A method, system and computer device for automatically adjusting line spacing in PCB design

Abstract

The present invention relates to the technical field of PCBs, and in particular to a method, system and computer equipment for automatically adjusting line spacing in PCB design. The present invention effectively reduces crosstalk between adjacent signal lines by reasonably adjusting the spacing between components and signal lines, better controls the impedance matching of signal lines by considering electrical characteristic information, and adjusts the line spacing in PCB design by obtaining characteristic information of components, which helps to reduce interference, improve signal integrity, and enhance electrical performance and reliability. By calculating the actual spacing between a reference line segment and a component pin, the crosstalk between signal lines is effectively reduced. By considering pin characteristics and electrical characteristics, the impedance of the signal line can be ensured to match the components. By accurately analyzing the size and characteristics of an intermediate line segment group, the crosstalk between adjacent signal lines can be effectively reduced. Reasonable line spacing can reduce the coupling of electromagnetic fields, ensure the clarity of signals, thereby improving the efficiency of signal transmission and reducing reflection phenomena.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB, and in particular to a method, system and computer equipment for automatically adjusting line spacing in PCB design. Background Art

[0002] The design of printed circuit boards is based on the circuit schematics to achieve the functions required by circuit designers. The design of printed circuit boards mainly refers to the layout design, which needs to consider various factors such as the layout of external connections, the optimized layout of internal electronic components, the optimized layout of metal connections and through holes, electromagnetic protection, and heat dissipation. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be achieved manually, while complex layout design requires the help of computer-aided design.

[0003] In the later stage of PCB design, engineers need to adjust the line spacing to ensure signal quality and design aesthetics. Existing line segment adjustments are all done manually. Each time a line segment is selected, the moving distance is set, and then it is dragged in the direction to be adjusted. However, since components are designed in the PCB board, manual adjustment of the line spacing cannot take into account the impact of the spacing between components and line segments in the PCB board. If the spacing between components and line segments is close, signal interference will occur. If the distance is far, space will be wasted, thereby reducing the efficiency of PCB design. Summary of the invention

[0004] The main purpose of the present invention is to provide a method for automatically adjusting line spacing in PCB design, aiming to solve the technical problems in the prior art.

[0005] The present invention provides a method for automatically adjusting line spacing in PCB design, comprising:

[0006] Acquire first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information;

[0007] Obtain a target line segment group in the PCB board, and extract two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component;

[0008] Determine a first adjustment distance according to each of the first adjustment line segments, pin characteristic information of the corresponding component, and electrical characteristic information;

[0009] Obtain the two edgemost line segments of the target line segment group in the PCB board as two reference line segments;

[0010] Acquire second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information;

[0011] Determine the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determine the second adjustment spacing according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component;

[0012] Extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group;

[0013] Acquire third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics;

[0014] A third adjustment spacing is determined according to the line segment size characteristics and the magnetic permeability characteristics, and spacings of line segments in the target line segment group are adjusted based on the first adjustment spacing, the second adjustment spacing, and the third adjustment spacing.

[0015] Preferably, the step of extracting two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component includes:

[0016] Acquire a first center coordinate of a component according to the first position feature information;

[0017] Obtain the first starting point coordinates and the first end point coordinates of each line segment on the left side of the component in the target line segment group, and obtain the second center coordinates of the corresponding line segment according to each of the first starting point coordinates and the first end point coordinates;

[0018] Obtain the second starting point coordinates and the second end point coordinates of each line segment on the right side of the component in the target line segment group, and obtain the third center coordinates of the corresponding line segment according to each of the second starting point coordinates and the second end point coordinates;

[0019] Acquire a first straight-line distance between a corresponding line segment and a component according to the first center coordinate and each second center coordinate;

[0020] Acquire a second straight-line distance between a corresponding line segment and a component according to the first center coordinate and each third center coordinate;

[0021] A line segment corresponding to the smallest first straight-line distance and a line segment corresponding to the smallest second straight-line distance are selected as two first adjustment line segments of each component.

[0022] Preferably, the step of determining the first adjustment spacing according to each of the first adjustment line segments, pin characteristic information of the corresponding component, and electrical characteristic information comprises:

[0023] Acquire operating frequency characteristics and power level characteristics according to the electrical characteristic information;

[0024] Obtaining a reference operating frequency of the component, and obtaining an impact factor according to the reference operating frequency;

[0025] The frequency influence degree value is calculated according to the operating frequency characteristics, the reference operating frequency and the influence factor, wherein the calculation formula is:

[0026]

[0027] Among them, P(Y) represents the frequency influence value, G(P) represents the working frequency characteristics, J(P) represents the reference working frequency, and N represents the influence factor;

[0028] Acquire third line width characteristic information of the first adjustment line segment;

[0029] The first adjustment spacing is calculated according to the third line width characteristic information, the power level characteristic, the frequency influence degree value and the pin characteristic information, wherein the calculation formula is:

[0030] T(Z1)=P(Y)*Y(J)*G(D)+X(K3);

[0031] Among them, T(Z1) represents the first adjustment spacing, P(Y) represents the frequency influence value, Y(J) represents the pin characteristic information, G(D) represents the power level characteristic, and X(K3) represents the third line width characteristic information.

