Burning test device

Abstract

The invention provides a burning test device, relates to the technical field of burning, and is used for solving the technical problem of burning complexity. The burning test device is used for burning or testing the compression additional memory module and comprises a bottom plate, a supporting and fixing device and a probe, the supporting and fixing device is used for placing the compression additional memory module and is configured to be fixedly connected with the compression additional memory module, and the probe is arranged on the supporting and fixing device. The end, away from the bottom plate, of the probe abuts against the surface, facing the bottom plate, of the compression additional memory module, the bottom plate is further provided with a golden finger, the golden finger is electrically connected with the probe and electrically connected with the terminal, and the terminal controls the probe to burn or test the compression additional memory module. Through the supporting and fixing device, fixation of burning of the compression additional memory module is achieved, burning of the compression additional memory module and input of a test signal are achieved through the probe, electrical connection between a golden finger of the bottom plate and a terminal is facilitated, single burning and testing of the compression additional memory module are achieved, and burning is convenient.

Description

Technical Field

[0001] The present disclosure relates to the technical field of burning, and in particular to a burning test device. Background Art

[0002] With the continuous development of integrated circuit technology, electronic products are becoming increasingly miniaturized for easy portability. As the computing and processing module of electronic products, the performance of memory (also known as internal storage) is crucial. In order to reduce power consumption and improve heat dissipation, the Compression Attached Memory Module (CAMM) came into being. It is usually necessary to burn program data of specific functions into the compression attached memory module and perform tests to achieve specific functions. However, the burning of the compression attached memory module usually requires the use of a specific machine, and there is a lack of a universal burning and testing device, which makes the burning complicated. Summary of the invention

[0003] In view of the above problems, an embodiment of the present disclosure provides a burning and testing device to facilitate the burning and testing of a compressed additional memory module.

[0004] According to some embodiments, the present disclosure provides a burning test device for burning or testing a compressed additional memory module, the burning test device comprising a base plate, and a supporting fixture and a probe arranged on the base plate, the supporting fixture is used to place the compressed additional memory module, and is configured to be fixedly connected to the compressed additional memory module, and an end of the probe away from the base plate is used to abut against a surface of the compressed additional memory module facing the base plate;

[0005] The base plate is also provided with a gold finger, the gold finger is electrically connected to the probe and to the terminal, and the terminal controls the probe to burn or test the compressed additional memory module.

[0006] In some possible embodiments, the compressed additional memory module has at least two through holes arranged at intervals;

[0007] The supporting and fixing device includes at least two supporting columns spaced apart on the base plate, and a positioning column and a pressing portion connected to each of the supporting columns, wherein the positioning column passes through the supporting column and contacts the base plate, and the positioning column also protrudes from the supporting column, the number of the positioning columns is less than or equal to the number of the through holes, and each of the positioning columns corresponds to one of the through holes.

[0008] In some possible embodiments, the pressing portion includes an extension plate, a rotating shaft and a pressing plate;

[0009] The extension plate is fixedly connected to the side of the support column, the rotating shaft is rotatably connected to the extension plate and protrudes from one end of the extension plate away from the bottom plate, the end of the rotating shaft away from the bottom plate is fixedly connected to the pressure plate, and the pressure plate is spaced apart from the extension plate.

[0010] In some possible embodiments, the surface of the extension plate away from the base plate is flush with the surface of the support column away from the base plate, and the distance between the surfaces of the pressure plate and the extension plate facing each other is greater than or equal to the thickness of the compressed additional memory module.

[0011] In some possible embodiments, a center line of the rotating shaft, a center line of the positioning column, and a center line of the supporting column are parallel to each other.

[0012] In some possible embodiments, the extension plate and the support column are an integral structure, and / or the pressure plate and the rotating shaft are an integral structure.

[0013] In some possible embodiments, an extension length of the pressing plate is smaller than an extension length of the extending plate, and the pressing plate and the positioning column are spaced apart.

[0014] In some possible embodiments, three support columns are provided, and the three support columns are respectively opposite to three edges of the compression additional memory module, and the three extension plates extend in the same direction.

[0015] In some possible embodiments, two of the three support columns are disposed opposite to each other, and another support column is disposed between the two oppositely disposed support columns, and the three support columns are respectively located at three vertices of a virtual triangle.

[0016] In some possible embodiments, the probe includes a sleeve, a compression spring and a needle, the sleeve is fixedly connected to the base plate, the compression spring is arranged in the sleeve, one end of the compression spring is against the sleeve, and the other end is fixedly connected to one end of the needle, and the other end of the needle protrudes out of the sleeve.

[0017] In some possible embodiments, when the compression spring is at a free length, the distance between the needle and the pressure plate is smaller than the thickness of the compression additional memory module.

