Fan frame and cooling fan with same

Abstract

The invention relates to a fan frame and a cooling fan with the fan frame. The fan frame comprises a substrate, a fan frame and a fan cover, the frame is formed on the edge of the substrate in an injection molding manner and extends upwards, the frame is provided with at least one stress release structure, and the frame is divided into a plurality of side wall parts by taking the at least one stress release structure as a boundary; and the connecting part is used for at least integrally connecting the upper half parts of the two parts of side wall parts on the two sides of the stress release structure in the vertical direction, and is used for improving the stress deformation of the substrate, improving the flatness of the substrate and reducing the generation of noise at the same time.

Description

Technical Field

[0001] The present application relates to a fan frame and a heat dissipation fan having the fan frame. Background Art

[0002] A centrifugal fan is a commonly used heat dissipation device, which is often used in electronic devices with narrow space and air outlets on the side (such as laptops). During design and production, a frame is generally injection-molded on a metal base. A fan wheel can be set in the space surrounded by the frame, and a top cover can be combined with the upper edge of the frame to accommodate the fan wheel.

[0003] However, the cooling fan used in a narrow space must be thin and lightweight, which results in the base being subjected to the stress of the frame when the frame is injection molded. The thin base will be squeezed by the stress of the frame (due to the temperature change of the molten plastic forming the frame), causing the stress distribution of the base to be uneven and deformed, and finally causing the base to be uneven. In addition, the thin fan limits the configuration space of the impeller, making the gap between the impeller and the base and the upper cover along the axial direction smaller. If the base is uneven, the impeller will collide with the base when rotating, causing the fan to make noise and the fan to run unbalanced, shortening the service life of the existing cooling fan and reducing the fan operation efficiency.

[0004] In order to address the above technical problems, the prior art CN215719808U patent (prior art one) proposes a technical solution, specifically: a plurality of side wall portions are injection-molded at the outer periphery of the bottom plate, the plurality of side wall portions are discontinuous, and there is a gap between the plurality of side wall portions, and the gap is used to provide the plurality of injection-molded side wall portions with expansion and contraction margin, so as to prevent the thermal expansion and contraction of the material after the side wall portions are injection-molded from squeezing the bottom plate, and also effectively reduce the wrapping force generated by the plastic injection and reduce the deformation of the bottom plate. However, this will give rise to new technical problems. Problem 1: The gap directly connects the internal air flow channel with the outside world, which may cause airflow leakage in the fan. Problem 2: Since the multiple side wall portions are discontinuous, the upper ends of the two side wall portions at the gap position are completely independent. When the upper plate is assembled to the upper edge of the side wall portion, the upper edges of the two side wall portions at the gap position are prone to misalignment along the thickness direction. In addition, when the fan wheel rotates at high speed, the upper edges of the two side wall portions at the gap position are prone to vibrate and generate noise.

[0005] Therefore, another solution has emerged in the prior art, such as CN221144831U patent (prior art 2), which mainly attempts to solve the above-mentioned problem 1 in prior art 1. Prior art 2 proposes two technical solutions. Solution 1 is: by designing the gap into a non-straight-through staggered detour groove (refer to the attached patent Figures 1 to 9Embodiment display), to reduce the airflow leakage to the outside of the fan through the gap. Solution 2 is: a bending portion is bent and extended at the edge of the upper cover, the position of the bending portion corresponds to the gap, and the gap is shielded by the bending portion to solve the problem of airflow leakage in the gap. However, compared with the prior art one, the solution one in the prior art two only slightly improves the problem of air leakage in the gap, but does not completely solve the problem, and there are also problems of misalignment of adjacent side wall parts at the gap position and operation vibration. In addition, although the solution two in the prior art two can better solve the problem of airflow leakage in the gap, since the upper cover is generally assembled to the side wall part, there is a tolerance between the surface of the combination position of the bending portion and the side wall part (such as assembly tolerance, design tolerance, etc.), which aggravates the problem of operation vibration, and at the same time cannot solve the problem of misalignment of adjacent side wall parts at the gap position, especially the problem of misalignment and vibration of the upper end edge of the adjacent side wall part at the gap position.

