A helium back cooling component and device for wafer cooling

Abstract

The invention discloses a helium back-cooling component and device for cooling a wafer, and belongs to a cooling device in the technical field of wafer processing equipment. The technical scheme thereof comprises: a sealed rotation and fixed installation for a component; a rotating main shaft passes through the magnetic fluid disk and is rotatably arranged; a support frame is fixedly connected to the rotating main shaft through a bellows; a water-cooled substrate table is arranged on the top of the rotating main shaft, a water vapor slip ring seat is arranged below the rotating main shaft, the rotating main shaft and the water vapor slip ring seat are sealed and rotatably arranged, a pipeline component for conveying a cooling medium to the water vapor slip ring seat is arranged inside the rotating main shaft, and the rotating main shaft realizes lifting and rotation control relative to the magnetic fluid disk through a lifting and rotating component fixedly arranged below the magnetic fluid disk; the invention provides a helium back-cooling component and device for cooling a wafer, which realize lifting and lowering of the rotating main shaft and circulation supply of cooling medium, thereby improving the stability and convenience of processing the wafer.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing equipment, and in particular relates to a helium back-cooling component and device for wafer cooling. Background Art

[0002] During some etching, deposition, or ion implantation processes, the wafer may generate a large amount of heat. If not properly controlled, this heat may cause uneven wafer temperature, thus affecting chip consistency. Furthermore, in some processing techniques, the wafer surface is coated with photoresist. If the temperature is too high, the photoresist will carbonize, affecting subsequent process steps. At this time, the wafer needs to be cooled to maintain the wafer temperature at the set temperature. Conventional direct water cooling, however, suffers from uneven contact and thermal conductivity due to gaps between the wafer and the ordinary water-cooled substrate stage. Therefore, a new cooling method is needed. Helium back cooling is the current mainstream cooling method. A certain amount of helium is introduced between the back of the wafer and the water-cooled substrate stage. The helium can evenly contact the back of the wafer and the surface of the water-cooled substrate stage, acting as a medium for good thermal conductivity.

[0003] In order to achieve good cooling of the processed wafer and rotational adjustment of its position, a device is needed that can stably mount and clamp the processed wafer, perform helium cold zone treatment on the back of the wafer, and provide rotational adjustment of the wafer during stable placement. Summary of the Invention

[0004] The first object of the present invention is to provide a helium back-cooling assembly for wafer cooling, which is provided by arranging a magnetic fluid disk and a rotating spindle that can be rotated and raised and lowered on the magnetic fluid disk, so that the wafer to be processed is placed on a water-cooled substrate table for fixed installation, and with the cooperation of a water vapor slip ring seat and the rotating spindle, helium is cooled and temperature-controlled on the back of the wafer fixedly set on the water-cooled substrate table. At the same time, the arrangement of the lifting and lowering rotating assembly is provided to realize the lifting and lowering of the rotating spindle and the circulation of the cooling medium, thereby improving the stability and convenience of wafer processing;

[0005] The second purpose is to provide a helium back-cooling device for wafer cooling, so as to achieve temperature cooling treatment of the wafer in a stable environment and provide a good working space, thereby improving the effect and efficiency of wafer processing.

[0006] The object of the present invention is achieved by providing a helium back-cooling assembly for wafer cooling, comprising:

[0007] Magnetic fluid disc, used for sealing rotation and fixed installation of components;

[0008] A rotating main shaft, the rotating main shaft passing through the magnetic fluid disk and rotatably arranged;

[0009] a support frame, the support frame being fixedly connected to the rotating main shaft via a bellows, and

[0010] A water-cooled substrate stage is provided on the top of the rotating spindle, a water vapor slip ring seat is provided below the rotating spindle, the rotating spindle and the water vapor slip ring seat are sealed and rotated, a pipeline assembly for conveying the cooling medium is provided inside the rotating spindle, and the rotating spindle is controlled to rise and fall and rotate relative to the magnetic fluid disk through a lifting and rotating assembly fixedly provided below the magnetic fluid disk.

[0011] Furthermore, the support frame includes a first disc and a second disc, the first disc and the second disc are fixedly connected by one or more connecting columns, the bottom of the bellows is fixedly connected to the first disc, the top of the bellows is fixedly connected to the bottom of the water-cooled substrate stage, and one or more buffer springs are arranged between the water-cooled substrate stage and the first disc.

[0012] Furthermore, the water-cooled substrate stage includes a first substrate stage and a second substrate stage, a spiral flow channel is provided on the lower side of the first substrate stage, the spiral flow channel and the upper end surface of the second substrate stage form a water flow channel, an outflow channel hole is provided on the upper surface of the water-cooled substrate stage, a plurality of the outflow channel holes are provided and are evenly distributed on the circumference of the water-cooled substrate stage, the outlet of the outflow channel hole is provided close to the edge of the water-cooled substrate stage, the air inlet ends of the plurality of the outflow channel holes are connected to the air supply ring provided in the center of the water-cooled substrate stage, a penetrating air flow return hole is provided in the middle of the water-cooled substrate stage, and the air flow return hole is connected to the air flow return pipe provided in the middle of the rotating spindle.

