Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the field of electronic equipment.The electronic equipment comprises a frame, a supporting beam and a pressure sensing module, the frame is provided with a containing groove, the supporting beam comprises a first fixing part, a second fixing part and a supporting part, and the first fixing part and the second fixing part are fixedly connected to the two opposite ends of the supporting part respectively; the two side parts of the containing groove are used for installing the first fixing part and the second fixing part respectively, the middle part of the containing groove is used for containing the supporting part, and a deformation gap is formed between the supporting part and the groove bottom of the containing groove. The pressure sensing module is arranged on the surface of one side of the supporting part in a stacked mode in the supporting direction of the supporting part.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Influenced by users' demand for waterproofing of electronic devices such as mobile phones, electronic devices can eliminate the through holes on the middle frame of the electronic device that originally corresponded to the physical switches by using pressure-sensitive buttons instead of physical switches. Among them, the current pressure-sensitive buttons are provided with intermittent steel plates, and the pressure-sensitive material is overlapped between two adjacent steel plates in the segmented steel plate so that the pressure-sensitive material can be deformed under pressure and provide press feedback. However, due to the strong brittleness of the pressure-sensitive material, during the processing and assembly of the pressure-sensitive buttons, it is necessary to squeeze the structures against each other to complete the connection and assembly work. During this process, the part of the pressure-sensitive material located at the edge area of ​​the steel plate has strong and concentrated stress, which makes the aforementioned area of ​​the pressure-sensitive material prone to cracks or even direct fractures, resulting in failure of the pressure-sensitive button. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide an electronic device to solve the problem that pressure-sensitive keys in current electronic devices are prone to cracks or even break directly due to stress concentration during assembly, resulting in failure of the pressure-sensitive keys.

[0004] An embodiment of the present application discloses an electronic device, which includes a frame, a support beam and a pressure sensing module, the frame is provided with a receiving groove, the support beam includes a first fixing portion, a second fixing portion and a supporting portion, the first fixing portion and the second fixing portion are respectively fixedly connected to opposite ends of the supporting portion, the two side portions of the receiving groove are respectively used to install the first fixing portion and the second fixing portion, the middle portion of the receiving groove is used to accommodate the supporting portion, and a deformation gap is provided between the supporting portion and the bottom of the receiving groove, and the pressure sensing module is stacked on a side surface of the supporting portion along the supporting direction of the supporting portion.

[0005] The embodiment of the present application discloses an electronic device, whose frame is provided with a receiving groove, the receiving groove is divided into a middle part and two side parts, the first fixed part and the second fixed part of the support beam are respectively installed in the two side parts of the receiving groove, the support part connected between the first fixed part and the second fixed part in the support beam is accommodated in the middle part of the receiving groove, and a deformation gap is provided between the support part and the groove bottom of the receiving groove, so that when the support part is subjected to a pressing force, the support part can move and deform toward the groove bottom of the receiving groove. At the same time, the pressure sensing module is stacked on the side surface of the support part along the supporting direction of the support part, so that in the process of deformation of the support part, the pressure sensing module can be deformed together to output a pressure sensing signal, and the support part can also provide good support for the pressure sensing module, thereby preventing stress concentration problems at any position on the pressure sensing module during the assembly process of the electronic device, thereby improving the service life of the pressure sensing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1-Figure 4 Schematic diagrams of different structures of electronic devices disclosed in embodiments of the present application; Figure 5 A schematic diagram of the structure of a pressure sensing module in an electronic device disclosed in an embodiment of the present application; Figure 6 This is a schematic diagram of the structure of an electronic device using another pressure sensing module disclosed in an embodiment of the present application.