[0006] In view of this, the fan frame of the existing heat dissipation fan still needs to be improved. Summary of the invention

[0007] The purpose of the present application is to provide a fan frame and a heat dissipation fan having the fan frame, which are used to improve the stress deformation of the substrate, improve the flatness of the substrate, and reduce the generation of noise.

[0008] To achieve the above objectives, this application adopts the following technical solutions: A fan frame, characterized by comprising: substrate; A frame is injection molded at the edge of the substrate and extends upward, the frame has at least one stress release structure, and the frame is divided into several side wall portions with the at least one stress release structure as a boundary; The connecting portion at least integrally connects the two side wall portions located on both sides of the stress release structure at the upper half in the up-down direction.

[0009] Furthermore, it also includes: an extension portion, the extension portion being located at an edge of the substrate; The extending portion extends to cover at least a portion of the stress release structure, and the extending portion and the connecting portion separate the inner side and the outer side of the frame.

[0010] Furthermore, the stress release structure is a gap structure that disconnects the frame; The two side edges of the extension part are combined with the side wall part by injection molding, and the extension part and the connection part block the gap structure of the stress release structure.

[0011] Furthermore, along the up-down direction, the height of the connecting portion is not greater than half the height of the frames on both sides of the connecting portion; In the up-down direction, the thickness of the substrate is no greater than one quarter of the height of the frame.

[0012] Further, the frame is combined with the extension portion by injection molding; In the up-down direction, the height of the extension portion is the same as the height of the frames at both sides of the extension portion, and the connecting portion is formed by a thin-walled layer attached to the outer surface of the extension portion; The stress release structure is in the shape of a groove formed by the frame being recessed inwardly at the position where the extension portion is located.

[0013] Furthermore, along the up-down direction, the height of the extension portion is smaller than the height of the frames at both sides of the extension portion, and the connecting portion is combined with the upper edge of the extension portion and is flush with the upper edge of the side wall portion.

[0014] Furthermore, the outer surface of the connecting portion further extends outward to form a thickened portion, and the thickened portion at least covers the outer surface of the upper end edge of the extending portion.

[0015] Furthermore, the inner side surface of the extension portion is flush with the inner side surface of the frame; Along the up-down direction, the height of the extension portion, the height of the thin-walled layer, and the heights of the frames at both sides of the extension portion are all the same.

[0016] Furthermore, the thickness of the thin-walled layer is no greater than half the thickness of the frames on both sides of the extending portion.

[0017] Furthermore, the thickness of the thin-walled layer is not less than 0.2 mm and not more than 0.5 mm, and the thickness of the frame at both sides of the extension portion is not less than 1 mm.

[0018] To achieve the above objectives, this application adopts the following technical solutions: A heat dissipation fan, comprising: a fan frame as described in any one of the above items, wherein the substrate is a base of the heat dissipation fan; A fan wheel is located in the fan frame, and the rotation axis of the fan wheel is perpendicular to the plane of the base plate; An upper cover, combined with an edge of the frame away from the substrate; An air inlet is formed through the upper cover and is located directly above the impeller, and the air inlet is opened along the axial direction of the impeller; An air outlet is formed at one side between the upper cover and the base plate, and the air outlet opens along the radial direction of the impeller.

[0019] The beneficial effects of the present application are as follows: the deformation of the substrate due to stress can be improved, the flatness of the substrate can be improved, and the generation of noise can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present application will be further described below in conjunction with drawings and embodiments.

[0021] Figure 1 It is a three-dimensional schematic diagram of the first embodiment of the heat dissipation fan of the present application.

[0022] Figure 2 yes Figure 1 Top view of the cooling fan.

[0023] Figure 3 yes Figure 1 The partial disassembly diagram of the cooling fan in the middle shows a three-dimensional schematic diagram after the upper cover is separated from the side panel.

