Vacuum adsorption system, scribing machine and control method of vacuum adsorption system

Abstract

The invention relates to the technical field of scribing machines, in particular to a vacuum adsorption system, a scribing machine and a control method of the vacuum adsorption system. The vacuum adsorption system comprises an air source, an electromagnetic valve, a vacuum generator, an adsorption mechanism, a pressure detection piece, a first air conveying pipeline and a vacuum pipeline, the air source and the vacuum generator communicate with the two ends of the first air conveying pipeline correspondingly, and the electromagnetic valve is installed in the first air conveying pipeline and controls the first air conveying pipeline to be connected or disconnected. The adsorption mechanism is communicated with a vacuum port of the vacuum generator through a vacuum pipeline; the pressure detection piece is mounted in the vacuum pipeline to detect the vacuum value of the vacuum pipeline; the electromagnetic valve is electrically connected with the pressure detection piece so that the electromagnetic valve can be closed when the detection value of the pressure detection piece is equal to the target value and can be opened when the detection value is smaller than the restart value. According to the control method of the vacuum adsorption system, the electromagnetic valve and the vacuum generator are selectively opened or closed according to the measured value of the pressure detection piece, the gas consumption is reduced, and the energy consumption is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of dicing machines, and in particular to a vacuum adsorption system, a dicing machine and a control method of the vacuum adsorption system. Background Art

[0002] In the wafer processing process, the automatic placement and automatic transfer of wafers is a crucial technology. Its stability and reliability directly affect the wafer fragmentation rate, and thus affect the overall production efficiency and quality. Especially in the wafer processing process, the wafer dicing machine vacuum absorbs the wafer to be processed through actuators such as mechanical arms to complete the wafer transfer, fixation and processing operations.

[0003] The vacuum adsorption system of the existing dicing machine mainly supplies air to the vacuum generator through the air source. The vacuum generator forms a negative pressure environment in the vacuum pipeline through compressed air to enable the adsorption mechanism to achieve the vacuum adsorption function. In order to ensure the reliable adsorption of the wafer, the air source needs to continuously supply air to the vacuum generator, and the vacuum adsorption system usually contains multiple adsorption mechanisms, which increases the overall gas consumption and energy consumption of the vacuum adsorption system. Summary of the invention

[0004] The object of the present invention is to provide a vacuum adsorption system, a dicing machine and a control method for the vacuum adsorption system, so as to reduce the gas consumption of the vacuum adsorption system and save energy.

[0005] To achieve this purpose, the technical solution adopted by the present invention is:

[0006] A vacuum adsorption system, comprising an air source, a solenoid valve, a vacuum generator, an adsorption mechanism, a pressure detection component, a first air pipeline and a vacuum pipeline, wherein the air source and the vacuum generator are respectively connected to two ends of the first air pipeline, and the solenoid valve is installed in the first air pipeline and controls the on-off of the first air pipeline;

[0007] The adsorption mechanism is connected to the vacuum port of the vacuum generator through the vacuum pipeline; the pressure detection component is installed in the vacuum pipeline to detect the vacuum value of the vacuum pipeline; the solenoid valve is electrically connected to the pressure detection component so that the solenoid valve is closed when the detection value of the pressure detection component is equal to the target value and can be opened when the detection value is less than the restart value.

[0008] As an optional solution for the vacuum adsorption system, a one-way valve is also installed in the vacuum pipeline.

[0009] As an optional solution for the vacuum adsorption system, the vacuum adsorption system also includes a second gas pipeline and a vacuum breaking valve, the gas source is also connected to one end of the second gas pipeline, the other end of the second gas pipeline is connected to the vacuum pipeline, and the connecting position between the second gas pipeline and the vacuum pipeline is located between the one-way valve and the adsorption mechanism.

[0010] As an optional solution for the vacuum adsorption system, the second gas pipeline is further equipped with a throttle valve, and along the air flow direction in the second gas pipeline, the throttle valve is located downstream of the vacuum breaking valve.

[0011] As an optional solution for the vacuum adsorption system, the vacuum adsorption system also includes a main line and a regulating and filtering mechanism, the gas source is connected to one end of the main line, and the other end of the main line is respectively connected to the first gas supply pipeline and the second gas supply pipeline; the regulating and filtering mechanism is installed on the main line.

