Wire harness and method for manufacturing wire harness

Abstract

The purpose of the present invention is to provide a wire harness that suppresses scattering of a wiring material when an exterior member is attached to the wiring material and that suppresses the wiring material from protruding from the exterior member. The present invention is provided with: a conductive wiring material (W); a molded member (1), which is an exterior member of the wiring material (W) that covers the plurality of wiring materials (W) and is provided integrally with the wiring material (W); and a winding tape (10) that binds the plurality of wiring materials (W) disposed on the inner side of the molded member (1). Therefore, when the molded member (1) covering the plurality of wiring materials W is mounted to the wiring material W by molding the molded member (1) using the mold (20), the plurality of wiring materials W can be mounted while maintaining a state in which the plurality of wiring materials W are bundled. As a result, the wiring material (W) can be prevented from scattering when the molded member (1) is attached to the wiring material (W), and the wiring material (W) can be prevented from protruding from the molded member (1).

Description

Technical Field

[0001] The invention relates to a wire harness and a method for manufacturing the wire harness. Background Art

[0002] In a wiring harness, an exterior material is indispensable to protect the wires from external structures such as the iron plate of a vehicle. In conventional wiring harnesses, various types of exterior materials can be used to protect the wires. For example, the wiring harness described in Patent Document 1 includes a wire harness and a molded body integrally provided at a portion of the wire harness in the axial direction, namely, a mounting portion, and the molded body is made of a thermoplastic resin.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-160568 Summary of the invention

[0006] Technical problem that the invention aims to solve

[0007] However, in conventional wiring harnesses, there are various types of exterior components, and therefore, there are many components that are difficult to install on electric wires without manual work. That is, there are various types of components in the exterior components, but in the exterior components, when the exterior components are installed on wiring materials such as electric wires, the wiring materials will spread out, and depending on the situation, a part of the spread wiring materials may sometimes protrude from the exterior components. Therefore, in conventional wiring harnesses, it is necessary to manually adjust the arrangement of the wiring materials relative to the exterior components while installing the exterior components, and there is room for improvement from the perspective of installing the exterior components on the wiring materials.

[0008] The present invention has been made in view of the above circumstances, and an object thereof is to provide a wire harness and a method for manufacturing the wire harness, which can suppress the wiring material from being scattered when the exterior member is attached to the wiring material and suppress the wiring material from protruding from the exterior member.

[0009] Technical solutions to the problem

[0010] In order to solve the above-mentioned problems and achieve the purpose, the wiring harness involved in the present invention is characterized in that it comprises: a wiring material, which has conductivity; a molded component, which covers a plurality of the wiring materials and is integrally provided with the wiring materials; and a winding tape, which bundles the plurality of wiring materials arranged on the inner side of the molded component.

[0011] In addition, in order to solve the above-mentioned problems and achieve the purpose, the manufacturing method of the wire harness involved in the present invention is characterized in that it includes: a process of bundling a plurality of conductive wiring materials and winding them with a winding tape; and a process of setting a molded component around the plurality of wiring materials wound with the winding tape by injection molding.

[0012] Effects of the Invention

[0013] In the wire harness and the manufacturing method of the wire harness according to the present invention, the wiring material arranged inside the molded component as the exterior component is wound with a winding tape for a plurality of wiring materials, and the plurality of wiring materials are arranged inside the exterior component in a state where the plurality of wiring materials are bundled with the winding tape. Therefore, when the exterior component is molded using a mold and the exterior component covering the plurality of wiring materials is mounted on the wiring materials, the plurality of wiring materials can be mounted while being bundled. As a result, the following effects are achieved: the wiring materials can be prevented from spreading when the exterior component is mounted on the wiring materials, and the wiring materials can be prevented from protruding from the exterior component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the wire harness according to the first embodiment.

[0015] Figure 2 This is a schematic diagram showing a state where a winding tape is wound around a plurality of wiring materials.

[0016] Figure 3 Yes Figure 2 The illustrated diagram is a cross-sectional view of a mold in a state where a wiring material is arranged in the mold.

[0017] Figure 4 It is shown in Figure 3 The schematic diagram shows a state where the mold is filled with resin material.