[0018] In some possible embodiments, at least two of the through holes include a copper-clad through hole and a limiting through hole, and the copper-clad through hole is covered with a copper layer;

[0019] The plurality of positioning posts include a first positioning post and a second positioning post. The first positioning post is made of a conductive material. The first positioning post is inserted into the copper-clad through hole. The first positioning post is in contact with the copper layer and is electrically connected to the gold finger. The second positioning post is inserted into the limiting through hole.

[0020] In some possible embodiments, the base plate is provided with a first wiring, the first wiring is connected to the ground end of the gold finger and is in contact with the first positioning column.

[0021] In some possible embodiments, there are multiple probes, and the base plate is provided with a second routing line and multiple third routing lines. The second routing line is connected to the power supply end of the gold finger and to one of the probes, and each of the third routing lines is connected to a data end of the gold finger and to one of the remaining probes.

[0022] In some possible embodiments, the terminal includes elastic protrusions arranged opposite to each other, and the opposite edges of the base plate are further provided with positioning notches, and the positioning notches are in corresponding contact with the elastic protrusions to clamp the base plate and the terminal.

[0023] The burning test device provided by the embodiment of the present disclosure has at least the following advantages:

[0024] The burning test device provided by the embodiment of the present disclosure is used for burning or testing a compressed additional memory module, and includes a base plate, and a supporting and fixing device and a probe arranged on the base plate. The supporting and fixing device is used to place the compressed additional memory module, and is configured to be fixedly connected to the compressed additional memory module, and the end of the probe away from the base plate is used to abut against the surface of the compressed additional memory module facing the base plate. The base plate is also provided with a gold finger, and the gold finger is electrically connected to the probe and electrically connected to the terminal, and the terminal controls the probe to burn or test the compressed additional memory module. The burning and fixing of the compressed additional memory module is achieved through the supporting and fixing device, and the burning and test signal input of the compressed additional memory module is achieved through the probe, and the gold finger of the base plate can be used to achieve electrical connection with the terminal, thereby realizing the single-body burning and testing of the compressed additional memory module, without the need for a specific machine and code, and can achieve portability in different environments and occasions, which is convenient for product research and development, verification and problem analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of a compressed additional memory module in an embodiment of the present disclosure;

[0026] Figure 2 is a top view of a cover plate in an embodiment of the present disclosure;

[0027] Figure 3It is a structural schematic diagram of a burning test device in an embodiment of the present disclosure;

[0028] Figure 4 is a top view of a burning test device in an embodiment of the present disclosure;

[0029] Figure 5 It is a side view of a burning test device in one embodiment of the present disclosure.

[0030] Description of reference numerals:

[0031] 10-compression additional memory module; 11-interconnect area;

[0032] 12- copper-clad through hole; 13- limiting through hole;

[0033] 20-cover plate; 30-bottom plate;

[0034] 31-Gold finger; 32-Positioning notch;

[0035] 41-support column; 42-positioning column;

[0036] 43-extension plate; 44-rotating shaft;

[0037] 45-pressing plate; 51-sleeve;

[0038] 52-needle. DETAILED DESCRIPTION

[0039] The disclosed embodiment provides a burning and testing device for burning and testing a compressed additional memory module, including a base plate, a supporting and fixing device, and a probe. The base plate provides support and is provided with a gold finger. The supporting and fixing device is used to place the compressed additional memory module and is fixedly connected to the compressed additional memory module. The probe is used to contact the compressed additional memory module. The gold finger is electrically connected to the probe and to a terminal. The terminal controls the probe to burn or test the compressed additional memory module. Through the electrical connection of the probe, the gold finger, and the terminal, the single-body burning and testing of the compressed additional memory module is realized without the need for a specific machine and code, and the burning and testing is convenient.

[0040] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0041] See also Figures 1 to 5The embodiment of the present disclosure provides a burning test device for burning or testing a compression attached memory module 10 (Compression Attached Memory Module, CAMM for short). The compression attached memory module 10 can be applied to a notebook computer or other electronic products to provide higher memory frequency and capacity.

[0042] See also Figure 1 and Figure 2 The compression additional memory module 10 is arranged on the mainboard through a compression connector, and the mainboard is supported by a back plate. The compression additional memory module 10 is covered with a cover plate 20 (Bracket), and the cover plate 20, the compression additional memory module 10, the compression connector, the mainboard and the back plate are fixedly connected to form a whole by screws. Among them, the cover plate 20, the compression additional memory module 10, the compression connector, the mainboard and the back plate are stacked in sequence.

[0043] Continue reading Figure 1 The compressed additional memory module 10 has a plurality of through holes arranged at intervals, and the plurality of through holes all penetrate the compressed additional memory module 10. At least some of the plurality of through holes correspond to mounting screws, and the compressed additional memory module 10 is fixed by the screws. Exemplarily, a screw is respectively mounted in each through hole, or a screw is respectively mounted in a plurality of through holes in the same row along a first direction, wherein the first direction may be the length direction of the compressed additional memory module 10.

