A die bonding and assembling fixture for a semiconductor packaging module

Abstract

The invention discloses a die-bonding assembly jig for a semiconductor packaging module, and relates to the technical field of semiconductor manufacturing. The die-bonding assembly jig for the semiconductor packaging module comprises a lead frame jig, a chip jig is arranged below the lead frame jig, a lead frame groove is provided on the surface of the lead frame jig, a chip groove is provided on the surface of the chip jig, a clamping mechanism providing a clamping force is arranged inside the chip jig, a clamping mechanism for fixing the lead frame inside the lead frame jig is arranged inside the lead frame jig, an inspection mechanism for inspecting the degree of fit between the lead frame jig and the chip jig is arranged inside the chip jig, a pressing plate is placed inside the lead frame groove and pressed on the upper surface of the lead frame to prevent the lead frame from sliding, a thrust is given to the lower part of the inner wall of the limit block positioning groove by a pressure block limit block, and thus a clamping force is provided between the lead frame jig and the chip jig.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a die bonding and assembling fixture for a semiconductor packaging module. Background Art

[0002] The background art of the die bonding and assembling fixture for a semiconductor packaging module stems from the growing demand for high-performance semiconductor packaging. In order to ensure that the packaging module can effectively conduct heat and maintain structural integrity during the high-temperature soldering process, the assembling accuracy of the fixture between the chip and the lead frame is adjusted to ensure high-precision alignment and fixation of the chip and the lead frame during the automated assembly process. Moreover, automation and robotic technologies are utilized to enable the fixture to operate at high speed and with high precision to meet the needs of mass production.

[0003] During the use of current equipment, there are still many inconveniences: The chip and the lead frame are connected through a tooling fixture to achieve the bonding of the packaging module. Usually, the assembling of the tooling fixture uses a magnetic attraction method to connect the chip and the lead frame. Using magnetic attraction to achieve the assembling of the tooling fixture is generally simple in design and convenient to operate. However, magnetic attraction can be affected by a weakened magnetic field or too high temperature, and the decrease in magnetic force is not easily detectable, resulting in the loosening of the ceramic chip and the lead frame during the assembling process of the tooling fixture, thus affecting the electrical function of the packaging module.

[0004] Therefore, the present invention proposes a die bonding and assembling fixture for a semiconductor packaging module to make up for and improve the deficiencies of the prior art. Summary of the Invention

[0005] (I) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the prior art, the present invention provides a die bonding and assembling fixture for a semiconductor packaging module, which solves the problem of loosening of the ceramic chip and the lead frame easily generated by using magnetic attraction to achieve the assembling of the tooling fixture as mentioned in the above background art.

[0007] (II) Technical Solutions

[0008] To achieve the above object, the present invention is realized through the following technical solutions: A die bonding and assembling fixture for a semiconductor packaging module, including a lead frame fixture, a chip fixture is provided below the lead frame fixture, a lead frame groove is opened on the surface of the lead frame fixture, a chip groove is opened on the surface of the chip fixture, a clamping mechanism for providing clamping force is arranged inside the chip fixture, a pressing mechanism for fixing the lead frame inside the lead frame fixture is arranged inside the lead frame fixture, an inspection mechanism for inspecting the fitting degree between the lead frame fixture and the chip fixture is arranged inside the chip fixture. The clamping mechanism includes a pressure block for clamping the chip fixture, the pressing mechanism includes a connecting support rod for fixing the lead frame on the surface of the lead frame fixture, and the inspection mechanism includes an inspection groove for observing the fitting degree between the lead frame fixture and the chip fixture.

[0009] Preferably, the clamping mechanism includes a limiting block, the limiting block is fixedly connected to the lower surface of the lead frame fixture, the limiting blocks are evenly distributed at the four corners of the lead frame fixture, the pressure block is rotatably connected to the inside of the chip fixture, a connecting block and a rebounding block are slidably connected to the inside of the lead frame fixture, the connecting block contacts the upper surface of one end of the pressure block, the rebounding block contacts the lower surface of one end of the pressure block, a first spring is fixedly connected to the inside of the chip fixture, the first spring is fixedly connected to the rebounding block, and a power plate is slidably connected to the inside of the chip fixture.