[0018] Figure 5 This is a schematic diagram showing a state in which a plurality of wiring materials are passed through the inner side of a forming portion of a die without winding a winding tape around the wiring materials.

[0019] Figure 6 This is a schematic diagram of a wire harness after a plurality of wiring materials are molded into a molded component without winding a winding tape.

[0020] Figure 7 This is a schematic diagram of a wire harness according to the second embodiment.

[0021] Figure 8 This is a schematic diagram showing a state where a winding tape is wound around a plurality of wiring materials in the second embodiment.

[0022] Fig. 9 It shows that Figure 8The diagram is an explanatory diagram of a state where the wiring material is arranged on a mold.

[0023] Fig.10 This is an explanatory diagram showing a state in which a plurality of wiring materials are arranged in a mold without winding a winding tape around the wiring materials.

[0024] Fig.11 This is a schematic diagram of a wire harness that is molded into a molded component without winding a plurality of wiring materials around a winding tape.

[0025] Description of Reference Numerals

[0026] 1 Molded parts

[0027] 2 External surface

[0028] 3. Protrusion

[0029] 5 ends

[0030] 10 Winding tape

[0031] 20 Mould

[0032] 21 Forming Department

[0033] 22 end

[0034] 30 Injection device

[0035] WH Harness

[0036] Wiring Materials DETAILED DESCRIPTION

[0037] Hereinafter, the embodiments of the present invention will be described in detail based on the accompanying drawings. In addition, the present invention is not limited to the embodiments. In addition, the constituent elements in the following embodiments include elements that can be easily replaced by those skilled in the art, or substantially the same elements.

[0038] [Implementation Method 1]

[0039] Figure 1 Schematic diagram of the wire harness WH involved in Embodiment 1. The wire harness WH involved in Embodiment 1 is arranged in a vehicle or the like. The wire harness WH, for example, bundles a plurality of wiring materials W used for power supply and signal communication as a collection component for connection between various devices mounted on a vehicle, and electrically connects the plurality of wiring materials W to the various devices through a connector or the like. The wire harness WH comprises: a plurality of wiring materials W having conductivity; and a molded component 1 integrally provided around the plurality of wiring materials W in a manner of bundling the plurality of wiring materials W. In addition, the wire harness WH may also be configured to include various components such as external components such as a corrugated tube, a resin tape, and a protector, an electrical connection box, and a fixing.

[0040] The wiring material W is composed of, for example, a metal rod, an electric wire, a wire bundle, etc. The metal rod is a rod-shaped member having conductivity. The electric wire is a conductor part (core wire) composed of a plurality of conductive metal wires. The wire bundle is formed by bundling the wires. In addition, each wiring material W may be covered by a covering part having insulation.

[0041] The molded component 1 is provided as an exterior component relative to the wiring material W. The molded component 1 is provided around the plurality of wiring materials W by covering the plurality of wiring materials W in a manner of bundling the plurality of wiring materials W along a predetermined direction (hereinafter referred to as the extension direction X) in which the plurality of wiring materials W extend. The molded component 1 is formed of an insulating elastic resin material (for example, ethylene-propylene-diene rubber (EPDM) etc.) having low rigidity and high flexibility, such as rubber or thermoplastic elastomer. The molded component 1 is integrally provided around the plurality of wiring materials W by molding the elastic resin material in a manner of bundling the plurality of wiring materials W. Therefore, the wire harness WH can have flexibility together with the molded component 1. The molded component 1 covers a portion of the sections of the plurality of wiring materials W together and buries the sections of the plurality of wiring materials W. In addition, the covering portion constituting the wiring material W is typically an insulating covering member provided over the entire length of the wiring material W. In contrast, the molded component 1 is a protective member provided locally at a necessary position in the wiring material W on the outside of such a covering member in order to protect the wiring material W, restrict the path, etc.

[0042] In the first embodiment, the molded component 1 is formed into a substantially cylindrical shape with its axial direction along the extending direction X of the wiring material W. The plurality of wiring materials W are arranged inside the molded component 1 around the axial center of the cylinder which is the shape of the molded component 1 .