[0044] For some possible examples, see Figure 1 The side of the compression additional memory module 10 facing the mainboard has four interconnection areas 11 arranged at intervals along the first direction and arranged at intervals along the second direction. The interconnection area 11 has a signal pin for interconnecting with the compression connector, and then interconnecting with the mainboard. Part of the area of ​​the compression additional memory module 10 can be a copper layer, and the four interconnection areas 11 and a plurality of through holes are arranged on the copper layer.

[0045] The first direction crosses the second direction, for example, they are perpendicular. The first direction may be the length direction of the compression additional memory module 10, and the second direction may be the width direction of the compression additional memory module 10. In addition, a chip is disposed on the other side (the side away from the motherboard) of the compression additional memory module 10, for example, the chip may be a dynamic random access memory (DRAM) chip.

[0046] The plurality of through holes of the compressed additional memory module 10 include copper-clad through holes 12, and the copper-clad through holes 12 may be provided in plurality, for example, three, and these copper-clad through holes 12 are arranged at intervals along the first direction. The copper-clad through hole 12 refers to a through hole whose hole wall is covered with a copper layer, for example, formed by electroplating copper on the hole wall of the through hole. Along the first direction, each copper-clad through hole 12 is staggered with the interconnection area 11; along the second direction, the plurality of copper-clad through holes 12 are located between two interconnection areas 11. Each of the plurality of copper-clad through holes 12 is respectively connected to a screw, and the screw is often connected to a ground contact of the motherboard.

[0047] The plurality of through holes of the compression additional memory module 10 also include a limiting through hole 13, and there is no copper in the limiting through hole 13. The limiting through hole 13 is used to limit the position of the compression additional memory module 10 on the motherboard. There can be a plurality of limiting through holes 13, for example, three, and the three limiting through holes 13 form a virtual triangle, and the three limiting through holes 13 are respectively located at the three vertices of the virtual triangle. The three limiting through holes 13 are located on both sides of the virtual straight line formed by the three copper-clad through holes 12. Figure 1 As shown, two of the three limiting through holes 13 are located on the upper side of the three copper-clad through holes 12 , and the other limiting through hole 13 is located on the lower side of the three copper-clad through holes 12 .

[0048] See also Figure 1 and Figure 3 , the compressed additional memory module 10 needs to be burned and tested by serial presence detection (Serial Presence Detect, referred to as SPD) using a burning test device to ensure that the compressed additional memory module 10 achieves specific functions. The burning test device includes a base plate 30, a supporting fixture and a probe, and the supporting fixture and the probe are both arranged on the base plate 30. For example, the supporting fixture and the probe are located on the middle area of ​​the board surface of the base plate 30, the supporting fixture is used to place the compressed additional memory module 10, and is configured to be fixedly connected to the compressed additional memory module 10, and the end of the probe away from the base plate 30 is used to abut against the surface of the compressed additional memory module 10 facing the base plate 30, so as to burn or test the compressed additional memory module 10.

[0049] The bottom plate 30 may be a flat plate, for example, the bottom plate 30 is a printed circuit board (PCB). A gold finger 31 may be provided at the edge of the bottom plate 30, and there may be a plurality of gold fingers 31, which are spaced apart at the edge of the bottom plate 30. For example, Figure 3As shown, a plurality of gold fingers 31 are provided on the left side of the bottom plate 30. The gold fingers 31 are electrically connected to the probe and to the terminal, so that the gold fingers 31 are electrically connected to the terminal, and the terminal controls the probe to burn or test the compressed additional memory module 10. The terminal can be a computer, and the gold fingers 31 are in contact with the slot of the computer.

[0050] The two opposite edges of the bottom plate 30 are also provided with positioning notches 32, respectively. The terminal includes elastic protrusions arranged opposite to each other. The positioning notches 32 are in corresponding contact with the elastic protrusions to clamp the bottom plate 30 and the terminal. When the two elastic protrusions are respectively located in the two positioning notches 32, the elastic protrusions clamp the bottom plate 30, so that the bottom plate 30 and the terminal are relatively fixed, and the gold finger 31 is electrically connected to the terminal. Among them, the positioning notch 32 can be U-shaped, and the positioning notch 32 and the gold finger 31 are respectively located on the three edges of the bottom plate 30, so as to avoid the positioning notch 32 and the gold finger 31 being located on the same edge, thereby ensuring the contact between the gold finger 31 and the terminal.

