Wafer film thickness test tray suitable for wafer test zero point position identification

Abstract

The invention relates to a wafer film thickness test tray suitable for wafer test zero position recognition, which comprises a tray body, a groove is formed in the zero position of the tray body, a module matched with the groove is assembled in the groove, and the module is used for detecting the thickness of the wafer film thickness test tray. The cambered surface, corresponding to the first reflective optoelectronic switch, of the module is coated with a first reflective coating, the side surface, corresponding to the second reflective optoelectronic switch, of the module is coated with a second reflective coating, and the first reflective coating and the second reflective coating are designed in a split mode. According to the tray, the groove is formed in the zero position and filled with the module, the reflective coatings are arranged on the two side faces of the module respectively, the module is convenient to replace and install, special positioning is not needed, direct installation is achieved, and time and labor are saved.

Description

Technical Field

[0001] The invention relates to a wafer film thickness test tray suitable for wafer test zero point position identification, belonging to the technical field of semiconductors. Background Art

[0002] At present, the wafer film thickness test accessory tray is used to locate the zero point of a circle, and then the thickness of the wafer is recorded by rotating the tray to a certain angle (90 / 135, etc.), and the position corresponding to the thickness is located according to the angle. The zero point position is generally located using a reflective photoelectric switch. The reflective material generally uses a soft adhesive-backed material, and a layer of reflective coating is applied on the surface of the soft material to play a reflective role. However, this adhesive-backed pasting method has the following problems: 1. After a long time or after being stained with other solvents, the adhesive backing is easy to debond, causing the material to fall off and the light path to be lost, resulting in the problem that the test position cannot be accurately determined; 2. When the adhesive-backed type is pasted at a curved position, the deformation stress at the curved position increases, causing the pasting position to debond easily, causing the reflected light position to shift and the photoelectric switch to fail, etc., resulting in the problem of being unable to obtain the test position. Summary of the invention

[0003] In view of the above technical problems, the present invention provides a wafer film thickness test tray suitable for wafer test zero point position identification. The tray has a groove at the zero point position and is filled with a module. Reflective coatings are respectively provided on two sides of the module. The module is easy to replace and install, does not require special positioning, and can be directly installed, saving time and effort.

[0004] To achieve the above object, the present invention adopts the following technical solutions: A wafer film thickness test tray suitable for wafer test zero point position identification, comprising: A tray body, wherein a groove is provided at the zero point of the tray body, a module adapted to the groove is installed in the groove, a first reflective coating is coated on the arc surface of the module corresponding to the first reflective photoelectric switch, and a second reflective coating is coated on the side surface of the module corresponding to the second reflective photoelectric switch, and the first reflective coating and the second reflective coating are of split design.

[0005] A wafer film thickness test tray suitable for wafer test zero point position identification, comprising: The tray body has a groove at the zero point of the tray body, and a module matched with the groove is installed in the groove, and the module is a reflective module.

[0006] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the groove is a T-shaped groove, and the module is a T-shaped module.

[0007] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the groove is an L-shaped groove, and the module is an L-shaped module.

[0008] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the module is fastened to the groove.

[0009] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the groove is provided with a threaded hole, and the module is locked with the groove by a top screw; or, The module is locked with the groove by screws.

[0010] The wafer film thickness test tray suitable for wafer test zero point position identification is preferably provided with a reflective coating on the wall surface corresponding to the arc surface of the module of the first reflective photoelectric switch, and the wall surface corresponding to the side surface of the module of the second reflective photoelectric switch is provided with a reflective coating.

[0011] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the reflective coating is a glass bead type reflective film layer or a micro prism type reflective film layer.

[0012] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the first reflective coating and the second reflective coating are glass bead type reflective film layers or micro prism type reflective film layers.

[0013] The present invention adopts the above technical solution, which has the following advantages: 1. The wafer film thickness test tray of the present invention opens a groove at the zero point and fills the module, and a reflective coating is respectively provided on the two sides of the module. The module is easy to replace and install, does not require special positioning, and can be directly installed, saving time and effort.

[0014] 2. The present invention makes the reflective module from reflective material, which can permanently solve the risk of the adhesive backing falling off due to aging. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of an existing wafer film thickness test tray provided by the present invention; Figure 2 A schematic diagram of a wafer film thickness test tray suitable for wafer test zero point position identification provided by an embodiment of the present invention; Figure 3 An exploded diagram of a wafer film thickness test tray suitable for wafer test zero point position identification provided by the embodiment of the present invention; The reference numerals in the figures are as follows: 1-tray body, 101-groove, 102-module; 2-first reflective photoelectric switch; 3-second reflective photoelectric switch. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention is described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work are within the scope of protection of the present invention.