[0013] Furthermore, a plurality of wafer drag hooks are provided inside the second disc, and the plurality of wafer drag hooks are evenly distributed in the circumferential direction of the second disc; a plurality of force-bearing plates are provided on the upper end surface of the second disc, and the plurality of force-bearing plates are evenly distributed in the circumferential direction of the second disc; a passing groove is provided at the edge of the water-cooled substrate table near the corresponding wafer drag hook.

[0014] Furthermore, the water vapor slip ring seat is provided with an air outlet pipe head, an air inlet pipe head, a liquid inlet pipe head and a liquid outlet pipe head in sequence from top to bottom in the height direction; the water vapor slip ring seat is provided with a first slip ring, a second slip ring, a third slip ring and a center slip ring which are connected with the air outlet pipe head, the air inlet pipe head, the liquid inlet pipe head and the liquid outlet pipe head in sequence, and the first slip ring, the second slip ring, the third slip ring and the center slip ring are connected with the corresponding pipe holes in the pipe assembly.

[0015] Furthermore, the lifting and rotating assembly includes a lifting plate and lifting cylinders vertically arranged on both sides of the lifting plate. The telescopic main shafts of the two lifting cylinders are respectively fixed to the bottom of the magnetic fluid disk. The shells of the two lifting cylinders are fixedly connected to the lifting plate through connecting rods. The lifting plate is connected to the rotating main shaft through bearings.

[0016] It also includes a passive gear fixedly sleeved on the outside of the rotating main shaft and a rotating motor vertically fixed on the lifting plate, and the rotating end of the rotating motor is provided with a driving gear meshing with the passive gear.

[0017] Furthermore, a sealing ring is provided on the upper end surface of the water-cooled substrate stage, and the sealing ring is provided on the circular edge of the water-cooled substrate stage, and the plurality of outflow channel holes are located on the inner side of the sealing ring.

[0018] Furthermore, the pipeline assembly includes a gas pipeline group and a liquid pipeline group, the gas pipeline group includes the air flow return pipeline placed on the central axis of the rotating main shaft and the air flow delivery pipeline arranged on the rotating main shaft, and the ends of the air flow return pipeline and the air flow delivery pipeline are respectively connected to the first slip ring and the second slip ring arranged inside the water vapor slip ring seat.

[0019] Furthermore, the upper end of the liquid pipeline group is connected to the flow channel to realize the supply and discharge of liquid in the flow channel.

[0020] A helium back-cooling device for wafer cooling, further comprising

[0021] A housing, the housing being an outer shell with an open top and a sealed bottom, and the housing being fixedly connected to the magnetic fluid disk;

[0022] An anti-pollution cover is provided between the first disc and the second disc, and a through hole is provided on a side of the anti-pollution cover;

[0023] The mounting tube is connected to the interior of the shell and is sealed and fixedly connected to the shell.

[0024] The beneficial effects of the present invention are embodied in:

[0025] 1. In the present invention, a rotating spindle is provided in the middle of the magnetic fluid disk, and the rotating spindle can perform lifting and rotating movements relative to the magnetic fluid disk. Furthermore, a support frame is provided at the upper end of the rotating spindle, and the support frame and the rotating spindle are connected by a bellows. Thus, the rotating spindle can drive the support frame to rotate, and the rotating spindle can be relatively extended and retracted inside the support frame through the connection of the bellows. Furthermore, the water-cooled substrate stage provided at the top of the rotating spindle can be controlled to rise and fall in the support frame. In this way, the wafer to be processed can be placed on the water-cooled substrate table and relatively fixedly installed under the relative clamping action of the support frame. More specifically, since a water vapor slip ring seat is provided under the rotating spindle, the water vapor slip ring seat can provide a cooling medium to the rotating spindle without affecting the rotation of the rotating spindle. Therefore, the cooling medium of the rotating spindle, such as gas helium, can be output from the upper end of the rotating spindle and the cooling control after the helium passes through is carried out below the fixed wafer, that is, on the back of the wafer, thereby realizing the helium cooling treatment of the back of the stably placed wafer.

[0026] 2. In the present invention, since the first and second disks are provided in the support frame and are relatively fixedly connected via the connecting column, the fixed connection between the first and second disks is achieved while also allowing the pipes provided in the first and second disks to communicate. More specifically, since the bottom of the bellows is fixedly connected to the first disk, the top of the bellows is fixedly connected to the bottom of the water-cooled substrate stage, and the water-cooled substrate stage is fixedly connected to the top of the rotating spindle, the support frame as a whole can be rotationally controlled by the connection between the bellows and the rotating spindle. At the same time, due to the connection of the bellows, the rotating spindle can drive the water-cooled substrate stage to rise and fall relative to the first and second disks, thereby providing a counteracting operation between the water-cooled substrate stage and the second disk, and clamping and mounting the wafer on the water-cooled substrate stage between the second disks. In addition, since one or more buffer springs are provided between the water-cooled substrate stage and the first disk, the lifting control of the water-cooled substrate stage between the first and second disks can be more stable.

