Substrate, film pasting method thereof and method for executing chemical plating

Abstract

The invention provides a substrate, a film pasting method thereof and a method for executing chemical plating. The inner side wall of the convex ring in the edge area of the substrate is trimmed to form at least one section of inclined inner side wall or arc-shaped inner side wall, so that an obtuse included angle can be formed between the inner side wall of the convex ring and the surface of the inner area, and the fitting degree of the first protective film at the corner position of the convex ring can be improved; and the problem that a slit is easy to appear at the corner position is reduced or even eliminated, so that the risk of chemical plating solution permeation can be effectively reduced when the chemical plating process is executed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a substrate and a film attaching method thereof, and a method for performing chemical plating. Background Art

[0002] Chemical plating is a new type of metal surface treatment technology. In many fields, chemical plating technology has replaced electroplating technology and become an environmentally friendly surface treatment process. For example, in the field of new energy vehicles, automotive IGBTs have high reliability requirements. In order to meet the high reliability requirements of the automotive field, the industry generally uses chemical plating technology to grow the surface metal of IGBTs (for example, Ni / Au or Ni / Pd / Au, etc.) to meet the requirements of automotive IGBT interconnection.

[0003] Among them, chemical plating can be divided into single-sided plating and double-sided plating. For the single-sided plating process, a protective film needs to be attached to the other side of the wafer (for example, the back side) to prevent the back side of the wafer from contacting the chemical agent, and the protective film is removed after the chemical plating is completed. For example, refer to Figure 1 As shown, before performing chemical plating on one side of the wafer 10, the Taiko thinning process is usually used to thin the other side of the wafer 10. The Taiko thinning process does not thin the entire surface of the wafer 10, but only thins the middle part of the wafer 10, thereby forming a thicker support ring at the edge of the wafer 10. The support ring is usually called a Taiko ring; then, a protective film 20 is attached to the surface of the wafer 10, and the protective film 20 is attached to the entire surface.

[0004] However, based on Figure 1 When the protective film 20 is attached in the film attaching method shown, since the Taiko ring protrudes relative to the middle part of the wafer to produce a step difference, the protective film 20 is prone to have a slit 20a at the position of the step difference. At this time, during the chemical plating process, as the chemical agent circulates, it is very easy to cause the chemical agent to penetrate from the edge of the protective film 20 and enter the slit 20a, thereby causing the back of the wafer to contact the chemical plating solution, seriously affecting the product yield. Summary of the invention

[0005] The object of the present invention is to provide a film-attaching method for a substrate, so as to solve the problem that the film-attaching method in the prior art is prone to chemical plating solution infiltration in the subsequent process, resulting in contact between the back side of the wafer and the chemical plating solution.

[0006] In this regard, the present invention provides a method for laminating a substrate, comprising: providing a substrate, wherein the substrate is defined with an edge area and an inner area surrounded by the edge area; performing a first grinding operation on the substrate to remove part of the thickness of the inner area of ​​the substrate and form a convex ring in the edge area of ​​the substrate, wherein the inner side wall of the convex ring facing the center of the substrate has at least one inclined inner side wall or at least one arc-shaped inner side wall; and attaching a first protective film on the substrate, wherein the first protective film is attached to the top surface of the inner area of ​​the substrate and extends at least to the top surface of the convex ring after being attached to the at least one inclined inner side wall or the at least one arc-shaped inner side wall.

[0007] Optionally, the convex ring has at least two sections of inclined inner side walls, and the at least two sections of inclined inner side walls are connected in sequence from the top to the bottom of the convex ring, and the slope of the inclined inner side wall at the bottom is the smallest; or, the slope of the at least two sections of the inclined inner side walls decreases gradually from the top to the bottom of the convex ring.

[0008] Optionally, the convex ring has at least two arc-shaped inner side walls, and the at least two arc-shaped inner side walls are connected in sequence from the top to the bottom of the convex ring, and the arc-shaped inner side wall at the bottom has the smallest curvature; or, the curvature of the at least two arc-shaped inner side walls decreases gradually from the top to the bottom of the convex ring.

[0009] Optionally, the method for forming the inclined inner wall or the arc-shaped inner wall of the convex ring includes: during the first grinding operation, the grinding surface of the grinding head is brought into contact with a portion of the top surface of the edge area close to the inner side of the substrate, and during the grinding process, the grinding range of the grinding head is gradually retracted from the edge area toward the inner area.

[0010] Optionally, the first protective film also extends and adheres to the outer side wall of the convex ring, and the first protective film extends from the top of the convex ring to cover the outer side wall of the convex ring until it stops at a position of 1 / 3-2 / 3 of the outer side wall in the direction from the top to the bottom.

[0011] Optionally, before attaching the first protective film, the method further includes: trimming the outer side wall of the convex ring away from the center of the substrate to form at least one inclined outer side wall or at least one arc-shaped outer side wall.

[0012] Optionally, the method for forming the inclined outer wall or the arc-shaped outer wall of the convex ring includes: performing a second grinding operation, and during the second grinding operation, contacting the grinding surface of the grinding head to a portion of the top surface of the edge area close to the outside of the substrate, and during the grinding process, making the grinding range of the grinding head gradually move outward in the edge area in a direction away from the internal area.

