A gold plating process for the surface of incoming substrate in EBGA process

Abstract

The present invention discloses a gold plating treatment process for the surface of incoming substrate in an EBGA process, which belongs to the field of semiconductor packaging, including a cleaning treatment process for a copper substrate and a gold plating process for the cleaned copper substrate, wherein the cleaning treatment process for the copper substrate includes preparing a cleaning solution, wherein the cleaning solution includes component A and component B; component A includes the following components in parts by weight: 10-12 parts of N-hydroxyphthalimide p-toluenesulfonate, 24-25 parts of visible light alkali generator wrapped in a microcapsule shell, and 10-12 parts of anionic surfactant, wherein the spectral absorption range of the visible light alkali generator is 200-500nm; component B includes the following components in parts by weight: 10-12 parts of plant protein, composite protease, and TG enzyme, wherein the mass ratio of plant protein to composite enzyme is 1:3-3.2, and the amount of TG enzyme added is 0.3-0.4% of the mass of plant protein. A protective film is formed on the surface of the copper substrate after cleaning by the present invention, which has a good protective effect on the copper substrate.

Description

Technical Field

[0001] The invention belongs to the field of semiconductors and relates to a gold plating treatment process for the surface of incoming substrate materials in an EBGA process. Background Art

[0002] The substrate material in the EBGA process is a copper substrate. The surface treatment of the copper substrate is mainly surface cleaning and surface gold plating. The surface cleaning of the copper substrate is to remove oxides, copper ions, oil stains and other substances on the surface of the copper substrate, and improve the connection strength between the gold-plated layer and the copper substrate. At present, the surface cleaning process of the copper substrate mainly uses pickling liquid, detergent, acid neutralizing substance and other substances to independently distribute and clean the copper substrate. There are many cleaning process flows, and the existing pickling liquid, detergent, acid neutralizing substance and the like are easy to flow, especially the detergent, which has a short contact time with the copper substrate and has low cleaning efficiency. In addition, after the surface of the copper substrate is cleaned, the surface of the copper substrate loses the protective layer such as the oxide layer, and the copper substrate body is directly exposed to the environment, which is easy to cause damage. Summary of the invention

[0003] The purpose of the present invention is to provide a gold plating treatment process for the surface of incoming substrates in an EBGA process, which solves the problem that when cleaning a copper substrate in the current EBGA process, there are many cleaning processes, the cleaning effect is poor, and the copper substrate body after cleaning is directly exposed to the environment, which is easy to cause secondary pollution or damage.

[0004] The technical solution adopted by the present invention is as follows:

[0005] A gold plating treatment process for the surface of an incoming substrate in an EBGA process includes a cleaning treatment process for a copper substrate and a gold plating process for the cleaned copper substrate. The cleaning treatment process for the copper substrate includes the following steps:

[0006] S1, preparing a cleaning solution, wherein the cleaning solution comprises component A and component B;

[0007] The component A comprises the following components in parts by weight: 10-12 parts of N-hydroxyphthalimide p-toluenesulfonate, 24-25 parts of a visible light base generator wrapped in a microcapsule shell, and 10-12 parts of an anionic surfactant, wherein the spectral absorption range of the visible light base generator is 200-500nm, the microcapsule shell is an anti-ultraviolet microcapsule shell, and the microcapsule shell is broken under acidic conditions and releases the visible light base generator inside;

[0008] The component B comprises the following components in parts by weight: 10-12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of plant protein to composite enzyme is 1:3-3.2, and the amount of TG enzyme added is 0.3-0.4% of the mass of plant protein;

[0009] S2, the N-hydroxyphthalimide toluenesulfonate in component A, the visible light alkali generator wrapped in the microcapsule shell, and the anionic surfactant are mixed in deionized water, and the first cleaning solution is obtained by mixing evenly, and then the copper substrate is placed in the first cleaning solution, and ultrasonic cleaning is performed under 248nm ultraviolet light for 20 minutes, and then, 450nm LED light is used to replace the 248nm ultraviolet light, and ultrasonic cleaning is continued under 450nm LED light for 30-35 minutes, and then the copper substrate is taken out, and after the copper substrate is taken out, the first cleaning solution is allowed to stand for 10 minutes and then filtered to obtain a filtrate, and the pH value of the filtrate is 7-8;

[0010] S3. Add the plant protein in component B to the filtrate, stir evenly, and then heat to 50°C. Add the composite protease solution and Tris-HCl buffer at 50°C. Perform enzymolysis for 2-3 hours at a stirring speed of 200-300 rpm to obtain a second cleaning solution. Then put the copper substrate after the first cleaning into the second cleaning solution. Perform ultrasonic cleaning for 15 minutes without ultraviolet light. Then cool the second cleaning solution to 37°C and add TG enzyme. Continue ultrasonic cleaning for 30 minutes and then take out the copper substrate. After the copper substrate is dried, a protective film is formed on the surface, and the cleaning process of the copper substrate is completed.

[0011] In the present invention, N-hydroxyphthalimide p-toluenesulfonate in component A is a photoacid generator, which can generate acid under 248nm ultraviolet light to achieve pickling of the copper substrate; the visible light base generator wrapped in the microcapsule shell in component A gradually breaks in the acid, releasing the visible light base generator inside, and the visible light base generator will produce a small amount of alkali under 248nm ultraviolet light, which will neutralize part of the acid, but the whole reaction system is still acidic, and the copper substrate is pickled. During the pickling process, as the amount of acid generated by the photolysis of N-hydroxyphthalimide p-toluenesulfonate increases, the degree of rupture of the microcapsule shell in the acid will increase accordingly. When the microcapsule shells are broken in large numbers, a large amount of visible light alkali generator will be released. Then, 450nm LED light is used to replace 248nm ultraviolet light. Under the 450nm LED light, the remaining N-hydroxyphthalimide toluenesulfonate will not continue to produce acid, and the visible light alkali generator will produce a large amount of alkali, which can neutralize the acid produced by N-hydroxyphthalimide toluenesulfonate and avoid excessive pickling of the copper substrate. After the alkali produced by the light alkali generator neutralizes the acid produced by N-hydroxyphthalimide toluenesulfonate, the pH value of the whole system is adjusted to 7-8, and the composite obtained by filtration has a certain viscosity and has a thickening effect.