[0027] 3. In the present invention, since the water-cooled substrate stage includes a first substrate stage and a second substrate stage, a spiral flow channel is provided on the lower side of the first substrate stage, and the spiral flow channel and the upper end surface of the second substrate stage form a water flow channel, which can make the liquid sent up by the liquid pipeline group flow evenly inside the water-cooled substrate stage. At this time, the wafer is placed on the upper surface of the water-cooled substrate stage, thereby strengthening the cold zone treatment on the back side of the wafer; for the delivery of helium, the helium is delivered to the center of the water-cooled substrate stage through the air flow delivery pipeline. An air supply ring is provided, and the air flow is transported to the circumferential edge of the water-cooled substrate stage from a plurality of outflow channel holes uniformly distributed in the circumferential direction through the air supply ring, so that the air flow flows out from the upper end surface of the water-cooled substrate stage. At this time, since the upper end surface of the water-cooled substrate stage is placed with a wafer, the air flow is transported from the gap between the wafer and the upper end surface of the water-cooled substrate stage, and refluxes from the air flow return hole provided through the middle part of the water-cooled substrate stage, and is recovered after being transported downward from the air flow return duct provided in the middle part of the rotating spindle.

[0028] 4. In the present invention, since a plurality of wafer drag hooks are provided inside the second disc, the provision of the plurality of wafer drag hooks enables preliminary placement of the wafers. The placed wafers, under the action of the rising water-cooled substrate stage below, are pushed upward under the plurality of force-bearing plates provided on the upper end surface of the second disc, thereby achieving final stable clamping and placement of the wafers. Furthermore, since a through groove is provided at the edge of the water-cooled substrate stage near the corresponding wafer drag hook, the water-cooled substrate stage can pass through the wafer drag hook when the water-cooled substrate stage moves upward, and then the water-cooled substrate stage can be well in contact with the plurality of force-bearing plates, thereby achieving clamping of the wafers.

[0029] 5. In the present invention, by arranging corresponding air outlet pipe heads, air inlet pipe heads, liquid inlet pipe heads and liquid outlet pipe heads in the water vapor slip ring seat, it is possible to realize separate and independent circulation transportation of the liquid cooling medium and the gas cooling medium in the rotating main shaft. More specifically, corresponding slip rings are provided at the positions of the corresponding pipe heads, thereby enabling the ports at the ends of the pipe components in the rotating main shaft and the corresponding slip rings to be connected one by one. Thus, it is possible to realize the circulation transportation of the cooling medium while the rotating main shaft has the function of rotation.

[0030] 6. In the present invention, since a lifting plate is provided in the lifting and rotating assembly, the lifting plate is connected to the rotating spindle through a bearing, and the lifting cylinder fixedly provided at the bottom of the magnetic fluid disk can control the lifting of the lifting plate, so that the rotating spindle and the components fixed on the lifting plate are lifted and lowered as a whole, thereby enabling the water-cooled substrate table on the top of the rotating spindle to be lifted and lowered, thereby realizing the operation of clamping the wafer. More specifically, the telescopic spindle of the lifting cylinder is fixed to the bottom of the magnetic fluid disk, and the outer shell of the lifting cylinder realizes relative lifting control, so that the outer shell of the lifting cylinder drives the rotating spindle to move up and down as a whole. During the rotation process, the passive gear outside the rotating spindle is meshed with the passive gear of the rotating motor on the lifting plate, thereby realizing the rotation control of the rotating spindle, thereby making the rotation and lifting of the rotating spindle two actions can be realized separately.

[0031] 7. In the present invention, since a sealing ring is provided on the upper end surface of the water-cooled substrate stage, the helium gas transported and diffused at the bottom of the wafer will not escape between the bottom of the wafer and the water-cooled substrate stage, thereby achieving better circulation of the helium gas.

[0032] 8. In the present invention, a pipeline assembly is set in the rotating main shaft, and the pipeline assembly includes a gas pipeline group and a liquid pipeline group, so that the gas pipeline group and the liquid pipeline group are relatively separated and independently set in the rotating main shaft, making the transportation of the cooling medium more stable and effective. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0034] Figure 1 This is a schematic diagram of the three-dimensional structure of the helium back cooling assembly of the present invention;

[0035] Figure 2 This is a schematic diagram of a half-section structure of a helium back-cooling assembly of the present invention;

[0036] Figure 3 This is a schematic diagram of the upper end surface structure of the helium back cooling assembly of the present invention;

[0037] Figure 4 Schematic diagram of the internal structure of the first substrate stage of the present invention;

[0038] Figure 5 This is a schematic diagram of the distribution of the gas pipeline group in the rotating main shaft of the present invention;

[0039] Figure 6This is a schematic diagram of the distribution of the liquid pipeline group in the rotating main shaft of the present invention;

[0040] Figure 7 This is a schematic diagram of the internal structure of the water vapor slip ring seat of the present invention;

[0041] Figure 8 This is a schematic diagram of the top view of the rotating main shaft of the present invention;

[0042] Figure 9 This is a schematic diagram of the overall structure of the helium back cooling device of the present invention.