[0010] Preferably, a clamping block is fixedly connected to one end of the pressure block, a clamping groove is opened on the surface of the limiting block, and the clamping block on the surface of the pressure block extends into the clamping groove of the limiting block.

[0011] Preferably, a slope is arranged on one side of the connecting block close to the power plate, and the connecting block is located inside the sliding path of the power plate.

[0012] Preferably, the pressing mechanism includes an adjusting support rod, the adjusting support rod is slidably connected to the inside of the lead frame fixture, the connecting support rod is rotatably connected to the inside of one end of the adjusting support rod, a pressure plate is fixedly connected to the surface of the adjusting support rod, a second spring is fixedly connected to the inside of the lead frame fixture, the second spring is fixedly connected to the pressure plate, a support support rod is rotatably connected to the inside of the lead frame fixture, the connecting support rod is rotatably connected to the inside of one end of the support support rod, a pressure rod is slidably connected to one end of the connecting support rod, a third spring is fixedly connected to the lower surface of the connecting support rod, and the pressure rod is fixedly connected to the third spring.

[0013] Preferably, a pressing plate is slidably connected to the inside of the lead frame groove of the lead frame fixture, and the pressure rod is located inside the sliding path of the pressing plate in the lead frame groove of the lead frame fixture.

[0014] Preferably, the adjustment rod extends to the lower surface of the lead frame fixture, and the adjustment rod contacts the upper surface of the chip fixture.

[0015] Preferably, the inspection mechanism includes a connecting push rod, which is slidably connected to the inside of the chip jig, a No. 4 spring is fixedly connected to the inside of the chip jig, and the No. 4 spring is fixedly connected to the connecting push rod, the chip jig is rotatably connected to the inside of the No. 1 gear, the No. 1 gear is meshed with the connecting push rod, the chip jig is rotatably connected to the No. 2 gear, and the No. 2 gear is coaxial with the No. 1 gear, the chip jig is slidably connected to the inside of the sliding gear rod, the chip jig is slidably connected to the inside of the sliding piston, the chip jig is fixedly connected to the inside of the No. 5 spring, the sliding piston is fixedly connected to the No. 5 spring, the chip jig is fixedly connected to the inside of the adjusting slider, one end of the sliding piston is slidably connected to the inside of the sliding block, one end of the sliding piston is fixedly connected to the inside of the sliding block, the No. 6 spring is fixedly connected to the sliding block, the surface of the sliding gear rod is fixedly connected to the power slider, the adjusting slider and the power slider are both located in the sliding path of the sliding block, the inspection groove is opened on the upper surface of the chip jig, and the lead frame jig extends to the inside of the inspection groove.

[0016] Preferably, the thickness of the power slider and the adjustment slider are both half of the thickness of the sliding block, and the adjustment slider and the power slider are not located in the same horizontal plane.

[0017] Preferably, an air guide groove is provided inside the chip jig, and the air guide groove of the chip jig is connected to the sliding groove of the sliding piston.

[0018] (III) Beneficial effects

[0019] The die-bonding assembly jig for the semiconductor packaging module provided by the present invention has the following beneficial effects:

[0020] 1. Through the coordinated use of the lead frame jig and the clamping mechanism, the chip is manually placed inside the chip slot on the surface of the chip jig, the lead frame is placed inside the lead frame slot on the surface of the lead frame jig, the pressure plate is placed inside the lead frame slot, pressed on the upper surface of the lead frame to prevent the lead frame from sliding, and a thrust is given to the lower wall of the limit block slot through the pressure block limit block, thereby providing a clamping force between the lead frame jig and the chip jig, and limiting the positional relationship between the lead frame jig and the chip jig. The clamping mechanism ensures the precise alignment between the chip and the lead frame through the physical structure, and the clamping mechanism has good durability and is not easy to fail due to long-term use.

[0021] 2. Through the coordinated use of the lead frame jig and the clamping mechanism, during the assembly process of the lead frame jig and the chip jig, the pressure rod contacts the upper surface of the pressure plate, thereby limiting the position of the pressure plate, and in the process of connecting the support rod so that the inclined state gradually changes to the horizontal state, the pressure plate pushes the pressure rod to slide upward, and the No. 3 spring is compressed under the push of the pressure rod. When the chip and the lead frame are bonded, the pressure rod gives the lead frame a downward thrust to ensure that the pads between the chip and the lead frame have sufficient contact area and pressure, thereby reducing problems such as signal attenuation, circuit breakage or insufficient mechanical strength caused by poor contact.

