Coil electronic component

Abstract

The present disclosure provides a coil electronic component, which may include a main body, the first surface and the second surface are opposite to each other in a first direction; the third surface and the fourth surface are opposite to each other in a second direction and are connected with the first surface and the second surface; the third surface and the fourth surface are opposite to each other in a third direction and are connected with the first surface and the second surface; the third surface and the fourth surface are a fifth surface and a sixth surface; a coil embedded in the main body; a first external electrode disposed on the sixth surface and extending onto a portion of the first surface and connected to the coil; a second external electrode disposed on the sixth surface and extending onto a portion of the second surface and connected to the coil; a first insulating layer covering the first external electrode on the first surface; and a second insulating layer covering the second external electrode on the second surface.

Description

Technical Field

[0001] The present disclosure relates to a coil electronic assembly. Background Art

[0002] Recently, as the functions of mobile devices are diversified, power consumption increases, and in order to increase battery life in mobile devices, coil electronic components with low loss and excellent efficiency are adopted around power management integrated circuits (PMICs). On the other hand, in order to make products thinner and increase the degree of freedom of component layout, the demand for thin power inductors is growing. Summary of the invention

[0003] The present disclosure is directed to providing a coil electronic component having a thin thickness and no volume loss of a main body.

[0004] However, the objects of the present disclosure are not limited to the above objects and can be expanded in various ways within the spirit and scope of the present disclosure.

[0005] A coil electronic component according to an aspect of the present disclosure may include: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface, the second surface, the third surface and the fourth surface; a coil, at least a portion of which is embedded in the main body; a first external electrode, which is arranged on the sixth surface of the main body and extends to a portion of the first surface and is connected to the coil; a second external electrode, which is arranged on the sixth surface of the main body and extends to a portion of the second surface and is connected to the coil; a first insulating layer, which covers the first external electrode on the first surface of the main body; and a second insulating layer, which covers the second external electrode on the second surface of the main body.

[0006] The coil electronic component may also include: a third insulating layer surrounding the edge of the first external electrode on the first surface of the main body, the edge facing the third surface, the fourth surface and the fifth surface; and a fourth insulating layer surrounding the edge of the second external electrode on the second surface of the main body, the edge facing the third surface, the fourth surface and the fifth surface.

[0007] The first insulating layer may cover at least a portion of the third insulating layer, and the second insulating layer may cover at least a portion of the fourth insulating layer.

[0008] The first external electrode may include a first electrode pad disposed on the sixth surface of the body and a first connection portion disposed on the first surface of the body, and the second external electrode may include a second electrode pad disposed on the sixth surface of the body and a second connection portion disposed on the second surface of the body.

[0009] The first electrode pad and the first connection portion may be an integrated structure, and the second electrode pad and the second connection portion may be an integrated structure.

[0010] The first connection portion may be spaced apart from the fifth surface of the body, and the second connection portion may be spaced apart from the fifth surface of the body.

[0011] The first connection portion may be spaced apart from each of the third surface and the fourth surface of the body, and the second connection portion may be spaced apart from each of the third surface and the fourth surface of the body.

[0012] The coil may be a wound coil.

[0013] The coil electronic component may also include: a supporting member, which is arranged in the main body and has a first supporting surface and a second supporting surface opposite to each other, wherein the coil may include a first coil pattern arranged on the first supporting surface of the supporting member, a second coil pattern arranged on the second supporting surface of the supporting member, and a via connecting the first coil pattern and the second coil pattern.

[0014] The body may be a stacked body of a plurality of sheets, and the coil may include a plurality of coil patterns that are provided on corresponding sheets among the plurality of sheets and connected to each other.

[0015] The coil electronic component may further include: a fifth insulating layer disposed between the first external electrode and the second external electrode on the sixth surface of the body.

[0016] The fifth insulating layer may also be disposed on the third surface, the fourth surface, and the fifth surface of the body.

[0017] According to another aspect of the present disclosure, a coil electronic component may include: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface, the second surface, the third surface and the fourth surface, a first recess spaced apart from the fifth surface of the main body being provided on the first surface, and a second recess spaced apart from the fifth surface of the main body being provided on the second surface; a coil, at least a portion of which is embedded in the main body; a first external electrode including a first electrode pad and a first connecting portion, the first electrode pad being provided on the sixth surface of the main body, the first connecting portion being embedded in the first recess and connected to the coil; and a second external electrode including a second electrode pad and a second connecting portion, the second electrode pad being provided on the sixth surface of the main body, the second connecting portion being embedded in the second recess and connected to the coil.

[0018] Each of the first and second recesses may be spaced apart from the third and fourth surfaces of the body such that the first and second connection portions are spaced apart from the third and fourth surfaces of the body.

[0019] The coil electronic component may further include: a first insulating layer covering the first connection portion embedded in the first recess; and a second insulating layer covering the second connection portion embedded in the second recess.

[0020] The coil electronic component may also include: a third insulating layer surrounding the edges of the third surface, the fourth surface and the fifth surface of the first connecting part facing the main body; and a fourth insulating layer surrounding the edges of the third surface, the fourth surface and the fifth surface of the second connecting part facing the main body.

[0021] The coil electronic component may further include: a fifth insulating layer disposed between the first electrode pad and the second electrode pad on the sixth surface of the body.

[0022] Each of the first electrode pad and the second electrode pad may include at least one plated layer, and an outer surface of the at least one plated layer may protrude from an outer surface of the fifth insulating layer in the third direction.

