the external camera can image the real image obtained by magnification of the objective lens of the optical microscope. The real image can be a sample stage whose height and level are to be adjusted, a sample stage whose angle is to be adjusted, or a sample holder whose height is to be adjusted. The specific image can be collected according to the actual working conditions, and there are no restrictions here.

[0077] When the host computer in this application adjusts the sample stage on the sample holder, it indicates that the host computer has driven the operating robot to lock the sample holder on the optical microscope stage. At this time, the host computer calls the external camera to image the real image magnified by the objective lens. The resulting first optical microscope image shows the sample holder mounted on the optical microscope stage, the sample stage on the sample holder, the sample fixed on the sample stage, and other components on the sample holder besides the sample stage, such as height-limiting barriers, Faraday cups, and markers. The host computer can call the first algorithm SDK to analyze the first optical microscope image to determine the type of sample stage on the sample holder, and drive the operating robot to adjust the sample stage according to the sample stage type, such as adjusting the height and level of the sample stage, so that the sample stage meets the preset height or level requirements.

[0078] In this application, the first algorithm SDK called by the host computer can be an existing image recognition algorithm or an image recognition algorithm adjusted according to the type of laboratory sample rack. The specific settings can be made according to the actual situation and are not limited here.

[0079] In one embodiment, the process of the host computer driving the operating robot to adjust the sample stage according to the sample stage type may include:

[0080] When the host computer determines that the sample stage type is a press-type, it drives the operating robot to adjust the height and level of the sample stage using the calibration method of the press-type.

[0081] When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

[0082] In this embodiment, as Figure 5 , 6 As shown, Figure 5This is a schematic diagram of the structure of the press-type sample stage provided in the embodiments of this application. Figure 6 This is a schematic diagram of the structure of the knob-type sample stage provided in an embodiment of this application. When the host computer in this application analyzes the image of the first optical mirror after imaging using the first algorithm SDK and determines that the sample stage type on the sample holder is a press-type, it can drive the operating robot to adjust the height and level of the sample stage using the press-type calibration method; when the host computer analyzes the image of the first optical mirror after imaging using the first algorithm SDK and determines that the sample stage type on the sample holder is a knob-type, it can drive the operating robot to adjust the height and level of the sample stage using the knob-type calibration method.

[0083] For example, such as Figure 5 As shown, when the sample stage type of this application is a press-type, the height of the sample stage can be adjusted by inserting an isolation plate at the lower end of the height limiting plate, such as... Figure 6 As shown, when the sample stage type of this application is a knob type, the height of the sample stage can be adjusted by adjusting the height of the bolt on the height limiting plate; the aforementioned height limiting plate is set on the edge of the sample stage, and the number of height limiting plates can be set to three. The specific process of adjusting the three height limiting plates to change the horizontal height of the sample stage is as follows:

[0084] When the sample stage type of this application is a press type, the host computer can drive the operating robot to press down the sample stage, place isolation plates under the three height limiting blocks, and then slowly pop up the sample stage, thereby realizing the adjustment of the height and level of the sample stage.

[0085] In the above process, an external camera can be used to acquire the first optical mirror image after imaging, and the image can be used to analyze whether the upper surface of the sample and the top of the height-limiting barrier of the sample stage are on the same horizontal plane; or a laser altimeter or other height detector can be set on the operating robot to obtain the initial tilt angle of the sample stage, so as to determine whether the upper surface of the sample and the top of the height-limiting barrier of the sample stage are on the same horizontal plane.

[0086] When the sample stage of this application is a knob type, the host computer can send a horizontal correction command to the operating robot based on the height of at least three marked positions of the sample detected by the laser altimeter. After receiving the command, the operating robot can use the 1cm and 2cm silicon wafer height adjustment grippers to turn the bolts of the height-limiting barrier, so that the upper surface of the sample is at the same level as the top of the height-limiting barrier of the sample stage. The laser altimeter can communicate with the terminal device, and the number of rotations of the bolts required in the horizontal correction command is determined based on the height of the sample marked positions detected by the laser altimeter. Correction stops when the height of all three marked positions of the sample as measured by the laser altimeter is 0.