[0012] As an optional solution of the vacuum adsorption system, the vacuum adsorption system also includes an alarm mechanism, which is electrically connected to the pressure detection component, and the alarm mechanism can send an alarm signal when the detection value of the pressure detection component is less than a lower limit value, and the target value and the restart value are both greater than the lower limit value.

[0013] As an optional solution of the vacuum adsorption system, the pressure detection component is a vacuum gauge.

[0014] A dicing machine includes the above-mentioned vacuum adsorption system.

[0015] A control method for a vacuum adsorption system is used to control the above vacuum adsorption system to realize a vacuum holding function. The control method for the vacuum adsorption system comprises the following steps:

[0016] S1: opening the solenoid valve and the vacuum generator, and the gas source supplies gas to the vacuum generator until the detection value of the pressure detection component reaches the target value, and then closing the solenoid valve and the vacuum generator;

[0017] S2: The pressure detection component monitors the vacuum value of the vacuum pipeline in real time;

[0018] S3: Determine whether the detection value is less than the restart value;

[0019] If yes, repeat step S1;

[0020] If not, repeat step S2.

[0021] As an optional solution of the control method of the vacuum adsorption system, step S3 also includes the following steps:

[0022] Determine whether the detection value is less than a lower limit value;

[0023] If so, the vacuum adsorption system sends out an alarm signal;

[0024] If not, repeat step S2.

[0025] The beneficial effects of the present invention are:

[0026] The vacuum adsorption system proposed in the present invention detects the vacuum value of the vacuum pipeline through a pressure detection component, and selectively opens or closes the solenoid valve and the vacuum generator according to the size of the detection value, thereby preventing the solenoid valve and the vacuum generator from being continuously opened, thereby preventing the gas source from continuously supplying gas to the vacuum generator. This not only ensures the vacuum holding function of the vacuum adsorption system, but also reduces the gas consumption of the vacuum adsorption system, thereby saving energy consumption.

[0027] The dicing machine proposed in the present invention includes the above-mentioned vacuum adsorption system, which prevents the solenoid valve and the vacuum generator from being continuously opened, thereby preventing the gas source from continuously supplying gas to the vacuum generator. This not only ensures the vacuum maintenance function of the vacuum adsorption system, but also reduces the gas consumption of the dicing machine and saves energy.

[0028] The control method of the vacuum adsorption system proposed in the present invention is used to control the above-mentioned vacuum adsorption system to achieve the vacuum holding function, avoiding the gas source from continuously supplying gas to the vacuum generator, which not only ensures the vacuum holding function of the vacuum adsorption system, but also reduces gas consumption and saves energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a structural distribution diagram of a vacuum adsorption system provided by an embodiment of the present invention;

[0030] Figure 2 It is a detailed flow chart of the control method of the vacuum adsorption system provided in an embodiment of the present invention.

[0031] The names and numbers of the components in the figure are as follows:

[0032] 1. Gas source; 2. Solenoid valve; 3. Vacuum generator; 4. Adsorption mechanism; 5. Pressure detection component; 6. First gas pipeline; 7. Vacuum pipeline; 8. One-way valve; 9. Second gas pipeline; 10. Vacuum breaking valve; 11. Throttle valve; 12. Main pipeline; 13. Adjustable filtering mechanism. DETAILED DESCRIPTION

[0033] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the present invention are further described below in conjunction with the accompanying drawings and through specific implementation methods. It is understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for the convenience of description, only the parts related to the present invention are shown in the accompanying drawings, not all.

[0034] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] In the description of this embodiment, the terms "upper", "lower", "right", "left" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0037] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0038] This embodiment provides a dicing machine, which includes a vacuum adsorption system, and realizes automatic placement and automatic transmission of wafers through the vacuum adsorption system. Since the dicing machine is a prior art, the specific structure and working process of the dicing machine are not described in detail.

[0039] The vacuum adsorption system of the existing dicing machine mainly supplies air to the vacuum generator through the air source. The vacuum generator forms a negative pressure environment in the vacuum pipeline through compressed air to enable the adsorption mechanism to achieve the vacuum adsorption function. In order to ensure the reliable adsorption of the wafer, the air source needs to continuously supply air to the vacuum generator, and the vacuum adsorption system usually contains multiple adsorption mechanisms, which increases the overall gas consumption and energy consumption of the vacuum adsorption system.

