Electronic device and air guiding structure

Abstract

The application discloses an electronic device and a wind guide structure. The electronic device comprises a wind guide assembly and a plurality of GPU modules. The plurality of GPU modules are arranged at intervals along a first direction. Each GPU module comprises an air inlet and an air outlet which are away from each other along the first direction. The wind guide assembly comprises a plurality of partitions which are arranged at intervals along the first direction. Each partition is located in the gap between two adjacent GPU modules and is opposite to the air outlet. The partition is used to isolate the air outlet and the air inlet of the two adjacent GPU modules. The partition isolates the air outlet and the air inlet of the two adjacent GPU modules. In this way, the hot air of the air outlet of the GPU module is blocked by the partition, thereby avoiding directly entering the air inlet of the adjacent GPU module. The GPU module inhales the cooled air for heat dissipation, and the heat dissipation efficiency is high. At the same time, the cold air around the partition can also enter the air inlet of the GPU module, thereby improving the heat dissipation effect of the GPU module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, in particular to an electronic device and a wind guide structure. BACKGROUND

[0002] With the wide application and development of artificial intelligence, Chat GPT, and the increase of large-scale data processing and computing demand, the demand for GPU servers is also increasing. GPU is the abbreviation of Graphics Processing Unit, which is a microprocessor specially used for processing image and graphics related operations. GPU server is a server equipped with a graphics processing unit (GPU), which uses the parallel computing power of GPU to improve the overall computing speed, mainly used in high-performance computing, such as data processing, machine learning, artificial intelligence, etc.

[0003] Each GPU server is usually equipped with multiple GPU modules, and the multiple GPU modules are installed densely. Since the heat dissipation of each GPU module is high, it will affect the stability of the GPU server running by affecting the densely installed GPU modules. Therefore, it is urgent to provide a GPU server device with good heat dissipation. SUMMARY

[0004] The electronic device and the wind guide structure provided by the present application improve the heat dissipation efficiency of the GPU card, thereby improving the heat dissipation performance of the electronic device.

[0005] The electronic device provided by the embodiment of the present application comprises: a wind guide assembly and multiple GPU modules, the multiple GPU modules are arranged at intervals along a first direction, and each GPU module comprises an air inlet and an air outlet which are away from each other along the first direction. The wind guide assembly comprises multiple partitions, the multiple partitions are arranged at intervals along the first direction, each partition is located in the gap between two adjacent GPU modules, and is opposite to the air outlet, and the partition is used to isolate the air outlet and the air inlet of the two adjacent GPU modules.

[0006] In the above embodiment, the partition isolates the air outlet and the air inlet of the two adjacent GPU modules. In this way, the hot air of the air outlet of the GPU module is blocked by the partition, thereby avoiding directly entering the air inlet of the adjacent GPU module. A part of the hot air flowing out of the air outlet of the GPU module bypasses the partition and enters the air inlet, and this path is relatively long compared with the path of directly entering the air inlet. During the flow in this relatively long path, the temperature of the hot air gradually decreases, and when entering the air inlet of the adjacent GPU module, the hot air has been naturally cooled. The GPU module inhales the cooled air for heat dissipation, and the heat dissipation efficiency is high. At the same time, the cold air around the partition can also enter the air inlet of the GPU module, thereby improving the heat dissipation effect of the GPU module.

[0007] In an embodiment, the air guiding assembly further comprises a cover, the plurality of partitions are installed in the cover, and the cover is arranged outside the plurality of GPU modules. The cover is used to carry the partitions, so that the air guiding assembly forms an integrated installation part, and the installation of the air guiding assembly is facilitated.

[0008] In an embodiment, the GPU module extends in a second direction, the GPU module comprises a first end and a second end arranged along the second direction, the first direction is perpendicular to the second direction, the air outlet is located at the first end, and the cover is located at the first end. The second end of the GPU module is not blocked, so that an open space is formed above the second end, air flow is facilitated, and the heat dissipation efficiency of the GPU module is improved.

