Display panel, preparation method of display panel, display device and photolithography mask

Abstract

The application discloses a display panel, a preparation method of the display panel, a display device and a photoetching mask plate. The display panel comprises a substrate and a flexible touch layer arranged on one side of the substrate. The flexible touch layer comprises a metal layer arranged on one side of the substrate, a dielectric layer arranged on the side of the metal layer away from the substrate, and a transparent conductive layer arranged on the side of the dielectric layer away from the substrate. The projection pattern on the side of the transparent conductive layer away from the dielectric layer is contained in the projection pattern on the side of the transparent conductive layer close to the dielectric layer. The display panel provided by the application is arranged on both sides of the transparent conductive layer in the flexible touch layer, so that the projection pattern on the side of the flexible touch layer away from the substrate is contained in the projection pattern on the side of the flexible touch layer close to the substrate, thereby reducing the included angle between the transparent conductive layer and the dielectric layer, avoiding the problem that the film layer is prone to peeling due to the excessively large edge angle of the transparent conductive layer, and improving the qualification rate of the display panel preparation process.

Description

Technical Field

[0001] This disclosure generally relates to the field of display device technology, and specifically to a display panel, a method for manufacturing the display panel, a display device, and a photomask. Background Technology

[0002] With the rapid development of display technology, active-matrix organic light-emitting diodes (AMOLEDs) are widely used in screen displays.

[0003] For example, during the fabrication of an AMOLED display, a flexible multi-layer on cell (fmloc) can be encapsulated inside the AMOLED display using a negative optical adhesive layer, so that the AMOLED display has both bendability and corrosion resistance.

[0004] However, during the encapsulation process using negative optical adhesive, an undercut structure is easily formed at the exposure boundary. This results in the edge angle of the flexible touch layer being obtuse, which makes the edge of the flexible touch layer a weak point for film peeling during the subsequent film peeling process, causing a loss in the yield of the display panel.

[0005] To address this, the drilling structure formed at the aforementioned boundary positions can be avoided by improving the precision of the photomask. However, this method is costly. Therefore, in the existing technology, the flexible touch layer of the display panel still suffers from a low yield rate due to the excessively large edge angle of the film layer. Summary of the Invention

[0006] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a display panel, a method for manufacturing a display panel, a display device, and a photomask. The display panel provided in this application can reduce the angle between the transparent conductive layer and the dielectric layer by setting the patterns on both sides of the transparent conductive layer in the flexible touch layer, so that the orthographic projection pattern on the side of the flexible touch layer away from the substrate is included in the orthographic projection pattern on the side of the flexible touch layer close to the substrate. This avoids the problem that the film layer is easy to peel off due to the excessive edge angle of the transparent conductive layer, which in turn leads to a low yield of the display panel.

[0007] According to a first aspect of this application, a display panel is provided, including a substrate and a flexible touch layer disposed on one side of the substrate, wherein the flexible touch layer includes a metal layer disposed on one side of the substrate, a dielectric layer disposed on the side of the metal layer away from the substrate, and a transparent conductive layer disposed on the side of the dielectric layer away from the substrate.

[0008] The orthographic projection pattern of the transparent conductive layer on the side away from the dielectric layer is contained within the orthographic projection pattern of the transparent conductive layer on the side closer to the dielectric layer.

[0009] In addition, the display panel of this application may also have the following additional technical features:

[0010] In one possible example, there is an angle of less than 90° between one edge of the transparent conductive layer and the dielectric layer in the circumferential direction.

[0011] In one possible example, the circumferential edge of the transparent conductive layer is a concave arc surface.

[0012] In one possible example, the angle between one circumferential edge of the transparent conductive layer and the dielectric layer is less than 45°.

[0013] In one possible example, the projection pattern of the transparent conductive layer in the direction perpendicular to the orthographic projection direction is a right trapezoid.

