Wire-drawing die cleaning device with self-cleaning function

Abstract

The invention discloses a wire-drawing die cleaning device with a self-cleaning function, the cleaning device comprises a rack, two groups of moving mechanisms, a cleaning mechanism and a grinding mechanism, the moving mechanisms are fixedly connected with the rack, the two groups of moving mechanisms are positioned on two sides of a wire-drawing die, the cleaning mechanism is fixedly connected with the moving mechanisms, and the grinding mechanism is fixedly connected with the rack. The grinding mechanism is fixedly connected with the cleaning mechanism, and the grinding mechanism is used for cleaning metal adhered to the wire drawing die; the cleaning device is used for cleaning the wire-drawing die, firstly, the cleaning mechanism and the grinding mechanism are moved to a cleaning station through the moving mechanism, then the cleaning mechanism is started to remove oil stains and other impurities on the wire-drawing die in a water flow cleaning mode, and then the grinding mechanism is started to remove metal particles adhering to a die hole of the wire-drawing die. And the moving mechanism drives the cleaning mechanism and the grinding mechanism to leave the wire-drawing die, the wire-drawing die does not need to be detached from a production line for cleaning, online cleaning is achieved, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wire drawing die cleaning, in particular to a wire drawing die cleaning device with a self-cleaning function. Background Art

[0002] Metal wire drawing is a process of forcing the material through a drawing die by external force. The cross-section of the drawing die gradually shrinks, so the metal passing through the drawing die will be compressed to obtain the required cross-sectional area shape and size. The winding mechanism is driven by a driving motor to pull the metal wire out of the unwinding mechanism, and the metal wire is drawn to the required size through the drawing die.

[0003] After the wire drawing die is used, there are a certain amount of impurities such as paint and grease in key positions such as the core and feed hole of the wire drawing die. The wire drawing die needs to be cleaned by a cleaning mechanism to ensure the cleanliness of the wire drawing die. However, the existing cleaning method requires the wire drawing die to be disassembled from the device and needs to be installed again after cleaning, which consumes a lot of manpower and material resources, and the production efficiency cannot be guaranteed.

[0004] In addition, when the wire drawing die is in use, the metal wire is deformed under the action of the extrusion force, so some metal particles will adhere to the die hole of the wire drawing die, affecting the smoothness of the surface of the wire drawing die. Summary of the invention

[0005] The object of the present invention is to provide a wire drawing die cleaning device with a self-cleaning function to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: the cleaning device includes a frame, a moving mechanism, a cleaning mechanism and a grinding mechanism. The moving mechanism is fastened to the frame. The moving mechanism is provided with two groups. The two groups of moving mechanisms are located on both sides of the wire drawing die. The cleaning mechanism is fastened to the moving mechanism. The grinding mechanism is fastened to the cleaning mechanism. The grinding mechanism is used to clean the metal adhered to the wire drawing die.

[0007] The frame provides stable support for the cleaning device. When the wire drawing operation is completed, the cleaning device is started to clean the wire drawing die. First, the cleaning mechanism and the grinding mechanism are moved to the cleaning station by the moving mechanism. Then, the cleaning mechanism is started to remove impurities such as oil on the wire drawing die by water cleaning. Then, the grinding mechanism is started to remove metal particles adhering to the die hole of the wire drawing die to restore its surface finish. Finally, the moving mechanism drives the cleaning mechanism and the grinding mechanism to leave the wire drawing die. There is no need to disassemble the wire drawing die from the production line for cleaning, thereby realizing online cleaning and improving work efficiency.

[0008] Furthermore, the moving mechanism includes a first push rod, a reversing seat and a second push rod. The first push rod is tightly connected to the frame, the reversing seat is tightly connected to the output end of the first push rod, the second push rod is tightly connected to the reversing seat, the output end of the second push rod faces the wire drawing die, and the output end of the second push rod is tightly connected to the cleaning mechanism.