[0007] Reference numerals: 100-frame, 101-deformation gap, 102-accommodation slot, 200-support beam, 210-first fixing portion, 211-avoidance gap, 220-second fixing portion, 230-support portion, 300-pressure sensing module, 310-circuit board, 320-pressure sensing material, 330-conductive part, 340-pad, 350-insulating protective layer, 360-piezoelectric device, 410 - keycap, 420 - adhesive layer, 430 - insert, 440 - first connecting layer, 450 - second connecting layer. DETAILED DESCRIPTION

[0008] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0009] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0010] like Figure 1-Figure 6 As shown, an embodiment of the present application discloses an electronic device, which includes a frame 100, a support beam 200 and a pressure sensing module 300. Of course, the electronic device may also generally include other components such as a display screen and a battery. Considering the simplicity of the text, they will not be introduced one by one here.

[0011] Specifically, the frame 100 may include an outer frame of the electronic device, that is, during the use of the electronic device, at least a portion of the outer surface of the frame 100 may be exposed so that the user can touch the outer surface of the frame 100, and the user can interact with the electronic device by directly or indirectly pressing the pressure sensing module 300 disposed on the frame 100.

[0012] The frame 100 can be formed of a hard material such as metal or plastic. As shown in the figure, the frame 100 is provided with a receiving groove 102. Specifically, the receiving groove 102 is recessed from the outer surface of the frame 100, so that the support beam 200 and the pressure sensing module 300 can be installed in the receiving groove 102, and the user can press the pressure sensing module 300 from the outer surface of the frame 100. Of course, the shape and depth of the receiving groove 102 can be flexibly designed according to the thickness and other dimensions of the support beam 200 and the pressure sensing module 300, and this document does not limit this.

[0013] At the same time, in order to ensure that the pressure sensing module 300 can deform normally and generate a pressure sensing signal when pressed, in the electronic device disclosed in the embodiment of the present application, the receiving groove 102 includes a middle part and two side parts respectively located at the aforementioned middle part. Of course, both side parts are connected to the middle part, so that this form of receiving groove 102 can be used to accommodate the support beam 200. At the same time, the receiving groove 102 can provide support for the support beam 200, so that the support part 230 located in the middle position of the support beam 200 can be deformed under pressure, and correspondingly the pressure sensing module 300 is deformed, and a deformation signal is output.

[0014] In more detail, the support beam 200 includes a first fixing portion 210, a second fixing portion 220 and a support portion 230, wherein the first fixing portion 210 and the second fixing portion 220 are fixedly connected to opposite ends of the support portion 230, respectively. Optionally, the first fixing portion 210, the second fixing portion 220 and the support portion 230 can all be formed of a material with relatively large structural strength such as metal, and the aforementioned three can be formed separately by separate molding, and then, the first fixing portion 210 and the second fixing portion 220 can be fixedly connected to opposite ends of the support portion 230 by welding or other methods. In other embodiments of the present application, the support beam 200 can be formed by a material with relatively large structural strength such as metal by an integral molding method. In a specific embodiment of the present application, the support beam 200 can be a steel plate with relatively small thickness, and along the length direction of the steel plate, it includes the first fixing portion 210, the support portion 230 and the second fixing portion 220 in sequence. It should be noted that the support beam 200 has good structural strength and is also deformable, that is, the support beam 200 is an elastic deformable part. When the support beam 200 is formed of metal material, by making the thickness of the support beam 200 relatively small, it can also be ensured that the support beam 200 has both good elastic deformation ability and high structural strength.

[0015] As described above, the receiving groove 102 is used to receive the support beam 200. Specifically, the two side portions of the receiving groove 102 can be used to install the first fixing portion 210 and the second fixing portion 220 respectively, and the middle portion of the receiving groove 102 is used to receive the support portion 230. That is, in the process of assembling the electronic device, the first fixing portion 210 and the second fixing portion 220 can be installed in the two side portions of the receiving groove 102 respectively, and correspondingly, the support portion 230 is received in the middle portion of the receiving groove 102. Of course, in order to ensure that the support portion 230 still has the ability to be deformed under pressure, in the embodiment of the present application, as shown in the figure, a deformation gap 101 is provided between the support portion 230 and the bottom of the receiving groove 102, so that when the side surface of the support portion 230 away from the bottom of the receiving groove 102 is subjected to a pressing force, the support portion 230 can move toward the bottom of the receiving groove 102 to deform. Among them, the bottom of the accommodating groove 102 is the inner wall of the groove opening facing the accommodating groove 102, and the supporting direction of the supporting part 230 is the depth direction of the accommodating groove 102. Of course, in the depth direction of the accommodating groove 102, the specific size of the deformation gap 101 can be determined according to actual conditions such as the degree of deformability of the pressure sensing module 300, and this article does not limit this.