[0012] The main components of component B in the present invention are plant protein, composite protease, and TG enzyme. Plant protein can obtain amino acids under the action of composite protease. Amino acids form coordination bonds with copper ions on the surface of the copper substrate to obtain copper ion chelates, which can further remove copper ions on the surface of the copper substrate. However, the amino acid solution is easy to flow and cannot fully contact the copper substrate. Therefore, the present invention uses the filtrate after component A washes the copper substrate as a thickener for component B, which can increase the viscosity of the enzymatic hydrolyzate of component B, so that the enzymatic hydrolyzate of component B can fully contact the copper substrate and further remove the copper ions on the surface of the copper substrate; in addition, the enzymatic hydrolyzate of component B can undergo a cross-linking reaction under the action of TG enzyme, and can form a network structure with a larger molecular weight, and the bonding force and adhesion can be significantly improved. After being attached to the copper substrate, under the action of the cross-linking agent, a protective film with a stable structure can be formed, which can not only prevent the copper substrate from being damaged (scratched or corroded) after washing, but also can keep the copper substrate surface from generating oxides again before the copper substrate is gold-plated.

[0013] Furthermore, the visible light base generator encapsulated by the microcapsule shell in the component A is prepared by the following method:

[0014] S1.1. Dissolve chitosan in a 1% glacial acetic acid solution at 65°C for 5 hours, then let stand for 24 hours, and adjust the pH to 5.0 to obtain a 2.5% chitosan solution; add gelatin to deionized water, heat to 65°C and stir until completely dissolved, and adjust the pH to 6.0 to obtain an 8% gelatin solution; add sodium alginate to deionized water, heat to 60°C and stir until completely dissolved, and adjust the pH to 7.5 to obtain a 0.5% sodium alginate solution;

[0015] S1.2, adding a visible light alkali generator to a gelatin solution at 40°C and stirring evenly to obtain a visible light alkali generator-gelatin dispersion, then adding a sodium alginate solution to the visible light alkali generator-gelatin dispersion and mixing evenly, adjusting the pH to 5.0, and obtaining a first reaction system, wherein the mass ratio of the visible light alkali generator to gelatin is 3.5:1, and the mass ratio of sodium alginate to gelatin is 1:3;

[0016] S1.3, slowly dripping the first reaction system into a calcium chloride solution at room temperature, standing to solidify, filtering and drying to obtain the first microcapsule;

[0017] S1.3, adding the first microcapsule to a 0.5% calcium chloride solution, stirring at a stirring speed of 50 rpm for 5 minutes, adding the chitosan solution, reacting for 2 hours, filtering and drying to obtain the second microcapsule, wherein the mass ratio of chitosan to sodium alginate is 2.5:1;

[0018] S1.4, obtain coconut bran, sieve the coconut bran through 100 mesh to obtain coconut bran powder, soak the coconut bran in 0.1 mol / L sodium hydroxide solution, filter after soaking for 1 hour, wash with clean water, and dry to obtain pretreated coconut bran powder for later use; take gelatin, add gelatin to deionized water, heat to 65°C and stir until completely dissolved, adjust the pH to 6.0 to obtain a gelatin solution with a mass fraction of 5%; at 50°C, pour activated carbon, APTMS-modified silica microspheres, titanium dioxide, and coconut bran powder into the gelatin solution, mix well to obtain a first gelatin solution; at 35°C-40°C, add aloin and mycosporin-like amino acids to the first gelatin solution and stir well to obtain a second gelatin solution; add the second microcapsules obtained in step S1.3 to the second gelatin solution, stir well, and then add 0.3 wt% sodium citrate solution, the mass of sodium citrate is 1% of the total mass of the second microcapsules in the second gelatin solution, after being stirred evenly, reacting for 2-3 hours, filtering and drying to obtain the final product, which is the visible light alkali generator wrapped in the anti-ultraviolet microcapsule shell.

[0019] The invention uses gelatin, chitosan and sodium alginate as main components of the microcapsule shell. Gelatin and chitosan are easily dissolved in an acidic solution, so that the microcapsule shell can release an internal photobase generator in the acid generation of N-hydroxyphthalimide toluenesulfonate. Sodium alginate has good viscosity and significant thickening effect. Sodium alginate can adsorb copper ions and can form a complex with copper ions to form an insoluble copper alginate precipitate, which can effectively remove copper ions. The chelate of chitosan and copper ions will precipitate under the condition of anionic surfactant and alkali. Chitosan can not only adsorb copper ions, but also precipitate the chelate when the pH of the reaction system is adjusted and under the condition of anionic surfactant, so as to effectively remove copper ions.

[0020] In the present invention, gelatin and sodium alginate form the first layer of microcapsule shell, chitosan is used to wrap the first layer of microcapsule shell to form the second layer of shell, and the light-resistant layer is wrapped outside the chitosan. The microcapsule shell of the present invention has a three-layer structure, forming a microcapsule shell with a relatively stable structure, which can protect the internal components from interference from the external environment, and the structure of the microcapsule shell is not easy to break during transportation, storage, etc. The outermost layer of the microcapsule shell in the present invention is the light-resistant layer, which can resist ultraviolet light and has light-shielding properties for visible light, and can prevent the occurrence of premature photolysis of the visible light alkali generator due to light.

[0021] The anti-light layer uses gelatin as the main shell-forming material, coconut bran as the visible light shading agent, aloin, mycosporin-like amino acids, and titanium dioxide as anti-ultraviolet agents, and activated carbon and APTMS-modified silica microspheres are mainly used to adsorb aloin and mycosporin-like amino acids in gelatin to enhance the adsorption of gelatin to aloin and mycosporin-like amino acids. In the present invention, gelatin is the main shell-forming material and will dissolve in acid. Therefore, the anti-light layer in the present invention will not hinder the dissolution of the microcapsule shell in acid.