[0032] Preferably, the step of determining the nearest component according to the second position characteristic information and the first characteristic information of the plurality of components comprises:

[0033] Acquire the first midpoint position information of the corresponding reference line segment according to the second position feature information;

[0034] Acquire second midpoint position information of corresponding components according to each of the first position feature information;

[0035] Acquire the center distance between the corresponding component and the reference line segment according to the first midpoint position information and each second midpoint position information;

[0036] Sorting the plurality of center distances from small to large to obtain a distance sorting table;

[0037] The component corresponding to the center spacing ranked first is selected from the spacing sorting table as the nearest component.

[0038] Preferably, the step of determining the third adjustment spacing according to the line segment size characteristics and the magnetic permeability characteristics comprises:

[0039] Acquire the coupled inductance of the corresponding line segment according to the magnetic permeability characteristics, and acquire the inductor voltage crosstalk according to the coupled inductance and line segment size characteristics;

[0040] Acquire initial spacing features between two adjacent line segments in each intermediate line segment group, and acquire coupling capacitance of corresponding line segments according to the initial spacing features and line segment size features;

[0041] Obtain the signal amplitude characteristics and self-capacitance characteristics of each line segment;

[0042] The capacitor voltage crosstalk is calculated according to the signal amplitude characteristics, the self-capacitance characteristics and the coupling capacitance, wherein the calculation formula is:

[0043]

[0044] Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics;

[0045] A comprehensive crosstalk degree is obtained according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and a third adjustment interval is determined according to the comprehensive crosstalk degree and line segment size characteristics.

[0046] Preferably, the step of obtaining the inductor voltage crosstalk according to the coupled inductor and the line segment size characteristics comprises:

[0047] Acquire the line segment diameter and line segment length according to the line segment size feature, and acquire the line segment cross-sectional area according to the line segment diameter;

[0048] Get the actual equivalent resistivity of the line segment;

[0049] Obtaining an equivalent resistance of a corresponding line segment according to the actual equivalent resistivity, the line segment cross-sectional area, and the line segment length;

[0050] Obtaining a signal change amplitude and change duration of a line segment, and obtaining a signal change rate of a corresponding line segment according to the signal change amplitude and change duration;

[0051] A coupled inductance is obtained, and an inductor voltage crosstalk is obtained according to the coupled inductance, a signal change rate, and an equivalent resistance.

[0052] The present application also provides a system for automatically adjusting line spacing in PCB design, comprising:

[0053] A first acquisition module is used to acquire first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information;

[0054] A first extraction module is used to obtain a target line segment group in the PCB board, and extract two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component;

[0055] A first determining module, configured to determine a first adjustment spacing according to each of the first adjustment line segments, pin characteristic information of a corresponding component, and electrical characteristic information;

[0056] The second acquisition module is used to acquire the two edgemost line segments of the target line segment group in the PCB board as two reference line segments;

[0057] A third acquisition module, used to acquire second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information;

[0058] A second determination module, configured to determine the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determine a second adjustment interval according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component;

[0059] A second extraction module, used for extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group;

[0060] A third determination module is used to obtain third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics;

[0061] The adjustment module is used to determine a third adjustment spacing according to the line segment size characteristics and the magnetic permeability characteristics, and to adjust the spacing of the line segments in the target line segment group based on the first adjustment spacing, the second adjustment spacing and the third adjustment spacing.

[0062] Preferably, the third determining module comprises:

[0063] A first acquisition unit, configured to acquire line segment size characteristics and magnetic permeability characteristics of line segments in each intermediate line segment group according to the third characteristic information;

[0064] A second acquisition unit, configured to acquire a coupling inductance of a corresponding line segment according to the magnetic permeability characteristics, and acquire an inductor voltage crosstalk according to the coupling inductance and line segment size characteristics;

[0065] A third acquisition unit is used to acquire an initial spacing feature between two adjacent line segments in each intermediate line segment group, and acquire a coupling capacitance of a corresponding line segment according to the initial spacing feature and a line segment size feature;

[0066] A fourth acquisition unit, used to acquire a signal amplitude characteristic and a self-capacitance characteristic of each line segment;

[0067] A calculation unit is used to calculate the capacitor voltage crosstalk according to the signal amplitude characteristics, the self-capacitance characteristics and the coupling capacitance, wherein the calculation formula is:

[0068]

[0069] Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics;

[0070] The determination unit is used to obtain a comprehensive crosstalk degree according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and determine a third adjustment interval according to the comprehensive crosstalk degree and a line segment size feature.

[0071] The present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method for automatically adjusting line spacing in PCB design when executing the computer program.

[0072] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the method for automatically adjusting line spacing in PCB design are implemented.

[0073] The beneficial effects of the present invention are as follows: the present invention can effectively reduce the crosstalk between adjacent signal lines by reasonably adjusting the spacing between components and signal lines; by considering electrical characteristic information, the impedance matching of signal lines can be better controlled to avoid signal reflection and distortion; by obtaining characteristic information of components to adjust the line spacing in PCB design, it is helpful to reduce interference, improve signal integrity, and enhance electrical performance and reliability; by calculating the actual spacing between the reference line segment and the component pin, the crosstalk between signal lines can be effectively reduced; a good spacing design can help reduce electromagnetic coupling between adjacent signal lines and reduce the risk of signal distortion; by considering pin characteristics and electrical characteristics, it can ensure that the impedance of the signal line matches the components; by accurately analyzing the size and characteristics of the intermediate line segment group, the crosstalk between adjacent signal lines can be effectively reduced; a reasonable line spacing can reduce the coupling of electromagnetic fields and ensure the clarity of the signal, thereby improving the efficiency of signal transmission and reducing reflection phenomena; by considering multiple spacing adjustment factors, it is possible to reduce failures caused by interference, improve the reliability and service life of the PCB, thereby significantly improving signal integrity, electrical performance and electromagnetic compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 The figure is a schematic diagram of a method flow according to an embodiment of the present invention.

