Wafer processing device and wafer processing method

Abstract

The embodiments of the present application provide a wafer processing device and a wafer processing method. The wafer processing device includes: a cleaning box; a plurality of support wheels for carrying wafers, the support wheels are located in the cleaning box, and the plurality of support wheels include a detection wheel, the detection wheel is provided with a force sensor for detecting the force between the wafer and the detection wheel; a controller, the controller is used to determine the relative position of the wafer relative to the detection wheel according to the force detected by the force sensor during the placement stage of the wafer being placed on the support wheel, and when the relative position of the wafer meets a given position condition, determine the current position of the wafer as the end position of the wafer to end the placement of the wafer.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular, to a wafer processing device and a wafer processing method. Background Art

[0002] Chemical Mechanical Polishing (CMP) is an ultra-precision surface processing technology for global flattening. It can complete the chemical mechanical polishing of the wafer under the combined action of chemistry and mechanics. A large amount of particulate matter will remain on the surface of the wafer after chemical mechanical polishing. Therefore, after the wafer is chemically mechanically polished, it is necessary to clean the wafer through a wafer processing device. A carrier is usually provided in the wafer processing device to carry the wafer to be cleaned. However, in the related art, when placing the wafer on the carrier, it is often difficult to accurately control the placement position of the wafer, and it is easy to cause damage to the carrier when placing the wafer.

[0003] More specifically, the carrier is generally a support wheel, which includes a gasket. The material of the gasket is generally a special rubber material, and it needs to meet various conditions at the same time: it is inert and stable when in continuous contact with the chemical liquid used to clean the wafer; it is not easy to be contaminated by pollutants, so as to avoid the pollutants from being stained back on the wafer; it will not introduce other pollutants such as metal ions; it can be in stable contact with the wafer and provide a buffer to drive the wafer to rotate without causing the edge of the wafer to break. In addition, there are also high requirements for the hardness and elastic coefficient of the gasket. The above reasons lead to extremely high costs for gaskets.

[0004] Therefore, how to increase the service life of a single gasket and reduce the frequency of gasket replacement is a technical problem that technicians in this field urgently need to solve. Summary of the invention

[0005] In view of this, embodiments of the present application provide a wafer processing device and a wafer processing method to at least partially solve the above-mentioned problems.

[0006] An embodiment of the present application provides a wafer processing device, comprising: a cleaning box; a plurality of supporting wheels for carrying wafers, the supporting wheels being located in the cleaning box, and the plurality of supporting wheels including a detection wheel, the detection wheel being provided with a force sensor for detecting the force between the wafer and the detection wheel; a controller, the controller being used to determine the relative position of the wafer with respect to the detection wheel according to the force detected by the force sensor during the placement stage of the wafer being placed on the supporting wheel, and to determine the current position of the wafer as the end position for placing the wafer when the relative position of the wafer meets a given position condition, so as to end the placement of the wafer.

[0007] An embodiment of the present application also provides a wafer processing method for a wafer processing device, wherein the wafer processing device includes a plurality of supporting wheels for carrying wafers, and the plurality of supporting wheels include a detection wheel, and the method includes: during the placement stage of the wafer being placed on the supporting wheel, detecting the force between the wafer and the detection wheel; determining the relative position of the wafer with respect to the detection wheel based on the force detected by the force sensor, and when the relative position of the wafer meets a given position condition, determining the current position of the wafer as the end position for placing the wafer to end the placement of the wafer; and cleaning the wafer.

[0008] An embodiment of the present application also provides a wafer cleaning device for a wafer processing device, wherein the wafer processing device includes a plurality of supporting wheels for carrying wafers, and the plurality of supporting wheels include a detection wheel, and the device includes: a detection module, used to detect the force between the wafer and the detection wheel during the placement stage of the wafer being placed on the supporting wheel; a placement module, used to determine the relative position of the wafer with respect to the detection wheel based on the force detected by the force sensor, and when the relative position of the wafer meets a given position condition, determine the current position of the wafer as the end position for placing the wafer to end the placement of the wafer; and a cleaning module, used to clean the wafer.

[0009] An embodiment of the present application further provides a computer storage medium on which a computer program is stored. When the program is executed by a processor, the method described in any of the above embodiments is implemented.