[0051] A plurality of spaced-apart wirings (not shown) may be provided in the base plate 30, and the plurality of wirings may be located inside the base plate 30 or on the top surface of the base plate 30. In some possible examples, the plurality of wirings include a first wiring, a second wiring, and a plurality of third wirings, and the first wiring is connected to the ground terminal of the gold finger 31 and to the supporting fixture. The second wiring is connected to the power terminal of the gold finger 31 and to a probe. Each third wiring is connected to a data terminal of the gold finger 31 and to one of the remaining probes, so that the terminal is electrically connected to the probe, and the terminal uses the gold finger 31, the second wiring, and the third wiring to control the probe to burn or test the compressed additional memory module 10.

[0052] See also Figures 3 to 5 The supporting and fixing device includes at least two supporting columns 41, and at least two supporting columns 41 are arranged on the bottom plate 30 at intervals. For example, the bottom surface of each supporting column 41 is fixedly connected to the top surface of the bottom plate 30. The supporting and fixing device also includes a positioning column 42 and a pressing part correspondingly connected to each supporting column 41. Each supporting column 41, and the positioning column 42 and the pressing part connected to the supporting column 41 are a group of supporting columns 41, positioning columns 42 and pressing parts. Through multiple groups of supporting columns 41, positioning columns 42 and pressing parts, the compressed additional memory module 10 is supported and fixed.

[0053] In some examples, three support columns 41 are provided, which has better stability. The three support columns 41 are respectively opposite to the three edges of the compression additional memory module 10, so that the spacing between the support columns 41 is larger and the distribution is more uniform.

[0054] Exemplarily, two of the three support columns 41 are arranged opposite to each other, and another support column 41 is arranged between the two oppositely arranged support columns 41. The three support columns 41 are respectively located at three vertices of a virtual triangle, that is, the three support columns 41 are not in a straight line, and the three support columns 41 are distributed in a triangular shape. By utilizing the stability of the triangle, the positioning and supporting effects are better.

[0055] The support column 41 may be a cylinder, an elliptical column or a rectangular column, and the cross-sectional dimension of the support column 41 is 2-4 cm. When the support column 41 is a cylinder, the cross-sectional dimension refers to the diameter dimension, when the support column 41 is an elliptical column, the cross-sectional dimension refers to the major axis dimension, and when the support column 41 is a rectangular column, the cross-sectional dimension refers to the side length dimension.

[0056] Along the extension direction of the support column 41, one of the two opposite end faces of the support column 41 is connected to the bottom plate 30. The support column 41 is also provided with a mounting hole penetrating the support column 41, the mounting hole exposes the bottom plate 30, and the mounting hole is used to install the positioning column 42. The support column 41 is an insulating column, that is, the material of the support column 41 is an insulating material, which can isolate most of the positioning columns 42.

[0057] Each support column 41 is provided with a positioning column 42, the cross-sectional dimension of the positioning column 42 is smaller than the cross-sectional dimension of the support column 41, and the top surface of the positioning column 42 is higher than the top surface of the support column 41. Exemplarily, the positioning column 42 is provided in the mounting hole and fixedly connected with the support column 41, for example, the positioning column 42 is interference fit with the mounting hole. The height of the positioning column 42 is greater than the height of the support column 41, one end of the positioning column 42 is in contact with the bottom plate 30, and the other end protrudes from the surface of the support column 41 away from the bottom plate 30, that is, the positioning column 42 passes through the support column 41 and protrudes from the support column 41.

[0058] In this way, a step is formed between the positioning column 42 and the support column 41, and the end surface of the support column 41 not blocked by the positioning column 42 is a step surface, which can be used to support the compressed additional memory module 10. The axis of the mounting hole can coincide with the axis of the support column 41, so that the step surface is evenly distributed along the circumference of the positioning column 42.

[0059] The positioning column 42 cooperates with the through hole of the compressed additional memory module 10, the number of the positioning column 42 is less than or equal to the number of the through holes, each positioning column 42 corresponds to and adapts to a through hole, for example, the cross-sectional size of the positioning column 42 is less than or equal to the aperture of the through hole, wherein the cross-sectional size of the positioning column 42 refers to the maximum distance between two points at the edge of the cross section of the positioning column 42, and the cross section of the positioning column 42 is perpendicular to the axis of the positioning column 42.

[0060] In the example where the multiple through holes include a copper-clad through hole 12 and a limiting through hole 13, and the copper-clad through hole 12 is covered with a copper layer, the multiple positioning pillars 42 include a first positioning pillar and a second positioning pillar, the first positioning pillar is penetrated into the copper-clad through hole 12, the first positioning pillar is in contact with the copper layer and is electrically connected to the gold finger 31, the second positioning pillar is penetrated into the limiting through hole 13, and the material of the first positioning pillar is a conductive material.

