Semiconductor plastic mold capable of preventing glue overflow

Abstract

The invention relates to the technical field of semiconductor processing molds, in particular to a semiconductor plastic mold capable of preventing glue overflowing, an auxiliary device comprises a vertical rod, the vertical rod is fixedly mounted on the surface of a processing seat, the surface of the vertical rod is slidably connected with a bearing seat, a lower mold is fixedly mounted on the surface of the bearing seat, and a sealing groove is formed in the surface of the lower mold; a sealing plate is fixedly installed on the surface of the bottom of the fixing plate, two sliding grooves are formed in the surface of the machining base, sliding blocks are slidably connected into the two sliding grooves, hinge plates are hinged to the surfaces of the ends, away from the sliding grooves, of the sliding blocks, a supporting plate is fixedly installed on the surface of the machining base, and electric telescopic rods are fixedly installed on the surfaces of the two sides of the supporting plate. According to the invention, the problems that the sealing performance of the die is easily reduced and overflow is easily generated during production due to abrasion of a die closing surface because the die is opened and closed for many times in the use process of the existing semiconductor die and the contact surface is abraded by the opening and closing of the die are solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing molds, and in particular to a semiconductor plastic mold for preventing glue overflow. Background Art

[0002] With the development of society, semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Molds are often required in the production of semiconductors.

[0003] During the use of existing semiconductor molds, the opening and closing of the molds are frequent, which causes wear on the contact surfaces and can easily reduce the sealing of the molds. The wear on the mold surfaces can easily lead to overflow during production, incomplete filling of materials, and excess burrs. The excess burrs need to be processed and cut again, which increases the production process and reduces the processing efficiency. Summary of the invention

[0004] The purpose of the present invention is to solve the technical problems in the above background and to propose a semiconductor plastic mold for preventing glue overflow.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a semiconductor plastic mold for preventing glue overflow, comprising a processing seat, the surface of the processing seat is provided with a long groove, the interior of the long groove is slidably connected with a sliding frame, the end of the sliding frame away from the long groove is fixedly installed with a fixed plate, the bottom surface of the fixed plate is fixedly installed with an upper mold, the top surface of the fixed plate is fixedly installed with a feed port, the feed port and the upper mold are connected to each other, the feed port is plugged with a sealing plug, the surface of the processing seat is provided with an auxiliary device, the auxiliary device includes a vertical rod, the vertical rod is fixedly installed on the surface of the processing seat, the surface of the vertical rod is slidably connected with a bearing seat, the surface of the bearing seat is fixedly installed with a lower mold, the surface of the lower mold is provided with a sealing groove, and the bottom surface of the fixed plate is fixedly installed with a sealing plate. The provision of the sealing plate and the sealing groove has the effect of making the upper mold and the lower mold more tightly closed.

[0006] Preferably, the surface of the processing seat is provided with two slide grooves, the interiors of the two slide grooves are slidably connected with sliders, the surface of the slider away from the slide groove is hinged with a hinge plate, and the hinge plate is hinged to the bearing seat at one end away from the slider. The setting of the hinge plate has the effect of driving the bearing seat to move on the surface of the vertical rod.

[0007] Preferably, a support plate is fixedly mounted on the surface of the processing seat, and electric telescopic rods are fixedly mounted on both sides of the support plate, and the output end of the electric telescopic rod is fixedly connected to the slider. The setting of the electric telescopic rod plays the effect of driving the slider to move inside the slide slot.

[0008] Preferably, a moving device is provided on the side of the processing seat, and the moving device includes a strip groove, the strip groove is opened on the side of the processing seat, a U-shaped plate is slidably connected inside the strip groove, and one end of the U-shaped plate away from the strip groove is fixedly connected to the sliding frame. The setting of the U-shaped plate has the effect of driving the sliding frame to move inside the long groove.

[0009] Preferably, a motor is fixedly mounted on the surface of the vertical end of the U-shaped plate, and a gear is fixedly mounted on the output end of the motor. The setting of the motor plays an effect of driving the gear to rotate.