[0024] Figure 4 yes Figure 1 A partial disassembly diagram of the cooling fan in the middle, specifically showing a three-dimensional schematic diagram after the upper cover is separated from the side panel and the side panel is separated from the bottom panel.

[0025] Figure 5 It is Figure 2 The cross-sectional view along the AA line is the location of one of the stress relief structures on the side panel.

[0026] Figure 6 yes Figure 5 A magnified view of the structure within the dashed box.

[0027] Figure 7 yes Figure 4 A magnified view of the structure within the dashed box.

[0028] Figure 8 It is a partial disassembly diagram of the second embodiment of the heat dissipation fan of the present application, specifically showing a three-dimensional schematic diagram after the upper cover is separated from the side panel and the side panel is separated from the bottom panel.

[0029] Fig. 9 is a cross-sectional view of the second embodiment of the heat dissipation fan of the present application, and its cross-sectional angle and position are similar to Figure 2 The same as the first embodiment.

[0030] Fig.10 yes Fig. 9 A magnified view of the structure within the dashed box.

[0031] Fig.11 yes Fig.10 A variation of the second embodiment.

[0032] Fig.12 It is a partial disassembly diagram of the third embodiment of the heat dissipation fan of the present application, specifically showing a three-dimensional schematic diagram after the upper cover is separated from the side panel and the side panel is separated from the bottom panel.

[0033] Fig.13is a cross-sectional view of the third embodiment of the heat dissipation fan of the present application, and its cross-sectional angle and position are similar to Figure 2 The same as the first embodiment.

[0034] Fig.14 yes Fig.13 A magnified view of the structure within the dashed box.

[0035] Fig.15 yes Fig.14 A variation of the third embodiment. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0037] Please refer to Figures 1 to 7 As shown, it is a schematic diagram of a first embodiment of a heat dissipation fan disclosed in the present application. Specifically, the heat dissipation fan includes a fan frame (not shown), a fan wheel 3 rotatably assembled in the fan frame, and a stator assembly (not shown). The fan frame includes a substrate 1 (preferably a base of a heat dissipation fan, and the substrate 1 is preferably a metal plate), a frame 2 integrally combined with the outer peripheral edge of the substrate 1 by injection molding, and an upper cover 4 covering the upper edge of the frame 2. An air inlet 41 is formed through the upper cover 4, and an air outlet 201 is formed at a side position between the upper cover 4 and the substrate 1. The fan wheel 3 is located directly below the air inlet 41, and the stator assembly is located directly below the fan wheel 3. A magnetic induction gap is formed between the stator assembly and the fan wheel 3. When in use, the stator assembly generates a magnetic field after being energized to generate a magnetic coupling with the fan wheel 3 and drives the fan wheel 3 to rotate. After the fan wheel 3 rotates, it drives air to be sucked in through the air inlet 41 and blown out through the air outlet 201 to achieve the function of expelling wind and dissipating heat. In the present application, the cooling fan is a centrifugal fan, the rotating shaft (unnumbered) of the impeller 3 is perpendicular to the plane of the substrate 1 , the air inlet 41 is opened along the axial direction of the impeller 3 , and the air outlet 201 is opened along the radial direction of the impeller 3 .

[0038] The outer peripheral edge of the substrate 1 extends upward to form an extension portion 11. The extension portion 11 is embedded and combined in the frame 2 (realized at the same time as the injection molding of the frame 2). Preferably, the inner surface of the extension portion 11 is flush with the inner surface of the frame 2. The outer surface of the frame 2 is formed with a stress release structure 21 at a position corresponding to the extension portion 11. The frame 2 is divided into two side wall portions 20 with the stress release structure 21 as a boundary. The stress release structure 21 can make the injection-molded frame 2 have a deformation margin, so as to prevent the frame 2 from generating stress extrusion on the substrate 1 due to the condensation and shrinkage of the molten plastic material (the hot-melt material forming the frame 2) after injection molding, so that the stress of the frame 2 when it is molded on the substrate 1 can be dispersed, thereby reducing the influence of the frame 2 after injection molding and condensation on the flatness of the substrate 1, thereby improving the flatness of the substrate 1.