[0087] In one embodiment, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical microscope, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results. This may include:

[0088] When the host computer adjusts the angle of the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the second algorithm SDK to analyze the image of the second optical mirror after imaging to determine the angle information of the sample on the sample stage in the image of the second optical mirror after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

[0089] In this embodiment, the host computer can not only adjust the height and level of one or more sample stages on the sample holder, but also adjust their angle. When the host computer adjusts the angle of the sample stage, it can call an external camera to image the real image obtained by magnification of the objective lens. At this time, the second optical mirror image after imaging is the sample holder with the sample stage angle to be adjusted. The host computer can use the second algorithm SDK to analyze the second optical mirror image after imaging to determine the angle information of the sample on the sample stage in the second optical mirror image after imaging, and drive the robot to adjust the angle of the sample stage according to the angle information so that the sample edge is orthogonal to the objective lens image.

[0090] The second algorithm SDK here can be an existing image thresholding segmentation algorithm, or an image thresholding segmentation algorithm adapted to the type of laboratory sample rack. The specific settings can be made according to the actual situation, and no restrictions are imposed here.

[0091] In one embodiment, the process by which the host computer drives the operating robot to adjust the sample stage based on the angle information may include:

[0092] The host computer determines the rotation angle and rotation direction to make the edge of the sample orthogonal to the image of the second optical mirror after imaging based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and rotation direction.

[0093] In this embodiment, as Figure 7 As shown, Figure 7 This is a schematic diagram of the second optical mirror image after the external camera magnifies the real image obtained from the objective lens, as provided in an embodiment of this application. It is understood that the angle of the sample on the sample stage in this application varies depending on the placement of the sample stage in the sample holder. When the position of the sample in this application is as follows... Figure 7As shown, the host computer can use an image thresholding segmentation algorithm to capture the sample edge, calculate the angle between it and the orthogonal axis of the second optical mirror image (i.e., the X-axis and Y-axis, equivalent to the eyepiece scale), and then determine the angle information that needs to be adjusted, such as the rotation angle and rotation direction. With the angle information, the host computer can send a sample stage plane rotation adjustment command to the operating robot, instructing it to rotate the sample stage clockwise / counterclockwise until the sample edge is orthogonal to the objective lens image, thereby effectively improving the accuracy of subsequent electron beam exposure.

[0094] In one embodiment, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image from the optical microscope, and drives the adjustment component to adjust the sample holder on the optical microscope stage based on the analysis results. It also controls the operating robot to perform a zeroing operation on the XY axes of the electron beam exposure equipment. This may include:

[0095] When the host computer adjusts the planar reference coordinates of the electron beam exposure equipment, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the third algorithm SDK to analyze the image of the third optical mirror after imaging to determine the position information of the Faraday cup on the sample holder in the image of the third optical mirror after imaging. Based on the position information, it drives the adjustment component to adjust the sample holder and then controls the operation robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment.

[0096] In this embodiment, the host computer can not only adjust the height and level of one or more sample stages on the sample holder, or adjust the angle of the sample stages, but also adjust the planar reference coordinates of the electron beam exposure equipment. When the host computer adjusts the planar reference coordinates of the electron beam exposure equipment, it can do so through the positioning marks on the sample holder.

[0097] For example, a Faraday cup is a marker on a sample holder used for planar positioning. There is only one on a specific sample holder, and it is in a fixed position. When viewed through the eyepiece, it is usually a black circular object. Therefore, in this application, after the host computer calls the external camera to image the real image obtained by magnification of the objective lens, and uses the third algorithm SDK to analyze the image in the third optical mirror, it can determine the position information of the Faraday cup on the sample holder in the image in the third optical mirror. Based on this position information, it drives the adjustment component to adjust the sample holder, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment.