[0016] Accordingly, in order to ensure that the electronic device disclosed in the embodiment of the present application has pressure sensing capability, as shown in the figure, the pressure sensing module 300 is stacked on a side surface of the support portion 230 along the support direction of the support portion 230, and then in the process of the support portion 230 being compressed and deformed, the pressure sensing module 300 can be driven to produce a deformation process, and then the pressure sensing module 300 outputs a pressure sensing signal. Of course, in the electronic device, the pressure sensing module 300 also needs to form an electrical connection relationship with the motherboard and other devices of the electronic device, so that the pressure sensing signal generated by the pressure sensing module 300 can be transmitted to the motherboard and converted into corresponding control commands, etc.

[0017] In more detail, in the electronic device disclosed in the embodiment of the present application, in a plane perpendicular to the supporting direction of the supporting portion 230, the projection of the surface of the supporting portion 230 for installing the pressure sensing module 300 can cover the projection of the surface on which the pressure sensing module 300 and the supporting portion 230 are in contact. In this case, any position on the pressure sensing module 300 can be supported by the supporting portion 230. Therefore, during the assembly of the electronic device, even if the pressure sensing module 300 and the supporting portion 230 are subjected to mutual squeezing force, since the supporting portion 230 can provide a more comprehensive support for the pressure sensing module 300, the pressure sensing module 300 can be prevented from being damaged due to local stress concentration.

[0018] The embodiment of the present application discloses an electronic device, wherein a frame 100 is provided with a receiving groove 102, and the receiving groove 102 is divided into a middle part and two side parts. The first fixing part 210 and the second fixing part 220 of the support beam 200 are respectively installed in the two side parts of the receiving groove 102, and the support part 230 connected between the first fixing part 210 and the second fixing part 220 in the support beam 200 is accommodated in the middle part of the receiving groove 102, and a deformation gap 101 is provided between the support part 230 and the bottom of the receiving groove 102, so that when the support part 230 is subjected to a pressing force, the support part 230 can move toward the bottom of the receiving groove 102 and deform. At the same time, the pressure sensing module 300 is stacked on one side surface of the supporting part 230 along the supporting direction of the supporting part 230, so that during the deformation of the supporting part 230, the pressure sensing module 300 can also be deformed to output a pressure sensing signal. In addition, the supporting part 230 can also provide good support for the pressure sensing module 300, thereby preventing stress concentration problems at any position on the pressure sensing module 300 during the assembly process of the electronic device, thereby improving the service life of the pressure sensing module 300.

[0019] As described above, the pressure sensing module 300 is attached to one side surface of the support portion 230. Optionally, the pressure sensing module 300 is located on the side of the slot of the support portion 230 facing the accommodating groove 102. In this case, when the user applies pressing force through the slot position of the accommodating groove 102, it can be ensured that the pressing force acts on the pressure sensing module 300, thereby deforming the pressure sensing module 300 and generating a pressure sensing signal.

[0020] In order to increase the deformation of the pressure sensing module 300, and then increase the signal amount of the pressure sensing module 300, so that the sensitivity and accuracy of the pressure sensing module 300 are relatively higher, in another embodiment of the present application, the pressure sensing module 300 can be located on the side of the support portion 230 facing the bottom of the receiving groove 102. In this case, when the pressure force on the support portion 230 is equal, the deformation of the pressure sensing module 300 in the technical solution disclosed in the embodiment of the present application is relatively larger. Specifically, the pressure sensing module 300 can be bonded to the surface of the side of the support portion 230 facing the bottom of the receiving groove 102 by double-sided tape or glue.

