Deposition module, capacitive film vacuum gauge and tool

Abstract

According to the scheme, the deposition module comprises a supporting ring and a plurality of layers of deposition plates, and the supporting ring can be installed at a test port and is provided with an air inlet end and an air outlet end; the multiple layers of deposition plates are arranged in the supporting ring in the axial direction of the supporting ring, an interlayer is formed between every two adjacent deposition plates, and each deposition plate is provided with deposition holes. When the deposition module is used, the deposition module can be mounted at a test port of the capacitive film vacuum gauge, and since the deposition module comprises the multiple layers of deposition plates, process gases firstly collide with one another in the deposition plates and the interlayer before entering the test port to effectively block products formed in the process and corrosion, so that the corrosivity and deposition are reduced; therefore, the influence on the measurement precision, sensitivity and stability of the capacitive film vacuum gauge is reduced, and the service life of the capacitive film vacuum gauge is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of vacuum gauges, and in particular to a deposition module, a capacitive thin film vacuum gauge, and a tooling. Background Art

[0002] A vacuum gauge is an instrument for measuring gas pressure. A capacitive film vacuum gauge uses the displacement of an ultra-thin strain diaphragm due to a pressure difference, causing a change in the capacitance between the ultra-thin strain diaphragm and a fixed electrode. The gas pressure is measured by measuring the capacitance change. The performance of the ultra-thin strain diaphragm is the key to high-precision gas pressure measurement. However, process gases and byproducts formed in the process are corrosive and adhesive. During pressure measurement, these components will directly impact and erode the diaphragm, causing erosion or deposition of contaminants on the ultra-thin strain diaphragm. This will affect the detection of the nanoscale deformation of the diaphragm, causing deviations in the ultra-thin strain diaphragm test, and directly affecting the accuracy, sensitivity and stability of pressure measurement. Furthermore, the service life of the capacitive film vacuum gauge will be shortened.

[0003] Therefore, how to reduce the corrosion and adhesion of process gases and by-products formed in the process to the ultra-thin strain diaphragm and improve the accuracy, sensitivity and stability of the capacitive thin film vacuum gauge measurement has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0004] The present application proposes a deposition module, a capacitive thin film vacuum gauge, and a tooling to reduce the corrosion and adhesion of process gases and by-products formed in the process to the ultra-thin strain diaphragm, and improve the accuracy, sensitivity, and stability of the capacitive thin film vacuum gauge measurement.

[0005] In order to achieve the above objectives, this application discloses the following technical solutions:

[0006] In a first aspect, the present application provides a deposition module for being installed on a test port of a capacitive thin film vacuum gauge, comprising a support ring and a multilayer deposition plate, wherein the support ring can be installed on the test port and has an air inlet end and an air outlet end; the multilayer deposition plate is arranged inside the support ring along the axial direction of the support ring, and a sandwich is formed between adjacent deposition plates, and each deposition plate is provided with a deposition hole.

[0007] In some embodiments, the deposition plate includes a hole region where deposition holes are arranged, and the hole region is distributed over the entire plate or a portion of the deposition plate.

[0008] In some embodiments, the number of deposition plates is four, which are respectively a first deposition plate, a second deposition plate, a third deposition plate and a fourth deposition plate from the air inlet end to the air outlet end.

[0009] In some embodiments, the hole areas of the first deposition plate and the hole areas of the third deposition plate are arranged in a staggered manner.

[0010] In some embodiments, the hole area on the second deposition plate and the hole area on the fourth deposition plate are circular, and the hole area on the second deposition plate is coaxially arranged with the hole area on the fourth deposition plate.

[0011] In some embodiments, the hole area on the second deposition plate is smaller than the hole area on the fourth deposition plate.

[0012] In some embodiments, the air inlet end of the support ring is provided with a limiting portion abutting against the test port.

[0013] In some embodiments, the inner wall of the support ring is provided with a plurality of annular grooves for mounting the deposition plate.

[0014] In some embodiments, the number of annular grooves is greater than the number of deposition plates.

[0015] In a second aspect, the present application provides a capacitive thin film vacuum gauge, comprising a vacuum gauge body and a deposition module, wherein the vacuum gauge body has a test port, and the deposition module is a deposition module such as any of the above items and is arranged at the test port.