[0075] Figure 2 FIG. 1 is a schematic diagram of a device structure according to an embodiment of the present invention.

[0076] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0077] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0078] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0079] like Figure 1-Figure 3 As shown, the present application provides a method for automatically adjusting line spacing in PCB design, comprising:

[0080] S1. Obtain first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information;

[0081] S2, obtaining a target line segment group in the PCB board, and extracting two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component;

[0082] S3, determining a first adjustment distance according to each of the first adjustment line segments, pin characteristic information of the corresponding component, and electrical characteristic information;

[0083] S4, obtaining the two edgemost line segments of the target line segment group in the PCB board as two reference line segments;

[0084] S5, acquiring second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information;

[0085] S6, determining the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determining the second adjustment spacing according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component;

[0086] S7, extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group;

[0087] S8, obtaining third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics;

[0088] S9. Determine a third adjustment spacing according to the line segment size characteristics and magnetic permeability characteristics, and adjust the spacing of the line segments in the target line segment group based on the first adjustment spacing, the second adjustment spacing and the third adjustment spacing. Specifically, adjust the spacing between the component and the two first adjustment line segments according to the first adjustment spacing, adjust the spacing between each baseline line segment and the nearest component according to the second adjustment spacing, and adjust the spacing between the line segments within each two adjacent components according to the third adjustment spacing.

[0089] As described in the above steps S1-S9, the design of PCB (printed circuit board) mainly refers to the layout design, which needs to consider various factors such as the layout of external connections, the optimized layout of internal electronic components, the optimized layout of metal connections and through holes, electromagnetic protection, heat dissipation, etc. In the later stage of PCB design, engineers need to adjust the line spacing to ensure signal quality and design aesthetics. The existing line segment adjustment is all done manually. Each time a line segment is selected, the moving distance is set and then dragged in the direction to be adjusted for adjustment. However, since components are designed in the PCB board, manual adjustment of the line spacing cannot take into account the influence of the spacing between the components and the line segments in the PCB board. If the spacing between the components and the line segments is close, signal interference will occur. If the distance is far, space will be wasted, thereby reducing the efficiency of PCB design. The present invention obtains first position characteristic information, pin characteristic information and electrical characteristic information of each component in a PCB board, extracts two adjacent line segments from a target line segment group as two first adjustment line segments of each component according to the first position characteristic information of each component, and then determines a first adjustment spacing according to each first adjustment line segment, the pin characteristic information of the corresponding component and the electrical characteristic information. In this way, by reasonably adjusting the spacing between components and signal lines, crosstalk between adjacent signal lines can be effectively reduced. The coupling of electric field and magnetic field between signal lines is the main cause of crosstalk. Appropriate line spacing can reduce such coupling. By increasing the distance between components and signal lines, radiation interference generated by high-frequency signals can be reduced, thereby improving the anti-interference ability of the system. By considering the electrical characteristic information, the impedance matching of the signal line can be better controlled to avoid signal reflection and distortion. The line spacing in PCB design is adjusted by obtaining the characteristic information of components, which is helpful to reduce interference, improve signal integrity, and improve electrical performance and reliability. The two edgemost line segments of the target line segment group are used as two reference line segments, and the nearest component is determined according to the second position feature information of each reference line segment and the first position feature information of multiple components, and the second adjustment spacing is determined according to the first line width feature information, the pin feature information of the nearest component and the electrical feature information. In this way, by calculating the actual spacing between the reference line segment and the component pin, the crosstalk between signal lines can be effectively reduced. Good spacing design helps to reduce electromagnetic coupling between adjacent signal lines and reduce the risk of signal distortion. Appropriate line spacing design helps to ensure that the signal is not interfered with by external factors during propagation, thereby maintaining good signal quality. By considering the pin features and electrical features, the impedance of the signal line can be matched with the components. Correct impedance matching helps to reduce signal reflection and improve signal transmission efficiency. By using the two edgemost line segments of the target line segment group as reference line segments and dynamically adjusting the line spacing using the feature information of these reference line segments, the signal integrity, electrical performance and electromagnetic compatibility of the PCB design can be significantly improved.By extracting the line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as the intermediate line segment group, and determining the third adjustment spacing according to the line segment size characteristics and magnetic permeability characteristics of each line segment in each intermediate line segment group, the crosstalk between adjacent signal lines can be effectively reduced by accurately analyzing the size and characteristics of the intermediate line segment group. Reasonable line spacing can reduce the coupling of electromagnetic fields and ensure the clarity of signals. By analyzing the size characteristics and electromagnetic characteristics (such as magnetic permeability) of the line segments, the impedance matching of the signal lines can be optimized, thereby improving the efficiency of signal transmission and reducing reflection phenomena. By adjusting the spacing, the interference of electromagnetic radiation generated by the signal lines on other components and signal lines can be effectively reduced, ensuring the clarity of the system. Stable operation, and finally adjusting the spacing of the line segments in the target line segment group based on the first adjustment spacing, the second adjustment spacing and the third adjustment spacing. In this way, the electromagnetic coupling between signal lines can be effectively reduced, crosstalk can be reduced, and the clarity and stability of the signal during transmission can be ensured. The design of the second adjustment spacing takes into account the line width characteristics of the edge line segments and the electrical characteristics of the component pins, which helps to achieve impedance matching, reduce signal reflection, and improve signal transmission efficiency. By considering multiple spacing adjustment factors, it can reduce failures caused by interference, improve the reliability and service life of the PCB, and thus significantly improve signal integrity, electrical performance and electromagnetic compatibility.