[0022] 3. Through the coordinated use of the clamping mechanism and the pressing mechanism, during the assembly process of the lead frame jig and the chip jig, the gas between the lead frame jig and the chip jig can only be discharged through the edge gap between the lead frame jig and the chip jig. Since the lead frame jig is located inside the inspection groove on the surface of the chip jig, soapy water is provided inside the inspection groove. The soapy water will form bubbles between the lead frame and the chip. The size and number of bubbles can indicate the degree of fit, thereby avoiding the problem of poor fit between the lead frame and the chip assembly jig, resulting in poor contact between the lead frame and the pads on the chip, which in turn affects the reliability of the electrical connection and signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0025] Figure 3 This is a location distribution diagram of the internal mechanism of the present invention;

[0026] Figure 4 It is a schematic diagram of the overall structure of the clamping mechanism of the present invention;

[0027] Figure 5 For the present invention Figure 4 A partial enlarged view of middle A;

[0028] Figure 6 It is a schematic diagram of the overall structure of the clamping mechanism of the present invention;

[0029] Figure 7 For the present invention Figure 6 A partial enlarged view of B in the middle;

[0030] Figure 8 It is a schematic diagram of the internal structure of the inspection mechanism of the present invention;

[0031] Figure 9 It is a schematic diagram of the overall structure of the inspection mechanism of the present invention;

[0032] Figure 10 For the present invention Figure 9 Partial enlarged view of C in the present invention;

[0033] Figure 11 Schematic diagram of the connection between the lead frame fixture and the chip fixture of the present invention.

[0034] The reference numerals in the figure respectively represent: 1. Lead frame fixture; 2. Chip fixture; 3. Clamping mechanism; 311. Limit block; 312. Pressure block; 313. Rebound block; 314. First spring; 315. Connection block; 316. Power plate; 4. Pressing mechanism; 411. Adjusting support rod; 412. Connecting support rod; 413. Second spring; 414. Pressure plate; 415. Supporting support rod; 416. Pressure rod; 417. Third spring; 5. Inspection mechanism; 511. Connecting push rod; 512. First gear; 513. Fourth spring; 514. Second gear; 515. Sliding rack; 516. Fifth spring; 517. Power slider; 518. Adjusting slider; 519. Sliding piston; 5110. Sliding abutting block; 5111. Sixth spring; 5112. Inspection groove. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Refer to Figures 1 to 11 , and a die bonding and assembling fixture for a semiconductor packaging module according to a preferred embodiment of the present invention will be described in detail below. A die bonding and assembling fixture for a semiconductor packaging module includes a lead frame fixture 1. A chip fixture 2 is provided below the lead frame fixture 1. A lead frame groove is formed on the surface of the lead frame fixture 1. A chip groove is formed on the surface of the chip fixture 2. A clamping mechanism 3 for providing a clamping force is provided inside the chip fixture 2. A pressing mechanism 4 for fixing the lead frame inside the lead frame fixture 1 is provided inside the lead frame fixture 1. An inspection mechanism 5 for inspecting the fitting degree between the lead frame fixture 1 and the chip fixture 2 is provided inside the chip fixture 2. The clamping mechanism 3 includes a pressure block 312 for clamping the chip fixture 2. The pressing mechanism 4 includes a connecting support rod 412 for fixing the lead frame on the surface of the lead frame fixture 1. The inspection mechanism 5 includes an inspection groove 5112 for observing the fitting degree between the lead frame fixture 1 and the chip fixture 2.