[0010] In an embodiment of the present application, a plurality of support wheels for carrying wafers may be provided in a cleaning box of a wafer processing device, and a detection wheel may be included in the plurality of support wheels, wherein a force sensor for detecting the force between the wafer and the detection wheel may be provided in the detection wheel, so that the force between the wafer and the detection wheel may be detected by the force sensor during the placement stage of the wafer being placed on the support wheel. The controller determines the relative position of the wafer relative to the detection wheel according to the force detected by the force sensor during the placement stage of the wafer being placed on the support wheel, and when the relative position of the wafer meets a given position condition, the current position of the wafer is determined as the end position for placing the wafer to end the placement of the wafer, and the placement position of the wafer may be accurately controlled according to the relative position of the wafer relative to the detection wheel, and when the relative position of the wafer meets a given position condition, the current position of the wafer is used as the end point for wafer placement, and the placement of the wafer is ended in time, so as to avoid damage to the support wheel as a wafer carrier when placing the wafer, especially reduce the damage to the gasket in the support wheel, and greatly improve the service life of the gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] Figure 1 It is a structural schematic diagram of a wafer processing device provided by an optional embodiment of the present application;

[0013] Figure 2 is a cross-sectional schematic diagram of a detection wheel provided in an optional embodiment of the present application;

[0014] Figure 3 yes Figure 2 An enlarged view of the portion of the detection wheel within the rectangular dashed frame;

[0015] Figure 4 is a partial schematic diagram of a detection wheel provided in an optional embodiment of the present application;

[0016] Figure 5 yes Figure 4 A cross-sectional view of the detection wheel portion shown;

[0017] Figure 6 is a structural schematic diagram of a force sensor provided in an optional embodiment of the present application;

[0018] Figure 7 It is a schematic diagram of the position relationship between a wafer and a support wheel gasket provided in an optional embodiment of the present application;

[0019] Figure 8 This is another schematic diagram of the position relationship between a wafer and a support wheel gasket provided in an optional embodiment of the present application;

[0020] Fig. 9 This is another schematic diagram of the position relationship between a wafer and a support wheel gasket provided in an optional embodiment of the present application;

[0021] Fig.10 It is a schematic diagram of force analysis of a wafer provided in an optional embodiment of the present application;

[0022] Fig.11 is a schematic diagram of the relevant structure of a support wheel provided in an optional embodiment of the present application;

[0023] Fig.12 It is a step flow chart of a wafer processing method provided in an optional embodiment of the present application.

[0024] Reference numerals:

[0025] 10. Wafer processing device; 11. Cleaning box; 12. Support wheel; 121. First support wheel; 122. Second support wheel; 123. Third support wheel; 13. Detection wheel; 131. First wheel cover; 132. Second wheel cover; 133. Mounting wheel seat; 134. Washer; 1341. First washer; 1342. Second washer; 1343. Third washer; 135. Force sensor; 136. Receiving groove; 137. First side wall; 138. Second side wall; 14. Driving motor; 15. Synchronous belt; 161. Rotating shaft; 162. Gear; 163. Bearing; 164. Bearing mounting seat; 165. First pressure cover; 166. Second pressure cover; 167. Screw; 168. Nut; 20. Wafer; 30. Robot arm. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0027] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in the embodiments of the present application refers to and includes any or all possible combinations of one or more associated listed items.

[0028] It should be understood that in the description of the embodiments of the present application, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the schemes of the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0029] In addition, when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.

[0030] The terms first, second, etc. are used to describe various elements, components, regions, layers and / or parts, but these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or part from another element, component, region, layer and / or part.

[0031] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0032] The wafer cleaning device provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0033] like Figure 1 As shown, the wafer processing device 10 provided in the embodiment of the present application includes: a cleaning box 11, a plurality of supporting wheels 12 for carrying wafers 20, and a controller. It should be understood that the supporting wheels 12 in the embodiment of the present application are the supporting members for carrying the wafers 20.

[0034] The support wheels 12 are located in the cleaning box 11, and the multiple support wheels 12 include detection wheels. As a feasible implementation, all the support wheels 12 can be detection wheels; or, some of the multiple support wheels 12 are detection wheels.

[0035] The detection wheel is provided with a force sensor 135 for detecting the force between the wafer 20 and the detection wheel. The force sensor 135 may be a pressure sensor 135, so that when the force between the wafer 20 and the detection wheel is pressure, the pressure applied by the wafer 20 to the detection wheel is detected by the pressure sensor 135.

[0036] The controller can be connected to the force sensor 135, and the connection method can be a wired connection or a wireless connection. The controller is used to determine the relative position of the wafer 20 relative to the detection wheel according to the force detected by the force sensor 135 when the wafer 20 is placed on the support wheel 12, and when the relative position of the wafer 20 meets the given position condition, the current position of the wafer 20 is determined as the end position of the wafer 20 to end the placement of the wafer 20. After the wafer 20 is placed, the wafer 20 can be cleaned.

