Movable device and winding type capacitor packaging structure thereof

Abstract

The invention provides a movable device and a winding type capacitor packaging structure thereof. The winding type capacitor packaging structure comprises a winding type assembly, a conductive assembly, a packaging assembly and a bottom seat plate. The conductive component comprises a first conductive pin and a second conductive pin. The first exposed part of the first conductive pin and the second exposed part of the second conductive pin pass through the bottom seat plate and are partially exposed from a bottom end of the bottom seat plate. A first gap between 0.01 mm and 0.2 mm is arranged between the first exposed part of the first conductive pin and the inner surface of the first bottom end guide channel of the bottom seat plate. A first exposed height from the bottom end of the first exposed part to the bottom end of the bottom seat plate is between 0.01 mm and 0.3 mm. A second gap between 0.01 mm and 0.2 mm is arranged between the second exposed part of the second conductive pin and the inner surface of the second bottom end guide channel of the bottom seat plate. And a second exposed height from the bottom end of the second exposed part to the bottom end of the bottom seat plate is between 0.01 mm and 0.3 mm.

Description

Technical Field

[0001] The present invention relates to a capacitor packaging structure, in particular to a winding capacitor packaging structure and a movable device using the winding capacitor packaging structure. Background Art

[0002] Capacitors have been widely used as basic components in consumer home appliances, computer motherboards, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase rotation, etc., and they are one of the indispensable components in electronic products. However, the wound capacitors of the prior art still have room for improvement. In particular, when the wound capacitors are set on the circuit substrate, the conductive pins of the wound capacitors cannot be surrounded by solder, which makes it impossible for the wound capacitors to be firmly fixed on the circuit board in a vibrating environment. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a movable device and a winding capacitor packaging structure thereof to address the deficiencies of the prior art, so that the first conductive pin and the second conductive pin can be firmly fixed or combined on the circuit substrate by surrounding the first conductive material and the second conductive material respectively.

[0004] In order to solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a wound capacitor packaging structure, which includes a wound component, a conductive component, a packaging component and a bottom base plate. The wound component includes a wound positive electrode conductive foil, a wound negative electrode conductive foil and two wound separators. The conductive component includes a first conductive pin electrically contacting the wound positive electrode conductive foil and a second conductive pin electrically contacting the wound negative electrode conductive foil. The wound component is coated inside the packaging component. The bottom base plate is arranged at the bottom end of the packaging component to support the packaging component.One of the two wound separators is arranged between the wound positive electrode conductive foil and the wound negative electrode conductive foil, and one of the wound positive electrode conductive foil and the wound negative electrode conductive foil is arranged between the two wound separators; the first conductive pin includes a first embedded portion accommodated in the packaging component and a first exposed portion exposed outside the packaging component, the second conductive pin includes a second embedded portion accommodated in the packaging component and a second exposed portion exposed outside the packaging component, and the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin both pass through the bottom seat plate and are partially exposed from a bottom end of the bottom seat plate. The bottom base plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; the bottom base plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; a first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom base plate is between 0.01 mm and 0.2 mm, and the first exposed portion of the first conductive pin is A bottom end of the exposed portion is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height of the bottom end of the first exposed portion is between 0.01 mm and 0.3 mm from the bottom end of the bottom seat plate; wherein a second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate is between 0.01 mm and 0.2 mm, a bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height of the bottom end of the second exposed portion is between 0.01 mm and 0.3 mm from the bottom end of the bottom seat plate; wherein, when the wound capacitor packaging structure When the structure is electrically connected to a circuit substrate by contacting a first conductive material and a second conductive material respectively through a first conductive pin and a second conductive pin, the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material to a first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate through a capillary action, and the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material to a second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate through a capillary action.

[0005] In order to solve the above-mentioned problem, another technical means adopted by the present invention is to provide a wound capacitor packaging structure, which includes a wound component, a conductive component, a packaging component and a bottom base plate. The conductive component includes a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component. The wound component is coated inside the packaging component. The bottom base plate is arranged at the bottom end of the packaging component to support the packaging component. Wherein, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin both pass through the bottom seat plate and are partially exposed from a bottom end of the bottom seat plate; wherein the bottom seat plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; wherein the bottom seat plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; wherein there is a gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate A first gap between 0.01mm and 0.2mm, a bottom end of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom seat plate is between 0.01mm and 0.3mm; wherein, a second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate is between 0.01mm and 0.2mm, a bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is between 0.01mm and 0.3mm.