[0014] According to a second aspect of this application, a method for manufacturing a display panel is provided, the method comprising:

[0015] A metal layer is prepared on one side of the substrate;

[0016] A dielectric layer is formed on the side of the metal layer away from the substrate;

[0017] A transparent conductive material is disposed on the side of the dielectric layer away from the substrate, and the transparent conductive material in a predetermined area is removed to form a transparent conductive layer; wherein, the stacked metal layer, the dielectric layer and the transparent conductive layer form a flexible touch layer, and the orthographic projection pattern of the transparent conductive layer on the side away from the dielectric layer is included in the orthographic projection pattern of the transparent conductive layer on the side close to the dielectric layer.

[0018] In addition, the method for manufacturing the display panel of this application may also have the following additional technical features:

[0019] In one possible example, removing the transparent conductive material within the preset area includes:

[0020] The transparent conductive material is exposed and developed using a photomask with a preset pattern to remove the transparent conductive material corresponding to the masked area of ​​the photomask.

[0021] According to a third aspect of this application, a display device is provided, the display device including the display panel described in the first aspect.

[0022] According to a fourth aspect of this application, a photomask is provided, which is used in the method for fabricating a display panel as described in the second aspect. The photomask includes a first cutout area and a second cutout area arranged side by side, and the area of ​​the photomask other than the first cutout area and the second cutout area is the masking area of ​​the photomask.

[0023] The orthographic projection patterns of the first and second cutout areas are both contained within a preset orthographic projection pattern of the transparent conductive layer on the side closer to the substrate in the display panel. The orthographic projection pattern of the first cutout area is the same as the preset orthographic projection pattern of the transparent conductive layer on the side away from the substrate. The first cutout area and the second cutout area are spaced apart by a preset distance along the vertical direction of the orthographic projection direction.

[0024] In addition, the photomask of this application may also have the following additional technical features:

[0025] In one possible example, the preset interval between the first hollowed-out area and the second hollowed-out area is 6~13um.

[0026] In one possible example, along the arrangement direction of the first and second perforated areas, the width of the second perforated area is 6~9µm.

[0027] Compared to existing flexible touch layers where there is a large angle between the transparent conductive layer and the dielectric layer, the display panel, display panel fabrication method, display device, and photomask provided in this application embodiment can use a photomask with a preset pattern to set the patterns on both sides of the transparent conductive layer in the flexible touch layer. This ensures that the orthographic projection pattern on the side of the flexible touch layer away from the substrate is included within the orthographic projection pattern on the side of the flexible touch layer closer to the substrate. This reduces the angle between the transparent conductive layer and the dielectric layer closer to the substrate, avoiding the problem of easy film peeling due to the excessively large edge angle of the transparent conductive layer, which leads to a low yield of the display panel and improves the yield of the display panel fabrication process.

[0028] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0029] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0030] Figure 1 A cross-sectional schematic diagram of a conventional display panel 10 provided for an embodiment of this application;

[0031] Figure 2 A top view of a conventional photomask 20 provided for an embodiment of this application;

[0032] Figure 3 One of the cross-sectional schematic diagrams of the display panel 30 provided in the embodiments of this application;

[0033] Figure 4 A second cross-sectional schematic diagram of the display panel 30 provided in an embodiment of this application;

[0034] Figure 5 A schematic flowchart illustrating the method for manufacturing the display panel 30 provided in this embodiment of the application;

[0035] Figure 6 This is one of the schematic diagrams illustrating the process of manufacturing the display panel 30 provided in the embodiments of this application;

[0036] Figure 7 This is a second schematic diagram illustrating the process of manufacturing the display panel 30 provided in this application embodiment;

[0037] Figure 8 This is the third schematic diagram illustrating the process of manufacturing the display panel 30 provided in the embodiments of this application;

[0038] Figure 9 This is the fourth schematic diagram illustrating the process of manufacturing the display panel 30 provided in the embodiments of this application;

[0039] Figure 10 A top view of the photomask 40 provided in an embodiment of this application;

[0040] Figure 11 A schematic diagram of the structure of a computer device provided in an embodiment of this application;

[0041] In the above image:

[0042] 10 - Existing display panel; 101 - Substrate; 102 - Metal layer; 103 - Dielectric layer; 104 - Transparent conductive layer; 105 - Drilling structure; 20 - Existing photomask; 201 - Light-transmitting area; 202 - Light-shielding area; 30 - Display panel; 301 - Substrate; 302 - Flexible touch layer; 3021 - Metal layer; 3022 - Dielectric layer; 3023 - Transparent conductive layer; 40 - Photomask; 401 - First cutout area; 402 - Second cutout area; 403 - Blocking area. Detailed Implementation

[0043] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments. Furthermore, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The terms "first" and "second," etc., in the specification and claims of the embodiments of this application are used to distinguish different objects, not to describe a specific order of objects.

