Flexible circuit board and display device

Abstract

The invention provides a flexible circuit board and a display device, a second device area of the flexible circuit board surrounds a first device area, the second device area is arranged close to the edge of the flexible circuit board, the flexible circuit board comprises a substrate, a device layer and a packaging glue layer, the device layer comprises a plurality of first driving devices located in the first device area, and the packaging glue layer comprises a plurality of second driving devices located in the second device area. The second driving devices are located in the second device area, and the height of the second driving devices is larger than that of the first driving devices; the packaging adhesive layer comprises a first adhesive layer covering the first driving device and a second adhesive layer covering the second driving device; the height of a first adhesive layer is larger than that of all first driving devices, the height of the first adhesive layer is smaller than that of all second driving devices, and the distance between the surface of the side, away from a substrate, of a second adhesive layer and the substrate is larger than that of all the second driving devices. Therefore, corrosive liquid can be prevented from permeating into the device layer to corrode components, and the reliability of the flexible circuit board is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] With the widespread application of Organic Light-Emitting Diode (OLED) displays, users have put forward higher requirements for their reliability, especially in terms of performance in terms of water resistance and sweat resistance. The weak links in OLED screens are often concentrated in the line connections. For example, one or more device areas are divided on the flexible circuit board, and components are installed in them, which makes the device area a key area that is easily affected by the external environment.

[0003] At present, in the device area of ​​flexible circuit boards, there are differences in the heights of different components, which makes it difficult to form a uniform packaging glue layer during the dispensing process. Low-lying areas are easily formed near components with lower heights. These low-lying areas may become potential channels for liquids (such as sweat) to enter the device area. Once sweat penetrates along these low points and gathers around the components, it will cause corrosion to the components, thereby reducing the overall reliability of the display panel. Summary of the invention

[0004] The embodiments of the present application provide a flexible circuit board and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided by the embodiments of the present application are as follows:

[0006] An embodiment of the present application provides a flexible circuit board, comprising a first device area and a second device area arranged around the first device area, wherein the second device area is arranged close to an edge of the flexible circuit board, and the flexible circuit board comprises:

[0007] substrate;

[0008] a device layer, disposed on one side of the substrate, the device layer comprising a plurality of first drive devices and a plurality of second drive devices that are spaced apart, the plurality of first drive devices being located in the first device region, the plurality of second drive devices being located in the second device region, and the height of the second drive devices being greater than the height of the first drive devices;

[0009] The packaging glue layer comprises a first glue layer and a second glue layer which are arranged on the same side of the substrate as the device layer, wherein the first glue layer covers a plurality of the first driving devices, and the second glue layer covers a plurality of the second driving devices;

[0010] Among them, the height of the first glue layer is greater than the height of all the first driving devices, and the height of the first glue layer is less than the height of all the second driving devices, and the distance from the surface of the second glue layer away from the side of the substrate to the substrate is greater than the height of all the second driving devices.

[0011] Optionally, in one embodiment, the second adhesive layer is disposed on a side of the first adhesive layer away from the substrate;

[0012] The first glue layer extends from the first device area to the outside of the second device area, and the first glue layer fills part of the gaps between the plurality of second driving devices.

[0013] Optionally, in one embodiment, the flexible circuit board includes a plurality of third driving devices, the height of each of the third driving devices is greater than the height of all the first driving devices, and the height of each of the third driving devices is less than the height of all the second driving devices;

[0014] Wherein, the third driving device is arranged between the first driving device and the second driving device.

[0015] Optionally, in one embodiment, the height of the first glue layer is greater than the height of all the third driving devices, and the first glue layer covers a plurality of the third driving devices;

[0016] Wherein, an orthographic projection of the second adhesive layer on the substrate at least partially overlaps with an orthographic projection of the third driving device on the substrate.

[0017] Optionally, in one embodiment, in the second device region, a side of the first driving device close to an edge of the second device region is flush with a side of the third driving device close to an edge of the second device region.