[0009] In an embodiment, the cover comprises a top plate and a side plate connected to each other, and the plurality of partitions are detachably connected to the top plate and the side plate. Therefore, the partitions can be replaced in a corresponding size according to different lengths of the GPU modules, so that the air guiding assembly has a wide range of applications.

[0010] In an embodiment, the partitions divide the cover into a plurality of accommodation spaces, each of the GPU modules is located in one of the accommodation spaces, the side plate is provided with an air inlet hole at a position corresponding to each of the accommodation spaces, and the top plate is provided with an air outlet hole at a position corresponding to each of the accommodation spaces. Air outside the air guiding assembly enters the cover through the air inlet hole and flows out of the cover through the air outlet, so that air in the cover flows and the temperature of the air in the cover is reduced. In this way, the temperature of air at the air inlet of the GPU module is effectively reduced. In addition, the GPU modules in each of the accommodation spaces can obtain sufficient air flow and good exhaust effect.

[0011] In an embodiment, the electronic device further comprises a case and a mounting bracket, the case comprises a first side plate and a second side plate arranged at intervals along the first direction, the mounting bracket is connected between the first side plate and the second side plate, the air guiding assembly is mounted on the mounting bracket. The mounting bracket is used to fix the air guiding assembly to the case, so that the position of the air guiding assembly relative to the GPU module is fixed, and the heat dissipation performance is improved.

[0012] In an embodiment, the first side plate is provided with at least two mounting positions arranged at intervals along the second direction, and the mounting bracket is mounted on any one of the mounting positions. The plurality of mounting positions can adjust the position of the mounting bracket to adapt to the layout of internal components of the server. The mounting bracket can be mounted on different mounting positions according to the size of the GPU module, so that the position of the air guiding assembly is variable and can adapt to GPU modules of different sizes.

[0013] In an embodiment, the GPU module comprises a connecting member connected to the mounting bracket, which can make the GPU module firmly mounted and avoid shaking.

[0014] The embodiment of the present application further provides a wind guide structure, which comprises a cover body and a plurality of baffle groups, each of the baffle groups comprises a plurality of baffles arranged at intervals along a first direction, and each of the baffles extends along a second direction; each of the baffle groups can be detachably connected to the cover body. The lengths of any two of the baffle groups along the second direction are different, and the plurality of baffle groups can be replaced with each other to meet the size requirements of different devices to be cooled. The first direction is perpendicular to the second direction. The wind guide structure can reduce the air leakage between the devices to be cooled, so that the devices to be cooled can be cooled in the respective cooling flow channels, and the cooling efficiency is improved.

[0015] In an embodiment, the cover body comprises a top plate and a side plate connected to each other, and the plurality of baffles are connected to the top plate and the side plate, and the top plate, the side plate and the baffles are perpendicular to each other. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structural schematic diagram of an electronic device provided by an embodiment of the present application is shown;

[0017] Figure 2 A structural schematic diagram of a GPU module provided by an embodiment of the present application is shown;

[0018] Figure 3 A structural schematic diagram of a GPU module provided by an embodiment of the present application is shown;

[0019] Figure 4 A structural schematic diagram of an electronic device provided by another embodiment of the present application is shown;

[0020] Figure 5 A structural schematic diagram of a wind guide assembly provided by an embodiment of the present application is shown;

[0021] Figure 6 A structural schematic diagram of a wind guide assembly provided by an embodiment of the present application is shown;

[0022] Figure 7 An assembly diagram of a case and a mounting bracket provided by an embodiment of the present application is shown;

[0023] Figure 8 An assembly diagram of a case, a mounting bracket and a GPU module provided by an embodiment of the present application is shown.