[0021] In addition, in order to make the appearance performance of the electronic device relatively better and reduce the difficulty of pressing the pressure sensing module 300, in the embodiment of the present application, a keycap 410 can also be provided on the side of the support portion 230 away from the bottom of the groove. At the same time, the keycap 410 can also form an adhesive layer 420 through materials such as double-sided tape or glue to fix the keycap 410 on the surface of the side of the support portion 230 away from the bottom of the groove. On the one hand, it ensures that the keycap 410 can be stably assembled in the electronic device. On the other hand, when the keycap 410 is under pressure, the pressure transmission efficiency and accuracy can be relatively higher. During the process of bonding the keycap 410, the keycap 410 can be fixedly bonded to the surface of the support portion 230 by cold pressing. Of course, since a deformation gap 101 is provided between the support portion 230 and the bottom of the accommodating groove 102, in order to improve the bonding reliability of the keycap 410 and prevent the support portion 230 from being damaged due to a large pressing force during the assembly of the keycap 410, when bonding the keycap 410, a hard pad can be firstly placed in the deformation gap 101, and after completing the bonding process of the keycap 410, the aforementioned hard pad can be removed from the deformation gap 101.

[0022] As described above, the pressure sensing module 300 is used to output a pressure sensing signal by generating deformation when under pressure. In a specific embodiment of the present application, the device used to provide the pressure sensing function in the pressure sensing module 300 may be a pressure sensing material piece 320. The pressure sensing material piece 320 is formed of a pressure sensing material. When it is deformed by pressure, due to the difference in bending radius of its two opposite side surfaces, the resistance change amount of the two opposite side surfaces of the pressure sensing material piece 320 is different. Since the deformation amount and resistance value of the surface of the pressure sensing material piece 320 are linearly related, the pressure difference between the two opposite side surfaces of the pressure sensing material piece 320 can be detected according to the Wheatstone bridge principle to determine the specific size of the pressure exerted on the pressure sensing material piece 320, and the pressure difference is converted into an electrical signal to achieve the purpose of pressure sensing. Of course, when the pressure sensing module 300 is located on the side of the support portion 230 facing the bottom of the groove, and the pressure sensing module 300 includes a pressure-sensitive material piece 320, in the thickness direction of the pressure sensing module 300, the size of the pressure sensing module 300 needs to be smaller than the size of the above-mentioned deformation gap 101 to ensure that the support portion 230 can still deform toward the side where the bottom of the accommodating groove 102 is located when under pressure.

[0023] To this end, in a specific embodiment of the present application, the pressure sensing module 300 may include a circuit board 310 and a pressure sensing material piece 320. As described above, the pressure on the pressure sensing material piece 320 can be determined by using the change in the resistance values ​​of the two opposite surfaces of the pressure sensing material piece 320. To this end, in a specific embodiment of the present application, the pressure sensing material piece 320 may be provided only on one side of the circuit board 310. In this case, the two ends of the pressure sensing material piece 320 facing the surface of the circuit board 310, which are respectively close to the first fixing portion 210 and the second fixing portion 220, can be electrically connected to the circuit board 310, and the two ends of the pressure sensing material piece 320 facing away from the circuit board 310, which are respectively close to the first fixing portion 210 and the second fixing portion 220, can also be electrically connected to the circuit board 310, so that the pressure sensing change of the two opposite surfaces of the single pressure sensing material piece 320 itself can be transmitted to devices such as a main board through the circuit board 310.

[0024] To put it more intuitively, the surface of the side of the pressure-sensitive material piece 320 close to the circuit board 310 is the inner surface, and the surface away from the circuit board 310 is the outer surface. In the embodiment of the present application, the inner surface and the outer surface of the pressure-sensitive material piece 320 located on one side of the circuit board 310 are both electrically connected to the circuit board 310, so that by detecting the difference in resistance between the inner surface and the outer surface of the pressure-sensitive material piece 320, it is possible to detect whether the pressure sensing module 300 is under pressure.