[0006] In order to solve the above-mentioned problem, another technical means adopted by the present invention is to provide a movable device, which is configured to use a winding capacitor packaging structure, and the winding capacitor packaging structure includes a winding component, a conductive component, a packaging component and a bottom seat plate. Wherein, the conductive component includes a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component, the wound component is wrapped inside the packaging component, and the bottom seat plate is arranged at the bottom end of the packaging component for supporting the packaging component; wherein a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin both pass through the bottom seat plate and are partially exposed from a bottom end of the bottom seat plate; wherein the bottom seat plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; wherein the bottom seat plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom The guide channel extends; wherein, a first gap between 0.01mm and 0.2mm is provided between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate, a bottom end of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height between the bottom end of the first exposed portion and the bottom end of the bottom seat plate is between 0.01mm and 0.3mm; wherein, a second gap between 0.01mm and 0.2mm is provided between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate, a bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height between the bottom end of the second exposed portion and the bottom end of the bottom seat plate is between 0.01mm and 0.3mm.

[0007] In one feasible or preferred embodiment, the packaging component includes a packaging shell configured to accommodate a winding component and a bottom closing structure arranged inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom closing structure.

[0008] In one feasible or preferred embodiment, the bottom seat plate has a plurality of first inner surfaces located in the first bottom guide channel, and the plurality of first inner surfaces include two first side inner surfaces corresponding to each other and a first top inner surface connected between the two first side inner surfaces. The first exposed portion of the first conductive pin has a first horizontal distance from one of the first side inner surfaces between 0.01 mm and 0.2 mm, and the first exposed portion of the first conductive pin has a first vertical distance from the first top inner surface between 0.01 mm and 0.2 mm; before the wound capacitor packaging structure is electrically connected to the circuit substrate, the ratio of a first thickness of the first conductive material disposed on the circuit substrate to a first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.3.

[0009] In one feasible or preferred embodiment, the bottom seat plate has a plurality of second inner surfaces located in the second bottom guide channel, and the plurality of second inner surfaces include two second side inner surfaces corresponding to each other and a second top inner surface connected between the two second side inner surfaces. The second exposed portion of the second conductive pin has a second horizontal distance from one of the second side inner surfaces between 0.01 mm and 0.2 mm, and the second exposed portion of the second conductive pin has a second vertical distance from the second top inner surface between 0.01 mm and 0.2 mm; before the wound capacitor packaging structure is electrically connected to the circuit substrate, the ratio of a second thickness of the second conductive material disposed on the circuit substrate to the second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.3.

[0010] In one feasible or preferred embodiment, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom guide channel and the second bottom guide channel are located between the at least two protruding support portions, and the height of each protruding support portion is equal to the first exposed height or the second exposed height.

[0011] One of the beneficial effects of the present invention is that the mobile device and the wound capacitor packaging structure provided by the present invention can be provided by "a first gap between 0.01 mm and 0.2 mm between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate", "a first exposed height between the bottom end of the first exposed portion and the bottom end of the bottom seat plate is between 0.01 mm and 0.3 mm", "a second gap between 0.01 mm and 0.2 mm between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate" and so on. And the technical solution of "the bottom end of the second exposed portion is at a second exposed height between 0.01mm and 0.3mm from the bottom end of the bottom seat plate", so that the first conductive pin and the second conductive pin can be firmly fixed or combined on the circuit substrate through the surrounding wrapping of the first conductive material and the second conductive material respectively, which will help to enhance the anti-vibration effect of the wound capacitor packaging structure (for example, the wound capacitor packaging structure can be suitable for any type of transportation), and can also ensure the electrical connection between the wound capacitor packaging structure and the circuit substrate (there will be no short circuit).

[0012] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional schematic diagram of the cooperation between the winding component and the conductive component provided by the first embodiment of the present invention.

[0014] Figure 2 It is a front view schematic diagram of a wound capacitor packaging structure provided by a first embodiment of the present invention.

[0015] Figure 3 It is a schematic diagram of the left side view of the wound capacitor packaging structure provided by the first embodiment of the present invention.