[0040] To solve the above problems, Figure 1 As shown, this embodiment also proposes a vacuum adsorption system, which includes a gas source 1, a solenoid valve 2, a vacuum generator 3, a suction mechanism 4, a pressure detection component 5, a first gas pipeline 6 and a vacuum pipeline 7. The gas source 1 and the vacuum generator 3 are respectively connected to the two ends of the first gas pipeline 6, and the solenoid valve 2 is installed in the first gas pipeline 6 and controls the on-off of the first gas pipeline 6. The suction mechanism 4 is connected to the vacuum port of the vacuum generator 3 through the vacuum pipeline 7. The pressure detection component 5 is installed in the vacuum pipeline 7 to detect the vacuum value of the vacuum pipeline 7 (that is, the negative pressure in the vacuum pipeline 7). The solenoid valve 2 is electrically connected to the pressure detection component 5 so that the solenoid valve 2 is closed when the detection value of the pressure detection component 5 is equal to the target value and can be opened when the detection value is less than the restart value. The vacuum value of the vacuum pipeline 7 is detected by the pressure detection component 5, and the solenoid valve 2 and the vacuum generator 3 are selectively opened or closed according to the size of the detected value, so as to avoid the solenoid valve 2 and the vacuum generator 3 being continuously opened, thereby preventing the gas source 1 from continuously supplying gas to the vacuum generator 3, which not only ensures the vacuum holding function of the vacuum adsorption system, but also reduces the gas consumption of the vacuum adsorption system and saves energy.

[0041] It should be noted that the above-mentioned target value and restart value are both preset vacuum values ​​of the vacuum pipeline 7. The target value is generally the maximum pressure value that the vacuum generator 3 can reach, and the restart value is slightly lower than the target value. The target value of the vacuum pipeline 7 in this embodiment is -80Kpa, and the restart value is -70kpa. When the solenoid valve 2 and the vacuum generator 3 are opened, the vacuum value in the vacuum pipeline 7 gradually reaches -80Kpa. At this time, the detection value of the pressure detection component 5 reaches the target value, the solenoid valve 2 and the vacuum generator 3 are closed, and the gas source 1 no longer supplies gas to the vacuum generator 3. When the pressure detection component 5 detects that the vacuum value in the vacuum pipeline 7 is lower than -70kpa, the solenoid valve 2 and the vacuum generator 3 are opened, and the gas source 1 supplies gas to the vacuum generator 3 again until the vacuum value of the vacuum pipeline 7 reaches -80Kpa again. In other embodiments, the target value and the restart value can also be set to other values ​​according to the actual working conditions, which are not specifically limited here.

[0042] In this embodiment, the solenoid valve 2 is a two-position three-way normally open valve or other valve body, which only needs to realize the on-off of the first gas pipeline 6. The pressure detection component 5 is a vacuum gauge, which has low cost, high detection accuracy, and is easy to install and use. In other embodiments, the pressure detection component 5 can also be a pressure sensor or other pressure measuring component.

[0043] like Figure 1 As shown, a one-way valve 8 is also installed in the vacuum pipeline 7. By setting the one-way valve 8, a one-way flow of air in the vacuum pipeline 7 is achieved. When the gas source 1 is suddenly cut off, the vacuum generator 3 is suddenly powered off, and other unexpected situations occur, the one-way valve 8 can ensure the vacuum environment in the vacuum pipeline 7, improve the vacuum maintenance effect of the vacuum pipeline 7, and prevent the adsorption mechanism 4 from being unable to stably adsorb the wafer.

[0044] like Figure 1 As shown, the vacuum adsorption system further includes a second gas pipeline 9 and a vacuum breaking valve 10, the gas source 1 is also connected to one end of the second gas pipeline 9, the other end of the second gas pipeline 9 is connected to the vacuum pipeline 7, and the connection position of the second gas pipeline 9 and the vacuum pipeline 7 is located between the one-way valve 8 and the adsorption mechanism 4. In the vacuum adsorption system, when the adsorption mechanism 4 vacuum adsorbs the wafer, the vacuum breaking valve 10 remains closed to disconnect the second gas pipeline 9; when the adsorption mechanism 4 releases the wafer, the solenoid valve 2 and the vacuum generator 3 are closed, and the first gas pipeline 6 is disconnected. The vacuum breaking valve 10 is opened to allow the gas source 1 to supply gas to the vacuum pipeline 7 through the second gas pipeline 9, destroying the vacuum environment in the vacuum pipeline 7, and completing the operation of the adsorption mechanism 4 releasing the wafer.