[0016] In a third aspect, the present application provides a tooling for installing a deposition module as described above on a test port of a vacuum gauge body of a capacitive thin film vacuum gauge as described above, or

[0017] The tool is used to disassemble the deposition module in any of the capacitive thin film vacuum gauges described above;

[0018] The tooling comprises a holding portion and a clamping portion, wherein the clamping portion is arranged at one end of the holding portion and is used for clamping a support ring of the deposition module.

[0019] In some embodiments, the clamping portion includes an elastic arm connected to the holding portion, a supporting claw supporting the limiting portion, and a clamping claw extending into the annular groove.

[0020] It can be seen from the above technical solution that when the above-mentioned deposition module of the present application is used, it can be installed at the test port of the capacitive thin film vacuum gauge. Since the deposition module includes a multi-layer deposition plate, the process gas first collides with each other in the deposition plate and the interlayer before entering the test port, which effectively blocks the products formed by the process and corrosion, reduces corrosion and deposition, and thus reduces the impact on the accuracy, sensitivity and stability of the capacitive thin film vacuum gauge measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work, and the present application can also be applied to other similar scenarios based on the provided drawings. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0022] Figure 1 A top perspective view of a deposition module provided in an embodiment of the present application;

[0023] Figure 2 A bottom-up stereoscopic diagram of a deposition module provided in an embodiment of the present application;

[0024] Figure 3 An exploded diagram of a deposition module provided in an embodiment of the present application;

[0025] Figure 4 A front view of a deposition module provided in an embodiment of the present application;

[0026] Figure 5 for Figure 4 Sectional view of section AA;

[0027] Figure 6 A top view of a first deposition plate provided in an embodiment of the present application;

[0028] Figure 7 A top view of a second deposition plate provided in an embodiment of the present application;

[0029] Figure 8 A top view of a third deposition plate provided in an embodiment of the present application;

[0030] Fig. 9 A top view of a fourth deposition plate provided in an embodiment of the present application;

[0031] Fig.10 A top perspective view of a capacitive thin film vacuum gauge provided in an embodiment of the present application;

[0032] Fig.11 A bottom-up stereogram of a capacitive thin film vacuum gauge provided in an embodiment of the present application;

[0033] Fig.12 A front view of a capacitive thin film vacuum gauge provided in an embodiment of the present application;

[0034] Fig.13 for Fig.12 Sectional view of the middle BB section;

[0035] Fig.14 A top perspective view of a tool provided in an embodiment of the present application;

[0036] Fig.15 A bottom-up stereoscopic diagram of the tool provided in an embodiment of the present application removing a deposition module from a capacitive thin film vacuum gauge;

[0037] In the figure: 10 - Capacitive thin film vacuum gauge;

[0038] 100-deposition module; 200-vacuum gauge body; 300-tooling;

[0039] 110-support ring; 111-annular groove; 112-limiting portion;

[0040] 120-deposition plate; 121-deposition hole; 122-hole area;

[0041] 210-test tube; 220-housing; 230-electrode; 240-ultra-thin strain film; 250-lead terminal;

[0042] 310 - holding portion; 320 - clamping portion; 321 - elastic arm; 322 - supporting claw; 323 - clamping claw. DETAILED DESCRIPTION

[0043] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It will be understood that the specific embodiments described herein are only used to explain the related application, rather than to limit the application. The described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0044] See also Figures 1 to 5 The present application provides a deposition module 100 for installation at a test port of a capacitive thin film vacuum gauge 10, comprising a support ring 110 and a multilayer deposition plate 120, wherein the support ring 110 can be installed at the test port and has an air inlet end and an air outlet end; the multilayer deposition plate 120 is arranged inside the support ring 110 along the axial direction of the support ring 110, a sandwich is formed between adjacent deposition plates 120, and each deposition plate 120 is provided with a deposition hole 121.

[0045] When the above-mentioned deposition module 100 of the present application is used, it can be installed at the test port of the capacitive thin film vacuum gauge 10. Since the deposition module 100 includes a multi-layer deposition plate 120, the process gas first collides with each other in the deposition plate 120 and the interlayer before entering the test port, which effectively blocks the products formed by the process and corrosion, reduces corrosion and deposition, and thus reduces the impact on the measurement accuracy, sensitivity and stability of the capacitive thin film vacuum gauge 10.