[0025] As described above, the pressure-sensitive material piece 320 can be set only on one side surface of the circuit board 310. Optionally, the pressure-sensitive material piece 320 is located between the circuit board 310 and the support portion 230. In this case, the support portion 230 and the circuit board 310 can be used to provide protection for the pressure-sensitive material piece 320 to prevent the pressure-sensitive material piece 320 from getting damp or rusty, thereby improving the service life of the pressure-sensitive material piece 320, that is, the entire pressure-sensing module 300.

[0026] In another embodiment of the present application, the circuit board 310 can be connected to the support portion 230, more specifically, the circuit board 310 can be connected to the side surface of the support portion 230 facing the bottom of the accommodating groove 102; at the same time, the pressure-sensitive material piece 320 is arranged on the side of the circuit board 310 away from the support portion 230, that is, the pressure-sensitive material piece 320 is arranged on the side surface of the circuit board 310 facing the bottom of the accommodating groove 102. In this case, the deformation ability of the pressure-sensitive material piece 320 can be further improved, thereby improving the detection accuracy and sensitivity of the pressure sensing module 300 to pressure, and diversifying the functions of the pressure sensing module 300.

[0027] In order to further improve the pressure detection accuracy and sensitivity of the pressure sensing module 300, in another embodiment of the present application, pressure sensing material pieces 320 can be arranged on opposite sides of the circuit board 310, and the difference between the resistances of the two pressure sensing material pieces 320 is used to represent the pressure magnitude of the pressure sensing module 300. In the embodiment of the present application, since the two pressure sensing material pieces 320 are respectively located on opposite sides of the circuit board 310, when the pressure sensing module 300 is subjected to the same pressure, the difference between the deformation amounts of the two pressure sensing material pieces 320 is relatively large, thereby improving the pressure detection accuracy of the pressure sensing module 300.

[0028] In detail, in an embodiment of the present application, a pressure-sensitive material piece 320 may be provided on a side of the circuit board 310 facing the support portion 230 and on a side of the circuit board 310 facing away from the support portion 230, respectively, and the two ends of one side surface of each of the two pressure-sensitive material pieces 320, respectively close to the first fixed portion 210 and the second fixed portion 220, are electrically connected to the circuit board 310.

[0029] In the process of electrically connecting any pressure-sensitive material piece 320 and the circuit board 310, the two opposite ends of the surface of one side of any pressure-sensitive material piece 320 close to the circuit board 310 can be connected to the circuit board 310. In this case, the connection difficulty between the pressure-sensitive material piece 320 and the circuit board 310 can be greatly reduced. In another embodiment of the present application, the surface of one side of each pressure-sensitive material piece 320 away from the circuit board 310 can be electrically connected to the circuit board 310, that is, any pressure-sensitive material piece 320 is electrically connected to the circuit board 310 through its respective outer surface. In this case, since the distance between the outer surfaces of the two pressure-sensitive material pieces 320 is the largest, when the support portion 230 is subjected to the same pressure, the difference between the deformation amounts of the respective outer surfaces of the two pressure-sensitive material pieces 320 is relatively larger, and thus the difference in resistance generated when the pressure-sensitive module 300 is deformed is relatively larger, so that the signal amount of the pressure-sensitive module 300 can be further improved, and the detection accuracy of the pressure-sensitive module 300 can be higher.

[0030] In order to enable the surface of any pressure-sensitive material piece 320 that faces away from the circuit board 310 to form a reliable electrical connection relationship with the circuit board 310, in a specific embodiment of the present application, the surface of the side of the pressure-sensitive material piece 320 that faces away from the circuit board 310 can be electrically connected to the circuit board 310 through a conductive piece 330, and a pad 340 can be provided on the circuit board 310, and then the conductive piece 330 can be electrically connected to the pad 340, thereby achieving the purpose of electrically connecting the surface of the side of the pressure-sensitive material piece 320 that faces away from the circuit board 310 with the circuit board 310. More specifically, the conductive piece 330 can be a wire, and in order to reduce the size of the conductive piece 330, the conductive piece 330 can be formed by curing a conductive paste.