[0013] Optionally, the first protective film also extends and is attached to the outer wall of the convex ring, and after attaching the first protective film, it also includes: attaching the second protective film along the circumferential direction of the substrate, and making the second protective film at least attached to the junction between the end of the first protective film and the outer wall of the substrate.

[0014] Optionally, the width of the second protective film is greater than or equal to 1 / 4 of the height of the convex ring.

[0015] Optionally, the viscosity of the second protective film is greater than the viscosity of the first protective film.

[0016] The present invention also provides a substrate with a protective film attached thereto, wherein the substrate is defined with an edge area and an internal area surrounded by the edge area, the surface of the edge area protrudes relative to the surface of the internal area to form a convex ring, and the inner side wall of the convex ring facing the center of the substrate has at least one inclined inner side wall or an arc-shaped inner side wall; and, a first protective film is attached to the substrate, the first protective film is attached to the internal area of ​​the substrate, and after being attached to the at least one inclined inner side wall or the at least one arc-shaped inner side wall, it extends at least to the top surface of the convex ring.

[0017] Optionally, the convex ring has at least two sections of inclined inner side walls, and the at least two sections of inclined inner side walls are connected in sequence from the top to the bottom of the convex ring, and the slope of the inclined inner side wall at the bottom is the smallest; or, the slope of the at least two sections of the inclined inner side walls decreases gradually from the top to the bottom of the convex ring.

[0018] Optionally, the convex ring has at least two arc-shaped inner side walls, and the at least two arc-shaped inner side walls are connected in sequence from the top to the bottom of the convex ring, and the arc-shaped inner side wall at the bottom has the smallest curvature; or, the curvature of the at least two arc-shaped inner side walls decreases gradually from the top to the bottom of the convex ring.

[0019] Optionally, the outer side wall of the convex ring facing away from the center of the substrate also has at least one inclined outer side wall or at least one arc-shaped outer side wall.

[0020] Optionally, the first protective film also extends and adheres to the outer side wall of the convex ring, and the first protective film extends from the top of the convex ring to cover the outer side wall of the convex ring until it stops at a position of 1 / 3-2 / 3 of the outer side wall in the direction from the top to the bottom.

[0021] Optionally, the first protective film is also extended and attached to the outer wall of the convex ring; and a second protective film is also attached along the circumferential direction of the substrate, and the second protective film is at least attached to the junction between the end of the first protective film and the outer wall of the substrate.

[0022] Optionally, the width of the second protective film is greater than or equal to 1 / 4 of the height of the convex ring.

[0023] Optionally, the viscosity of the second protective film is greater than the viscosity of the first protective film.

[0024] Another object of the present invention is to provide a method for performing chemical plating, comprising: using the film sticking method as described above to attach a protective film on at least the first surface of a substrate; or, providing a substrate as described above, with a protective film attached to at least the first surface of the substrate; performing a chemical plating process to form a chemically plated metal on the second surface of the substrate.

[0025] The film attaching method of the substrate provided by the present invention improves the adhesion of the protective film on the substrate by optimizing the structure of the convex ring in the edge area of ​​the substrate, so as to better protect the substrate and effectively improve the problem of the chemical plating solution in the chemical plating process infiltrating into the internal area and affecting the product yield. Specifically, by trimming the inner side wall of the convex ring to form at least one inclined inner side wall or an arc-shaped inner side wall, an obtuse angle can be formed between the inner side wall of the convex ring and the surface of the internal area, so that when attaching the first protective film, the adhesion of the first protective film at the corner position of the convex ring can be improved, reducing or even eliminating the phenomenon that slits are easy to appear at the corner position, thereby solving the problem in the prior art that the chemical plating solution easily penetrates into the slit and further contacts the internal area of ​​the substrate.

[0026] Furthermore, the first protective film can be extended to the outer side wall of the convex ring to increase the coverage area of ​​the substrate, increase the thread for the chemical plating solution to penetrate, and resist the risk of chemical plating solution penetration to a greater extent. On this basis, in an optional solution, the outer side wall of the convex ring can also be trimmed to form at least one inclined outer side wall or an arc-shaped outer side wall, so that the outer top angle of the protrusion can be an obtuse angle, which can fit the first protective film more smoothly, improve the fit of the first protective film on the outer side of the convex ring, and further improve the blocking effect of the chemical plating solution.

[0027] In addition, when the first protective film also extends to the outer wall of the convex ring, in an optional solution, a second protective film can be attached to the circumferential direction of the substrate, and the second protective film is attached to the junction between the end of the first protective film and the outer wall of the substrate. In this way, the end of the first protective film can be prevented from being exposed, and the problem that the end of the first protective film is easily washed away by the circulation of the plating solution can be effectively improved during the chemical plating process, greatly reducing the risk of chemical plating solution infiltration. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The figure is a schematic diagram of the structure of an existing substrate with a protective film attached thereto.

[0029] Figure 2The figure is a schematic flow chart of a method for laminating a substrate in one embodiment of the present invention.