[0061] The number of the first positioning posts is less than or equal to the number of the copper-clad through holes 12. For example, the number of the first positioning posts is two. The two first positioning posts are arranged opposite to each other, and the number of the copper-clad through holes 12 is three. Each first positioning post is correspondingly penetrated in a copper-clad through hole 12. That is, two copper-clad through holes 12 located on both sides of the three copper-clad through holes 12 are respectively correspondingly penetrated with a first positioning post, and the copper-clad through hole 12 located in the middle is left vacant.

[0062] The number of the second positioning posts is less than or equal to the number of the limiting through holes 13. For example, the number of the second positioning posts is one, and the number of the limiting through holes 13 is three. The second positioning post is correspondingly penetrated in one limiting through hole 13, that is, the second positioning post is penetrated in the middle limiting through hole 13 among the three limiting through holes 13, and the other two limiting through holes 13 are vacant.

[0063] In this arrangement, the copper-clad through holes 12 and the limiting through holes 13 of the compression additional memory module 10 are used to realize the positioning and cooperation with the burning test device, and there is no need to set additional through holes for accommodating the first positioning column and the second positioning column on the compression additional memory module 10, thereby reducing the secondary processing of the compression additional memory module 10. In addition, the copper-clad through holes 12 on both sides and the limiting through holes 13 in the middle are respectively used to cooperate with the first positioning column and the second positioning column, and the distance between the first positioning columns and the second positioning column is relatively far, so the positioning and supporting effects of the compression additional memory module 10 are better, and the cooperation with the compression additional memory module 10 is stable.

[0064] In order to realize the grounding of the compressed additional memory module 10, in some possible examples, the first positioning column is a conductive column, that is, the material of the first positioning column is a conductive material. The first positioning column contacts the copper layer of the copper-clad through hole 12 to realize the electrical connection between the first positioning column and the copper layer. The first positioning column is also electrically connected to the gold finger 31, for example, electrically connected to the ground end of the gold finger 31.

[0065] In some possible implementations, one end of the first positioning post ( Figure 3The bottom end of the bottom plate 30 is in contact with the first wiring in the bottom plate 30 to be electrically connected to the first wiring. The first wiring is connected to the ground end of the gold finger 31, so that the first positioning column is electrically connected to the ground end of the gold finger 31, and the first positioning column is used to realize the grounding of the compression additional memory module 10, without the need to ground the compression additional memory module 10 separately.

[0066] In some examples, the second positioning post can also be a conductive post, that is, the material of the second positioning post is also a conductive material, for example, the same material as the first positioning post, which is convenient for manufacturing the first positioning post and the second positioning post. The second positioning post passes through the limiting through hole 13, and it can contact the limiting through hole 13, and the second positioning post does not contact any of the wirings in the bottom plate 30.

[0067] Continue reading Figures 3 to 5 A pressing part is correspondingly arranged on each support column 41, and the pressing part includes an extension plate 43, a rotating shaft 44 and a pressing plate 45. The extension plate 43 is fixedly connected to the side of the support column 41, the rotating shaft 44 is rotatably connected to the extension plate 43, and protrudes from one end of the extension plate 43 away from the bottom plate 30, and the pressing plate 45 is fixedly connected to one end of the rotating shaft 44 away from the bottom plate 30, and the pressing plate 45 is spaced apart from the extension plate 43.

[0068] The extension plate 43 is connected to the side of the support column 41, for example, by welding or the extension plate 43 and the support column 41 are an integral structure, so that the plate surface of the extension plate 43 has a large space for setting the rotating shaft 44. The extension plate 43 can be a flat plate, and the support column 41 is a cylinder. The extension plate 43 and the support column 41 have a smooth transition, and the width can be smaller than the diameter of the support column 41.

[0069] In some examples, the surface of the extension plate 43 away from the base plate 30 is flush with the surface of the support column 41 away from the base plate 30, that is, the top surface of the extension plate 43 is flush with the top surface of the support column 41, so that the top surface of the extension plate 43 and the top surface of the support column 41 can jointly provide support for the compressed additional memory module 10, increase the contact area between the supporting fixing device and the compressed additional memory module 10, and make the compressed additional memory module 10 better in stability during burning and testing.

[0070] In the example where three support columns 41 are provided, the three extension plates 43 extend in the same direction. Figure 3 and Figure 4 As shown, the three extension plates 43 extend along the first direction to reduce the interference between the pressure plate 45 and the compression additional memory module 10. The extension plates 43 on the two oppositely arranged support columns 41 extend in a direction away from each other, such as Figure 3As shown, the extension plate 43 of the support column 41 close to the gold finger extends in the direction close to the gold finger, and the extension plate 43 of the support column 41 far from the gold finger extends in the direction far from the gold finger. In this way, the rotation shafts 44 on the two extension plates 43 are located outside the compression additional memory module 10, and the corresponding pressing plates 45 can rotate a full circle to ensure the compression effect of the compression additional memory module 10.