[0009] The first push rod is fixed on the frame to provide stable support for the moving mechanism, and the reversing seat is used to connect the first push rod and the second push rod. During cleaning, the first push rod moves to drive the reversing seat and the second push rod to move to the same height of the wire drawing die. The second push rod moves to drive the cleaning mechanism to move toward the wire drawing die, thereby abutting the cleaning mechanism against both sides of the wire drawing die for subsequent cleaning.

[0010] Furthermore, the cleaning mechanism includes a first connecting seat, a second connecting seat, a first cover shell and a second cover shell. The first connecting seat and the second connecting seat are respectively fastened to the output end of the second push rod, the first cover shell is fastened to the first connecting seat, and the second cover shell is fastened to the second connecting seat. The first cover shell is provided with a water inlet hole, which is connected to an external water source. The second cover shell is provided with a water outlet hole. Both the first cover shell and the second cover shell are provided with openings, and the openings face the wire drawing die.

[0011] The first connecting seat and the second connecting seat are used to connect the first cover shell and the second cover shell with the second push rod, so as to drive the first cover shell and the second cover shell to move toward the wire drawing die. Because the cross-section of the first cover shell and the second cover shell is U-shaped and the opening is facing the wire drawing die, when the first cover shell and the second cover shell are abutted against the two sides of the wire drawing die under the drive of the second push rod, a relatively closed cleaning space is formed with the wire drawing die, and then cleaning liquid is injected into the cleaning space through the water inlet hole and discharged through the water outlet hole, so that the cleaning liquid flows continuously in the cleaning space to clean the oil stains on the die hole of the wire drawing die.

[0012] Furthermore, the grinding mechanism includes a cylinder, a movable column, a partition assembly and a guide assembly. The cylinder is fastened to the first connecting seat, the output end of the cylinder is transmission-connected to the movable column, a guide hole is provided on the first cover shell, the movable column is slidingly connected to the guide hole, the partition assembly is slidingly connected to the movable column, and the guide assembly is slidingly connected to the movable column.

[0013] The die hole of the wire drawing die will be rubbed by the metal wire during use, and the hardness of the metal wire is much smaller than that of the wire drawing die. Under the action of the extrusion force, marks will be left on the inner wall of the die hole, that is, some metal particles will adhere to the die hole, and during the wire drawing operation, the metal wire will shake during the winding and unwinding process, so the distribution of metal particles adhering to the inner wall of the die hole is uneven. In the process of cleaning the die hole, the cylinder is actuated to drive the moving column to pass through the guide hole and insert into the die hole. The diameter of the moving column is smaller than the die hole. The partition component divides the cleaning area into several groups to facilitate the subsequent removal of the adhering metal particles. The guide component can shrink the cleaning flow channel at the die hole to speed up the flow rate, thereby improving the cleaning effect.

[0014] Furthermore, the partition assembly includes a moving plate and a telescopic spring, a moving groove is provided on the moving column, the moving plate is slidably connected to the moving groove, a plurality of moving plates are arranged along the circumference of the moving column, one end of the telescopic spring is fastened to the bottom surface of the moving plate, and the other end of the telescopic spring is fastened to the inner wall of the moving groove;

[0015] During cleaning: the end of the moving plate away from the moving column abuts against the inner wall of the wire drawing die.

[0016] To ensure the airtightness between the separated areas of the partition component, when the partition component follows the moving column and is inserted into the die hole of the wire drawing die, the moving plate moves downward along the moving groove, and the telescopic spring is compressed, and the moving plate is pressed against the inner wall of the die hole under the action of the elastic force. Because there are several moving plates, the die hole can be divided into several cleaning areas to facilitate the subsequent cleaning of the adhering metal particles.

[0017] Furthermore, one end of the moving plate away from the cylinder is an inclined surface.

[0018] One end of the movable plate is arranged as an inclined surface, so that the movable plate can be easily inserted into the die hole.

[0019] Furthermore, the guide assembly includes a guide plate, a return spring and a pressure sensor. A guide groove is provided on the movable column. The guide plate is slidably connected to the guide groove. One end of the return spring is firmly connected to the guide plate. The other end of the return spring is firmly connected to the pressure sensor. The pressure sensor is firmly connected to the inner wall of the guide groove. The pressure sensor is externally connected to a detection power supply. Several guide plates are arranged along the circumference of the movable column. Protrusions are provided at the ends of several guide plates away from the cylinder.