[0023] The first insulating layer and the second insulating layer may also extend in the third direction from the outer surface of the first electrode pad in the first direction and the outer surface of the second electrode pad in the first direction, and the side surface of the at least one plating layer included in the first electrode pad in the first direction may be adjacent to the side surface of the first insulating layer in the first direction, and the side surface of the at least one plating layer included in the second electrode pad in the first direction may be adjacent to the side surface of the second insulating layer in the first direction.

[0024] According to the embodiment, a coil electronic component having a thin thickness without a volume loss of a body can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment.

[0026] Figure 2 is along Figure 1 Schematic cross-sectional view taken along line II'.

[0027] Figure 3 It is schematically shown Figure 1 Side view of the coil electronics assembly.

[0028] Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F It is shown that the formation Figure 1 Figure 2 is a diagram of an example step for creating an outer electrode in a coil electronics assembly.

[0029] Figure 5 is a cross-sectional view schematically showing a coil electronic component according to a comparative example.

[0030] Figure 6 is a perspective view schematically showing a coil electronic component according to another embodiment.

[0031] Figure 7 is along Figure 6 Schematic cross-sectional view taken along line II-II'.

[0032] Figure 8 is a partial cross-sectional view schematically showing a coil electronic component according to still another embodiment. DETAILED DESCRIPTION

[0033] The present disclosure will be described more fully below with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. The drawings and description are to be considered illustrative rather than restrictive in nature. Throughout the specification, the same or similar reference numerals represent the same or similar elements. In addition, in the drawings, some constituent elements are exaggerated, omitted or briefly shown, and the sizes of the individual constituent elements do not reflect the actual sizes.

[0034] The accompanying drawings are provided only to allow the embodiments disclosed in this specification to be easily understood and should not be interpreted as limiting the spirit disclosed in this specification. It should be understood that the present disclosure includes all modifications, equivalents, and alternatives without departing from the scope and spirit of the present disclosure.

[0035] Terms including ordinal numbers such as "first", "second", etc. will only be used to describe various constituent elements and should not be interpreted as limiting these constituent elements. These terms are only used to distinguish one constituent element from another constituent element.

[0036] It should be understood that when an element such as a layer, film, region, area or substrate is referred to as being "on" or "above" another element, it can be directly on the other element, or there can be intervening elements. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. In addition, in this specification, the words "on..." or "above..." mean being disposed on or below a target portion, and do not necessarily mean being disposed on the upper side of the target portion based on the direction of gravity.

[0037] Throughout the specification, it should be understood that the terms "include", "comprising", "having" or "consisting of" indicate the presence of the features, quantities, steps, operations, constituent elements, components or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, constituent elements, components or combinations thereof. Unless explicitly described to the contrary, the words "include", "comprising", "having" or "consisting of" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0038] In addition, throughout the specification, the phrase "in a plan view" or "on a plane" means observing the target portion from above, and the phrase "in a cross-sectional view" or "on a cross section" means observing a cross section formed by vertically cutting the target portion from the side.

[0039] Furthermore, throughout the specification, when a component is described as being “connected” to another component, the component may be “directly connected” to the other component, may be “connected” to the other component through a third component, or may be physically and / or electrically connected to the other component, and the component and the other component may be integrated while being represented by different names according to position or function.

[0040] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment. Figure 2 is along Figure 1 Schematic cross-sectional view taken along line II'. Figure 3 It is schematically shown Figure 1 Side view of the coil electronics assembly.

[0041] Reference Figure 1 , Figure 2 and Figure 3 According to the embodiment, the coil electronic component 1000 includes a body (or referred to as a magnetic body) 100, a coil 200, a support member 300, a first external electrode 500, a second external electrode 600, a first insulating layer 710, a second insulating layer 720, a third insulating layer 730, a fourth insulating layer 740 and a fifth insulating layer 750.

[0042] The body 100 may have a substantially rectangular parallelepiped shape, but the present embodiment is not limited thereto. Due to the shrinkage of the body 100 during sintering, the body 100 may have a substantially rectangular parallelepiped shape, rather than a perfect rectangular parallelepiped shape. For example, the body 100 may have a substantially rectangular parallelepiped shape, and its corners or vertex portions may have a rounded shape.

[0043] In this embodiment, for the sake of convenience of explanation, the two surfaces opposite to each other in the length direction (L-axis direction) are respectively defined as the first surface S1 and the second surface S2, the two surfaces opposite to each other in the width direction (W-axis direction) are respectively defined as the third surface S3 and the fourth surface S4, and the two surfaces opposite to each other in the thickness direction (T-axis direction) are respectively defined as the fifth surface S5 and the sixth surface S6.

[0044] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph obtained by photographing a cross section of the coil electronic component 1000 in the length direction (L axis direction)-thickness direction (T axis direction) taken at the center of the coil electronic component 1000 in the width direction (W axis direction), the length of the coil electronic component 1000 may refer to: the maximum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Alternatively, the length of the coil electronic component 1000 may refer to: the minimum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Optionally, the length of the coil electronic component 1000 may refer to: the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph that are opposite to each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction).

[0045] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph obtained by photographing a cross section of the coil electronic component 1000 in the length direction (L axis direction)-thickness direction (T axis direction) taken at the center of the coil electronic component 1000 in the width direction (W axis direction), the thickness of the coil electronic component 1000 may refer to: the maximum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Alternatively, the thickness of the coil electronic component 1000 may refer to: the minimum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Optionally, the thickness of the coil electronic component 1000 may refer to: the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph that are opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction).