[0018] Optionally, in one embodiment, in the second device region, a spacing between two adjacent driving devices is greater than or equal to 0.3 mm and less than or equal to 0.95 mm, and a height difference between the second driving device and the third driving device is less than or equal to 0.3 mm.

[0019] Optionally, in one embodiment, the flexible circuit board further includes a protective layer, and the second adhesive layer is disposed on a side of the first adhesive layer away from the substrate, and at least a portion of the second adhesive layer surrounds the upper surface of the first adhesive layer to form a recessed structure; the protective layer is disposed on a surface of the second adhesive layer away from the first adhesive layer, and the orthographic projection of the protective layer on the substrate at least covers the orthographic projection of the recessed structure on the substrate.

[0020] Optionally, in one embodiment, an angle between a side wall of the second glue layer away from the first device region and a surface of the substrate facing the second glue layer is greater than or equal to 45 degrees and less than 90 degrees.

[0021] Optionally, in one embodiment, a distance between two adjacent driving devices in the first device region is smaller than a distance between two adjacent driving devices in the second device region.

[0022] An embodiment of the present application further provides a display device, the display device comprising a display panel and any of the above-mentioned flexible circuit boards;

[0023] Among them, the display panel includes a display part, a first binding part arranged opposite to the display part, and a bending part connected between the display part and the first binding part, and the flexible circuit board is located on a side of the first binding part away from the display part, and the flexible circuit board is connected to the first binding part.

[0024] The beneficial effects of the embodiments of the present application are as follows: the embodiments of the present application provide a flexible circuit board and a display device, wherein the flexible circuit board includes a first device area and a second device area arranged around the first device area, the second device area is arranged close to the edge of the flexible circuit board, and the flexible circuit board includes a substrate, a device layer and a packaging glue layer arranged on the same side of the substrate; by setting the height of the first glue layer to be greater than the height of all the first drive devices, and the height of the first glue layer to be less than the height of all the second drive devices, the distance from the surface of the second glue layer away from the side of the substrate to the substrate is greater than the height of all the second drive devices, thereby avoiding the problem of uneven coverage of the colloid in the dispensing process, so that the sealing glue can better fill the height difference between the first drive device and the second drive device, thereby preventing corrosive liquid from penetrating into the device layer to cause corrosion to the components, thereby improving the reliability of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A first top view of the flexible circuit board provided in an embodiment of the present application;

[0027] Figure 2 A top view of a device layer provided in an embodiment of the present application;

[0028] Figure 3 The embodiments of the present application provide Figure 1 Schematic diagram of the cross section at MM`;

[0029] Figure 4 A schematic diagram of the first structure of the encapsulation adhesive layer provided in an embodiment of the present application;

[0030] Figure 5 A second top view of the flexible circuit board provided in the embodiment of the present application;

[0031] Figure 6 The embodiments of the present application provide Figure 5 Schematic diagram of the cross section at NN` in the middle;

[0032] Figure 7 A second structural diagram of the encapsulation adhesive layer provided in the embodiment of the present application

[0033] Figure 8 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that

[0035] The specific embodiments described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working mode, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device. In addition, the terms "first" and "second" are only used for descriptive purposes, and the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] The disclosure below provides many different embodiments to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0038] In order to solve the above problems, the embodiments of the present application provide a flexible circuit board and a display device. The following are detailed descriptions of each. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0039] Please combine Figure 1 , Figure 2 and Figure 3 ;in, Figure 1 A first top view of the flexible circuit board provided in an embodiment of the present application; Figure 2 A top view of a device layer provided in an embodiment of the present application; Figure 3 The embodiments of the present application provide Figure 1 Schematic diagram of the cross section at MM`.