[0020] The metal particles adhered to the inner wall of the die hole will increase the surface roughness of the wall, and the greater the roughness, the greater the resistance to water flow, and the flow rate of the water flow will be reduced accordingly. The guide assembly is located between the two movable plates, and the water flow will be divided into several groups and flow out of the die hole under the obstruction of the movable plate. When the water flows through the guide plate, it will drive the guide plate to move under the action of the fluid viscosity resistance, and the water flow will impact the protrusion at one end of the guide plate, thereby pushing the guide plate to move along the guide groove, compressing the reset spring, and transmitting the pressure to the pressure sensor. The pressure sensor can detect the magnitude of this pressure, and the more metal particles adhered to the inner wall of the die hole, the greater the resistance to water flow, the smaller the impact force of the water flow on the guide plate, the shorter the distance the guide plate moves along the guide groove, and the smaller the pressure transmitted to the pressure sensor. By detecting the pressure on the pressure sensor through an external detection power supply, the density of the adhered metal particles in each area of ​​the inner wall of the die hole can be judged. The more areas where metal particles adhere, the smaller the pressure on the pressure sensor.

[0021] Furthermore, a feed channel is provided on the movable column, the inlet of the feed channel is externally connected to the grinding fluid, and the outlet position of the feed channel corresponds to the position of the guide plate.

[0022] In order to remove the metal particles adhering to the inner wall of the die hole, grinding fluid is connected to the feed channel. Driven by the water flow, the abrasive particles in the grinding fluid will rub against the inner wall of the die hole, thereby removing the adhering metal particles. After the grinding is completed, the feed channel is closed, and the cleaning fluid flowing in through the water inlet hole performs self-cleaning on the inner wall of the die hole and the inside of the cleaning mechanism to avoid grinding fluid residue inside.

[0023] Furthermore, the guide assembly also includes a connecting rod and an adjustment plate, one end of the connecting rod is fastened to the guide plate, the other end of the connecting rod is fastened to the adjustment plate, and the adjustment plate is slidably connected to the movable column.

[0024] The connecting rod connects the adjustment plate and the guide plate together, and the guide plate can move along the guide groove under the impact of water flow, thereby driving the adjustment plate to slide along the surface of the moving column, so as to adjust the opening size of the feed channel outlet. The more metal particles adhere, the greater the resistance to water flow, the shorter the distance the guide plate moves, the shorter the distance the adjustment plate moves, the smaller the area covered at the feed channel outlet, and the larger the opening of the feed channel outlet. In this way, the discharge amount of the grinding fluid can be automatically adjusted according to the density of metal particle adhesion in different areas, that is, the grinding degree of different areas can be automatically controlled, so as to ensure uniform grinding and keep the smoothness of the die hole consistent after grinding.