[0045] With the rapid development of display technology, active-matrix organic light-emitting diodes (AMOLEDs) are widely used in screen displays.

[0046] For example, in the fabrication process of an AMOLED display, a flexible multi-layer on cell (FMLOC) can be encapsulated inside the AMOLED display using a negative optical adhesive layer, enabling the AMOLED display to be both flexible and corrosion-resistant. The flexible touch layer achieves its touchability through a capacitor formed by two layers of metal patterns.

[0047] However, during the encapsulation process using negative optical adhesive, an undercut structure is easily formed at the exposure boundary. This results in the edge angle of the flexible touch layer being obtuse, which makes the edge of the flexible touch layer a weak point for film peeling during the subsequent film peeling process, causing a loss in the yield of the display panel.

[0048] For example, Figure 1 This is one of the cross-sectional schematic diagrams of the existing display panel 10 provided in the embodiments of this application, such as... Figure 1 As shown, the display panel 10 includes a substrate 101, a metal layer 102 disposed on one side of the substrate 101, a dielectric layer 103 disposed on the side of the metal layer 102 away from the substrate 101, and a transparent conductive layer 104 disposed on the side of the dielectric layer 103 away from the substrate 101.

[0049] For example, when preparing the transparent conductive layer 104, a whole layer of transparent conductive material can be first deposited on the side of the dielectric layer 103 away from the substrate 101, and then a method such as... Figure 2 The photomask 20 shown exposes and develops the entire layer of transparent conductive material to obtain, as shown... Figure 1 The transparent conductive layer 104 shown.

[0050] Specifically, such as Figure 2 As shown, the photomask 20 is composed of a light-transmitting area 201 and a light-blocking area 202. The pattern of the light-transmitting area 201 is the same as the preset orthographic projection pattern of the transparent conductive layer 104 in the display panel 10.

[0051] It should be noted that the reference Figure 2 Since the boundary of the light-transmitting area 201 is directly the light-blocking area 202, when exposing the transparent conductive material using the photomask 20, refer to... Figure 3 The cross-sectional diagram shown illustrates that, because light shines directly onto the transparent conductive material from the light-transmitting area 201 of the photomask 20, it can easily cause the transparent conductive material to exhibit phenomena such as... at the boundary between the light-transmitting area 201 and the light-shielding area 202. Figure 1 The drilled structure 105 shown can easily lead to a gap between the transparent conductive layer 104, which is formed on the side of the dielectric layer 103 away from the substrate 101, and the dielectric layer 103 at its edge position, as shown in the diagram. Figure 1 The larger included angle shown.

[0052] As a result, the curing effect at the edge of the transparent conductive layer 104 is poor, which makes the edge of the transparent conductive layer 104 a weak point in the subsequent film peeling process, resulting in a low pass rate of the display panel 10.

[0053] To address the aforementioned issues, in one embodiment, the drilling structure 105 formed at the aforementioned boundary position can be avoided by improving the precision of the photomask 20. However, this method is costly. Therefore, the flexible touch layer in existing display panels still suffers from a low yield rate due to excessively large edge angles of the film layer.

[0054] Based on this, this application proposes a display panel that can reduce the angle between the transparent conductive layer and the dielectric layer by setting the patterns on both sides of the transparent conductive layer in the flexible touch layer, so that the orthographic projection pattern on the side of the flexible touch layer away from the substrate is included in the orthographic projection pattern on the side of the flexible touch layer close to the substrate. This avoids the problem that the film layer is easy to peel off due to the excessive edge angle of the transparent conductive layer, which in turn leads to a low yield of the display panel.