[0040] In one embodiment, the flexible circuit board 1 includes a first device area 100 and a second device area 200 arranged around the first device area 100, the second device area 200 is arranged close to the edge of the flexible circuit board 1, and the flexible circuit board 1 includes a stacked substrate 11, a device layer 12 and a packaging glue layer 13; wherein the substrate 11 is used to carry and protect the circuit, the device layer 12 includes a plurality of drive devices 121 arranged at intervals, and different drive devices 121 have different heights in a direction perpendicular to the substrate 11, and the drive devices 121 include but are not limited to integrated circuit chips, power management modules, drive display devices, sensors and capacitors, inductors, crystal oscillators and other passive components or one or more; the packaging glue layer 13 covers the device layer 12, and the packaging glue layer 13 can prevent harmful substances such as moisture, dust and chemicals from invading the device area to avoid the drive device 121 from being affected by the environment, thereby extending the service life of the flexible circuit board 1.

[0041] The device layer 12 includes a plurality of first drive devices 1211 and a plurality of second drive devices 1212 that are spaced apart from each other, wherein the plurality of first drive devices 1211 are located in the first device region 100, and the plurality of second device regions 200 are located in the second device region 200, and a height h2 of the second drive devices 1212 is greater than a height h1 of the first drive devices 1211; wherein the height h2 of the second drive device 1212 refers to a distance from a surface of the second drive device 1212 away from a side of the substrate 11 to the substrate 11; and the height h1 of the first drive device 1211 refers to a distance from a surface of the first drive device 1211 away from a side of the substrate 11 to the substrate 11.

[0042] It should be noted that different first driving devices 1211 have different distances from the surface of the side away from the substrate 11 to the substrate 11, and the height h1 of the first driving device 1211 is less than 0.3 mm; different second driving devices 1212 have different distances from the surface of the side away from the substrate 11 to the substrate 11, and the height h2 of the second driving device 1212 is greater than 0.6 mm.

[0043] The packaging glue layer 13 includes a first glue layer 131 and a second glue layer 132, the first glue layer 131 covers multiple first driving devices 1211, and the second glue layer 132 covers multiple second driving devices 1212; wherein, the second glue layer 132 is arranged on a side of the first glue layer 131 away from the substrate 11, the first glue layer 131 extends from the first device area 100 to the outside of the second device area 200, and the first glue layer 131 fills part of the gap between the multiple second driving devices 1212.

[0044] In one embodiment, the height of the first glue layer 131 is greater than the height of the tallest first driving device 1211 in the first device area 100, and the height of the first glue layer 131 is less than the height of the shortest second driving device 1212 in the second device area 200, and the distance between the surface of the second glue layer 132 away from the substrate 11 and the substrate 11 is greater than the height of the tallest second driving device 1212 in the second device area 200.

[0045] The first glue layer 131 can be formed by a first dispensing process. In the first dispensing process, the colloid is dispensed from the center of the first device area 100. Since the colloid is a fluid, the colloid naturally overflows in a direction away from the center of the first device area 100. After the first dispensing process is completed, the colloid will gradually become flat due to surface tension, filling the gaps between the multiple first drive devices 1211 and covering the multiple first drive devices 121. After the colloid is solidified, the first glue layer 131 is formed; wherein, the height H1 of the first glue layer 131 is greater than the height h1 of all the first drive devices 1211 in the first device area 100, and the height H1 of the first glue layer 131 is less than the height h2 of all the second drive devices 1212 in the second device area 200.

[0046] It can be understood that, in this embodiment, the second device area 200 is arranged around the first device area 100, the second device area 200 is arranged close to the edge of the flexible circuit board 1, and the plurality of first driving devices 1211 are located in the first device area 100, and the plurality of second device areas 200 are located in the second device area 200, so that in the first dispensing process, a relatively flat glue coating area can be formed in the first device area 100, so that the height H1 of the first glue layer 131 is greater than the height h1 of all the first driving devices 1211, and the first glue layer 1 31 covers multiple first driving devices 1211, thereby realizing the sealing of the first driving devices 1211; wherein, the first glue layer 131 can effectively encapsulate the first driving device 1211, prevent external corrosive liquids (such as sweat) from penetrating into the device layer 12, and protect the first driving device 1211 from being corrosive liquids; and, the first glue layer 131 can fill part of the gaps between multiple second driving devices 1212, complete the partial coverage of the second driving device 1212, and reduce the height difference when the subsequent colloid flows between the high and low driving devices 121.