[0046] For the convenience of description, the deposition plate 120 includes a hole area 122 in which deposition holes 121 are arranged. The hole area 122 is arranged on the entire plate or a part of the deposition plate 120. Figures 6 to 8 The mesoporous region 122 is arranged in a part of the deposition plate 120. Fig. 9 The middle hole area 122 is arranged on the whole plate. The deposition holes 121 are centrally arranged on the hole area 122 . The deposition holes 121 can be arranged regularly or randomly. Any area where the deposition holes 121 are centrally arranged can be understood as the hole area 122 . Figures 6 to 9 In the deposition plate 120 shown, the hole area 122 is fan-shaped, fan-ring-shaped or circular. The shape of the hole area 122 may also be other structural forms, such as ring-shaped, rectangular, elliptical, etc.

[0047] The present application changes the flow direction of the process gas entering the deposition module 100 by combining deposition plates 120 with different hole areas 122 .

[0048] This application takes the number of deposition plates 120 as four as an example for illustration:

[0049] See also Figures 3 to 9 , from the air inlet end to the air outlet end, they are respectively the first deposition plate 120a, the second deposition plate 120b, the third deposition plate 120c and the fourth deposition plate 120d.

[0050] The hole areas 122 of the first deposition plate 120 a and the hole areas 122 on the third deposition plate 120 c are arranged alternately. Figure 6 In the embodiment, the hole area 122 of the first deposition plate 120a is located at the 3 o'clock and 9 o'clock positions, Figure 8The hole area 122 of the third deposition plate 120c is shown to be located at the 12 o'clock and 6 o'clock positions to achieve the staggered arrangement of the hole areas 122 on the first deposition plate 120a and the third deposition plate 120c. The process gas enters the interlayer between the first deposition plate 120a and the second deposition plate 120b from the 3 o'clock and 9 o'clock positions, enters the interlayer between the second deposition plate 120b and the third deposition plate 120c from the hole area 122 on the second deposition plate 120b, and enters the interlayer between the third deposition plate 120c and the fourth deposition plate 120d from the 12 o'clock and 6 o'clock positions under the action of the hole area 122 of the third deposition plate 120c, and finally flows out from the hole area 122 of the fourth deposition plate 120d. Due to the staggered arrangement of the hole areas 122 of the third deposition plate 120c and the first deposition plate 120a, the process gas is rotated (clockwise or counterclockwise), thereby increasing the collision area between the process gas and the deposition plate 120.

[0051] It should be noted that Figure 6 and Figure 8 The deposition plate 120 shown includes two hole areas 122. In some other embodiments of the present application, the first deposition plate 120a and the third deposition plate 120c may also have three hole areas 122, four hole areas 122, five hole areas 122, six hole areas 122, and so on.

[0052] In order to further increase the collision area of ​​the process gas, the hole area 122 on the second deposition plate 120b is located in the middle area of ​​the second deposition plate 120b, the hole area 122 on the first deposition plate 120a and the hole area 122 on the third deposition plate 120c are close to the edges of their respective deposition plates 120, and the hole area 122 on the first deposition plate 120a and the hole area 122 on the third deposition plate 120c avoid each other in the axial direction. As a result, the process gas is offset from the edge area to the middle area in the interlayer between the first deposition plate 120a and the second deposition plate 120b; the process gas is offset from the middle area to the edge area in the interlayer between the second deposition plate 120b and the third deposition plate 120c, that is, the offset from edge to middle to edge, combined with the above rotation, thereby achieving the rotational offset of the process gas in the inlet direction, further increasing the collision area of ​​the process gas.

[0053] In order to improve the uniformity of the outflowing gas, in some embodiments of the present application, the hole area 122 on the fourth deposition plate 120d is circular and substantially coincides with the fourth deposition plate 120d.

[0054] The hole area 122 on the second deposition plate 120b is circular and is coaxially arranged with the hole area 122 of the fourth deposition plate 120d. The hole area 122 on the second deposition plate 120b is smaller than the hole area 122 on the fourth deposition plate 120d.

[0055] For the convenience of processing, the hole area 122 on the first deposition plate 120a and the hole area 122 on the third deposition plate 120c are fan rings. To simplify the processing difficulty, the first deposition plate 120a and the third deposition plate 120c have the same shape.