[0055] Figure 3 This is one of the cross-sectional schematic diagrams of the display panel 30 provided in the embodiments of this application, such as... Figure 3 As shown, the display panel 30 includes a substrate 301 and a flexible touch layer 302 disposed on one side of the substrate 301. The flexible touch layer 302 includes a metal layer 3021 disposed on one side of the substrate, a dielectric layer 3022 disposed on the side of the metal layer 3021 away from the substrate, and a transparent conductive layer 3023 disposed on the side of the dielectric layer 3022 away from the substrate 301.

[0056] Specifically, the orthographic pattern of the transparent conductive layer 3023 on the side away from the dielectric layer 3022 is included within the orthographic pattern of the transparent conductive layer 3023 on the side close to the dielectric layer 3022.

[0057] For example, the substrate 301, as the substrate material of the display panel 30, can have the characteristics of low coefficient of expansion and high surface flatness, and its manufacturing material can be, for example, alkali-free glass.

[0058] For example, the metal layer 3021, as a conductive path in the flexible touch layer 302, can have the characteristics of thin film, high conductivity and high transparency; specifically, the metal layer 3021 can transmit signals generated by the touch point.

[0059] For example, the dielectric layer 3022 serves as an insulating layer in the flexible touch layer 302, which can effectively prevent short-circuit interference; specifically, the insulating material used to prepare the dielectric layer 3022 can be, for example, silicon nitride (SiNx).

[0060] For example, a transparent conductive layer 3023 can be formed by curing a transparent conductive material to provide protection for the flexible touch layer 302. For example, the transparent conductive material can be a negative optical adhesive, and based on this, the transparent conductive layer 3023 can also be called a TOC film layer.

[0061] It should be noted that negative optical adhesive, as a photosensitive mixed liquid composed of three main components—photosensitive resin, sensitizer, and solvent—can undergo chemical changes under light exposure, making it difficult to dissolve in the developer, thus preserving the portion exposed to light.

[0062] In one possible implementation, the orthographic projection pattern of the transparent conductive layer 3023 on the side away from the dielectric layer 3022 can be included in the orthographic projection pattern of the transparent conductive layer 3023 on the side close to the dielectric layer 3022. The orthographic projection patterns on both sides of the transparent conductive layer 3023 can be the same or different.

[0063] In this embodiment, by setting the patterns on both sides of the transparent conductive layer 3023, the orthographic projection shape of the transparent conductive layer 3023 on the side closer to the dielectric layer 3022 can be at least the same as the orthographic projection shape of the transparent conductive layer 3023 on the side farther from the dielectric layer 3022 (that is, the cross-sectional shape of the display panel 30 is at least rectangular), thereby avoiding the situation where the transparent conductive layer 3023 is easy to peel off due to the large angle between the transparent conductive layer 3023 and the dielectric layer 3022.

[0064] For example, when the orthographic projection patterns on both sides of the transparent conductive layer 3023 are the same, the projection pattern of the transparent conductive layer 3023 in the direction perpendicular to the orthographic projection direction (i.e., cross-sectional view) can be rectangular.

[0065] For example, when the orthographic projection patterns on both sides of the transparent conductive layer 3023 are different, one side edge of the transparent conductive layer 3023 in the circumferential direction may have an angle of less than 90° with the dielectric layer 3022.

[0066] Specifically, Figure 4 This is a second cross-sectional schematic diagram of the display panel 30 provided in the embodiments of this application, as shown below. Figure 4 As shown, there is an angle of less than 90° between one edge of the transparent conductive layer 3023 and the dielectric layer 3022 in the circumferential direction, that is, the angle of the edge of the transparent conductive layer 3023 near the dielectric layer 3022 is an acute angle.

[0067] For example, the angle between one edge of the transparent conductive layer 3023 in the circumferential direction and the dielectric layer 3022 can be less than 45°.

[0068] For example, when the edge angle of the transparent conductive layer 3023 near the dielectric layer 3022 is acute, the projection pattern of the transparent conductive layer 3023 in the direction perpendicular to the orthographic projection direction (i.e., the cross-sectional view) is a right trapezoid.

