Optical module

Abstract

The invention provides an optical module, which comprises an optical receiving assembly, a microprocessor, a laser driving chip and a laser emitting chip, and is characterized in that the optical receiving assembly is used for receiving a receiving optical signal carrying a first low-frequency message; the microprocessor is electrically connected with the light receiving assembly and is used for receiving the first low-frequency message and sending a power control signal according to the first low-frequency message; the laser driving chip is electrically connected with the microprocessor and is used for receiving the power control signal and adjusting power supply to the laser emitting chip according to the power control signal so as to adjust the emitting power of the laser emitting chip; the laser emission chip is electrically connected with the laser driving chip and is used for emitting an emission light signal. Through signal transmission between the optical modules at the two ends, the low-frequency message indicating adjustment of the transmitting power of the laser transmitting chip is obtained, the laser transmitting chip is adjusted to the proper transmitting power according to the actual optical network condition, the power consumption between the optical modules at the two ends is reduced, and therefore the optimal power consumption level is achieved.

Description

An optical module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to the Chinese patent application filed with the China Patent Office on January 17, 2022, with application number 202210058774.4 and application name “A kind of optical module”, the entire contents of which are incorporated herein by reference; this disclosure claims priority to the Chinese patent application filed with the China Patent Office on January 17, 2022, with application number 202210047990.9 and application name “A kind of optical module”, the entire contents of which are incorporated herein by reference; this disclosure claims priority to the Chinese patent application filed with the China Patent Office on January 28, 2022, with application number 202210104219.0 and application name “A kind of optical module”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0004] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0005] Summary of the Invention

[0006] In a first aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical receiving component electrically connected to the circuit board, for receiving a received optical signal carrying a first low-frequency message; a microprocessor, arranged on the circuit board, electrically connected to the optical receiving component, for receiving the first low-frequency message, and sending a power control signal according to the first low-frequency message; a laser emitting chip electrically connected to a laser driving chip, for sending an emitted optical signal; a laser driving chip electrically connected to the microprocessor, for receiving the power control signal, and adjusting the emission power of the laser emitting chip according to the power control signal; and an optical fiber interface corresponding to the laser emitting chip, for connecting to an external optical fiber to transmit the emitted optical signal.

[0007] In a second aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical receiving component electrically connected to the circuit board, for receiving an emitted optical signal emitted by an optical module at an opposite end; a microprocessor arranged on the circuit board, electrically connected to the optical receiving component, for detecting the received power of the emitted optical signal to generate a second low-frequency message; a laser emitting chip, for emitting an optical signal carrying the second low-frequency message; and an optical fiber interface corresponding to the laser emitting chip, for connecting to an external optical fiber to transmit the optical signal.

[0008] In a third aspect, the present disclosure provides an optical module, comprising: a circuit board; an optical receiving component electrically connected to the circuit board, for receiving a received optical signal carrying a third low-frequency message; a microprocessor, arranged on the circuit board, electrically connected to the optical receiving component, for receiving the third low-frequency message, and generating a first wavelength control signal or a second wavelength control signal based on a comparison of a wavelength parameter indicated by the third low-frequency message and a preset value; a laser emitting chip electrically connected to a laser driving chip, for emitting an emitted optical signal; a laser driving chip electrically connected to the microprocessor, for receiving the first wavelength control signal and the second wavelength control signal, adjusting the power supply to the laser emitting chip according to the first wavelength control signal to coarsely adjust the wavelength of the emitted optical signal; adjusting the power supply to the laser emitting chip according to the second wavelength control signal to fine-tune the wavelength of the emitted optical signal; and an optical fiber interface corresponding to the laser emitting chip, for connecting to an external optical fiber to transmit the emitted optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] To more clearly illustrate the solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signals, etc.

[0010] FIG1 is a connection diagram of an optical communication system according to some embodiments;

[0011] FIG2 is a block diagram of an optical network terminal according to some embodiments;

[0012] FIG3 is a structural diagram of an optical module according to some embodiments;

[0013] FIG4 is an exploded view of an optical module according to some embodiments;

[0014] FIG5 is a light path diagram of an optical module in actual application according to some embodiments;

[0015] FIG6 is a schematic structural diagram of a circuit board in an optical module according to some embodiments;

[0016] FIG7 is a schematic diagram of a use of an optical module according to some embodiments;

[0017] FIG8 is a schematic diagram illustrating the use of dual MCUs in an optical module according to some embodiments. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0019] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0020] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0021] When describing some embodiments, the term "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other.

[0022] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0023] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0024] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0025] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0026] In optical communication technology, light is used to carry the information to be transmitted. This information is then transmitted through optical fiber or waveguide information transmission equipment to information processing equipment such as computers. Because optical signals have passive transmission characteristics when transmitted through optical fiber or waveguide, low-cost, low-loss information transmission is possible. Furthermore, the signals transmitted by optical fiber or waveguide information transmission equipment are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to establish an information connection between optical fiber or waveguide information transmission equipment and computers and other information processing equipment, it is necessary to convert electrical signals into optical signals.

[0027] In the field of fiber-optic communications, optical modules implement the aforementioned conversion between optical and electrical signals. They include both an optical port and an electrical port. The optical port enables optical communication with information transmission equipment such as optical fibers or optical waveguides, while the electrical port enables electrical connection to an optical network terminal (e.g., an optical modem). This electrical connection is primarily used for power supply, I2C signal transmission, data signal transmission, and grounding. The optical network terminal transmits the electrical signals to information processing equipment such as computers via network cables or wireless fidelity (Wi-Fi).

[0028] FIG1 is a connection diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0029] One end of optical fiber 101 is connected to remote server 1000, and the other end is connected to optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, for example, signal transmission over several kilometers (6 to 8 kilometers). Furthermore, if repeaters are used, ultra-long-distance transmission is theoretically possible. Therefore, in typical optical communication systems, the distance between remote server 1000 and optical network terminal 100 can typically reach several thousand meters, tens of kilometers, or even hundreds of kilometers.

[0030] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, etc.

[0031] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

[0032] Optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to optical fiber 101, thereby establishing a bidirectional optical signal connection between optical module 200 and optical fiber 101. The electrical port is configured to connect to optical network terminal 100, thereby establishing a bidirectional electrical signal connection between optical module 200 and optical network terminal 100. Optical module 200 converts optical signals into electrical signals, thereby establishing a connection between optical fiber 101 and optical network terminal 100. For example, optical signals from optical fiber 101 are converted into electrical signals by optical module 200 and then input into optical network terminal 100. Similarly, electrical signals from optical network terminal 100 are converted into optical signals by optical module 200 and then input into optical fiber 101.

[0033] The optical network terminal 100 includes a roughly rectangular housing, an optical module interface 102, and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200. The network cable interface 104 is configured to connect to the network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and transmits signals from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the operation of the optical module 200. In addition to the optical network terminal 100, the host computer of the optical module 200 may also include an optical line terminal (OLT), etc.

[0034] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .

[0035] Figure 2 is a structural diagram of an optical network terminal according to some embodiments. To clearly illustrate the connection between optical module 200 and optical network terminal 100, Figure 2 only shows the structure of optical network terminal 100 related to optical module 200. As shown in Figure 2, optical network terminal 100 also includes a PCB circuit board 105 disposed within a housing, a cage 106 disposed on the surface of PCB circuit board 105, and an electrical connector disposed within cage 106. The electrical connector is configured to connect to the electrical port of optical module 200; the heat sink 107 has raised portions, such as fins, to increase the heat dissipation area.

[0036] The optical module 200 is inserted into the cage 106 of the optical network terminal 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical fiber 101.

[0037] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver.

[0038] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0039] In some embodiments of the application, the lower shell 202 includes a base plate and two lower side plates located on both sides of the base plate and arranged perpendicularly to the base plate; the upper shell 201 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and is combined with two side walls and two side plates to achieve the upper shell 201 covering the lower shell 202.

[0040] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located on the side of the optical module 200. Among them, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port 204 and is inserted into the host computer (such as the optical network terminal 100); the opening 205 is an optical port, which is configured to connect to the external optical fiber 101 so that the optical fiber 101 can connect to the optical transceiver device inside the optical module 200.