[0022] The invention prepares a microcapsule shell which can be broken in acid, has the functions of resisting ultraviolet light, shielding visible light and having a stable structure.

[0023] Furthermore, in the first gelatin solution of step S1.4, the mass ratio of activated carbon, APTMS-modified silica microspheres, titanium dioxide, coconut bran powder, and gelatin is 0.8:1.5:2:3:5;

[0024] The amount of aloin added to the second gelatin solution in step S1.4 is 3% of the mass of gelatin in the first gelatin solution, and the amount of mycosporin-like amino acids added is 5% of the mass of gelatin in the first gelatin solution.

[0025] Furthermore, the composite protease in component B includes papain, neutral protease and gelatinase, and the mass ratio of papain, neutral protease and gelatinase is 2:1:1.

[0026] Further, the component A comprises the following components in parts by weight: 10 parts of N-hydroxyphthalimide p-toluenesulfonate, 24 parts of a visible light base generator wrapped in a microcapsule shell, and 12 parts of an anionic surfactant;

[0027] The component B comprises the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of the plant protein to the composite enzyme is 1:3.2, and the added amount of TG enzyme is 0.4% of the mass of the plant protein.

[0028] Furthermore, the visible light base generator is obtained by dispersing N-(4-formylphenyl)-N-methylglycine methyl ester and cycloalkyl ketone through an aldehyde-ketone condensation reaction with an organic base. The specific preparation method is: dissolving N-(4-formylphenyl)-N-methylglycine methyl ester and 3-methylcyclopentanone in tetrahydrofuran, and obtaining a precipitate a through an aldehyde-ketone condensation reaction; wherein the molar ratio of the N-(4-formylphenyl)-N-methylglycine methyl ester to 3-methylcyclopentanone is 1:1; dispersing the above precipitate a and 1,8-diazabicyclo (5.4.0) undec-7-ene in N,N-dimethylformamide for reaction, removing the solvent, and obtaining a visible light base generator; the molar ratio of the precipitate a to the organic base is 1:2.

[0029] Furthermore, the anionic surfactant comprises sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 2-3:1.

[0030] Furthermore, the mass ratio of sodium dodecylbenzene sulfonate to anionic polyacrylamide is 3:1.

[0031] Furthermore, the plant protein includes soy protein, flax protein and chia seed protein, and the mass ratio of the soy protein, flax protein and chia seed protein is 1:1:2.

[0032] The present invention preferably uses plant protein rich in amino acid species, which can undergo multiple reactions with copper ions and has high removal efficiency for copper ions.

[0033] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0034] 1. The present invention discloses a gold plating treatment process for the surface of a substrate in an EBGA process. Component A can be used to perform acid washing and alkali washing on the surface of a copper substrate to remove oil stains and copper ions on the surface of the copper substrate. After cleaning with component A, component B is used to perform secondary cleaning on the copper substrate and form a film. While improving the cleaning efficiency of the copper substrate, the cleaned copper substrate is protected.

[0035] 2. Component B in the present invention uses plant protein as the main component, and utilizes enzymatic hydrolysis and enzyme-catalyzed cross-linking to obtain an enzymatic hydrolyzate that can further remove copper ions on the surface of the copper substrate and form a protective film with a relatively stable structure on the surface of the copper substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative work, among which:

[0037] Figure 1 It is the SEM image of the visible light alkali generator encapsulated by the UV-resistant microcapsule shell;

[0038] Figure 2 This is a surface SEM image of the copper substrate of Example 7 after cleaning. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention, that is, the embodiments described are only part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0041] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0042] The features and performance of the present invention are further described in detail below in conjunction with the embodiments.

[0043] Example 1

[0044] A preferred embodiment of the present invention provides a gold plating process for the surface of a substrate in an EBGA process, comprising a cleaning process for a copper substrate and a gold plating process for the cleaned copper substrate, wherein the cleaning process for the copper substrate comprises the following steps:

[0045] S1, preparing a cleaning solution, wherein the cleaning solution comprises component A and component B;

[0046] The component A comprises the following components in parts by weight: 10 parts of N-hydroxyphthalimide p-toluenesulfonate, 24 parts of a visible light base generator wrapped in a microcapsule shell, and 10 parts of an anionic surfactant, wherein the spectral absorption range of the visible light base generator is 200-500nm, the microcapsule shell is an anti-ultraviolet microcapsule shell, the microcapsule shell ruptures under acidic conditions and releases the visible light base generator inside, and the anionic surfactant comprises sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 2:1;

[0047] The component B comprises the following components in parts by weight: 10 parts of plant protein, composite protease, and TG enzyme, the mass ratio of plant protein to composite enzyme is 1:3, and the amount of TG enzyme added is 0.3% of the mass of plant protein;

[0048] S2, the N-hydroxyphthalimide toluenesulfonate in component A, the visible light alkali generator wrapped in the microcapsule shell, and the anionic surfactant are mixed in deionized water, and the first cleaning solution is obtained by mixing evenly, and then the copper substrate is placed in the first cleaning solution, and ultrasonic cleaning is performed under 248nm ultraviolet light for 20 minutes, and then, 450nm LED light is used to replace the 248nm ultraviolet light, and the copper substrate is taken out after ultrasonic cleaning for 30 minutes under 450nm LED light. After the copper substrate is taken out, the first cleaning solution is allowed to stand for 10 minutes and then filtered to obtain a filtrate, and the pH value of the filtrate is 7;

[0049] S3. Add the plant protein in component B to the filtrate, stir evenly, and then heat to 50°C. Add the composite protease solution and Tris-HCl buffer at 50°C. Perform enzymatic hydrolysis at a stirring speed of 300 rpm for 2 hours to obtain a second cleaning solution. Then put the copper substrate after the first cleaning into the second cleaning solution, perform ultrasonic cleaning for 15 minutes without ultraviolet light, then cool the second cleaning solution to 37°C and add TG enzyme. Continue ultrasonic cleaning for 30 minutes, then take out the copper substrate. After the copper substrate is dried, a protective film is formed on the surface, and the cleaning process of the copper substrate is completed.