[0037] like Figure 1 As shown, as a feasible implementation method, the wafer processing device 10 may include three support wheels 12, namely a first support wheel 121, a second support wheel 122 and a third support wheel 123, and the three support wheels 12 may include at least two detection wheels, for example, the first support wheel 121 and the second support wheel 122 are detection wheels, the first support wheel 121 and the third support wheel 123 are detection wheels, the second support wheel 122 and the third support wheel 123 are detection wheels, or the first support wheel 121, the second support wheel 122 and the third support wheel 123 are all support wheels 12, etc.

[0038] like Figure 2-6 As shown, in some optional embodiments, the detection wheel 13 includes a first wheel cover 131, a second wheel cover 132, a mounting wheel seat 133 and a washer 134. The mounting wheel seat 133 is arranged between the first wheel cover 131 and the second wheel cover 132, and the washer 134 is sleeved outside the mounting wheel seat 133. In addition, the mounting wheel seat 133 can be connected to the first wheel cover 131 or the second wheel cover 132 by welding.

[0039] The force sensor 135 may be disposed in the mounting wheel seat 133. The mounting wheel seat 133 may include an outer side surface in contact with the washer 134, and the force sensor 135 may be disposed inside the mounting wheel seat 133, and at least a portion of the force sensor 135 is adjacent to the outer side surface of the mounting wheel seat 133, so that the force sensor 135 is as close to the washer 134 as possible, so that the force sensor 135 can detect the force between the wafer 20 and the washer 134 of the detection wheel 13.

[0040] On the side of the gasket 134 away from the mounting wheel seat 133, a receiving groove 136 for placing the wafer 20 is formed between the first wheel cover 131, the second wheel cover 132 and the gasket 134. The rotating axis of the detection wheel 13 can be arranged in the horizontal direction. When placing the wafer 20, the surface of the wafer 20 can be made parallel to the vertical direction, so that the wafer 20 is placed in the receiving groove 136 in the vertical direction. The gasket 134 of the detection wheel 13 is the main structure for supporting the wafer 20, which can be made of a flexible material to prevent the gasket 134 from damaging the wafer 20.

[0041] It should be noted that when the wafer 20 is placed on the surface of the gasket 134 , the surface of the gasket 134 will deform, causing the mounting wheel seat 133 and the force sensor 135 to deform, thereby causing the force sensor 135 to detect the force of the wafer 20 acting on the detection wheel 13 .

[0042] In the embodiment of the present application, the detection wheel 13 includes a first wheel cover 131, a second wheel cover 132, a mounting wheel seat 133 and a gasket 134; the mounting wheel seat 133 is arranged between the first wheel cover 131 and the second wheel cover 132, the gasket 134 is sleeved on the outside of the mounting wheel seat 133, and the force sensor 135 is arranged inside the mounting wheel seat 133; on the side of the gasket 134 away from the mounting wheel seat 133, a receiving groove 136 for placing the wafer 20 is formed between the first wheel cover 131, the second wheel cover 132 and the gasket 134. When placing the wafer 20, the accommodating groove 136 can be used to place the wafer 20, and the gasket 134 can be used to provide support for the wafer 20, so that the gasket 134 can bear the force applied by the wafer 20 to the detection wheel 13, and transmit the force to the mounting wheel seat 133, so that the mounting wheel seat 133 can not only serve as a base for the installation of the gasket 134, but also can accurately detect the force between the wafer 20 and the detection wheel 13 through the force sensor 135, so as to give full play to the role of the mounting wheel seat 133 and expand the function of the mounting wheel seat 133.

[0043] Similar to the detection wheel 13, the support wheels 12 other than the detection wheel among the multiple support wheels 12 of the wafer processing device 10 may also include a first wheel cover, a second wheel cover, a mounting wheel seat and a gasket, but the mounting wheel seat may not be provided with a force sensor 135. The specific arrangement of the first wheel cover, the second wheel cover, the mounting wheel seat and the gasket can refer to the embodiment of the detection wheel 13, and will not be described in detail here.

[0044] During the placement phase of the wafer 20, the Figure 1 The robot 30 shown in the figure grabs the wafer 20 and places the wafer 20 on the supporting wheel 12. When placing the wafer 20, there may be a gap between the wafer 20 and the washer 134 of the supporting wheel 12. Figure 7-9 The three position relationships are shown. Figure 7 , the wafer 20 is tangent to the gasket 134; Figure 8 In the embodiment, the wafer 20 compresses the gasket 134; Fig. 9 In the embodiment, the wafer 20 is not in contact with the gasket 134. Fig. 9 As shown, if the robot 30 holding the wafer 20 is released when the wafer 20 is not in contact with the gasket 134, the wafer 20 will fall freely under the action of gravity, collide with the gasket 134, and compress the gasket 134. The compression of the gasket 134 may affect the service life of the gasket 134, so the compression of the gasket 134 should be avoided as much as possible.