[0031] As described above, the pressure-sensitive material piece 320 can be arranged on the side surface of the circuit board 310 away from the support part 230. In this case, optionally, the pressure-sensing module 300 can also include an insulating protective layer 350, and by making the insulating protective layer 350 cover the pressure-sensitive material piece 320, the conductive piece 330 and the pad 340, the aforementioned devices with conductive capabilities can be protected by the insulating protective layer 350, thereby improving the reliability and service life of the pressure-sensing module 300.

[0032] As described above, the device for providing the pressure sensing function in the pressure sensing module 300 may be a pressure sensing material 320. In another embodiment of the present application, the device for providing the pressure sensing function may also be a piezoelectric device 360. The piezoelectric device 360 ​​can generate current when subjected to pressure, and the magnitude of the current is positively correlated with the magnitude of the pressure on the piezoelectric device 360. For this reason, in another embodiment of the present application, the pressure sensing module 300 may also include a circuit board 310 and a piezoelectric device 360. The piezoelectric device 360 ​​may specifically include a pressure chip or a piezoelectric ceramic part, both of which can generate a corresponding magnitude of current when subjected to pressure. By connecting the piezoelectric device 360 ​​to the circuit board 310, the current generated by the piezoelectric device 360 ​​can be detected by the corresponding device in the electronic device to determine the pressure on the piezoelectric device 360. Of course, in the embodiment of the present application, in order to ensure that the piezoelectric device 360 ​​can be compressed and deformed during the pressure, the pressure sensing module 300 needs to be sandwiched between the support portion 230 and the bottom of the accommodating groove 102 during the assembly of the electronic device.

[0033] In addition, the piezoelectric device 360 ​​can be located on the side of the circuit board 310 facing the bottom of the groove, so that the circuit board 310 can form a good fitting and supporting relationship with the support portion 230, preventing the circuit board 310 from being scratched and damaged by the piezoelectric device 360 ​​during the assembly of the pressure sensing module 300.

[0034] As described above, the first fixing portion 210 and the second fixing portion 220 can be installed in the two side portions of the receiving groove 102 respectively, and the structures and assembly methods of the first fixing portion 210 and the second fixing portion 220 can be the same. For this reason, taking the first fixing portion 210 as an example, the first fixing portion 210 does not necessarily need to form a fixed connection relationship with the two side portions of the receiving groove 102. For example, by making the first fixing portion 210 and the two side portions of the receiving groove 102 form an interference fit relationship in the supporting direction of the supporting portion 230, it can be ensured that the first fixing portion 210 can be stably fixed in the two side portions of the receiving groove 102. In this case, the size of the first fixing portion 210 in the aforementioned supporting direction can be made slightly larger than the size of the two side portions of the receiving groove 102, so as to ensure that the first fixing portion 210 can form an interference fit relationship with the two side portions of the receiving groove 102 to achieve the purpose of relative fixation.

[0035] Based on the above embodiment, in the supporting direction, when the first fixing portion 210 and the two side portions of the accommodating groove 102 are interference fit, the size of the first fixing portion 210 can also be made larger than the size of the supporting portion 230. At the same time, as shown in the figure, an avoidance notch 211 can be provided on the first fixing portion 210, and the avoidance notch 211 is recessed from one end of the first fixing portion 210 close to the supporting portion 230 toward a direction away from the second fixing portion 220. In the supporting direction, by arranging the avoidance notch 211 and the deformation gap 101 to be located on opposite sides of the supporting portion 230 respectively, the deformation ability of the supporting portion 230 is relatively stronger during the deformation of the supporting portion 230 in the direction close to the bottom of the accommodating groove 102 and in the process of recovering the deformation in the direction away from the bottom of the accommodating groove 102.