[0030] Figure 3-Figure 8 It is a structural schematic diagram of the process of attaching a protective film to the substrate in the first embodiment of the present invention.

[0031] Figure 9-11 They are schematic diagrams of the structures of substrates in Embodiment 2, Embodiment 3 and Embodiment 4 of the present invention respectively.

[0032] The reference numerals are as follows:

[0033] 10-wafer;

[0034] 20-protective film;

[0035] 20a-gap;

[0036] 100-substrate;

[0037] 100A - fringe area;

[0038] 100B - internal area;

[0039] 110-convex ring;

[0040] 111a - inclined inner wall;

[0041] 111b-arc-shaped inner side wall;

[0042] 112 - inclined outer side wall;

[0043] 210- first protective film;

[0044] 220 - second protective film. DETAILED DESCRIPTION

[0045] The core idea of ​​the present invention is to provide a film-laminating method for a substrate, which can effectively reduce the penetration of chemical reagents into the surface that does not require chemical plating, thereby avoiding affecting the products in the substrate; and can also avoid the formation of gaps between the protective film and the substrate, thereby better blocking chemical reagents and improving the protection of the substrate.

[0046] For details, please refer to Figure 2 As shown, a film attaching method for a substrate in one embodiment of the present invention includes the following steps.

[0047] Step S100 , providing a substrate, wherein the substrate is defined with an edge region and an inner region surrounded by the edge region.

[0048] Step S200, performing a first grinding operation on the substrate to remove part of the thickness of the inner region of the substrate and form a convex ring at the edge region of the substrate, wherein the inner side wall of the convex ring facing the center of the substrate has at least one inclined inner side wall or at least one arc-shaped inner side wall.

[0049] Step S300, attaching a first protective film on the substrate, wherein the first protective film is attached to the inner area of ​​the substrate and is attached to at least one inclined inner side wall or at least one arc-shaped inner side wall and then extends to the top surface of the convex ring.

[0050] It should be noted that since the inner side wall of the convex ring has at least one section of inclined inner side wall or curved inner side wall, an obtuse angle can be formed between the bottom inner side wall of the convex ring and the surface of the internal area, which is beneficial to improve the fit of the first protective film on the convex ring, reduce or even eliminate the slit of the first protective film layer at the bottom corner of the convex ring, and reduce the risk of chemical plating solution penetration.

[0051] When attaching the first protective film, the first protective film may be further extended to the outer side wall of the convex ring to increase the coverage area of ​​the substrate. On this basis, in an optional solution, the film attaching method may also include: step S400, attaching the second protective film along the circumferential direction of the substrate, and attaching the second protective film to at least the junction between the end of the first protective film and the outer side wall of the substrate.

[0052] The following is a further detailed description of the substrate and its film-attaching method and the method for performing chemical plating proposed in the present invention in conjunction with specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. It should be recognized that relative terms such as "above", "below", "top", "bottom", "above" and "below" shown in the drawings can be used to describe the relationship between various elements. These relative terms are intended to cover different orientations of elements other than the orientations depicted in the drawings. For example, if the device is inverted relative to the view in the drawing, an element described as being "above" another element will now be below the element.

[0053] <Example 1>

[0054] In step S100, refer to Figure 3 As shown, a substrate 100 is provided, and the substrate 100 includes, for example, a wafer. The substrate 100 has a first surface and a second surface opposite to each other, one of the first surface and the second surface is a back surface, and the other surface is a front surface. In this embodiment, the front surface of the substrate 100 is a surface to be chemically plated, and the back surface is a surface to be attached with a protective film.

[0055] Furthermore, the substrate 100 is defined with an edge region 100A and an inner region 100B surrounded by the edge region, and a semiconductor device may be formed in the inner region 100B, and the semiconductor device is, for example, a power device, and the power device may further include an IGBT device, etc. Specifically, there are multiple chip regions on the substrate 100, and due to the limitations of the substrate shape and the chip shape, the chip region located at the edge of the substrate is usually an incomplete chip region (i.e., an invalid chip region), and the semiconductor device formed therein is also an invalid device. Therefore, the chip region located inside the substrate is usually a valid chip region, and the chip region located at the edge of the substrate is usually an invalid chip region. At this time, the invalid chip region at the edge of the substrate can be defined as the edge ring region 100A of the substrate 100. For example, the width of the invalid chip area at the edge of the substrate is 2mm-5mm. At this time, the width area of ​​2mm-5mm from the edge to the inside of the substrate 100 can be defined as the edge ring area 100A of the substrate, and the inner side of the edge ring area 100A is the internal area 100B, and the internal area 100B has multiple valid chip areas.

[0056] In step S200, continue to refer to Figure 3 As shown, a first grinding operation is performed on the substrate 100 to remove part of the thickness of the inner region 100B of the substrate 100 and form a convex ring 110 in the edge region 100A of the substrate 100, wherein the inner side wall of the convex ring 110 facing the center of the substrate has at least one inclined inner side wall 111a or an arc-shaped inner side wall 111b.