[0037] As Figure 4In the embodiment, the clamping mechanism 3 includes a limit block 311, which is fixedly connected to the lower surface of the lead frame fixture 1. The limit blocks 311 are evenly distributed at the four corners of the lead frame fixture 1. Figure 11 In the embodiment, the chip is manually placed in the chip slot on the surface of the chip fixture 2, the lead frame is placed in the lead frame slot on the surface of the lead frame fixture 1, the pressure plate is placed in the lead frame slot, pressed on the upper surface of the lead frame to prevent the lead frame from sliding, and the lead frame fixture 1 is fixed to the upper surface of the chip fixture 2, and the limit block 311 extends to the inside of the lead frame fixture 1, as shown in FIG. Figure 5 In the embodiment, the pressure block 312 is rotatably connected to the inside of the chip fixture 2, the lead frame fixture 1 is internally slidably connected with a connecting block 315 and a rebound block 313, the connecting block 315 contacts the upper surface of one end of the pressure block 312, the rebound block 313 contacts the lower surface of one end of the pressure block 312, the chip fixture 2 is internally fixedly connected with a spring No. 1 314, the spring No. 1 314 is fixedly connected to the rebound block 313, the chip fixture 2 is internally slidably connected with a power plate 316, one end of the pressure block 312 is fixedly connected with a card The surface of the limit block 311 is provided with a positioning groove. At this time, the lower surface of the limit block 311 contacts the inclined surface of the limit block 312 at one end of the pressure block 312. The limit block 311 slides down to give the inclined surface of the pressure block 312 a leftward thrust. The pressure block 312 rotates counterclockwise inside the chip fixture 2, and the end of the pressure block 312 away from the limit block 311 pushes the rebound block 313 to slide downward. As the limit block 311 continues to slide down, the positioning groove on the surface of the limit block 311 reaches the inside of the rotation path of the pressure block 312. Figure 5 In the embodiment, the surface positioning block of the pressure block 312 extends to the inside of the positioning groove of the limit block 311, and the connecting block 315 is provided with an inclined surface near the side of the power plate 316. The connecting block 315 is located inside the sliding path of the power plate 316. The rebound block 313 loses the restriction of the limit block 311 on the pressure block 312, thereby increasing the thrust, and then the rebound block 313 is driven to slide upward through the No. 1 spring 314, thereby pushing the pressure block 312 to rotate clockwise, and a thrust is given to the lower part of the inner wall of the positioning groove of the limit block 311 through the pressure block 312, thereby providing a clamping force between the lead frame fixture 1 and the chip fixture 2, and limiting the positional relationship between the lead frame fixture 1 and the chip fixture 2. The clamping mechanism 3 ensures the precise alignment between the chip and the lead frame through the physical structure, and the clamping mechanism 3 has good durability and is not easy to fail due to long-term use.

[0038] like Figure 6 In the embodiment, the clamping mechanism 4 includes an adjusting rod 411, which is slidably connected to the inside of the lead frame fixture 1. During the assembly process of the lead frame fixture 1 and the chip fixture 2, the adjusting rod 411 contacts the upper surface of the chip fixture 2, and the chip fixture 2 pushes the adjusting rod 411 to slide upward. Figure 7Among them, the connecting rod 412 is rotatably connected to the inside of one end of the adjusting rod 411. A pressure plate 414 is fixedly connected to the surface of the adjusting rod 411. A second spring 413 is fixedly connected inside the lead frame fixture 1. The second spring 413 is fixedly connected to the pressure plate 414. A support rod 415 is rotatably connected inside the lead frame fixture 1. The connecting rod 412 is rotatably connected to the inside of one end of the support rod 415. During the upward sliding of the adjusting rod 411, the support rod 415 is pushed to rotate counterclockwise through the connecting rod 412. When the support rod 415 becomes vertical, it stops rotating under the restriction of the inner wall of the lead frame fixture 1. As the adjusting rod 411 continues to slide upward, the connecting rod 412 rotates around one end of the support rod 415, and thus the inclined state gradually changes to a horizontal state. At this time, the pressure rod 416 contacts the upper surface of the pressing plate, thereby limiting the position of the pressing plate. As Figure 7 Among them, a pressure rod 416 is slidably connected to one end of the connecting rod 412. A third spring 417 is fixedly connected to the lower surface of the connecting rod 412. The pressure rod 416 is fixedly connected to the third spring 417. A pressing plate is slidably connected inside the lead frame groove of the lead frame fixture 1. The pressure rod 416 is located in the sliding path of the pressing plate in the lead frame groove of the lead frame fixture 1. And during the process that the connecting rod 412 gradually changes from an inclined state to a horizontal state, the pressing plate pushes the pressure rod 416 to slide upward, and the third spring 417 is compressed under the push of the pressure rod 416. When the chip and the lead frame are keyed together, a downward thrust is given to the lead frame through the pressure rod 416 to ensure that there is sufficient contact area and pressure between the pads of the chip and the lead frame, reducing problems such as signal attenuation, open circuit or insufficient mechanical strength caused by poor contact.