[0043] In the molded component 1 according to the first embodiment, when the molded component 1 is formed by injection molding, the protrusion 3 as a gate portion protrudes from the outer surface 2 of the molded component 1 and is formed on a part of the outer surface 2. That is, the protrusion 3 formed on the outer surface 2 of the molded component 1 becomes a part of the outer surface 2 formed using the mold 20 (see Figure 4 ) The trace of the injection portion where the resin material is injected into the mold 20 when the molded component 1 is injection molded. The protrusion 3 is formed on the outer surface 2 near the center of the molded component 1 in the extending direction X of the wiring material W.

[0044] The wiring materials W arranged inside the molded component 1 are bundled by the winding tape 10. The winding tape 10 is arranged inside the molded component 1 together with the wiring materials W, and is concentratedly wound around the plurality of wiring materials W, thereby bundling the plurality of wiring materials W. The width of the winding tape 10 in the extending direction X of the wiring materials W is narrower than the length of the molded component 1 in the extending direction X of the wiring materials W. Therefore, the winding tape 10 is wound around a portion of the portion of the wiring materials W located inside the molded component 1.

[0045] In the first embodiment, the winding tape 10 for bundling a plurality of wiring materials W inside the molded component 1 is arranged to be included in the same position as the position of the protrusion 3 forming the gate portion of the molded component 1 in the extending direction X of the wiring materials W. That is, the winding tape 10 is arranged at a position overlapping with the protrusion 3 in the radial direction of the cylinder which is the shape of the molded component 1.

[0046] Next, a method for manufacturing the wire harness WH according to the first embodiment will be described. Figure 2 1 is a schematic diagram showing a state where the winding tape 10 is wound around a plurality of wiring materials W. FIG. Figure 2 FIG. 2 shows a step (ST1) of bundling a plurality of conductive wiring materials W and winding them around a winding tape 10. When manufacturing the wiring harness WH according to the first embodiment, first, as shown in FIG. Figure 2 As shown, a plurality of wiring materials W are bundled and a winding tape 10 is wound around the plurality of wiring materials W. The winding tape 10 is a so-called adhesive tape and can maintain the plurality of wiring materials W in a bundled state by being wound around the wiring materials W.

[0047] Figure 3 Yes Figure 2 The illustrated diagram is a cross-sectional view of the mold 20 in a state where the wiring material W is arranged in the mold 20 . Figure 3 The process (ST2) of placing a plurality of wiring materials W in the mold 20 is shown. After the winding tape 10 is wound around the wiring materials W in a state where the plurality of wiring materials W are bundled, the molded component 1 is placed around the plurality of wiring materials W wound with the winding tape 10 by injection molding of a resin material. The injection molding of the molded component 1 is performed using the mold 20 capable of molding the molded component 1. Therefore, after the winding tape 10 is wound around the plurality of wiring materials W, the wiring materials W are arranged in the mold 20 for molding the molded component 1. In the first embodiment, the mold 20 has an upper mold 20a and a lower mold 20b, and when molding the molded component 1, the upper mold 20a and the lower mold 20b are overlapped in the vertical direction. That is, the upper mold 20a overlaps the lower mold 20b from the upper side.

[0048] In the upper mold 20a and the lower mold 20b, a forming portion 21 is formed on the opposite surface of each other, and the forming portion 21 is used to form the molded component 1. In detail, a first forming portion 21a as the forming portion 21 is formed on the surface of the upper mold 20a on the side opposite to the lower mold 20b, and a second forming portion 21b as the forming portion 21 is formed on the surface of the lower mold 20b on the side opposite to the upper mold 20a. The first forming portion 21a and the second forming portion 21b are formed in a shape capable of forming the outer surface 2 of the molded component 1. The first forming portion 21a and the second forming portion 21b are respectively formed in a shape capable of forming the outer surface 2 of the shape of the molded component 1, that is, a range of about 180° in the circumferential direction of a cylinder.

[0049] In addition, an insertion hole 20aa is formed in the upper mold 20a. The insertion hole 20aa is used to insert the injection device 30 (see FIG. 1 ) when injecting the resin material into the mold 20 when molding the molded component 1. Figure 4 ) of the nozzle 31 (refer to Figure 4 The insertion hole 20aa is formed as a hole communicating with the first molded portion 21a from the surface of the upper mold 20a on the opposite side to the surface facing the lower mold 20b.