[0056] See also Figure 3 The support ring 110 has two functions: first, it is installed at the test port, and second, it supports the deposition plate 120. To this end, the inner wall of the support ring 110 is provided with a plurality of annular grooves 111 to install the deposition plate 120. The deposition plate 120 is detachably connected to the support ring 110 or non-detachably connected. The deposition plate 120 is an elastic member that can be inserted into the annular groove 111 through slight deformation. When the deposition plate 120 needs to be replaced, the deposition plate 120 is squeezed to separate from the annular groove 111 to remove the deposition plate 120; when the deposition plate 120 needs to be installed, the deposition plate 120 is squeezed to produce a slight deformation and inserted into the annular groove 111.

[0057] It should be noted that the number of the annular grooves 111 is consistent with the number of the deposition plates 120, or the number of the annular grooves 111 is greater than the number of the deposition plates 120, so that the number and spacing of the deposition plates 120 can be adjusted according to needs.

[0058] In order to ensure that the deposition module 100 can be installed in place, the air inlet end of the support ring 110 is provided with a limiting portion 112 that abuts against the test port.

[0059] It should be noted that the deposition module 100 described above in the present application can be applied not only to the capacitive thin film vacuum gauge 10, but also to other scenarios that can block corrosive gases.

[0060] See also Figures 10 to 13 The embodiment of the present application discloses a capacitive thin film vacuum gauge 10, including a vacuum gauge body 200 and a deposition module 100, the vacuum gauge body 200 has a test port, the deposition module 100 is any of the above-mentioned deposition modules 100, and is arranged at the test port.

[0061] The vacuum gauge body 200 includes a test tube 210, a shell 220, an electrode 230, an ultra-thin strain film 240 and a lead terminal 250, wherein the test tube 210 is located at the test port of the shell 220, the electrode 230 is located in the shell 220 and is electrically connected to the lead terminal 250, and the lead terminal 250 is exposed from the shell 220; the ultra-thin strain film 240 is located below the electrode 230.

[0062] Since the capacitive thin film vacuum gauge 10 of the embodiment of the present application is provided with the above-mentioned deposition module 100, the problem that the process gas and the by-products formed impact and corrode the ultra-thin strain membrane 240, thereby affecting the performance of the ultra-thin strain membrane 240 and causing the capacitive thin film vacuum gauge 10 to have low measurement accuracy, poor sensitivity and consistency, poor stability and short life is solved.

[0063] The special flow channel design allows the process gases to collide with each other in the structure, increasing the probability of collision with the surface of the deposition module 100, effectively blocking the process and corrosion, and products formed by the deposition module 100, reducing the corrosiveness and deposition rate.

[0064] The flow channel design can avoid the process byproducts and corrosion, and the deposition module 100 can prevent the process gas flow from being restricted due to the deposition module 100, which may affect the accuracy of the pressure measurement.

[0065] In addition, the above-mentioned deposition module 100 can also be detachably connected to the vacuum gauge body 200 and can be replaced according to needs, thereby improving the structural reliability and the credibility of the measurement results and extending the life of the capacitive thin film vacuum gauge 10.

[0066] To facilitate replacement of the deposition module 100, see Fig.14 The present application provides a tool 300, which is used to install the deposition module 100 as any one of the above items on the test port of the vacuum gauge body 200 of the capacitive thin film vacuum gauge 10 as any one of the above items, or

[0067] The tool 300 is used to disassemble the deposition module 100 in any of the capacitive thin film vacuum gauges 10 described above;

[0068] The tooling 300 includes a holding portion 310 and a clamping portion 320 . The clamping portion 320 is disposed at one end of the holding portion 310 and is used to clamp the support ring 110 of the deposition module 100 .

[0069] As long as the structure that can realize the disassembly and assembly of the deposition module 100 can be understood as the tooling 300, the present application also discloses a specific structure of the tooling 300. Fig.14 See also Fig.15 The clamping portion 320 of the tool 300 includes an elastic arm 321 connected to the holding portion 310 , a supporting claw 322 supporting the limiting portion 112 , and a clamping claw 323 extending into the annular groove 111 .