[0043] In the accompanying drawings, 1-magnetic fluid disk, 2-rotating spindle, 3-support frame, 4-bellows, 5-water-cooled substrate stage, 6-water vapor slip ring seat, 7-pipeline assembly, 8-lifting and rotating assembly, 9-first disc, 10-second disc, 11-connecting column, 12-buffer spring, 13-flow channel, 14-outflow channel hole, 15-air flow return hole, 16-air flow return pipe, 17-wafer drag hook, 18-force plate, 19-through groove, 20-air outlet pipe head, 21-air inlet pipe head, 22-liquid inlet pipe head, 23-liquid outlet pipe head , 24-first slip ring, 25-second slip ring, 26-third slip ring, 27-center slip ring, 28-lifting plate, 29-lifting cylinder, 30-telescopic spindle, 31-housing, 32-connecting rod, 33-passive gear, 34-rotating motor, 35-driving gear, 36-sealing ring, 37-gas pipeline group, 38-liquid pipeline group, 39-air flow conveying pipeline, 44-housing, 45-anti-fouling cover, 46-through hole, 47-first substrate stage, 48-second substrate stage, 49-air supply ring, 50-mounting pipe. DETAILED DESCRIPTION

[0044] The following embodiments of the technical solution of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0045] It should be noted that, unless otherwise specified, the technical or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the present invention belongs.

[0046] Reference Figures 1-9 , a helium back-cooling assembly for wafer cooling, comprising:

[0047] Magnetic fluid disk 1, used for sealing, rotating and fixed installation of components;

[0048] A rotating main shaft 2, wherein the rotating main shaft 2 passes through the magnetic fluid disk 1 and is rotatably arranged;

[0049] A support frame 3, the support frame 3 is fixedly connected to the rotating main shaft 2 through a bellows 4, and

[0050] A water-cooled substrate stage 5 is provided on the top of the rotating spindle 2, and a water vapor slip ring seat 6 is provided below the rotating spindle 2. The rotating spindle 2 and the water vapor slip ring seat 6 are sealed and rotated. A pipeline assembly 7 for conveying the cooling medium is provided inside the rotating spindle 2. The rotating spindle 2 is controlled by the lifting and rotating assembly 8 fixedly provided below the magnetic fluid disk 1 to achieve lifting and rotation relative to the magnetic fluid disk 1.

[0051] By arranging a rotating spindle 2 in the middle of the magnetic fluid disk 1, the rotating spindle 2 can be lifted and rotated relative to the magnetic fluid disk 1, and then a support frame 3 is arranged at the upper end of the rotating spindle 2, and the support frame 3 and the rotating spindle 2 are connected by a bellows 4. Thus, the rotating spindle 2 can drive the support frame 3 to rotate, and the rotating spindle 2 can be relatively extended and retracted inside the support frame 3 through the connection of the bellows 4, and then the water-cooled substrate table 5 arranged at the top of the rotating spindle 2 can be controlled to rise and fall in the support frame 3, so that the wafer to be processed can be placed on the water-cooled substrate table 5 and relatively fixedly installed under the relative clamping action of the support frame 3. More specifically, since a water vapor slip ring seat 6 is provided under the rotating spindle 2, the water vapor slip ring seat 6 can provide cooling medium to the rotating spindle 2 without affecting the rotation of the rotating spindle 2;

[0052] Therefore, the cooling medium of the rotating spindle 2, such as gaseous helium, can be output from the upper end of the rotating spindle 2, and the cooling control after the helium passes through is performed below the fixedly placed wafer, that is, on the back of the wafer, thereby realizing the helium cooling treatment of the back of the stably placed wafer.

[0053] Preferably, the support frame 3 includes a first disc 9 and a second disc 10, the first disc 9 and the second disc 10 are fixedly connected by one or more connecting columns 11, the bottom of the bellows 4 is fixedly connected to the first disc 9, the top of the bellows 4 is fixedly connected to the bottom of the water-cooled substrate stage 5, and one or more buffer springs 12 are arranged between the water-cooled substrate stage 5 and the first disc 9.