[0050] When the molded component 1 is molded using the mold 20, the upper mold 20a and the lower mold 20b are overlapped in a state where the wiring material W passes through the first molding portion 21a of the upper mold 20a and the inner side of the second molding portion 21b of the lower mold 20b. At this time, the winding tape 10 of the wiring material W wound around the wiring material W is arranged at a position overlapping with the insertion hole 20aa formed in the upper mold 20a. That is, the wiring material W is arranged inside the molding portion 21 formed in the mold 20 in such a manner that the position of the winding tape 10 in the extending direction X of the wiring material W includes a portion at the same position as the insertion hole 20aa formed in the upper mold 20a.

[0051] Figure 4 It means in Figure 3 The schematic diagram of the state where the mold 20 is filled with resin material is shown. Figure 4 The process (ST3) of providing the molded component 1 around the plurality of wiring materials W wound with the winding tape 10 by injection molding is shown. After the plurality of wiring materials W bundled by winding the winding tape 10 are passed through the inside of the molding portion 21 formed in the mold 20, the molten resin material is filled into the molding portion 21 in a state where the upper mold 20a and the lower mold 20b are overlapped. The resin material is filled into the molding portion 21 using the injection device 30. The injection device 30 can melt the resin material and can eject the molten resin material from the nozzle 31.

[0052] When the molding portion 21 of the mold 20 is filled with resin material, the nozzle 31 of the injection device 30 is inserted into the insertion hole 20aa formed in the upper mold 20a, and the molten resin material is ejected from the nozzle 31, thereby injecting the resin material into the molding portion 21. Thus, the resin material is filled in the space formed by the first molding portion 21a of the upper mold 20a and the second molding portion 21b of the lower mold 20b.

[0053] The resin material filled in the forming portion 21 is cooled over time and solidified. As a result, the resin material is formed into a molded component 1 in which the wiring material W is arranged inside and covers the wiring material W. After the resin material in the forming portion 21 is solidified and formed into the molded component 1, the upper mold 20a and the lower mold 20b are separated to take out the molded component 1 formed by the mold 20.

[0054] Here, in the first embodiment, before the wiring materials W are passed through the inner side of the forming section 21 of the die 20 and the molded component 1 is molded by the die 20, the plurality of wiring materials W are bundled with the winding tape 10. That is, when the molded component 1 is molded by the forming section 21 of the die 20, the wiring materials W bundled with the winding tape 10 are passed through the inner side of the forming section 21. Therefore, the molded component 1 is molded so that the plurality of wiring materials W passing through the inner side of the forming section 21 are not scattered.

[0055] Figure 5 1 is a schematic diagram showing a state in which the wiring materials W are passed through the inside of the forming portion 21 of the die 20 without winding the winding tape 10 around the plurality of wiring materials W. FIG. Figure 6 1 is a schematic diagram of a wire harness WH in which a molded component 1 is formed without winding a winding tape 10 around a plurality of wiring materials W. When the molded component 1 of the wire harness WH is formed using a mold 20, for example, Figure 5 As shown in FIG. 1 , if the winding tape 10 is not wound around the plurality of wiring materials W, there is a possibility that the wiring materials W may be scattered. That is, the resin material injected into the molding portion 21 of the mold 20 when the molded component 1 is formed flows in the molding portion 21 while filling the molding portion 21. Therefore, the pressure of the resin material when flowing in the molding portion 21 acts on the wiring materials W arranged inside the molding portion 21 of the mold 20, and the plurality of wiring materials W may be scattered due to the pressure from the resin material.

[0056] In a state where the wiring material W is spread out in the forming portion 21 of the mold 20, when the resin material in the forming portion 21 is solidified, there is a possibility that a part of the wiring material W among the plurality of wiring materials W is solidified in a state protruding from the molded component 1. That is, the resin material is solidified in the forming portion 21 while the wiring material W is spread out, and thus the resin material is solidified in a state where a part of the wiring material W protrudes from the resin material. In this case, as shown in FIG. Figure 6 As shown, in the wire harness WH, a portion of the wiring material W may have a protruding portion Wa protruding from the molded component 1. In this case, the molded component 1 cannot protect the protruding portion Wa of the wiring material W protruding from the molded component 1.