[0047] The second glue layer 132 can be formed by a second dispensing process. In the second dispensing process, the colloid is dispensed along the arrangement path of the second driving devices 1212, and the colloid will flow to a lower place, that is, the colloid will overflow along the direction of the second device area 200 close to the first device area 100. After the second dispensing process is completed, the colloid will gradually become flat due to surface tension, filling the gaps between multiple second driving devices 1212 and covering multiple second driving devices 1212. After the colloid is cured, the second glue layer 132 is formed; wherein, the distance from the surface of the second glue layer 132 away from the side of the substrate 11 to the substrate 11 is greater than the height h2 of all the second driving devices 1212 in the second device area 200.

[0048] It can be understood that, in this embodiment, the second driving device 1212 is arranged around the first driving device 1211, and the height h2 of the second driving device 1212 is greater than the height h1 of the first driving device 1211. Therefore, the second driving device 1212 can restrict the colloid during the coating process to a certain extent to prevent it from excessive flow; and, through the layered design of the packaging glue layer 13, in the second dispensing process, the distance from the surface of the second glue layer 132 away from the side of the substrate 11 to the substrate 11 is greater than the height h2 of all the second driving devices 1212, and the second glue layer 132 can fill the height difference between the first driving device 1211 and the second driving device 1212, and complete the sealing of the second driving device 1212; wherein, the second glue layer 132 can effectively encapsulate the second driving device 1212, prevent external corrosive liquids (such as sweat) from penetrating into the device layer 12, and protect the second driving device 1212 from corrosive liquid erosion, thereby improving the reliability of the flexible circuit board 1.

[0049] In one embodiment, in the first device area 100, the spacing between two adjacent driving devices 121 is smaller than the spacing between two adjacent driving devices 121 in the second device area 200; wherein, in the first device area 100, the distribution density of the first driving devices 1211 is greater than the distribution density of the second driving devices 1212 in the second device area 200.

[0050] It can be understood that since the distance between two adjacent driving devices 121 in the first device area 100 is small, the colloid can be more concentrated in the first dispensing process, that is, in the area where the distance between two adjacent driving devices 121 is small, in the first dispensing process, the physical restrictions and obstacles to the flow of the colloid are more obvious, and the colloid can more easily fill the gaps between the adjacent driving devices 121, thereby ensuring that the colloid flows evenly in the first device area 100, and the first glue layer 131 encapsulates the first driving device 1211 more tightly, further preventing external corrosive liquids (such as sweat) from penetrating into the device layer 12, protecting the first driving device 1211 from corrosive liquid erosion.

[0051] Please continue to combine Figure 1 , Figure 2 and Figure 3 In one embodiment, the flexible circuit board 1 further includes a plurality of third driving devices 1213, wherein the third driving devices 1213 are disposed between the first driving devices 1211 and the second driving devices 1212, wherein a height h3 of each of the third driving devices 1213 is greater than a height h1 of all of the first driving devices 1211, and a height h3 of each of the third driving devices 1213 is less than a height h2 of all of the second driving devices 1212; the third driving devices 1213 can enable a better transition when the colloid flows.

[0052] Specifically, the height of the third driving device 1213 is greater than the height of the highest first driving device 1211 in the first device area 100, and the height of the third driving device 1213 is less than the height of the shortest second driving device 1212 in the second device area 200. In the first dispensing process, the provision of the third driving device 1213 helps to adjust the flow rate and direction of the colloid to ensure a smooth transition of the first glue layer 131 between driving devices 121 at different heights, avoid an abrupt slope transition of the colloid between driving devices 121 at different heights, and thereby enable the first glue layer 131 to smoothly cover the first driving device 1211 and the third driving device 1213, thereby reducing the flow unevenness caused by the height h3 difference between the first driving device 1211 and the third driving device 1213.