[0050] The visible light alkali generator wrapped in the microcapsule shell in the component A is prepared by the following method:

[0051] S1.1. Dissolve chitosan in a 1% glacial acetic acid solution at 65°C for 5 hours, then let stand for 24 hours, and adjust the pH to 5.0 to obtain a 2.5% chitosan solution; add gelatin to deionized water, heat to 65°C and stir until completely dissolved, and adjust the pH to 6.0 to obtain an 8% gelatin solution; add sodium alginate to deionized water, heat to 60°C and stir until completely dissolved, and adjust the pH to 7.5 to obtain a 0.5% sodium alginate solution;

[0052] S1.2, adding a visible light alkali generator to a gelatin solution at 40°C and stirring evenly to obtain a visible light alkali generator-gelatin dispersion, then adding a sodium alginate solution to the visible light alkali generator-gelatin dispersion and mixing evenly, adjusting the pH to 5.0, and obtaining a first reaction system, wherein the mass ratio of the visible light alkali generator to gelatin is 3.5:1, and the mass ratio of sodium alginate to gelatin is 1:3;

[0053] S1.3, slowly dripping the first reaction system into a calcium chloride solution at room temperature, standing to solidify, filtering and drying to obtain the first microcapsule;

[0054] S1.3, adding the first microcapsule to a 0.5% calcium chloride solution, stirring at a stirring speed of 50 rpm for 5 minutes, adding the chitosan solution, reacting for 2 hours, filtering and drying to obtain the second microcapsule, wherein the mass ratio of chitosan to sodium alginate is 2.5:1;

[0055] S1.4, obtain coconut bran, sieve the coconut bran through 100 mesh to obtain coconut bran powder, soak the coconut bran in 0.1 mol / L sodium hydroxide solution, filter after soaking for 1 hour, wash with clean water, and dry to obtain pretreated coconut bran powder for later use; take gelatin, add gelatin to deionized water, heat to 65°C and stir until completely dissolved, adjust the pH to 6.0 to obtain a gelatin solution with a mass fraction of 5%; at 50°C, pour activated carbon, APTMS-modified silica microspheres, titanium dioxide, and coconut bran powder into the gelatin solution, mix well to obtain a first gelatin solution; at 35°C-40°C, add aloin and mycosporin-like amino acids to the first gelatin solution and stir well to obtain a second gelatin solution; add the second microcapsules obtained in step S1.3 to the second gelatin solution, stir well, and then add 0.3 wt% sodium citrate solution, the mass of sodium citrate is 1% of the total mass of the second microcapsule in the second gelatin solution, after being stirred evenly, reacting for 2-3 hours, filtering and drying to obtain the final product, which is the visible light alkali generator wrapped in the anti-ultraviolet microcapsule shell. The microscopic picture of the visible light alkali generator wrapped in the anti-ultraviolet microcapsule shell is as follows Figure 1 As shown;

[0056] The mass ratio of activated carbon, APTMS-modified silica microspheres, titanium dioxide, coconut bran powder, and gelatin in the first gelatin solution of step S1.4 is 0.8:1.5:2:3:5;

[0057] The amount of aloin added to the second gelatin solution in step S1.4 is 3% of the mass of gelatin in the first gelatin solution, and the amount of mycosporin-like amino acids added is 5% of the mass of gelatin in the first gelatin solution.

[0058] The composite protease in the component B comprises papain, neutral protease and gelatinase, and the mass ratio of papain, neutral protease and gelatinase is 2:1:1.

[0059] The plant protein includes soy protein, flax protein and chia seed protein, and the mass ratio of the soy protein, flax protein and chia seed protein is 1:1:2.

[0060] The visible light base generator is obtained by dispersing N-(4-formylphenyl)-N-methylglycine methyl ester and cycloalkyl ketone with an organic base after an aldehyde-ketone condensation reaction. The specific preparation method is: N-(4-formylphenyl)-N-methylglycine methyl ester and 3-methylcyclopentanone are dissolved in tetrahydrofuran, and a precipitate a is obtained by an aldehyde-ketone condensation reaction; wherein the molar ratio of the N-(4-formylphenyl)-N-methylglycine methyl ester to the 3-methylcyclopentanone is 1:1; the above precipitate a and 1,8-diazabicyclo (5.4.0) undec-7-ene are dispersed in N,N-dimethylformamide for reaction, and the solvent is removed to obtain a visible light base generator; the molar ratio of the precipitate a to the organic base is 1:2.

[0061] Example 2

[0062] This embodiment is based on the embodiment 1, and is different from the embodiment 1 in that: the component A comprises the following components in parts by weight: 10 parts of N-hydroxyphthalimide p-toluenesulfonate, 24 parts of a visible light base generator wrapped in a microcapsule shell, and 12 parts of an anionic surfactant;

[0063] The component B comprises the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of the plant protein to the composite enzyme is 1:3.2, and the added amount of TG enzyme is 0.4% of the mass of the plant protein.

[0064] Example 3

[0065] This embodiment is based on the embodiment 1, and is different from the embodiment 1 in that: the component A comprises the following components in parts by weight: 12 parts of N-hydroxyphthalimide p-toluenesulfonate, 25 parts of a visible light base generator wrapped in a microcapsule shell, and 12 parts of an anionic surfactant;

[0066] The component B comprises the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of the plant protein to the composite enzyme is 1:3.2, and the added amount of TG enzyme is 0.4% of the mass of the plant protein.