[0046] Based on an optical microscope photograph or a scanning electron microscope (SEM) photograph obtained by photographing a cross section of the coil electronic component 1000 in the length direction (L axis direction)-width direction (W axis direction) taken at the center of the coil electronic component 1000 in the thickness direction (T axis direction), the width of the coil electronic component 1000 may refer to: the maximum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Alternatively, the width of the coil electronic component 1000 may refer to: the minimum value of the lengths of a plurality of line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above cross-sectional photograph that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Optionally, the width of the coil electronic component 1000 may refer to: the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the coil electronic component 1000 shown in the above-mentioned cross-sectional photograph that are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction).

[0047] In addition, each of the length, width, and thickness of the coil electronic component 1000 can be measured using a micrometer measurement method. The micrometer measurement method can be measured using a micrometer with metrology R&R (repeatability and reproducibility) by the following method: setting a zero point, inserting the coil electronic component 1000 according to the present embodiment between the tips of the micrometer, and rotating the measuring rod of the micrometer. In addition, when the length of the coil electronic component 1000 is measured by using the micrometer measurement method, the length of the coil electronic component 1000 may refer to a value measured once, or may refer to an arithmetic mean of values ​​measured multiple times. The same applies to the measurement of the width and thickness of the coil electronic component 1000.

[0048] The body 100 constitutes the appearance of the coil electronic component 1000 and is a space forming a magnetic circuit, which is a path through which magnetic flux induced by the coil 200 passes when current is applied to the coil 200 through the first and second external electrodes 500 and 600 .

[0049] The body 100 surrounds and encloses the coil 200 and the support member 300, and includes an insulating material and a magnetic material. For example, the body 100 may include magnetic particles, and an insulating resin as an insulating material may be interposed between the magnetic particles.

[0050] The magnetic material may include a first metal magnetic powder, a second metal magnetic powder, and a third metal magnetic powder, wherein the second metal magnetic powder has a larger particle size than the first metal magnetic powder, and the third metal magnetic powder has a larger particle size than the second metal magnetic powder. 50The particle size D of the second metal magnetic powder may be greater than or equal to 0.1 μm and less than or equal to 0.2 μm. 50 The particle size D of the third metal magnetic powder may be greater than or equal to 1 μm and less than or equal to 2 μm. 50 It may be greater than or equal to 25 μm and less than or equal to 30 μm.

[0051] The magnetic particles may be ferrite particles or metal magnetic particles exhibiting magnetic properties.

[0052] For example, the ferrite particles may include at least one of spinel ferrite magnetic particles (such as Mg-Zn-based ferrite magnetic particles, Mn-Zn-based ferrite magnetic particles, Mn-Mg-based ferrite magnetic particles, Cu-Zn-based ferrite magnetic particles, Mg-Mn-Sr-based ferrite magnetic particles, Ni-Zn-based ferrite magnetic particles), hexagonal ferrite magnetic particles (such as Ba-Zn-based ferrite magnetic particles, Ba-Mg-based ferrite magnetic particles, Ba-Ni-based ferrite magnetic particles, Ba-Co-based ferrite magnetic particles, Ba-Ni-Co-based ferrite magnetic particles), garnet-type ferrite magnetic particles (such as Y-type ferrite magnetic particles) and Li-based ferrite magnetic particles.

[0053] The metal magnetic particles may include two or more particles having different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles may be at least one of pure iron particles, Fe-Si-based alloy particles, Fe-Si-Al-based alloy particles, Fe-Ni-based alloy particles, Fe-Ni-Mo-based alloy particles, Fe-Ni-Mo-Cu-based alloy particles, Fe-Co-based alloy particles, Fe-Ni-Co-based alloy particles, Fe-Cr-based alloy particles, Fe-Cr-Si-based alloy particles, Fe-Si-Cu-Nb-based alloy particles, Fe-Ni-Cr-based alloy particles, and Fe-Cr-Al-based alloy particles. Here, different compositions of the metal magnetic particles may refer to different contents.

[0054] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloy particles, but the present embodiment is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to about 30 μm, but is not limited thereto. In this specification, the average particle size may refer to the particle size represented by D 90 , D 50 The particle size distribution is expressed as the particle size distribution represented by the particle size distribution. The particle size distribution is well known to those skilled in the art as an indicator of the proportion of particles of a certain size (particle size) contained in the particle group to be measured. 50(The particle size corresponding to 50% of the cumulative amount of the particle size distribution) refers to the average particle size.

[0055] The metal magnetic particles may be two or more different types of metal magnetic particles. Here, different types of metal magnetic particles refer to metal magnetic particles that are different from each other in at least one of average diameter, composition, component ratio, crystallinity, and shape.

[0056] The insulating resin may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0057] There is no particular limitation on the method of forming the body 100. For example, the body 100 may be formed by placing magnetic material sheets on the upper and lower portions of the coil 200, and then pressing and curing the sheets.

[0058] The support member 300 is disposed inside the body 100 and supports the coil 200 .

[0059] The support member 300 may be made of a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be made of an insulating material formed by impregnating a reinforcing material such as glass fiber or an inorganic filler in the above insulating resin. For example, the support member 300 may be made of an insulating material such as a prepreg, ABF (Ajinomoto deposited film), FR-4, BT (bismaleimide triazine) film, PID (photosensitive dielectric) film, etc., however, the present embodiment is not limited thereto.

[0060] At least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) can be used as the inorganic filler.

[0061] The through hole 310 is located at the center of the support member 300. The through hole 310 may be filled with a magnetic material constituting the body 100 to form a core, thereby improving the performance of the coil electronic component.