[0069] For example, the circumferential edge of the transparent conductive layer 3023 can be a concave arc surface.

[0070] Compared to existing flexible touch layers where there is a large angle between the transparent conductive layer and the dielectric layer, the display panel 30 provided in this application embodiment can use a photolithographic mask with a preset pattern to set the patterns on both sides of the transparent conductive layer 3023 in the flexible touch layer 302. This allows the orthographic projection pattern of the flexible touch layer 302 on the side away from the substrate 201 to be included within the orthographic projection pattern of the flexible touch layer 302 on the side closer to the substrate 301. This reduces the angle between the transparent conductive layer 3023 and the dielectric layer 3022 on the side closer to the substrate 301, avoiding the problem of easy peeling of the film layer due to the excessive edge angle of the transparent conductive layer 3023, which leads to a low yield of the display panel 30. This improves the yield of the display panel 30 manufacturing process.

[0071] In another embodiment of this application, a method for manufacturing the display panel 30 is also provided. Figure 5 This is a schematic flowchart of the manufacturing method of the display panel 30 provided in the embodiments of this application, as shown below. Figure 5 As shown, the method includes the following steps:

[0072] Step 501: Prepare a metal layer 3021 on one side of the substrate 301.

[0073] For example, Figure 6 This is one of the schematic diagrams illustrating the process of manufacturing the display panel 30 provided in the embodiments of this application, such as... Figure 6 As shown, a metal material can be deposited on one side of the substrate 301 to form a metal layer 3021.

[0074] Specifically, the metal layer 3021, as a conductive path in the flexible touch layer 302, can have the characteristics of thin film, high conductivity, and high transparency.

[0075] Step 502: Prepare dielectric layer 3022 on the side of metal layer 3021 away from substrate 301.

[0076] For example, Figure 7 This is a second schematic diagram of the process of manufacturing the display panel 30 provided in the embodiments of this application, as shown below. Figure 7 As shown, an insulating material can be laid on the side of the metal layer 3021 away from the substrate 301 to form the dielectric layer 3022.

[0077] Specifically, the insulating material used to prepare the dielectric layer 3022 can be, for example, silicon nitride.

[0078] Step 503: A transparent conductive material is disposed on the side of the dielectric layer 3022 away from the substrate 301, and the transparent conductive material in the preset area is removed to form a transparent conductive layer 3023; wherein, the stacked metal layer 3021, dielectric layer 3022 and transparent conductive layer 3023 form a flexible touch layer 302, and the orthographic projection pattern of the transparent conductive layer 3023 away from the dielectric layer 3022 is included in the orthographic projection pattern of the transparent conductive layer 3023 near the dielectric layer 3022.

[0079] For example, Figure 8 This is the third schematic diagram of the process for manufacturing the display panel 30 provided in the embodiments of this application, as shown below. Figure 8 As shown, a whole layer of transparent conductive material can be laid on the side of dielectric layer 3022 away from substrate 301.

[0080] Specifically, the aforementioned transparent conductive material can cure itself to form a transparent conductive layer 3023. For example, the transparent conductive material can be a negative optical adhesive composed of three main components: photosensitive resin, sensitizer, and solvent.

[0081] For example, after the entire layer of transparent conductive material is laid, the transparent conductive material in a preset area can be removed to form a transparent conductive layer 3023.

[0082] Specifically, a photomask with a preset pattern can be used to expose and develop the transparent conductive material to remove the transparent conductive material corresponding to the masked area of ​​the photomask, thereby forming a transparent conductive layer 3023 based on the transparent conductive material remaining on the side of the dielectric layer 3022 away from the substrate 301.

[0083] For example, Figure 9 This is the fourth schematic diagram of the process for manufacturing the display panel 30 provided in the embodiments of this application, as shown below. Figure 9 As shown, an exposure process can be used to allow light to pass through the light-transmitting area of ​​a preset photomask and irradiate the transparent conductive material to remove the transparent conductive material corresponding to the blocked area in the preset photomask, thereby forming the transparent conductive layer 3023 from the transparent conductive material remaining on one side of the dielectric layer 3022.