[0090] In one embodiment, the step S2 of extracting two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component includes:

[0091] S21, acquiring a first center coordinate of a component according to the first position feature information;

[0092] S22, obtaining the first starting point coordinates and the first end point coordinates of each line segment on the left side of the component in the target line segment group, and obtaining the second center coordinates of the corresponding line segment according to each of the first starting point coordinates and the first end point coordinates;

[0093] S23, obtaining the second starting point coordinates and the second end point coordinates of each line segment on the right side of the component in the target line segment group, and obtaining the third center coordinates of the corresponding line segment according to each of the second starting point coordinates and the second end point coordinates;

[0094] S24, acquiring a first straight-line distance between a corresponding line segment and a component according to the first center coordinate and each second center coordinate;

[0095] S25. Obtain a second straight-line distance between a corresponding line segment and a component according to the first center coordinate and each third center coordinate;

[0096] S26. Select a line segment corresponding to the smallest first straight-line distance and a line segment corresponding to the smallest second straight-line distance as two first adjustment line segments for each component.

[0097] As described in the above steps S21-S26, the present invention obtains the first center coordinate of the component through the first position feature information, obtains the first starting point coordinate and the first end point coordinate of each line segment on the left side of the component in the target line segment group, and obtains the second center coordinate of the corresponding line segment according to each first starting point coordinate and the first end point coordinate, and then obtains the first straight-line distance between the corresponding line segment and the component according to the first center coordinate and each second center coordinate. By accurately calculating the straight-line distance between the component and the adjacent line segment, the layout of the line segment can be effectively determined, the electromagnetic coupling between signal lines can be reduced, the crosstalk can be reduced, the clarity and stability of the signal can be ensured, and the line width and spacing can be reasonably configured to achieve impedance matching, thereby reducing signal reflection and loss and improving electrical performance. Similarly, through The second starting point coordinates and the second end point coordinates of each line segment on the right side of the component in the target line segment group are obtained, and the third center coordinates of the corresponding line segment are obtained according to each second starting point coordinate and the second end point coordinates, and then the second straight-line distance between the corresponding line segment and the component is obtained according to the first center coordinate and each third center coordinate. Finally, the line segment corresponding to the smallest first straight-line distance and the line segment corresponding to the smallest second straight-line distance are selected as the two first adjustment line segments of each component. In this way, by calculating the straight-line distance between the component and the line segment, the mutual interference between the signal lines can be effectively evaluated. Selecting the line segment with the smallest straight-line distance as the adjustment line segment is helpful to reduce signal reflection and distortion, and can effectively reduce the electromagnetic radiation interference caused by the signal line, and ensure the electromagnetic compatibility between the components.

[0098] In one embodiment, the step S3 of determining the first adjustment interval according to each first adjustment line segment, pin characteristic information of the corresponding component, and electrical characteristic information includes:

[0099] S31, acquiring operating frequency characteristics and power level characteristics according to the electrical characteristic information;

[0100] S32, obtaining a reference operating frequency of the component, and obtaining an impact factor according to the reference operating frequency;

[0101] S33, calculating the frequency influence value according to the operating frequency characteristics, the reference operating frequency and the influence factor, wherein the calculation formula is:

[0102]

[0103] Among them, P(Y) represents the frequency influence value, G(P) represents the working frequency characteristics, J(P) represents the reference working frequency, and N represents the influence factor;

[0104] S34, obtaining third line width characteristic information of the first adjustment line segment;

[0105] S35. Calculate a first adjustment spacing according to the third line width characteristic information, the power level characteristic, the frequency influence degree value and the pin characteristic information, wherein the calculation formula is:

[0106] T(Z1)=P(Y)*Y(J)*G(D)+X(K3);

[0107] Among them, T(Z1) represents the first adjustment spacing, P(Y) represents the frequency influence value, Y(J) represents the pin characteristic information, G(D) represents the power level characteristic, and X(K3) represents the third line width characteristic information.