[0045] In the embodiment of the present application, the above position condition can be set according to the position of the wafer 20 when the wafer 20 is tangent to the gasket 134 in the detection wheel. When the relative position of the wafer 20 relative to the detection wheel satisfies the position condition (such as Figure 7 The position of the wafer 20 is determined as the end position for placing the wafer 20, and the robot 30 is controlled to release the wafer 20 to end the placement of the wafer 20, so that the end position for placing the wafer 20 is the position where the wafer 20 is tangent to the gasket 134 of the inspection wheel to avoid the wafer 20 compressing the gasket 134.

[0046] In some optional embodiments, the controller can be specifically used to determine the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction based on the force detected by the force sensor 135, and determine the relative position of the wafer 20 with respect to the detection wheel based on the length and angle of the line.

[0047] The following describes an embodiment of the present application by taking the wafer processing device 10 including a first supporting wheel 121 , a second supporting wheel 122 and a third supporting wheel 123 as an example.

[0048] As a feasible implementation, the plurality of supporting wheels included in the wafer processing device 10, namely the first supporting wheel 121, the second supporting wheel 122 and the third supporting wheel 123 can be located in the same vertical plane, such as Fig.10 As shown, the third support wheel 123 is the support wheel 12 located at the bottom in the vertical direction among the three support wheels 12, and the first support wheel 121 and the second support wheel 122 can be symmetrical about the vertical line where the center of the third support wheel 123 is located. It should be understood that when the number of the support wheels 12 is other numbers, the support wheels 12 can also be located in the same vertical plane and are symmetrically arranged about the vertical line located in the middle of each support wheel 12.

[0049] like Fig.10 As shown, when the wafer is placed on the first supporting wheel 121, the second supporting wheel 122 and the third supporting wheel 123, the wafer is aligned with the first washer 1341 of the first supporting wheel 121, the second washer 1342 of the second supporting wheel 122 and the third washer 1343 of the third supporting wheel 123. Fig.10 The force analysis of the wafer 20 is performed, and the force of the wafer 20 satisfies the following formula:

[0050] mg=FN1*cosα+FN2*cosα+FN3

[0051] FN1*sinα=FN2*sinα

[0052] Wherein, mg represents the gravity of the wafer 20, Fig.10The direction of mg is the vertical direction. FN1, FN2 and FN3 respectively represent the forces between the wafer 20 and the first support wheel 121, the second support wheel 122 and the third support wheel 123, which are approximately equal to the support forces of the first gasket 1341, the second gasket 1342 and the third gasket 1343 on the wafer 20. α represents the angle between the line from the center of the wafer to the center of the first support wheel 121 and the vertical direction, that is, the angle between the line from the center of the wafer to the center of the detection wheel and the vertical direction. It should be understood that the center of the detection wheel can coincide with the center of the gasket in the detection wheel. The angle between the line from the center of the wafer to the second support wheel 122 and the vertical direction in the figure is also α.

[0053] The size of mg can be a given fixed value, and mg is obtained by obtaining the fixed value. Of course, mg can also be obtained by weighing the wafer. The value of FN1 is equal to the value of the interaction force between the first support wheel 121 and the wafer 20, the value of FN2 is equal to the value of the interaction force between the second support wheel 122 and the wafer 20, and the value of FN3 is equal to the value of the interaction force between the third support wheel 123 and the wafer 20. It should be understood that when the first support wheel 121 is a detection wheel, the value of FN1 can be detected by the force sensor 135 in the first washer 1341, when the second support wheel 122 is a detection wheel, the value of FN2 can be detected by the force sensor 135 in the second washer 1342, and when the third support wheel 123 is a detection wheel, the value of FN3 can be detected by the force sensor 135 in the third washer 1343.

[0054] It should be noted that the detection wheel included in the support wheel 12 can be set according to the position of the support wheel, as long as the angle between the line from the center of the wafer to the center of any specific detection wheel and the vertical direction can be solved. The specific detection wheel is a detection wheel whose center is in contact with the wafer 20, and the line connecting the center of the wafer 20 intersects / is not parallel to the vertical direction.

[0055] For example, for Figure 1 and Fig.10 The three support wheels 12 in the embodiment of the present invention can be partially or entirely detection wheels. The first support wheel 121 and the second support wheel 122 can be used as the above-mentioned specific detection wheels. Fig.10 The α in the figure is the angle between the line from the center of the wafer to the center of the specific detection wheel and the vertical direction.