[0084] It should be noted that the reason why the above-mentioned transparent conductive material can remain and form a transparent conductive layer 3023 under light irradiation is that the transparent conductive material is a negative optical adhesive that can undergo chemical changes under light irradiation, making it difficult to dissolve in the developer; secondly, the light irradiated onto the transparent conductive material through the preset photomask can be yellow light.

[0085] Compared to existing flexible touch layers where there is a large angle between the transparent conductive layer and the dielectric layer, the method for fabricating the display panel 30 provided in this application embodiment can use a photolithographic mask with a preset pattern to set the patterns on both sides of the transparent conductive layer 3023 in the flexible touch layer 302. This allows the orthographic projection pattern of the flexible touch layer 302 on the side away from the substrate 201 to be included within the orthographic projection pattern of the flexible touch layer 302 on the side closer to the substrate 301. This reduces the angle between the transparent conductive layer 3023 and the dielectric layer 3022 on the side closer to the substrate 301, avoiding the problem of easy peeling of the film layer due to the excessively large edge angle of the transparent conductive layer 3023, which leads to a low yield of the display panel 30. This improves the yield of the display panel 30 fabrication process.

[0086] In another embodiment of this application, a photomask 40 is also provided, which can be applied to the fabrication method of the display panel 30 described in the preceding embodiments. Specifically, in step 503 above, the photomask 40 can be used to expose the transparent conductive material to complete the fabrication of the transparent conductive layer 3023.

[0087] For example, Figure 10 This is a top view of the photomask 40 provided in the embodiments of this application, as shown below. Figure 10As shown, the photomask 40 may include a first cutout area 401 and a second cutout area 402 arranged side by side, wherein the area of ​​the photomask 40 other than the first cutout area 401 and the second cutout area 402 is the masking area 403 of the photomask 40.

[0088] Specifically, the first cutout area 401 and the second cutout area 402 can be light-transmitting areas of the photomask 40, and the area other than the first cutout area 401 and the second cutout area 402 can be light-shielding areas, that is, light can pass through the first cutout area 401 and the second cutout area 402 and irradiate the light-transmitting conductive material.

[0089] In one possible implementation, refer to Figure 10 The first cutout area 401 and the second cutout area 402 on the photomask 40 can be arranged side by side.

[0090] For example, the first cutout area 401 may correspond to the side of the transparent conductive layer 3023 away from the substrate 301, wherein the orthographic projection pattern of the first cutout area 401 may be the same as the orthographic projection pattern of the side of the transparent conductive layer 3023 away from the substrate 301.

[0091] Specifically, the first cutout area 401 on the photomask 40 can be designed based on a preset pattern on the side of the transparent conductive layer 3023 away from the substrate 301.

[0092] For example, refer to Figure 10 The side length of the second hollow area 402 in the vertical direction can be the same as the side length of the first hollow area 401 in the vertical direction. The orthographic projection patterns of the first hollow area 401 and the second hollow area 402 can both be included in the orthographic projection pattern of the transparent conductive layer 3023 in the display panel 30 on the side close to the substrate 301.

[0093] Specifically, the second cutout area 402 can be arranged side by side on one side of the first cutout area 401 based on the preset pattern of the transparent conductive layer 3023 on the side away from the substrate 301 and the preset length of the transparent conductive layer 3023 in the vertical direction along the stacking direction of the inner film layer of the display panel 30 (i.e., the side length of the preset pattern on the side of the transparent conductive layer 3023 away from the substrate 301).

[0094] For example, refer to Figure 10 In the direction perpendicular to the orthographic projection direction, there is a preset interval A between the first hollow area 401 and the second hollow area 402.

[0095] Specifically, the preset interval A between the first hollow area 401 and the second hollow area 402 is 6~9um.

[0096] For example, the length of one side of the second hollowed-out area 402 along the perpendicular direction of the orthographic projection direction (i.e., as shown in the figure) can be... Figure 10 The width B of the second hollow area 402 shown is set to be much smaller than the side length of the second hollow area 402 in the vertical direction along the orthographic projection direction.

[0097] Specifically, in the direction perpendicular to the orthographic projection direction, the width B of the second hollow area 402 can be 6~9um.