[0010] Preferably, a gear rack is fixedly mounted on the surface of the processing seat, and the gear rack and the gear rack are meshed with each other. The arrangement of the gear rack and the gear rack enables the U-shaped plate to move inside the strip groove.

[0011] Compared with the prior art, the advantages and positive effects of the present invention are: 1. In the present invention, by setting an auxiliary device, when the device needs to be used, first, the two electric telescopic rods are started at the same time, and the two electric telescopic rods are started to drive the two sliders to move in the direction of approaching each other inside the slide groove, and the two sliders move in the direction of approaching each other inside the slide groove to drive the hinged plate to move, and the hinged plate movement pushes the bearing seat to move upward on the surface of the vertical rod, and the bearing seat moves upward on the surface of the vertical rod to drive the lower mold to move upward, and the lower mold moves upward, so that the upper mold and the lower mold are closed, and when the upper mold and the lower mold are closed, the sealing plate will be stuck in the sealing groove, and then the sealing plug will be pulled out, and molding liquid will be added to the feed port, so as to complete the injection molding of the semiconductor product, and through the cooperation of the above structure, the upper mold and the lower mold can be closely fitted under the action of the sealing plate and the sealing groove, thereby preventing the problem of glue overflow during injection molding.

[0012] 2. In the present invention, by setting a moving device, when the injection molding is completed and the position of the upper mold needs to be changed, the motor is started first, and the motor starts to drive the gear to rotate, and the gear rotates and engages with the rack, so that the U-shaped plate moves inside the strip groove, and the movement of the U-shaped plate inside the strip groove drives the sliding frame to move inside the long groove, and the movement of the sliding frame inside the long groove drives the fixed plate to move, and the movement of the fixed plate drives the upper mold to move. When the upper mold moves to a suitable position, the motor can be turned off. Through the cooperation of the above structure, the position of the upper mold can be changed, so that the positions of the upper mold and the lower mold can be staggered, thereby facilitating the demolding of the product completed by injection molding in the lower mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The present invention provides a three-dimensional structural schematic diagram of a semiconductor plastic mold for preventing glue overflow.

[0014] Figure 2 The present invention provides a right side structural schematic diagram of a semiconductor plastic mold for preventing glue overflow.

[0015] Figure 3 The present invention provides a left-side structural schematic diagram of a semiconductor plastic mold for preventing glue overflow.

[0016] Figure 4 The present invention proposes a semiconductor plastic mold for preventing glue overflow Figure 2 Schematic diagram of the structure at A in the middle.

[0017] In the figure: 1. processing seat; 2. auxiliary device; 201. vertical rod; 202. bearing seat; 203. lower mold; 204. sealing groove; 205. sealing plate; 206. slide groove; 207. slider; 208. hinged plate; 209. support plate; 210. electric telescopic rod; 3. moving device; 31. strip groove; 32. U-shaped plate; 33. motor; 34. gear; 35. rack; 4. long groove; 5. sliding frame; 6. fixed plate; 7. upper mold; 8. feed port; 9. sealing plug. DETAILED DESCRIPTION

[0018] The present invention is described below with specific embodiments, but they are not intended to be limiting of the invention.

[0019] Embodiment 1 See also Figure 1-4 The present invention provides a technical solution: a semiconductor plastic mold for preventing glue overflow, comprising a processing seat 1, a long groove 4 is opened on the surface of the processing seat 1, a sliding frame 5 is slidably connected inside the long groove 4, a fixed plate 6 is fixedly installed on the end of the sliding frame 5 away from the long groove 4, an upper mold 7 is fixedly installed on the bottom surface of the fixed plate 6, a feed port 8 is fixedly installed on the top surface of the fixed plate 6, the feed port 8 and the upper mold 7 are connected to each other, and a sealing plug 9 is inserted into the inside of the feed port 8.

[0020] Embodiment 2 See also Figure 1-4 Based on the first embodiment, this embodiment provides specific settings and functions of the auxiliary device 2 and the mobile device 3.