[0067] Example 4

[0068] This embodiment is based on the embodiment 1, and is different from the embodiment 1 in that: the component A comprises the following components in parts by weight: 11 parts of N-hydroxyphthalimide p-toluenesulfonate, 24.5 parts of a visible light base generator wrapped in a microcapsule shell, and 11 parts of an anionic surfactant, wherein the spectral absorption range of the visible light base generator is 200-500nm, the microcapsule shell is an anti-ultraviolet microcapsule shell, and the microcapsule shell is broken under acidic conditions and releases the visible light base generator inside;

[0069] The component B comprises the following components in parts by weight: 11 parts of plant protein, composite protease, and TG enzyme, the mass ratio of the plant protein to the composite enzyme is 1:3.1, and the added amount of TG enzyme is 0.35% of the mass of the plant protein.

[0070] Example 5

[0071] This embodiment is based on the embodiment 2, but is different from the embodiment 2 in that the anionic surfactant comprises sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 3:1.

[0072] Example 6

[0073] This embodiment is based on Example 5, but differs from Example 5 in that: S3, the plant protein in component B is added to the filtrate, stirred evenly, and then heated to 50°C, a composite protease solution and Tris-HCl buffer are added at 50°C, and a second cleaning solution is obtained after enzymolysis at a stirring speed of 200 rpm for 3 hours, and then the copper substrate after the first cleaning is placed in the second cleaning solution, and after ultrasonic cleaning for 15 minutes without ultraviolet light, the second cleaning solution is cooled to 37°C and TG enzyme is added, and ultrasonic cleaning is continued for 30 minutes, and then the copper substrate is taken out, and a protective film is formed on the surface of the copper substrate after drying, thereby completing the cleaning process of the copper substrate.

[0074] Example 7

[0075] This embodiment is based on Example 5, but differs from Example 5 in that: S2, the N-hydroxyphthalimide p-toluenesulfonate in component A, the visible light alkali generator wrapped in the microcapsule shell, and the anionic surfactant are mixed in deionized water, and the mixture is evenly mixed to obtain a first cleaning solution, and then the copper substrate is placed in the first cleaning solution, and ultrasonically cleaned for 20 minutes under 248nm ultraviolet light, and then, 450nm LED light is used to replace the 248nm ultraviolet light, and ultrasonic cleaning is continued for 35 minutes under 450nm LED light, and then the copper substrate is taken out. After the copper substrate is taken out, the first cleaning solution is allowed to stand for 10 minutes and then filtered to obtain a filtrate, and the pH value of the filtrate is 8.

[0076] The surface SEM image of the copper substrate after cleaning and drying is as follows: Figure 2As shown, it can be seen that the surface of the copper substrate after cleaning is smooth, without obvious unevenness or obvious contaminants.

[0077] Comparative Example 1

[0078] Based on Example 7, different from Example 7, the anionic surfactant includes sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 1:1.

[0079] Comparative Example 2

[0080] Based on Example 7, different from Example 7, the anionic surfactant includes sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 4:1.

[0081] Comparative Example 3

[0082] Based on Example 7, different from Example 7, the anionic surfactant does not include anionic polyacrylamide.

[0083] Comparative Example 4

[0084] Based on Example 7, different from Example 7, the anionic surfactant does not include sodium dodecylbenzene sulfonate.

[0085] Comparative Example 5

[0086] Based on Example 7, different from Example 7, the component B includes the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of plant protein to composite enzyme is 1:3.3, and the added amount of TG enzyme is 0.5% of the mass of plant protein.

[0087] Comparative Example 6

[0088] Based on Example 7, different from Example 7, the component B includes the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of plant protein to composite enzyme is 1:2.9, and the added amount of TG enzyme is 0.2% of the mass of plant protein.

[0089] Comparative Example 7

[0090] Based on Example 7, different from Example 7, the component B does not include TG enzyme.

[0091] Comparative Example 8

[0092] Based on Example 7, the difference from Example 7 is that the preparation method of the visible light alkali generator wrapped in the microcapsule shell in component A does not include S1.2, and chitosan is not used for double wrapping, and it is prepared by the following method:

[0093] Add gelatin to deionized water, heat to 65°C and stir until completely dissolved, adjust the pH to 6.0 to obtain a gelatin solution with a mass fraction of 8%; add sodium alginate to deionized water, heat to 60°C and stir until completely dissolved, adjust the pH to 7.5 to obtain a sodium alginate solution with a mass fraction of 0.5%;

[0094] Adding a visible light base generator to a gelatin solution at 40°C and stirring evenly to obtain a visible light base generator-gelatin dispersion, then adding a sodium alginate solution to the visible light base generator-gelatin dispersion and mixing evenly, adjusting the pH to 5.0 to obtain a first reaction system, wherein the mass ratio of the visible light base generator to gelatin is 3.5:1, and the mass ratio of sodium alginate to gelatin is 1:3;

[0095] At room temperature, slowly dripping the first reaction system into a calcium chloride solution, standing to solidify, filtering and drying to obtain a first microcapsule;

[0096] Obtain coconut bran, sieve the coconut bran through 100 mesh to obtain coconut bran powder, soak the coconut bran in 0.1 mol / L sodium hydroxide solution, filter after soaking for 1 hour, wash with clean water, and dry to obtain pretreated coconut bran powder for later use; separately obtain gelatin, add the gelatin into deionized water, heat to 65°C and stir until completely dissolved, adjust the pH to 6.0 to obtain a gelatin solution with a mass fraction of 5%; at 50°C, pour activated carbon, APTMS-modified silica microspheres, titanium dioxide, and coconut bran powder into the gelatin solution, mix well to obtain a first gelatin solution; at 35°C-40°C, add aloin and mycosporin-like amino acids into the first gelatin solution and stir well to obtain a second gelatin solution; add the first microcapsule into the second gelatin solution, stir well, and then add 0.3% tantalum acetate at a concentration of 1.5; wt% sodium citrate solution, the mass of sodium citrate is 1% of the total mass of the second microcapsules in the second gelatin solution, after being stirred evenly, reacting for 2-3 hours, filtering and drying to obtain the final product, which is the visible light alkali generator wrapped in the anti-ultraviolet microcapsule shell;

[0097] The mass ratio of activated carbon, APTMS-modified silica microspheres, titanium dioxide, coconut bran powder, and gelatin in the first gelatin solution was 0.8:1.5:2:3:5;

[0098] The amount of aloin added to the second gelatin solution is 3% of the mass of gelatin in the first gelatin solution, and the amount of mycosporin-like amino acids added is 5% of the mass of gelatin in the first gelatin solution.