[0036] In order to reduce the difficulty of processing the first fixing part 210, in another embodiment of the present application, the size of the two side parts of the receiving groove 102 in the supporting direction can also be larger than the size of the first fixing part 210. In this case, the electronic device can also include an insert 430, and in the supporting direction of the supporting part 230, the insert 430 can be stacked on one side of the first fixing part 210, and the corresponding first fixing part 210 and the insert 430 are embedded in the two side parts of the receiving groove 102, so that the first fixing part 210 and the insert 430 can form an interference fit relationship with the two side parts of the receiving groove 102. In this case, the size of the first fixing part 210 and the supporting part 230 in the supporting direction can be equal, and then the support beam 200 including the first fixing part 210, the second fixing part 220 and the supporting part 230 can be directly formed by conventional materials such as steel plates with uniform thickness, which can greatly reduce the difficulty of processing the support beam 200.

[0037] In order to improve the assembly reliability between the insert 430 and the first fixing part 210, in the embodiment of the present application, the insert 430 and the first fixing part 210 may be pre-fixed in a connection relationship. Specifically, a first connection layer 440 may be formed between the first fixing part 210 and the insert 430 by bonding or welding to ensure a more stable fixing relationship between the first fixing part 210 and the insert 430. It should be noted that when the bonding fixing method is adopted, the first connection layer 440 may be a layered structure, and when the welding fixing method is adopted, the first connection layer 440 may be a solder point structure.

[0038] In the above-mentioned embodiments of the present application, the first fixing portion 210 can form an interference fit relationship with the two side portions of the receiving groove 102 alone or in cooperation with the insert 430, so that the first fixing portion 210 and the two side portions of the receiving groove 102 form a relatively stable relative fixed relationship. In order to prevent the support portion 230 from causing the first connecting layer 440 to fail easily due to long-term and frequent shear force when the support portion 230 is under pressure, a side surface of the first fixing portion 210 facing the bottom of the receiving groove 102 can also form a fixed connection relationship with the corresponding inner walls of the two side portions of the receiving groove 102. In this case, when the pressure exerted on the support portion 230 acts on the first connecting layer 440, the inner walls of the two side portions of the receiving groove 102 facing the first fixing portion 210 in the supporting direction can provide good support for the support portion 230 and the first connecting layer 440, thereby ensuring that the reliability of the first connecting layer 440 is relatively high. More specifically, the first fixing portion 210 may be fixedly connected to the inner walls of both side portions of the receiving groove 102 by bonding or welding to form the second connection layer 450 .

[0039] In addition, when the first fixing portion 210 and the two side portions of the receiving groove 102 are directly fixedly connected through the second connection layer 450, in order to facilitate the formation of the second connection layer 450, the size of the first fixing portion 210 in the supporting direction may be smaller than the size of the two side portions of the receiving groove 102. After the second connection layer 450 is formed, that is, the fixing work between the first fixing portion 210 and the two side portions of the receiving groove 102 is completed, the gap between the first fixing portion 210 and the two side portions of the receiving groove 102 in the supporting direction may be filled with a method such as an insert 430 to further improve the stability of the first fixing portion 210. Of course, since the first fixing portion 210 and the two side portions of the receiving groove 102 in the supporting direction have formed a relatively reliable fixed connection relationship through the second connection layer 450, even if the gap between the first fixing portion 210 and the two side portions of the receiving groove 102 in the supporting direction may remain, it is no longer necessary to fill the gap with a device such as an insert 430.

[0040] As described above, the structure and assembly method of the second fixing portion 220 can be the same as those of the first fixing portion 210. To this end, optionally, the assembly method between the second fixing portion 220 and the two side portions of the accommodating groove 102 can refer to the above description of the first fixing portion 210. Considering the simplicity of the text, it will not be repeated here.

[0041] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0042] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: The invention comprises a frame (100), a support beam (200) and a pressure sensing module (300), wherein the frame (100) is provided with a receiving groove (102), the support beam (200) comprises a first fixing portion (210), a second fixing portion (220) and a supporting portion (230), the first fixing portion (210) and the second fixing portion (220) being respectively fixedly connected to opposite ends of the supporting portion (230), the two side portions of the receiving groove (102) being respectively used for installing the first fixing portion (210) and the second fixing portion (220), the middle portion of the receiving groove (102) being used for accommodating the supporting portion (230), and a deformation gap (101) being provided between the supporting portion (230) and the groove bottom of the receiving groove (102), and the pressure sensing module (300) being stacked on a side surface of the supporting portion (230) along the supporting direction of the supporting portion (230).