[0057] In contrast, the wire harness WH according to the first embodiment is molded into the molded component 1 in a state where a plurality of wiring materials W are bundled with the winding tape 10, so that the wiring materials W do not protrude from the molded component 1 and the molded component 1 can be molded. Thus, the wire harness WH can appropriately protect the wiring materials W by the molded component 1.

[0058] The wire harness WH is routed at an arbitrary position in a state where a part of the plurality of wiring materials W is covered by the molded component 1 and the wiring materials W are protected by the molded component 1. At this time, since the protrusion 3 is formed on the molded component 1, when the molded component 1 is arranged at an arbitrary position, it can be positioned by the protrusion 3. Thus, when routing the wire harness WH, the molded component 1 can be arranged at an appropriate position.

[0059] In the wire harness WH according to the above embodiment, among the wiring materials W arranged inside the molded component 1, the winding tape 10 is wound around a plurality of wiring materials W, and the plurality of wiring materials W are arranged inside the molded component 1 in a state of being bundled by the winding tape 10. Therefore, when the molded component 1 is formed by using the mold 20 and the molded component 1 covering the plurality of wiring materials W is mounted on the wiring materials W, it is possible to mount the molded component 1 while maintaining the state of bundling the plurality of wiring materials W. As a result, it is possible to suppress the wiring materials W from being scattered when the molded component 1 as an exterior component is mounted on the wiring materials W, and it is possible to suppress the wiring materials W from protruding from the molded component 1. In addition, it is possible to suppress the wiring materials W from protruding from the molded component 1, so that the wire harness WH can be manufactured with stable quality.

[0060] In addition, since the winding tape 10 is disposed so as to be included in the same position as the position where the protrusion 3, which is the gate portion of the molded component 1, is formed in the extending direction X of the wiring material W, it is possible to further suppress the wiring material W from being scattered. That is, when the molded component 1 is formed using the mold 20, in the molding portion 21 of the mold 20, the molten resin material is injected into the molding portion 21 from the position of the insertion hole 20aa formed in the mold 20. Therefore, for the wiring material W disposed in the molding portion 21 of the mold 20 when the molded component 1 is formed, the pressure from the resin material when the resin material is injected into the molding portion 21 is likely to act with a large pressure on the portion of the wiring material W located near the insertion hole 20aa. As a result, the portion of the wiring material W located near the insertion hole 20aa is likely to be scattered due to the large pressure acting from the resin material when the molded component 1 is formed.

[0061] On the other hand, in the wire harness WH according to the first embodiment, the winding tape 10 for bundling the plurality of wiring materials W is disposed on the wiring material W so as to be included in the same position as the position where the protrusion 3, which is the gate portion of the molded component 1, is formed in the extending direction X of the wiring material W. That is, the winding tape 10 is disposed so as to be included in the portion where the resin material is injected when the molded component 1 is formed, that is, the portion where the insertion hole 20aa of the mold 20 is located in the extending direction X of the wiring material W. Therefore, the portion of the plurality of wiring materials W where a large pressure is easily applied from the resin material when the molded component 1 is formed and the wiring materials W are easily scattered can be bundled with the winding tape 10.

[0062] Thus, by bundling the portion where the wiring materials W are likely to be scattered due to the large pressure from the resin material when the molded component 1 is formed, the winding tape 10 can be used to bundle the plurality of wiring materials W, thereby maintaining the bundled state even when the molded component 1 is formed. As a result, it is possible to suppress the wiring materials W from being scattered when the molded component 1 is attached to the wiring materials W, and to suppress the wiring materials W from protruding from the molded component 1.

[0063] In addition, in the manufacturing method of the wire harness WH according to the first embodiment, a plurality of wiring materials W having conductivity are bundled, the winding tape 10 is wound around the wiring materials W, and the molded component 1 is provided around the plurality of wiring materials W wound with the winding tape 10 by injection molding. Thus, when the molded component 1 is provided around the plurality of wiring materials W, the molded component 1 can be provided while maintaining the state in which the plurality of wiring materials W are bundled, and the molded component 1 can be attached to the wiring materials W while maintaining the state in which the plurality of wiring materials W are bundled. As a result, when the molded component 1 as an exterior component is attached to the wiring materials W, it is possible to suppress the wiring materials W from being scattered, and it is possible to suppress the wiring materials W from protruding from the molded component 1.