[0025] Compared with the prior art, the beneficial effect achieved by the present invention is that the first push rod and the second push rod cooperate to drive the first cover shell and the second cover shell to move toward the wire drawing die. When the first cover shell and the second cover shell abut against the two sides of the wire drawing die under the drive of the second push rod, a relatively closed cleaning space is formed with the wire drawing die. Then, cleaning liquid is injected into the cleaning space through the water inlet hole, and the cleaning liquid is discharged through the water outlet hole, so that the cleaning liquid continuously flows in the cleaning space to clean the oil stains on the die hole of the wire drawing die. There is no need to disassemble the wire drawing die from the production line for cleaning, thereby realizing online cleaning and improving Working efficiency: The metal particles adhered to the inner wall of the die hole will increase the surface roughness of the wall, and the greater the roughness, the greater the resistance to water flow, and the flow rate of the water flow will be reduced accordingly. The guide component is located between the two moving plates, and the water flow will be divided into several groups and flow out of the die hole under the obstruction of the moving plate. When the water flows through the guide plate, it will drive the guide plate to move under the action of the fluid viscosity resistance, and the water flow will impact the protrusion at one end of the guide plate, thereby pushing the guide plate to move along the guide groove, compressing the reset spring, and transmitting the pressure to the pressure sensor. The pressure sensor can detect the size of this pressure, and the inner wall of the die hole The more metal particles adhered to the guide plate, the greater the resistance to water flow, the smaller the impact force of water flow on the guide plate, the shorter the distance the guide plate moves along the guide groove, and the smaller the pressure transmitted to the pressure sensor. By detecting the pressure applied to the pressure sensor through an external detection power supply, the density of the adhered metal particles in each area of ​​the inner wall of the die hole can be determined. The smaller the pressure, the more adhered metal particles; the connecting rod connects the adjustment plate and the guide plate together, and the guide plate can move along the guide groove under the impact of water flow, thereby driving the adjustment plate to slide along the surface of the moving column, thereby adjusting the outlet of the feed channel. The opening size of the outlet is determined by the amount of metal particles adhering to the feed channel, and the more metal particles adhere, the greater the resistance to water flow, the shorter the distance the guide plate moves, the shorter the distance the adjustment plate moves, the smaller the area covered by the feed channel outlet, and the larger the opening of the feed channel outlet. This can automatically adjust the discharge amount of the grinding fluid according to the density of metal particle adhesion in different areas, that is, automatically control the grinding degree of different areas, thereby ensuring uniform grinding and keeping the smoothness of the mold holes after grinding consistent. When the pressure sensors in each group are subjected to the same pressure, the grinding degree of each area remains consistent, and the grinding process can be ended. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the cleaning mechanism of the present invention;

[0029] Figure 3 is a partial cross-sectional view of the present invention;

[0030] Figure 4 is a schematic diagram of a grinding mechanism of the present invention;

[0031] Figure 5 is a schematic diagram of a mobile column of the present invention;

[0032] Figure 6 yes Figure 5 A partial enlarged view of the A direction;

[0033] Figure 7 yes Figure 5 A local B-direction enlarged view;

[0034] Figure 8 is a partial cross-sectional view of the moving column;

[0035] Fig. 9 yes Figure 8 A local C-direction enlarged view;

[0036] In the figure: 1-frame, 2-moving mechanism, 21-first push rod, 22-reversing seat, 23-second push rod, 3-cleaning mechanism, 31-first connecting seat, 32-second connecting seat, 33-first cover shell, 331-water inlet, 332-guide hole, 34-second cover shell, 341-water outlet, 4-grinding mechanism, 41-cylinder, 42-moving column, 421-moving groove, 422-guide groove, 423-feeding channel, 43-partitioning assembly, 431-moving plate, 432-telescopic spring, 44-guide assembly, 441-guide plate, 4411-protrusion, 442-reset spring, 443-pressure sensor, 444-connecting rod, 445-adjusting plate. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figure 1-9 , the present invention provides a technical solution:

[0039] The cleaning device includes a frame 1, a moving mechanism 2, a cleaning mechanism 3 and a grinding mechanism 4. The moving mechanism 2 is tightly connected to the frame 1. The moving mechanism 2 is provided with two groups. The two groups of moving mechanisms 2 are located on both sides of the wire drawing die. The cleaning mechanism 3 is tightly connected to the moving mechanism 2. The grinding mechanism 4 is tightly connected to the cleaning mechanism 3. The grinding mechanism 4 is used to clean the metal adhered to the wire drawing die.

[0040] The frame 1 provides stable support for the cleaning device. When the wire drawing operation is completed, the cleaning device is started to clean the wire drawing die. First, the cleaning mechanism 3 and the grinding mechanism 4 are moved to the cleaning station by the moving mechanism 2. Then, the cleaning mechanism 3 is started to remove impurities such as oil on the wire drawing die by water cleaning. Then, the grinding mechanism 4 is started to remove metal particles adhering to the die hole of the wire drawing die to restore its surface finish. Finally, the moving mechanism 2 drives the cleaning mechanism 3 and the grinding mechanism 4 to leave the wire drawing die. There is no need to disassemble the wire drawing die from the production line for cleaning, thereby realizing online cleaning and improving work efficiency.