[0016] Figure 4 It is a schematic right side view of the wound capacitor packaging structure provided by the first embodiment of the present invention.

[0017] Figure 5 for Figure 3 An enlarged schematic diagram of part V.

[0018] Figure 6 for Figure 4 Schematic enlargement of the V1 part.

[0019] Figure 7It is an enlarged schematic diagram of the first conductive pin of the wound capacitor packaging structure provided by the first embodiment of the present invention before contacting the first conductive material.

[0020] Figure 8 It is an enlarged schematic diagram of the second conductive pin of the wound capacitor packaging structure provided by the first embodiment of the present invention before contacting the second conductive material.

[0021] Fig. 9 It is an enlarged schematic diagram of the first conductive pin of the wound capacitor packaging structure provided by the first embodiment of the present invention after contacting the first conductive material.

[0022] Fig.10 It is an enlarged schematic diagram of the second conductive pin of the wound capacitor packaging structure provided by the first embodiment of the present invention after contacting the second conductive material.

[0023] Fig.11 A functional block diagram of a mobile device using a wound capacitor packaging structure provided by a second embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation methods of the "movable device and its wound capacitor packaging structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0025] [First embodiment]

[0026] See also Figures 1 to 10 As shown, the first embodiment of the present invention provides a wound capacitor packaging structure S, which includes: a wound component 1, a conductive component 2, a packaging component 3 and a bottom base plate 4.