[0041] The combined assembly of upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300 and optical transceivers within the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for these components. Furthermore, during assembly of components such as the circuit board 300, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0042] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0043] In some embodiments, the optical module 200 further includes an unlocking component 203 located on the outer wall of its housing. The unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0044] For example, the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 and includes engaging components that mate with the cage of the host computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the engaging components of the unlocking component 203 secure the optical module 200 in the cage of the host computer. When the unlocking component 203 is pulled, the engaging components of the unlocking component 203 move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the engaging relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be removed from the cage of the host computer.

[0045] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), transimpedance amplifiers (TIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0046] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can stably carry the chip; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0047] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is conductively connected to the electrical connector in the cage 106. The gold finger can be provided only on the surface of one side of the circuit board 300 (for example, the upper surface shown in FIG4 ), or can be provided on the upper and lower surfaces of the circuit board 300 to adapt to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0048] The optical transceiver device includes an optical transmitter submodule 400 and an optical receiver submodule 500, which are used to transmit and receive optical signals, respectively. The optical transmitter submodule 400 generally includes a laser transmitter chip, with a laser driver chip mounted on a circuit board 300 to control the laser transmitter chip's optical signal transmission. The optical receiver submodule 500 generally includes an optical receiver chip, with a optical receiver driver chip mounted on a circuit board 300 to control the optical-to-electrical conversion performed by the optical receiver chip.

[0049] In an access network communication system, there is an optical module at each end of the line, and an optical connection is established between the optical modules at both ends. One end sends an optical signal to the other end through the connected optical module to send data. At the same time, the optical module at one end can also receive optical signals from the other end to receive data.

[0050] The first optical module and the second optical module can be color light Tunable-BIDI optical modules. The BIDI optical module adopts the BOSA solution. The emission and reception wavelengths are different. The BIDI optical modules are used in pairs. For example, the first optical module has an emission wavelength of λ1 and a reception wavelength of λ2; the second optical module has an emission wavelength of λ2 and a reception wavelength of λ1.

[0051] Figure 5 is an optical path diagram of an optical module in actual application according to some embodiments. As shown in Figure 5, when the first optical module transmits a first optical signal and the second optical module transmits a second optical signal, to facilitate transmission of the first optical signal and the second optical signal, a first combiner / demultiplexer and a second combiner / demultiplexer are provided between the first optical module and the second optical module. The first combiner / demultiplexer is connected to the first optical module and is used to combine and couple the optical signal emitted by the first optical module into an optical fiber 101, and transmit the optical signal to the second optical module via the optical fiber 101; the second combiner / demultiplexer is connected to the second optical module and is used to couple the optical signal emitted by the second optical module into an optical fiber 101, and transmit the optical signal to the first optical module via the optical fiber 101.

[0052] The first combiner / demultiplexer can not only combine and couple the optical signal into the optical fiber 101, but also perform wavelength demultiplexing on the optical signal transmitted by the optical fiber 101, and the demultiplexed optical signal is transmitted to the first optical module through the corresponding channel; the second combiner / demultiplexer can not only combine and couple the optical signal into the optical fiber 101, but also perform wavelength demultiplexing on the optical signal transmitted by the optical fiber 101, and the demultiplexed optical signal is transmitted to the second optical module through the corresponding channel.

[0053] The first and second optical modules form a pair, with tunable transmission. For example, one end can transmit at a tunable wavelength from λ1-1 to N-1, while the other end can transmit at a tunable wavelength from λ1-2 to N-2. Reception typically utilizes broadband reception. For example, an optical module with a tunable transmission wavelength from λ1-1 to N-1 can receive all light with wavelengths from λ1-2 to N-2; while an optical module with a tunable transmission wavelength from λ1-2 to N-2 can receive all light with wavelengths from λ1-1 to N-1.

[0054] In use, if the first optical module is connected to channel 1-1 of the first combiner / demultiplexer, it transmits light at a wavelength of λ1-1 and receives light at a wavelength of λ1-2. If the second optical module is connected to channel 2-1 of the second combiner / demultiplexer, it transmits light at a wavelength of λ1-2 and receives light at a wavelength of λ1-1. Communication between the first and second optical modules is now possible, and modules operating at other wavelengths cannot transmit signals to or from these two modules, preventing them from interfering with each other.

[0055] The current practical application is to superimpose a low-frequency signal on the transmission signal. In some embodiments, the low-frequency signal superposition method can be: (1) adding a low-frequency signal to the BIAS DC power; (2) adding a low-frequency modulation signal to the EA DC negative voltage bias.

[0056] In actual use, a 50Kbps low-frequency modulation signal is superimposed on the 10Gbps or 25Gbps signal. The 10Gbps or 25Gbps signal is a normal business signal. While not occupying the business, another 50Kbps low-frequency signal is added to perform other functions.

[0057] In some embodiments, after a link is established between a first optical module and a second optical module, when the first optical module sends an optical signal to the second optical module, if the transmission distance and link loss between the first and second optical modules are different, the transmit power can be reduced for short transmission distances or with low link loss to reduce power consumption; while the transmit power can be increased for long transmission distances or with high link loss to meet the application requirements. Therefore, by adjusting the transmit power of the first and second optical modules, power consumption between the first and second optical modules can be reduced.

[0058] Both the first and second optical modules have a transmit power adjustment function. This function adjusts the transmit power of the optical signal in the first or second optical module based on different transmission distances and link losses. Different transmit power levels result in different drive currents. Increasing the power with a lower drive current results in lower power consumption for the corresponding module.

[0059] Figure 6 is a schematic diagram of the structure of a circuit board in an optical module according to some embodiments, and Figure 7 is a schematic diagram of the use of an optical module according to some embodiments. As shown in Figures 6 and 7, the optical module provided by the embodiment of the present disclosure includes:

[0060] The optical receiving component 510 is electrically connected to the circuit board 300 and is used to receive the received optical signal carrying the first low-frequency message;

[0061] The microprocessor 320 is provided on the circuit board 300 and is electrically connected to the optical receiving component 510, and is configured to receive the first low-frequency message and send a power control signal according to the first low-frequency message;

[0062] The laser emission chip 410 is electrically connected to the laser driving chip 330 and is used to emit an emission light signal;

[0063] The laser driver chip 330 is electrically connected to the microprocessor 320 and is used to receive a power control signal and adjust the power supply to the laser emission chip 410 according to the power control signal to adjust the emission power of the laser emission chip 410;

[0064] The optical fiber interface corresponds to the laser emission chip 410 and is used to connect to an external optical fiber to transmit the emission light signal.

[0065] In some embodiments, the first low-frequency message indicates the power of the transmitted optical signal, or instructs adjustment of the power of the transmitted optical signal. Specifically, the first low-frequency message is sent from one optical module to another optical module. The microprocessor 320 of the optical module that receives the first low-frequency message interprets the first low-frequency message and issues a power control signal based on the first low-frequency message. The laser driver chip 330 of the optical module receives the power control signal and adjusts the power supply to the laser emitting chip 410 based on the power control signal to adjust the transmit power of the laser emitting chip 410.

[0066] When the first low-frequency message indicates the power of the transmitted optical signal, the first low-frequency message is generated based on a comparison between the received power of the received optical signal and a preset value. The preset value includes the transmit power, the sensitivity value, and the overload value. The transmit power, the sensitivity value, and the overload value are all working parameters of the optical receiving component and the laser transmitting chip in the optical module at the opposite end.

[0067] For example, a first optical module transmits an optical signal to a second optical module, which receives the optical signal. The microprocessor 320 of the second optical module detects the received power of the optical signal and generates a low-frequency message based on the received power. The laser transmitting chip of the second optical module transmits a transmitted optical signal carrying the low-frequency message. Then, the optical receiving component of the first optical module receives the received optical signal carrying the low-frequency message. The microprocessor 320 of the first optical module parses the low-frequency message to obtain the received power. The microprocessor 320 generates a first low-frequency message based on the received power, the transmit power of the first optical module, the sensitivity value of the first optical module, and the overload value of the first optical module. The laser transmitting chip of the first optical module transmits the transmitted optical signal carrying the first low-frequency message to the second optical module.