[0021] In this embodiment: an auxiliary device 2 is provided on the surface of the processing seat 1, and the auxiliary device 2 includes a vertical rod 201, which is fixedly installed on the surface of the processing seat 1, and a bearing seat 202 is slidably connected to the surface of the vertical rod 201, and a lower mold 203 is fixedly installed on the surface of the bearing seat 202, and a sealing groove 204 is opened on the surface of the lower mold 203, and a sealing plate 205 is fixedly installed on the bottom surface of the fixed plate 6.

[0022] The provision of the sealing plate 205 and the sealing groove 204 enables the upper mold 7 and the lower mold 203 to be more tightly closed.

[0023] Specifically, two slide grooves 206 are provided on the surface of the processing seat 1, and sliders 207 are slidably connected inside the two slide grooves 206. A hinge plate 208 is hinged on the surface of one end of the slider 207 away from the slide groove 206, and the end of the hinge plate 208 away from the slider 207 is hinged to the supporting seat 202.

[0024] Embodiment 3 See also Figure 1-4 Based on the first and second embodiments, this embodiment provides specific settings and functions of the auxiliary device 2 and the mobile device 3.

[0025] In this embodiment, the setting of the hinged plate 208 has the effect of driving the bearing seat 202 to move on the surface of the vertical rod 201 .

[0026] Specifically, a support plate 209 is fixedly mounted on the surface of the processing seat 1, and electric telescopic rods 210 are fixedly mounted on both sides of the support plate 209, and the output end of the electric telescopic rod 210 is fixedly connected to the slider 207. The setting of the electric telescopic rod 210 has the effect of driving the slider 207 to move inside the slide groove 206.

[0027] A moving device 3 is provided on the side of the processing seat 1. The moving device 3 includes a strip groove 31. The strip groove 31 is opened on the side of the processing seat 1. A U-shaped plate 32 is slidably connected inside the strip groove 31. One end of the U-shaped plate 32 away from the strip groove 31 is fixedly connected to the sliding frame 5. When the injection molding is completed and the position of the upper mold 7 needs to be changed, the motor 33 is first started. The motor 33 starts to drive the gear 34 to rotate. The gear 34 rotates and meshes with the rack 35, so that the U-shaped plate 32 moves inside the strip groove 31. The U-shaped plate 32 moves inside the strip groove 31 to drive the sliding frame 5 to move inside the long groove 4. The sliding frame 5 moves inside the long groove 4 to drive the fixed plate 6 to move. The fixed plate 6 moves and drives the upper mold 7 to move. When the upper mold 7 moves to a suitable position, the motor 33 can be turned off. Through the cooperation of the above structure, the position of the upper mold 7 can be changed, so that the positions of the upper mold 7 and the lower mold 203 can be misaligned, so as to facilitate the demoulding of the product completed by injection molding inside the lower mold 203.

[0028] Specifically, a motor 33 is fixedly mounted on the surface of the vertical end of the U-shaped plate 32 , and a gear 34 is fixedly mounted on the output end of the motor 33 .

[0029] The motor 33 drives the gear 34 to rotate.

[0030] Specifically, a rack 35 is fixedly mounted on the surface of the processing seat 1 , and the gear 34 and the rack 35 are meshed with each other.

[0031] The arrangement of the gear 34 and the rack 35 enables the U-shaped plate 32 to move inside the strip groove 31 .

[0032] Working principle: By setting the auxiliary device 2, when the device needs to be used, first start the two electric telescopic rods 210 at the same time, the two electric telescopic rods 210 start to drive the two sliders 207 to move in the direction of approaching each other inside the slide groove 206, the two sliders 207 move in the direction of approaching each other inside the slide groove 206 to drive the hinge plate 208 to move, the hinge plate 208 moves to push the bearing seat 202 to move upward on the surface of the vertical rod 201, the bearing seat 202 moves upward on the surface of the vertical rod 201 to drive the lower mold The upper mold 203 moves upward, and the lower mold 203 moves upward, so that the upper mold 7 and the lower mold 203 are closed. When the upper mold 7 and the lower mold 203 are closed, the sealing plate 205 will be stuck in the sealing groove 204. Next, the sealing plug 9 is pulled out and the molding liquid is added to the feed port 8 to complete the injection molding of the semiconductor product. Through the cooperation of the above structure, the upper mold 7 and the lower mold 203 can be tightly fitted under the action of the sealing plate 205 and the sealing groove 204, thereby preventing the problem of glue overflow during injection molding.