[0027] First, if Figure 1As shown, the wound assembly 1 includes a wound positive electrode conductive foil 11, a wound negative electrode conductive foil 12, and two wound separators 13. Further, one of the two wound separators 13 can be disposed between the wound positive electrode conductive foil 11 and the wound negative electrode conductive foil 12, and one of the wound positive electrode conductive foil 11 and the wound negative electrode conductive foil 12 can be disposed between the two wound separators 13 (e.g. Figure 1 The wound positive electrode conductive foil 11 is shown to be disposed between two wound separators 13). In addition, the wound separator 13 may be a separator paper or paper foil with conductive polymer attached thereto by impregnation. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0028] Furthermore, cooperation Figure 1 and Figure 2 As shown, the conductive component 2 includes a first conductive pin 21 electrically contacting the wound positive electrode conductive foil 11 and a second conductive pin 22 electrically contacting the wound negative electrode conductive foil 12, the wound component 1 is wrapped inside the packaging component 3, and the bottom base plate 4 is arranged at the bottom end of the packaging component 3 for supporting the packaging component 3. More specifically, the first conductive pin 21 includes a first embedded portion 211 accommodated inside the packaging component 3 and a first exposed portion 212 exposed outside the packaging component 3, and the second conductive pin 22 includes a second embedded portion 221 accommodated inside the packaging component 3 and a second exposed portion 222 exposed outside the packaging component 3. In addition, the first exposed portion 212 of the first conductive pin 21 and the second exposed portion 222 of the second conductive pin 22 both pass through the bottom base plate 4 and are partially exposed from a bottom end of the bottom base plate 4. For example, the packaging component 3 includes a packaging shell 31 (such as an aluminum shell or a shell made of any material) configured to accommodate the roll-up component 1 and a bottom end closing structure 32 (such as an aluminum shell or a shell made of any material) disposed inside the packaging shell 31 and cooperating with the packaging shell 31, and the packaging component is completely covered by the packaging shell 31 and the bottom end closing structure 32. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0029] Furthermore, with Figure 2 , Figure 3 and Figure 5As shown, the bottom seat plate 4 has a first through opening 411 and a first bottom guide channel 412 connected to the first through opening 411, and the first exposed portion 212 of the first conductive pin 21 can pass through the first through opening 411 and extend along the first bottom guide channel 412 (that is, the first exposed portion 212 can be partially accommodated in the first bottom guide channel 412 after being bent relative to the first embedded portion 211). It is worth noting that there may be a first gap G1 between the first exposed portion 212 of the first conductive pin 21 and the inner surface of the first bottom guide channel 412 of the bottom base plate 4, which is between 0.01 mm and 0.2 mm (i.e., any value in mm among 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.20, and the same range is also applicable to the examples herein), and a bottom end of the first exposed portion 212 of the first conductive pin 21 is spaced from the first bottom guide channel 412 of the bottom base plate 4 by a distance of 0.01 mm to 0.2 mm. The channel 412 is exposed, and a first exposed height H1 of the bottom end of the first exposed portion 212 from the bottom end of the bottom seat plate 4 can be between 0.01 mm and 0.3 mm (that is, any value in mm among 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.20, 0.21, 0.22, 0.23, 0.24, 0.25, 0.26, 0.27, 0.28, 0.29, 0.30, and the same range also applies to the examples here). For example, the bottom seat plate 4 has a plurality of first inner surfaces located in the first bottom guide channel 412, and the plurality of first inner surfaces include two first side inner surfaces 4121 corresponding to each other and a first top inner surface 4122 connected between the two first side inner surfaces 4121. In addition, a first horizontal distance HD1 between the first exposed portion 212 of the first conductive pin 21 and one of the first side inner surfaces 4121 may be between 0.01 mm and 0.2 mm, and a first vertical distance VD1 between the first exposed portion 212 of the first conductive pin 21 and the first top inner surface 4122 may be between 0.01 mm and 0.2 mm. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] Furthermore, with Figure 2 , Figure 4 and Figure 6As shown, the bottom seat plate 4 has a second through opening 421 and a second bottom guide channel 422 connected to the second through opening 421, and the second exposed portion 222 of the second conductive pin 22 can pass through the second through opening 421 and extend along the second bottom guide channel 422 (that is, the second exposed portion 222 can be partially accommodated in the second bottom guide channel 422 after being bent relative to the second embedded portion 221). It is worth noting that there may be a second gap G2 between the second exposed portion 222 of the second conductive pin 22 and the inner surface of the second bottom guide channel 422 of the bottom base plate 4, which is between 0.01 mm and 0.2 mm (that is, any value in mm among 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.20, and the same range is also applicable to the examples herein), and a bottom end of the second exposed portion 222 of the second conductive pin 22 is spaced from the second bottom guide channel 422 of the bottom base plate 4. The channel 422 is exposed, and a second exposed height H2 of the bottom end of the second exposed portion 222 from the bottom end of the bottom seat plate 4 can be between 0.01 mm and 0.3 mm (that is, any value in mm among 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.20, 0.21, 0.22, 0.23, 0.24, 0.25, 0.26, 0.27, 0.28, 0.29, 0.30, and the same range also applies to the examples here). For example, the bottom seat plate 4 has a plurality of second inner surfaces located in the second bottom guide channel 422, and the plurality of second inner surfaces include two second side inner surfaces 4221 corresponding to each other and a second top inner surface 4222 connected between the two second side inner surfaces 4221. In addition, a second horizontal distance HD2 between the second exposed portion 222 of the second conductive pin 22 and one of the second side inner surfaces 4221 may be between 0.01 mm and 0.2 mm, and a second vertical distance VD2 between the second exposed portion 222 of the second conductive pin 22 and the second top inner surface 4222 may be between 0.01 mm and 0.2 mm. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0031] For example, if Figure 7As shown, before the wound capacitor package structure S is electrically connected to the circuit substrate P, the ratio of "a first thickness T1 (e.g., 0.1 to 0.2 mm) of a first conductive material M1 (e.g., solder ball, solder paste, or any conductive material) disposed on the circuit substrate P" to "a first exposed height H1 (e.g., 0.01 to 0.3 mm) of the bottom end of the first exposed portion 212 from the bottom end of the bottom seat plate 4" can be 0.1 to 0.2:0.01 to 0.3. In addition, as Figure 8 As shown, before the wound capacitor package structure S is electrically connected to the circuit substrate P, the ratio of "a second thickness T2 (e.g., 0.1 to 0.2 mm) of a second conductive material M2 (e.g., solder ball, solder paste, or any conductive material) disposed on the circuit substrate P" to "a second exposed height H2 (e.g., 0.01 to 0.3 mm) of the bottom end of the second exposed portion 222 from the bottom end of the bottom seat plate 4" can be 0.1 to 0.2:0.01 to 0.3. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0032] In this way, cooperate Figure 7 and Fig. 9 As shown, when the wound capacitor package structure S is electrically connected to the circuit substrate P by contacting the first conductive material M1 and the second conductive material M2 respectively through the first conductive pin 21 and the second conductive pin 22, due to the definition or setting of one of the four parameter conditions of the first exposed height H1, the first horizontal distance HD1, the first vertical distance VD1 and the "ratio of the first thickness T1 to the first exposed height H1", the first exposed portion 212 of the first conductive pin 21 can be configured to guide a portion of the first conductive material M1 to the first gap G1 between the first exposed portion 212 of the first conductive pin 21 and the inner surface of the first bottom guide channel 412 of the bottom seat plate 4 through capillary action. In addition, the first exposed portion 212 of the first conductive pin 21 can be configured to guide a portion of the first conductive material M1 to the first gap G1 between the first exposed portion 212 of the first conductive pin 21 and the inner surface of the first bottom guide channel 412 of the bottom seat plate 4 through capillary action. Figure 8 and Fig.10As shown, when the wound capacitor packaging structure S is electrically connected to the circuit substrate P by the first conductive pin 21 and the second conductive pin 22 contacting the first conductive material M1 and the second conductive material M2 respectively, due to the definition or setting of one of the four parameter conditions of the second exposed height H2, the second horizontal distance HD2, the second vertical distance VD2 and the "ratio of the second thickness T2 to the second exposed height H2", the second exposed portion 222 of the second conductive pin 22 can be configured to guide a portion of the second conductive material M2 to the second gap G2 located between the second exposed portion 222 of the second conductive pin 22 and the inner surface of the second bottom guide channel 422 of the bottom seat plate 4 through capillary action. Therefore, the first conductive pin 21 and the second conductive pin 22 can be respectively wrapped by the surrounding shape of the first conductive material M1 and the second conductive material M2 (such as Fig. 9 and Fig.10 This will help to enhance the anti-vibration effect of the wound capacitor packaging structure S (for example, the wound capacitor packaging structure S can be suitable for any type of vehicle), and can also ensure the electrical connection between the wound capacitor packaging structure S and the circuit substrate P (there will be no short circuit).