[0108] As described in the above steps S31-S35, the present invention obtains the operating frequency characteristics and power level characteristics through electrical characteristic information, wherein the operating frequency characteristics refer to the frequency range in which the electronic components can effectively perform signal processing, transmission and switching under normal working conditions, and the power level characteristics refer to the maximum power value that the electronic components can withstand under normal working conditions. By obtaining the reference operating frequency of the components and obtaining the influence factor according to the reference operating frequency, the frequency influence degree value is calculated according to the operating frequency characteristics, the reference operating frequency and the influence factor. In this way, the interference that may occur in high-frequency signal transmission can be identified by analyzing the operating frequency characteristics and the reference operating frequency. By calculating the influence degree value, the line spacing can be adjusted in time to reduce the possibility of frequency-related interference. Based on the calculation of the frequency influence degree value, the line spacing can be flexibly adjusted according to the frequency requirements and power levels of the actual application to meet different circuit design requirements. By evaluating the influence of the frequency characteristics on the circuit, the resistance of the PCB to external electromagnetic interference can be improved to ensure that the system works normally in a complex environment. The operating frequency characteristics and power level characteristics are obtained using electrical characteristic information, and the frequency influence degree value is calculated. It can not only enhance signal integrity and electrical performance, improve design flexibility and electromagnetic compatibility, but also support high-density design, improve design efficiency and product reliability. By obtaining the third line width characteristic information of the first adjustment line segment, and calculating the first adjustment spacing according to the third line width characteristic information, power level characteristics, frequency influence degree value and pin characteristic information, the adjustment spacing calculated according to the line width characteristic information and other electrical characteristics can effectively reduce mutual interference between signals and ensure signal integrity. By comprehensively considering multiple electrical characteristics to calculate the spacing, the design can be flexibly adjusted according to specific application requirements to meet the requirements of different frequencies and power levels. By considering factors such as power level and frequency influence, unnecessary iterations can be reduced in the early stage of design, and design efficiency can be improved. The method of calculating the first adjustment spacing using the third line width characteristic information of the first adjustment line segment, as well as the power level characteristics, frequency influence degree value and pin characteristic information, significantly improves the scientificity and effectiveness of PCB design, helps to reduce interference effects, optimize signal integrity, electrical performance and electromagnetic compatibility, and supports high-density design and improves product reliability, ultimately achieving more efficient and flexible PCB design.

[0109] In one embodiment, the step S6 of determining the nearest component according to the second position characteristic information and the first characteristic information of the plurality of components comprises:

[0110] S61, acquiring first midpoint position information of a corresponding reference line segment according to the second position feature information;

[0111] S62, acquiring second midpoint position information of corresponding components according to each of the first position feature information;

[0112] S63, obtaining the center distance between the corresponding component and the reference line segment according to the first midpoint position information and each second midpoint position information;

[0113] S64, sorting the plurality of center distances in ascending order to obtain a distance sorting table;

[0114] S65 , selecting the component corresponding to the center spacing ranked first from the spacing sorting table as the nearest component.

[0115] As described in the above steps S61-S65, the present invention obtains the first midpoint position information of the corresponding reference line segment through the second position feature information, obtains the second midpoint position information of the corresponding component according to each first position feature information, and then obtains the center distance between the corresponding component and the reference line segment according to the first midpoint position information and each second midpoint position information, sorts the multiple center distances in order from small to large to obtain a distance sorting table, and finally selects the component corresponding to the center distance ranked first from the distance sorting table as the nearest component. In this way, by determining the distance between the nearest component and the reference line segment, the interference caused by signal coupling between components can be effectively reduced, and the integrity of the signal can be improved. After determining the nearest component, the layout of the line segment can be optimized to ensure impedance matching between signal lines, reduce signal reflection and power loss, and significantly improve the consideration of interference effects between components and line segments in PCB design.

[0116] In one embodiment, the step S9 of determining the third adjustment interval according to the line segment size characteristics and the magnetic permeability characteristics comprises:

[0117] S91, obtaining a coupled inductance of a corresponding line segment according to the magnetic permeability characteristics, and obtaining an inductor voltage crosstalk according to the coupled inductance and line segment size characteristics;

[0118] S92, obtaining initial spacing features between two adjacent line segments in each intermediate line segment group, and obtaining coupling capacitance of corresponding line segments according to the initial spacing features and line segment size features, wherein the calculation formula is: Among them, O(R) represents coupling capacitance, L represents segment length (segment length is obtained by segment size feature), C(J) represents initial spacing feature, α represents dielectric constant of vacuum, and β represents relative dielectric constant;

[0119] S93, obtaining a signal amplitude characteristic and a self-capacitance characteristic of each line segment;

[0120] S94, calculating the capacitance voltage crosstalk according to the signal amplitude characteristic, the self-capacitance characteristic and the coupling capacitance, wherein the calculation formula is:

[0121]

[0122] Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics;

[0123] S95. Obtain a comprehensive crosstalk degree according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and determine a third adjustment spacing according to the comprehensive crosstalk degree and line segment size characteristics, wherein the calculation formula is: Wherein, T(Z3) represents the third adjustment interval, O(G) represents the coupling inductance, O(R) represents the coupling capacitance, L represents the line segment length, and Z(C) represents the comprehensive crosstalk degree.