[0024] REFERENCE NUMERALS:

[0025] 1 - air guide assembly; 2 - GPU module; M - first direction; N - second direction; 101 - partition; 201 - air inlet; 202 - air outlet; 203 - fan assembly; 204 - base plate; 205 - finned heat sink; 206 - chip assembly; 3 - case; 102 - cover; A - first end; B - second end; 1021 - top plate; 1022 - side plate; 10221 - air inlet hole; 10211 - air outlet hole; 4 - mounting bracket; 207 - connecting piece; 31 - first side plate; 32 - second side plate; 33 - third side plate; 51 - limiting H-shaped stud; 41 - first mounting arm; 411 - limiting clamping groove; 42 - cross beam; 421 - first guide hole; 422 - first fixing hole; 423 - second guide hole; 424 - second fixing hole; 2071 - second guide needle; 1023 - flange; 10231 - avoiding hole. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with examples in conjunction with the drawings.

[0027] The terms used in the following examples are only for the purpose of describing specific examples and are not intended to be limiting of the present application. As used in the specification and the appended claims, the singular forms "a," "an" and "the" are intended to include both singular as well as the plural forms, unless the context clearly indicates otherwise.

[0028] Reference in the specification to "one embodiment" or "an embodiment" or "specific embodiments" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases "in one embodiment" or "in an embodiment" or "in specific embodiments" in various places in the specification are not necessarily all referring to the same embodiment.

[0029] In some related technologies, chip-based heat dissipation (including CPU and GPU) mainly has two heat dissipation modes of air cooling and water cooling. Under the same specification power consumption, the water cooling heat dissipation capacity is stronger, but the price is expensive, so air cooling heat dissipation is mostly used. The working principle of air cooling heat dissipation is that a large amount of heat generated by CPU or GPU during work is transferred to the heat sink, causing the heat sink to heat up, and the heat sink and the surrounding air are in heat transfer under the action of the fan. When the heat dissipated by the heat sink is equal to the heat generated by the maximum power consumption of the CPU or GPU, the temperature reaches a balanced stable state.

[0030] The air enters from the air inlet side and flows out from the air outlet side, thereby taking away the heat of the GPU module. The GPU server comprises a plurality of GPU modules arranged in sequence, and the air inlet side of the GPU module is opposite to the air outlet side of an adjacent GPU module. In this way, the hot air discharged from the air outlet side of the previous GPU module is directly sucked into the next GPU module, causing the temperature of the GPU module sucking in the hot air to rise and the heat dissipation performance to decrease.

[0031] To solve the above problems, the application provides an electronic device and a wind guide structure, which can improve the heat dissipation performance of the GPU module 2, thereby improving the heat dissipation performance of the electronic device.

[0032] As shown in Figure 1 The electronic device provided by the embodiment of the application comprises a wind guide assembly 1 and a plurality of GPU modules 2. The plurality of GPU modules 2 are arranged in sequence along a first direction M, and each GPU module 2 has an air inlet 201 and an air outlet 202 which are opposite to each other along the first direction M. The wind guide assembly 1 comprises a plurality of partitions 101 which are arranged in sequence along the first direction M. Each partition 101 is located in the gap between two adjacent GPU modules 2 and is opposite to the air outlet 202. The partition 101 is used to isolate the air outlet 202 and the air inlet 201 of the two adjacent GPU modules 2. In this way, the hot air discharged from the air outlet 202 of the GPU module 2 is blocked by the partition 101, thereby avoiding direct entry into the air inlet 201 of the adjacent GPU module 2. A part of the hot air flowing out from the air outlet 202 of the GPU module 2 bypasses the partition 101 and enters the air inlet 201. This path is relatively long compared with the path of direct entry into the air inlet 201. During the flow in this relatively long path, the temperature of the discharged hot air gradually decreases. When the hot air enters the air inlet 201 of the adjacent GPU module 2, the hot air has been naturally cooled. The GPU module 2 sucks in the cooled air for heat dissipation, and the heat dissipation efficiency is relatively high. At the same time, the cold air around the partition 101 can also enter the air inlet 201 of the GPU module 2, thereby improving the heat dissipation effect of the GPU module 2.