[0098] It should be noted that the reason for setting the first cutout area 401 and the second cutout area 402 in the photolithography mask 40 to be spaced apart while setting the width of the second cutout area 402 to be much smaller than the width of the first cutout area 401 is that, based on this setting, the second cutout area 402 can become a slit cutout area set on one side of the first cutout area 401, so that when light passes through the second cutout area 402, it can use light diffraction to solidify the transparent conductive material corresponding to the boundary position of the first cutout area 401, thereby improving the solidification effect at the edge position of the transparent conductive layer 3023.

[0099] In one possible implementation, the circumferential edge of the transparent conductive layer 3023 can be a concave arc surface.

[0100] For example, such as Figure 4 As shown, along the direction from the transparent conductive layer 3023 to the substrate 301, one side of the circumferential edge of the transparent conductive layer 3023 is a concave arc surface.

[0101] Specifically, refer to Figure 4 A cross-sectional view of the central display panel 30 shows that the angle between the line connecting the two endpoints of the arc surface of the circumferential edge of the transparent conductive layer 3023 and the dielectric layer 3022 is 45°. Based on this, the angle between one side edge of the transparent conductive layer 3023 and the dielectric layer 3022 can be less than 45°.

[0102] It should be noted that the reason why one side of the circumferential edge of the transparent conductive layer 3023 appears as a concave arc surface is because when light shines through the second perforated area 402 onto the light-transmitting conductive material, since the second perforated area 402 is a slit, the light can travel along... Figure 9 The different directions of diffraction are shown at the edge of the transparent conductive material, thereby forming a transparent conductive layer 3023 with a concave arc surface on one side of the circumferential edge.

[0103] In this embodiment, the first cutout region 401 and the second cutout region 402 arranged side by side in the photolithography mask 40 can be used to etch images such as... Figure 1 The edges of the transparent conductive layer 104 shown are cured to form a structure as shown. Figure 4 The orthographic pattern on the side away from the substrate 301 is included in the orthographic pattern on the side close to the substrate 301, and the transparent conductive layer 3023 has a concave arc surface on one side of its circumferential edge. This avoids the problem that the film layer is easy to peel off due to the excessive edge angle of the transparent conductive layer 104, which leads to a low yield of the display panel and improves the yield of the display panel manufacturing process.

[0104] In another embodiment of this application, a display device is also provided, which may include the display panel 30 in the foregoing embodiments.

[0105] In one possible implementation, the display device can be used to output image information. For example, the display device can display text images by controlling semiconductor light-emitting diodes; for instance, the display device can be an AMOLED display device.

[0106] Compared to existing flexible touch layers where there is a large angle between the transparent conductive layer and the dielectric layer, the display device provided in this application embodiment can use a photolithographic mask with a preset pattern to set the patterns on both sides of the transparent conductive layer 3023 in the flexible touch layer 302. This allows the orthographic projection pattern of the flexible touch layer 302 on the side away from the substrate 201 to be included within the orthographic projection pattern of the flexible touch layer 302 on the side closer to the substrate 301. This reduces the angle between the transparent conductive layer 3023 and the dielectric layer 3022 on the side closer to the substrate 301, avoiding the problem of easy peeling of the film layer due to the excessive edge angle of the transparent conductive layer 3023, which in turn leads to a low yield of the display panel 30. This improves the yield of the display panel 30 manufacturing process.

[0107] In another embodiment of this application, a computer device 600 is also provided, which includes a central processing unit (CPU) 601 that can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage portion 608 into a random access memory (RAM) 603. The RAM 603 also stores various programs and data required for the system's operating instructions. The CPU 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0108] The following components are connected to the input / output (I / O) interface 605: an input section 606 including a keyboard, mouse, etc.; an output section 607 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and speakers, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN card, modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the input / output (I / O) interface 605 as needed. A removable medium 611, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 610 as needed so that computer programs read from it can be installed into the storage section 608 as needed.