[0068] In some embodiments, the first low-frequency message generates a link loss value based on a comparison between the transmission power and the reception power of the optical module at the opposite end, generates a minimum transmission power based on a comparison between the link loss value and the sensitivity value of the optical module at the opposite end, and generates a maximum transmission power based on a comparison between the link loss value and the overload value of the optical module at the opposite end.

[0069] In some disclosed embodiments, after the microprocessor 320 of the first optical module obtains the receiving power of the second optical module, it obtains a link loss value based on the transmission power of the first optical module and the receiving power (link loss value = transmission power of the first optical module - receiving power of the second optical module), calculates the minimum transmission power based on the link loss value and the receiving sensitivity value of the first optical module (minimum transmission power = link loss value - sensitivity value), and calculates the maximum transmission power based on the link loss value and the receiving overload value of the first optical module (maximum transmission power = link loss value - overload value). The calculated minimum transmission power and maximum transmission power are the minimum transmission power and maximum transmission power of the second optical module.

[0070] The microprocessor 320 of the first optical module loads the minimum transmit power and maximum transmit power into the transmit optical signal in the form of a first low-frequency message. The laser emitting chip 410 of the first optical module transmits the transmit optical signal carrying the first low-frequency message. The optical receiving component 510 of the second optical module receives the received optical signal carrying the first low-frequency message. The microprocessor 320 of the second optical module receives the first low-frequency message and issues a power control signal based on the first low-frequency message. The laser driver chip 330 of the second optical module adjusts the power supply to the laser emitting chip 410 based on the power control signal, adjusting the transmit power range of the laser emitting chip 410 to the transmit power range indicated by the first low-frequency message (minimum transmit power, maximum transmit power).

[0071] In some embodiments, not only can the transmission power range of the second optical module be obtained by the link loss between the first optical module and the second optical module, but the transmission optical power of the second optical module can also be adjusted according to the reception power of the second optical module.

[0072] When the first low-frequency message indicates adjustment of the power of the transmitted optical signal, the first low-frequency message is generated based on a comparison between the received power of the received optical signal and a preset value, where the preset value is any value between a sensitivity value and an overload value, and both the sensitivity value and the overload value are operating parameters of the optical receiving component in the optical module at the opposite end.

[0073] In some embodiments, the first low-frequency message is generated based on the difference between the received power of the opposite optical module (the second optical module) and a preset value. After the laser emitting chip 410 of the first optical module emits a transmitted light signal, the optical receiving component 510 of the second optical module receives the transmitted light signal and detects the received power of the transmitted light signal through the microprocessor 320. The power difference between the received power and the preset value of the second optical module is calculated. This power difference can indicate whether to reduce or increase the transmit power of the first optical module. This power difference is then sent to the first optical module in the form of a first low-frequency message to adjust the transmit power of the laser emitting chip 410 in the first optical module.

[0074] In some embodiments, in addition to generating the first low-frequency message based on any value between the sensitivity value and the overload value of the optical module, the first low-frequency message may also be generated based on any range between the sensitivity value and the overload value of the optical module. The first low-frequency message is generated based on a comparison of the received power of the received optical signal with a preset range, where the preset range is any range between the sensitivity value and the overload value, and both the sensitivity value and the overload value are operating parameters of the optical receiving component in the optical module at the opposite end.

[0075] In some disclosed embodiments, a first low-frequency message is generated based on the difference between the received power of the opposite optical module (the second optical module) and a preset range. After the laser emitting chip 410 of the first optical module emits a transmitted light signal, the optical receiving component 510 of the second optical module receives the transmitted light signal and detects the received power of the transmitted light signal through the microprocessor 320. The power difference between the received power and the preset range of the second optical module is calculated. This power difference can indicate whether to reduce or increase the transmit power of the first optical module. This power difference is then sent to the first optical module in the form of a first low-frequency message to adjust the transmit power of the laser emitting chip 410 in the first optical module.

[0076] The first optical module transmits an optical signal to the second optical module, which receives the optical signal. The second optical module's microprocessor 320 detects the received power of the optical signal and generates a low-frequency message based on the received power. The second optical module's laser transmitting chip 410 then transmits an optical signal carrying the low-frequency message. The first optical module's optical receiving component 510 then receives the received optical signal carrying the low-frequency message. The first optical module's microprocessor 320 analyzes the low-frequency message to obtain the received power. The microprocessor 320 then determines whether the received power is between the sensitivity and overload power of the first optical module and meets the application specifications.

[0077] If the received power is less than the sensitivity, the microprocessor 320 of the first optical module generates a power control signal to increase the transmit power and loads the power control signal onto the transmitted optical signal in the form of a first low-frequency message. The laser emitting chip 410 of the first optical module transmits the transmit optical signal carrying the first low-frequency message to the second optical module. The optical receiving component 510 of the second optical module receives the received optical signal carrying the first low-frequency message. The microprocessor 320 of the second optical module receives the first low-frequency message and, based on the first low-frequency message, issues a power control signal to increase the transmit power. The laser driver chip 330 of the second optical module adjusts the power supply to the laser emitting chip 410 based on the power control signal to increase the transmit power of the laser emitting chip 410 until the transmit power meets the transmit power specification of the application.

[0078] If the received power is greater than the overload power, the microprocessor 320 of the first optical module generates a power control signal to reduce the transmit power and applies the power control signal to the transmitted optical signal in the form of a first low-frequency message. The laser emitting chip 410 of the first optical module transmits the transmit optical signal carrying the first low-frequency message to the second optical module. The optical receiving component 510 of the second optical module receives the received optical signal carrying the first low-frequency message. The microprocessor 320 of the second optical module receives the first low-frequency message and, based on the first low-frequency message, issues a power control signal to reduce the transmit power. The laser driver chip 330 of the second optical module adjusts the power supply to the laser emitting chip 410 based on the power control signal to reduce the transmit power of the laser emitting chip 410 until the transmit power meets the application specification.

[0079] In some embodiments, when the microprocessor 320 sends a power control signal according to the first low-frequency message, the microprocessor 320 is also required to obtain the current transmission power gear of the laser emission chip 410, and then the microprocessor 320 obtains the target transmission power gear according to the power difference indicated by the first low-frequency message and the current transmission power gear, and sends a power control signal according to the target transmission power gear.

[0080] When the first low-frequency message indicates adjustment of the power of the transmitted optical signal, the microprocessor 320 is also used to determine whether the power difference indicated by the first low-frequency message is greater than zero. When the power difference is greater than zero, it indicates that the transmitted optical power of the first optical module is high, and the transmission power gear of the laser emission chip 410 in the first optical module needs to be reduced; when the power difference is less than zero, it indicates that the transmitted optical power of the first optical module is low, and the transmission power gear of the laser emission chip 410 in the first optical module needs to be increased.

[0081] For example, the Power Leveling of the first optical module is divided into three gears, POWER1, POWER2, ​​and POWER3, and the three gears correspond to 3dBm, 0dBm, and -3dBm, respectively. The current transmission power gear of the laser emitting chip 410 in the first optical module is POWER1, 3dBm; the optical receiving component 510 of the first optical module receives the received optical signal carrying the first low-frequency message channel, and the microprocessor 320 parses and obtains the power difference of 4dB indicated by the first low-frequency message, and the power difference is the power difference that the laser emitting chip 410 can reduce or increase; after receiving the power difference of 4dB, the microprocessor 320 determines that the laser emitting chip 410 in the first optical module can reduce the transmission power by 4dB, thereby switching the transmission power gear of the first optical module from POWER1, 3dBm to POWER2, ​​0dBm, thereby reducing the power consumption of the first optical module.

[0082] In some embodiments, the microprocessor 320 determines an adjusted target transmit power level based on the power difference and the current transmit power level of the first optical module. The laser driver chip 330 controls the gradual adjustment of the drive current of the laser emitting chip to adjust the transmit power level of the laser emitting chip 410 to the target transmit power level. For example, if the current transmit power level of the first optical module is POWER1, 3dBm, and the power difference indicated by the first low-frequency message is 4dB, it is determined that the transmit power of the first optical module can be reduced by 4dB. Therefore, the transmit power level of the first optical module is switched from the current transmit power level POWER1, 3dBm to the target transmit power level POWER2, ​​0dBm.