[0033] It is worth noting that, for example, Figure 2 , Figure 3 and Figure 4 As shown, in one of the feasible embodiments, the bottom end of the bottom seat plate 4 has at least two protruding support portions 43 corresponding to each other, the first bottom end guide channel 412 and the second bottom end guide channel 422 are located between the at least two protruding support portions 43, and the height of each protruding support portion 43 is just equal to the first exposed height H1 or the second exposed height H2, thereby improving the stability of the bottom seat plate 4 when it is set on the circuit substrate P. For example, after actual testing, the winding capacitor packaging structure S provided in the first embodiment of the present invention can have a failure rate of 0% after 12 hours under a test acceleration of 30G (1G=9.8m / s2), and a failure rate of 0% after 6 hours under a test acceleration of 35G. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0034] [Second embodiment]

[0035] See also Figure 2 and Fig.11As shown, the second embodiment of the present invention provides a movable device D (such as any means of transportation such as a car, a ship, an airplane, etc.), and the movable device D can be configured to use the wound capacitor packaging structure S provided in the first embodiment, and the wound capacitor packaging structure S includes a wound component 1, a conductive component 2, a packaging component 3 and a bottom seat plate 4.

[0036] [Beneficial Effects of Embodiments]

[0037] One of the beneficial effects of the present invention is that the mobile device D and the wound capacitor packaging structure S provided by the present invention can be provided by "a first gap G1 between 0.01 mm and 0.2 mm between the first exposed portion 212 of the first conductive pin 21 and the inner surface of the first bottom guide channel 412 of the bottom seat plate 4", "a first exposed height H1 between the bottom end of the first exposed portion 212 and the bottom end of the bottom seat plate 4 is between 0.01 mm and 0.3 mm", "a second exposed height H1 between 0.01 mm and 0.2 mm between the second exposed portion 222 of the second conductive pin 22 and the inner surface of the second bottom guide channel 422 of the bottom seat plate 4 is between 0.01 mm and 0.2 mm", and "a first gap G1 between 0.01 mm and 0.2 mm between the first exposed portion 212 and the inner surface of the first bottom guide channel 412 of the bottom seat plate 4 is between 0.01 mm and 0.3 mm". The technical solutions of "gap G2" and "a second exposed height H2 of the bottom end of the second exposed portion 222 being between 0.01mm and 0.3mm from the bottom end of the bottom seat plate 4" are adopted so that the first conductive pin 21 and the second conductive pin 22 can be firmly fixed or combined on the circuit substrate P through the surrounding wrapping of the first conductive material M1 and the second conductive material M2, respectively. This will help to enhance the anti-vibration effect of the wound capacitor packaging structure S (for example, the wound capacitor packaging structure S can be suitable for any type of transportation) and can also ensure the electrical connection between the wound capacitor packaging structure S and the circuit substrate P (there will be no short circuit).