[0033] Figure 2 The structure diagram of the GPU module provided by the embodiment of the application is shown in Figure 3 The structure diagram of the GPU module provided by the embodiment of the application is shown in Figure 2 and Figure 3As shown, in one embodiment, the GPU module 2 includes a GPU body and a fan assembly 203. The GPU body includes a chip assembly 206, a substrate 204, and a finned heatsink 205. The chip is mounted between the substrate 204 and the finned heatsink 205. Heat generated by the chip assembly 206 is transferred to the finned heatsink 205 and dissipated through it. The fan assembly 203 is mounted on the side of the GPU body away from the substrate 204 to draw in external cool air into the GPU module 2, accelerating the heat dissipation of the finned heatsink 205. The substrate 204 has multiple perforated structures, which serve as air outlets 202 for the GPU module. The fan assembly 203 draws in air for the GPU module 2, which enters the GPU body to dissipate heat for the finned heatsink 205 and the chip assembly 206, and then flows out from the air outlet 202 on the other side of the GPU module 2. The fan assembly 203 may include multiple fans, thereby improving the heat dissipation efficiency of the GPU module 2, and these multiple fans are arranged along a second direction N. When the GPU module 2 is installed in a GPU server, it can be installed in a vertical insertion mode in the electronic device slot, which reduces the space occupied and allows more GPU modules to be installed in the electronic device. Typically, GPU modules in GPU servers are installed horizontally. In this installation method, the air inlets 201 and outlets 202 of two adjacent GPU modules 2 are opposite each other. The vertical projection of the partition 101 on the substrate 204 completely covers the outlet 202, blocking the flow path of hot air from the outlet 202 and preventing hot air from directly entering the air inlets 201 of adjacent GPU modules, thus preventing the GPU module temperature from rising instead of decreasing.

[0034] Figure 4 A schematic diagram of the structure of an electronic device provided for another embodiment of this application, such as... Figure 4 As shown, the electronic device also includes a chassis 3 and a motherboard (not shown in the figure). The motherboard is mounted on the bottom surface of the chassis 3, and a plurality of slots (not shown in the figure) are spaced apart along a first direction M on the side of the motherboard facing away from the bottom surface of the chassis 3. The aforementioned plurality of GPU modules 2 are installed in a one-to-one correspondence with the slots. Specifically, each GPU module 2 includes gold fingers, which are inserted into the slots, and the GPU module 2 transmits electrical signals to the motherboard through the gold fingers.

[0035] When assembling electronic devices, first install the GPU module 2 into the slot, and then install the air guide assembly 1. Figure 5 This is a schematic diagram of the structure of the air guide assembly provided in an embodiment of this application. Figure 6 A schematic diagram of another angle air guide assembly provided for an embodiment of this application. (See attached diagram.) Figure 5 and Figure 6As shown, in order to facilitate the installation of the plurality of partitions 101, in an embodiment, the air guide assembly 1 further comprises a cover 102, the plurality of partitions 101 are installed in the cover 102, and the cover 102 is used to carry the plurality of partitions 101, so that the air guide assembly 1 forms an integrated installation piece, facilitating the installation of the partitions 101. The cover 102 covers the outside of the plurality of GPU module groups 2.