[0083] In some embodiments, when the microprocessor 320 sends a power control signal according to the first low-frequency message, the microprocessor 320 is also required to obtain the current transmission power value of the laser emission chip 410, and then the microprocessor 320 obtains the target transmission power value according to the power difference indicated by the first low-frequency message and the current transmission power value, and sends a power control signal according to the target transmission power value.

[0084] When the first low-frequency message indicates adjustment of the power of the transmitted optical signal, the microprocessor 320 is further used to determine whether the power difference indicated by the first low-frequency message is greater than zero. When the power difference is greater than zero, it indicates that the transmitted optical power of the first optical module is high, and the transmission power value of the laser emission chip 410 in the first optical module needs to be reduced; when the power difference is less than zero, it indicates that the transmitted optical power of the first optical module is low, and the transmission power value of the laser emission chip 410 in the first optical module needs to be increased.

[0085] If the current transmission power value POWER1 of the first optical module is 3dBm, the optical receiving component 510 of the first optical module receives the received optical signal carrying the first low-frequency message, and the microprocessor 320 of the first optical module parses and obtains the power difference of 4dB indicated by the first low-frequency message, and the power difference is the power difference that the first optical module can reduce or increase; after receiving the power difference of 4dB, the microprocessor 320 determines that the first optical module can reduce the transmission power by 4dB, so the target transmission power value is 3dBm-4dB=-1dBm, so the transmission power POWER1 of the laser emitting chip 410 in the first optical module is reduced from 3dBm to -1dBm, so that the power consumption of the first optical module is reduced.

[0086] In some embodiments, the microprocessor 320 determines an adjusted target transmit power value based on the power difference and the current transmit power value of the first optical module. The laser driver chip 330 controls the gradual adjustment of the drive current of the laser emitting chip to adjust the transmit power of the laser emitting chip 410 to the target transmit power value. For example, if the current transmit power value POWER1 of the first optical module is 3dBm and the power difference indicated by the first low-frequency message is 4dB, it is determined that the transmit power of the first optical module can be reduced by 4dB. Therefore, the transmit power value POWER1 of the first optical module is reduced from the current transmit power value of 3dBm to the target transmit power value of -1dBm.

[0087] In some embodiments, the microprocessor 320 can be a single MCU solution or a dual MCU solution. When the microprocessor 320 is a dual MCU solution, one MCU is used to control the operation of the optical module, such as controlling the laser driver chip 330, the laser transmitter chip 410, and the optical receiving component 510; the other MCU is used for communication between the optical module and the opposite optical module, such as receiving and processing data information and sending data.

[0088] Figure 8 is a schematic diagram of the use of dual MCUs in an optical module according to some embodiments. As shown in Figure 8, in the transmitting optical module (first optical module) provided by the embodiment of the present disclosure, the microprocessor 320 includes a first chip (first slave MCU) and a second chip (first master MCU) that communicate with each other. The first slave MCU receives a first low-frequency message, and the first master MCU sends a power control signal. That is, the first master MCU and the first slave MCU are connected in communication, and the laser emitting chip (first light emitting chip) and the light receiving component (first light receiving chip) are respectively connected to the first slave MCU for control.

[0089] In certain disclosed embodiments, a first master MCU of a first optical module is connected to a transmitting host computer via I2C, and the first master MCU is connected to a first slave MCU via I2C. Thus, the transmitting host computer sends a message to be sent to the first master MCU via I2C, and the first master MCU writes the message content to the first slave MCU via I2C. When the message content is written, indicating that the first slave MCU is able to send the written message content, the I2C communication between the first master MCU and the first slave MCU is interrupted, the first master MCU does not access the first slave MCU, and the first slave MCU uses all its resources for message sending.

[0090] The first slave MCU generates an optical signal based on the written message content and controls the first optical transmitter chip to transmit the optical signal. When the optical signal is successfully transmitted, the level of the transmission indicator pin flips, which can be a low-to-high level on the I / O port, indicating that the message has been sent. The first slave MCU can be accessed again for the next transmission.

[0091] The first optical receiver chip is used to receive the received optical signal carrying the first low-frequency message channel sent by the second optical module. The first slave MCU parses the first low-frequency message in the received optical signal. When the first optical receiver chip begins receiving a message, it indicates message reception through the receive indicator pin. If the I / O port output is high, it indicates that the message is being received and I2C access to the first slave MCU is not recommended. When the message is received, the receive indicator pin goes low again, and the first master MCU can access the first slave MCU, allowing the first master MCU to read the received message content.

[0092] When the second optical module sends an optical signal to the first optical module, the received optical signal received by the first optical receiving chip includes a high-frequency data signal and a first low-frequency message. The first slave MCU controls the first optical receiving chip to convert the received optical signal into a high-frequency electrical signal and a first low-frequency electrical signal. Then, the first slave MCU sends communication data to the first master MCU according to the high-frequency electrical signal and the first low-frequency electrical signal.

[0093] Circuit board 300 includes a signal output gold finger 310 (shown in Figure 6) for electrical connection to an external host computer. The first main MCU receives communication data and transmits the high-frequency electrical signal contained in the communication data to signal output gold finger 310 to transmit the high-frequency communication data. The first main MCU then analyzes the first low-frequency electrical signal contained in the communication data, obtains the power difference indicated by the first low-frequency electrical signal, generates a power control signal based on the power difference, and transmits the power control signal to the laser driver chip.

[0094] Similarly, the first optical module can also control the second optical module to adjust the transmit power. This transmit power can be either a transmit power value or a power leveling level. In this case, the optical receiving component 510 of the first optical module is used to receive the transmitted optical signal from the opposite optical module (the second optical module). The microprocessor 320 is used to detect the received power of the transmitted optical signal to generate a second low-frequency message. The laser transmitting chip is used to emit an optical signal carrying the second low-frequency message.

[0095] In some disclosed embodiments, the optical receiving component 510 of the first optical module receives the transmitted optical signal sent by the second optical module, the microprocessor 320 detects the received optical power of the transmitted optical signal, and calculates the power difference between the received optical power and the preset value of the first optical module; the microprocessor 320 loads the power difference into the optical signal in the form of a second low-frequency message, and controls the laser transmitting chip 410 to transmit the optical signal carrying the second low-frequency message to the second optical module. The second optical module can automatically adjust the transmission power level of the second optical module according to the power difference indicated by the second low-frequency message, or the second optical module can increase or decrease the transmission power value of the second optical module according to the power difference indicated by the second low-frequency message.

[0096] In some embodiments, the second low-frequency message indicates adjusting the power of the optical signal transmitted by the second optical module. The second low-frequency message may be based on the difference between the received power of the optical signal transmitted by the second optical module by the first optical module and a preset value of the first optical module. The preset value is any value between the sensitivity value and the overload value. The sensitivity value and the overload value are both working parameters of the optical receiving component in the first optical module.

[0097] The second low-frequency message may also be based on the difference between the received power of the optical signal transmitted by the first optical module to the second optical module and a preset range of the first optical module, where the preset range is any range between the sensitivity value and the overload value, and the sensitivity value and the overload value are both working parameters of the optical receiving component in the first optical module.

[0098] For example, the power leveling of the second optical module is divided into three gears, POWER1, POWER2, ​​and POWER3, which correspond to 3dBm, 0dBm, and -3dBm, respectively. The received optical power of the transmitted optical signal received by the optical receiving component 510 in the first optical module from the second optical module is -14dBm, and the sensitivity of the first optical module is -18dBm. The microprocessor 320 calculates that the power difference between the received optical power and the sensitivity of the first optical module is 4dB (-14dBm-(-18dBm)=4dB). The microprocessor 320 loads the power difference of 4dB into the low-frequency message channel to form a second low-frequency message, and controls the laser transmitting chip 410 to transmit an optical signal carrying the second low-frequency message to the second optical module. For example, the specific compiled content "difference power 4dB" is compiled into "111100000100". After receiving the optical signal, the second optical module automatically adjusts the transmission power gear of the second optical module according to the power difference indicated by the second low-frequency message.