[0056] When part of the first support wheel 121, the second support wheel 122 and the third support wheel 123 are detection wheels, that is, when the first support wheel 121, the second support wheel 122 and the third support wheel 123 include two detection wheels, the first support wheel 121 and the third support wheel 123 can be detection wheels, and FN1 and FN3 can be detected at this time, so that α in the above formula can be solved. When the first support wheel 121, the second support wheel 122 and the third support wheel 123 are all detection wheels, FN1, FN2 and FN3 can be directly detected to solve α in the above formula.

[0057] After determining the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction, the relative position of the wafer 20 with respect to the detection wheel can be determined according to the length of the line connecting the center of the wafer and the center of the detection wheel, and the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction. Optionally, the relative position can be directly expressed by the length of the line connecting the center of the wafer and the center of the detection wheel and the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction, or by the relative coordinates of the center of the wafer and the center of the detection wheel.

[0058] As a feasible implementation method, the given position condition can be that the angle between the line connecting the center of the wafer and the center of the specific detection wheel indicated by the relative position of the wafer 20 relative to the detection wheel and the vertical direction satisfies a given angle range. Optionally, the angle range can be determined based on the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction when the wafer 20 is tangent to the gasket 134 in the detection wheel. The above angle range does not include 0 degrees and 180 degrees, that is, when the wafer 20 is placed on the support wheel 12, the line connecting the center of the specific detection wheel and the center of the wafer 20 intersects with the vertical direction.

[0059] As another feasible implementation, the given position condition may be that the position of the center of the wafer in the vertical direction indicated by the relative position of the wafer 20 relative to the detection wheel satisfies a given position range. Optionally, the angle range may be determined based on the position of the center of the wafer in the vertical direction when the wafer 20 is tangent to the washer 134 in the detection wheel.

[0060] The position of the center of the detection wheel is a known position. Based on the known position, the position of the center of the wafer in the vertical direction can be indicated according to the relative position of the wafer 20 with respect to the detection wheel.

[0061] For example, the distance between the center of the wafer and the center of the detection wheel in the vertical direction can be determined based on the length of the line connecting the center of the wafer and the center of the detection wheel and the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction. Then, based on the position of the center of the detection wheel, the position of the center of the wafer in the vertical direction can be obtained.

[0062] In the embodiment of the present application, the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction can be determined based on the force detected by the force sensor 135, and the relative position of the wafer 20 with respect to the detection wheel can be determined based on the length and angle of the line. Therefore, during the detection stage of the wafer 20, the placement status of the wafer 20 can be obtained based on the relative position, which can provide a reference for the placement of the wafer 20.

[0063] Specifically, after placement, the force between the wafer and the detection wheel can also be detected, and the offset of the relative position of the wafer relative to the detection wheel compared to the standard position can be determined based on the detected force; and the position condition can be updated based on the offset. The standard position can be the position when the gasket is not worn; as the gasket continues to wear, the position of the wafer in the vertical direction continues to move downward, resulting in an offset. The offset can be specifically determined based on the vertical position of the center of the wafer determined based on the force. After determining the offset, the position condition can be updated, and the updated position condition can be the distance corresponding to the downward offset of the standard position. The updated position condition can be applied to the subsequent processing of other wafers.

[0064] In addition, in this embodiment, the loss thickness of the gasket in the support wheel can also be calculated according to the offset, and the service life of the gasket can be determined according to the loss thickness. Specifically, the offset can be set equal to the loss thickness of the gasket in the support wheel directly below the wafer, and the loss thickness of the gasket in the support wheels on the left and right sides of the wafer can be calculated according to the offset and the α angle. According to the loss thickness of the gasket, the service life of the gasket can be accurately analyzed, and early warning and machine range analysis can be performed, which greatly reduces the maintenance cost of the equipment.

[0065] It should be noted that a cleaning brush and a nozzle and other cleaning structures may also be provided in the cleaning box 11. When cleaning the wafer 20, the cleaning liquid may be sprayed onto the wafer 20 through the nozzle, and the surface of the wafer 20 may be cleaned through the cleaning brush. The specific arrangement of the cleaning brush and the nozzle and other cleaning structures may refer to the relevant technology, and will not be described in detail here.