[0053] It should be noted that the present embodiment does not specifically limit the position of the third drive device 1213. The present embodiment only takes the third drive device 1213 being arranged between the first drive device 1211 and the second drive device 1212 as an example to illustrate the technical solution of the present application; in addition, the height h3 of the third drive device 1213 in the present embodiment refers to the distance from the surface of the third drive device 1213 away from the side of the substrate 11 to the substrate 11. Different third drive devices 1213 have different distances from the surface of the side of the substrate 11 away from the substrate 11. The height h3 of the third drive device 1213 is greater than or equal to 0.3 mm and less than or equal to 0.6 mm.

[0054] In one embodiment, the height H1 of the first adhesive layer 131 is greater than the height h3 of all the third driving devices 1213, and the first adhesive layer 131 covers a plurality of the third driving devices 1213, thereby sealing the third driving devices 1213 to avoid exposure and external liquids (such as sweat or water vapor) from penetrating, thereby improving the protection capability of the entire flexible circuit board 1 and extending the service life of the product.

[0055] In one embodiment, the orthographic projection of the second adhesive layer 132 on the substrate 11 at least partially overlaps with the orthographic projection of the third driving device 1213 on the substrate 11, thereby further improving the sealing of the encapsulation adhesive layer 13 and further preventing external liquids (such as sweat or water vapor) from penetrating from the outside of the encapsulation adhesive layer 13.

[0056] Please continue to combine Figure 1 , Figure 2 and Figure 3 In one embodiment, in the second device area 200, the side of the first driving device 1211 close to the edge of the second device area 200 is flush with the side of the third driving device 1213 close to the edge of the second device area 200, so that the first glue layer 131 can be more evenly distributed at the edge of the second device area 200, avoiding the height difference problem caused by the misalignment of the first driving device 1211 and the third driving device 1213, thereby preventing the occurrence of uneven colloid flow.

[0057] Furthermore, in the second device region 200 , the distance between two adjacent driving devices 121 is greater than or equal to 0.3 mm and less than or equal to 0.95 mm, and the height difference between the first driving device 1211 and the third driving device 1213 is less than or equal to 0.3 mm.

[0058] Specifically, the spacing between two adjacent second drive devices 1212 is greater than or equal to 0.3 mm and less than or equal to 0.95 mm, the spacing between the second drive device 1212 and the third drive device 1213 is greater than or equal to 0.3 mm and less than or equal to 0.95 mm, and the height difference between the first drive device 1211 and the third drive device 1213 is less than or equal to 0.3 mm; by limiting the spacing between two adjacent drive devices 121 to be greater than or equal to 0.3 mm and less than or equal to 0.95 mm, sufficient space is ensured for the colloid to flow freely during the dispensing process and to effectively fill the gap between the two adjacent drive devices 121, thereby avoiding the problem of the colloid being difficult to flow due to too small a spacing, and preventing the problem of insufficient strength of the encapsulation glue layer 13 due to too large a spacing.

[0059] At the same time, limiting the height difference between the first driving device 1211 and the third driving device 1213 to be less than or equal to 0.3 mm helps to keep the colloid evenly distributed on the driving devices 121 at different heights; specifically, a smaller height difference between two adjacent driving devices 121 can reduce the risk of colloid accumulation in lower areas and insufficient coverage of higher areas, ensuring that the colloid can flow evenly through the entire device area, thereby avoiding uneven coverage caused by differences in gravity and fluidity during the dispensing and curing process of the colloid, and ensuring the integrity and uniformity of the packaging glue layer 13.

[0060] Please combine Figure 1 , Figure 2 , Figure 3 and Figure 4 ;in, Figure 4 This is a schematic diagram of the first structure of the encapsulation adhesive layer provided in an embodiment of the present application.

[0061] In one embodiment, the second adhesive layer 132 is disposed on a side of the first adhesive layer 131 away from the substrate 11, and at least a portion of the second adhesive layer 132 surrounds the upper surface of the first adhesive layer 131 to form a recessed structure 1321; the flexible circuit board 1 also includes a protective layer 14, which is disposed on a surface of the second adhesive layer 132 away from the first adhesive layer 131, and the orthographic projection of the protective layer 14 on the substrate 11 at least covers the orthographic projection of the recessed structure 1321 on the substrate 11.