[0070] When the deposition module 100 needs to be installed, an external force is applied to the elastic arm 321 to make the elastic arm 321 move toward the middle, the air inlet end of the deposition module 100 is placed on the clamping portion 320, and the elastic arm 321 is released. Under the action of its own elastic force, the elastic arm 321 is reset, and the supporting claw 322 is abutted against the limiting portion 112, and the clamping claw 323 is extended into the annular groove 111, thereby realizing the assembly of the deposition module 100 and the tooling 300. Holding the holding portion 310, the deposition module 100 is installed in the test port through the test tube 210, and is installed in place when the limiting portion 112 abuts against the edge of the test port. An external force is applied to the elastic arm 321 to make the elastic arm 321 move toward the middle, and the tooling 300 can be taken out.

[0071] When the deposition module 100 needs to be disassembled, the holding portion 310 is held, and the tooling 300 is moved to the deposition module 100 through the test tube 210. External force is applied to the elastic arm 321 to make the elastic arm 321 move toward the middle. The elastic arm 321 is released. Under the action of its own elastic force, the elastic arm 321 is reset, and the supporting claw 322 is abutted against the limiting portion 112. The clamping claw 323 is extended into the annular groove 111, thereby realizing the assembly of the deposition module 100 and the tooling 300. External force is applied to disengage the deposition module 100 from the test port, and the disassembly of the deposition module 100 is completed.

[0072] In the above, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0073] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0074] It should be noted that, for the convenience of description, only the parts related to the relevant application are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0075] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used, and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. The scope of application involved in the present application is not limited to the technical solution formed by a specific combination of the above-mentioned technical features, but should also cover other technical solutions formed by any combination of the above-mentioned technical features or their equivalent features without departing from the above-mentioned application concept. For example, the above-mentioned features are replaced with the technical features with similar functions disclosed in this application (but not limited to) to form a technical solution.

Claims

1. A deposition module for installation in a test port of a capacitive thin film vacuum gauge, characterized in that: It includes a support ring and a multi-layer deposition plate, wherein the support ring can be installed on the test port and has an air inlet end and an air outlet end; the multi-layer deposition plates are arranged inside the support ring along the axial direction of the support ring, and interlayers are formed between adjacent deposition plates, and each deposition plate is provided with a deposition hole.

2. The deposition module according to claim 1, characterized in that The deposition plate includes a hole area where the deposition holes are arranged, and the hole area is distributed over the entire plate or a part of the deposition plate.

3. The deposition module according to claim 2, characterized in that: The number of the deposition plates is four, which are the first deposition plate, the second deposition plate, the third deposition plate and the fourth deposition plate from the air inlet end to the air outlet end.

4. The deposition module according to claim 3, characterized in that: The hole areas of the first deposition plate and the hole areas on the third deposition plate are arranged alternately.

5. The deposition module according to claim 4, characterized in that: The hole area on the second deposition plate and the hole area on the fourth deposition plate are circular, and the hole area on the second deposition plate is coaxially arranged with the hole area of ​​the fourth deposition plate.

6. The deposition module according to claim 5, characterized in that: The hole area on the second deposition plate is smaller than the hole area on the fourth deposition plate.

7. The deposition module according to any one of claims 1 to 6, characterized in that: The air inlet end of the support ring is provided with a limiting portion abutting against the test port.

8. The deposition module according to any one of claims 1 to 6, characterized in that: The inner wall of the support ring is provided with a plurality of annular grooves for mounting the deposition plate.

9. The deposition module according to claim 8, characterized in that: The number of the annular grooves is greater than the number of the deposition plates.

10. A capacitive thin film vacuum gauge, characterized in that: It comprises a vacuum gauge body and a deposition module, wherein the vacuum gauge body has a test port, and the deposition module is the deposition module as claimed in any one of claims 1 to 9 and is arranged at the test port.

11. A tool, characterized in that: The tool is used to install the deposition module according to any one of claims 1 to 9 on the test port of the vacuum gauge body of the capacitive thin film vacuum gauge according to any one of claims 10, or The tool is used to disassemble the deposition module in the capacitive thin film vacuum gauge according to any one of claims 10; The tooling comprises a holding portion and a clamping portion, wherein the clamping portion is arranged at one end of the holding portion and is used for clamping a support ring of the deposition module.

12. The tooling according to claim 11, characterized in that: The clamping portion comprises an elastic arm connected to the holding portion, a supporting claw supporting the limiting portion, and a clamping claw extending into the annular groove.

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