[0045] Furthermore, the second gas pipeline 9 is also equipped with a throttle valve 11, and the throttle valve 11 is located downstream of the vacuum breaking valve 10 along the air flow direction in the second gas pipeline 9. When the vacuum breaking valve 10 is opened, the air from the gas source 1 is sequentially delivered to the vacuum pipeline 7 through the vacuum breaking valve 10 and the throttle valve 11 to destroy the vacuum environment of the vacuum pipeline 7. The throttle valve 11 is used to control the flow of the second gas pipeline 9, thereby adjusting the speed of the adsorption mechanism 4 to release the wafer to meet different processing requirements and improve the protection of the wafer.

[0046] like Figure 1As shown, the vacuum adsorption system also includes a main line 12 and an adjusting filter mechanism 13. The gas source 1 is connected to one end of the main line 12, and the other end of the main line 12 is respectively connected to the first gas pipeline 6 and the second gas pipeline 9. The adjusting filter mechanism 13 is installed on the main line 12. The adjusting filter mechanism 13 of this embodiment includes an adjusting component and a filtering component. The adjusting component is used to adjust the flow rate of the air in the main line 12, so as to accurately control the air supply of the gas source 1. The filtering component is used to filter impurities in the air to ensure the cleanliness of the air supply. The above-mentioned adjusting component can be an air flow meter, an air regulating valve, etc., and the filtering component can be a plate filter, a bag filter, etc.

[0047] In the present embodiment, the vacuum adsorption system also includes an alarm mechanism (not shown in the figure), which is electrically connected to the pressure detection component 5, and the alarm mechanism can send an alarm signal when the detection value of the pressure detection component 5 is less than the lower limit value, and the target value and the restart value are both greater than the lower limit value. Specifically, the lower limit value, the restart value and the target value increase in sequence, and the restart value is between the lower limit value and the target value. By setting the alarm mechanism, the vacuum adsorption system can promptly remind the staff to shut down for maintenance when the vacuum value of the vacuum pipeline 7 drops below the lower limit value. The above-mentioned alarm signal can be a single method or a combination of multiple methods such as sound alarm, light alarm and alarm pop-up window of the operation interface of the dicing machine, which is not specifically limited here.

[0048] It should be noted that the above lower limit value is the minimum value for the adsorption mechanism 4 to stably adsorb the wafer. If the vacuum value in the vacuum pipeline 7 is less than the lower limit value, the adsorption mechanism 4 cannot achieve stable adsorption. The lower limit value of the vacuum pipeline 7 in this embodiment is -60Kpa. When the vacuum generator 3 is turned on, the vacuum value of the vacuum pipeline 7 gradually reaches -80Kpa. At this time, the solenoid valve 2 and the vacuum generator 3 are closed, and the gas source 1 no longer supplies gas to the vacuum generator 3. When the pressure detection component 5 detects that the vacuum value in the vacuum pipeline 7 is lower than -60kpa, for example, cracks or leaks appear in the vacuum pipeline 7, the alarm mechanism sends an alarm signal, and the dicing machine stops to detect the vacuum adsorption system. In other embodiments, the lower limit value can also be set to other values ​​according to the actual working conditions, which is not specifically limited here.

[0049] like Figure 2 As shown, this embodiment also discloses a control method of a vacuum adsorption system, which is used to control the above-mentioned vacuum adsorption system to realize the vacuum holding function. The control method of the vacuum adsorption system includes the following steps:

[0050] S1: Open the solenoid valve 2 and the vacuum generator 3, and the gas source 1 supplies gas to the vacuum generator 3 until the detection value of the pressure detection component 5 reaches the target value, and then close the solenoid valve 2 and the vacuum generator 3.

[0051] S2: The pressure detection component 5 monitors the vacuum value of the vacuum pipeline 7 in real time.

[0052] S3: Determine whether the detection value is less than the restart value. If the detection value is less than the restart value, repeat step S1; if the detection value is not less than the restart value, repeat step S2.