[0033] When the injection molding is completed and the position of the upper mold 7 needs to be changed, the motor 33 is started first. The motor 33 starts to drive the gear 34 to rotate, and the gear 34 rotates and engages with the rack 35, so that the U-shaped plate 32 moves inside the strip groove 31. The movement of the U-shaped plate 32 inside the strip groove 31 drives the sliding frame 5 to move inside the long groove 4. The movement of the sliding frame 5 inside the long groove 4 drives the fixed plate 6 to move. The movement of the fixed plate 6 drives the upper mold 7 to move. When the upper mold 7 moves to a suitable position, the motor 33 can be turned off. Through the cooperation of the above-mentioned structure, the position of the upper mold 7 can be changed, so that the positions of the upper mold 7 and the lower mold 203 can be staggered, thereby facilitating the demoulding of the product that has been injection molded inside the lower mold 203.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate rather than limit the technical solutions of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the present invention can still be modified or replaced by equivalents. Any modification or partial replacement that does not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A semiconductor plastic mold for preventing glue overflow, comprising a processing seat (1), characterized in that: A long groove (4) is provided on the surface of the processing seat (1), a sliding frame (5) is slidably connected inside the long groove (4), a fixing plate (6) is fixedly mounted on one end of the sliding frame (5) away from the long groove (4), and an upper mold (7) is fixedly mounted on the bottom surface of the fixing plate (6); A feed port (8) is fixedly mounted on the top surface of the fixed plate (6); the feed port (8) and the upper mold (7) are in communication with each other; a sealing plug (9) is inserted into the interior of the feed port (8); and an auxiliary device (2) is provided on the surface of the processing seat (1).

2. A semiconductor plastic mold for preventing glue overflow according to claim 1, characterized in that: The auxiliary device (2) comprises a vertical rod (201), the vertical rod (201) being fixedly mounted on the surface of the processing seat (1), the surface of the vertical rod (201) being slidably connected to a bearing seat (202), a lower mold (203) being fixedly mounted on the surface of the bearing seat (202), a sealing groove (204) being provided on the surface of the lower mold (203), and a sealing plate (205) being fixedly mounted on the bottom surface of the fixing plate (6).

3. A semiconductor plastic mold for preventing glue overflow according to claim 1, characterized in that: The surface of the processing seat (1) is provided with two slide grooves (206), the interiors of the two slide grooves (206) are slidably connected with a slider (207), the surface of one end of the slider (207) away from the slide groove (206) is hinged with a hinge plate (208), and one end of the hinge plate (208) away from the slider (207) is hinged to the bearing seat (202).

4. A semiconductor plastic mold for preventing glue overflow according to claim 1, characterized in that: A support plate (209) is fixedly mounted on the surface of the processing seat (1), and electric telescopic rods (210) are fixedly mounted on both side surfaces of the support plate (209), and the output end of the electric telescopic rod (210) is fixedly connected to the slider (207).

5. The semiconductor plastic mold for preventing glue overflow according to claim 1, characterized in that: A moving device (3) is provided on the side of the processing seat (1), and the moving device (3) comprises a strip groove (31). The strip groove (31) is opened on the side of the processing seat (1), and a U-shaped plate (32) is slidably connected inside the strip groove (31). One end of the U-shaped plate (32) away from the strip groove (31) is fixedly connected to the sliding frame (5).

6. A semiconductor plastic mold for preventing glue overflow according to claim 5, characterized in that: A motor (33) is fixedly mounted on the surface of the vertical end of the U-shaped plate (32), and a gear (34) is fixedly mounted on the output end of the motor (33).

7. A semiconductor plastic mold for preventing glue overflow according to claim 6, characterized in that: A rack (35) is fixedly mounted on the surface of the processing seat (1), and the gear (34) and the rack (35) are meshed with each other.

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