[0054] It can be understood that since the first disc 9 and the second disc 10 are provided in the support frame 3, and the first disc 9 and the second disc 10 are relatively fixedly connected through the connecting column 11, while achieving the fixed connection between the two, the pipes provided in the first disc 9 and the second disc 10 can also be connected. More specifically, since the bottom of the bellows 4 is fixedly connected to the first disc 9, the top of the bellows 4 is fixedly connected to the bottom of the water-cooled substrate stage 5, and the water-cooled substrate stage 5 is fixedly connected to the top of the rotating spindle 2; thus, the support frame 3 as a whole can be rotated and controlled under the connection between the bellows 4 and the rotating spindle 2.

[0055] At the same time, due to the connection of the bellows 4, the rotating spindle 2 can drive the water-cooled substrate stage 5 to rise and fall relative to the first disc 9 and the second disc 10, thereby providing an offset operation between the water-cooled substrate stage 5 and the second disc 10, and clamping and installing the wafer on the water-cooled substrate stage 5 between the second disc 10. In addition, since more than one buffer spring 12 is arranged between the water-cooled substrate stage 5 and the first disc 9, the upgrade control of the water-cooled substrate stage 5 between the first disc 9 and the second disc 10 can be more stable.

[0056] Preferably, the water-cooled substrate stage 5 includes a first substrate stage 47 and a second substrate stage 48, a spiral flow channel 13 is provided on the lower side of the first substrate stage 47, and the spiral flow channel 13 and the upper end surface of the second substrate stage 48 form a water flow channel, and the upper surface of the water-cooled substrate stage 5 is provided with an outflow channel hole 14, and the outflow channel holes 14 are provided in plurality and are evenly distributed on the circumference of the water-cooled substrate stage 5, and the outlet of the outflow channel hole 14 is provided close to the edge of the water-cooled substrate stage 5, and the air inlet ends of the plurality of the outflow channel holes 14 are connected to the air supply ring provided in the center of the water-cooled substrate stage 5, and a penetrating air flow return hole 15 is provided in the middle of the water-cooled substrate stage 5, and the air flow return hole 15 is connected to the air flow return pipe 16 provided in the middle of the rotating spindle 2.

[0057] Since the water-cooled substrate stage 5 includes a first substrate stage 47 and a second substrate stage 48, a spiral flow channel 13 is provided on the lower side of the first substrate stage 47. The spiral flow channel 13 and the upper end surface of the second substrate stage 48 form a water flow channel, which can make the liquid sent up by the liquid pipeline group 38 flow evenly inside the water-cooled substrate stage 5. At this time, the wafer is placed on the upper surface of the water-cooled substrate stage 5, thereby strengthening the cold zone treatment on the back side of the wafer; for the delivery of helium, the helium is delivered to the air supply ring 49 provided in the center of the water-cooled substrate stage 5 through the air flow delivery pipe 39. The air flow is transported from a plurality of outflow channel holes 14 evenly distributed in the circumferential direction to the circumferential edge of the water-cooled substrate stage 5 through the air supply ring 49, and then the air flow flows out from the upper end surface of the water-cooled substrate stage 5. At this time, since the upper end surface of the water-cooled substrate stage 5 is placed with a wafer, the air flow is transported from the gap between the wafer and the upper end surface of the water-cooled substrate stage 5, and refluxes from the through air flow return hole 15 set in the middle of the water-cooled substrate stage 5, and is recovered after being transported downward from the air flow return duct 16 set in the middle of the rotating spindle 2.

[0058] Preferably, a plurality of wafer drag hooks 17 are provided inside the second disc 10, and the plurality of wafer drag hooks 17 are evenly distributed in the circumferential direction of the second disc 10; a plurality of force-bearing plates 18 are provided on the upper end surface of the second disc 10, and the plurality of force-bearing plates 18 are evenly distributed in the circumferential direction of the second disc 10; a through groove 19 is provided at the edge of the water-cooled substrate table 5 near the corresponding wafer drag hook 17.

[0059] Combine Figure 1 and Figure 3 Since multiple wafer drag hooks 17 are provided inside the second disc 10, the provision of multiple wafer drag hooks 17 enables preliminary placement of the wafers. The placed wafers, under the action of the rising water-cooled substrate stage 5 below, are pushed upward under the multiple force-bearing plates 18 provided on the upper end surface of the second disc 10, thereby achieving final stable clamping and placement of the wafers; further, since a through groove 19 is provided at the edge of the water-cooled substrate stage 5 near the corresponding wafer drag hook 17, when the water-cooled substrate stage 5 moves upward, the water-cooled substrate stage 5 can pass through the wafer drag hook 17, and then the water-cooled substrate stage 5 can be well in contact with the multiple force-bearing plates 18, thereby achieving clamping of the wafers.

[0060] Preferably, the water vapor slip ring seat 6 is provided with an air outlet pipe head 20, an air inlet pipe head 21, a liquid inlet pipe head 22 and a liquid outlet pipe head 23 in sequence from top to bottom in the height direction; the water vapor slip ring seat 6 is provided with a first slip ring 24, a second slip ring 25, a third slip ring 26 and a center slip ring 27 which are connected with the air outlet pipe head 20, the air inlet pipe head 21, the liquid inlet pipe head 22 and the liquid outlet pipe head 23 in sequence, and the first slip ring 24, the second slip ring 25, the third slip ring 26 and the center slip ring 27 are connected with the corresponding pipe holes in the pipe assembly 7.