[0057] In this embodiment, an example is given in which the inner side of the convex ring 110 has an inclined inner side wall 111a. In this example, the inclined inner side wall 111a of the convex ring 110 is connected to the surface of the inner area 100B, so that an obtuse angle is formed between the inclined surface of the inclined inner side wall 111a and the surface of the inner area 100B, so that when the first protective film is subsequently attached, the fit of the first protective film at the corner position of the convex ring 110 can be improved, and the problem of slits being easily formed at the corner position can be improved.

[0058] Illustratively, through the first grinding operation, on the one hand, part of the thickness of the inner region 100B of the substrate 100 can be removed to achieve the purpose of thinning the substrate 100; on the other hand, the first grinding operation can also be used to form a convex ring 110 with an inclined inner sidewall 111a.

[0059] For details, please refer to Figure 3As shown, the substrate 100 is ground using a grinding device, and during the grinding process, the grinding surface of the grinding head 310 contacts the top surface of the inner region 100B and the top surface of the edge region 100A close to the inner side of the substrate, and during the grinding process, the grinding range of the grinding head 310 is gradually reduced from the edge region 100A toward the inner region 100B. Figure 3 In the example of FIG. 1 , the grinding head 310 takes the center of the substrate 100 as the center of the circle and performs grinding within a predetermined grinding radius. During the grinding process, as the grinding radius of the grinding head 310 gradually decreases, the grinding range thereof shrinks accordingly, that is, the boundary of the grinding range of the grinding head 310 gradually shrinks from the edge area 100A to the inner area 100B, for example. Figure 3 The grinding range of the grinding head 310 shown in FIG. 1 is from the boundary Z1 to the boundary Z2, thereby forming an inclined inner sidewall 111a. In this embodiment, the grinding range of the grinding head 310 is linearly contracted (ie, the grinding radius of the grinding head 310 is linearly reduced) so that the inner sidewall forms an inclined surface.

[0060] In one example, the grinding device includes: a grinding head 310, a first control rod 320, a second control rod 330, and a third control rod 340 connected in sequence. Specifically, the first control rod 320 is vertically connected to the grinding head 310 in a direction perpendicular to the grinding surface of the grinding head 310, the second control rod 330 is arranged in a direction parallel to the grinding surface and connects the end of the first control rod 320, and the third control rod 340 extends vertically and connects the end of the second control rod 330. The second control rod 330 is, for example, a telescopic rod for adjusting the grinding radius of the grinding head 310; similarly, at least one of the first control rod 320 and the third control rod 340 can also be a telescopic rod, so that the height of the grinding head 310 can be controlled by using one of them.

[0061] For more information, please refer to Figure 5 As shown, before attaching the first protective film to the substrate 100, the method further includes: trimming the outer side wall of the convex ring 110 away from the center of the substrate to form at least one inclined outer side wall 112. In this way, the outer vertex angle of the convex ring 110 can be adjusted from a sharp right angle to a smoother obtuse angle, so that when the first protective film is attached and the first protective film is also covered to the outside of the convex ring 110, the fit of the first protective film on the inclined outer side wall 112 of the convex ring 110 can be effectively improved. That is, the convex ring 110 in this example is specifically a structure that is narrow at the top and wide at the bottom, and its cross-sectional shape can be a trapezoid, for example, the slopes of the inclined inner side wall 111a and the inclined outer side wall 112 of the convex ring 110 can be consistent to form a regular trapezoidal structure. For example, the top width D1 of the convex ring 110 can be 1mm-2mm, and the bottom width D2 of the convex ring 110 can be 2mm-5mm.

[0062] In a specific example, the outer wall of the protruding ring 110 can also be trimmed by grinding. Figure 4 As shown, a second grinding operation is performed, and during the second grinding operation, the grinding surface of the grinding head 310 contacts the top surface of the edge region 100B close to the outer side of the substrate, and during the grinding process, the grinding range of the grinding head 310 gradually moves outward in the edge region 100A in a direction away from the inner region 100B. Figure 4 In the example, the grinding head 310 is centered on the center of the substrate 100 and performs grinding around the outer periphery of the substrate 100 based on a predetermined grinding radius. During the grinding process, as the grinding radius of the grinding head 310 gradually increases, the grinding range of the grinding head 310 gradually moves outward from the edge area 100A. In this way, the grinding head 310 gradually consumes the edge of the substrate from top to bottom around the outer periphery of the substrate 100, and the grinding radius is controlled to increase linearly as the grinding height decreases, thereby gradually reducing the grinding range of the edge area of ​​the substrate 100, thereby forming an inclined outer side wall 112.

[0063] In step S300, refer to Figure 6 As shown, a first protective film 210 is attached to the substrate 100, and the first protective film 210 is attached to the top surface of the inner area 100B of the substrate 100 and extends at least to the top surface of the convex ring 110, that is, the first protective film 210 is attached to the inner area 100B of the substrate 100, the inner side wall of the convex ring 110 and the top surface of the convex ring 110.

