Method for replacing PCB (Printed Circuit Board) adapter plate by adopting glass substrate etching process

Abstract

The invention provides a method for replacing a PCB (Printed Circuit Board) adapter plate by adopting a glass substrate etching process. The method comprises the following steps of: manufacturing a film with a preset pattern; an indium tin oxide layer, namely an ITO conducting layer and a metal layer, is prepared on a glass substrate by adopting a post-plating metal preparation process, and the post-plating metal preparation process comprises the following steps: preparing the ITO conducting layer on the glass substrate, etching, preparing the metal layer, and then etching the metal layer; obtaining a single-layer circuit semi-finished product or a double-layer circuit semi-finished product or a multi-layer circuit semi And cutting the obtained single-layer circuit semi-finished product or the obtained double-layer circuit semi-finished product or the obtained multi-layer circuit semi-finished product, connecting a flexible printed circuit (FPC), and conducting to obtain a finished product. The manufacturing cost can be greatly reduced, meanwhile, the technological process can be simplified, the timeliness can be improved, the precision can be improved, and the purpose that the using effect is equal to or more precise can be achieved.

Description

Technical Field

[0001] The invention relates to a method for preparing a PCB adapter plate by using a glass substrate etching process instead of a PCB adapter plate, and belongs to the technical field of glass substrate etching. Background Art

[0002] There are two ways to drive OLED to light up: bare screen lighting, i.e., no chip drive, and module lighting, i.e., with chip drive. In terms of bare screen lighting, one way is to use a probe to directly contact the screen circuit to make it conductive with the electrode, but this method is limited by the narrow screen circuit (less than 10um), the high cost of the probe fixture, and the difficulty of maintenance, so it cannot be fully implemented. Another way to light up the bare screen is to connect the power supply to the PCB board, and then output the electrode signal to the corresponding circuit of the bare screen through the conductive rubber adapter to make the circuit conductive and illuminated. Although this bare screen lighting method is simple and easy to maintain, the only material with a higher cost is the customized printed circuit board, i.e., PCB board. At present, it generally costs thousands of yuan to customize a double-layer PCB. If the demand is large, the cost will rise sharply.

[0003] The current manufacturing process of PCB boards is as follows: 1) CUT: Cut the original copper-clad board into boards; 2) Drilling: Drill holes at the corresponding positions on the board according to the material; 3) Copper deposition: Use chemical methods to deposit a thin layer of copper on the insulating hole wall; 4) Graphic transfer: Transfer the image on the production film to the board; 5) Graphic electroplating: Plate the hole and line copper layer to a certain thickness (20-25um), and finally meet the copper thickness requirements of the final PCB board glass substrate adapter board; 6) Film stripping: Use NaOH solution to expose the non-circuit copper layer of the anti-electroplating covering film layer 7) Etching: Use chemical reaction method to corrode the copper layer of non-circuit parts; 8) Green oil: Transfer the pattern of green oil film to the board, which can protect the circuit and prevent tin on the circuit when welding parts; 9) Silk screen characters: Print the required text and information on the board; 10) Surface treatment: Because bare copper is easily damp and oxidized if exposed to the air for a long time, it needs surface treatment. Common surface treatments include tin spraying, immersion gold, OSP, immersion tin, immersion silver, nickel palladium gold, electric hard gold, electric gold finger, etc.; 11) Molding: Let the PCB be cut into the required shape and size by CNC molding machine. The above PCB board production process is relatively complicated. It takes three days or more from mold opening to production, with low timeliness and high production cost.

[0004] At the same time, the conventional metal preparation process is to layer-etch the indium tin oxide layer ITO and the metal conductive layer covering it that have been made on the substrate. The conventional metal preparation process requires two processes as follows: feeding the incoming substrate - substrate cleaning - photoresist coating - pre-baking - UV exposure - development - baking - etching - degumming, such as Figure 4, that is, the first etching, first etch the metal on the surface of the ITO layer, and then etch the ITO layer. The difference is that the etching solution used for the ITO layer is different from the etching solution for the metal. The ITO etching solution used in the first etching has a corrosive effect on the metal. After etching, the ITO lead is wider than the metal lead and the precision is lower. Summary of the invention

[0005] The purpose of the present invention is to provide a method for preparing a PCB adapter plate by using a glass substrate etching process to solve the problems in the prior art of high production cost, relatively complex process, and need to improve timeliness and precision.