[0064] [Implementation Method 2]

[0065] The wire harness WH according to the second embodiment is substantially the same as the wire harness WH according to the first embodiment, and is characterized in that the winding tape 10 for bundling the wiring material W is arranged to include the end portion 5 of the molded component 1. The other structures are the same as those of the first embodiment, and thus the description thereof is omitted and the same reference numerals are given.

[0066] Figure 7 Schematic diagram of a wire harness WH according to Embodiment 2. The wire harness WH according to Embodiment 2 has a molded component 1 covering a conductive wiring material W, similarly to the wire harness WH according to Embodiment 1, and the molded component 1 covers a plurality of wiring materials W and is provided integrally with the wiring materials W. In addition, a winding tape 10 is wound around the plurality of wiring materials W, and the plurality of wiring materials W are bundled by the winding tape 10.

[0067] Unlike the first embodiment, the winding tape 10 in which the plurality of wiring materials W are bundled can be arranged so as to be included in the position of the end portion 5 of the molded component 1 in the extending direction X of the wiring materials W. That is, the winding tape 10 is arranged at a position overlapping in the radial direction of the cylinder which is the shape of the molded component 1 with respect to the end portions 5 on both sides of the molded component 1 in the extending direction X of the wiring materials W. That is, in the first embodiment, the winding tape 10 is arranged at one position near the center of the molded component 1 in the extending direction X of the wiring materials W, whereas in the second embodiment, the winding tape 10 is arranged at two positions near both ends of the molded component 1 in the extending direction X of the wiring materials W.

[0068] Next, a method for manufacturing the wire harness WH according to the second embodiment will be described. Figure 8 1 is a schematic diagram showing a state where the winding tape 10 is wound around a plurality of wiring materials W in the second embodiment. When manufacturing the wire harness WH according to the second embodiment, first, Figure 8 As shown in the figure, the winding tape 10 is wound around two locations separated in the extending direction X of the plurality of wiring materials W. The winding tapes 10 at the two locations are arranged so that the interval between the ends of each winding tape 10 on the side of the other winding tape 10 is narrower than the length of the molded component 1, and the interval between the ends of each winding tape 10 on the side opposite to the side of the other winding tape 10 is wider than the length of the molded component 1. The winding tape 10 is wound around the two locations in the state where the plurality of wiring materials W are bundled, so that the plurality of wiring materials W can be maintained in a bundled state by the winding tape 10.

[0069] Fig. 9 It means that Figure 81 is an explanatory diagram of a state in which the wiring material W is arranged in the mold 20. After the winding tape 10 is wound around the wiring material W in a state in which a plurality of wiring materials W are bundled, the wiring material W is arranged in the mold 20 for molding the molded component 1. Fig. 9 As shown, the wiring material W is first arranged on the lower mold 20b of the mold 20. That is, the wiring material W is arranged inside the second molded portion 21b formed in the lower mold 20b.

[0070] At this time, the wiring material W is arranged in such a manner that the winding tapes 10 wound around the two locations of the wiring material W extend from the inner side of the second forming portion 21b to the outer side of the end portion 22 of the mold 20. That is, the wiring material W is arranged relative to the lower mold 20b in such a manner that the winding tapes 10 at the two locations extend from the inner side of the second forming portion 21b to the outer side of the end portion 22 of the mold 20.

[0071] After the wiring material W is placed in the lower mold 20b, the upper mold 20a is overlapped with the lower mold 20b, and the molten resin material is injected into the molded portion 21 in a state where the wiring material W passes through the first molded portion 21a of the upper mold 20a and the inner side of the second molded portion 21b of the lower mold 20b. That is, in a state where the upper mold 20a and the lower mold 20b are overlapped, the injection device 30 (see FIG. 2 ) is inserted into the insertion hole 20aa formed in the upper mold 20a. Figure 4 ) of the nozzle 31 (refer to Figure 4 ), the resin material is injected from the injection device 30. Thus, the resin material is injected into the molded portion 21 formed in the mold 20, and the molded portion 21 is filled with the resin material.