[0064] In this embodiment, the first protective film 210 can be further extended to the outer side wall of the convex ring 110, so that the end of the first protective film 210 stops at the outer side wall of the substrate 100. For example, the first protective film 210 can be extended from the top of the convex ring 110 to cover the outer side wall of the convex ring 110 until it stops at the position of 1 / 3-2 / 3 of the outer side wall from the top to the bottom. In one example, the end of the first protective film 210 can be attached to the height position between 1 / 3 and 2 / 3 of the convex ring 110. In this way, the coverage area of ​​the first protective film 210 on the substrate 100 is increased, and the thread for the chemical plating solution to penetrate is increased, so that the chemical plating solution can be effectively prevented from penetrating into the surface of the substrate that does not require chemical plating.

[0065] As described above, the convex ring 110 has an inclined inner wall 111a and an inclined outer wall 112. Therefore, although the convex ring 110 exists in the edge area 100B of the substrate, the side wall slope of the convex ring 110 is small, which can improve the fit of the first protective film 210 to the convex ring 110 and reduce or even eliminate the slits generated when the first protective film 210 covers the corner position of the convex ring 110, including: adjusting the angle between the inclined inner wall 111a of the convex ring 110 and the surface of the internal area to an obtuse angle to improve the fit of the first protective film 210 at the bottom angle position of the inner side of the convex ring, and improving the problem that slits are easy to appear at the bottom angle position of the inner side of the convex ring; and adjusting the outer top angle of the convex ring 110 from a sharp right angle to a smoother obtuse angle, which can effectively improve the fit of the first protective film 210 on the outer top angle of the convex ring and the outer wall of the convex ring, and improve the problem that slits are easy to appear at the outer top angle position of the convex ring 110.

[0066] In an optional solution, after attaching the first protective film 210, step S400 is further included. Figure 7 and Figure 8 As shown, the second protective film 220 is attached along the circumferential direction of the substrate 100, and the second protective film 220 is attached to the junction between the end of the first protective film 210 and the outer wall of the substrate. Figure 7 is a three-dimensional diagram of a substrate with a first protective film and a second protective film attached thereto. Figure 8 It is a cross-sectional view when the first protective film and the second protective film are attached to the substrate.

[0067] In this example, the second protective film 220 is used to surround and cover the end of the first protective film 210 to prevent the end of the first protective film 210 from being exposed. This can effectively improve the problem of the end of the first protective film 210 being easily washed away by the circulation of the plating solution during the chemical plating process, thereby greatly reducing the risk of chemical plating solution infiltration.

[0068] Furthermore, the width of the second protective film 220 can be set to be greater than or equal to 1 / 4 of the height of the convex ring 110, so that the second protective film 220 has a sufficient width to close the end of the first protective film 210, that is, a part of the second protective film 220 is attached to the end of the first protective film 210, and the other part is attached to the outer wall of the substrate. In addition, the viscosity of the second protective film 220 can be made greater than the viscosity of the first protective film 210, so as to improve the protection strength of the end of the first protective film 210, so as to better resist the impact of the chemical plating solution.

[0069] <Example 2>

[0070] The difference from the first embodiment is that the convex ring in this embodiment has at least two sections of inclined inner side walls, which are connected in sequence from the top to the bottom of the convex ring, and the slope of the inclined inner side wall at the bottom is the smallest.

[0071] Fig. 9 FIG. 1 is a schematic diagram of the structure of the substrate after grinding in the second embodiment of the present invention. Fig. 9 As shown, a convex ring 110 is formed in the edge region 100A of the substrate 100, and the inner side of the convex ring 110 has two sections of inclined inner side walls 111a connected in sequence, and the slope of the inclined inner side wall 111a located at the bottom is the smallest. That is, the bottom of the convex ring 110 and the top surface of the inner region 100B are smoothly connected at a large obtuse angle, so that when the first protective film 210 is attached, the fit of the first protective film 210 at the bottom corner position of the convex ring 110 can be effectively improved.

[0072] It should be noted that in Fig. 9 In the example, only two sections of the inclined inner side wall 111a connected in sequence are shown on the inner side of the convex ring 110. However, in other examples, the inner side of the convex ring 110 may have multiple sections of the inclined inner side wall 111a connected in sequence, and the slope of the multiple sections of the inclined inner side wall 111a may decrease gradually from the top to the bottom of the convex ring 110.

[0073] When the inclined inner sidewall 111a is formed on the inner side of the convex ring 110 by the first grinding operation, the linear decreasing slope value of the grinding radius of the grinding head 310 can be controlled. For example, for an inclined inner sidewall with a larger slope, the grinding radius of the grinding head 310 can be linearly decreased with a smaller slope; and for an inclined inner sidewall with a smaller slope, the grinding radius of the grinding head 310 can be linearly decreased with a larger slope.

[0074] also, Fig. 9 In the example, only the inclined inner side wall 111a is formed on the inner side of the protruding ring 110. However, in other examples, the inclined outer side wall can also be formed on the outer side of the protruding ring 110 with reference to the first embodiment. Also, after attaching the first protective film 210, the second protective film 220 can also be attached on the basis of the first protective film 210.

[0075] <Example 3>

[0076] The difference from Example 1 is that the inner wall of the convex ring in this embodiment is an arc-shaped inner wall, the arc surface of the arc-shaped inner wall is convex, and the bottom of the arc-shaped inner wall and the top surface of the internal area form an obtuse angle, so that when the first protective film is attached, the fit of the first protective film at the corner position of the convex ring can be improved, thereby improving the problem of slits easily appearing at the corner position.