[0006] The technical solution of the present invention is: A method for preparing a PCB adapter plate by using a glass substrate etching process, comprising the following steps: S1. preparing a film with a predetermined pattern, wherein the predetermined pattern includes a light-transmitting area and a non-light-transmitting area; S2, using a post-metallization preparation process to prepare an indium tin oxide layer, i.e., an ITO conductive layer, and a metal layer on the glass substrate, respectively, wherein the post-metallization preparation process is to prepare an ITO conductive layer on the glass substrate, etch it, and then prepare a metal layer, and then etch the metal layer; S3, after step S2, a single-layer circuit semi-finished product is obtained. When a single-layer circuit is manufactured, step S5 is entered; when a double-layer circuit or a multi-layer circuit is manufactured, photoresist is coated on the single-layer circuit semi-finished product to insulate and form an insulating layer, and step S4 is entered; S4, performing PVD metal coating on the entire surface to form an upper metal layer, and then performing a metal layer etching process, cleaning, coating with photoresist and exposing, the upper metal layer corresponding to the non-light-transmitting area is retained, and the upper metal layer corresponding to the light-transmitting area is etched; S5, after going through step S4 once, a double-layer circuit semi-finished product is obtained, and after going through step S4 multiple times, a multi-layer circuit semi-finished product is obtained, and the process proceeds to the next step S6; S6, cutting the single-layer circuit semi-finished product obtained in step S3 or the double-layer circuit semi-finished product or the multi-layer circuit semi-finished product obtained in step S5 to obtain a glass substrate circuit board, which is then connected to the flexible circuit board FPC and turned on to obtain a glass substrate adapter board.

[0007] Furthermore, in step S2, an indium tin oxide layer, that is, an ITO conductive layer and a metal layer are prepared on the glass substrate respectively by a post-metallization preparation process, specifically, S21, a layer of indium tin oxide layer, i.e., an ITO conductive layer, which has been manufactured on a glass substrate, is cleaned, coated with a photoresist, and exposed using the film of step S1 on an exposure machine, and then the indium tin oxide layer ITO corresponding to the light-transmitting area on the glass substrate is etched, and the indium tin oxide layer ITO corresponding to the non-light-transmitting area is retained, to obtain an etched indium tin oxide layer ITO; S22, performing full-surface PVD metal coating on the etched indium tin oxide layer ITO and the glass substrate to produce a metal layer, after cleaning and coating with photoresist and performing exposure operation on an exposure machine using the film of step S1, the metal layer corresponding to the light-transmitting area is etched, and the metal layer corresponding to the non-light-transmitting area is retained to obtain an etched metal layer.

[0008] Furthermore, in step S4, the photoresist is polyimide glue, namely, PI glue.

[0009] Furthermore, in step S6, the flexible circuit board FPC is connected and conducted to form a glass substrate adapter board. Specifically, the metal circuit, namely, electrode circuit 1, formed by etching the glass substrate circuit board and the metal circuit, namely, electrode circuit 2, corresponding to the flexible circuit board FPC, are conducted through anisotropic conductive film ACF to achieve vertical connection.

[0010] The beneficial effects of the present invention are: 1. This method uses a glass substrate etching process to replace the PCB adapter board preparation method. Compared with the existing method, it can greatly reduce the production cost, simplify the process flow, improve timeliness, and achieve the purpose of equivalent or more precise use effect. This method uses a post-metallization preparation process, which can improve the accuracy and have no effect on the metal layer, prevent the metal layer from being corroded by the ITO etching solution, and can achieve finer line widths and line gaps.

[0011] 2. The present invention adopts film to make the mask MASK, which has a simple process, a production cost of about 100 yuan per piece, can be reused, and the accuracy can be controlled below 10um.

[0012] 3. This method uses glass substrate etching technology to replace the PCB adapter board preparation method, and the manufacturing cost is relatively low. Compared with the cost of a single PCB, one glass substrate can be etched into 10 pieces using the glass substrate etching process, which is equivalent to only 1 / 10 of the PCB cost after amortization.