[0036] Please refer to Figure 2-4 In a further embodiment, the GPU module group 2 extends in the second direction N, and the GPU module group 2 comprises a first end A and a second end B arranged along the second direction N, the first direction M is perpendicular to the second direction N, the air outlet 202 is located at the first end A, and the cover 102 covers the first end A of the GPU module group 2. Specifically, one end of the cover 102 is closed and the other end is open along the first direction M. The cover 102 covers the first end A of the GPU module group 2, and the GPU module group 2 extends from the open end of the cover 102 to the outside of the cover 102. In this way, the space above the second end B of the GPU module group 2 is open, which is conducive to the flow of air, thereby improving the heat dissipation efficiency of the GPU module group 2

[0037] Figure 5 The structural diagram of the air guide assembly provided by the embodiment of the present application is shown in Figure 6 The structural diagram of the air guide assembly provided by the embodiment of the present application is shown in Figure 5 and Figure 6 As shown, in an embodiment, the cover 102 comprises a top plate 1021 and a side plate 1022 connected to each other, and the plurality of partitions 101 are detachably connected to the top plate 1021 and the side plate 1022. Due to the different models of the GPU module group 2, the length of the GPU module group 2 is different, and accordingly the position of the air inlet 201 is also adjusted. Therefore, the partition 101 can comprise multiple models to adapt to the position of the air inlet 201 of the GPU module group 2 of different models and shield it.

[0038] In an embodiment, the length of the partition 101 along the second direction N can be equal to the length of the top plate 1021. Alternatively, the length of the partition 101 along the second direction N can be greater than the length of the top plate 1021. Alternatively, the length of the partition 101 along the second direction N can be less than the length of the top plate 1021. When replacing partitions 101 of different lengths, the cover 102 can not be replaced, thereby saving costs.

[0039] In one embodiment, the partition 101 divides the housing 102 into multiple accommodating spaces, with each GPU module 2 located within one accommodating space. The side panels 1022 are provided with air inlets 10221 corresponding to each accommodating space, and the top panel 1021 is provided with air outlets 10211 corresponding to each accommodating space. Air from outside the air guide assembly 1 enters the housing 102 through the air inlets 10221 and exits the housing 102 through the air outlets 202, causing airflow within the housing 102 and thus reducing the air temperature within the housing 102. This effectively reduces the air temperature at the air inlet 201 of the GPU module 2. It also ensures that the GPU module 2 within each accommodating space receives sufficient airflow and achieves good exhaust performance.

[0040] Figure 7 Assembly drawings of the chassis and mounting brackets provided for embodiments of this application, such as... Figure 7 As shown, in one embodiment, the electronic device further includes a mounting bracket 4. The chassis 3 includes a first side plate 31 and a second side plate 32 spaced apart along a first direction M. The mounting bracket 4 is connected between the first side plate 31 and the second side plate 32, and the air guide assembly 1 is mounted on the mounting bracket 4. The mounting bracket is used to fix the air guide assembly 1 to the chassis 3, thereby fixing the position of the air guide assembly 1 relative to the GPU module 2.

[0041] Figure 8 Assembly drawings of the chassis, mounting bracket, and GPU module provided for embodiments of this application, in conjunction with... Figure 4 and Figure 8 In one embodiment, the chassis 3 further includes a third side plate 33, which is fixedly connected between the first side plate 31 and the second side plate 32. The mounting bracket 4, the first side plate 31, the second side plate 32, and the third side plate 33 enclose a mounting space. Multiple GPU modules 2 are located within this mounting space. Since the length of GPU modules 2 of different models and brands varies along the second direction N, and the third side plate 33 is fixedly connected to the first side plate 31 and the second side plate 32 respectively, the position of the third side plate 33 cannot be moved. In order to enable the electronic device to be compatible with GPU modules 2 of different lengths, the first side plate 31 and the second side plate 32 are respectively provided with at least two sets of mounting positions spaced apart along the second direction N, and the mounting bracket 4 can be installed in any set of mounting positions. Multiple sets of mounting positions make the distance between the mounting bracket 4 and the third side plate 33 variable, and the mounting bracket 4 can be installed in different mounting positions according to the size of the GPU module 2, so that the position of the air guide assembly 1 is variable and adaptable to GPU modules 2 of different sizes.