[0098] The aforementioned third algorithm SDK can be an existing image sharpness recognition algorithm and contour recognition algorithm, or it can be an image sharpness recognition algorithm and contour recognition algorithm adjusted according to the shape and position of the Faraday cup, or other recognition algorithms. The specific settings can be made according to the actual situation, and there are no restrictions here.

[0099] In a specific implementation, such as Figure 8 , 9 As shown, Figure 8 This is a schematic diagram illustrating the process of focusing an image using an image sharpness recognition algorithm, as provided in an embodiment of this application. Figure 9 This is a schematic diagram illustrating the process of using a contour recognition algorithm to perform contour recognition on a Faraday cup, as provided in an embodiment of this application; combined with Figure 8 , Figure 9 As can be seen, the host computer of this application can first use an image sharpness recognition algorithm to identify the focus of the image under the objective lens image. The algorithm outputs a normalized VAR value for sharpness evaluation (the value is positively correlated with sharpness), thereby gradually adjusting the focus to a relatively sharp state. Then, the host computer can call a contour recognition algorithm to perform contour recognition on the Faraday cup, obtain the position coordinates, form position information, and send it to the adjustment component to control the adjustment component to adjust the plane position until the target is roughly in the center of the image.

[0100] In one embodiment, the adjustment component may include an X-axis automatic adjustment component and a Y-axis automatic adjustment component.

[0101] The process by which the host computer drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment, may include:

[0102] The host computer determines the X-axis and Y-axis movement distances when the Faraday cup is positioned at the center of the scale in the image of the third optical mirror after imaging, based on the position information.

[0103] The host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis movement distance, and then controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure equipment.

[0104] The host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis movement distance, and then controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure equipment.

[0105] In this embodiment, when the host computer adjusts the planar reference coordinates of the electron beam exposure equipment, it can do so through the positioning marks on the sample holder. Specifically, in this application, the host computer can determine the X-axis and Y-axis movement distances based on the position information to position the Faraday cup at the center of the scale of the third optical mirror image after imaging, and then adjust the sample holder according to the X-axis and Y-axis movement distances.

[0106] In this application, when the host computer drives the adjustment component to adjust the sample holder based on the position information and controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment, such as... Figure 10 As shown, Figure 10 A schematic diagram showing the positional relationship between various adjustment components provided in the embodiments of this application, the optical microscope, and the optical microscope stage; Figure 10 In this application, the adjustment component may include an X-axis automatic adjustment component and a Y-axis automatic adjustment component. The X-axis automatic adjustment component may consist of a linear motor and two sets of piezoelectric preload brakes. The linear motor has a repeatability of ±0.002 mm, and the C5 type piezoelectric preload brake has a closed-loop resolution of 1.08 μm. In this application, as... Figure 11 As shown, Figure 11 This is a schematic diagram showing the positional relationship between the X-axis automatic adjustment component and other devices on the optical mirror stage provided in this application embodiment. The host computer can determine the X-axis movement distance and Y-axis movement distance when the Faraday cup is in the center of the scale of the third optical mirror image after imaging based on the position information. Then, after driving the linear motor to push the X-axis for coarse positioning based on the X-axis movement distance, it can further drive the C5 type piezoelectric pre-pressure brakes at both ends of the linear motor to accurately position and adjust the X-axis position.

[0107] Furthermore, the Y-axis automatic adjustment component in this application can consist of two sets of linear motors and two sets of piezoelectric preload brakes. The repeatability of the linear motors is ±0.002 (mm), and the closed-loop resolution of the C5 type piezoelectric preload brake is 1.08 μm. In this application, as... Figure 12 As shown, Figure 12 This diagram illustrates the positional relationship between the Y-axis automatic adjustment component and other devices on the optical stage provided in this application embodiment. In this application, the host computer can coarsely position the Y-axis by pushing it laterally with a linear motor, and then precisely position and adjust the Y-axis using C5 piezoelectric pre-pressure brakes at both ends of the linear motor. After both adjustments are completed, the host computer can also control the operating robot to perform a zeroing operation on the XY axes of the electron beam exposure equipment.