[0072] The resin material filled in the forming portion 21 is cooled and solidified as time passes, so that the solidified resin material forms the molded component 1 covering the wiring material W. After the resin material in the forming portion 21 is solidified and formed into the molded component 1, the upper mold 20a and the lower mold 20b are separated to take out the molded component 1 formed by the mold 20.

[0073] At this time, the molded component 1 is molded in a state where the winding tapes 10 wound around the wiring material W at two locations are respectively located at positions extending from the inside of the second molded portion 21b to the outside of the end portion 22 of the mold 20. Therefore, in the molded component 1 after molding, the winding tapes 10 at two locations extend from the inside of the molded component 1 toward the outside in the extending direction X of the wiring material W, and are arranged to be included in the position of the end portion 5 of the molded component 1 in the extending direction X of the wiring material W.

[0074] In the second embodiment, when the molded component 1 is molded by the mold 20, the wiring material W bundled by the winding tape 10 is passed through the inside of the molding portion 21. Therefore, as in the first embodiment, the plurality of wiring materials W passing through the inside of the molding portion 21 are molded without being scattered. In addition, in the second embodiment, since the winding tape 10 is arranged to include the position of the end portion 5 of the molded component 1 in the extending direction X of the wiring material W, it is possible to suppress the wiring material W from being clamped by the mold 20 when the molded component 1 is molded.

[0075] Fig.10 1 and 2 are explanatory diagrams showing a state in which the wiring materials W are arranged on the die 20 without winding the winding tape 10 around the plurality of wiring materials W. FIG. Fig.11 It is a schematic diagram of a wiring harness WH in which a molded component 1 is formed without winding a winding tape 10 around a plurality of wiring materials W. In the case where the molded component 1 is formed without winding the winding tape 10 around the wiring materials W, when the wiring materials W are arranged in the mold 20, there is a possibility that a part of the plurality of wiring materials W will protrude from the forming portion 21 of the mold 20. That is, in the case where the wiring materials W are arranged inside the second forming portion 21b formed in the lower mold 20b without winding the winding tape 10 around the wiring materials W, the plurality of wiring materials W not wound with the winding tape 10 are likely to spread out. Therefore, in the case where the wiring materials W are arranged inside the second forming portion 21b without winding the winding tape 10 around the wiring materials W, there is a possibility that a part of the wiring materials W after spreading out, for example, Fig.10 The possibility of extending from the second formed portion 21b like the sandwich portion Wb shown.

[0076] During the molding of the molded component 1, since the upper mold 20a and the lower mold 20b are overlapped, when the upper mold 20a and the lower mold 20b are overlapped in a state where a part of the wiring material W protrudes from the second molded portion 21b, the protruding part of the wiring material W is sandwiched by the upper mold 20a and the lower mold 20b. That is, when the wiring material W is arranged inside the second molded portion 21b formed in the lower mold 20b, the sandwiched part Wb of the wiring material W protruding from the second molded portion 21b is sandwiched by the upper mold 20a and the lower mold 20b other than the molded portion 21 when the upper mold 20a and the lower mold 20b are overlapped.

[0077] When the molten resin material is filled into the molding portion 21 in a state where the sandwiched portion Wb of the wiring material W is sandwiched between the upper mold 20a and the lower mold 20b outside the molding portion 21, the sandwiched portion Wb of the wiring material W is located outside the resin material. Therefore, when the resin material filled into the molding portion 21 is solidified, the resin material is solidified in a state where the sandwiched portion Wb of the wiring material W protrudes from the resin material. Therefore, when the resin material is solidified in a state where the sandwiched portion Wb of the wiring material W protrudes from the resin material, the molded component 1 is formed as shown in FIG. Fig.11 As shown, the sandwiched portion Wb becomes a protruding portion Wa of the wiring material W that protrudes from the molded component 1 .

[0078] That is, the sandwiched portion Wb of the wiring material W does not protrude from the position of the end portion 5 of the molded component 1 to the outside of the molded component 1, but protrudes from the position of the outer surface 2 of the molded component 1 to the outside of the molded component 1. In this case, the molded component 1 cannot protect the protruding portion Wa of the wiring material W protruding from the molded component 1.