[0042] The mounting bracket 4 can be connected to different mounting positions of the case 3 by connecting members such as fixing pins or screws. In a specific embodiment, a plurality of limiting dowels 51 are arranged on the first side plate 31 and the second side plate 32 respectively, and the limiting dowels 51 on each side plate are spaced apart by a predetermined distance. The limiting dowels 51 on the first side plate 31 correspond to the limiting dowels 51 on the second side plate 32 one by one. The mounting bracket 4 includes a first mounting arm 41 and a second mounting arm (not shown in the figure), and the first mounting arm 41 is connected to the first side plate 31 and the second mounting arm is connected to the second side plate 32. The first mounting arm 41 and the second mounting arm are respectively spaced apart by a plurality of limiting clamping grooves 411. The spacing of the limiting clamping grooves 411 is the same as the spacing of the limiting dowels 51. The limiting dowels 51 are clamped in the limiting clamping grooves 411 to fix the mounting bracket 4 to the case 3.

[0043] The limiting clamping groove 411 is a hole structure, and the shape of the hole structure can be approximately triangular, with the top narrow and the bottom wide. During installation, the limiting dowel 51 is inserted through the wider position of the limiting clamping groove 411, and then the mounting arm is moved downward so that the limiting dowel 51 is clamped at the narrower top position of the limiting clamping groove 411. The mounting bracket 4 falls under the action of gravity and is clamped firmly with the limiting dowel 51.

[0044] In combination Figure 4-8 In an embodiment, the GPU module 2 includes a connecting member 207 connected to the mounting bracket 4 for fixing the GPU module 2 and the mounting bracket 4 together. The connecting member 207 can be located at the first end A of the GPU module 2. Specifically, the mounting bracket 4 further includes a cross beam 42 connected between the first mounting arm 41 and the second mounting arm, and the cross beam 42 extends along the first direction M. The cross beam 42 is provided with a first guide hole 421, a first fixing hole 422, a second guide hole 423, and a second fixing hole 424. The cover body 102 is provided with a flange 1023 for connecting with the mounting bracket 4, and the flange 1023 is connected to the side plate 1022. The flange 1023 is provided with a first guide pin (not shown in the figure) corresponding to the first guide hole 421, and during installation, the first guide pin is inserted into the first guide hole 421 to realize the alignment of the air guide assembly 1 and the mounting bracket 4. The connecting member 207 of the GPU module 2 is provided with a second guide pin 2071 corresponding to the second guide hole 423, and the second guide pin 2071 is inserted into the second guide hole 423 to realize the alignment of the GPU module 2 and the mounting bracket 4. Then the air guide assembly 1 is connected with the first fixing hole 422 by a screw, and the GPU module 2 is connected with the second fixing hole 424. The flange 1023 is provided with an avoiding hole 10231 and a mounting through hole, and the avoiding hole 10231 is used for avoiding the connecting member 207. After the cover body 102 is installed on the mounting bracket 4, the connecting member 207 can be exposed outside the cover body 102, which is convenient for users to maintain the GPU module 2.

[0045] The first fixing hole 422 and the second fixing hole 424 can be a tapping hole, and a hole wall of the tapping hole is provided with a thread, and the air guide assembly 1 can be fixed to the tapping hole through a screw passing through the mounting through hole. When assembling, the GPU module is first connected to the mounting bracket 4, and then the air guide assembly 1 is connected to the mounting bracket 4.

[0046] In combination Figure 4-6 , the embodiment of the present application also provides an air guide structure, which comprises a cover body 102 and a plurality of baffle groups, each baffle group comprising a plurality of baffles 101 arranged at intervals along a first direction M, each baffle 101 extending along a second direction N, and the first direction M being perpendicular to the second direction N. Wherein each baffle group in the plurality of baffle groups can be detachably connected to the cover body 102. After the air guide structure is installed on the equipment, each baffle 101 is used to isolate two adjacent devices to be cooled in the equipment. The device to be cooled is a device with an independent cooling fan, and the air inlet 201 and the air outlet 202 thereof are opposite to each other. The baffle 101 can block the cooling channel between the two adjacent devices to be cooled, so as to avoid that the hot air flowing out of the air outlet 202 of the previous device to be cooled directly enters the air inlet 201 of the next device to be cooled, thereby causing the temperature of the device to be cooled to rise and reducing the cooling efficiency. The air guide structure can reduce the air leakage problem between the devices to be cooled, so that the devices to be cooled can cool in their respective cooling flow channels, thereby improving the cooling efficiency.