[0039] Please refer to Figures 1 to 7 In the first embodiment shown, the stress release structure 21 is a gap structure that disconnects the frame 2. The lower end portion of the gap structure of the frame 2 forming the stress release structure 21 is blocked by the extension portion 11. Among them, along the up and down direction, the height of the extension portion 11 is less than the height of the frame 2 at both sides of the extension portion 11. The upper edge of the extension portion 11 is blocked by a connecting portion 22, and the connecting portion 22 connects the two parts of the side wall portion 20 located on both sides of the stress release structure 21 as a whole. The connecting portion 22 is formed simultaneously when the frame 2 is injection molded. The extension portion 11 and the connecting portion 22 separate the inner side and the outer side of the frame 2, which can prevent the airflow from leaking to the outside of the cooling fan through the gap structure forming the stress release structure 21. The connecting portion 22 can prevent the upper edges of the two side wall portions 20 located on both sides of the stress release structure 21 from being misaligned in the thickness direction, and prevent the upper edges of the side wall portions 20 from being peeled off from both sides of the extension portion 11 (along the radial direction of the impeller 3). During the use of the fan, the upper edges of the two side wall portions 20 located on both sides of the stress release structure 21 are prevented from vibrating (in the radial direction of the impeller 3) and generating noise. In addition, in the present application, the extension portion 11 is formed on the substrate 1, and the substrate 1 and the extension portion 11 are directly integrated with the frame 2 through injection molding, which can avoid the loose fit between the extension portion 11 and the frame 2, make the extension portion 11 more firmly combined with the frame 2, and further avoid or reduce the vibration noise that may occur in the extension portion 11.

[0040] Please refer to Figures 1 to 7As shown, in theory, the connection part 22 is not provided, and the two parts of the side wall part 20 on both sides of the stress release structure 21 are completely disconnected (completely physically disconnected), which is the best solution to improve the stress deformation of the substrate 1. However, the two parts of the side wall part 20 that are completely disconnected will cause technical problems as described in the background technology. Therefore, in the preferred embodiment of the present application, the height of the connection part 22 along the up and down direction is not greater than half of the height of the frame 2 at the corresponding position (that is, the frame 2 at the position connected to the connection part 22) along the up and down direction. In this way, while ensuring that the stress release structure 21 has a good effect on stress dispersion of the substrate 1, it can also prevent the side wall part 20 from vibrating and generating noise. In this way, a balance is achieved, which can effectively improve the flatness of the substrate 1 while solving the technical problems described in the prior art to meet customer needs.

[0041] Figures 1 to 7 In the illustrated embodiment, the thickness of the connecting portion 22 is the same as that of the extending portion 11 , the inner surface of the connecting portion 22 is flush with the inner surface of the extending portion 11 and the inner surface of the frame 2 , and the outer surface of the connecting portion 22 is flush with the outer surface of the extending portion 11 .

[0042] Please refer to Figures 8 to 10 The second embodiment of the present application is shown in FIG. Figures 1 to 7 The only difference between the second embodiment and the first embodiment is the stress release structure 21. The second embodiment actually adds a thin-walled layer 222 structure on the basis of the first embodiment. The thin-walled layer 222 covers the outer surface of the connecting portion 22 and the outer surface of the extending portion 11. In the up and down direction, the height of the thin-walled layer 222 is the same as the height of the frame 2 on both sides of the extending portion 11. The thin-walled layer 222 structure is actively helpful in preventing the side wall portion 20 from vibrating and the side wall portion 20 from peeling off from the connecting portion 22, but it will affect the stress dispersion effect of the stress release structure 21 on the substrate 1 to a certain extent. Therefore, preferably, the thickness of the thin-walled layer 222 is not more than half the thickness of the frame 2 on both sides of the extending portion 11. In the second embodiment, the extending portion 11, the connecting portion 22 and the thin-walled layer 22 separate the inner side and the outer side of the frame 2. Preferably, the thickness of the thin-walled layer 22 is not less than 0.2 mm and not more than 0.5 mm, and the thickness of the frame 2 on both sides of the extending portion 11 is not less than 1 mm.