[0041] The moving mechanism 2 includes a first push rod 21, a reversing seat 22 and a second push rod 23. The first push rod 21 is fastened to the frame 1, the reversing seat 22 is fastened to the output end of the first push rod 21, the second push rod 23 is fastened to the reversing seat 22, the output end of the second push rod 23 faces the wire drawing die, and the output end of the second push rod 23 is fastened to the cleaning mechanism 3.

[0042] The first push rod 21 is fixed on the frame 1 to provide stable support for the moving mechanism 2. The reversing seat 22 is used to connect the first push rod 21 and the second push rod 23. During cleaning, the first push rod 21 is actuated to drive the reversing seat 22 and the second push rod 23 to move up to the same height as the wire drawing die. The second push rod 23 is actuated to drive the cleaning mechanism 3 to move toward the direction of the wire drawing die, thereby abutting the cleaning mechanism 3 against both sides of the wire drawing die for subsequent cleaning.

[0043] The cleaning mechanism 3 includes a first connecting seat 31, a second connecting seat 32, a first cover shell 33 and a second cover shell 34. The first connecting seat 31 and the second connecting seat 32 are respectively fastened to the output ends of the second push rod 23. The first cover shell 33 is fastened to the first connecting seat 31, and the second cover shell 34 is fastened to the second connecting seat 32. The first cover shell 33 is provided with a water inlet hole 331, and the water inlet hole 331 is connected to an external water source. The second cover shell 34 is provided with a water outlet hole 341. Both the first cover shell 33 and the second cover shell 34 are provided with openings, and the openings face the wire drawing die.

[0044] The first connecting seat 31 and the second connecting seat 32 are used to connect the first cover shell 33 and the second cover shell 34 with the second push rod 23, so as to drive the first cover shell 33 and the second cover shell 34 to move toward the wire drawing die. Because the cross-section of the first cover shell 33 and the second cover shell 34 is U-shaped and the opening is facing the wire drawing die, when the first cover shell 33 and the second cover shell 34 are abutted against the two sides of the wire drawing die under the drive of the second push rod 23, a relatively closed cleaning space is formed with the wire drawing die, and then cleaning liquid is injected into the cleaning space through the water inlet hole 331, and the cleaning liquid is discharged through the water outlet hole 341, so that the cleaning liquid flows continuously in the cleaning space to clean the oil stains on the die hole of the wire drawing die.

[0045] The grinding mechanism 4 includes a cylinder 41, a movable column 42, a partition assembly 43 and a guide assembly 44. The cylinder 41 is fastened to the first connecting seat 31, and the output end of the cylinder 41 is transmission-connected to the movable column 42. A guide hole 332 is provided on the first cover shell 33. The movable column 42 is slidably connected to the guide hole 332, the partition assembly 43 is slidably connected to the movable column 42, and the guide assembly 44 is slidably connected to the movable column 42.

[0046] The die hole of the wire drawing die will be rubbed by the metal wire during use, and the hardness of the metal wire is much smaller than that of the wire drawing die. Under the action of the extrusion force, marks will be left on the inner wall of the die hole, that is, some metal particles are adhered to the die hole, and during the wire drawing operation, the metal wire will shake during the winding and unwinding process, so the distribution of metal particles adhered to the inner wall of the die hole is uneven. In the process of cleaning the die hole, the cylinder 41 is actuated to drive the movable column 42 to pass through the guide hole 332 and insert into the die hole. The diameter of the movable column 42 is smaller than the die hole. The partition component 43 divides the cleaning area into several groups to facilitate the subsequent removal of the adhered metal particles. The guide component 44 can shrink the cleaning flow channel at the die hole to speed up the flow rate, thereby improving the cleaning effect.

[0047] The partition assembly 43 includes a moving plate 431 and a telescopic spring 432. The moving column 42 is provided with a moving groove 421. The moving plate 431 is slidably connected to the moving groove 421. A plurality of moving plates 431 are arranged along the circumference of the moving column 42. One end of the telescopic spring 432 is fastened to the bottom surface of the moving plate 431, and the other end of the telescopic spring 432 is fastened to the inner wall of the moving groove 421.