[0124] As described in the above steps S91-S95, the present invention obtains the coupled inductance of the corresponding line segment through the magnetic permeability feature, wherein the magnetic permeability feature is a measure of the material's ability to respond to the magnetic field, and the coupled inductance refers to the inductance effect generated by the interaction of the magnetic field between two or more inductance elements, which indicates the ability of a changing current through one inductance element to induce an electromotive force in another inductance element, and obtains the inductance voltage crosstalk according to the coupled inductance and line segment size features, so that the coupled inductance and the inductance voltage crosstalk are calculated, wherein the inductance voltage crosstalk refers to the mutual coupling of two or more signal lines through the magnetic field caused by magnetic field coupling in the circuit, The change of a signal (especially a high-frequency signal) induces an undesirable voltage (i.e., crosstalk voltage) in the adjacent signal line. The source of voltage crosstalk can be better understood and managed, thereby optimizing the spacing between line segments and reducing mutual interference between signals. The influence of materials can be considered by using the magnetic permeability characteristics, and the design scheme can be evaluated more comprehensively, thereby optimizing the layout of the line segments. Considering coupled inductance and voltage crosstalk in the design helps to improve the efficiency of power transmission and reduce energy consumption, thereby not only helping to reduce voltage crosstalk and improve signal integrity, but also enhancing the electrical performance and electromagnetic compatibility of the design. By obtaining the two adjacent lines in each intermediate line segment group, the design can be more comprehensive. The initial spacing characteristics of the line segment are obtained, and the coupling capacitance of the corresponding line segment is obtained according to the initial spacing characteristics and the line segment size characteristics, wherein the coupling capacitance refers to the method of realizing signal transmission or energy transfer through the capacitor element in the circuit, which allows the AC signal to pass through while blocking the flow of the DC signal. By obtaining the signal amplitude characteristics and self-capacitance characteristics of each line segment, the capacitor voltage crosstalk is calculated according to the signal amplitude characteristics, self-capacitance characteristics and coupling capacitance, wherein the capacitor voltage crosstalk is caused by electric field coupling. Due to the coupling of the electric field between the two signal lines, the change of a signal induces a voltage in the adjacent signal line. Finally, according to the capacitor voltage The comprehensive crosstalk degree is obtained by calculating the coupling capacitance and the capacitance voltage crosstalk, and the third adjustment spacing is determined according to the comprehensive crosstalk degree and the line segment size characteristics. In this way, by calculating the coupling capacitance and the capacitance voltage crosstalk, it is possible to clearly identify which line segments interfere with each other, and reduce this interference by adjusting the spacing. Reducing the voltage crosstalk can significantly improve the integrity of the signal, especially in high-frequency applications, ensuring the stability of the signal amplitude and reducing the bit error rate. By obtaining the initial spacing characteristics between the line segments, calculating the coupling capacitance and the capacitance voltage crosstalk, and finally adjusting the line spacing according to the comprehensive crosstalk degree, the consideration of the interference effect between multiple line segments in PCB design can be significantly improved.

[0125] In one embodiment, the step S91 of acquiring the inductor voltage crosstalk according to the coupled inductor and the line segment size characteristics includes:

[0126] S911, acquiring a line segment diameter and a line segment length according to the line segment size feature, and acquiring a line segment cross-sectional area according to the line segment diameter;

[0127] S912, obtaining the actual equivalent resistivity of the line segment;

[0128] S913. Obtain the equivalent resistance of the corresponding line segment according to the actual equivalent resistivity, the line segment cross-sectional area, and the line segment length, wherein the calculation formula is: Where D(R) represents equivalent resistance, S(D) represents actual equivalent resistivity, L represents line segment length, and A represents line segment cross-sectional area;

[0129] S914, obtaining a signal change amplitude and a change duration of a line segment, and obtaining a signal change rate of a corresponding line segment according to the signal change amplitude and the change duration;

[0130] S915. Obtain coupling inductance, and obtain inductor voltage crosstalk according to the coupling inductance, signal change rate, and equivalent resistance, wherein the calculation formula is: Among them, C(R) represents the inductor voltage crosstalk, X(B) represents the signal change rate, O(G) represents the coupled inductor, and D(R) represents the equivalent resistance.

[0131] As described in the above steps S911-S915, the present invention obtains the diameter and length of the line segment through the line segment size characteristics, and obtains the cross-sectional area of ​​the line segment according to the line segment diameter, obtains the actual equivalent resistivity of the line segment, and obtains the equivalent resistance of the corresponding line segment according to the actual equivalent resistivity, the cross-sectional area of ​​the line segment and the length of the line segment, wherein the equivalent resistance refers to the value of a single resistance that can be regarded as a combination of multiple resistors (or other circuit elements) in a circuit. The calculation of the equivalent resistance can help understand the attenuation of the signal during the transmission process, thereby optimizing the size characteristics and spacing of multiple line segments to reduce the signal loss caused by resistance and ensure signal integrity. By reducing the equivalent resistance of the line segment, the power transmission efficiency can be improved and the energy loss in the signal transmission process can be reduced. By adjusting the reasonable line spacing, the signal loss caused by resistance can be effectively reduced to ensure the stable operation of the electronic device. By obtaining the signal change amplitude and change duration of the line segment, and based on The signal change rate of the corresponding line segment is obtained according to the signal change amplitude and change duration, where the signal change rate refers to the speed at which the signal changes over time, and is usually used to describe the degree of change of the signal waveform within a unit time. The inductor voltage crosstalk is obtained through the coupled inductor, signal change rate and equivalent resistance. In this way, through the combination of signal change rate and coupled inductor, the inductor coupling that interferes with the signal can be effectively identified, thereby providing a basis for adjusting the design. By evaluating the inductor voltage crosstalk, potential interference in signal transmission can be identified in time, and the impact of interference on signal integrity can be reduced. By monitoring the signal change rate and inductor crosstalk, signal distortion caused by insufficient line spacing can be discovered and resolved in time, thereby improving the quality and stability of the signal. By analyzing the signal change amplitude and change duration of the line segment and calculating the signal change rate, and combining the coupled inductor and equivalent resistance to calculate the inductor voltage crosstalk method, the consideration of the interference impact between multiple line segments in PCB design can be significantly improved.