[0099] For example, if the current transmission power value POWER1 of the second optical module is 3dBm, the received optical power of the optical receiving component 510 of the first optical module receiving the transmitted optical signal emitted by the second optical module is -14dBm, and the sensitivity of the first optical module is -18dBm. The microprocessor calculates that the power difference between the received optical power and the sensitivity of the first optical module is 4dB (-14dBm-(-18dBm)=4dB); the microprocessor 320 loads the power difference of 4dB into the low-frequency message channel to form a second low-frequency message, and controls the laser transmitting chip 410 to transmit an optical signal carrying the second low-frequency message to the second optical module, such as compiling the specific compiled content "difference power 4dB" into "111100000100". After the second optical module receives the optical signal, it increases or decreases the transmission power value of the second optical module according to the power difference in the optical signal.

[0100] In some embodiments, the second optical module determines an adjusted target transmit power level based on the power difference indicated by the second low-frequency message and the current transmit power level of the second optical module. The laser driver chip 330 of the second optical module controls the gradual adjustment of the drive current of the laser emitting chip 410 to adjust the transmit power level of the laser emitting chip 410 in the second optical module to the target transmit power level. For example, if the current transmit power level of the second optical module is POWER1, 3dBm and the power difference indicated by the second low-frequency message is 4dB, it is determined that the transmit power of the second optical module can be reduced by 4dB. Therefore, the transmit power level of the laser emitting chip 410 in the second optical module is switched from POWER1, 3dBm to POWER2, ​​0dBm.

[0101] In some embodiments, the second optical module determines an adjusted target transmit power value based on the power difference indicated by the second low-frequency message and the current transmit power value of the second optical module. The laser driver chip 330 of the second optical module gradually adjusts the drive current of the laser emitting chip 410 to adjust the transmit power value of the laser emitting chip 410 in the second optical module to the target transmit power value. For example, if the current transmit power value POWER1 of the second optical module is 3dBm and the power difference indicated by the second low-frequency message is 4dB, it is determined that the transmit power of the second optical module can be reduced by 4dB. Therefore, the transmit power value POWER1 of the second optical module is reduced from the current transmit power value of 3dBm to the target transmit power value of -1dBm.

[0102] In some embodiments, when the first optical module transmits an optical signal carrying a second low-frequency message to the second optical module, the circuit board 300 includes a signal input gold finger electrically connected to an external host computer to receive high-frequency communication data. In certain disclosed embodiments, the first transmitting host computer transmits high-frequency communication data to the microprocessor 320 via the signal input gold finger. The microprocessor 320 modulates the second low-frequency message and the high-frequency communication data into an optical signal carrying the second low-frequency message, and transmits the optical signal carrying the second low-frequency message to the second optical module via the laser transmitting chip.

[0103] The optical module provided in the embodiment of the present disclosure is a BIDI optical module, that is, it includes a transmitting end optical module and a receiving end optical module, and the transmitting end optical module and the receiving end optical module both include an optical receiving component 510, a microprocessor 320, a laser emitting chip 410, a laser driving chip 330 and an optical fiber interface. The optical receiving component 510 of the transmitting end optical module receives a received optical signal carrying a first low-frequency message sent by the receiving end optical module, and the microprocessor 320 of the transmitting end optical module receives and parses the first low-frequency message, and sends a power control signal according to the first low-frequency message; the laser driving chip 330 of the transmitting end optical module receives the power control signal, and adjusts the power supply to the laser emitting chip 410 according to the power control signal to adjust the emission power of the laser emitting chip, so as to adjust the power of the laser emitting chip 410 when emitting an optical signal, thereby reducing the power consumption between the transmitting end optical module and the receiving end optical module. At the same time, after the optical receiving component 510 of the transmitting optical module receives the transmitted optical signal emitted by the receiving optical module, the microprocessor 320 of the transmitting optical module detects the received power of the transmitted optical signal and generates a second low-frequency message based on the received power; the microprocessor 320 loads the second low-frequency message onto the transmitted optical signal, and the laser emitting chip 410 of the transmitting optical module emits an optical signal carrying the second low-frequency message. The receiving optical module receives the optical signal carrying the second low-frequency message and can generate a power control signal based on the second low-frequency message to adjust the transmit power of the laser emitting chip 410, thereby adjusting the power of the laser emitting chip when emitting the optical signal; and the receiving optical module generates the first low-frequency message based on the received power of the transmitted optical signal emitted by the transmitting optical module. The present disclosure obtains a low-frequency message instructing to adjust the transmit power of the laser emitting chip through signal transmission between the transmitting optical module and the receiving optical module, adjusts the power supply to the laser emitting chip based on the low-frequency message, and adjusts the laser emitting chip to the appropriate transmit power according to the actual optical network conditions, thereby reducing the power consumption between the optical modules at both ends and achieving the optimal power consumption level.

[0104] Based on the optical module provided in the above embodiment, the embodiment of the present disclosure further provides an optical power adjustment method based on a dual-MCU optical module. In this method, the method in which the first optical module controls the second optical module to adjust the transmission power includes:

[0105] The first slave MCU receives a first optical signal carrying a first low-frequency message. The first master MCU detects the received optical power of the first optical signal and calculates a first power difference between the received optical power and the sensitivity of the first optical module. The first slave MCU then adds the first power difference to the transmitted optical signal in the form of a second low-frequency message. The first slave MCU then controls the transmission of a second optical signal carrying the second low-frequency message. The second slave MCU receives a second optical signal carrying a second low-frequency message and parses the second low-frequency message to obtain the first power difference. The second master MCU then obtains the current transmit power of the second optical module and adjusts the transmit power of the second optical module based on the first power difference.

[0106] The current transmit power of the second optical module obtained by the second main MCU can be a current transmit power level or a current transmit power value. When obtaining the current transmit power level of the second optical module, the second main MCU automatically adjusts the transmit power level of the second optical module based on the first power difference. When obtaining the current transmit power value of the second optical module, the second main MCU increases or decreases the transmit power value of the second optical module based on the first power difference.

[0107] For example, the Power Leveling of the second optical module is divided into three gears, POWER1, POWER2, ​​and POWER3, and the three gears correspond to 3dBm, 0dBm, and -3dBm respectively. The current transmission power gear of the second optical module is POWER1, 3dBm; the received optical power of the first optical signal received by the first optical receiving chip of the first optical module is -14dBm, and the sensitivity of the first optical module is -18dBm. The first master MCU calculates that the first power difference between the received optical power and the sensitivity of the first optical module is 4dB (-14dBm-(-18dBm)=4dB); the first slave MCU loads the first power difference of 4dB into the second optical signal in the form of a second low-frequency message, and controls the first optical transmitter to receive the first optical signal. The transmitting chip transmits a second optical signal carrying a second low-frequency message to the second optical module, such as compiling the specific compiled content "difference power 4dB" into "111100000100"; the second optical receiving chip of the second optical module receives the second optical signal carrying the second low-frequency message, and the second slave MCU parses and obtains the first power difference of 4dB indicated by the second low-frequency message. The first power difference is the power difference that the second optical module can reduce or increase; after receiving the first power difference of 4dB, the second main MCU determines that the second optical module can reduce the transmission power by 4dB, thereby switching the transmission power gear of the second optical module from POWER1, 3dBm to POWER2, ​​0dBm, thereby reducing the power consumption of the second optical module.

[0108] For example, if the current transmit power value POWER1 of the second optical module is 3dBm, the received optical power of the first optical signal received by the first optical receiving chip of the first optical module is -14dBm, and the sensitivity of the first optical module is -18dBm, the first master MCU calculates that the first power difference between the received optical power and the sensitivity of the first optical module is 4dB (-14dBm-(-18dBm)=4dB); the first slave MCU loads the first power difference of 4dB into the second optical signal in the form of a second low-frequency message, and controls the first optical transmitting chip to transmit the second optical signal carrying the second low-frequency message to the second optical module, such as The specific compiled content "difference power 4dB" is compiled into "111100000100"; the second optical receiving chip of the second optical module receives the second optical signal carrying the second low-frequency message, and the second slave MCU parses and obtains the first power difference of 4dB indicated by the second low-frequency message. The first power difference is the power difference that the second optical module can reduce or increase; after the second main MCU receives the first power difference of 4dB, it determines that the second optical module can reduce the transmission power by 4dB, thereby reducing the transmission power value POWER1 of the second optical module from 3dBm to -1dBm, thereby reducing the power consumption of the second optical module.