[0053] The control method of the vacuum adsorption system mentioned above is used to control the vacuum adsorption system to realize the vacuum holding function. The solenoid valve 2 and the vacuum generator 3 are selectively opened or closed according to the size of the detection value to avoid the solenoid valve 2 and the vacuum generator 3 being continuously opened, thereby avoiding the gas source 1 from continuously supplying gas to the vacuum generator 3. This not only ensures the vacuum holding function of the vacuum adsorption system, but also reduces gas consumption and saves energy.

[0054] Furthermore, step S3 also includes the following steps: judging whether the detection value is less than the lower limit value, if the detection value is less than the lower limit value, the vacuum adsorption system sends an alarm signal; if the detection value is not less than the lower limit value, repeating step S2. When the detection value of the pressure detection member 5 is less than the lower limit value, the alarm mechanism sends an alarm signal to promptly remind the staff to stop the machine for maintenance, thereby improving the safety and reliability of the vacuum adsorption system.

[0055] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. Vacuum adsorption system, characterized in that: The invention comprises an air source (1), an electromagnetic valve (2), a vacuum generator (3), an adsorption mechanism (4), a pressure detection component (5), a first air pipeline (6) and a vacuum pipeline (7), wherein the air source (1) and the vacuum generator (3) are respectively connected to two ends of the first air pipeline (6), and the electromagnetic valve (2) is installed in the first air pipeline (6) and controls the on-off of the first air pipeline (6); The adsorption mechanism (4) is connected to the vacuum port of the vacuum generator (3) through the vacuum pipeline (7); the pressure detection element (5) is installed in the vacuum pipeline (7) to detect the vacuum value of the vacuum pipeline (7); The solenoid valve (2) is electrically connected to the pressure detection element (5) so that the solenoid valve (2) is closed when the detection value of the pressure detection element (5) is equal to the target value and can be opened when the detection value is less than the restart value.

2. The vacuum adsorption system according to claim 1, characterized in that: A one-way valve (8) is also installed in the vacuum pipeline (7).

3. The vacuum adsorption system according to claim 2, characterized in that: The vacuum adsorption system further comprises a second gas pipeline (9) and a vacuum breaking valve (10); the gas source (1) is also connected to one end of the second gas pipeline (9); the other end of the second gas pipeline (9) is connected to the vacuum pipeline (7); and the connection position between the second gas pipeline (9) and the vacuum pipeline (7) is located between the one-way valve (8) and the adsorption mechanism (4).

4. The vacuum adsorption system according to claim 3, characterized in that: The second gas supply pipeline (9) is also equipped with a throttle valve (11), and along the air flow direction in the second gas supply pipeline (9), the throttle valve (11) is located downstream of the vacuum breaking valve (10).

5. The vacuum adsorption system according to claim 3, characterized in that: The vacuum adsorption system further comprises a main pipe (12) and a regulating and filtering mechanism (13); the gas source (1) is connected to one end of the main pipe (12), and the other end of the main pipe (12) is respectively connected to the first gas supply pipeline (6) and the second gas supply pipeline (9); the regulating and filtering mechanism (13) is installed on the main pipe (12).

6. The vacuum adsorption system according to any one of claims 1 to 5, characterized in that: The vacuum adsorption system further comprises an alarm mechanism, which is electrically connected to the pressure detection component (5) and is capable of sending an alarm signal when the detection value of the pressure detection component (5) is less than a lower limit value, and the target value and the restart value are both greater than the lower limit value.

7. The vacuum adsorption system according to any one of claims 1 to 5, characterized in that: The pressure detection component (5) is a vacuum gauge.

8. A dicing machine, characterized in that: A vacuum adsorption system comprising any one of claims 1 to 7.

9. A control method for a vacuum adsorption system, characterized in that: The method for controlling the vacuum adsorption system according to any one of claims 1 to 7 to realize the vacuum holding function comprises the following steps: S1: opening the solenoid valve (2) and the vacuum generator (3), and the gas source (1) supplies gas to the vacuum generator (3) until the detection value of the pressure detection element (5) reaches the target value, and then closing the solenoid valve (2) and the vacuum generator (3); S2: the pressure detection element (5) monitors the vacuum value of the vacuum pipeline (7) in real time; S3: Determine whether the detection value is less than the restart value; If yes, repeat step S1; If not, repeat step S2.

10. The control method of the vacuum adsorption system according to claim 9, characterized in that: Step S3 also includes the following steps: Determine whether the detection value is less than a lower limit value; If so, the vacuum adsorption system sends out an alarm signal; If not, repeat step S2.

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