[0066] In an embodiment of the present application, a plurality of support wheels 12 for carrying wafers 20 may be provided in the cleaning box 11 of the wafer processing device 10, and the plurality of support wheels 12 include a detection wheel, in which a force sensor 135 for detecting the force between the wafer 20 and the detection wheel is provided, so that the force between the wafer 20 and the detection wheel can be detected by the force sensor 135 during the placement stage of the wafer 20 being placed on the support wheel 12. Through the controller, during the placement stage when the wafer 20 is placed on the supporting wheel 12, the relative position of the wafer 20 with respect to the detection wheel is determined according to the force detected by the force sensor 135, and when the relative position of the wafer 20 meets the given position condition, the current position of the wafer 20 is determined as the end point position for placing the wafer 20 to end the placement of the wafer 20. The placement position of the wafer 20 can be accurately controlled according to the relative position of the wafer 20 with respect to the detection wheel. When the relative position of the wafer 20 meets the given position condition, the position of the wafer 20 is used as the end point for placing the wafer 20, and the placement of the wafer 20 is ended in time to avoid damage to the supporting wheel 12 serving as the carrier of the wafer 20 when the wafer 20 is placed.

[0067] like Figure 1 As shown, in some optional embodiments, the wafer processing device 10 further includes a drive motor 14, and the drive motor 14 is connected to at least one detection wheel.

[0068] It should be understood that the driving motor 14 can be connected to the detection wheel directly or indirectly through a transmission structure such as a synchronous belt and a gear. For example, the detection wheel may include a first support wheel 121 and a second support wheel 122. Figure 1 As shown, the drive motor 14 can be connected to the first support wheel 121 through the synchronous belt 15, so that the drive motor 14 transmits power to the first support wheel 121 through the synchronous belt 15, so that the first support wheel 121 can drive the wafer 20 to rotate. Alternatively, the drive motor 14 can be connected to the first support wheel 121 and the second support wheel 122 through the synchronous belt 15, respectively, so that the drive motor 14 transmits power to the first support wheel 121 and the second support wheel 122 through the synchronous belt 15 at the same time, so that the first support wheel 121 and the second support wheel 122 can simultaneously drive the wafer 20 to rotate.

[0069] In the embodiment of the present application, the wafer processing device 10 also includes a drive motor 14, and the drive motor 14 can be connected to at least one detection wheel. The drive motor 14 can drive the detection wheel to rotate, so that the detection wheel drives the wafer 20 to rotate, so that the detection wheel can not only detect the interaction force between the wafer 20 and the detection wheel during the placement stage of the wafer 20 to control the placement of the wafer 20, but also drive the wafer 20 to rotate during the cleaning stage of cleaning the wafer 20, so that the above-mentioned cleaning brushes, nozzles and other cleaning structures can clean the wafer 20 more comprehensively, and can concentrate multiple functions on one component of the detection wheel, thereby reducing the number of components of the wafer processing device 10.

[0070] like Fig.11 As shown, as a feasible implementation method, the wafer processing device 10 may also include a rotating shaft 161 connected to the supporting wheel 12. Specifically, the supporting wheel 12 may be arranged on one side of the rotating shaft 161, and a gear 162 that can mesh with the above-mentioned synchronous belt 15 may be installed on the other side of the rotating shaft 161, so that the rotating shaft 161 is driven to rotate by the gear 162. The rotating shaft 161 may be installed in the bearing 163, and the bearing 163 is arranged between the bearing mounting seat 164 and the first pressure cover 165, and the bearing mounting seat 164 is fixedly connected to the first pressure cover 165, so as to limit the bearing 163. A second pressure cover 166 may also be arranged on the side of the bearing 163 close to the first pressure cover 165, and the second pressure cover 166 may be located in the through hole opened on the first pressure cover 165. The second pressure cover 166 may contact the inner ring of the bearing 163 and move synchronously with the inner ring of the bearing 163. Furthermore, a screw 167 connected to the rotating shaft 161 may be provided on the side of the gear 162 away from the support wheel 12. A nut 168 mounted on the rotating shaft 161 may be provided on the side of the support wheel 12 away from the screw 167, so that the gear 162, the second end cover, the bearing 163, the bearing mounting seat 164 and the support wheel 12 mounted on the rotating shaft 161 are fixed by the nut 168 and the screw 167. When the first wheel cover 131 of the support wheel 12 is farther away from the nut 168 than the second wheel cover 132, the mounting wheel seat 133 may be connected to the first wheel cover 131 by welding.

[0071] In some optional embodiments, the shape of the mounting wheel seat 133 is a runway shape. By setting the shape of the mounting wheel seat 133 to be a runway shape, the washer 134 sleeved thereon can be fixed to prevent the washer 134 from rotating relative to the mounting wheel seat 133. In addition, the two ends of the racetrack-shaped mounting wheel seat 133 are arc-shaped, which can facilitate the washer 134 to be sleeved on the mounting wheel seat 133. Corresponding to the mounting wheel seat 133, as shown in FIG. Figure 6 As shown, the portion of the force sensor 135 adjacent to the outer side surface of the mounting wheel seat 133 may also be in a runway shape.