[0062] The material of the protective layer 14 can be an insulating material. Using insulating material as the protective layer 14 can effectively prevent current leakage and short circuit, improve the overall electrical insulation performance of the flexible circuit board 1, and ensure the normal operation of the driving device 121; at the same time, the insulating material can reduce the impact of electromagnetic interference (EMI), protect the signal transmission in the flexible circuit board 1, and improve the overall signal integrity and transmission stability.

[0063] It should be noted that, since the height h2 of the second driving device 1212 is greater than the height H1 of all the first adhesive layers 131, in the second dispensing process, the height h2 of the second driving device 1212 determines the flow direction and distribution of the colloid. Therefore, in the second dispensing process, the formed second adhesive layer 132 is more easily accumulated around the second driving device 1212, so that the molded second adhesive layer 132 has an annular structure, that is, the second adhesive layer 132 surrounds the upper surface of the first adhesive layer 131 to form a recessed structure 1321.

[0064] It can be understood that in this embodiment, the protective layer 14 is arranged on the surface of the second adhesive layer 132 away from the first adhesive layer 131, and the orthographic projection of the protective layer 14 on the substrate 11 at least covers the orthographic projection of the recessed structure 1321 on the substrate 11. The protective layer 14 provides an additional barrier for the device layer 12 of the flexible circuit board 1, effectively blocking the external environment (such as moisture, sweat, dust, etc.) from invading the flexible circuit board 1, and reducing the risk of corrosion of the driving device 121.

[0065] At the same time, due to the provision of the protective layer 14, the second glue layer 132 does not need to completely cover the first glue layer 131, that is, in the second glue dispensing process, the amount of colloid used can be controlled, and it is only necessary to ensure that the second glue layer 132 can cooperate with the protective layer 14 to form an effective sealing structure, thereby reducing the amount of colloid used, reducing the cost of the glue dispensing process, reducing the glue dispensing time, and improving production efficiency; in addition, reducing the amount of glue dispensing also helps to avoid the risk of colloid overflow or excessive accumulation, thereby ensuring the uniformity and reliability of packaging quality.

[0066] In one embodiment, the orthographic projection of the protective layer 14 on the substrate 11 at least covers the orthographic projection of the second adhesive layer 132 on the substrate 11, thereby further blocking the external environment (such as moisture, sweat, dust, etc.) from invading the flexible circuit board 1 and reducing the risk of corrosion of the driving device 121.

[0067] Please continue to combine Figure 1 , Figure 2 , Figure 3 and Figure 4In one embodiment, an angle α between a side wall of the second adhesive layer 132 away from the first device area 100 and a surface of the substrate 11 facing the second adhesive layer 132 is greater than or equal to 45 degrees and less than 90 degrees, and a side wall of the second adhesive layer 132 away from the first device area 100 is a slope structure; by forming the slope, when any liquid contacts the side wall of the second adhesive layer 132 away from the first device area 100, the liquid will flow downward along the slope instead of directly penetrating into the second adhesive layer 132, thereby further reducing the probability of corrosive liquid penetrating into the device area, thereby improving the reliability of the flexible circuit board 1.

[0068] Please combine Figure 2 , Figure 5 , Figure 6 and Figure 7 ;in, Figure 5 A second top view of the flexible circuit board provided in the embodiment of the present application; Figure 6 The embodiments of the present application provide Figure 5 Schematic diagram of the cross section at NN` in the middle; Figure 7 This is a schematic diagram of the second structure of the encapsulation adhesive layer provided in an embodiment of the present application.

[0069] In one embodiment, the first glue layer 131 is disposed in the first device area 100, the first glue layer 131 covers the plurality of first driving devices 1211, a height H1 of the first glue layer 131 is greater than a height h1 of all the first driving devices 1211, and a height H1 of the first glue layer 131 is less than a height h2 of all the second driving devices 1212, and the second glue layer 132 is disposed in the second interval area, the second glue layer 132 covers the plurality of second driving devices 1212, and a height H2 of the second glue layer 132 is greater than a height h2 of all the second driving devices 1212.