[0017] Unless otherwise defined, the technical or scientific terms used in the present invention shall have the usual meanings understood by persons with ordinary skills in the field to which the present invention belongs. The words "first", "second", "third", "fourth" and similar terms used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" and the like mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0018] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside", "outside", "inner side", "outer side", "below", "above", etc. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures.

[0019] At present, the zero point position of the wafer film thickness test tray is generally located by using a reflective photoelectric switch. The reflective material is generally a soft adhesive material with a reflective coating on the surface of the soft material to reflect light. However, this adhesive-backed pasting method has the following problems: 1. After a long time or after being stained with other solvents, the adhesive backing is easy to debond, causing the material to fall off and the light path to be lost, resulting in the problem that the test position cannot be accurately determined; 2. When the adhesive backing is pasted at a curved position, the deformation stress at the curved position increases, causing the pasting position to debond easily, causing the reflected light position to shift and the photoelectric switch to fail, etc., resulting in the problem of being unable to obtain the test position.

[0020] Based on the above technical problems, the present invention provides a wafer film thickness test tray suitable for wafer test zero point position identification. The tray opens a groove at the zero point position and fills the module with a reflective coating on both sides of the module. The module is easy to replace and install, does not require special positioning, and can be directly installed, saving time and effort.

[0021] like Figure 1 As described above, it is a schematic diagram of an existing wafer film thickness test tray. The existing reflective coating is directly coated at the zero point of the tray. There is a bend at the junction of the arc surface and the upper end surface of the tray. At the bend, due to the increase in deformation stress, the adhesive position is easy to debond, causing the position of the reflected light to shift, which in turn causes the photoelectric switch to fail, resulting in the problem of being unable to obtain the test position. To solve this problem, this application proposes the following solution.

[0022] like Figure 2 , 3 As shown, the wafer film thickness test tray applicable to wafer test zero point position identification according to the present invention comprises: The tray body 1 has a groove 101 at the zero point of the tray body 1, and a module 102 matched with the groove 101 is assembled in the groove 101. The arc surface of the module 102 corresponding to the first reflective photoelectric switch 2 is coated with a first reflective coating, and the side surface of the module 102 corresponding to the second reflective photoelectric switch 3 is coated with a second reflective coating. The first reflective coating and the second reflective coating are split designs.

[0023] Furthermore, a reflective coating is provided on the wall surface of the first reflective photoelectric switch 2 corresponding to the arc surface of the module 102 , and a reflective coating is provided on the wall surface of the second reflective photoelectric switch 3 corresponding to the side surface of the module 102 .

[0024] Specifically, the first reflective coating, the second reflective coating and the reflective coating can be a glass bead type reflective film layer or a micro prism type reflective film layer. Glass bead type reflective film is generally a film structure object composed of multiple layers of different materials such as a surface layer (protective film), a reflective layer (functional layer), a base layer (bearing layer), an adhesive layer and a bottom layer (protective layer). The surface layer of the reflective film is generally composed of a resin film with good light transmittance and weather resistance. The reflective layer has different composition materials according to different types of reflective films, including tiny glass beads, micro prisms or metal reflective coatings, etc. The base layer is mostly a film made of resin organic compounds, the adhesive layer is generally epoxy resin glue, and the bottom layer is a protective layer made of thick paper. The reflection principle of the micro prism type reflective film layer is to use the refraction and reflection of micro prisms.