[0013] Fourth, this method uses glass substrate etching technology to replace the PCB adapter board preparation method, which can improve timeliness. It takes three days or more from mold opening to production of PCB. However, film production only takes one day, and the glass substrate adapter board can be produced one hour after going online. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1It is a schematic diagram of a process of using a glass substrate etching process to replace a PCB adapter board preparation method; Figure 2 is a schematic diagram of a specific example of film in the embodiment; Figure 3 Schematic diagrams for explaining the first metal plating and the second metal plating in the embodiments, wherein (a) is a schematic diagram of the first metal plating, and (b) is a schematic diagram of the second metal plating; Figure 4 It is a schematic diagram of the conventional metal preparation process; Figure 5 Schematic diagrams for explaining the manufacture of a single-layer circuit semi-finished product and a double-layer circuit semi-finished product in the embodiment, wherein (a) is a schematic diagram for explaining the manufacture of a single-layer circuit semi-finished product; (b) is a schematic diagram for explaining the manufacture of a double-layer circuit semi-finished product based on the single-layer circuit semi-finished product; Figure 6 is a schematic diagram of a specific example of a single-layer glass substrate adapter plate in the embodiment; Figure 7 is a schematic diagram of a specific example of a double-layer circuit semi-finished product in the embodiment; Among them: 1-film, 2-light-transmitting area, 3-non-light-transmitting area, 4-glass substrate, 5-indium tin oxide layer ITO, 6-metal layer, 7-PI glue, 8-upper metal layer, 9-single-layer circuit semi-finished product, 10-flexible circuit board FPC. DETAILED DESCRIPTION

[0015] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0016] The embodiment provides a method for preparing a PCB adapter plate by using a glass substrate etching process instead of a PCB adapter plate. Figure 1 , including the following steps, S1, making a film with a predetermined pattern, wherein the predetermined pattern includes a light-transmitting area and a non-light-transmitting area, such as Figure 2 .

[0017] In step S1, the film with the predetermined pattern is subsequently used as a mask in an exposure machine. After exposure, the photoresist in the light-transmitting area will be removed, and the metal or indium tin oxide layer ITO in the unprotected exposure area can be etched away in the etching process. Figure 2 It is a schematic diagram of a film with a predetermined pattern. Figure 2In the figure, the round hole is the positioning hole, and the other white frame lines are the non-light-transmitting areas corresponding to the metal traces on the glass substrate. The metal traces (leads) are all indium tin oxide layer ITO + metal. Because it involves etching, photoresist is coated and exposed, developed and etched. The unexposed white traces are the metal patterns to be retained on the glass substrate; the other black areas are light-transmitting areas. The metal layer and indium tin oxide ITO on the corresponding glass substrate will be etched away, leaving only a glass substrate without any patterns.

[0018] S2. A post-metallization preparation process is used to prepare an indium tin oxide layer, i.e., an ITO conductive layer, and a metal layer on a glass substrate, respectively. The post-metallization preparation process is to prepare an ITO conductive layer on a glass substrate, etch it, and then prepare a metal layer, and then etch the metal layer.

[0019] In step S2, an indium tin oxide layer, i.e., an ITO conductive layer and a metal layer are prepared on a glass substrate by a post-metallization preparation process, specifically, S21, a layer of indium tin oxide layer, i.e., an ITO conductive layer, which has been manufactured on a glass substrate, is cleaned, coated with a photoresist, and exposed using the film of step S1 on an exposure machine, and then the indium tin oxide layer ITO corresponding to the light-transmitting area on the glass substrate is etched, and the indium tin oxide layer ITO corresponding to the non-light-transmitting area is retained, to obtain an etched indium tin oxide layer ITO; S22, performing full-surface PVD metal coating on the etched indium tin oxide layer ITO and the glass substrate to produce a metal layer, after cleaning and coating with photoresist and performing exposure operation on an exposure machine using the film of step S1, the metal layer corresponding to the light-transmitting area is etched, and the metal layer corresponding to the non-light-transmitting area is retained to obtain an etched metal layer.

[0020] In step S2, a post-metallization process is adopted, and the indium tin oxide layer ITO is below the metal layer. Figure 3 When etching the indium tin oxide layer ITO in (a), there is a problem that the ITO etching solution will corrode the metal layer, so a post-metal plating process is used, such as Figure 3 (b) is to first etch the glass substrate with only the indium tin oxide layer ITO, and then PVD plate the metal layer to avoid the possibility of corrosion of the metal layer. In addition, since the metal layer will not be corroded in the subsequent metallization process, the line width and gap between lines can be 5 microns or less, meeting the requirements of high-precision routing layout.

[0021] S3. After step S2, a single-layer circuit semi-finished product is obtained. When making a single-layer circuit, proceed to step S5; when making a double-layer circuit or a multi-layer circuit, a photoresist is coated on the single-layer circuit semi-finished product to insulate and form an insulating layer, and proceed to step S4.

[0022] S4, performing PVD metal coating on the entire surface to produce an upper metal layer, and then performing a metal layer etching process, cleaning, coating with photoresist and exposing, the upper metal layer corresponding to the non-light-transmitting area is retained, and the upper metal layer corresponding to the light-transmitting area is etched.