[0070] The second glue layer 132 is arranged on a side of the first glue layer 131 away from the first driving device 1211, and the second glue layer 132 extends from the first device area 100 to the outside of the second device area 200, the orthographic projection of the second glue layer 132 on the substrate 11 at least partially overlaps with the orthographic projection of the first glue layer 131 on the substrate 11, and the orthographic projection of the second glue layer 132 on the substrate 11 at least partially overlaps with the orthographic projection of the first driving device 1211 on the substrate 11.

[0071] Furthermore, the plurality of third driving devices 1213 are located in the second device area 200, and the third driving devices 1213 are arranged between two adjacent first driving devices 1211; the height H1 of the first glue layer 131 is less than the height h3 of all the third driving devices 1213, the second glue layer 132 covers the plurality of third driving devices 1213, and the height H2 of the second glue layer 132 is greater than the height h3 of all the third driving devices 1213.

[0072] It can be understood that, in this embodiment, through the layered design of the packaging glue layer 13, the first glue layer 131 covers the plurality of the first driving devices 1211, the height H1 of the first glue layer 131 is greater than the height h1 of all the first driving devices 1211, and the height H1 of the first glue layer 131 is less than the height h2 of all the second driving devices 1212, thereby completing the sealing of the first driving device 1211, the second glue layer 132 covers the plurality of the second driving devices 1212, the height H2 of the second glue layer 132 is greater than the height h2 of all the second driving devices 1212, and the second glue layer 132 can fill the first driving device 1211. The height difference between the device 1211 and the second driving device 1212 is used to complete the sealing of the second driving device 1212; at the same time, by arranging the second glue layer 132 on the side of the first glue layer 131 away from the first driving device 1211, and the second glue layer 132 extends from the first device area 100 to the outside of the second device area 200, the orthographic projection of the second glue layer 132 on the substrate 11 is at least partially overlapped with the orthographic projection of the first glue layer 131 on the substrate 11, thereby further improving the sealing of the packaging glue layer 13, and further preventing external liquid (such as sweat or water vapor) from penetrating from the outside of the packaging glue layer 13.

[0073] See also Figure 8 , is a schematic diagram of the structure of the display device provided in an embodiment of the present application.

[0074] This embodiment also provides a display device 2, which includes a display panel 21 and the flexible circuit board 1 described in any of the above embodiments; wherein the display panel 21 includes a display portion 211, a first binding portion 213 arranged opposite to the display portion 211, and a bending portion 212 connected between the display portion 211 and the first binding portion 213; the flexible circuit board 1 is located on a side of the first binding portion 213 away from the display portion 211, and the flexible circuit board 1 is connected to the first binding portion 213.

[0075] It can be understood that the flexible circuit board 1 has been described in detail in the above embodiment and will not be repeated here.

[0076] The display device 2 may further include a first back panel 22, a first supporting layer 23, a second supporting layer 24 and a second back panel 25, wherein the first back panel 22 is arranged on a side of the display portion 211 close to the first binding portion 213, the first supporting layer 23 is arranged on a side of the first back panel 22 away from the display portion 211, the second back panel 25 is arranged on a side of the first binding portion 213 close to the display portion 211, and the second supporting layer 24 is arranged on a side of the second back panel 25 away from the first binding portion 213.

[0077] Furthermore, the display device 2 also includes a functional film layer 26, a packaging structure 27 and a chip 28; the functional film layer 26 and the packaging structure 27 are sequentially arranged on the light-emitting side of the display part 211 of the display panel 21, the functional film layer 26 includes but is not limited to a polarizer located on the light-emitting side of the display panel 21, the orthographic projection of the functional film layer 26 in a direction perpendicular to the display panel 21 completely covers the display part 211, the shape of the packaging structure 27 matches the shape of the functional film layer 26, and can be attached to the side of the functional film layer 26 away from the display panel 21 through an adhesive layer (not shown in the figure), and the packaging structure 27 includes but is not limited to a flexible substrate 271 and a flexible cover plate 272 sequentially away from the display panel 21.