[0077] Fig.10FIG. 1 is a schematic diagram of the structure of the substrate after grinding in the third embodiment of the present invention. Fig.10 As shown, a convex ring 110 is formed in the edge region 100A of the substrate 100, and the inner side wall of the convex ring 110 is an arc-shaped inner side wall 111b, and the arc-shaped inner side wall 111b protrudes away from the center of the convex ring. In this embodiment, the first grinding operation can also be used to simultaneously achieve the thickness reduction of the substrate 100, and the inner side wall of the convex ring 110 is formed into the arc-shaped inner side wall 111b, and during the first grinding operation, the grinding radius of the grinding head 310 is controlled to decrease nonlinearly, thereby forming the arc-shaped inner side wall 111b.

[0078] also, Fig.10 In the example, only the arc-shaped inner wall 111b is formed on the inner side of the convex ring 110. However, in other examples, an arc-shaped outer wall may also be formed on the outer side of the convex ring 110. Also, after attaching the first protective film, a second protective film may also be attached on the basis of the first protective film.

[0079] <Example 4>

[0080] The difference from the third embodiment is that the convex ring in this embodiment has at least two arc-shaped inner side walls, which are connected in sequence from the top to the bottom of the convex ring, and the arc-shaped inner side wall at the bottom has the smallest curvature.

[0081] Fig.11 FIG. 4 is a schematic diagram of the structure of the substrate after grinding in the fourth embodiment of the present invention. Fig.11 As shown, a convex ring 110 is formed in the edge region 100A of the substrate 100, and the inner side of the convex ring 110 has two sections of arc-shaped inner side walls 111b connected in sequence, and the arc-shaped inner side wall 111b located at the bottom has the smallest curvature. That is, the bottom of the convex ring 110 and the top surface of the inner region 100B are smoothly connected, so that when the first protective film 210 is attached, the fit of the first protective film 210 at the bottom corner position of the convex ring 110 can be effectively improved.

[0082] It should be noted that in Fig.11 In the example, the inner side of the convex ring 110 only illustrates two sections of arc-shaped inner side walls 111b connected in sequence. However, in other examples, the inner side of the convex ring 110 may have multiple sections of arc-shaped inner side walls 111b connected in sequence, and the curvature of the multiple sections of the arc-shaped inner side walls 111b may decrease gradually from the top to the bottom of the convex ring 110.

[0083] Likewise, Fig.11 In the example, only the arc-shaped inner wall 111b is formed on the inner side of the convex ring 110. However, in other examples, at least one arc-shaped outer wall may be formed on the outer side of the convex ring 110. Also, after attaching the first protective film, a second protective film may also be attached on the basis of the first protective film.

[0084] Based on the above-mentioned film attaching method, this embodiment also provides a substrate with a protective film attached thereto, which can be specifically combined with Figure 5-Figure 11 As shown, the substrate 100 is defined with an edge region 100A and an inner region 100B surrounded by the edge region 100A, and the surface of the edge region 100A is protruding relative to the surface of the inner region 100B to form a convex ring 110. Further, the inner side wall of the convex ring 110 facing the center of the substrate has at least one inclined inner side wall 111a or at least one arc-shaped inner side wall 111b.

[0085] Continue to refer Figure 6-Figure 8 As shown, a first protective film 210 is attached to the substrate 100, and the first protective film 210 is attached to the inner area 100B of the substrate 100 and extends at least to the top surface of the convex ring 110. In a specific example, the first protective film 210 can be further extended to the outer side wall of the convex ring 110 to increase the coverage area of ​​the protective film on the substrate. For example, the first protective film 210 can be extended from the top of the convex ring 110 to cover the outer side wall of the convex ring 110 until it stops at a position of 1 / 3-2 / 3 in the direction from the top to the bottom of the outer side wall. In one example, the end of the first protective film 210 can be stopped between the 1 / 3 height position and the 2 / 3 height position of the convex ring 110. Exemplarily, the outer side wall of the convex ring 110 away from the center of the substrate can also have at least one inclined outer side wall or at least one arc-shaped outer side wall, so as to improve the fit of the first protective film 210 on the outer side of the convex ring.

[0086] exist Figure 6 and Figure 8 In the example of FIG. 1 , the inner side of the protruding ring 110 has only one inclined inner side wall 111 a. However, in other examples, for example Fig. 9 As shown, the convex ring 110 has at least two sections of inclined inner side walls 111a, and the at least two sections of inclined inner side walls 111a are connected in sequence from the top to the bottom of the convex ring 110, and the slope of the inclined inner side wall 111a at the bottom is the smallest; alternatively, the slope of the at least two sections of the inclined inner side walls 111a can be gradually decreased from the top to the bottom of the convex ring 110, so as to achieve a smoother connection between the side wall of the convex ring 110 and the top surface of the internal area 100B.