[0132] The present application also provides a system for automatically adjusting line spacing in PCB design, comprising:

[0133] A first acquisition module is used to acquire first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information;

[0134] A first extraction module is used to obtain a target line segment group in the PCB board, and extract two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component;

[0135] A first determining module, configured to determine a first adjustment spacing according to each of the first adjustment line segments, pin characteristic information of a corresponding component, and electrical characteristic information;

[0136] The second acquisition module is used to acquire the two edgemost line segments of the target line segment group in the PCB board as two reference line segments;

[0137] A third acquisition module, used to acquire second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information;

[0138] A second determination module, configured to determine the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determine a second adjustment interval according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component;

[0139] A second extraction module, used for extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group;

[0140] A third determination module is used to obtain third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics;

[0141] The adjustment module is used to determine a third adjustment spacing according to the line segment size characteristics and the magnetic permeability characteristics, and to adjust the spacing of the line segments in the target line segment group based on the first adjustment spacing, the second adjustment spacing and the third adjustment spacing.

[0142] In one embodiment, the third determining module includes:

[0143] A first acquisition unit, configured to acquire line segment size characteristics and magnetic permeability characteristics of line segments in each intermediate line segment group according to the third characteristic information;

[0144] A second acquisition unit, configured to acquire a coupling inductance of a corresponding line segment according to the magnetic permeability characteristics, and acquire an inductor voltage crosstalk according to the coupling inductance and line segment size characteristics;

[0145] A third acquisition unit is used to acquire an initial spacing feature between two adjacent line segments in each intermediate line segment group, and acquire a coupling capacitance of a corresponding line segment according to the initial spacing feature and a line segment size feature;

[0146] A fourth acquisition unit, used to acquire a signal amplitude characteristic and a self-capacitance characteristic of each line segment;

[0147] A calculation unit is used to calculate the capacitor voltage crosstalk according to the signal amplitude characteristics, the self-capacitance characteristics and the coupling capacitance, wherein the calculation formula is:

[0148]

[0149] Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics;

[0150] The determination unit is used to obtain a comprehensive crosstalk degree according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and determine a third adjustment interval according to the comprehensive crosstalk degree and the line segment size characteristics.

[0151] The present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method for automatically adjusting line spacing in PCB design when executing the computer program.

[0152] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the method for automatically adjusting line spacing in PCB design are implemented.

[0153] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0154] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0155] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for automatically adjusting line spacing in PCB design, characterized in that: include: Acquire first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information; Obtain a target line segment group in the PCB board, and extract two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component; Determine a first adjustment distance according to each of the first adjustment line segments, pin characteristic information of the corresponding component, and electrical characteristic information; Obtain the two edgemost line segments of the target line segment group in the PCB board as two reference line segments; Acquire second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information; Determine the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determine the second adjustment spacing according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component; Extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group; Acquire third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics; A third adjustment spacing is determined according to the line segment size characteristics and the magnetic permeability characteristics, and spacings of line segments in the target line segment group are adjusted based on the first adjustment spacing, the second adjustment spacing, and the third adjustment spacing.

2. The method for automatically adjusting line spacing in PCB design according to claim 1, characterized in that: The step of extracting two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component includes: Acquire a first center coordinate of a component according to the first position feature information; Obtain the first starting point coordinates and the first end point coordinates of each line segment on the left side of the component in the target line segment group, and obtain the second center coordinates of the corresponding line segment according to each of the first starting point coordinates and the first end point coordinates; Obtain the second starting point coordinates and the second end point coordinates of each line segment on the right side of the component in the target line segment group, and obtain the third center coordinates of the corresponding line segment according to each of the second starting point coordinates and the second end point coordinates; Acquire a first straight-line distance between a corresponding line segment and a component according to the first center coordinate and each second center coordinate; Acquire a second straight-line distance between a corresponding line segment and a component according to the first center coordinate and each third center coordinate; A line segment corresponding to the smallest first straight-line distance and a line segment corresponding to the smallest second straight-line distance are selected as two first adjustment line segments of each component.

3. The method for automatically adjusting line spacing in PCB design according to claim 1, characterized in that: The step of determining the first adjustment spacing according to each of the first adjustment line segments, the pin characteristic information of the corresponding component, and the electrical characteristic information comprises: Acquire operating frequency characteristics and power level characteristics according to the electrical characteristic information; Obtaining a reference operating frequency of the component, and obtaining an impact factor according to the reference operating frequency; The frequency influence degree value is calculated according to the operating frequency characteristics, the reference operating frequency and the influence factor, wherein the calculation formula is: Among them, P(Y) represents the frequency influence value, G(P) represents the working frequency characteristics, J(P) represents the reference working frequency, and N represents the influence factor; Acquire third line width characteristic information of the first adjustment line segment; The first adjustment spacing is calculated according to the third line width characteristic information, the power level characteristic, the frequency influence degree value and the pin characteristic information, wherein the calculation formula is: T(Z1)=P(Y)*Y(J)*G(D)+X(K3); Among them, T(Z1) represents the first adjustment spacing, P(Y) represents the frequency influence value, Y(J) represents the pin characteristic information, G(D) represents the power level characteristic, and X(K3) represents the third line width characteristic information.