[0078] In specific applications, the display device 2 can be at least one of a foldable smartphone, a foldable tablet computer, a foldable mobile phone, a video phone, an e-book reader, a desktop computer, a laptop, a netbook, a workstation, a server, a personal digital assistant, a portable media player, an MP3 player, a mobile medical machine, a camera, a game console, a digital camera, a car navigation system, an electronic billboard, an ATM or a wearable device, etc., which have a display function.

[0079] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0080] The above is a detailed introduction to a flexible circuit board and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A flexible circuit board, characterized in that: The flexible circuit board comprises a first device area and a second device area arranged around the first device area, wherein the second device area is arranged close to an edge of the flexible circuit board. The flexible circuit board comprises: substrate; a device layer, disposed on one side of the substrate, the device layer comprising a plurality of first drive devices and a plurality of second drive devices that are spaced apart, the plurality of first drive devices being located in the first device region, the plurality of second drive devices being located in the second device region, and the height of the second drive devices being greater than the height of the first drive devices; The packaging glue layer comprises a first glue layer and a second glue layer which are arranged on the same side of the substrate as the device layer, wherein the first glue layer covers a plurality of the first driving devices, and the second glue layer covers a plurality of the second driving devices; Among them, the height of the first glue layer is greater than the height of all the first driving devices, and the height of the first glue layer is less than the height of all the second driving devices, and the distance from the surface of the second glue layer away from the side of the substrate to the substrate is greater than the height of all the second driving devices.

2. The flexible circuit board according to claim 1, characterized in that: The second adhesive layer is disposed on a side of the first adhesive layer away from the substrate; The first glue layer extends from the first device area to the outside of the second device area, and the first glue layer fills part of the gaps between the plurality of second driving devices.

3. The flexible circuit board according to claim 2, characterized in that: The flexible circuit board includes a plurality of third driving devices, the height of each of the third driving devices is greater than the height of all the first driving devices, and the height of each of the third driving devices is less than the height of all the second driving devices; Wherein, the third driving device is arranged between the first driving device and the second driving device.

4. The flexible circuit board according to claim 3, characterized in that: The height of the first glue layer is greater than the height of all the third driving devices, and the first glue layer covers a plurality of the third driving devices; Wherein, an orthographic projection of the second adhesive layer on the substrate at least partially overlaps with an orthographic projection of the third driving device on the substrate.

5. The flexible circuit board according to claim 3, characterized in that: In the second device region, a side of the first driving device close to an edge of the second device region is flush with a side of the third driving device close to an edge of the second device region.

6. The flexible circuit board according to claim 3, characterized in that: In the second device region, a distance between two adjacent driving devices is greater than or equal to 0.3 mm and less than or equal to 0.95 mm, and a height difference between the second driving device and the third driving device is less than or equal to 0.3 mm.

7. The flexible circuit board according to any one of claims 1 to 6, characterized in that: The second adhesive layer is disposed on a side of the first adhesive layer away from the substrate, and at least a portion of the second adhesive layer surrounds an upper surface of the first adhesive layer to form a concave structure; The flexible circuit board further includes a protective layer, which is disposed on a surface of the second adhesive layer away from the first adhesive layer, and the orthographic projection of the protective layer on the substrate at least covers the orthographic projection of the recessed structure on the substrate.

8. The flexible circuit board according to claim 7, characterized in that: An angle between a side wall of the second glue layer away from the first device region and a surface of the substrate facing the second glue layer is greater than or equal to 45 degrees and less than 90 degrees.

9. The flexible circuit board according to any one of claims 1 to 6, characterized in that: A distance between two adjacent driving devices in the first device region is smaller than a distance between two adjacent driving devices in the second device region.

10. A display device, characterized in that: The display device comprises a display panel and a flexible circuit board as claimed in any one of claims 1 to 9; Among them, the display panel includes a display part, a first binding part arranged opposite to the display part, and a bending part connected between the display part and the first binding part, and the flexible circuit board is located on a side of the first binding part away from the display part, and the flexible circuit board is connected to the first binding part.

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