[0079] In contrast, in the wire harness WH according to the second embodiment, the winding tape 10 wound around the plurality of wiring materials W is arranged at a position including the end portion 5 of the molded component 1 in the extending direction X of the wiring materials W. Therefore, when the plurality of wiring materials W are arranged in the forming portion 21 of the mold 20, it is possible to suppress the wiring materials W from spreading, and thus it is possible to suppress a portion of the scattered wiring materials W from protruding from the forming portion 21 and being clamped by portions other than the forming portion 21 in the upper mold 20a and the lower mold 20b.

[0080] That is, by arranging the winding tape 10 at a position including the positions of the end portions 5 on both sides of the molded component 1 in the extending direction X of the wiring material W, the portion of the wiring material W arranged inside the molded component 1 can be maintained as a whole in a state of being bundled by the winding tape 10 at two locations. Thus, when the molded component 1 covering a plurality of wiring materials W is molded by injection molding of a resin material and mounted on the wiring material W, the plurality of wiring materials W arranged inside the molded component 1 can be mounted while being maintained in a bundled state.

[0081] Therefore, when the molded component 1 is formed using the mold 20, a part of the wiring material W can be prevented from protruding from the forming portion 21 of the mold 20, and a part of the wiring material W can be prevented from being sandwiched between the upper mold 20a and the lower mold 20b at a portion other than the forming portion 21. As a result, when the molded component 1 is attached to the wiring material W, it is possible to prevent the wiring material W from being scattered, and a part of the scattered wiring material W can be prevented from protruding from the molded component 1 that has been formed.

[0082] [Modifications]

[0083] In the above-mentioned first and second embodiments, the protrusion 3, which is the gate portion during the molding of the molded component 1, is formed on the molded component 1 after molding, but the protrusion 3 may be removed after the molding of the molded component 1. The protection of the wiring material W by the molded component 1 has nothing to do with the protrusion 3, and therefore it does not matter whether the protrusion 3 is present in the molded component 1 after molding.

[0084] In the second embodiment described above, the winding tape 10 wound around the wiring material W is arranged so as to include the positions of the ends 5 on both sides of the molded component 1 in the extending direction X of the wiring material W, but the winding tape 10 may not be arranged at the positions of the ends 5 on both sides of the molded component 1. The winding tape 10 wound around the wiring material W may be arranged, for example, at the position of the end 5 on one side of the molded component 1, but not at the position of the end 5 on the other side of the molded component 1. Depending on the shape of the molded component 1 and the mold 20, the winding tape 10 wound around the wiring material W is preferably arranged so as to include at least the position of the end 5 on the side of the molded component 1 where the wiring material W protrudes from the forming portion 21 of the mold 20 so that the wiring material W is easily clamped by the portion other than the forming portion 21 of the mold 20.

[0085] In the above-mentioned first and second embodiments, the molded component 1 is formed into a substantially cylindrical shape with the axial direction along the extending direction X of the wiring material W, but the molded component 1 may be formed into other shapes. The molded component 1 may be formed into, for example, a substantially prism shape, or may be formed into a substantially truncated cone shape in which the end 5 on one side and the end 5 on the other side of the molded component 1 are different in size. The molded component 1 may have any shape as long as it can locally protect the necessary portion of the wiring material W.

[0086] In addition, the wiring harness and the manufacturing method of the wiring harness involved in the above-mentioned embodiments and modified examples of the present invention are not limited to the above-mentioned embodiments and modified examples, and various changes can be made within the scope described in the claims. The wiring harness involved in this embodiment and modified example can also be constructed by appropriately combining the constituent elements of the above-mentioned embodiments and modified examples.

Claims

1. A wiring harness, characterized in that: have: a wiring material having electrical conductivity; a molded component that covers the plurality of wiring materials and is provided integrally with the wiring materials; as well as A winding tape is provided to bundle the plurality of wiring materials arranged inside the molded component.

2. The wire harness according to claim 1, characterized in that: The winding tape is arranged to include a position identical to a position where a gate portion of the molded component is formed in an extending direction of the wiring material.

3. The wire harness according to claim 1, characterized in that: The winding tape is arranged to include a position of an end portion of the molded component in the extending direction of the wiring material.

4. A method for manufacturing a wire harness, characterized in that: include: A step of bundling a plurality of conductive wiring materials and winding the bundles with a winding tape; as well as A step of providing a molded component by injection molding around the plurality of wiring materials wound around the winding tape.

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