Conductive resin superhard grinding wheel based on double percolation effect and preparation method thereof

Abstract

The application provides a conductive resin superhard grinding wheel based on double percolation effect and a preparation method thereof. First, a sample is taken according to the following formula: 5% conductive filler, 25% superhard abrasive grain, 25-35% resin A in liquid state, 30-40% resin B in powder state and 5% auxiliary filler in terms of volume percentage; then, the preparation of conductive filler / resin A mixed solution, the wetting of resin B and superhard abrasive grain and the adhesion of a layer of conductive filler / resin A compound on the surface of the two are sequentially completed; then, mechanical mixing is carried out, the grinding wheel matrix is formed by pressing, the formed grinding wheel matrix is placed in a furnace together with a mould pressing mould for curing treatment, finally, the grinding wheel matrix is subjected to cutting processing and sharpening treatment, and the conductive resin superhard grinding wheel is prepared. Through the application, the conductive resin superhard grinding wheel with low conductive filler content and high conductivity can be prepared.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of mechanical part processing, in particular to the field of design and preparation of resin super-hard grinding wheels with low content of conductive fillers and excellent electrical conductivity. BACKGROUND

[0002] Grinding-electrolysis combined machining technology is an important means to realize high-performance manufacturing of difficult-to-machine material parts. For example, to realize ultra-precision mirror grinding of hard and brittle materials, Japanese scholars Murata and Ohmori proposed the electrolytic in-process dressing (ELID) grinding technology. This technology utilizes the dynamic balance between electrolytic dressing effect and electrolytic inhibition effect of the oxide layer on the surface of the grinding wheel to continuously dress the grinding wheel so that the protrusion amount of the abrasive grains remains constant, thereby obtaining stable and controllable grinding quality. To improve the grinding efficiency of high-strength and high-toughness alloy materials, American scholar Keeleric developed electrochemical grinding technology. This technology utilizes the anodic electrolysis effect of the workpiece and the mechanical scraping effect of the electrolysis products by the grinding wheel cathode to complete material removal, thereby realizing high-efficiency and high-quality grinding of high-strength and high-toughness alloys.

[0003] Conductive grinding wheels are the key components of grinding-electrolysis combined machining systems, and their performance and adaptability in specific processes determine the final machining quality of the parts. However, the requirement of the system for the conductivity of the grinding wheel makes it necessary to choose metal bond grinding wheels as the grinding tool in the process practice, and the singleness of the available tools severely limits the performance of the grinding-electrolysis combined machining technology.

[0004] Therefore, it is urgent to develop new grinding tools that have excellent electrical conductivity and grinding performance. SUMMARY

[0005] To solve the above technical problems, the present application proposes a preparation method of conductive resin super-hard grinding wheels based on double percolation effect, thereby providing new tools for building grinding-electrolysis combined machining systems.

[0006] The object of the present application is achieved by the following technical solutions:

[0007] The present application provides a preparation method of conductive resin super-hard grinding wheels based on double percolation effect, wherein:

[0008] The preparation method comprises:

[0009] Step S01: Take a sample according to the following formula: conductive fillers 5%, super-hard abrasive grains 25%, liquid resin A 25-35%, powdered resin B 30-40%, and auxiliary fillers 5% by volume percentage;

[0010] Step S02: Preparation of conductive filler / resin A mixture: Add the nano-conductive filler into resin A, stir for a set time, and obtain the filler / resin A mixture;

[0011] Step S03: Wetting of resin B and superhard abrasive particles: Add resin B and superhard abrasive particles into the conductive filler / resin A mixture respectively for wetting, so that a layer of conductive filler / resin A composite adheres to the surfaces of the two;

[0012] Step S04: Mechanical mixing: Pour the wetted resin B, wetted superhard abrasive particles, and auxiliary filler into a mixing container, set the rotation speed and mixing time, and prepare the conductive filler / resin A / resin B / superhard abrasive particle / auxiliary filler mixture;

[0013] Step S05: Pressing and forming the grinding wheel matrix: According to the designed pressing mold, weigh a certain amount of the mixture, fill it into the mold, and place it on the press with a heating plate. The hot-pressing forming is performed by using the constant pressure method to form the grinding wheel matrix;

[0014] Step S06: Curing treatment: Set the curing temperature, place the formed grinding wheel matrix together with the pressing mold in the furnace for curing treatment, so that the conductive filler undergoes conductive percolation in resin A, and the conductive filler / resin A composite system undergoes conductive percolation in resin B;

[0015] Step S07: Grinding wheel pretreatment: Cut the grinding wheel matrix after the curing treatment to ensure the dimensional and geometric tolerances of the grinding wheel. Use a grinding strip to sharpen the cut grinding wheel to obtain the conductive resin superhard grinding wheel.

[0016] More preferably, in the preparation method of the conductive resin superhard grinding wheel based on the double percolation effect:

[0017] The conductive filler includes any one or more of the following materials: carbon nanotubes, nano-carbon black, graphene.