4. The method for automatically adjusting line spacing in PCB design according to claim 1, characterized in that: The step of determining the nearest component according to the second position characteristic information and the first characteristic information of the plurality of components comprises: Acquire the first midpoint position information of the corresponding reference line segment according to the second position feature information; Acquire second midpoint position information of corresponding components according to each of the first position feature information; Acquire the center distance between the corresponding component and the reference line segment according to the first midpoint position information and each second midpoint position information; Sorting the plurality of center distances in ascending order to obtain a distance sorting table; The component corresponding to the center spacing ranked first is selected from the spacing sorting table as the nearest component.

5. The method for automatically adjusting line spacing in PCB design according to claim 1, characterized in that: The step of determining the third adjustment spacing according to the line segment size characteristics and the magnetic permeability characteristics comprises: Acquire the coupled inductance of the corresponding line segment according to the magnetic permeability characteristics, and acquire the inductor voltage crosstalk according to the coupled inductance and line segment size characteristics; Acquire initial spacing features between two adjacent line segments in each intermediate line segment group, and acquire coupling capacitance of corresponding line segments according to the initial spacing features and line segment size features; Obtain the signal amplitude characteristics and self-capacitance characteristics of each line segment; The capacitance voltage crosstalk is calculated according to the signal amplitude characteristics, the self-capacitance characteristics and the coupling capacitance, wherein the calculation formula is: Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics; A comprehensive crosstalk degree is obtained according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and a third adjustment interval is determined according to the comprehensive crosstalk degree and line segment size characteristics.

6. The method for automatically adjusting line spacing in PCB design according to claim 5, characterized in that: The step of obtaining the inductor voltage crosstalk according to the coupled inductor and the line segment size characteristics comprises: Acquire the line segment diameter and line segment length according to the line segment size feature, and acquire the line segment cross-sectional area according to the line segment diameter; Get the actual equivalent resistivity of the line segment; Obtaining an equivalent resistance of a corresponding line segment according to the actual equivalent resistivity, the line segment cross-sectional area, and the line segment length; Obtaining a signal change amplitude and change duration of a line segment, and obtaining a signal change rate of a corresponding line segment according to the signal change amplitude and change duration; A coupled inductance is obtained, and an inductor voltage crosstalk is obtained according to the coupled inductance, a signal change rate, and an equivalent resistance.

7. A system for automatically adjusting line spacing in PCB design, characterized in that: include: A first acquisition module is used to acquire first characteristic information of each component in the PCB board, wherein the first characteristic information includes first position characteristic information, pin characteristic information and electrical characteristic information; A first extraction module is used to obtain a target line segment group in the PCB board, and extract two adjacent line segments from the target line segment group according to the first position feature information of each component as two first adjustment line segments of each component; A first determining module, configured to determine a first adjustment spacing according to each of the first adjustment line segments, pin characteristic information of a corresponding component, and electrical characteristic information; The second acquisition module is used to acquire the two edgemost line segments of the target line segment group in the PCB board as two reference line segments; A third acquisition module, used to acquire second characteristic information of each reference line segment, wherein the second characteristic information includes second position characteristic information and first line width characteristic information; A second determination module, configured to determine the nearest component according to the second position characteristic information and the first position characteristic information of the plurality of components, and determine a second adjustment interval according to the first line width characteristic information, the pin characteristic information and the electrical characteristic information of the nearest component; A second extraction module, used for extracting a line segment group within the first adjustment line segment of every two adjacent components from the target line segment group as an intermediate line segment group; A third determination module is used to obtain third characteristic information of each line segment in each intermediate line segment group, wherein the third characteristic information includes line segment size characteristics and magnetic permeability characteristics; The adjustment module is used to determine a third adjustment spacing according to the line segment size characteristics and the magnetic permeability characteristics, and to adjust the spacing of the line segments in the target line segment group based on the first adjustment spacing, the second adjustment spacing and the third adjustment spacing.

8. The system for automatically adjusting line spacing in PCB design according to claim 7, characterized in that: The third determining module comprises: A first acquisition unit, configured to acquire line segment size characteristics and magnetic permeability characteristics of line segments in each intermediate line segment group according to the third characteristic information; A second acquisition unit, configured to acquire a coupling inductance of a corresponding line segment according to the magnetic permeability characteristics, and acquire an inductor voltage crosstalk according to the coupling inductance and line segment size characteristics; A third acquisition unit is used to acquire an initial spacing feature between two adjacent line segments in each intermediate line segment group, and acquire a coupling capacitance of a corresponding line segment according to the initial spacing feature and a line segment size feature; A fourth acquisition unit, used to acquire a signal amplitude characteristic and a self-capacitance characteristic of each line segment; A calculation unit is used to calculate the capacitor voltage crosstalk according to the signal amplitude characteristics, the self-capacitance characteristics and the coupling capacitance, wherein the calculation formula is: Among them, Y(C) represents capacitor voltage crosstalk, O(R) represents coupling capacitance, Z(R) represents self-capacitance characteristics, and X(F) represents signal amplitude characteristics; The determination unit is used to obtain a comprehensive crosstalk degree according to the capacitor voltage crosstalk and the inductor voltage crosstalk, and determine a third adjustment interval according to the comprehensive crosstalk degree and a line segment size feature.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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