[0099] Comparative Example 9

[0100] Based on Example 7, different from Example 7, sodium alginate is not added in the preparation method of the visible light alkali generator wrapped by the microcapsule shell in component A.

[0101] Comparative Example 10

[0102] Based on Example 7, different from Example 7, the preparation method of the visible light base generator wrapped in the microcapsule shell in component A does not use step S1.4 for the third shell wrapping, and the visible light base generator wrapped in the microcapsule shell in component A is the second microcapsule.

[0103] Comparative Example 11

[0104] Based on Example 7, different from Example 7, in the preparation method of the visible light alkali generator wrapped in the microcapsule shell in Component A, no activated carbon and APTMS-modified silica microspheres are added in S1.4.

[0105] Comparative Example 12

[0106] Based on Example 7, different from Example 7, in the preparation method of the visible light alkali generator wrapped by the microcapsule shell in component A, no activated carbon is added in S1.4.

[0107] Comparative Example 13

[0108] Based on Example 7, different from Example 7, in the preparation method of the visible light base generator wrapped in the microcapsule shell in Component A, no APTMS-modified silica microspheres are added in S1.4.

[0109] Comparative Example 14

[0110] Based on Example 7, different from Example 7, in the preparation method of the visible light alkali generator wrapped by the microcapsule shell in Component A, no aloin is added in S1.4.

[0111] Comparative Example 15

[0112] Based on Example 7, different from Example 7, in the preparation method of the visible light alkali generator wrapped in the microcapsule shell in Component A, no mycosporin-like amino acid is added in S1.4.

[0113] Comparative Example 16

[0114] Based on Example 7, different from Example 7, in the preparation method of the visible light alkali generator wrapped by microcapsule shell in the component A, coconut bran powder is not added in S1.4. Without the addition of coconut bran powder, the visible light alkali generator wrapped by microcapsule shell is easily affected by visible light during transportation or storage.

[0115] Comparative Example 17

[0116] Based on Example 7, different from Example 7, a visible light alkali generator without microcapsule shell coating is directly added to Component A, and no microcapsule shell needs to be prepared. A visible light alkali generator without microcapsule shell coating will also generate alkali under ultraviolet light to neutralize acid, and fail to achieve a good pickling effect.

[0117] Comparative Example 18

[0118] Based on Example 7, different from Example 7, the cleaning solution described in this comparative example only includes component A; N-hydroxyphthalimide p-toluenesulfonate, visible light alkali generator wrapped in microcapsule shell, and anionic surfactant in component A are mixed in deionized water, and the first cleaning solution is obtained by mixing evenly, and then the copper substrate is placed in the first cleaning solution, and ultrasonic cleaning is performed for 20 minutes under 248nm ultraviolet light, and then 450nm LED light is used to replace 248nm ultraviolet light, and ultrasonic cleaning is continued for 30-35 minutes under 450nm LED light irradiation, and then the copper substrate is taken out, and the copper substrate is dried after being taken out to complete the cleaning of the copper substrate. Without a protective film, it is easy to be secondary polluted or even scratched during gold plating, transportation or storage, resulting in uneven distribution of the gold plating layer.

[0119] Comparative Example 19

[0120] Based on Example 7, different from Example 7, component A of this comparative example does not include a visible light base generator wrapped in a microcapsule shell.

[0121] Test Example 1

[0122] The copper substrate with obvious oil stains and rust on the surface was used as the cleaning object, and the surface conditions of the copper substrates after cleaning in Examples 1-7 and Comparative Examples 1-18 were detected. The cleaned copper substrates were gold-plated, and the surface conditions of the gold-plated layer after gold plating were detected; the results are shown in Table 1.

[0123] The gold plating method is: put the treated copper plate into the chemical nickel plating solution, heat it to an appropriate temperature, keep it for a period of time, form a layer of nickel base, and directly perform chemical gold plating on the nickel base. Put the treated copper plate into the Q / YS.805 chemical gold plating solution, heat the liquid to about 85 degrees, keep it for 5 minutes, and complete the gold plating process. After the gold plating is completed, the copper plate is fished out and cleaned with water, and then dried in time. This gold plating method is a prior art. After the gold plating, the color and uniformity of the copper substrate after gold plating are observed by observation. The appearance of the gold plating is usually yellow or light yellow, and the color depth is evenly distributed.

[0124] Surface condition of the copper substrate: Use an optical microscope to observe whether there are pits, rust, oil, cracks, scratches on the surface of the copper substrate. At the same time, judge whether there is grease by touch. A clean surface should have no grease, dirt or other impurities remaining, and no fingerprints or stains will be left when touched.

[0125] Table 1 Surface condition of copper substrate and gold-plated layer test results

[0126] Surface condition of copper substrate Color of gold-plated layer on copper substrate Uniformity of gold plating layer on copper substrate Example 1 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 2 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 3 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 4 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 5 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 6 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Example 7 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Comparative Example 1 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Comparative Example 2 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Comparative Example 3 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Comparative Example 4 No pits, no rust, no oil stains, no cracks, no scratches, no grease yellow Uneven Comparative Example 5 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uneven Comparative Example 6 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uneven Comparative Example 7 No pits, no rust, no oil stains, no cracks, no scratches and no grease yellow Uneven Comparative Example 8 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 9 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uneven Comparative Example 10 No pits, rust, oil spots, cracks, scratches, or grease yellow Uneven Comparative Example 11 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 12 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 13 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 14 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 15 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 16 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uniform Comparative Example 17 No pits, rust, oil, cracks, scratches or grease yellow Uneven Comparative Example 18 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uneven Comparative Example 19 No pits, no rust, no oil, no cracks, no scratches and no grease yellow Uneven

[0127] In the present invention, the microcapsule shell of the visible light alkali generator wrapped in the microcapsule shell does not have an anti-ultraviolet effect without a third layer of wrapping. The photoalkali generator will quickly produce alkali under ultraviolet light to neutralize the acid produced in the photoacid generator, and an effective pickling effect cannot be achieved. There will still be some oil stains and rust on the surface of the copper substrate, affecting the gold plating effect. The present invention releases the photoalkali generator slowly as the microcapsule shell is cracked, and the acid will not be quickly neutralized in the early stage of acid production, providing sufficient pickling degree and having a good pickling effect; after a certain period of pickling, the cracking degree of the microcapsule shell increases, releasing a large amount of photoalkali generator, which can continuously improve the pH of the entire reaction system and avoid excessive pickling. If the photoalkali generator is not added to component A in the present invention, excessive pickling will occur, and some pits will appear on the surface of the copper substrate, resulting in uneven distribution of the gold plating layer.