[0023] S5. After going through step S4 once, a double-layer circuit semi-finished product is obtained, such as Figure 7 After multiple steps S4, a multi-layer circuit semi-finished product is obtained, and the next step S6 is entered.

[0024] In step S5, after Figure 5 After the arrow in (a), a single-layer circuit semi-finished product can be obtained. After that, a layer of photoresist is coated after the ITO layer and the metal layer have been etched. This layer of photoresist has an insulating effect, so that PVD can prepare multi-layer metal circuits for upper and lower layer insulation. Figure 5 The arrow in (b) is used to coat the insulation layer and PVD metallization and the subsequent process can obtain a double-layer circuit semi-finished product, which can be repeated many times. Figure 5 The arrows in (b) are used for insulating layer coating and PVD metallization, and then a multi-layer circuit semi-finished product is obtained.

[0025] S6, cutting the single-layer circuit semi-finished product obtained in step S3 or the double-layer circuit semi-finished product or the multi-layer circuit semi-finished product obtained in step S5 to obtain a glass substrate circuit board, which is then connected to the flexible circuit board FPC and turned on to obtain a glass substrate adapter board.

[0026] In step S6, the flexible circuit board FPC is connected and turned on to form a finished product. Figure 6 Specifically, the metal circuit formed by etching the glass substrate circuit board, namely the electrode circuit 1, and the metal circuit corresponding to the flexible circuit board FPC, namely the electrode circuit 2, are connected through the anisotropic conductive film ACF to achieve vertical connection. The anisotropic conductive film ACF has bonding, curing and conductive functions, and is filled with conductive particles with an insulating layer. These conductive particles are broken by temperature, pressure and pressing time. After the rupture, the metal inside the insulating layer is exposed, and the electrode circuit 2 of the upper flexible circuit board FPC and the electrode circuit 1 of the lower glass substrate circuit board are vertically connected. Electrode circuit 2 and electrode circuit 1 are actually higher (protruding) than the substrate, which is equivalent to the area without metal leads. Although there are conductive particles, they are not broken by external force (extrusion between metal leads), so the metal leads are insulated.

[0027] This method uses a glass substrate etching process to replace the PCB adapter board preparation method. Compared with the existing method, it can greatly reduce the production cost, simplify the process flow, improve timeliness, and achieve the purpose of equivalent or more precise use effect.

[0028] This method uses a glass substrate etching process to replace the PCB adapter board preparation method, and uses a yellow light substrate etching process to produce a single-layer or double-layer PCB that can replace it. The yellow light substrate etching process uses the light emitted by the photolithography machine to expose the glass substrate coated with photoresist and having a whole metal layer through a photomask with a pattern. The photoresist will change its properties after being exposed to light, so that the pattern on the mask is copied to the glass substrate, so that the glass substrate has the function of an electronic circuit diagram. First, use film to make a metal and ITO (conductive material: indium tin oxide) mask (MASK) with a predetermined pattern; then, according to the etching accuracy requirements, the first metal plating and the second metal plating process can be selected. Among them, the first metal plating is that the glass substrate has an indium tin oxide layer ITO and a metal layer respectively, and then metal etching and ITO etching are performed. The process is simple, but the disadvantage is that ITO is under the metal, and after etching, ITO is wider than the metal lead, that is, the degree of precision is reduced. The post-metallization process is to first etch the ITO pattern, then deposit the metal layer on the surface of the glass substrate by PVD (sputtering), and then perform metal etching; by adding a metal coating process, the accuracy can be improved without any impact on the metal layer, thus preventing the metal layer from being corroded by the ITO etching solution, and achieving finer line widths and line gaps.

[0029] This method uses a glass substrate etching process to replace the PCB adapter board preparation method, adopts a post-metallization process and a PI insulation layer metallization process, and after the glass substrate with ITO is cleaned, coated with photoresist and exposed, the non-exposed area retains the required pattern, and the exposed area is etched. The ITO and metal etching process flows are the same, except that the etching solution is divided into metal etching solution and ITO etching solution, which is equivalent to performing the process twice to produce a single-layer circuit semi-finished product, such as Figure 5 (a). Figure 5 (b), the insulating layer is coated with photoresist for insulation, and the entire surface is PVD metal-plated again. After cleaning, photoresist coating and exposure, the non-exposed metal area retains the required pattern to prepare a double-layer circuit semi-finished product. The PCB double-layer board uses vias to route the crossed lines on the back to avoid crossing. Each time PVD is passed, a metal layer is added, in which polyimide glue (coated photoresist, also an insulating layer) is used between the metal layer and the upper metal layer, and between the upper metal layers for upper and lower insulation. After repeated PVD, the process can realize the preparation of multi-layer circuit semi-finished products, which can realize micron-level circuits and can be superimposed for high-precision lead design. Glass substrate etching can be achieved by using PI glue as an insulating layer for isolation, that is, single-layer or multi-layer metal leads can be prepared on a single side. PI glue has good heat resistance and insulation effects, and the film thickness can be coated at the micron level for insulation.