[0108] In one embodiment, when the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image after imaging, drives the adjustment component to adjust the optical microscope based on the analysis results, and controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment, which may include:

[0109] When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the fourth algorithm SDK to analyze the image of the fourth optical mirror after imaging. After determining the clarity of the mark on the sample holder in the image of the fourth optical mirror after imaging, it drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

[0110] In this embodiment, after adjusting the XY axis coordinates of the electron beam exposure device, the host computer can also adjust the Z axis reference coordinates. During adjustment, the host computer can call the external camera to image the real image obtained by magnification of the objective lens, and use the fourth algorithm SDK to analyze the image of the fourth optical mirror after imaging to determine the clarity of the positioning mark on the sample holder in the image of the fourth optical mirror after imaging. This drives the adjustment component to adjust the optical microscope and adjust the height of the sample holder.

[0111] In this application, the mark on the sample stage, like the Faraday cup, has only one location, typically in the upper right corner of the Faraday cup. Once the mark in the designated area is clearly visible under the eyepiece, the current sample stage height can be considered the Z-axis reference coordinate. At this point, the robot can be controlled to click the "Zo" button on the device's touchscreen to zero the Z-axis and record the coordinate information of each mark on the screen for precise sample positioning.

[0112] The fourth algorithm SDK mentioned above can be an existing image sharpness recognition algorithm, an image sharpness recognition algorithm adjusted according to the shape and position of the mark, or other recognition algorithms. The specific settings can be made according to the actual situation, and there are no restrictions here.

[0113] In one embodiment, the adjustment assembly may further include a large knob adjustment assembly and a small knob adjustment assembly.

[0114] The process by which the host computer drives the adjustment component to adjust the optical microscope according to the resolution, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment, may include:

[0115] The host computer determines the focusing data that makes the mark reach a preset clarity threshold based on the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope and the small knob adjustment component to adjust the fine adjustment knob on the optical microscope based on the focusing data, so as to adjust the height of the sample holder, and controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment.

[0116] In this embodiment, as Figure 10 As shown, the adjustment components of this application can include not only an automatic X-axis adjustment component and an automatic Y-axis adjustment component, but also a large knob adjustment component and a small knob adjustment component. When the host computer adjusts the optical microscope according to the sharpness-driven adjustment components, it can first adjust the sample holder height to make the mark clear to complete the focusing work and reset the Z-axis coordinate to zero. As mentioned above, the host computer of this application can call the image sharpness recognition algorithm to identify the sharpness of the mark and output the VAR value to evaluate the sharpness. Therefore, the focusing process can be referred to the above, and the next action is determined by comparing the sharpness of the two focusing operations. In addition, this application can also preset a sharpness threshold. When the VAR value is greater than the threshold, the sharpness is considered to be up to standard, and the focusing process is exited. The above process is applicable to coarse and fine adjustments. After the focusing adjustment is completed, the host computer can control the operating robot to reset the Z-axis to zero, so as to use the current sample holder height as the Z-axis reference coordinate.

[0117] Furthermore, such as Figure 13 As shown, Figure 13 This is a schematic diagram of the structure of the large and small knob adjustment assembly provided in this application embodiment. The large and small knob adjustment assemblies of this application have similar structures, both consisting of an electric module, a servo rotary motor, a synchronous belt drive, a spring-loaded floating head, and a knob adjustment tool. After the electric module pushes the servo rotary motor into position, the servo rotary motor can drive the synchronous belt drive to drive the knob adjustment tool to adjust the large and small knobs. The mechanism uses a spring-loaded floating head to prevent the knob adjustment tool from over-pressing the knob, and the tool surface is covered with soft rubber to prevent scratching the knob. The servo rotary motor can monitor torque to prevent over-pressing and damage to the knob. The knob adjustment tool adjusts the coarse and fine adjustment knobs of the optical microscope by rotating the end faces of the large and small knobs.