[0072] like Figure 3As shown, in some optional embodiments, the accommodating groove 136 includes a first side wall 137 located at the first wheel cover 131 and a second side wall 138 located at the second wheel cover 132; the distance from a point on the first side wall 137 to the middle symmetry plane of the gasket 134 is positively correlated with the distance from the point to the rotation axis of the detection wheel, and the middle symmetry plane is the symmetry plane of the gasket 134 that is perpendicular to the rotation axis; and the first side wall 137 and the second side wall 138 are symmetrical about the middle symmetry plane.

[0073] As a feasible implementation, the receiving groove 136 may further include a third side wall located at the first wheel cover 131, a fourth side wall located at the second wheel cover 132, and a groove bottom located at the gasket 134. One side of the third side wall may intersect with the first side wall 137, and the other side may intersect with the groove bottom; one side of the fourth side wall may intersect with the second side wall 138, and the other side may intersect with the groove bottom, and the third side wall and the fourth side wall may be perpendicular to the groove bottom, so that the third side wall and the fourth side wall may be used to guide the wafer 20 to be perpendicular to the groove bottom formed by the gasket 134, which is conducive to the stable placement of the wafer 20.

[0074] In the embodiment of the present application, by setting the distance from a point on the first side wall 137 to the middle symmetry plane of the gasket 134 to be positively correlated with the distance from the point to the rotation axis of the detection wheel, and the first side wall 137 and the second side wall 138 are symmetrical about the middle symmetry plane, the first side wall 137 and the second side wall 138 can be used to form a funnel-shaped opening of the receiving groove 136, that is, the first side wall 137 and the second side wall 138 can be used to expand the opening range of the receiving groove 136, so that the wafer 20 can more easily enter the receiving groove 136 of the detection wheel.

[0075] The embodiment of the present application also provides a wafer processing method for a wafer processing device, wherein the wafer processing device may include a plurality of supporting wheels for carrying wafers, and the plurality of supporting wheels include a detection wheel. Fig.12 As shown, the wafer processing method provided in the embodiment of the present application may include:

[0076] S110 , during the placement phase of the wafer being placed on the supporting wheels, detecting the force between the wafer and the detection wheel.

[0077] S120, determining the relative position of the wafer with respect to the detection wheel according to the force detected by the force sensor, and when the relative position of the wafer satisfies a given position condition, determining the current position of the wafer as the end position for placing the wafer to end the placement of the wafer.

[0078] S130, cleaning the wafer.

[0079] In some optional embodiments, the relative position of the wafer with respect to the detection wheel is determined based on the force detected by the force sensor, including: determining the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction based on the force detected by the force sensor, and determining the relative position of the wafer with respect to the detection wheel based on the length and angle of the line.

[0080] In some optional embodiments, after completing the placement of the wafer, the method further includes: detecting the force between the wafer and the detection wheel, and determining the offset of the relative position of the wafer relative to the detection wheel compared with the standard position based on the detected force; and updating the position condition based on the offset.

[0081] In addition, in this embodiment, the loss thickness of the gasket in the support wheel can also be calculated according to the offset, and the service life of the gasket can be determined according to the loss thickness. Specifically, the offset can be set equal to the loss thickness of the gasket in the support wheel directly below the wafer, and the loss thickness of the gasket in the support wheels on the left and right sides of the wafer can be calculated according to the offset and the α angle. According to the loss thickness of the gasket, the service life of the gasket can be accurately analyzed, and early warning and machine range analysis can be performed, which greatly reduces the maintenance cost of the equipment.

[0082] The wafer processing method provided in this embodiment is based on the same inventive concept as the aforementioned wafer processing device embodiment, and has the beneficial effects of the corresponding equipment embodiments. The specific implementation process can be found in the description in the aforementioned wafer processing device embodiment, and will not be repeated here.

[0083] The embodiment of the present application also provides a wafer cleaning device for a wafer processing device, wherein the wafer processing device may include a plurality of supporting wheels for carrying wafers, and the plurality of supporting wheels include a detection wheel. The wafer cleaning device provided in the embodiment of the present application may include:

[0084] The detection module is used to detect the force between the wafer and the detection wheel when the wafer is placed on the supporting wheel.

[0085] The placement module is used to determine the relative position of the wafer with respect to the detection wheel according to the force detected by the force sensor, and when the relative position of the wafer meets the given position condition, determine the current position of the wafer as the end position of the wafer placement to end the placement of the wafer.