[0071] Continue reading Figures 3 to 5 , one end of the shaft 44 is connected to the extension plate 43, and the other end passes through the pressure plate 45. The shaft 44 is fixedly connected to one of the extension plate 43 and the pressure plate 45, and the other is rotatably connected. That is, the shaft 44 is fixedly connected to the extension plate 43 and rotatably connected to the pressure plate 45; or the shaft 44 is rotatably connected to the extension plate 43 and fixedly connected to the pressure plate 45, for example, the pressure plate 45 and the shaft 44 are an integral structure. Among them, the center line of the shaft 44, the center line of the positioning column 42, and the center line of the support column 41 are parallel to each other, reducing the restriction problem of the compression additional memory module 10 caused by the mismatch between the shaft 44 and the positioning column 42, and while positioning the compression additional memory module 10, the compression additional memory module 10 can also be better pressed.

[0072] The pressure plate 45 is connected to the rotating shaft 44, and the extension length of the pressure plate 45 is smaller than the extension length of the extension plate 43. The pressure plate 45 is spaced apart from the positioning column 42. Exemplarily, the rotating shaft 44 is located at the part of the extension plate 43 away from the support column 41, and one end of the pressure plate 45 is connected to the rotating shaft 44. The extension length of the pressure plate 45 is smaller than the extension length of the extension plate 43 to avoid interference between the pressure plate 45 and the positioning column 42 when the pressure plate 45 rotates.

[0073] The pressing plate 45 is spaced apart from the extension plate 43, wherein the pressing plate 45 may be a flat plate, for example, the pressing plate 45 is parallel to the extension plate 43, so that the pressing plate 45 and the extension plate 43 are equidistant from each other. The spacing between the surfaces of the pressing plate 45 and the extension plate 43 facing each other is greater than or equal to the thickness of the compressed additional memory module 10, so that the additional memory module can be arranged between the pressing plate 45 and the extension plate 43, and the additional memory module is pressed and fixed by the pressing plate 45. When the compressed additional memory module 10 is fixedly connected to the supporting and fixing device, the surfaces of the pressing plate 45 and the compressed additional memory module 10 facing each other are pressed against each other, that is, the pressing plate 45 is pressed against the top surface of the compressed additional memory module 10.

[0074] In some examples, the distance between the surfaces of the pressing plate 45 and the extending plate 43 facing each other is equal to the thickness of the compression additional memory module 10. When the compression additional memory module 10 is fixedly connected to the supporting fixture, the pressing plate 45 and the extending plate 43 both abut against the compression additional memory module 10, that is, the pressing plate 45 abuts against the top surface of the compression additional memory module 10, and the extending plate 43 abuts against the bottom surface of the pressing plate 45, and the extending plate 43 also supports the compression additional memory module 10.

[0075] In the above example, the top surface of the extension plate 43 is flush with the top surface of the support column 41, and the top surface of the extension plate 43 and the top surface of the support column 41 are both in contact with the bottom surface of the compression additional memory module 10. The extension plate 43 and the support column 41 provide support for the compression additional memory module 10, and the compression additional memory module 10 is relatively stable.

[0076] In other examples, the distance between the surfaces of the pressing plate 45 and the extension plate 43 facing each other is greater than the thickness of the compression additional memory module 10. When the compression additional memory module 10 is fixedly connected to the support fixture, the pressing plate 45 abuts against the compression additional memory module 10, that is, the pressing plate 45 abuts against the top surface of the compression additional memory module 10, and the extension plate 43 does not contact the compression additional memory module 10, and the compression additional memory module 10 is not supported by the extension plate 43. In the above example, the top surface of the extension plate 43 can be flush with the top surface of the support column 41. At this time, the compression additional memory module 10 is supported by the probe, which can ensure reliable contact between the probe and the compression additional memory module 10.

[0077] Continue reading Figures 3 to 5 , multiple probes may be provided, and one end of each of the multiple probes is fixedly connected to the bottom plate 30. For example, four probes are provided, and three of the four probes are arranged at intervals along the second direction, and another probe is located beside the three probes. The positions of the four probes are relatively fixed, such as Figure 4 As shown, three probes located in the same column along the second direction are respectively a first probe, a second probe and a third probe, and another probe is a fourth probe, wherein the first probe is connected to the HSCL pin (clock pin) of the compressed additional memory module 10, the second probe is connected to the HSDA pin (data pin) of the compressed additional memory module 10, the third probe is connected to the HAS pin (address pin) of the compressed additional memory module 10, and the fourth probe is connected to the Power pin (power pin) of the compressed additional memory module 10.