[0109] Specifically, according to embodiments of this application, the flowchart above refers to... Figure 5 The described process can be implemented as a computer software program. For example, embodiments of this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowchart. In such an embodiment, the computer program contains program code for performing the methods shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via communication section 609, and / or installed from removable medium 611. When the computer program is executed by central processing unit (CPU) 601, it performs the functions defined in the system of this application.

[0110] It should be noted that the computer-readable medium shown in this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media can also be any computer-readable medium compatible with computer-readable storage media, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0111] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operational instructions of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two connected blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified functions or operational instructions, or using a combination of dedicated hardware and computer instructions.

[0112] The units or modules described in the embodiments of this application can be implemented in software or hardware. The described units or modules can also be housed in a processor; for example, a processor may be described as including a semantic extraction unit, a weight allocation unit, and a determination unit. The names of these units or modules do not necessarily constitute a limitation on the unit or module itself.

[0113] On the other hand, this application also provides a computer-readable storage medium, which may be included in the computer device described in the above embodiments, or may exist independently and not assembled into the computer device. The aforementioned computer-readable storage medium stores one or more programs that, when used by one or more processors, execute the methods described in this application. For example, it may execute... Figure 5 The steps of the method shown.

[0114] This application provides a computer program product including instructions that, when executed, cause the method described in this application to be performed. For example, it can execute... Figure 5 Each step of any of the methods shown.

[0115] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the foregoing disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A display panel, characterized by, The display panel comprises a substrate and a flexible touch layer arranged on one side of the substrate, wherein the flexible touch layer comprises a metal layer arranged on one side of the substrate, a dielectric layer arranged on one side of the metal layer away from the substrate, and a transparent conductive layer arranged on one side of the dielectric layer away from the substrate; The projection pattern of the transparent conductive layer on one side away from the dielectric layer is contained in the projection pattern of the transparent conductive layer on one side close to the dielectric layer; The angle between the circumferential side edge of the transparent conductive layer and the dielectric layer is less than 90°, and the projection pattern of the transparent conductive layer in the vertical direction of the projection direction is a right trapezoid.

2. The display panel of claim 1, wherein, The angle between the circumferential side edge of the transparent conductive layer and the dielectric layer is less than 45°.

3. A method for manufacturing a display panel, characterized by, The method comprises: Preparation of a metal layer on one side of a substrate; Preparation of a dielectric layer on one side of the metal layer away from the substrate; Arrangement of a transparent conductive substance on one side of the dielectric layer away from the substrate, and removal of the transparent conductive substance in a preset area to form a transparent conductive layer; wherein the metal layer, the dielectric layer, and the transparent conductive layer arranged in layers form a flexible touch layer, the projection pattern of the transparent conductive layer on one side away from the dielectric layer is contained in the projection pattern of the transparent conductive layer on one side close to the dielectric layer; The angle between the circumferential side edge of the transparent conductive layer and the dielectric layer is less than 90°, and the projection pattern of the transparent conductive layer in the vertical direction of the projection direction is a right trapezoid.

4. The method of manufacturing a display panel according to claim 3, wherein The removal of the transparent conductive substance in the preset area comprises: Exposure and development of the transparent conductive substance using a photomask with a preset pattern to remove the transparent conductive substance corresponding to the shielding area of the photomask.

5. A display device, characterized by comprising: The display device comprises the display panel of any one of claims 1-2.

6. A photolithographic mask, characterized by The photomask used in the preparation method of the display panel of any one of claims 3-4 comprises a first hollow area and a second hollow area arranged side by side, and the area of the photomask other than the first hollow area and the second hollow area is the shielding area of the photomask; The projection pattern of the first hollow area and the second hollow area is contained in the preset projection pattern of the transparent conductive layer on one side close to the substrate in the display panel, and the projection pattern of the first hollow area is the same as the preset projection pattern of the transparent conductive layer on one side away from the substrate, wherein along the vertical direction of the projection direction, the first hollow area and the second hollow area have a preset interval.

7. The photolithography mask according to claim 6, wherein, The preset interval between the first hollow area and the second hollow area is 6-13 um.

8. The photolithography mask of claim 6, wherein, Along the arrangement direction of the first hollow area and the second hollow area, the width of the second hollow area is 6-9 um.

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