[0048] During cleaning: one end of the moving plate 431 away from the moving column 42 abuts against the inner wall of the wire drawing die.

[0049] To ensure the airtightness between the separated areas of the partition component 43, when the partition component 43 follows the moving column 42 to be inserted into the die hole of the wire drawing die, the moving plate 431 moves downward along the moving groove 421, and the telescopic spring 432 is compressed, and the moving plate 431 is pressed against the inner wall of the die hole under the action of the elastic force. Because there are several moving plates 431, the die hole can be divided into several cleaning areas to facilitate the subsequent cleaning of the adhering metal particles.

[0050] One end of the moving plate 431 away from the cylinder 41 is an inclined surface.

[0051] One end of the movable plate 431 is configured as an inclined surface, which can facilitate the insertion of the movable plate 431 into the mold hole.

[0052] The guide assembly 44 includes a guide plate 441, a return spring 442 and a pressure sensor 443. A guide groove 422 is provided on the movable column 42. The guide plate 441 is slidably connected to the guide groove 422. One end of the return spring 442 is firmly connected to the guide plate 441. The other end of the return spring 442 is firmly connected to the pressure sensor 443. The pressure sensor 443 is firmly connected to the inner wall of the guide groove 422. The pressure sensor 443 is externally connected to a detection power supply. Several guide plates 441 are arranged along the circumference of the movable column 42. A protrusion 4411 is provided at one end of the guide plates 441 away from the cylinder 41.

[0053] The metal particles adhered to the inner wall of the die hole will increase the surface roughness of the wall, and the greater the roughness, the greater the resistance to the water flow, and the flow rate of the water flow will be reduced accordingly. The guide component 44 is located between the two moving plates 431, and the water flow will be divided into several groups and flow out of the die hole under the obstruction of the moving plate 431. When the water flow flows through the guide plate 441, the guide plate 441 will be driven to move under the action of the fluid viscosity resistance, and the water flow will impact the protrusion 4411 at one end of the guide plate 441, thereby pushing the guide plate 441 to move along the guide groove 422, compressing the reset spring 442, thereby transmitting the pressure The force sensor 443 measures the pressure. The pressure sensor 443 can detect the size of this pressure. The more metal particles adhered to the inner wall of the mold hole, the greater the resistance to the water flow, the smaller the impact force of the water flow on the guide plate 441, the shorter the distance that the guide plate 441 moves along the guide groove 422, and the smaller the pressure transmitted to the pressure sensor 443. By detecting the size of the pressure applied to the pressure sensor 443 through an external detection power supply, the density of the adhered metal particles in each area of ​​the inner wall of the mold hole can be determined. The more areas where metal particles adhere, the smaller the pressure applied to the pressure sensor 443.

[0054] A feed channel 423 is provided on the moving column 42 . The inlet of the feed channel 423 is externally connected to the grinding fluid. The outlet position of the feed channel 423 corresponds to the position of the guide plate 441 .

[0055] In order to remove the metal particles adhering to the inner wall of the mold hole, a grinding fluid is connected to the feed channel 423. Driven by the water flow, the abrasive particles in the grinding fluid will rub against the inner wall of the mold hole, thereby removing the adhering metal particles. After the grinding is completed, the feed channel 423 is closed, and the cleaning fluid flowing in through the water inlet hole 331 performs self-cleaning on the inner wall of the mold hole and the inside of the cleaning mechanism 3 to avoid grinding fluid residue inside.

[0056] The guide assembly 44 further includes a connecting rod 444 and an adjusting plate 445 . One end of the connecting rod 444 is fastened to the guide plate 441 , and the other end of the connecting rod 444 is fastened to the adjusting plate 445 . The adjusting plate 445 is slidably connected to the moving column 42 .