[0030] This method uses a glass substrate etching process to replace the PCB adapter board preparation method, and uses a glass substrate etching process with ITO and metal to replace a single-layer or double-layer PCB adapter board, which can greatly reduce manufacturing costs, improve accuracy and achieve timeliness. The method of etching ITO first and then plating metal multiple times is used to achieve double-layer or multi-layer routing; by etching ITO first and then plating metal, the degree of precision is higher, and more precise lead width and lead gap requirements can be achieved. This method is suitable for electronic manufacturing fields such as organic light-emitting diode OLED test lighting and display panel manufacturing.

[0031] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A method for preparing a PCB adapter plate by using a glass substrate etching process, characterized in that: The following steps are included: S1. preparing a film with a predetermined pattern, wherein the predetermined pattern includes a light-transmitting area and a non-light-transmitting area; S2, using a post-metallization preparation process to prepare an indium tin oxide layer, i.e., an ITO conductive layer, and a metal layer on the glass substrate, respectively, wherein the post-metallization preparation process is to prepare an ITO conductive layer on the glass substrate, etch it, and then prepare a metal layer, and then etch the metal layer; S3, after step S2, a single-layer circuit semi-finished product is obtained. When a single-layer circuit is manufactured, step S5 is entered; when a double-layer circuit or a multi-layer circuit is manufactured, photoresist is coated on the single-layer circuit semi-finished product to insulate and form an insulating layer, and step S4 is entered; S4, performing PVD metal coating on the entire surface to form an upper metal layer, and then performing a metal layer etching process, cleaning, coating with photoresist and exposing, the upper metal layer corresponding to the non-light-transmitting area is retained, and the upper metal layer corresponding to the light-transmitting area is etched; S5, after going through step S4 once, a double-layer circuit semi-finished product is obtained, and after going through step S4 multiple times, a multi-layer circuit semi-finished product is obtained, and the process proceeds to the next step S6; S6, cutting the single-layer circuit semi-finished product obtained in step S3 or the double-layer circuit semi-finished product or the multi-layer circuit semi-finished product obtained in step S5 to obtain a glass substrate circuit board, which is then connected to the flexible circuit board FPC and turned on to obtain a glass substrate adapter board.

2. The method for preparing a PCB adapter board by using a glass substrate etching process as claimed in claim 1, characterized in that: In step S2, an indium tin oxide layer, i.e., an ITO conductive layer and a metal layer are prepared on a glass substrate by a post-metallization preparation process, specifically, S21, a layer of indium tin oxide layer, i.e., an ITO conductive layer, which has been manufactured on a glass substrate, is cleaned, coated with a photoresist, and exposed using the film of step S1 on an exposure machine, and then the indium tin oxide layer ITO corresponding to the light-transmitting area on the glass substrate is etched, and the indium tin oxide layer ITO corresponding to the non-light-transmitting area is retained, to obtain an etched indium tin oxide layer ITO; S22, performing full-surface PVD metal coating on the etched indium tin oxide layer ITO and the glass substrate to produce a metal layer, after cleaning and coating with photoresist and performing exposure operation on an exposure machine using the film of step S1, the metal layer corresponding to the light-transmitting area is etched, and the metal layer corresponding to the non-light-transmitting area is retained to obtain an etched metal layer.

3. The method for preparing a PCB adapter plate by using a glass substrate etching process as claimed in claim 1, characterized in that: In step S4, the photoresist is polyimide glue, namely PI glue.

4. The method for preparing a PCB adapter plate by using a glass substrate etching process as claimed in any one of claims 1 to 3, characterized in that: In step S6, the flexible circuit board FPC is connected and turned on to form a glass substrate adapter board. Specifically, the metal circuit, namely electrode circuit 1, formed by etching the glass substrate circuit board and the metal circuit, namely electrode circuit 2, corresponding to the flexible circuit board FPC are turned on by anisotropic conductive film ACF to achieve vertical connection.

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