[0018] More preferably, in the preparation method of the conductive resin superhard grinding wheel based on the double percolation effect: the superhard abrasive particles include any one or more of the following materials: diamond, CBN abrasive particles.

[0019] More preferably, in the preparation method of the conductive resin superhard grinding wheel based on the double percolation effect:

[0020] The resin A and resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin.

[0021] More preferably, in the preparation method of the conductive resin superhard grinding wheel based on the double percolation effect:

[0022] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, potassium sulfate.

[0023] The application also provides a conductive resin super-hard grinding wheel based on double percolation effect, wherein the conductive resin super-hard grinding wheel is prepared by the above-mentioned method for preparing a conductive resin super-hard grinding wheel based on double percolation effect.

[0024] The application also provides a conductive resin super-hard grinding wheel based on double percolation effect, wherein:

[0025] The conductive resin super-hard base material is prepared from the following raw materials: conductive filler 5%, super-hard abrasive particles 25%, liquid resin A 25-35%, powdered resin B 30-40%, and auxiliary filler 5% by volume percentage.

[0026] More preferably, in the conductive resin super-hard grinding wheel based on double percolation effect:

[0027] The conductive filler includes any one or more of the following materials: carbon nanotubes, nano-carbon black, and graphene.

[0028] More preferably, in the conductive resin super-hard grinding wheel based on double percolation effect:

[0029] The super-hard abrasive particles include any one or more of the following materials: diamond and CBN abrasive particles.

[0030] More preferably, in the conductive resin super-hard grinding wheel based on double percolation effect:

[0031] The resin A and resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, and polyurethane resin.

[0032] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, potassium sulfate.

[0033] As can be seen from the technical solutions of the application, the application has the following technical effects:

[0034] By the method for preparing a conductive resin super-hard grinding wheel, the conductive filler is added to resin A to cause conductive percolation, and then the conductive filler / resin A composite system is added to resin B to cause conductive percolation, so that a conductive composite material (i.e., conductive filler / resin A / resin B) with a low percolation threshold can be prepared, and the conductive composite material with a low percolation threshold can be used as a grinding wheel binder raw material to further prepare a conductive resin super-hard grinding wheel based on double percolation effect. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 Preparation flowchart of the conductive resin super-hard grinding wheel based on double percolation effect of the present application. DETAILED DESCRIPTION

[0036] The present application will be described in detail below in conjunction with the accompanying drawings and examples.

[0037] Example One

[0038] The present application provides a preparation method of a conductive resin super-hard grinding wheel based on double percolation effect, and the preparation process includes the following steps: formula design, preparation of conductive filler / resin A mixed solution, wetting of resin B (powder) and super-hard abrasive particles, mechanical mixing, compression molding, curing treatment, etc. (as shown in Figure 1 The specific implementation is as follows:

[0039] Step S01: Formula design, the sample is prepared by using the following raw materials, and the conductive filler is 5%, the super-hard abrasive particles are 25%, the resin A (liquid) is 25-35%, the resin B (powder) is 30-40%, and the auxiliary filler is 5% in terms of volume percentage;

[0040] The conductive filler includes any one or more of the following materials: carbon nanotubes, nano-carbon black and graphene;

[0041] The super-hard abrasive particles include any one or more of the following materials: diamond or CBN abrasive particles;

[0042] The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin, etc.;

[0043] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, potassium sulfate, etc.;

[0044] Step S02: Preparation of the conductive filler / resin A mixed solution, the nano-conductive filler is added to the resin A, and stirring is performed for a set time to obtain the filler / resin A mixed solution;

[0045] Step S03: Wetting of the resin B and the super-hard abrasive particles, the resin B and the super-hard abrasive particles are respectively added to the conductive filler / resin A mixed solution for wetting, so that a layer of conductive filler / resin A composite is adhered to the surfaces of the resin B and the super-hard abrasive particles;

[0046] Step S04: Mechanical mixing, the wetted resin B, the wetted super-hard abrasive particles and the auxiliary filler are poured into a mixing container, and a rotation speed and a mixing time are set to prepare the mixed material of the conductive filler / resin A / resin B / super-hard abrasive particles / auxiliary filler;

[0047] Step S05: press molding the grinding wheel base: according to the designed mold, a certain amount of mixture is weighed and filled into the mold, and then placed on a press with a heating plate to perform hot press molding by using a constant pressure method to form the grinding wheel base;

[0048] Step S06: curing treatment: set the curing temperature, and place the formed grinding wheel base together with the mold into a furnace for curing treatment, so that the conductive filler in the resin A occurs conductive percolation, and the conductive filler / resin A composite system in the resin B occurs conductive percolation, and then the whole grinding grain layer has good conductive properties;

[0049] The curing treatment can be performed in a muffle furnace.

[0050] Step S07: grinding wheel pretreatment: cutting processing is performed on the grinding wheel to ensure the size tolerance and shape tolerance of the grinding wheel; and the grinding wheel is sharpened by using a grinding bar (the material can be alumina or silicon carbide) to make the abrasive grains have a certain cutting edge height, so as to obtain the conductive resin superhard grinding wheel.