[0062] The coil 200 is embedded in the body 100, and exhibits the characteristics of the coil electronic component 1000. For example, in the case where the coil electronic component 1000 of the present embodiment is used as a power inductor, when current is applied to the coil 200, the coil 200 can be used to stabilize the power supply of an electronic device by storing an electric field as a magnetic field to maintain an output voltage.

[0063] The coil 200 may be disposed on first and second supporting surfaces 320 and 330 of the supporting member 300 facing each other. The coil 200 may include first and second coil patterns 210 and 220 which may be electrically connected to each other through vias 230.

[0064] The first coil pattern 210 is disposed on the first supporting surface 320 of the supporting member 300 and includes a first lead-out portion 213 . The first lead-out portion 213 is exposed from the first surface S1 of the body 100 and is electrically connected to the first external electrode 500 .

[0065] The second coil pattern 220 is disposed on the second supporting surface 330 of the supporting member 300, and includes a second lead-out portion 223. The second lead-out portion 223 is exposed from the second surface S2 of the body 100, and is electrically connected to the second external electrode 600.

[0066] In addition, when the first coil pattern 210, the first lead-out portion 213 and the via 230 are formed on the first support surface 320 of the support member 300 by plating, the first coil pattern 210, the first lead-out portion 213 and the via 230 may include seed layers such as chemical plating layers and electroplating layers, respectively. Here, the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer of the multi-layer structure may be formed as a conformal film structure in which one electroplating layer is covered by another electroplating layer, or may be formed as a stacked structure in which one electroplating layer is only stacked on one surface of another electroplating layer. The seed layer of the first coil pattern 210, the seed layer of the first lead-out portion 213 and the seed layer of the via 230 may be formed integrally without a boundary between them, but the present embodiment is not limited thereto. The electroplating layer of the first coil pattern 210, the electroplating layer of the first lead-out portion 213 and the electroplating layer of the via 230 may be formed integrally without a boundary between them, but the present embodiment is not limited thereto. The above description may be equally applied to the second coil pattern 220 , the second lead-out portion 223 , and the via hole 230 .

[0067] Each of the coil 200 and the via 230 may be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), alloys thereof, etc., but the embodiment is not limited thereto.

[0068] The insulating layer IF may be disposed between the coil 200 and the main body 100. The insulating layer IF may be disposed along the surface of the support member 300 and the coil 200. The insulating layer IF does not exist in the portion where the support member 300 and the coil 200 are connected to the external electrodes 500 and 600. The insulating layer IF is used to insulate the coil 200 from the main body 100, and may include a known insulating material (such as polyparaxylene). Any insulating material may be used in the insulating layer IF, and there is no particular limitation. For example, the insulating layer IF may include a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating layer IF may be formed by a method such as vapor deposition, but is not limited thereto. For example, the insulating layer IF may be formed by stacking an insulating film on both sides of the support member 300.

[0069] The first and second external electrodes 500 and 600 are disposed outside the body 100 and connected to the coil 200. That is, the first and second external electrodes 500 and 600 are connected to the first and second lead-out portions 213 and 223 of the coil 200, respectively.

[0070] The first external electrode 500 extends from the sixth surface S6 of the body 100 to a portion of the first surface S1 and is connected to the first lead-out portion 213 of the coil 200 .

[0071] For example, the first external electrode 500 may include a first electrode pad 510 and a first connection part 520 .

[0072] The first electrode pad 510 is disposed on the sixth surface S6 of the body 100, and the first connection portion 520 extends from the first electrode pad 510 to the first surface S1 of the body 100. The first lead-out portion 213 of the coil 200 is exposed from the first surface S1 of the body 100 and connected to the first connection portion 520. Therefore, the coil 200 is electrically connected to the first external electrode 500.

[0073] The first electrode pad 510 and the first connection portion 520 may be an integrated structure. For example, the first electrode pad 510 and the first connection portion 520 may be formed by plating.

[0074] The second external electrode 600 extends from the sixth surface S6 of the body 100 to a portion of the second surface S2 and is connected to the second lead-out portion 223 of the coil 200 .

[0075] For example, the second external electrode 600 may include a second electrode pad 610 and a second connection part 620 .

[0076] The second electrode pad 610 is disposed on the sixth surface S6 of the body 100, and the second connection portion 620 extends from the second electrode pad 610 to the second surface S2 of the body 100. The second lead-out portion 223 of the coil 200 is exposed from the second surface S2 of the body 100 and connected to the second connection portion 620. Therefore, the coil 200 is electrically connected to the second external electrode 600.

[0077] The second electrode pad 610 and the second connection portion 620 may be an integrated structure. For example, the second electrode pad 610 and the second connection portion 620 may be formed by plating.

[0078] The first external electrode 500 may include a first metal layer 501 , a second metal layer 502 , and a third metal layer 503 .

[0079] The first metal layer 501 is a plating layer that contacts the first lead-out portion 213 of the coil 200 and the outer surface of the body 100 (ie, the first surface S1 and the sixth surface S6), and may include copper (Cu). The first metal layer 501 may include a portion corresponding to the first electrode pad 510 of the first external electrode 500 and a portion corresponding to the first connection portion 520 of the first external electrode 500.

[0080] The second metal layer 502 is a plated layer covering the first metal layer 501 and may include nickel (Ni). The second metal layer 502 may be disposed on a portion of the first metal layer 501 corresponding to the first electrode pad 510 , and may not be disposed on a portion of the first metal layer 501 corresponding to the first connection portion 520 .