[0038] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A wound capacitor packaging structure, characterized in that: The wound capacitor packaging structure comprises: A wound assembly, comprising a wound positive electrode conductive foil, a wound negative electrode conductive foil and two wound separators; A conductive component, the conductive component comprising a first conductive pin electrically contacting the wound positive electrode conductive foil and a second conductive pin electrically contacting the wound negative electrode conductive foil; a packaging component, wherein the roll-up component is wrapped inside the packaging component; and a bottom base plate, the bottom base plate being arranged at the bottom end of the packaging component to support the packaging component; wherein one of the two wound separators is disposed between the wound positive electrode conductive foil and the wound negative electrode conductive foil, and one of the wound positive electrode conductive foil and the wound negative electrode conductive foil is disposed between the two wound separators; The first conductive pin includes a first embedded portion accommodated in the packaging component and a first exposed portion exposed outside the packaging component, the second conductive pin includes a second embedded portion accommodated in the packaging component and a second exposed portion exposed outside the packaging component, and the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin both pass through the bottom base plate and are partially exposed from a bottom end of the bottom base plate; The bottom base plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; The bottom base plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; There is a first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom base plate, which is between 0.01 mm and 0.2 mm; a bottom end of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom base plate; and a first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom base plate is between 0.01 mm and 0.3 mm; A second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom base plate is between 0.01 mm and 0.2 mm, a bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom base plate, and a second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom base plate is between 0.01 mm and 0.3 mm; Wherein, when the wound capacitor packaging structure is electrically connected to a circuit substrate by contacting a first conductive material and a second conductive material respectively through the first conductive pin and the second conductive pin, the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material to the first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate through capillary action, and the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material to the second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate through capillary action.

2. The wound capacitor packaging structure according to claim 1, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of first inner surfaces located in the first bottom end guide channel, and the plurality of first inner surfaces include two first side end inner surfaces corresponding to each other and a first top end inner surface connected between the two first side end inner surfaces; wherein a first horizontal distance between the first exposed portion of the first conductive pin and the inner surface of one of the first side ends is between 0.01 mm and 0.2 mm, and a first vertical distance between the first exposed portion of the first conductive pin and the inner surface of the first top end is between 0.01 mm and 0.2 mm; Wherein, before the wound capacitor packaging structure is electrically connected to the circuit substrate, a ratio of a first thickness of the first conductive material disposed on the circuit substrate to the first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.3; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

3. The wound capacitor packaging structure according to claim 1, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of second inner surfaces located in the second bottom end guide channel, and the plurality of second inner surfaces include two second side end inner surfaces corresponding to each other and a second top end inner surface connected between the two second side end inner surfaces; wherein a second horizontal distance between the second exposed portion of the second conductive pin and an inner surface of the second side end is between 0.01 mm and 0.2 mm, and a second vertical distance between the second exposed portion of the second conductive pin and an inner surface of the second top end is between 0.01 mm and 0.2 mm; Wherein, before the wound capacitor packaging structure is electrically connected to the circuit substrate, a ratio of a second thickness of the second conductive material disposed on the circuit substrate to the second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.3; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

4. A wound capacitor packaging structure, characterized in that: The wound capacitor packaging structure comprises: a winding assembly; A conductive component, the conductive component comprising a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component; a packaging component, wherein the roll-up component is wrapped inside the packaging component; and a bottom base plate, the bottom base plate being arranged at the bottom end of the packaging component to support the packaging component; Wherein, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin both pass through the bottom base plate and are partially exposed from a bottom end of the bottom base plate; The bottom base plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; The bottom base plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; There is a first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom base plate, which is between 0.01 mm and 0.2 mm; a bottom end of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom base plate; and a first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom base plate is between 0.01 mm and 0.3 mm; There is a second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate, which is between 0.01 mm and 0.2 mm. A bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is between 0.01 mm and 0.3 mm.