[0051] The cutting processing can be performed on the grinding wheel by using a numerical control machine tool to ensure the size tolerance and shape tolerance of the grinding wheel.

[0052] Example two:

[0053] The embodiment two of the present application provides a conductive resin superhard grinding wheel based on double percolation effect, and the base material of the grinding wheel is prepared from the following raw materials, and the conductive filler is 5%, the superhard abrasive grain is 25%, the resin A (liquid) is 25-35%, the resin B (powder) is 30-40%, and the auxiliary filler is 5% in terms of volume percentage.

[0054] The conductive filler includes any one or more of the following materials: carbon nanotube, nano carbon black and graphene;

[0055] The superhard abrasive grain includes any one or more of the following materials: diamond or CBN abrasive grain;

[0056] The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin and the like;

[0057] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, potassium sulfate and the like.

[0058] The conductive resin superhard grinding wheel based on double percolation effect is prepared by the preparation method of the embodiment one. Here, no detailed description is given.

[0059] Experiments show that the conductive filler is added to resin A to make it conductive percolation, and then the conductive filler / resin A composite system is added to resin B to make it conductive percolation, so as to prepare a low percolation threshold conductive composite (i.e. conductive filler / resin A / resin B). The low percolation threshold conductive composite can be used as a raw material of the abrasive wheel binder to further prepare a conductive resin superhard abrasive wheel.

[0060] Although the present application has been disclosed with reference to the preferred embodiments, the embodiments are not intended to limit the present application. Any equivalent changes or modifications made without departing from the spirit and scope of the present application shall also fall within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the content defined in the claims of the present application.

Claims

1.A method for preparing a conductive resin super-hard grinding wheel based on double percolation effect, characterized in that: the method comprises the following steps: S01: taking a sample according to the following formula: 5% conductive filler, 25% super-hard abrasive grains, 25-35% resin A in liquid state, 30-40% resin B in powder state, and 5% auxiliary filler; S02: preparing a conductive filler / resin A mixture by adding nano-conductive filler into resin A and stirring for a set time; S03: wetting resin B and super-hard abrasive grains by adding them into the conductive filler / resin A mixture to make their surfaces adhere to a layer of conductive filler / resin A composite; S04: mechanically mixing the wetted resin B, wetted super-hard abrasive grains, and auxiliary filler in a mixing container at a set speed and for a set time to obtain a mixture of conductive filler / resin A / resin B / super-hard abrasive grains / auxiliary filler; S05: pressing the mixture into a grinding wheel base according to a designed mold, weighing a certain amount of the mixture, filling it into the mold, and hot-pressing it into a grinding wheel base on a press with a heating plate by using a constant pressure method; S06: curing the grinding wheel base by setting a curing temperature and placing the formed grinding wheel base and mold into a furnace for curing treatment to make the conductive filler percolate in resin A and the conductive filler / resin A composite percolate in resin B; and S07: pre-treating the grinding wheel by cutting the grinding wheel base after the curing treatment to ensure the size tolerance and form tolerance of the grinding wheel, and sharpening the cut grinding wheel with a grinding strip to obtain a conductive resin super-hard grinding wheel. 2.The method for preparing a conductive resin super-hard grinding wheel based on double percolation effect according to claim 1, characterized in that: the conductive filler comprises any one or more of the following materials: carbon nanotubes, nano-carbon black, and graphene. 3.The method for preparing a conductive resin super-hard grinding wheel based on double percolation effect according to claim 1, characterized in that: the super-hard abrasive grains comprise any one or more of the following materials: diamond and CBN abrasive grains. 4.The method for preparing a conductive resin super-hard grinding wheel based on double percolation effect according to claim 1, characterized in that: the resin A and resin B comprise any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, and polyurethane resin. 5.The method for preparing a conductive resin super-hard grinding wheel based on double percolation effect according to claim 1, characterized in that: the auxiliary filler comprises any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, and potassium sulfate. The conductive resin super-hard grinding wheel is prepared by the method for preparing a conductive resin super-hard grinding wheel based on double percolation effect according to any one of claims 1-5. 7.A conductive resin super-hard grinding wheel based on double percolation effect according to claim 6, characterized in that: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6. A conductive resin super-abrasive wheel based on a dual percolation effect, characterized in that, ​ ​ The base material of the conductive resin superhard is made of the following raw materials, in volume percentage, conductive filler 5%, superhard abrasive grain 25%, liquid resin A 25-35%, powder resin B 30-40%, auxiliary filler 5%. 8.The conductive resin superhard wheel based on double percolation effect according to claim 7, characterized in that: The conductive filler comprises any one or more of the following materials: carbon nanotube, nano carbon black, graphene. 9.The conductive resin superhard wheel based on double percolation effect according to claim 7, characterized in that: The superhard abrasive grain comprises any one or more of the following materials: diamond, CBN abrasive grain. 10.The conductive resin superhard wheel based on double percolation effect according to claim 7, characterized in that: The resin A and resin B comprise any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin; The auxiliary filler comprises any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, zinc sulfate barium, potassium fluoborate and potassium chloride, potassium sulfate.

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