[0078] The multiple probes can all be retractable probes to ensure good contact between the probes and the compressed additional memory module 10. In some examples, the probe includes a sleeve 51, a compression spring and a needle 52, the sleeve 51 is fixedly connected to the bottom plate 30, the compression spring is arranged in the sleeve 51, and one end of the compression spring is against the sleeve 51, and the other end is fixedly connected to one end of the needle 52, and the other end of the needle 52 extends out of the sleeve 51.

[0079] One end of the sleeve 51 is fixedly connected to the bottom plate 30. The sleeve 51 is hollow and has an opening at least at one end away from the bottom plate 30, so that the needle 52 can extend from the side of the sleeve 51 away from the bottom plate 30 to contact the compressed additional memory module 10 to achieve burning or testing. A compression spring is provided in the sleeve 51, one end of the compression spring is against the bottom of the sleeve 51, and the other end is fixedly connected to one end of the needle 52. The other end of the needle 52 is located outside the sleeve 51 to connect with the compressed additional memory module 10. The diameter of the sleeve 51 is less than or equal to 4 cm and greater than or equal to 2 cm, and the diameter of the needle 52 is less than or equal to 0.5 cm.

[0080] In order to ensure good contact between the needle 52 and the compression additional memory module 10, when the compression spring is at a free length, the distance between the needle 52 and the pressure plate 45 is less than the thickness of the compression additional memory module 10, that is, when the compression spring is not subjected to external force, the distance between the needle 52 and the pressure plate 45 is less than the thickness of the compression additional memory module 10. In this way, when the pressure plate 45 abuts against the top surface of the compression additional memory module 10, the compression additional memory module 10 presses down the needle 52, so that the compression spring is in a compressed state, thereby abutting the needle 52 against the bottom surface of the accessory memory module, so that the needle 52 and the compression additional memory module 10 maintain contact.

[0081] Multiple probes are electrically connected to the gold finger 31. For example, the sleeve 51, the compression spring and the needle 52 can all be made of conductive materials, and the sleeve 51 is electrically connected to the gold finger 31 to input a burning signal or a test signal. Multiple probes are respectively connected to the second wiring and multiple third wirings of the base plate 30. One probe is connected to the second wiring, and the second wiring is connected to the power supply terminal of the gold finger 31. Each of the remaining probes is connected to a third wiring, and the third wiring is connected to a data terminal of the gold finger 31.

[0082] In the example where the multiple probes include a first probe, a second probe, a third probe and a fourth probe, the first probe, the second probe and the third probe are respectively in contact with a third wiring, and the three third wirings are respectively connected to the HSCL pin, the HSDA pin and the HAS pin of the compressed additional memory module 10 through the data end of the gold finger 31, and the fourth probe is connected to the Power pin of the compressed additional memory module 10 through the second wiring and the power end of the gold finger 31.

[0083] When the compression additional memory module 10 is installed on the supporting fixture, the through hole of the compression additional memory module 10 is sleeved on the positioning column 42 of the supporting fixture, and is lifted up by multiple probes during the falling process. At this time, the top surface of the compression additional memory module 10 is slightly higher than the bottom surface of the pressing plate 45, and the compression additional memory module 10 needs to be pressed so that the top surface of the compression additional memory module 10 is lower than the bottom surface of the pressing plate 45. Then the pressing plate 45 is rotated to the top of the compression additional memory module 10, and the compression additional memory module 10 is pressed and fixed, so that the compression additional memory module 10 is fixedly connected to the supporting fixture.

[0084] When the compressed additional memory module 10 is fixedly connected to the supporting and fixing device, the positioning column 42 is inserted into the corresponding through hole, and the supporting column 41 may be in contact with the compressed additional memory module 10 or may not be in contact with the compressed additional memory module 10, that is, the supporting column 41 and / or the probe can support the compressed additional memory module 10, and the pressing plate 45 of the pressing part abuts against the surface of the compressed additional memory module 10 away from the base plate 30, and the probe abuts against the compressed additional memory module 10, and the signal path is built. At this time, the terminal can be used to burn or test the compressed additional memory module 10.

[0085] In summary, the burning test device in the embodiment of the present disclosure is used for burning or testing the compressed additional memory module 10, which includes a base plate 30, and a supporting and fixing device and a probe arranged on the base plate 30, wherein the supporting and fixing device is used to place the compressed additional memory module 10, and is configured to be fixedly connected with the compressed additional memory module 10, and the end of the probe away from the base plate 30 is used to abut against the surface of the compressed additional memory module 10 facing the base plate 30. The base plate 30 is also provided with a gold finger 31, and the gold finger 31 is electrically connected to the probe and to the terminal, and the terminal controls the probe to burn or test the compressed additional memory module 10. The burning and fixing of the compressed additional memory module 10 is realized by the supporting and fixing device, and the burning and input of the test signal of the compressed additional memory module 10 are realized by the probe, and the gold finger 31 of the base plate 30 is conducive to the electrical connection with the terminal, so as to realize the single burning and testing of the compressed additional memory module 10, without the need for a specific machine and code, and can realize portability in different environments and occasions, which is convenient for product development, verification and problem analysis.