[0061] By arranging corresponding air outlet pipe heads 20, air inlet pipe heads 21, liquid inlet pipe heads 22 and liquid outlet pipe heads 23 in the water vapor slip ring seat 6, it is possible to realize separate and independent circulation transportation of the liquid cooling medium and the gas cooling medium in the rotating main shaft 2. More specifically, corresponding slip rings are provided at the positions of the corresponding pipe heads, thereby enabling the ports at the ends of the pipe components 7 in the rotating main shaft 2 and the corresponding slip rings to be connected one by one; thereby, it is possible to realize the circulation transportation of the cooling medium while the rotating main shaft 2 has the function of rotation.

[0062] It should be emphasized that the central slip ring 27 provides the function of conveying the medium during the rotation of the pipeline in the direction of the central axis.

[0063] Preferably, the lifting and rotating assembly 8 includes a lifting plate 28, and lifting cylinders 29 vertically arranged on both sides of the lifting plate 28. The telescopic main shafts 30 of the two lifting cylinders 29 are respectively fixed to the bottom of the magnetic fluid disk 1. The housings 31 of the two lifting cylinders 29 are fixedly connected to the lifting plate 28 through connecting rods 32. The lifting plate 28 is connected to the rotating main shaft 2 through bearings.

[0064] It also includes a passive gear 33 fixedly mounted on the outside of the rotating main shaft 2 and a rotating motor 34 vertically fixed on the lifting plate 28 . The rotating end of the rotating motor 34 is provided with a driving gear 35 meshing with the passive gear 33 .

[0065] It can be understood that since a lifting plate 28 is provided in the lifting and rotating assembly 8, the lifting plate 28 is connected to the rotating spindle 2 through a bearing, and the lifting cylinder 29 fixedly provided at the bottom of the magnetic fluid disk 1 can control the lifting of the lifting plate 28, so that the rotating spindle 2 and the components fixed on the lifting plate 28 are lifted and lowered as a whole, thereby controlling the lifting of the water-cooled substrate table 5 on the top of the rotating spindle 2 to achieve the operation of clamping the wafer; more specifically, the telescopic spindle 30 of the lifting cylinder 29 is fixed to the bottom of the magnetic fluid disk 1, and the outer shell 31 of the lifting cylinder 29 achieves relative lifting control, so that the outer shell 31 of the lifting cylinder 29 drives the rotating spindle 2 to move up and down as a whole. During the rotation process, the driven gear 33 outside the rotating spindle 2 is meshed with the driven gear 33 of the rotating motor 34 on the lifting plate 28, thereby realizing the rotation control of the rotating spindle 2, thereby making the rotation and lifting of the rotating spindle 2 can be realized separately.

[0066] As a preferred embodiment of this invention, refer to Figure 3 The upper end surface of the water-cooled substrate stage 5 is provided with a sealing ring 36 , and the sealing ring 36 is provided on the circular edge of the water-cooled substrate stage 5 , and the plurality of outflow channel holes 14 are located on the inner side of the sealing ring 36 .

[0067] Since a sealing ring 36 is provided on the upper end surface of the water-cooled substrate stage 5, the helium gas transported and diffused at the bottom of the wafer will not escape between the bottom of the wafer and the water-cooled substrate stage 5, thereby achieving better circulation of the helium gas.

[0068] Preferably, the pipeline assembly 7 includes a gas pipeline group 37 and a liquid pipeline group 38, the gas pipeline group 37 includes the air flow return pipeline 16 placed on the central axis position of the rotating main shaft 2 and the air flow delivery pipeline 39 arranged on the rotating main shaft 2, and the ends of the air flow return pipeline 16 and the air flow delivery pipeline 39 are respectively connected to the first slip ring 24 and the second slip ring 25 arranged inside the water vapor slip ring seat 6.

[0069] A pipeline assembly 7 is set in the rotating main shaft 2, and the pipeline assembly 7 includes a gas pipeline group 37 and a liquid pipeline group 38, so that the gas pipeline group 37 and the liquid pipeline group 38 are relatively separated and independently set in the rotating main shaft 2, making the transportation of the cooling medium more stable and effective.

[0070] As a preferred embodiment of this invention, it should be emphasized that, referring to Figure 5The gas pipe group 37 and the liquid pipe group 38 are independently arranged in the length direction of the rotating spindle 2, wherein the air flow return pipe 16 included in the gas pipe group 37 is arranged at the position of the central axis of the rotating spindle 2, and a gas inlet pipe is provided in the gas pipe group 37, and the gas inlet pipe is arranged in any length direction on the rotating spindle 2. The upper ends of the gas inlet pipe and the air flow return pipe 16 are both connected to the interior of the first substrate stage 47.