[0043] Please refer to Figure 11, which is the second embodiment of this application ( Figures 8 to 10), in which the thin-walled layer 222 in the second embodiment is optimized so that the thin-walled layer 222 only covers the outer surface of the connecting portion 22 and the outer surface of the upper edge of the extending portion 11, while the outer surface of the lower edge of the extending portion 11 is not covered by the thin-walled layer 222, thereby achieving the same technical effect as the second embodiment. In this variant embodiment, the thin-walled layer 222 is also called the thickened portion 221 (refer to Fig.11 In this variant embodiment, the extension portion 11, the connection portion 22 and the thin-walled layer 222 separate the inner side and the outer side of the frame 2.

[0044] Please refer to Figure 12 to Figure 14 As shown, it is the third embodiment of the present application. In the third embodiment, along the up-down direction, the height of the extension portion 11 is the same as the height of the frame 2 at the two sides of the extension portion 11 (or the upper edge of the extension portion 11 is flush with the upper edge of the frame 2 at the two sides of the extension portion 11), and the connecting portion 22 is formed by a thin-walled layer 222 attached to the outer surface of the extension portion 11. Compared with the second embodiment, it is equivalent to canceling the connecting portion 22 located above the upper edge of the extension portion 11 in the second embodiment, and the extension portion 11 continues to extend upward to be flush with the upper edge of the frame 2. In the third embodiment, preferably, the thickness of the thin-walled layer 222 is not greater than half of the thickness of the frame 2 at the two sides of the extension portion 11. Preferably, the thickness of the thin-walled layer 222 is not less than 0.2 mm and not more than 0.5 mm, and the thickness of the frame 2 at the two sides of the extension portion 11 is not less than 1 mm. In the third embodiment, the stress release structure 21 is manifested as a groove formed by the outer surface of the frame 2 at the position of the extension portion 11 being inwardly concave and not penetrating. In the third embodiment, along the up-down direction, the height of the extension portion 11, the height of the thin-walled layer 222, and the height of the frame 2 at both sides of the extension portion 11 are the same. Of course, in order to achieve a better effect, the upper edge of the thin-walled layer 222 (the position adjacent to the upper cover 4) can be designed to be thicker, while the upper edge of the thin-walled layer 222 can be designed to be thinner (the reason is that the stress extrusion of the frame 2 on the substrate 1 is mainly concentrated at the lower end of the frame 2). In the third embodiment, the extension portion 11 and the thin-walled layer 222 separate the inner side and the outer side of the frame 2.

[0045] Please refer to Fig.15 As shown, it is the third embodiment of the present application ( Figure 12 to Figure 14) In this variant embodiment, the lower end portion of the thin-walled layer 222 (that is, the connecting portion 22) in the third embodiment is actually cancelled, and only the upper end portion of the thin-walled layer 222 is retained. In this variant embodiment, the extension portion 11 and the thin-walled layer 222 (connecting portion 22) separate the inner side and the outer side of the frame 2. In this variant embodiment, preferably, the thickness of the thin-walled layer 222 is not greater than half of the thickness of the frame 2 on both sides of the extension portion 11. Preferably, the thickness of the thin-walled layer 222 is not less than 0.2 mm and not greater than 0.5 mm, and the thickness of the frame 2 on both sides of the extension portion 11 is not less than 1 mm.

[0046] It should be noted that in certain usage scenarios, when the airflow leaks to the outside of the cooling fan through the gap structure forming the stress release structure 21, the extension portion 11 can be cancelled and only the connecting portion 22 can be formed, which is more conducive to improving the stress deformation of the substrate 1.