[0086] In this specification, each embodiment or implementation is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other. The description of reference terms such as "one implementation", "some implementations", "illustrative implementations", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable manner.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A burning test device, characterized in that: Used for burning or testing a compressed additional memory module, the burning and testing device comprises a base plate, and a supporting and fixing device and a probe arranged on the base plate, the supporting and fixing device is used to place the compressed additional memory module and is configured to be fixedly connected to the compressed additional memory module, and an end of the probe away from the base plate is used to abut against a surface of the compressed additional memory module facing the base plate; The base plate is also provided with a gold finger, the gold finger is electrically connected to the probe and to the terminal, and the terminal controls the probe to burn or test the compressed additional memory module.

2. The burning test device according to claim 1, characterized in that: The compressed additional memory module has at least two through holes arranged at intervals; The supporting and fixing device includes at least two supporting columns spaced apart on the base plate, and a positioning column and a pressing portion connected to each of the supporting columns, wherein the positioning column passes through the supporting column and contacts the base plate, and the positioning column also protrudes from the supporting column, the number of the positioning columns is less than or equal to the number of the through holes, and each of the positioning columns corresponds to one of the through holes.

3. The burning test device according to claim 2, characterized in that: The pressing part includes an extension plate, a rotating shaft and a pressing plate; The extension plate is fixedly connected to the side of the support column, the rotating shaft is rotatably connected to the extension plate and protrudes from one end of the extension plate away from the bottom plate, the end of the rotating shaft away from the bottom plate is fixedly connected to the pressure plate, and the pressure plate is spaced apart from the extension plate.

4. The burning test device according to claim 3, characterized in that: The surface of the extension plate away from the base plate is flush with the surface of the support column away from the base plate, and the distance between the opposing surfaces of the pressing plate and the extension plate is greater than or equal to the thickness of the compression additional memory module.

5. The burning test device according to claim 3, characterized in that: The center line of the rotating shaft, the center line of the positioning column, and the center line of the supporting column are parallel to each other.

6. The burning test device according to claim 3, characterized in that: The extension plate and the support column are an integral structure, and / or the pressure plate and the rotating shaft are an integral structure.

7. The burning test device according to claim 3, characterized in that: The extension length of the pressing plate is smaller than the extension length of the extending plate, and the pressing plate is spaced apart from the positioning column.

8. The burning test device according to claim 4, characterized in that: There are three support columns, and the three support columns are respectively opposite to three edges of the compression additional memory module, and the three extension plates extend in the same direction.

9. The burning test device according to claim 8, characterized in that: Two of the three support columns are arranged opposite to each other, and another support column is arranged between the two oppositely arranged support columns, and the three support columns are respectively located on three vertices of a virtual triangle.

10. The burning test device according to any one of claims 3 to 9, characterized in that: The probe includes a sleeve, a compression spring and a needle. The sleeve is fixedly connected to the base plate. The compression spring is arranged in the sleeve. One end of the compression spring abuts against the sleeve, and the other end is fixedly connected to one end of the needle. The other end of the needle protrudes out of the sleeve.

11. The burning test device according to claim 10, characterized in that: When the compression spring is at a free length, the distance between the needle and the pressure plate is less than the thickness of the compression additional memory module.

12. The burning test device according to any one of claims 2 to 9, characterized in that: At least two of the through holes include a copper-clad through hole and a limiting through hole, and the copper-clad through hole is covered with a copper layer; The plurality of positioning posts include a first positioning post and a second positioning post. The first positioning post is made of a conductive material. The first positioning post is inserted into the copper-clad through hole. The first positioning post is in contact with the copper layer and is electrically connected to the gold finger. The second positioning post is inserted into the limiting through hole.

13. The burning test device according to claim 12, characterized in that: The bottom plate is provided with a first wiring, the first wiring is connected to the ground end of the gold finger and is in contact with the first positioning column.

14. The burning test device according to any one of claims 1 to 9, characterized in that: There are multiple probes, and the base plate is provided with a second line and multiple third lines. The second line is connected to the power supply end of the gold finger and to one of the probes. Each of the third lines is connected to a data end of the gold finger and to one of the remaining probes.

15. The burning test device according to any one of claims 1 to 9, characterized in that: The terminal comprises elastic protrusions arranged opposite to each other, and the opposite edges of the bottom plate are also provided with positioning notches, and the positioning notches are in corresponding contact with the elastic protrusions to clamp the bottom plate and the terminal.

Images