[0071] Similarly, refer to Figure 6 The liquid pipeline group 38 includes a liquid inlet pipe and a liquid outlet pipe, and the liquid inlet pipe and the liquid outlet pipe are arranged in any length direction of the rotating main shaft 2.

[0072] Preferably, the upper end of the liquid pipeline group 38 is connected to the flow channel 13 to achieve the supply and discharge of liquid in the flow channel 13.

[0073] The present application provides a helium back cooling device for wafer cooling based on a helium back cooling component provided, which also includes

[0074] The housing 44 is an outer shell with an open top and a sealed bottom. The housing 44 is fixedly connected to the magnetic fluid disk 1;

[0075] An anti-pollution cover 45 is provided between the first disc 9 and the second disc 10 , and a through hole 46 is provided on a side of the anti-pollution cover 45 ;

[0076] The mounting tube 50 is connected to the interior of the housing 44 and is sealed and fixedly connected to the housing 44 .

[0077] The complete helium back-cooling device can perform etching processing on the wafer being etched by clamping and rotating it in a stable and protective environment, wherein the effect of implementing helium back-cooling is more stable and effective, and the corresponding wiring harnesses and pipelines can be set through the mounting tube 50.

[0078] The working principle and working process of the present invention:

[0079] The helium back-cooling assembly for wafer cooling provided by the present invention is provided with a rotating spindle 2 in the middle of a magnetic fluid disk 1, and the rotating spindle 2 can move up and down and rotate relative to the magnetic fluid disk 1; furthermore, a support frame 3 is provided at the upper end of the rotating spindle 2, and the support frame 3 and the rotating spindle 2 are connected by a bellows 4, so that the rotating spindle 2 can drive the support frame 3 to rotate, and the rotating spindle 2 can be relatively extended and retracted inside the support frame 3 through the connection of the bellows 4, and furthermore, the water-cooled substrate stage 5 provided at the top of the rotating spindle 2 can be raised and lowered in the support frame 3. By controlling the rotation of the rotating spindle 2, the wafer to be processed can be placed on the water-cooled substrate table 5 and fixedly installed relatively under the relative clamping action of the support frame 3. More specifically, since a water vapor slip ring seat 6 is provided under the rotating spindle 2, the water vapor slip ring seat 6 can provide a cooling medium to the rotating spindle 2 without affecting the rotation of the rotating spindle 2. Therefore, the cooling medium of the rotating spindle 2, such as gas helium, can be output from the upper end of the rotating spindle 2 and the cooling control after the helium passes through is carried out under the fixed wafer, that is, on the back of the wafer, thereby realizing the helium cooling treatment of the back of the stably placed wafer.

[0080] Furthermore, a helium back-cooling device for wafer cooling is provided, and the wafer to be processed is placed on the water-cooled substrate stage 5 through the through hole 46, and is raised by the lifting and rotating assembly 8, and the wafer is set above the water-cooled substrate stage 5 and clamped between the first disc 9. The input of helium is realized under the action of the water vapor slip ring seat 6, and circulated in the water-cooled substrate stage 5, so that the back of the wafer is cooled. At the same time, the lifting and rotating assembly 8 can drive the entire support frame 3 to rotate, thereby allowing the clamped wafer to rotate at a uniform speed in position, and the etching of the wafer surface can be more uniform.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.

Claims

1. A helium back-cooling assembly for wafer cooling, characterized in that: include: A magnetic fluid disk (1) is used for sealing, rotating and fixing the components; A rotating main shaft (2), the rotating main shaft (2) passing through the magnetic fluid disk (1) and being rotatably arranged; a support frame (3), the support frame (3) being fixedly connected to the rotating main shaft (2) via a bellows (4); and A water-cooled substrate stage (5) is arranged on the top of the rotating spindle (2), a water vapor slip ring seat (6) is arranged below the rotating spindle (2), the rotating spindle (2) and the water vapor slip ring seat (6) are arranged to rotate in a sealed manner, a pipeline assembly (7) for conveying a cooling medium is arranged inside the rotating spindle (2), and the rotating spindle (2) is lifted and rotated relative to the magnetic fluid disk (1) by means of a lifting and rotating assembly (8) fixedly arranged below the magnetic fluid disk (1).

2. The helium back-cooling assembly for wafer cooling according to claim 1, characterized in that: The support frame (3) comprises a first circular disk (9) and a second circular disk (10), the first circular disk (9) and the second circular disk (10) are fixedly connected via one or more connecting columns (11), the bottom of the bellows (4) is fixedly connected to the first circular disk (9), the top of the bellows (4) is fixedly connected to the bottom of the water-cooled substrate stage (5), and one or more buffer springs (12) are provided between the water-cooled substrate stage (5) and the first circular disk (9).