[0081] The third metal layer 503 is a plating layer covering the second metal layer 502 and may include tin (Sn). The third metal layer 503 may be disposed on a portion of the second metal layer 502 corresponding to the first electrode pad 510 and may not be disposed on a portion of the first metal layer 501 corresponding to the first connection portion 520 .

[0082] However, the present embodiment is not limited to the above-mentioned three-layer structure, and a double-layer structure in which only one plating layer is added on the first metal layer 501 is also feasible. The lower surface of the plating layer protrudes from the outer surface of the fifth insulating layer 750 in the thickness direction (T-axis direction), and the side surface of the plating layer may be connected to the side surface of the first insulating layer 710 in the length direction (L-axis direction). The side surface of at least one plating layer (e.g., at least one of the first metal layer 501, the second metal layer 502, and the third metal layer 503) included in the first electrode pad 510 in the length direction (L-axis direction) is adjacent to the side surface of the first insulating layer 710 in the length direction (L-axis direction).

[0083] The second external electrode 600 may include a first metal layer 601 , a second metal layer 602 , and a third metal layer 603 .

[0084] The first metal layer 601 is a plating layer that contacts the second lead-out portion 223 of the coil 200 and the outer surface of the body 100 (ie, the second surface S2 and the sixth surface S6), and may include copper (Cu). The first metal layer 601 may include a portion corresponding to the second electrode pad 610 of the second external electrode 600 and a portion corresponding to the second connection portion 620 of the second external electrode 600.

[0085] The second metal layer 602 is a plated layer covering the first metal layer 601 and may include nickel (Ni). The second metal layer 602 may be disposed on a portion of the first metal layer 601 corresponding to the second electrode pad 610 , and may not be disposed on a portion of the first metal layer 601 corresponding to the second connection portion 620 .

[0086] The third metal layer 603 is a plating layer covering the second metal layer 602 and may include tin (Sn). The third metal layer 603 may be disposed on a portion of the second metal layer 602 corresponding to the second electrode pad 610 , and may not be disposed on a portion of the first metal layer 601 corresponding to the second connection portion 620 .

[0087] However, the present embodiment is not limited to the above-mentioned three-layer structure, and a double-layer structure in which only one plating layer is added to the first metal layer 601 is also feasible. The lower surface of the plating layer protrudes from the outer surface of the fifth insulating layer 750 in the thickness direction (T-axis direction), and the side surface of the plating layer may be connected to the side surface of the second insulating layer 720 in the length direction (L-axis direction). The side surface of at least one plating layer (e.g., at least one of the first metal layer 601, the second metal layer 602, and the third metal layer 603) included in the second electrode pad 620 in the length direction (L-axis direction) is adjacent to the side surface of the second insulating layer 720 in the length direction (L-axis direction).

[0088] As described above, the first external electrode 500 and the second external electrode 600 may each include nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof, and may each include a plurality of plating layers. For example, the first external electrode 500 and the second external electrode 600 may each include a nickel (Ni) layer, a copper (Cu) layer, a nickel / copper (Ni / Cu) layer, a palladium / nickel (Pd / Ni) layer, a palladium / nickel / copper (Pd / Ni / Cu) layer, or a copper / nickel / copper (Cu / Ni / Cu) layer.

[0089] In some embodiments, the outermost layer may be made of tin (Sn). Since the tin plating layer has a relatively low melting point, the mountability of the first and second external electrodes 500 and 600 on the substrate may be improved.

[0090] Generally, the tin-plated layer may be connected to an electrode pad on a substrate via a solder including a tin (Sn)-copper (Cu)-silver (Ag) alloy paste. That is, during a reflow process, the tin-plated layer and the solder may be melted and bonded to each other.

[0091] The first insulating layer 710 covers the first external electrode 500 on the first surface S1 of the body 100. The second insulating layer 720 covers the second external electrode 600 on the second surface S2 of the body 100.

[0092] The third insulating layer 730 surrounds the edge of the first external electrode 500 on the first surface S1 of the body 100 toward the third surface S3, the fourth surface S4, and the fifth surface S5. For example, in three regions between the first connection portion 520 and the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100, the third insulating layer 730 contacts the first connection portion 520 and covers the first surface S1 of the body 100.

[0093] The first insulating layer 710 covers the first external electrode 500 on the first surface S1 of the body 100, and thus the first insulating layer 710 may cover the first connection portion 520. The first insulating layer 710 may also cover the third insulating layer 730 surrounding the edge of the first connection portion 520. That is, the first insulating layer 710 may cover the first connection portion 520 and the third insulating layer 730. The first insulating layer 710 may extend from the outer surface of the first electrode pad 510 in the length direction (L-axis direction) in the thickness direction (T-axis direction).

[0094] The fourth insulating layer 740 surrounds the edge of the second external electrode 600 on the second surface S2 of the body 100 that faces the third surface S3, the fourth surface S4, and the fifth surface S5. For example, in three regions between the second connection portion 620 and the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100, the fourth insulating layer 740 contacts the second connection portion 620 and covers the second surface S2 of the body 100.

[0095] The second insulating layer 720 covers the second external electrode 600 on the second surface S2 of the body 100, and thus the second insulating layer 720 may cover the second connection portion 620. The second insulating layer 720 may also cover the fourth insulating layer 740 surrounding the edge of the second connection portion 620. That is, the second insulating layer 720 may cover the second connection portion 620 and the fourth insulating layer 740. The second insulating layer 720 may extend from the outer surface of the second electrode pad 610 in the length direction (L-axis direction) in the thickness direction (T-axis direction).