[0047] In addition, in other modified embodiments, the extension portion 11 can be set on the upper cover 4, but because the upper cover 4 and the substrate 1 are fixed together by assembly, there will be a problem that the extension portion 11 is not tightly combined with the frame 2. Even so, in this modified embodiment, due to the setting of the connecting portion 22, the problem of noise generated by the vibration of the upper end edges of the two side wall portions 20 located on both sides of the stress release structure 21 can also be solved.

[0048] It is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0049] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. A fan frame, characterized in that: include: substrate(1); A frame (2) is injection-molded at an edge of the substrate (1) and extends upward, the frame (2) having at least one stress release structure (21), and the frame (2) is divided into several side wall portions (20) with the at least one stress release structure (21) as a boundary; The connecting portion (22) integrally connects at least two side wall portions (20) located on both sides of the stress release structure (21) at the upper half in the up-down direction.

2. The fan frame according to claim 1, characterized in that: Also includes: An extension portion (11), the extension portion (11) being located at an edge of the substrate (1); The extension portion (11) extends to cover at least a portion of the stress release structure (21), and the extension portion (11) and the connection portion (22) separate the inner side and the outer side of the frame (2).

3. The fan frame according to claim 2, characterized in that: The stress release structure (21) is a gap structure that disconnects the frame (2); The two side edges of the extension portion (11) are combined with the side wall portion (20) by injection molding, and the extension portion (11) and the connection portion (22) are sealed to form a gap structure of the stress release structure (21).

4. The fan frame according to claim 1, characterized in that: In the up-down direction, the height of the connecting portion (22) is no greater than half the height of the frame (2) on both sides of the connecting portion (22); In the up-down direction, the thickness of the substrate (1) is no greater than one quarter of the height of the frame (2).

5. The fan frame according to claim 2 or 3, characterized in that: The frame (2) is combined with the extension portion (11) by injection molding; In the up-down direction, the height of the extension portion (11) is the same as the height of the frame (2) at both sides of the extension portion (11), and the connection portion (22) is formed by a thin-walled layer (222) attached to the outer surface of the extension portion (11); The stress release structure (21) is in the shape of a groove formed by the frame (2) being recessed inwardly at the location of the extension portion (11).

6. The fan frame according to claim 2 or 3, characterized in that: Along the up-down direction, the height of the extension portion (11) is less than the height of the frame (2) at both sides of the extension portion (11), and the connection portion (22) is coupled to the upper edge of the extension portion (11) and is flush with the upper edge of the side wall portion (20).

7. The fan frame according to claim 6, characterized in that: The outer surface of the connecting portion (22) further extends outward to form a thickened portion (221), and the thickened portion (221) at least covers the outer surface of the upper end edge of the extending portion (11).

8. The fan frame according to claim 5, characterized in that: The inner side surface of the extension portion (11) is flush with the inner side surface of the frame (2); Along the up-down direction, the height of the extension portion (11), the height of the thin-walled layer (222), and the height of the frame (2) at both sides of the extension portion (11) are all the same.

9. The fan frame according to claim 5, characterized in that: The thickness of the thin-walled layer (222) is no greater than half the thickness of the frame (2) on both sides of the extension portion (11).

10. The fan frame according to claim 9, characterized in that: The thickness of the thin-walled layer (222) is not less than 0.2 millimeters and not more than 0.5 millimeters, and the thickness of the frame (2) at both sides of the extension portion (11) is not less than 1 millimeter.

11. A cooling fan, characterized in that: include: The fan frame according to any one of claims 1 to 10, wherein the substrate (1) is a base of a cooling fan; A fan wheel (3) is located in the fan frame, and the rotation axis of the fan wheel (3) is perpendicular to the plane of the base plate (1); An upper cover (4) is combined with an edge of the frame (2) at one end away from the base plate (1); An air inlet (41) is formed through the upper cover (4) and is located directly above the impeller (3), and the air inlet (41) is opened along the axial direction of the impeller (3); An air outlet (201) is formed at a side position between the upper cover (4) and the base plate (1), and the air outlet (201) opens along the radial direction of the impeller (3).

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