[0057] The connecting rod 444 connects the adjustment plate 445 and the guide plate 441 together, and the guide plate 441 can move along the guide groove 422 under the impact of the water flow, thereby driving the adjustment plate 445 to slide along the surface of the movable column 42, thereby adjusting the opening size of the outlet of the feed channel 423, and the more metal particles adhere, the greater the resistance to the water flow, the shorter the distance the guide plate 441 moves, the shorter the distance the adjustment plate 445 moves, the smaller the area covered at the outlet of the feed channel 423, and the larger the opening of the outlet of the feed channel 423, thereby realizing automatic adjustment of the discharge amount of the grinding fluid according to the density of metal particle adhesion in different areas, that is, automatically controlling the grinding degree of different areas, thereby ensuring uniform grinding, so that the smoothness of the mold hole after grinding remains consistent.

[0058] Working principle of the present invention: After the wire drawing operation is completed, the cleaning mechanism 3 and the grinding mechanism 4 are moved to the cleaning station through the moving mechanism 2. When the first cover shell 33 and the second cover shell 34 are abutted against the two sides of the wire drawing die under the drive of the second push rod 23, a relatively closed cleaning space is formed with the wire drawing die. Then, the cleaning liquid is injected into the cleaning space through the water inlet hole 331, and the cleaning liquid is discharged through the water outlet hole 341, so that the cleaning liquid continuously flows in the cleaning space to clean the oil stains on the die hole of the wire drawing die. In the process of cleaning the die hole, the cylinder 41 is actuated to drive the moving column 42 to pass through the guide hole 332 and insert In the die hole, after the partition component 43 follows the moving column 42 and is inserted into the die hole of the wire drawing die, the moving plate 431 moves down along the moving groove 421, and the telescopic spring 432 is compressed. Under the action of the elastic force, the moving plate 431 is pressed against the inner wall of the die hole. Because the moving plates 431 are provided with a plurality of them, the die hole can be divided into a plurality of cleaning areas. The water flow will be divided into a plurality of groups and flow out of the die hole under the obstruction of the moving plate 431. When the water flow flows through the guide plate 441, the guide plate 441 will be driven to move under the action of the viscous resistance of the fluid, and the water flow will impact the protrusion 4411 at one end of the guide plate 441, thereby pushing The guide plate 441 moves along the guide groove 422, compressing the return spring 442, thereby transmitting pressure to the pressure sensor 443. The pressure sensor 443 can detect the magnitude of this pressure. The more metal particles adhered to the inner wall of the die hole, the greater the resistance to the water flow, the smaller the impact force of the water flow on the guide plate 441, the shorter the distance the guide plate 441 moves along the guide groove 422, and the smaller the pressure transmitted to the pressure sensor 443. By detecting the magnitude of the pressure received by the pressure sensor 443 through an external detection power supply, the density of the adhered metal particles in each area of ​​the inner wall of the die hole can be determined, and the adhesion of the metal particles can be determined. The more areas are connected, the smaller the pressure on the pressure sensor 443 is, and the more metal particles are adhered, the greater the resistance to the water flow, the shorter the distance the guide plate 441 moves, the shorter the distance the adjustment plate 445 moves, the smaller the area covered by the outlet of the feed channel 423, and the larger the opening of the outlet of the feed channel 423, thereby realizing automatic adjustment of the discharge amount of the grinding fluid according to the density of metal particle adhesion in different areas. After grinding is completed, the feed channel 423 is closed, and the cleaning fluid flowing in through the water inlet hole 331 performs self-cleaning on the inner wall of the mold hole and the inside of the cleaning mechanism 3 to avoid grinding fluid residue inside.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0060] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wire drawing die cleaning device with self-cleaning function, characterized in that: The cleaning device comprises a frame (1), a moving mechanism (2), a cleaning mechanism (3) and a grinding mechanism (4); the moving mechanism (2) is tightly connected to the frame (1); the moving mechanism (2) is provided with two groups, and the two groups of the moving mechanism (2) are located on both sides of the wire drawing die; the cleaning mechanism (3) is tightly connected to the moving mechanism (2); the grinding mechanism (4) is tightly connected to the cleaning mechanism (3); and the grinding mechanism (4) is used to clean the metal adhered to the wire drawing die.