[0118] In one embodiment, after the host computer controls the robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment, it can also perform the following operations:

[0119] The external camera is used to image the real image obtained by magnification of the objective lens. After analyzing the image obtained by the fifth optical mirror using the fifth algorithm SDK, the position coordinates of all the marks on the sample holder located around the sample are determined and the position coordinates are saved.

[0120] In this embodiment, after adjusting the height, angle, and level of the sample holder and sample stage, and controlling the operating robot to zero the XYZ axes of the electron beam exposure equipment, this application can also call an external camera to image the real image obtained by magnification of the objective lens, and use the fifth algorithm SDK to analyze the image of the fifth optical mirror after imaging to determine the position coordinates of all the marks on the sample holder around the sample, and save the position coordinates so as to position the sample during subsequent electron beam exposure, so as to accurately control the exposure of the electron beam at different positions.

[0121] It is understood that all of the above requirements in this application involve placing the target object under the objective lens. Based on the known information, the absolute position of the target object on different sample stages and the relative position between the target objects are basically fixed in this application. In this application, there is a certain business logic relationship between the requirements, so the host computer can achieve this purpose based on the above position information.

[0122] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0123] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0124] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic adjustment system for an electron beam exposure apparatus, characterized in that, The system includes a host computer, an external camera, an optical stage, an adjustment component mounted on the optical stage, and an operating robot mounted on one side of the optical stage. The optical microscope and optical microscope stage of the electron beam exposure equipment are set on the optical microscope stage. The optical microscope stage is used to load a sample holder with a fixed sample. The adjustment component and the operating robot are set around the optical microscope. The lens of the external camera is docked with the objective lens of the optical microscope. The input and output terminals of the host computer are respectively connected to the external camera, the adjustment component and the operating robot. When the host computer is working, it calls the external camera to image the real image obtained by magnification of the objective lens, and analyzes the image of the optical microscope after imaging. Based on the analysis results, it drives the adjustment component or the operating robot to adjust the sample holder on the optical microscope stage, the sample stage on the sample holder, and the optical microscope. It also controls the operating robot to perform a zeroing operation on the XYZ axis of the electron beam exposure equipment in order to adjust the sample on the sample stage.

2. The automatic adjustment system for an electron beam exposure apparatus according to claim 1, characterized in that, The system further includes: a tray docking assembly disposed between the optical mirror stage and the operating robot, the tray docking assembly being disposed opposite to the optical mirror stage; Before the host computer calls the external camera to image the real image magnified by the objective lens, it also performs the following operations: Send a sample rack handling command to the operating robot to drive the operating robot to move the sample rack with the fixed sample in the designated area to the tray docking assembly; Send a sample rack import command to the tray docking assembly to drive the tray docking assembly to import the sample rack into the optical microscope stage; Send a sample holder locking command to the operating robot to drive the operating robot to lock the sample holder to the optical microscope stage.

3. The automatic adjustment system for an electron beam exposure apparatus according to claim 1 or 2, characterized in that, When the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical mirror, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results, including: When the host computer adjusts the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnifying the objective lens, and uses the first algorithm SDK to analyze the image of the first optical mirror after imaging to determine the sample stage type on the sample holder, and drives the operating robot to adjust the sample stage according to the sample stage type.

4. The automatic adjustment system for an electron beam exposure apparatus according to claim 3, characterized in that, The process by which the host computer drives the operating robot to adjust the sample stage according to the sample stage type includes: When the host computer determines that the sample stage type is a press-type, it drives the operating robot to adjust the height and level of the sample stage using the calibration method of the press-type. When the host computer determines that the sample stage is a knob type, it drives the operating robot to adjust the height and level of the sample stage using the knob type calibration method.

5. The automatic adjustment system for an electron beam exposure apparatus according to claim 1 or 2, characterized in that, When the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image obtained by the optical mirror, and drives the operating robot to adjust the sample stage on the sample holder based on the analysis results, including: When the host computer adjusts the angle of the sample stage on the sample holder, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the second algorithm SDK to analyze the image of the second optical mirror after imaging to determine the angle information of the sample on the sample stage in the image of the second optical mirror after imaging, and drives the operating robot to adjust the angle of the sample stage according to the angle information.