[0025] The main representative products of micro-prismatic reflective film can be divided into four categories from the perspective of retro-reflective characteristics and structure: truncated prismatic reflective film that focuses on long-distance recognition, truncated prismatic reflective film that focuses on close-range large-angle reading, full prismatic reflective film that takes into account both long-distance recognition performance and close-range reading performance, and new prismatic reflective film that combines these prism technologies with new material technologies. They are new reflective materials that have emerged in recent years to meet the needs of different levels in response to the diversification of application levels. Long-distance truncated micro-prismatic reflective film is the first generation of micro-prismatic reflective film. The front brightness of this type of reflective film is very high. The front brightness of the white film (0.2° / -4°) is generally above 800cd / lx / m, and the distribution of retro-reflected light has no directionality. Whether the reflective film is applied horizontally or vertically, the difference in reflective effect is not much. However, at large incident angles and observation angles, the reflective brightness will be greatly attenuated. The front brightness of the large-angle truncated micro-prismatic reflective film is relatively low, but its reflective brightness will not be greatly attenuated at large incident angles and observation angles. The full prismatic reflective film is a prismatic retro-reflective material made of a full prism structure, which removes the non-reflective part of the traditional micro-prismatic structure, so that the reflective film is composed of a prism structure that can achieve full reflection. It combines the two characteristics of long-distance and large-angle micro-prismatic reflective films. While maintaining high front brightness and easy to find at a long distance, it improves the reflective brightness at large incident angles and observation angles at a distance of 50-250 meters. On the current full prismatic reflective film, after each microcrystalline cube is connected and arranged according to a certain rule, there will be more than 930 units on a square centimeter of material area to control the path of light entry and reflection. The lower layer of the microcrystalline cube corner body is sealed to form an air layer, which uses the diffraction phenomenon of light to make the incident light form internal total reflection, so that the best reflective effect can be achieved without the help of a metal reflective layer. Compared with the traditional engineering-grade and high-intensity-grade reflective films, this reflective film made of wear-resistant and high-hardness polycarbonate material and microcrystalline cube technology not only has doubled its reflective performance, but also greatly improved its large-angle reflective performance. The front brightness of this full-prism reflective film is more than six times that of the engineering-grade, and the front brightness of the white film (0.2° / -4°) is generally above 600cd / lx / m, which is more than twice that of the high-intensity grade, and the retroreflective performance at a large observation angle (0.5° and 2°) is about two to four times higher. The reflective film layer in the present invention is a commonly used known reflective film, which is not specifically limited here.

[0026] Furthermore, if Figure 2As shown, the shape of the groove 101 can be various, for example, the groove 101 is a T-shaped groove, and the corresponding module 102 is a T-shaped module; or, the groove 101 is an L-shaped groove, and the module 102 is an L-shaped module. In a preferred embodiment of the present invention, in order to strengthen the connection between the module 102 and the groove 101, a threaded hole is opened on the side of the groove 101 at a position that does not affect the reflective surface, and then a top screw or screw is used on the side to lock the module 102.

[0027] Furthermore, the entire module 102 may also be made of a reflective material, which can solve the risk of the adhesive backing falling off due to aging for a long time, but the cost is relatively high.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer film thickness test tray suitable for wafer test zero point position identification, characterized in that: include: A tray body (1), wherein a groove (101) is provided at a zero point of the tray body (1), wherein a module (102) adapted to the groove (101) is mounted in the groove (101), wherein a first reflective coating is coated on an arc surface of the module (102) corresponding to a first reflective photoelectric switch (2), and a second reflective coating is coated on a side surface of the module (102) corresponding to a second reflective photoelectric switch (3), wherein the first reflective coating and the second reflective coating are of split design.

2. A wafer film thickness test tray suitable for wafer test zero point position identification, characterized in that: include: A tray body (1), wherein a groove (101) is provided at a zero point position of the tray body (1), wherein a module (102) matching the groove (101) is mounted in the groove (101), and the module (102) is a reflective module.

3. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 1 or 2, characterized in that: The groove (101) is a T-shaped groove, and the module (102) is a T-shaped module.

4. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 1 or 2, characterized in that: The groove (101) is an L-shaped groove, and the module (102) is an L-shaped module.

5. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 1 or 2, characterized in that: The module (102) is firmly connected to the groove (101).

6. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 5, characterized in that: A threaded hole is provided on the groove (101), and the module (102) and the groove (101) are locked by means of a screw; or, The module (102) and the groove (101) are locked by means of screws.

7. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 1, characterized in that: A reflective coating is provided on the wall surface of the first reflective photoelectric switch (2) corresponding to the curved surface of the module (102), and a reflective coating is provided on the wall surface of the second reflective photoelectric switch (3) corresponding to the side surface of the module (102).

8. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 7, characterized in that: The reflective coating is a glass bead type reflective film layer or a micro prism type reflective film layer.

9. The wafer film thickness test tray suitable for wafer test zero point position identification according to claim 1, characterized in that: The first reflective coating layer and the second reflective coating layer are glass bead type reflective film layers or micro prism type reflective film layers.

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