[0039] As Figure 8 Among them, the inspection mechanism 5 includes a connecting push rod 511. The connecting push rod 511 is slidably connected inside the chip fixture 2. A fourth spring 513 is fixedly connected inside the chip fixture 2. The fourth spring 513 is fixedly connected to the connecting push rod 511. A first gear 512 is rotatably connected inside the chip fixture 2. The first gear 512 meshes with the connecting push rod 511. A second gear 514 is rotatably connected inside the chip fixture 2. The second gear 514 is coaxial with the first gear 512. During the assembly process of the lead frame fixture 1 and the chip fixture 2, the limiting block 311 slides downward to push the connecting push rod 511 to slide rightward, and drives the first gear 512 to rotate counterclockwise through the surface teeth, thereby driving the second gear 514 to rotate synchronously. As Figure 10Inside, a sliding rack 515 is slidably connected inside the chip fixture 2, a sliding piston 519 is slidably connected inside the chip fixture 2, a fifth spring 516 is fixedly connected inside the chip fixture 2, and the sliding piston 519 is fixedly connected to the fifth spring 516. An adjusting slider 518 is fixedly connected inside the chip fixture 2. A sliding abutting block 5110 is slidably connected inside one end of the sliding piston 519. A sixth spring 5111 is fixedly connected inside one end of the sliding piston 519, and the sixth spring 5111 is fixedly connected to the sliding abutting block 5110. A power slider 517 is fixedly connected to the surface of the sliding rack 515. Both the adjusting slider 518 and the power slider 517 are located within the sliding path of the sliding abutting block 5110. The second gear 514 rotates counterclockwise to push the sliding rack 515 to slide leftward, and a leftward thrust is given to the sliding abutting block 5110 through the power slider 517 on the surface, thereby driving the sliding piston 519 to slide leftward, and then injecting air into the sliding groove of the sliding piston 519 through the one-way valve on the lower surface of the chip fixture 2, as Figure 10 Inside, an inspection groove 5112 is formed on the upper surface of the chip fixture 2, and the lead frame fixture 1 extends into the inspection groove 5112. The thicknesses of both the power slider 517 and the adjusting slider 518 are half of the thickness of the sliding abutting block 5110. The adjusting slider 518 and the power slider 517 are not on the same horizontal plane. An air guide groove is formed inside the chip fixture 2, and the air guide groove of the chip fixture 2 is communicated with the sliding groove of the sliding piston 519. When the lead frame fixture 1 is in contact with the surface of the chip fixture 2, the sliding abutting block 5110 is in contact with the inclined surface of the sliding piston 519. The sliding abutting block 5110 extends into the sliding piston 519 under the push of the inclined surface of the adjusting slider 518. At this time, the sliding abutting block 5110 is disengaged from the restriction of the power slider 517. The sliding piston 519 slides rightward under the push of the fifth spring 516, and then injects the gas inside the sliding groove of the sliding piston 519 into the space between the lead frame fixture 1 and the chip fixture 2 through the air guide groove. Since there is a pressing plate in the limit frame groove of the lead frame fixture 1 and it is limited by the pressing mechanism 4, the gas between the lead frame fixture 1 and the chip fixture 2 can only be discharged intermittently through the edges of the lead frame fixture 1 and the chip fixture 2. Since the lead frame fixture 1 is located inside the inspection groove 5112 on the surface of the chip fixture 2, soapy water is provided inside the inspection groove 5112, and soapy water will form bubbles between the lead frame and the chip. The size and the number of generated bubbles can indicate the degree of fitting.