6. The automatic adjustment system for an electron beam exposure apparatus according to claim 5, characterized in that, The process by which the host computer drives the operating robot to adjust the sample stage based on the angle information includes: The host computer determines the rotation angle and rotation direction to make the edge of the sample orthogonal to the image of the second optical mirror after imaging based on the angle information, and drives the operating robot to rotate the sample stage according to the rotation angle and rotation direction.

7. The automatic adjustment system for an electron beam exposure apparatus according to claim 1 or 2, characterized in that, When the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image from the optical microscope, and drives the adjustment component to adjust the sample holder on the optical microscope stage based on the analysis results. It also controls the operating robot to perform a zeroing operation on the XY axes of the electron beam exposure equipment, including: When the host computer adjusts the planar reference coordinates of the electron beam exposure equipment, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the third algorithm SDK to analyze the image of the third optical mirror after imaging to determine the position information of the Faraday cup on the sample holder in the image of the third optical mirror after imaging. Based on the position information, it drives the adjustment component to adjust the sample holder and then controls the operation robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment.

8. The automatic adjustment system for an electron beam exposure apparatus according to claim 7, characterized in that, The adjustment components include an X-axis automatic adjustment component and a Y-axis automatic adjustment component; The process by which the host computer drives the adjustment component to adjust the sample holder according to the position information, and then controls the operating robot to perform a zeroing operation on the XY axis of the electron beam exposure equipment, includes: The host computer determines the X-axis and Y-axis movement distances when the Faraday cup is positioned at the center of the scale in the image of the third optical mirror after imaging, based on the position information. The host computer drives the X-axis automatic adjustment component to adjust the distance of the sample holder in the X-axis direction according to the X-axis movement distance, and then controls the operating robot to perform a zeroing operation on the X-axis of the electron beam exposure equipment. The host computer drives the Y-axis automatic adjustment component to adjust the distance of the sample holder in the Y-axis direction according to the Y-axis movement distance, and then controls the operating robot to perform a zeroing operation on the Y-axis of the electron beam exposure equipment.

9. The automatic adjustment system for an electron beam exposure apparatus according to claim 1 or 2, characterized in that, When the host computer is working, it calls the external camera to image the real image magnified by the objective lens, analyzes the image after imaging, drives the adjustment component to adjust the optical microscope according to the analysis results, and controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment, including: When the host computer adjusts the Z-axis reference coordinate of the electron beam exposure device, it calls the external camera to image the real image obtained by magnification of the objective lens, and uses the fourth algorithm SDK to analyze the image of the fourth optical mirror after imaging. After determining the clarity of the mark on the sample holder in the image of the fourth optical mirror after imaging, it drives the adjustment component to adjust the optical microscope according to the clarity, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure device.

10. The automatic adjustment system for an electron beam exposure apparatus according to claim 9, characterized in that, The adjustment assembly also includes a large knob adjustment assembly and a small knob adjustment assembly; The process by which the host computer drives the adjustment component to adjust the optical microscope according to the resolution, and then controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment, includes: The host computer determines the focusing data that makes the mark reach a preset clarity threshold based on the clarity, and drives the large knob adjustment component to adjust the coarse adjustment knob on the optical microscope and the small knob adjustment component to adjust the fine adjustment knob on the optical microscope based on the focusing data, so as to adjust the height of the sample holder, and controls the operating robot to perform a zeroing operation on the Z-axis of the electron beam exposure equipment.

11. The automatic adjustment system for an electron beam exposure apparatus according to claim 1 or 2, characterized in that, After the host computer controls the operating robot to perform a zeroing operation on the XYZ axes of the electron beam exposure equipment, it also performs the following operations: The external camera is used to image the real image obtained by magnification of the objective lens. After analyzing the image obtained by the fifth optical mirror using the fifth algorithm SDK, the position coordinates of all the marks on the sample holder located around the sample are determined and the position coordinates are saved.

Images