[0109] Similarly, the method for the second optical module to control the first optical module to adjust the transmit power includes:

[0110] The second slave MCU receives the second optical signal carrying the second low-frequency message, the second master MCU detects the received optical power of the second optical signal, calculates a second power difference between the received optical power and the sensitivity of the second optical module, and then adds the second power difference to the first optical signal in the form of a first low-frequency message. The second slave MCU then controls the transmission of the first optical signal carrying the first low-frequency message. The first slave MCU receives the first optical signal carrying the first low-frequency message, parses the first low-frequency message, and obtains the second power difference. The first master MCU obtains the current transmit power of the first optical module and adjusts the transmit power of the first optical module based on the second power difference.

[0111] The current transmit power of the first optical module obtained by the first main MCU may be a current transmit power level or a current transmit power value. When obtaining the current transmit power level of the first optical module, the first main MCU automatically adjusts the transmit power level of the first optical module based on the first power difference. When obtaining the current transmit power value of the first optical module, the first main MCU increases or decreases the transmit power value of the first optical module based on the first power difference.

[0112] For example, the Power Leveling of the first optical module is divided into three gears, POWER1, POWER2, ​​and POWER3, and the three gears correspond to 3dBm, 0dBm, and -3dBm respectively. The current transmission power gear of the first optical module is POWER1, 3dBm; the received optical power of the second optical signal received by the second optical receiving chip is -14dBm, and the sensitivity of the second optical module is -18dBm. The second main MCU calculates that the second power difference between the received optical power and the sensitivity of the second optical module is 4dB (-14dBm-(-18dBm)=4dB); the second slave MCU loads the second power difference of 4dB to the first optical signal in the form of a first low-frequency message, and controls the second optical transmitting chip A first optical signal carrying a first low-frequency message is transmitted to the first optical module, such as compiling the specific compiled content "difference power 4dB" into "111100000100"; the first optical receiving chip of the first optical module receives the first optical signal carrying the first low-frequency message, and the first slave MCU parses and obtains a second power difference of 4dB indicated by the second low-frequency message. The second power difference is the power difference that can be reduced or increased by the first optical module; after receiving the second power difference of 4dB, the first main MCU determines that the first optical module can reduce the transmission power by 4dB, thereby switching the transmission power gear of the first optical module from POWER1, 3dBm to POWER2, ​​0dBm, thereby reducing the power consumption of the first optical module.

[0113] For example, if the current transmission power value of the first optical module is 3dBm, the received optical power of the second optical signal received by the second optical receiving chip of the second optical module is -14dBm, and the sensitivity of the second optical module is -18dBm, the second master MCU calculates that the second power difference between the received optical power and the sensitivity of the second optical module is 4dB (-14dBm-(-18dBm)=4dB); the second slave MCU loads the second power difference of 4dB into the first optical signal in the form of a first low-frequency message, and controls the second optical transmitting chip to transmit the first optical signal carrying the first low-frequency message to the first optical module, such as The specific compiled content "difference power 4dB" is compiled as "111100000100"; the first optical receiving chip of the first optical module receives the first optical signal carrying the first low-frequency message, and the first slave MCU parses and obtains the second power difference of 4dB indicated by the first low-frequency message. The second power difference is the power difference that the first optical module can reduce or increase; after receiving the second power difference of 4dB, the first master MCU determines that the first optical module can reduce the transmission power by 4dB, thereby reducing the transmission power value of the first optical module from 3dBm to -1dBm, thereby reducing the power consumption of the first optical module.

[0114] In the optical power adjustment method based on the dual-MCU optical module provided in the embodiment of the present disclosure, the optical module adopts a dual-MCU solution of a master MCU and a slave MCU. The master MCU is responsible for the conventional general function processing of the optical module and is responsible for interacting with the host computer, and the slave MCU is responsible for sending and receiving message information and interacting with the master MCU. The first slave MCU of the transmitting optical module receives a first optical signal carrying a first low-frequency message sent by the receiving optical module, the first master MCU detects the received optical power of the first optical signal, the first master MCU calculates a first power difference between the received optical power and the sensitivity of the transmitting optical module, the first slave MCU loads the first power difference into the second optical signal in the form of a second low-frequency message, and the first slave MCU controls the second optical signal carrying the second low-frequency message to be sent to the receiving optical module; the second slave MCU of the receiving optical module parses the second low-frequency message to obtain the first power difference, the second master MCU obtains the current transmit power of the receiving optical module, and the second master MCU adjusts the transmit power of the receiving optical module to the target transmit power according to the first power difference, so as to adjust the transmit power of the receiving optical module to the most appropriate power, thereby reducing the power consumption between the transmitting optical module and the receiving optical module. The second slave MCU of the receiving optical module receives the second optical signal carrying the second low-frequency message sent by the transmitting optical module, the second slave MCU detects the received optical power of the second optical signal, the second master MCU calculates and obtains a second power difference between the received optical power and the sensitivity of the receiving optical module, the second slave MCU loads the second power difference to the first optical signal in the form of a first low-frequency message, and the second slave MCU controls the first optical signal carrying the first low-frequency message to be sent to the transmitting optical module; the first slave MCU of the transmitting optical module parses the first low-frequency message to obtain the second power difference, the first master MCU obtains the current transmit power of the transmitting optical module, and the first master MCU adjusts the transmit power of the transmitting optical module to the target transmit power according to the second power difference, so as to adjust the transmit power of the transmitting optical module to the most appropriate power, thereby reducing the power consumption between the transmitting optical module and the receiving optical module. The present disclosure adopts dual MCUs, establishes links between the first master MCU and the first slave MCU of the transmitting optical module and the second slave MCU and the second master MCU of the receiving optical module, and obtains a low-frequency message instructing to adjust the transmission power value of the laser transmitting chip through signal transmission between the transmitting optical module and the receiving optical module. The power supply to the laser transmitting chip is automatically adjusted according to the low-frequency message, and the laser transmitting chip can be adjusted to the appropriate transmission power according to the actual optical network conditions, thereby reducing the power consumption between the optical modules at both ends and achieving the optimal power consumption level.

[0115] In a device environment, when optical modules transmit information to each other to control the debugging of transmission parameters, in addition to debugging the transmission power, the wavelength also needs to be debugged.

[0116] As shown in Figures 6 and 7, the optical module provided in the embodiment of the present disclosure includes:

[0117] The optical receiving component 510 is electrically connected to the circuit board 300 and is used to receive the received optical signal carrying the third low-frequency message.

[0118] The microprocessor 320 is provided on the circuit board 300 and is electrically connected to the optical receiving component 510 for receiving the third low frequency message and generating a first wavelength control signal or a second wavelength control signal based on a comparison between the wavelength parameter indicated by the third low frequency message and a preset value.

[0119] The laser emitting chip 410 is electrically connected to the laser driving chip 330 and is used to emit an emission light signal.

[0120] The laser driver chip 330 is electrically connected to the microprocessor 320, and is used to receive a first wavelength control signal and a second wavelength control signal, and adjust the power supply to the laser emission chip according to the first wavelength control signal to coarsely adjust the wavelength of the emitted light signal; and adjust the power supply to the laser emission chip according to the second wavelength control signal to finely adjust the wavelength of the emitted light signal.

[0121] The optical fiber interface corresponds to the laser emission chip 410 and is used to connect to an external optical fiber to transmit the emission light signal.

[0122] In some embodiments, the third low-frequency message indicates the first wavelength of the optical signal transmitted by the opposite optical module, as well as the second wavelength and side mode suppression ratio information of the transmitted optical signal detected by the wavelength tester. Specifically, the third low-frequency message is sent from the first optical module to the second optical module. The microprocessor 320 of the second optical module interprets the third low-frequency message and generates a wavelength control signal based on the third low-frequency message. The laser driver chip 330 of the second optical module adjusts the power supply to the laser transmitting chip 410 based on the wavelength control signal to adjust the wavelength of the transmitted optical signal.