[0087] In addition, in other examples, such as Fig.10 and Fig.11 As shown, the inner side of the protruding ring 110 has at least one arc-shaped inner side wall 111b. Fig.11 When the convex ring 110 has at least two arc-shaped inner side walls 111b, the curvature of the bottom arc-shaped inner side wall 111b can be minimized; or, the curvature of at least two arc-shaped inner side walls 111b can be gradually decreased from the top to the bottom of the convex ring 110.

[0088] As described above, in an optional solution, the first protective film 210 can also be extended and attached to the outer side wall of the convex ring 110. On this basis, the second protective film 220 can be further attached to the substrate 100. Figure 7 and Figure 8 As shown, the second protective film 220 is attached to the outer side wall of the substrate 100 along the circumferential direction of the substrate 100, and the second protective film 220 is attached to the junction between the end of the first protective film 210 and the outer side wall of the substrate. In this way, the end of the first protective film 210 can be prevented from being exposed under the coverage of the second protective film 220, so that the problem that the end of the first protective film 210 is easily washed away with the circulation of the plating solution can be effectively improved during the chemical plating process.

[0089] Furthermore, the width of the second protective film 220 can be set to be greater than or equal to 1 / 4 of the height of the convex ring 110, so that the second protective film 220 has a sufficient width to close the end of the first protective film 210, that is, a part of the second protective film 220 is attached to the end of the first protective film 210, and the other part is attached to the outer wall of the substrate. In addition, the viscosity of the second protective film 220 can be made greater than the viscosity of the first protective film 210, so as to improve the protection strength of the end of the first protective film 210, so as to better resist the impact of the chemical plating solution.

[0090] Based on the film-attaching method for a substrate and the substrate with a protective film attached provided by the present disclosure, when a chemical plating process is performed on the substrate, the infiltration of the chemical plating solution can be effectively blocked, thereby reducing the risk of the infiltration of the chemical plating solution affecting the product.

[0091] Specifically, the method for performing chemical plating provided in this embodiment includes: attaching a protective film on at least the first surface (e.g., the back side) of the substrate using the method described above; then, performing a chemical plating process to form a chemically plated metal on the second surface (e.g., the front side) of the substrate, and during the chemical plating process, the first surface of the substrate can be covered by the protective film to avoid being affected by the chemical plating.

[0092] Specific combination Figure 5-Figure 11 As shown, in this embodiment, the convex ring 110 in the edge area 100A of the substrate 100 is optimized so that the inner side wall of the convex ring 110 is formed into at least one inclined inner side wall 111a or at least one arc-shaped inner side wall 111b, thereby improving the fit of the protective film on the convex ring 110.

[0093] Furthermore, a first protective film 210 and a second protective film 220 may be sequentially attached to the substrate 100, wherein the first protective film 210 is attached to the inner area 100B of the substrate 100, the inner wall and the outer wall of the convex ring 110, and the second protective film 220 surrounds the outer wall of the substrate along the circumferential direction of the substrate and covers the junction between the end of the first protective film 210 and the substrate.

[0094] That is, in this example, not only can the adhesion of the protective film on the substrate be improved, and the problem of slits being easily generated at the bottom corner of the convex ring be improved; but also the coverage area of ​​the substrate can be increased, while preventing the end of the first protective film 210 from being easily washed away by the circulating flow of the chemical plating solution, thereby effectively blocking the chemical plating solution and preventing the chemical plating solution from penetrating into the surface of the substrate that does not require chemical plating, which is beneficial to improving the yield of the product.

[0095] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. For the equipment disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. Although the present invention has been disclosed as above with preferred embodiments, the above embodiments are not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the technical content disclosed above can be used to make many possible changes and modifications to the technical solution of the present invention, or modified to equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still belong to the scope of protection of the technical solution of the present invention.

[0096] It should also be recognized that the terms described herein are used only to describe specific embodiments and are not intended to limit the scope of the invention. It should be noted that the singular forms "a" and "an" used herein and in the appended claims include plural references unless the context clearly indicates otherwise. For example, a reference to "a step" or "a device" means a reference to one or more steps or devices, and may include secondary steps as well as secondary devices. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have the definition of a logical "or", not a logical "exclusive or", unless the context clearly indicates otherwise.

Claims

1. A method for laminating a substrate, characterized in that: include: Providing a substrate, wherein the substrate defines an edge region and an inner region surrounded by the edge region; Performing a first grinding operation on the substrate to remove a portion of the thickness of the inner region of the substrate and forming a convex ring at the edge region of the substrate, wherein the inner side wall of the convex ring facing the center of the substrate has at least one inclined inner side wall or at least one arc-shaped inner side wall; and A first protective film is attached to the substrate, the first protective film is attached to the top surface of the inner area of ​​the substrate, and is attached to the at least one inclined inner side wall or the at least one arc-shaped inner side wall and extends at least to the top surface of the convex ring.

2. The film attaching method for a substrate as claimed in claim 1, characterized in that: The convex ring has at least two sections of inclined inner side walls, and the at least two sections of inclined inner side walls are connected in sequence from the top to the bottom of the convex ring, and the slope of the inclined inner side wall at the bottom is the smallest; or, the slope of the at least two sections of the inclined inner side walls decreases gradually from the top to the bottom of the convex ring.