[0096] The fifth insulating layer 750 may be disposed in a region on the sixth surface S6 of the body 100 where the first external electrode 500 and the second external electrode 600 are not disposed. That is, the fifth insulating layer 750 may be disposed in a region other than the first electrode pad 510 and the second electrode pad 610 on the sixth surface S6 of the body 100. The fifth insulating layer 750 may also be disposed on at least a portion of the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100. The fifth insulating layer 750 may prevent an electrical short circuit between other electronic components and the external electrodes 500 and 600.

[0097] In the above, the first insulating layer 710, the second insulating layer 720, the third insulating layer 730, the fourth insulating layer 740 and the fifth insulating layer 750 are described, and they may not be formed in the listed order. In addition, these insulating layers may be made of the same material, or may be made of different materials.

[0098] Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F It is shown that the formation Figure 1 Since the structures and materials of the first external electrode 500 and the second external electrode 600 correspond to each other, the first external electrode 500 will be mainly described below.

[0099] Reference Figure 4A , a portion of the fifth insulating layer 750 on the sixth surface S6 of the body 100 is removed to form the first pad region 910 and the second pad region 920. The method of removing the fifth insulating layer 750 may include a grinding process, but is not limited thereto.

[0100] The first pad region 910 and the second pad region 920 are spaced apart from each other in the length direction (L-axis direction). That is, the fifth insulating layer 750 remains between the first pad region 910 and the second pad region 920. The first electrode pad 510 is then disposed in the first pad region 910, and the second electrode pad 610 is then disposed in the second pad region 920.

[0101] A portion of the fifth insulating layer 750 is also removed from the first surface S1 of the body 100 where the first connection portion 520 is to be disposed and from the second surface S2 of the body 100 where the second connection portion 620 is to be disposed.

[0102] Reference Figure 4B , a third insulating layer 730 is disposed on a first surface S1 of the body 100 where the first connection portion 520 is disposed, and a fourth insulating layer 740 is disposed on a second surface S2 of the body 100 where the second connection portion 620 is disposed.

[0103] Reference Figure 4C , a portion of the third insulating layer 730 is removed from the first surface S1 of the body 100 to expose the first lead-out portion 213 of the coil 200, and a portion of the fourth insulating layer 740 is removed from the second surface S2 to expose the second lead-out portion 223 of the coil 200. In this case, by using a laser, the third insulating layer 730 may be etched on the first surface S1 of the body 100 to form a first recess 930, and the fourth insulating layer 740 may be etched on the second surface S2 to form a second recess 940. However, the method of removing the third insulating layer is not limited thereto. The first recess 930 may have a shape in which a portion of the third insulating layer 730 is recessed to expose the first surface S1 of the body 100, and the second recess 940 may have a shape in which a portion of the fourth insulating layer 740 is recessed to expose the second surface S2 of the body 100. In other words, the first recess 930 may be an area surrounded by the third insulating layer 730 like a wall, and the second recess 940 may be an area surrounded by the fourth insulating layer 740 like a wall. That is, in the length direction (L-axis direction), the third insulating layer 730 protrudes beyond the first recess 930, and the fourth insulating layer 740 protrudes beyond the second recess 940. However, the first recess 930 may be in an open shape on one side facing the sixth surface S6, and the second recess 940 may be in an open shape on one side facing the sixth surface S6.

[0104] Reference Figure 4D , plating is performed on the first pad region 910 and the first recess 930 to form a first metal layer 501 spanning the first pad region 910 and the first recess 930 , and plating is performed on the second pad region 920 and the second recess 940 to form a first metal layer 601 spanning the second pad region 920 and the second recess 940 .

[0105] The first recess 930 is surrounded by the third insulating layer 730 except for one side of the sixth surface S6 of the body 100. In particular, since the third insulating layer 730 is also disposed between the first recess 930 and the fifth surface S5 of the body 100, the plating can be prevented from diffusing to the fifth surface S5. That is, in the length direction (L-axis direction), since the third insulating layer 730 protrudes more than the first recess 930, the third insulating layer 730 can be used as a wall to block the plating growth toward the fifth surface S5 of the body 100. As a result, the portion of the first metal layer 501 filled in the first recess 930 is surrounded by the third insulating layer 730.

[0106] Reference Figure 4E, a first insulating layer 710 is formed to cover the first metal layer 501. The first insulating layer 710 may cover both the first metal layer 501 and the third insulating layer 730. The first metal layer 501 located in the first pad region 910 on the sixth surface S6 is not covered by the first insulating layer 710. Similarly, a second insulating layer 720 is formed to cover the first metal layer 601. The second insulating layer 720 may cover both the first metal layer 601 and the fourth insulating layer 740. The first metal layer 601 located in the second pad region 920 on the sixth surface S6 is not covered by the second insulating layer 720.

[0107] Reference Figure 4F , additional plating is performed to cover the first metal layer 501 in the first pad region 910 and the first metal layer 601 in the second pad region 920. Thus, the second metal layer 502 and the second metal layer 602 and the third metal layer 503 and the third metal layer 603 may be formed.

[0108] Figure 5 is a cross-sectional view schematically showing a coil electronic component according to a comparative example.