3. The helium back-cooling assembly for wafer cooling according to claim 2, characterized in that: The water-cooled substrate stage (5) comprises a first substrate stage (47) and a second substrate stage (48). A spiral flow channel (13) is arranged on the lower side of the first substrate stage (47). The spiral flow channel (13) and the upper end surface of the second substrate stage (48) form a water flow channel. An outflow channel hole (14) is arranged on the upper surface of the water-cooled substrate stage (5). A plurality of the outflow channel holes (14) are arranged and are evenly distributed on the circumference of the water-cooled substrate stage (5). The outlets of the outflow channel holes (14) are arranged close to the edge of the water-cooled substrate stage (5). The air inlet ends of the plurality of the outflow channel holes (14) are connected to an air supply ring (49) arranged at the center of the water-cooled substrate stage (5). A penetrating airflow reflow hole (15) is arranged in the middle of the water-cooled substrate stage (5). The airflow reflow hole (15) is connected to an airflow reflow pipe (16) arranged in the middle of the rotating main shaft (2).

4. The helium back-cooling assembly for wafer cooling according to claim 2, characterized in that: A plurality of wafer drag hooks (17) are arranged inside the second disc (10), and the plurality of wafer drag hooks (17) are evenly distributed in the circumferential direction of the second disc (10); a plurality of force-bearing plates (18) are arranged on the upper end surface of the second disc (10), and the plurality of force-bearing plates (18) are evenly distributed in the circumferential direction of the second disc (10); and a through groove (19) is arranged at a position near the corresponding wafer drag hook (17) on the edge of the water-cooled substrate table (5).

5. The helium back-cooling assembly for wafer cooling according to claim 3, characterized in that: The water vapor slip ring seat (6) is provided with an air outlet pipe head (20), an air inlet pipe head (21), a liquid inlet pipe head (22) and a liquid outlet pipe head (23) in sequence from top to bottom in the height direction; a first slip ring (24), a second slip ring (25), a third slip ring (26) and a center slip ring (27) are provided inside the water vapor slip ring seat (6) and are connected to the air outlet pipe head (20), the air inlet pipe head (21), the liquid inlet pipe head (22) and the liquid outlet pipe head (23) in sequence; the first slip ring (24), the second slip ring (25), the third slip ring (26) and the center slip ring (27) are connected to corresponding pipe holes in the pipe assembly (7).

6. The helium back-cooling assembly for wafer cooling according to claim 2, characterized in that: The lifting and rotating assembly (8) comprises a lifting plate (28), and lifting cylinders (29) vertically arranged on both sides of the lifting plate (28), the telescopic main shafts (30) of the two lifting cylinders (29) are respectively fixedly arranged on the bottom of the magnetic fluid disk (1), the shells (31) of the two lifting cylinders (29) are fixedly connected to the lifting plate (28) through a connecting rod (32), and the lifting plate (28) is connected to the rotating main shaft (2) through a bearing; It also includes a passive gear (33) fixedly sleeved on the outside of the rotating main shaft (2) and a rotating motor (34) vertically fixed on the lifting plate (28), wherein the rotating end of the rotating motor (34) is provided with a driving gear (35) meshing with the passive gear (33).

7. The helium back-cooling assembly for wafer cooling according to claim 3, characterized in that: The upper end surface of the water-cooled substrate stage (5) is provided with a sealing ring (36), the sealing ring (36) is arranged on the circular edge of the water-cooled substrate stage (5), and the plurality of outflow channel holes (14) are located on the inner side of the sealing ring (36).

8. The helium back-cooling assembly for wafer cooling according to claim 5, characterized in that: The pipeline assembly (7) comprises a gas pipeline group (37) and a liquid pipeline group (38); the gas pipeline group (37) comprises an air flow return pipeline (16) disposed at a central axis position of the rotating main shaft (2) and an air flow delivery pipeline (39) disposed on the rotating main shaft (2); the ends of the air flow return pipeline (16) and the air flow delivery pipeline (39) are respectively connected to the first slip ring (24) and the second slip ring (25) disposed inside the water vapor slip ring seat (6).

9. The helium back-cooling assembly for wafer cooling according to claim 8, characterized in that: The upper end of the liquid pipeline group (38) is connected to the flow channel (13) to achieve the supply and discharge of liquid in the flow channel (13).

10. A helium back cooling device for wafer cooling, characterized in that: A helium back-cooling assembly for wafer cooling comprising any one of claims 2 to 9, further comprising A shell (44), the shell (44) being an outer shell with an open top and a sealed bottom, the shell (44) being fixedly connected to the magnetic fluid disk (1); An anti-fouling cover (45), the anti-fouling cover (45) being arranged between the first circular disc (9) and the second circular disc (10), and a through hole (46) being arranged on a side surface of the anti-fouling cover (45); A mounting tube (50) is arranged to communicate with the interior of the shell (44) and is sealed and fixedly connected to the shell (44).

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