2. A wire drawing die cleaning device with self-cleaning function according to claim 1, characterized in that: The moving mechanism (2) comprises a first push rod (21), a reversing seat (22) and a second push rod (23); the first push rod (21) is firmly connected to the frame (1); the reversing seat (22) is firmly connected to the output end of the first push rod (21); the second push rod (23) is firmly connected to the reversing seat (22); the output end of the second push rod (23) faces the wire drawing die; and the output end of the second push rod (23) is firmly connected to the cleaning mechanism (3).

3. The wire drawing die cleaning device with self-cleaning function according to claim 2, characterized in that: The cleaning mechanism (3) comprises a first connecting seat (31), a second connecting seat (32), a first cover shell (33) and a second cover shell (34); the first connecting seat (31) and the second connecting seat (32) are respectively fastened to the output end of the second push rod (23); the first cover shell (33) is fastened to the first connecting seat (31); the second cover shell (34) is fastened to the second connecting seat (32); a water inlet hole (331) is provided on the first cover shell (333); the water inlet hole (331) is connected to an external water source; the second cover shell (34) is provided with a water outlet hole (341); the first cover shell (33) and the second cover shell (34) are both provided with openings, and the openings face the wire drawing die.

4. The wire drawing die cleaning device with self-cleaning function according to claim 3, characterized in that: The grinding mechanism (4) comprises a cylinder (41), a movable column (42), a partition assembly (43) and a flow guide assembly (44); the cylinder (41) is tightly connected to the first connecting seat (31); the output end of the cylinder (41) is drivingly connected to the movable column (42); a guide hole (332) is provided on the first cover shell (33); the movable column (42) is slidably connected to the guide hole (332); the partition assembly (43) is slidably connected to the movable column (42); and the flow guide assembly (44) is slidably connected to the movable column (42).

5. A wire drawing die cleaning device with self-cleaning function according to claim 4, characterized in that: The partition assembly (43) comprises a moving plate (431) and a telescopic spring (432); a moving groove (421) is provided on the moving column (42); the moving plate (431) is slidably connected to the moving groove (421); a plurality of moving plates (431) are arranged along the circumference of the moving column (42); one end of the telescopic spring (432) is firmly connected to the bottom surface of the moving plate (431); and the other end of the telescopic spring (432) is firmly connected to the inner wall of the moving groove (421); During cleaning: one end of the movable plate (431) away from the movable column (42) abuts against the inner wall of the wire drawing die.

6. A wire drawing die cleaning device with self-cleaning function according to claim 5, characterized in that: One end of the movable plate (431) away from the cylinder (41) is an inclined surface.

7. A wire drawing die cleaning device with self-cleaning function according to claim 6, characterized in that: The guide assembly (44) comprises a guide plate (441), a return spring (442) and a pressure sensor (443); a guide groove (422) is provided on the movable column (42); the guide plate (441) is slidably connected to the guide groove (422); one end of the return spring (442) is firmly connected to the guide plate (441); the other end of the return spring (442) is firmly connected to the pressure sensor (443); the pressure sensor (443) is firmly connected to the inner wall of the guide groove (422); the pressure sensor (443) is externally connected to a detection power supply; a plurality of guide plates (441) are arranged along the circumference of the movable column (42); and a plurality of guide plates (441) are provided with a protrusion (4411) at one end away from the cylinder (41).

8. The wire drawing die cleaning device with self-cleaning function according to claim 7, characterized in that: The movable column (42) is provided with a feed channel (423), the inlet of the feed channel (423) is externally connected to the grinding fluid, and the outlet position of the feed channel (423) corresponds to the position of the guide plate (441).

9. A wire drawing die cleaning device with self-cleaning function according to claim 8, characterized in that: The guide assembly (44) further comprises a connecting rod (444) and an adjustment plate (445), one end of the connecting rod (444) being fixedly connected to the guide plate (441), the other end of the connecting rod (444) being fixedly connected to the adjustment plate (445), and the adjustment plate (445) being slidably connected to the movable column (42).

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