[0109] Reference Figure 5 , the coil electronic component according to the comparative example includes a slit 110' and an insulating layer 700' disposed in the slit 110', and the slit 110' is formed by partially removing the edge of the first surface S1' toward the fifth surface S5' of the main body 100'. In this case, since the insulating layer 700' formed in the slit 110' does not protrude from the first surface S1' of the main body 100', the effect of preventing the plating P from diffusing toward the fifth surface S5' may not be significant. In this case, since a portion of the main body 100' is removed to form the slit 110', the volume of the main body 100' is reduced by an amount corresponding to the removed portion. As a result, the characteristics of the coil electronic component may be adversely affected.

[0110] On the other hand, according to this embodiment, since the third insulating layer 730 can be used as a wall, it can effectively block the plating from diffusing to the fifth surface S5 of the body 100, and since there is no need to remove a portion of the body 100 to prevent the plating from diffusing, the characteristics of the coil electronic component can be enhanced.

[0111] Figure 6 is a perspective view schematically showing a coil electronic component according to another embodiment. Figure 7 is along Figure 6 Schematic cross-sectional view taken along line II-II'.

[0112] Reference Figure 6 and Figure 7The coil electronic component 2000 includes a body 1100 , a coil 1200 , a first external electrode 500 , a second external electrode 600 , a first insulating layer 710 , a second insulating layer 720 , a third insulating layer 730 , a fourth insulating layer 740 and a fifth insulating layer 750 .

[0113] The coil 1200 may include at least one turn of a conducting wire. For example, the coil 1200 may be in the form of a spirally wound metal (e.g., copper (Cu) or silver (Ag)) wire coated with an insulating material on the surface. That is, the coil 1200 may be a wound coil. The coil 1200 is not limited to a single wire and may include a twisted wire or two or more wires.

[0114] The coil 1200 may be a circular coil, but is not limited thereto. For example, the coil 1200 may be various well-known coils, such as a rectangular coil.

[0115] The cross-section of each wire of the coil 1200 may have various well-known shapes, such as square, circular, triangular, and elliptical.

[0116] The coil 1200 may include multiple layers. The coil 1200 may include a first coil 1210 and a second coil 1220. The second coil 1220 may be connected to the first coil 1210 and disposed above the first coil 1210, ie, on a side facing the fifth surface S5 of the body 1100.

[0117] The number of turns of the first coil 1210 and the number of turns of the second coil 1220 may be the same or different.

[0118] The coil 1200 may have a planar spiral shape and may have multiple turns. That is, the second coil 1220 may include the innermost turn coil C1, at least one intermediate turn coil C2, and the outermost turn coil C3 in the direction from the center point of the body 1100 in the length direction (L-axis direction) to the second surface S2. The first coil 1210 may include the innermost turn coil C1', at least one intermediate turn coil C2', and the outermost turn coil C3' in the direction from the center point of the body 1100 in the length direction (L-axis direction) to the second surface S2.

[0119] The insulating layer IF may be provided along the surface of each of the multiple turns of the coil 1200. The insulating layer IF is used to protect and insulate the multiple turns of the first coil 1210 and the second coil 1220, and may include a known insulating material such as polyparaxylene. Any insulating material may be used in the insulating layer IF, and there is no particular limitation. For example, the insulating layer IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating layer IF may be formed by a method such as vapor deposition, but is not limited thereto.

[0120] The coil 1200 may include a winding portion 1230 , a first lead-out portion 1213 , and a second lead-out portion 1223 .

[0121] The winding portion 1230 is a portion where the metal wire forms at least one turn.

[0122] The first lead portion 1213 extends from one end of the winding portion 1230 and is exposed from the first surface S1 of the body 1100. The first lead portion 1213 is connected to the first external electrode 500. The second lead portion 1223 extends from the other end of the winding portion 1230 and is exposed from the second surface S2 of the body 1100. The second lead portion 1223 is connected to the second external electrode 600.

[0123] Components other than the above components and Figure 1 The components of the coil electronic assembly shown are the same, so repeated descriptions thereof will be omitted.

[0124] Figure 8 is a partial cross-sectional view schematically showing a coil electronic component according to still another embodiment.

[0125] Reference Figure 8 The coil electronic component 3000 includes a body 2100 , a coil 2200 , a first external electrode 500 , a second external electrode 600 , a first insulating layer 710 , a second insulating layer 720 , a third insulating layer 730 , a fourth insulating layer 740 and a fifth insulating layer 750 .

[0126] The body 2100 may be a stacked body of a plurality of sheets including a magnetic material stacked in a thickness direction (T-axis direction). The coil 2200 may include a plurality of coil patterns 2210 disposed on respective sheets and connected to each other.

[0127] A first lead portion 2213 is provided at one end of the coil 2200, and a second lead portion 2223 is provided at the other end of the coil 2200. The first lead portion 2213 is exposed from the first surface S1 of the body 2100 and connected to the first external electrode 500. The second lead portion 2223 is exposed from the second surface S2 of the body 2100 and connected to the second external electrode 600.

[0128] Components other than the above Figure 1 The components of the coil electronic assembly shown are the same, so repeated descriptions thereof will be omitted.

[0129] While the present disclosure has been described in connection with what are presently considered to be practical embodiments, it should be understood that the present disclosure is not limited to the disclosed embodiments, but on the contrary is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

[0130] <Description of Reference Numerals> 1000, 2000, 3000: Coil electronics 100, 1100, 2100: Main body 200, 1200, 2200: Coil 210: First coil pattern 220: Second coil pattern 230: Via 213, 1213, 2213: First lead-out section 223, 1223, 2223: Second lead-out section 300: Supporting member 500: First outer electrode 501, 601: First metal layer 502, 602: Second metal layer 503, 603: The third metal layer 510: First electrode pad 520: First connection part 600: Second outer electrode 610: Second electrode pad 620: Second connection part 710: First insulation layer 720: Second insulation layer 730: The third insulation layer 740: Fourth insulation layer 750: Fifth insulation layer 910: First pad area 920: Second pad area 930: First recess 940: Second recess 1210: First coil 1220: Second coil 1230: Winding Department 2210: Coil pattern IF: Insulation layer.