[0047] The lengths of any two baffle groups along the second direction N are different, so that the air guide structure can be compatible with different lengths, models and brands of devices to be cooled with independent cooling fans. At the same time, the replaceable baffle group can also reduce the production cost of the air guide structure.

[0048] The device to be cooled can be a GPU module 2, a CPU module or the like chip module.

[0049] In an embodiment, the cover body 102 comprises a top plate 1021 and a side plate 1022 connected to each other, and the plurality of baffles 101 are connected to the top plate 1021 and the side plate 1022, and the top plate 1021, the side plate 1022 and the baffles 101 are perpendicular to each other.

[0050] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. An electronic device, characterized in that, include: The system includes an air guide assembly and multiple GPU modules, wherein the multiple GPU modules are arranged at intervals along a first direction, and each GPU module includes an air inlet and an air outlet that are opposite to each other along the first direction. The air guide assembly includes a cover and multiple partitions. The multiple partitions are installed inside the cover. The cover covers the outside of the multiple GPU modules. The multiple partitions are spaced apart along the first direction. Each partition is located in the gap between two adjacent GPU modules and is opposite to the air outlet. The partition is used to isolate the air outlet and the air inlet of two adjacent GPU modules. The GPU module extends in a second direction, and the GPU module includes a first end and a second end arranged along the second direction. The first direction is perpendicular to the second direction. The air outlet is located at the first end, and the cover is located at the first end.

2. The electronic device according to claim 1, characterized in that, The cover includes a top plate and side plates that are connected to each other, and the plurality of partitions are detachably connected to the top plate and the side plates.

3. The electronic device according to claim 2, characterized in that, The partition divides the cover into multiple storage spaces, with each GPU module located in one of the storage spaces. The side panels are provided with air inlets at positions corresponding to each storage space, and the top panels are provided with air outlets at positions corresponding to each storage space.

4. The electronic device according to claim 1, characterized in that, The electronic device further includes a chassis and a mounting bracket. The chassis includes a first side plate and a second side plate spaced apart along the first direction. The mounting bracket is connected between the first side plate and the second side plate, and the air guide assembly is mounted on the mounting bracket.

5. The electronic device according to claim 4, characterized in that, The first side plate has at least two mounting positions spaced apart along the second direction, and the mounting bracket is installed at any one of the mounting positions, wherein the second direction is perpendicular to the first direction.

6. The electronic device according to claim 4, characterized in that, The GPU module includes a connector that is connected to the mounting bracket.

7. An air guiding structure, characterized in that, Installed in an electronic device, the electronic device includes multiple heat-dissipating devices spaced apart along a first direction. The air guiding structure includes a cover and multiple partition groups. Each partition group includes multiple partitions spaced apart along the first direction. Each partition extends along a second direction. Each partition is used to isolate two adjacent heat-dissipating devices. The heat-dissipating devices are devices with their own cooling fans. The air inlets and outlets of the heat-dissipating devices are opposite to each other, and the partition is opposite to the air outlet. Each partition group is detachably connected to the cover. Any two partition groups have different lengths along the second direction. The first direction is perpendicular to the second direction.

8. The air guiding structure according to claim 7, characterized in that, The cover includes a top plate and side plates connected to each other, and a plurality of partitions are connected to the top plate and the side plates, with the top plate, the side plates and the partitions being perpendicular to each other.

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