[0040] The following is the entire working process and working principle of the above embodiment: manually place the chip inside the chip slot on the surface of the chip fixture 2, place the lead frame inside the lead frame slot on the surface of the lead frame fixture 1, place the pressure plate inside the lead frame slot, press on the upper surface of the lead frame to prevent the lead frame from sliding, and fix the lead frame fixture 1 to the upper surface of the chip fixture 2. The limit block 311 extends to the inside of the lead frame fixture 1, and the rebound block 313 is driven to slide upward by the first spring 314, thereby pushing the pressure block 312 to rotate clockwise, and the pressure block 312 gives a thrust to the lower wall of the limit block 311 under the positioning slot, thereby providing a clamping force between the lead frame fixture 1 and the chip fixture 2, and clamping the lead frame fixture 1 and the chip fixture 2. The positional relationship between the chip fixture 2 is limited, and the clamping mechanism 3 ensures the precise alignment between the chip and the lead frame through the physical structure. The durability of the clamping mechanism 3 is good and it is not easy to fail due to long-term use. At the same time, during the assembly of the lead frame fixture 1 and the chip fixture 2, the support rod 411 is adjusted to continue to slide upward, and the connecting support rod 412 rotates around one end of the supporting support rod 415, so that the inclined state gradually changes to a horizontal state. At this time, the pressure rod 416 contacts the upper surface of the pressure plate, and the connecting support rod 412 gradually changes from the inclined state to the horizontal state. The pressure plate pushes the pressure rod 416 to slide upward, and the third spring 417 is compressed under the push of the pressure rod 416. When the chip is bonded to the lead frame, the pressure rod 416 is pressed. The force rod 416 gives the lead frame a downward thrust to ensure that the pads between the chip and the lead frame have sufficient contact area and pressure, thereby reducing problems such as signal attenuation, circuit breakage or insufficient mechanical strength caused by poor contact. Furthermore, during the assembly of the lead frame fixture 1 and the chip fixture 2, the limit block 311 slides downward to push the connecting push rod 511 to slide to the right, and pushes the first gear 512 to rotate counterclockwise through the surface tooth block, thereby driving the second gear 514 to rotate synchronously. The second gear 514 rotates counterclockwise to push the sliding gear rod 515 to slide to the left, and gives the sliding block 5110 a leftward thrust through the surface power slider 517, thereby driving the sliding piston 519 to slide to the left, thereby passing through the chip fixture 2. The one-way valve on the lower surface injects air into the sliding groove of the sliding piston 519. When the lead frame jig 1 and the chip jig 2 are fitted on the surface, the sliding piston 519 slides to the right under the push of the No. 5 spring 516, and then the gas inside the sliding groove of the sliding piston 519 is injected into the space between the lead frame jig 1 and the chip jig 2 through the air guide groove. Since the limit frame groove of the lead frame jig 1 has a pressure plate and is limited by the clamping mechanism 4, the gas between the lead frame jig 1 and the chip jig 2 can only be discharged intermittently through the edges of the lead frame jig 1 and the chip jig 2. The soapy water inside the inspection groove 5112 will form bubbles between the lead frame and the chip jig under the blowing of the gas, and the size and number of bubbles produced can indicate the degree of fitting.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A die-bonding assembly jig for a semiconductor packaging module, comprising a lead frame jig (1), a chip jig (2) being arranged below the lead frame jig (1), a lead frame groove being provided on the surface of the lead frame jig (1), and a chip groove being provided on the surface of the chip jig (2), wherein: The chip jig (2) is provided with a clamping mechanism (3) for providing a clamping force, the lead frame jig (1) is provided with a pressing mechanism (4) for fixing the lead frame inside the lead frame jig (1), and the chip jig (2) is provided with an inspection mechanism (5) for inspecting the degree of fit between the lead frame jig (1) and the chip jig (2); The clamping mechanism (3) comprises a limit block (311), the limit block (311) is fixedly connected to the lower surface of the lead frame jig (1), the limit blocks (311) are evenly distributed at the four corners of the lead frame jig (1), the chip jig (2) is rotatably connected to a pressure block (312) inside, the chip jig (2) is slidably connected to a connecting block (315) and a rebound block (313) inside, the connecting block (315) is in contact with an upper surface of one end of the pressure block (312), the rebound block (313) is in contact with a lower surface of one end of the pressure block (312), the chip jig (2) is fixedly connected to a No. 1 spring (314), the No. 1 spring (314) is fixedly connected to the rebound block (313), and the chip jig (2) is slidably connected to a power plate (316); The clamping mechanism (4) comprises a connecting rod (412) for fixing the lead frame on the surface of the lead frame fixture (1); The inspection mechanism (5) comprises an inspection groove (5112) for observing the degree of fit between the lead frame fixture (1) and the chip fixture (2).