Claims

1. A coil electronic assembly, comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface, the second surface, the third surface and the fourth surface; a coil, at least a portion of which is embedded in the body; a first external electrode disposed on the sixth surface of the body and extending onto a portion of the first surface to be connected to the coil; a second external electrode disposed on the sixth surface of the body and extending onto a portion of the second surface to be connected to the coil; a first insulating layer covering the first external electrode on the first surface of the body; as well as A second insulating layer covers the second external electrode on the second surface of the body.

2. The coil electronic component according to claim 1, further comprising: a third insulating layer surrounding an edge of the first external electrode on the first surface of the body, the edge facing the third surface, the fourth surface, and the fifth surface of the body; as well as A fourth insulating layer surrounds an edge of the second external electrode on the second surface of the body, the edge facing the third surface, the fourth surface, and the fifth surface of the body.

3. The coil electronic assembly according to claim 2, wherein: The first insulating layer covers at least a portion of the third insulating layer; and The second insulating layer covers at least a portion of the fourth insulating layer.

4. The coil electronic assembly according to claim 1, wherein: The first external electrode includes a first electrode pad disposed on the sixth surface of the body and a first connection portion disposed on the first surface of the body; and The second external electrode includes a second electrode pad disposed on the sixth surface of the body and a second connection portion disposed on the second surface of the body.

5. The coil electronic assembly according to claim 4, wherein: The first electrode pad and the first connecting portion are integrally formed; and The second electrode pad and the second connecting portion are integrally formed.

6. The coil electronics assembly according to claim 4, wherein: The first connecting portion is spaced apart from the fifth surface of the body; and The second connection portion is spaced apart from the fifth surface of the body.

7. The coil electronics assembly according to claim 6, wherein: The first connection portion is spaced apart from each of the third surface and the fourth surface of the body; and The second connection portion is spaced apart from each of the third surface and the fourth surface of the body.

8. The coil electronics assembly according to claim 1, wherein: The coil is a wound coil.

9. The coil electronic assembly according to claim 1, further comprising: a support member disposed in the body and having a first support surface and a second support surface opposite to each other, The coil includes a first coil pattern disposed on the first supporting surface of the supporting member, a second coil pattern disposed on the second supporting surface of the supporting member, and a via connecting the first coil pattern and the second coil pattern.

10. The coil electronics assembly according to claim 1, wherein: The main body is a stack of multiple sheets; and The coil includes a plurality of coil patterns that are provided on corresponding sheets among the plurality of sheets and are connected to each other.

11. The coil electronic assembly according to claim 1, further comprising: A fifth insulating layer is disposed between the first external electrode and the second external electrode on the sixth surface of the body.

12. The coil electronics assembly of claim 11, wherein: The fifth insulating layer is also disposed on the third surface, the fourth surface, and the fifth surface of the body.

13. A coil electronic assembly comprising: A main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface, the second surface, the third surface and the fourth surface, wherein a first recessed portion spaced apart from the fifth surface of the main body is provided on the first surface, and a second recessed portion spaced apart from the fifth surface of the main body is provided on the second surface; a coil, at least a portion of which is embedded in the body; a first external electrode, comprising a first electrode pad and a first connecting portion, wherein the first electrode pad is disposed on the sixth surface of the body, and the first connecting portion is embedded in the first recess and connected to the coil; as well as The second external electrode includes a second electrode pad and a second connecting portion, wherein the second electrode pad is disposed on the sixth surface of the main body, and the second connecting portion is embedded in the second recess and connected to the coil.

14. The coil electronic component according to claim 13, wherein: Each of the first and second recesses is spaced apart from the third and fourth surfaces of the body, so that the first and second connecting portions are spaced apart from the third and fourth surfaces of the body.

15. The coil electronics assembly according to claim 14, further comprising: a first insulating layer covering the first connecting portion embedded in the first recess; as well as The second insulating layer covers the second connecting portion embedded in the second recess.

16. The coil electronics assembly according to claim 15, further comprising: a third insulating layer surrounding edges of the third surface, the fourth surface, and the fifth surface of the first connecting portion facing the main body; as well as A fourth insulating layer surrounds edges of the second connecting portion that face the third surface, the fourth surface, and the fifth surface of the main body.

17. The coil electronics assembly according to claim 16, further comprising: A fifth insulating layer is disposed between the first electrode pad and the second electrode pad on the sixth surface of the body.

18. The coil electronics assembly of claim 17, wherein: Each of the first electrode pad and the second electrode pad includes at least one plating layer, and An outer surface of the at least one plating layer protrudes from an outer surface of the fifth insulating layer in the third direction.

19. The coil electronics assembly of claim 18, wherein: The first insulating layer and the second insulating layer further extend in the third direction from an outer surface of the first electrode pad in the first direction and an outer surface of the second electrode pad in the first direction, and The side surface of the at least one plating layer included in the first electrode pad in the first direction is adjacent to the side surface of the first insulating layer in the first direction, and the side surface of the at least one plating layer included in the second electrode pad in the first direction is adjacent to the side surface of the second insulating layer in the first direction.

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