5. The wound capacitor packaging structure according to claim 4, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of first inner surfaces located in the first bottom end guide channel, and the plurality of first inner surfaces include two first side end inner surfaces corresponding to each other and a first top end inner surface connected between the two first side end inner surfaces; wherein a first horizontal distance between the first exposed portion of the first conductive pin and an inner surface of the first side end is between 0.01 mm and 0.2 mm, and a first vertical distance between the first exposed portion of the first conductive pin and an inner surface of the first top end is between 0.01 mm and 0.2 mm; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

6. The wound capacitor packaging structure according to claim 4, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of second inner surfaces located in the second bottom end guide channel, and the plurality of second inner surfaces include two second side end inner surfaces corresponding to each other and a second top end inner surface connected between the two second side end inner surfaces; wherein a second horizontal distance between the second exposed portion of the second conductive pin and an inner surface of the second side end is between 0.01 mm and 0.2 mm, and a second vertical distance between the second exposed portion of the second conductive pin and an inner surface of the second top end is between 0.01 mm and 0.2 mm; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

7. A mobile device, the mobile device being configured to use a wound capacitor packaging structure, characterized in that: The wound capacitor packaging structure includes a wound component, a conductive component, a packaging component and a bottom base plate; The conductive component includes a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component, the wound component is wrapped inside the packaging component, and the bottom base plate is arranged at the bottom end of the packaging component for supporting the packaging component; Wherein, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin both pass through the bottom base plate and are partially exposed from a bottom end of the bottom base plate; The bottom base plate has a first through opening and a first bottom guide channel connected to the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; The bottom base plate has a second through opening and a second bottom guide channel connected to the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; There is a first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom base plate, which is between 0.01 mm and 0.2 mm; a bottom end of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom base plate; and a first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom base plate is between 0.01 mm and 0.3 mm; There is a second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate, which is between 0.01 mm and 0.2 mm. A bottom end of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is between 0.01 mm and 0.3 mm.

8. The mobile device according to claim 7, characterized in that: in, When the wound capacitor packaging structure is electrically connected to a circuit substrate by the first conductive pin and the second conductive pin respectively contacting a first conductive material and a second conductive material, the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material to the first gap between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom base plate through a capillary action, and the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material to the second gap between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom base plate through a capillary action; Wherein, before the wound capacitor packaging structure is electrically connected to the circuit substrate, a ratio of a first thickness of the first conductive material disposed on the circuit substrate to the first exposed height of the bottom end of the first exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.3; Among them, before the wound capacitor packaging structure is electrically connected to the circuit substrate, the ratio of a second thickness of the second conductive material arranged on the circuit substrate to the second exposed height of the bottom end of the second exposed portion from the bottom end of the bottom seat plate is 0.1 to 0.2:0.01 to 0.

3.

9. The movable device according to claim 7, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of first inner surfaces located in the first bottom end guide channel, and the plurality of first inner surfaces include two first side end inner surfaces corresponding to each other and a first top end inner surface connected between the two first side end inner surfaces; wherein a first horizontal distance between the first exposed portion of the first conductive pin and an inner surface of the first side end is between 0.01 mm and 0.2 mm, and a first vertical distance between the first exposed portion of the first conductive pin and an inner surface of the first top end is between 0.01 mm and 0.2 mm; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

10. The movable device according to claim 7, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the bottom seat plate has a plurality of second inner surfaces located in the second bottom end guide channel, and the plurality of second inner surfaces include two second side end inner surfaces corresponding to each other and a second top end inner surface connected between the two second side end inner surfaces; wherein a second horizontal distance between the second exposed portion of the second conductive pin and an inner surface of the second side end is between 0.01 mm and 0.2 mm, and a second vertical distance between the second exposed portion of the second conductive pin and an inner surface of the second top end is between 0.01 mm and 0.2 mm; Wherein, the bottom end of the bottom seat plate has at least two protruding support portions corresponding to each other, the first bottom end guide channel and the second bottom end guide channel are located between the at least two protruding support portions, and the height of each of the protruding support portions is equal to the first exposed height or the second exposed height.

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