2. The die-bonding assembly jig for a semiconductor package module according to claim 1, characterized in that: One end of the pressure block (312) is fixedly connected to a positioning block, a positioning groove is provided on the surface of the limiting block (311), and the positioning block on the surface of the pressure block (312) extends into the positioning groove of the limiting block (311).

3. The die-bonding assembly jig for a semiconductor package module according to claim 1, characterized in that: A slope is provided on one side of the connection block (315) close to the power plate (316), and the connection block (315) is located inside the sliding path of the power plate (316).

4. The die-bonding assembly jig for a semiconductor package module according to claim 1, characterized in that: The clamping mechanism (4) comprises an adjusting support rod (411), wherein the adjusting support rod (411) is slidably connected to the inside of the lead frame jig (1), the connecting support rod (412) is rotatably connected to the inside of one end of the adjusting support rod (411), a pressure plate (414) is fixedly connected to the surface of the adjusting support rod (411), a No. 2 spring (413) is fixedly connected to the inside of the lead frame jig (1), the No. 2 spring (413) and the pressure plate (414) are fixedly connected, a supporting support rod (415) is rotatably connected to the inside of one end of the supporting support rod (415), one end of the connecting support rod (412) is slidably connected to a pressure rod (416), a No. 3 spring (417) is fixedly connected to the lower surface of the connecting support rod (412), and the pressure rod (416) and the No. 3 spring (417) are fixedly connected.

5. The die-bonding assembly jig for a semiconductor package module according to claim 4, characterized in that: A pressure plate is slidably connected inside the lead frame slot of the lead frame jig (1), and the pressure rod (416) is located within the sliding path of the pressure plate in the lead frame slot of the lead frame jig (1).

6. The die-bonding assembly jig for a semiconductor package module according to claim 4, characterized in that: The adjusting support rod (411) extends to the lower surface of the lead frame fixture (1), and the adjusting support rod (411) is in contact with the upper surface of the chip fixture (2).

7. The die-bonding assembly jig for a semiconductor package module according to claim 4, characterized in that: The inspection mechanism (5) comprises a connecting push rod (511), wherein the connecting push rod (511) is slidably connected to the inside of the chip fixture (2), a No. 4 spring (513) is fixedly connected to the inside of the chip fixture (2), and the No. 4 spring (513) and the connecting push rod (511) are fixedly connected, the inside of the chip fixture (2) is rotatably connected to a No. 1 gear (512), and the No. 1 gear (512) and the connecting push rod (511) are meshed, the inside of the chip fixture (2) is rotatably connected to a No. 2 gear (514), and the No. 2 gear (514) and the No. 1 gear (512) are coaxial, the inside of the chip fixture (2) is slidably connected to a sliding gear rod (515), the inside of the chip fixture (2) is slidably connected to a sliding piston (519), and the inside of the chip fixture (2) is fixedly connected A No. 5 spring (516) is provided, the sliding piston (519) is fixedly connected to the No. 5 spring (516), an adjusting slider (518) is fixedly connected inside the chip fixture (2), one end of the sliding piston (519) is internally slidably connected to a sliding stopper (5110), one end of the sliding piston (519) is internally fixedly connected to a No. 6 spring (5111), the No. 6 spring (5111) and the sliding stopper (5110) are fixedly connected, a power slider (517) is fixedly connected to the surface of the sliding gear rod (515), the adjusting slider (518) and the power slider (517) are both located in the sliding path of the sliding stopper (5110), the inspection groove (5112) is opened on the upper surface of the chip fixture (2), and the lead frame fixture (1) extends to the inside of the inspection groove (5112).

8. The die-bonding assembly jig for a semiconductor package module according to claim 7, characterized in that: The thickness of the power slider (517) and the adjustment slider (518) are both half the thickness of the sliding stop (5110), and the adjustment slider (518) and the power slider (517) are not located on the same horizontal plane.

9. The die-bonding assembly jig for a semiconductor package module according to claim 7, characterized in that: An air guide groove is provided inside the chip jig (2), and the air guide groove of the chip jig (2) is in communication with the sliding groove of the sliding piston (519).

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