3. The film attaching method for a substrate as claimed in claim 1, characterized in that: The convex ring has at least two arc-shaped inner side walls, the at least two arc-shaped inner side walls are sequentially connected from the top to the bottom of the convex ring, and the arc of the arc-shaped inner side wall at the bottom is the smallest; Alternatively, the curvature of the at least two sections of the arc-shaped inner side walls decreases gradually from the top to the bottom of the convex ring.

4. The film attaching method for a substrate as claimed in claim 1, characterized in that: The method for forming the inclined inner side wall or the arc-shaped inner side wall of the convex ring includes: During the first grinding operation, the grinding surface of the grinding head contacts a portion of the top surface of the edge region close to the inner side of the substrate, and during the grinding process, the grinding range of the grinding head is gradually reduced from the edge region toward the inner region.

5. The film attaching method for a substrate as claimed in claim 1, characterized in that: The first protective film also extends and adheres to the outer side wall of the convex ring, and the first protective film extends from the top of the convex ring to cover the outer side wall of the convex ring until it stops at a position of 1 / 3-2 / 3 of the outer side wall in the direction from the top to the bottom.

6. The film attaching method for a substrate according to any one of claims 1 to 5, characterized in that: Before attaching the first protective film, the method further includes: trimming the outer side wall of the convex ring away from the center of the substrate to form at least one inclined outer side wall or at least one arc-shaped outer side wall.

7. The film attaching method for a substrate as claimed in claim 6, characterized in that: The method for forming the inclined outer side wall or the arc-shaped outer side wall of the convex ring includes: Perform a second grinding operation, and during the second grinding operation, bring the grinding surface of the grinding head into contact with a portion of the top surface of the edge region close to the outside of the substrate, and during the grinding process, make the grinding range of the grinding head gradually move outward in the edge region in a direction away from the inner region.

8. The film attaching method for a substrate according to any one of claims 1 to 5, characterized in that: The first protective film also extends and is attached to the outer wall of the convex ring, and after attaching the first protective film, it also includes: attaching the second protective film along the circumferential direction of the substrate, and making the second protective film at least attached to the junction between the end of the first protective film and the outer wall of the substrate.

9. The film attaching method for a substrate as claimed in claim 8, characterized in that: The width of the second protective film is greater than or equal to 1 / 4 of the height of the convex ring; and / or the viscosity of the second protective film is greater than the viscosity of the first protective film.

10. A substrate with a protective film attached, characterized in that: The substrate is defined with an edge region and an inner region surrounded by the edge region, the surface of the edge region protrudes relative to the surface of the inner region to form a convex ring, and the inner side wall of the convex ring facing the center of the substrate has at least one inclined inner side wall or at least one arc-shaped inner side wall; and A first protective film is attached to the substrate, and the first protective film is attached to the inner area of ​​the substrate and extends at least to the top surface of the convex ring after being attached to the at least one inclined inner side wall or the at least one arc-shaped inner side wall.

11. The substrate according to claim 10, wherein The convex ring has at least two sections of inclined inner side walls, and the at least two sections of inclined inner side walls are connected in sequence from the top to the bottom of the convex ring, and the slope of the inclined inner side wall at the bottom is the smallest; or, the slope of the at least two sections of the inclined inner side walls decreases gradually from the top to the bottom of the convex ring.

12. The substrate according to claim 10, wherein The convex ring has at least two arc-shaped inner side walls, the at least two arc-shaped inner side walls are sequentially connected from the top to the bottom of the convex ring, and the arc of the arc-shaped inner side wall at the bottom is the smallest; Alternatively, the curvature of the at least two sections of the arc-shaped inner side walls decreases gradually from the top to the bottom of the convex ring.

13. The substrate according to claim 10, characterized in that The outer side wall of the convex ring away from the center of the substrate also has at least one inclined outer side wall or at least one arc-shaped outer side wall.

14. The substrate according to any one of claims 10 to 13, characterized in that: The first protective film also extends and adheres to the outer side wall of the convex ring, and the first protective film extends from the top of the convex ring to cover the outer side wall of the convex ring until it stops at a position of 1 / 3-2 / 3 of the outer side wall in the direction from the top to the bottom.

15. The substrate according to any one of claims 10 to 13, characterized in that: The first protective film also extends and is attached to the outer side wall of the convex ring; and a second protective film is also attached along the circumferential direction of the substrate, and the second protective film is at least attached to the junction between the end of the first protective film and the outer side wall of the substrate.

16. The substrate according to claim 15, characterized in that The width of the second protective film is greater than or equal to 1 / 4 of the height of the convex ring; and / or the viscosity of the second protective film is greater than the viscosity of the first protective film.

17. A method for performing chemical plating, characterized in that: include: Adopting the film attaching method as described in any one of claims 1 to 9, attaching the protective film at least on the first surface of the substrate; Alternatively, there is provided a substrate as claimed in any one of claims 10 to 16, wherein a protective film is attached to at least a first surface of the substrate; An electroless plating process is performed to form an electroless metal on the second surface of the substrate.

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