[0123] Since the emission wavelength of the first optical module is fixed and the emission parameters of the second optical module are unknown, to obtain the emission wavelength information of the second optical module, an optical splitter and a wavelength tester are set up in the network connecting the first and second optical modules. The signal light emitted by the second optical module is split into two paths by the optical splitter. One path is transmitted to the first optical module for optical layer data transmission and message channel communication; the other path is transmitted to the wavelength tester, which detects the wavelength and side mode suppression ratio (SMSR) of the optical signal emitted by the second optical module.

[0124] The second wavelength information and side mode suppression ratio (SMSR) information of the second optical module detected by the wavelength tester are loaded into a third low-frequency message, which is then transmitted to the second optical module via the laser emitting chip 410 of the first optical module. The microprocessor 320 of the second optical module parses the third low-frequency message and, based on the third low-frequency message, obtains the first wavelength information of the optical signal transmitted by the laser emitting chip 410 in the first optical module, as well as the second wavelength information and side mode suppression ratio (SMSR) information of the optical signal transmitted by the second optical module detected by the wavelength tester.

[0125] For distributed Bragg reflector (DBR), wavelength control has two parameters: TEC (Thermo Electric Cooler) temperature control and DBR. DBR is the main wavelength adjustment function, which can adjust the wavelength and side mode suppression ratio (SMSR). The wavelength adjustment capability is generally 0.8nm interval; TEC can achieve wavelength fine-tuning, and the adjustment accuracy is generally 0.001nm.

[0126] To perform coarse and fine tuning of the wavelength of the transmitted optical signal, when the third low-frequency message indicates the side mode suppression ratio (SMR) of the transmitted optical signal, the microprocessor 320 generates different wavelength control signals based on a comparison of the SMR with a preset value, where the preset value is the SMR specification value of the second optical module. In certain disclosed embodiments, if the SMR indicated by the third low-frequency message does not meet the preset value, the microprocessor 320 issues a first wavelength control signal; if the SMR indicated by the third low-frequency message meets the preset value, the microprocessor 320 issues a second wavelength control signal.

[0127] After the microprocessor 320 generates a first wavelength control signal based on the comparison between the side mode suppression ratio indicated by the third low-frequency message and the preset value, the laser driving chip 330 adjusts the power supply to the laser emitting chip 410 according to the first wavelength control signal to coarsely adjust the wavelength of the emitted optical signal.

[0128] In some embodiments, the second optical module provided by the embodiment of the present disclosure also includes a semiconductor cooler. When the side mode suppression ratio indicated by the third low-frequency message reaches a composite preset value, the microprocessor 320 calculates a wavelength deviation value based on the first wavelength information and the second wavelength information indicated by the third low-frequency message, and sends a second wavelength control signal based on the wavelength deviation value; the semiconductor cooler is electrically connected to the laser driver chip, and the laser driver chip adjusts the power supply to the semiconductor cooler according to the second wavelength control signal; the laser emitting chip 410 is set on the cooling surface of the semiconductor cooler, and the semiconductor cooler adjusts the temperature of the laser emitting chip to fine-tune the wavelength of the optical emission signal.

[0129] In some disclosed embodiments, because the second optical module has not been factory debugged initially, the wavelength emitted by the second module may be filtered out after passing through the second combiner / demultiplexer, and the light cannot pass through. The first optical module sends a first optical signal carrying the first wavelength information, and the wavelength tester detects no light.

[0130] The first optical signal passes through the first and second combiners / demultiplexers of the corresponding channels and is emitted into the second optical module. After the optical receiving chip of the second optical module receives the first optical signal sent by the first optical module, the microprocessor of the second optical module controls the fixed TEC temperature. This temperature is generally calibrated within a temperature range when the laser is shipped, such as 45-50°C for CH1 and 50-55°C for CHn. The TEC temperature can be configured to an intermediate temperature point.

[0131] The microprocessor controls the driving current sent to the DBR laser to coarsely adjust the wavelength of the optical signal generated by the DBR laser in a step-by-step or binary manner, so that the emission wavelength of the second optical module can pass through the second combiner / demultiplexer and be identified by the wavelength tester. The wavelength information, side mode suppression ratio (SMSR), and other information are measured.

[0132] The first optical module transmits a first optical signal carrying a third low-frequency message to the second optical module via an optical transmitter chip. The microprocessor of the second optical module parses and obtains first wavelength information, second wavelength information, and side mode suppression ratio (SMSR) indicated by the third low-frequency message. The microprocessor then issues a first wavelength control signal to adjust the DBR, thereby adjusting the second wavelength information and the side mode suppression ratio (SMSR) of the optical signal transmitted by the second optical module, so that the side mode suppression ratio (SMSR) of the second optical module meets preset specifications.

[0133] After the side mode suppression ratio SMSR meets the preset specifications, the second optical module continues to receive the first wavelength information sent by the first optical module, the second wavelength information detected by the wavelength tester, and the side mode suppression ratio SMSR information. The microprocessor sends a second wavelength control signal. The laser driver chip controls the drive current sent to the TEC according to the second wavelength control signal to control the set temperature of the TEC to the corresponding value, and fine-tune the wavelength of the optical signal generated by the DBR laser to ensure that the emission wavelength of the second optical module meets the specifications, completing the debugging of the emission wavelength of the second optical module.

[0134] The optical module provided in the embodiment of the present disclosure is a BIDI optical module, that is, it includes a transmitting end optical module (second optical module) and a receiving end optical module (first optical module). Both the transmitting end optical module and the receiving end optical module include an optical receiving component 510, a microprocessor 320, a laser emitting chip 410, a laser driver chip 330 and an optical fiber interface. The optical receiving component interface 510 of the transmitting end optical module receives a received optical signal carrying a third low-frequency message sent by the receiving end optical module. The microprocessor 320 of the transmitting end optical module receives and parses the third low-frequency message, and generates a first wavelength control signal or a second wavelength control signal based on a comparison between a wavelength parameter indicated by the third low-frequency message and a preset value; the laser driver chip 330 of the transmitting end optical module receives the first wavelength control signal and the second wavelength control signal, adjusts the power supply to the laser emitting chip 410 according to the first wavelength control signal to coarsely adjust the wavelength of the emitted optical signal, and adjusts the power supply to the laser emitting chip according to the second wavelength control signal to finely adjust the wavelength of the emitted optical signal, thereby being able to adjust the wavelength of the optical signal emitted by the laser emitting chip 410.

[0135] The present disclosure transmits signals between a transmitting optical module and a receiving optical module. When the wavelength and emission power of the receiving optical module are fixed, a low-frequency message instructing adjustment of the emission wavelength and emission power of the laser emission chip is obtained. The emission wavelength and emission power of the laser emission chip in the transmitting optical module are automatically adjusted according to the low-frequency message, thereby realizing emission parameter adjustment of the transmitting optical module.

[0136] By transmitting information between optical modules and controlling the wavelength and transmit power of each module, the extinction ratio (ER) of the optical module can also be adjusted. To adjust the extinction ratio, the second optical module is first configured to its default initial value. The first optical module then identifies the service bit error rate (BER) received by the first optical module and transmits it to the second optical module via a message channel. The second optical module's microprocessor then uses a step-by-step method to adjust the extinction ratio from small to large, finding the optimal ER that meets the application bit error rate and fixing it.

[0137] After completing the adjustment of wavelength, transmit power, and extinction ratio, the second optical module can adjust the top adjustment circuit to change the transmitted optical power. The first optical module reads the difference in the transmitted optical power change, calculates whether the top adjustment depth is appropriate, and sends it to the second optical module through the message channel.

[0138] In some disclosed embodiments, the modulation depth of the message channel is defined as the difference between the optical power of the "1" level and the optical power of the "0" level, divided by twice the average optical power, and is calculated by the following formula:

[0139] Where, P(1) is the average optical power of the message channel "1" level, in mW; P(0) is the average optical power of the message channel "0" level, in mW.