[0128] Test Example 2

[0129] The surface wear resistance and corrosion resistance of the copper substrates after cleaning in Examples 1-7 and Comparative Examples 1-19 were tested, and the test results are shown in Table 2.

[0130] The surface wear resistance testing method is as follows: using a UMT-2 multifunctional friction and wear testing machine, the test load is 10N, the friction form is reciprocating wear, the wear scar length is 8mm, the frequency is 3Hz, the wear time is 1h, and the wear rate before and after wear is measured, the wear rate = (weight of the copper substrate after wear - weight of the copper substrate before wear) / weight of the copper substrate before wear × 100%; the blank control group is the copper substrate before cleaning.

[0131] Corrosion resistance: salt spray test method was adopted to prepare a sodium chloride salt solution with a mass fraction of 5%, and the prepared salt solution was added into the liquid storage tank of the salt spray test machine. The salt spray test machine was started to start spraying, and the cleaned copper substrate was placed in the salt spray. The test temperature of the salt spray test machine was set to 35°C, the spray pressure was 137.3kPa (1.4kgf / cm²), and the spraying time was 24 hours and 48 hours. After 24 hours and 48 hours, the corrosion condition of the copper substrate surface was observed to see if there were any corrosion spots.

[0132] Table 2 Surface wear resistance and corrosion resistance test results of copper substrate

[0133] Wear rate 24-hour salt spray test 48 hours salt spray test Example 1 0.0013-0.0014% No corrosion No corrosion Example 2 0.0011-0.0012% No corrosion No corrosion Example 3 0.0011-0.0012% No corrosion No corrosion Example 4 0.0012-0.0013% No corrosion No corrosion Example 5 0.0011-0.0012% No corrosion No corrosion Example 6 0.0012-0.0013% No corrosion No corrosion Example 7 <0.001% No corrosion No corrosion Comparative Example 1 >0.0015% No corrosion Corrosion spots appear Comparative Example 2 0.0013-0.0014% No corrosion No corrosion Comparative Example 3 >0.0015% No corrosion No corrosion Comparative Example 4 >0.0015% No corrosion Corrosion spots appear Comparative Example 5 0.0011-0.0012% No corrosion Corrosion spots appear Comparative Example 6 >0.0015% No corrosion Corrosion spots appear Comparative Example 7 >0.0015% Corrosion spots appear Corrosion spots appear Comparative Example 8 >0.0015% No corrosion Corrosion spots appear Comparative Example 9 >0.0015% No corrosion Corrosion spots appear Comparative Example 10 >0.0018% Corrosion spots appear Corrosion spots appear Comparative Example 11 >0.0015% No corrosion Corrosion spots appear Comparative Example 12 >0.0015% No corrosion No corrosion Comparative Example 13 >0.0015% No corrosion Corrosion spots appear Comparative Example 14 >0.0018% Corrosion spots appear Corrosion spots appear Comparative Example 15 >0.0017% Corrosion spots appear Corrosion spots appear Comparative Example 16 0.0011-0.0012% No corrosion No corrosion Comparative Example 17 >0.0018% Corrosion spots appear Corrosion spots appear Comparative Example 18 >0.002% Corrosion spots appear Corrosion spots appear Comparative Example 19 >0.0018% Corrosion spots appear Corrosion spots appear Blank control group >0.002% Corrosion spots appear Corrosion spots appear

[0134] Comparing the data in Table 1 with that in Table 2, the best embodiment of the present invention is Example 7. After the copper substrate is cleaned in Example 7, the protective film on the surface of the copper substrate has good corrosion resistance and wear resistance, and can provide good protection for the copper substrate.

[0135] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions and improvements made by any technician familiar with the field within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A gold plating process for the surface of an incoming substrate in an EBGA process, comprising a cleaning process for a copper substrate and a gold plating process for the cleaned copper substrate, characterized in that: The cleaning process of the copper substrate comprises the following steps: S1, preparing a cleaning solution, wherein the cleaning solution comprises component A and component B; The component A comprises the following components in parts by weight: 10-12 parts of N-hydroxyphthalimide p-toluenesulfonate, 24-25 parts of a visible light base generator wrapped in a microcapsule shell, and 10-12 parts of an anionic surfactant, wherein the spectral absorption range of the visible light base generator is 200-500nm, the microcapsule shell is an anti-ultraviolet microcapsule shell, and the microcapsule shell is broken under acidic conditions to release the visible light base generator inside; the anionic surfactant comprises sodium dodecylbenzene sulfonate and anionic polyacrylamide in a mass ratio of 2-3:1; The component B comprises the following components in parts by weight: 10-12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of plant protein to composite enzyme is 1:3-3.2, and the amount of TG enzyme added is 0.3-0.4% of the mass of plant protein; S2, the N-hydroxyphthalimide toluenesulfonate in component A, the visible light alkali generator wrapped in the microcapsule shell, and the anionic surfactant are mixed in deionized water, and the first cleaning solution is obtained by mixing evenly, and then the copper substrate is placed in the first cleaning solution, and ultrasonic cleaning is performed under 248nm ultraviolet light for 20 minutes, and then, 450nm LED light is used to replace the 248nm ultraviolet light, and ultrasonic cleaning is continued under 450nm LED light for 30-35 minutes, and then the copper substrate is taken out, and after the copper substrate is taken out, the first cleaning solution is allowed to stand for 10 minutes and then filtered to obtain a filtrate, and the pH value of the filtrate is 7-8; S3. Add the plant protein in component B to the filtrate, stir evenly, and then heat to 50°C. Add the composite protease solution and Tris-HCl buffer at 50°C. Perform enzymolysis for 2-3 hours at a stirring speed of 200-300 rpm to obtain a second cleaning solution. Then put the copper substrate after the first cleaning into the second cleaning solution. Perform ultrasonic cleaning for 15 minutes without ultraviolet light. Then cool the second cleaning solution to 37°C and add TG enzyme. Continue ultrasonic cleaning for 30 minutes and then take out the copper substrate. After the copper substrate is dried, a protective film is formed on the surface, and the cleaning process of the copper substrate is completed.

2. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 1, characterized in that: The visible light alkali generator wrapped in the microcapsule shell in the component A is prepared by the following method: S1.

1. Dissolve chitosan in a 1% glacial acetic acid solution at 65°C for 5 hours, then let stand for 24 hours, and adjust the pH to 5.0 to obtain a 2.5% chitosan solution; add gelatin to deionized water, heat to 65°C and stir until completely dissolved, and adjust the pH to 6.0 to obtain an 8% gelatin solution; add sodium alginate to deionized water, heat to 60°C and stir until completely dissolved, and adjust the pH to 7.5 to obtain a 0.5% sodium alginate solution; S1.2, adding a visible light alkali generator to a gelatin solution at 40°C and stirring evenly to obtain a visible light alkali generator-gelatin dispersion, then adding a sodium alginate solution to the visible light alkali generator-gelatin dispersion and mixing evenly, adjusting the pH to 5.0, and obtaining a first reaction system, wherein the mass ratio of the visible light alkali generator to gelatin is 3.5:1, and the mass ratio of sodium alginate to gelatin is 1:3; S1.3, slowly dripping the first reaction system into a calcium chloride solution at room temperature, standing to solidify, filtering and drying to obtain the first microcapsule; S1.3, adding the first microcapsule to a 0.5% calcium chloride solution, stirring at a stirring speed of 50 rpm for 5 minutes, adding the chitosan solution, reacting for 2 hours, filtering and drying to obtain the second microcapsule, wherein the mass ratio of chitosan to sodium alginate is 2.5:1; S1.4, obtain coconut bran, sieve the coconut bran through 100 mesh to obtain coconut bran powder, soak the coconut bran in 0.1 mol / L sodium hydroxide solution, filter after soaking for 1 hour, wash with clean water, and dry to obtain pretreated coconut bran powder for later use; take gelatin, add gelatin to deionized water, heat to 65°C and stir until completely dissolved, adjust the pH to 6.0 to obtain a gelatin solution with a mass fraction of 5%; at 50°C, pour activated carbon, APTMS-modified silica microspheres, titanium dioxide, and coconut bran powder into the gelatin solution, mix well to obtain a first gelatin solution; at 35°C-40°C, add aloin and mycosporin-like amino acids to the first gelatin solution and stir well to obtain a second gelatin solution; add the second microcapsules obtained in step S1.3 to the second gelatin solution, stir well, and then add 0.3 wt% sodium citrate solution, the mass of sodium citrate is 1% of the total mass of the second microcapsules in the second gelatin solution, after being stirred evenly, reacting for 2-3 hours, filtering and drying to obtain the final product, which is the visible light alkali generator wrapped in the anti-ultraviolet microcapsule shell.

3. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 2, characterized in that: The mass ratio of activated carbon, APTMS-modified silica microspheres, titanium dioxide, coconut bran powder, and gelatin in the first gelatin solution of step S1.4 is 0.8:1.5:2:3:5; The amount of aloin added to the second gelatin solution in step S1.4 is 3% of the mass of gelatin in the first gelatin solution, and the amount of mycosporin-like amino acids added is 5% of the mass of gelatin in the first gelatin solution.

4. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 1, characterized in that: The composite protease in the component B comprises papain, neutral protease and gelatinase, and the mass ratio of papain, neutral protease and gelatinase is 2:1:

1.

5. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 4, characterized in that: The component A comprises the following components in parts by weight: 10 parts of N-hydroxyphthalimide p-toluenesulfonate, 24 parts of a visible light base generator wrapped in a microcapsule shell, and 12 parts of an anionic surfactant; The component B comprises the following components in parts by weight: 12 parts of plant protein, composite protease, and TG enzyme, the mass ratio of the plant protein to the composite enzyme is 1:3.2, and the added amount of TG enzyme is 0.4% of the mass of the plant protein.

6. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 1 or 2, characterized in that: The visible light base generator is obtained by dispersing N-(4-formylphenyl)-N-methylglycine methyl ester and cycloalkyl ketone with an organic base after an aldehyde-ketone condensation reaction. The specific preparation method is: N-(4-formylphenyl)-N-methylglycine methyl ester and 3-methylcyclopentanone are dissolved in tetrahydrofuran, and a precipitate a is obtained by an aldehyde-ketone condensation reaction; wherein the molar ratio of the N-(4-formylphenyl)-N-methylglycine methyl ester to the 3-methylcyclopentanone is 1:1; the above precipitate a and 1,8-diazabicyclo (5.4.0) undec-7-ene are dispersed in N,N-dimethylformamide for reaction, and the solvent is removed to obtain a visible light base generator; the molar ratio of the precipitate a to the organic base is 1:

2.

7. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 1, characterized in that: The mass ratio of sodium dodecylbenzene sulfonate and anionic polyacrylamide is 3:

1.

8. The gold plating treatment process for the surface of the substrate in the EBGA process according to claim 1, characterized in that: The plant protein includes soy protein, flax protein and chia seed protein, and the mass ratio of the soy protein, flax protein and chia seed protein is 1:1:2.

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