2. The electronic device according to claim 1, characterized in that: The pressure sensing module (300) is located on a side of the support portion (230) facing the groove bottom, and a key cap (410) is provided on a side of the support portion (230) facing away from the groove bottom.

3. The electronic device according to claim 2, characterized in that: In the thickness direction of the pressure sensing module (300), the size of the pressure sensing module is smaller than the size of the deformation gap (101), the pressure sensing module (300) comprises a circuit board (310) and a pressure sensing material piece (320), the pressure sensing material piece (320) being formed of a pressure sensing material, two ends of the pressure sensing material piece (320) facing the circuit board (310) and respectively close to the first fixing portion (210) and the second fixing portion (220) are both electrically connected to the circuit board (310), and two ends of the pressure sensing material piece (320) facing away from the circuit board (310) and respectively close to the first fixing portion (210) and the second fixing portion (220) are both electrically connected to the circuit board (310).

4. The electronic device according to claim 3, characterized in that: The circuit board (310) is connected to the support portion (230), and the pressure-sensitive material piece (320) is arranged on a side of the circuit board (310) that is away from the support portion (230).

5. The electronic device according to claim 3, characterized in that: The pressure sensing module (300) comprises a circuit board (310) and a pressure sensing material piece (320); the pressure sensing material piece (320) is formed of a pressure sensing material; the pressure sensing material piece (320) is provided on a side of the circuit board (310) facing the support portion (230) and on a side of the circuit board (310) facing away from the support portion (230), respectively; and two ends of one side surface of each of the two pressure sensing material pieces (320) close to the first fixing portion (210) and the second fixing portion (220) are electrically connected to the circuit board (310).

6. The electronic device according to claim 5, wherein a surface of each of the pressure-sensitive material pieces (320) facing away from the circuit board (310) is electrically connected to the circuit board (310).

7. The electronic device according to claim 4 or 6, characterized in that: A surface of the pressure-sensitive material piece (320) facing away from the circuit board (310) is electrically connected to a soldering pad (340) of the circuit board (310) via a conductive piece (330); the pressure-sensitive module (300) further comprises an insulating protective layer (350); the insulating protective layer (350) covers the pressure-sensitive material piece (320), the conductive piece (330) and the soldering pad (340).

8. The electronic device according to claim 2, characterized in that: The pressure sensing module (300) is clamped between the support portion (230) and the bottom of the accommodating groove (102), and the pressure sensing module (300) comprises a circuit board (310) and a piezoelectric device (360). The piezoelectric device (360) is electrically connected to the circuit board (310), and the piezoelectric device (360) comprises a pressure chip or a piezoelectric ceramic component.

9. The electronic device according to claim 1, characterized in that: In the supporting direction of the supporting portion (230), the first fixing portion (210) is interference-fitted with two side portions of the accommodating groove (102), and the size of the first fixing portion (210) is larger than the size of the supporting portion (230). The first fixing portion (210) is provided with an avoidance notch (211), and the avoidance notch (211) is recessed from one end of the first fixing portion (210) close to the supporting portion (230) in a direction away from the second fixing portion (220), and in the supporting direction, the avoidance notch (211) and the deformation gap (101) are respectively located on opposite sides of the supporting portion (230).

10. The electronic device according to claim 1, characterized in that: The electronic device further comprises an insert (430), wherein in the supporting direction of the supporting portion (230), the insert (430) is stacked on one side of the first fixing portion (210), and the first fixing portion (210) and the insert (430) are both embedded in two side portions of the containing groove (102); The insert (430) is fixedly connected to the first fixing portion (210).

11. The electronic device according to claim 1, characterized in that: A side surface of the first fixing portion (210) facing the bottom of the accommodating groove (102) is fixedly connected to the inner walls of two side portions of the accommodating groove (102).

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