[0140] P(1) is the actual monitoring power received by the first optical module, and P(0) is also the actual monitoring power received by the first optical module. These two states are actually the two light-emitting states of the first optical module. The second optical module can be fixed in the two light-emitting states respectively, so that the first optical module can measure the two power values ​​of P(1) and P(0).

[0141] Modulate the message channel to a known depth m MC When the P(1) of the second optical module is obtained through the monitoring of the first optical module, the P(0) of the second optical module can be modulated by P(1) and the message channel with a depth m MC Calculate P(0), that is, through the top adjustment circuit, P(1) and m MC P(0) is calculated.

[0142] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: a circuit board; an optical receiving component, electrically connected to the circuit board, for receiving a received optical signal carrying a first low-frequency message; a microprocessor, disposed on the circuit board and electrically connected to the optical receiving component, for receiving the first low-frequency message and issuing a power control signal according to the first low-frequency message; a laser emitting chip, electrically connected to a laser driving chip, for emitting an emitted optical signal; a laser driving chip, electrically connected to the microprocessor, for receiving the power control signal and adjusting the emission power of the laser emitting chip according to the power control signal; an optical fiber interface, corresponding to the laser emitting chip, for connecting to an external optical fiber to transmit the emitted optical signal.

2. The optical module according to claim 1, wherein the first low-frequency message indicates the power of the emitted optical signal or indicates adjusting the emission power of the emitted optical signal.

3. The optical module according to claim 2, wherein the first low-frequency message indicates the power of the emitted optical signal, and the first low-frequency message is generated based on a comparison between the received power of the received signal and a preset value, and the preset value includes an emission power, a sensitivity value, and an overload value, and the emission power, the sensitivity value, and the overload value are all operating parameters of an optical receiving component and a laser emitting chip in a relative-end optical module.

4. The optical module according to claim 3, wherein the first low-frequency message generates a link loss value based on a comparison between the emission power of the relative-end optical module and the received power, generates a minimum emission power based on a comparison between the link loss value and the sensitivity value of the relative-end optical module, and generates a maximum emission power based on a comparison between the link loss value and the overload value of the relative-end optical module.

5. The optical module according to claim 2, wherein the first low-frequency message indicates adjusting the power of the emitted optical signal, and the first low-frequency message is generated based on a comparison between the received power of the received optical signal and a preset value, and the preset value is any value between the sensitivity value and the overload value, and the sensitivity value and the overload value are both operating parameters of an optical receiving component in a relative-end optical module.

6. The optical module according to claim 2, wherein the first low-frequency message indicates adjusting the power of the emitted optical signal, and the first low-frequency message is generated based on a comparison between the received power of the received optical signal and a preset range, and the preset range is any range between the sensitivity value and the overload value, and the sensitivity value and the overload value are both operating parameters of an optical receiving component in a relative-end optical module.

7. The optical module according to any one of claims 1 to 6, wherein the laser driving chip is specifically configured to automatically adjust the emission power level of the laser emitting chip according to the power control signal.

8. The optical module according to claim 7, wherein the microprocessor is further configured to obtain the current emission power level of the laser emitting chip; and obtain a target emission power level according to the power difference indicated by the first low-frequency message and the current emission power level, and issue the power control signal according to the target emission power level.

9. The optical module according to claim 7, wherein the microprocessor is further configured to determine whether the power difference indicated by the first low-frequency message is greater than zero. When the power difference is greater than zero, the emission power level of the laser emission chip is decreased; when the power difference is less than zero, the emission power level of the laser emission chip is increased.

10. The optical module according to any one of claims 1 to 6, wherein the laser driver chip is specifically configured to adjust the power supply to the laser emission chip according to the power control signal, so as to adjust the emission power value of the laser emission chip to a target value.

11. The optical module according to claim 10, wherein the microprocessor is further configured to obtain the current emission power value of the laser emission chip; and obtain a target emission power value according to the power difference indicated by the first low-frequency message and the current emission power value, and issue the power control signal according to the target emission power value.

12. The optical module according to claim 11, wherein the microprocessor is further configured to determine whether the power difference indicated by the first low-frequency message is greater than zero. When the power difference is greater than zero, the emission power value of the laser emission chip is decreased; when the power difference is less than zero, the emission power value of the laser emission chip is increased.

13. The optical module according to any one of claims 1 to 12, wherein the microprocessor comprises a first chip and a second chip that communicate with each other. The first chip receives the first low-frequency message, and the second chip issues the power control signal; The circuit board comprises signal output pins and is electrically connected to an external upper computer; The optical receiving component converts the received optical signal into a high-frequency electrical signal and a first low-frequency electrical signal. The high-frequency electrical signal is transmitted to the signal output pins to transmit high-frequency communication data; the first low-frequency electrical signal is transmitted to the first chip to transmit the first low-frequency message; The first chip issues first communication data to the second chip according to the first low-frequency message, and the second chip issues a power control signal according to the first communication data.

14. An optical module comprising: A circuit board; An optical receiving component, electrically connected to the circuit board, for receiving the emitted optical signal sent by the opposite-end optical module; A microprocessor, disposed on the circuit board and electrically connected to the optical receiving component, for detecting the received power of the emitted optical signal to generate a second low-frequency message; A laser emission chip, for emitting an optical signal carrying the second low-frequency message; An optical fiber interface, corresponding to the laser emission chip, for connecting an external optical fiber to transmit the optical signal.

15. The optical module according to claim 14, wherein the second low-frequency message indicates to adjust the emission power of the emitted optical signal of the opposite-end optical module. The second low-frequency message is based on the difference between the received power of the emitted optical signal and a preset value, and the preset value is any value between the sensitivity value and the overload value. Both the sensitivity value and the overload value are operating parameters of the optical receiving component of the local optical module.

16. The optical module according to claim 15, wherein the circuit board includes a signal input gold finger, which is electrically connected to an external host computer to receive high-frequency communication data; The microprocessor includes a first chip and a second chip that communicate with each other. The second chip detects the received power of the emitted optical signal and generates a second low-frequency message according to the power difference between the received power and the preset value. The first chip controls the laser emission chip to emit an optical signal carrying the second low-frequency message.

17. An optical module, comprising: a circuit board; an optical receiving component, electrically connected to the circuit board, for receiving a received optical signal carrying a third low-frequency message; a microprocessor, disposed on the circuit board and electrically connected to the optical receiving component, for receiving the third low-frequency message, and generating a first wavelength control signal or a second wavelength control signal according to a comparison between the wavelength parameter indicated by the third low-frequency message and a preset value; a laser emission chip, electrically connected to a laser driver chip, for emitting an emitted optical signal; a laser driver chip, electrically connected to the microprocessor, for receiving the first wavelength control signal and the second wavelength control signal, adjusting the power supply to the laser emission chip according to the first wavelength control signal to coarsely adjust the wavelength of the emitted optical signal; and adjusting the power supply to the laser emission chip according to the second wavelength control signal to finely adjust the wavelength of the emitted optical signal; an optical fiber interface, corresponding to the laser emission chip, for connecting to an external optical fiber to transmit the emitted optical signal.

18. The optical module according to claim 17, wherein the third low-frequency message indicates the first wavelength information of the emitted optical signal of the opposite-end optical module, and the second wavelength information and side mode suppression ratio information of the emitted optical signal detected by a wavelength tester.

19. The optical module according to claim 18, wherein the third low-frequency message indicates the side mode suppression ratio of the emitted optical signal. When the side mode suppression ratio does not meet the preset value, the microprocessor issues the first wavelength control signal; when the side mode suppression ratio meets the preset value, the microprocessor issues the second wavelength control signal; wherein, the preset value is the operating parameter of the laser emission chip in the local optical module.

20. The optical module according to claim 19, further comprising: the microprocessor, for calculating a wavelength deviation value according to the first wavelength information and the second wavelength information, and issuing the second wavelength control signal according to the wavelength deviation value; the laser driver chip, electrically connected to a semiconductor cooler, for adjusting the power supply to the semiconductor cooler according to the second wavelength control signal; the semiconductor cooler, on whose cooling surface a laser emission chip is disposed, for adjusting the temperature of the laser emission chip to finely adjust the wavelength of the emitted optical signal.

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