[0086] The cleaning module is used to clean the wafer.

[0087] The wafer cleaning device provided in this embodiment is based on the same inventive concept as the embodiment of the aforementioned wafer processing method, and is used to implement the corresponding wafer processing methods in the aforementioned multiple method embodiments, and has the beneficial effects of the corresponding method embodiments. In addition, the functional implementation of each unit in the wafer cleaning device of this embodiment can refer to the description of the corresponding parts in the aforementioned method embodiments, and will not be repeated here.

[0088] The present application also provides a computer storage medium on which a computer program is stored, and when the program is executed by a processor, the method described in any of the above-mentioned multiple method embodiments is implemented. The computer storage medium includes, but is not limited to: a compact disc read-only memory (CD-ROM), a random access memory (RAM), a floppy disk, a hard disk or a magneto-optical disk, etc.

[0089] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0090] The above-mentioned method according to the embodiment of the present application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as a CD-ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as a computer code originally stored in a remote recording medium or a non-temporary machine-readable medium downloaded through a network and to be stored in a local recording medium, so that the method described herein can be stored in such software processing on a recording medium using a general-purpose computer, a dedicated processor or programmable or dedicated hardware (such as an application specific integrated circuit (ASIC) or a field programmable gate array (FPGA).

[0091] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0092] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer processing device, characterized in that: include: Cleaning box; A plurality of support wheels for carrying wafers, the support wheels being located in the cleaning box, the support wheels comprising washers, and the plurality of support wheels comprising a detection wheel, the detection wheel being provided with a force sensor for detecting the acting force between the wafer and the detection wheel; A controller is used to determine the relative position of the wafer with respect to the detection wheel according to the force detected by the force sensor during the placement stage of the wafer being placed on the supporting wheel, and when the relative position of the wafer meets a given position condition, determine the current position of the wafer as the end position of the wafer to end the placement of the wafer.

2. The wafer processing device according to claim 1, characterized in that: The controller is used to determine the angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction according to the force detected by the force sensor, and determine the relative position of the wafer with respect to the detection wheel according to the length of the line and the angle.

3. The wafer processing device according to claim 1 or 2, characterized in that: The detection wheel comprises a first wheel cover, a second wheel cover, a mounting wheel seat and the washer; the mounting wheel seat is arranged between the first wheel cover and the second wheel cover, the washer is sleeved outside the mounting wheel seat, and the force sensor is arranged inside the mounting wheel seat; On a side of the gasket away from the mounting wheel seat, a receiving groove for accommodating the wafer is formed between the first wheel cover, the second wheel cover and the gasket.

4. The wafer processing device according to claim 3, characterized in that: The receiving groove includes a first side wall located at the first wheel cover and a second side wall located at the second wheel cover; The distance from a point on the first side wall to the middle symmetry plane of the gasket is positively correlated with the distance from the point to the rotation axis of the detection wheel, and the middle symmetry plane is the symmetry plane of the gasket perpendicular to the rotation axis; and the first side wall and the second side wall are symmetrical about the middle symmetry plane.

5. The wafer processing device according to claim 4, characterized in that: The shape of the mounting wheel seat is a runway shape.

6. The wafer processing device according to claim 1 or 2, characterized in that: The wafer processing device further comprises a driving motor, and the driving motor is connected to at least one of the detection wheels.

7. A wafer processing method, used in a wafer processing device, characterized in that: The wafer processing device comprises a plurality of supporting wheels for carrying wafers, the supporting wheels comprise washers, and the plurality of supporting wheels comprise a detection wheel, and the method comprises: During the placement phase of the wafer being placed on the supporting wheel, detecting the force between the wafer and the detection wheel; Determine the relative position of the wafer with respect to the detection wheel according to the detected force, and when the relative position of the wafer satisfies a given position condition, determine the current position of the wafer as the end position for placing the wafer, so as to end the placement of the wafer; The wafer is cleaned.

8. The wafer processing method according to claim 7, characterized in that: Determining the relative position of the wafer with respect to the detection wheel according to the detected force includes: The angle between the line connecting the center of the wafer and the center of the detection wheel and the vertical direction is determined according to the detected force, and the relative position of the wafer with respect to the detection wheel is determined according to the length of the line and the angle.

9. The wafer processing method according to claim 8, characterized in that: After finishing placing the wafer, the method further includes: Detecting the force between the wafer and the detection wheel, and determining the offset of the relative position of the wafer relative to the detection wheel compared to the standard position based on the detected force; The position condition is updated according to the offset.

10. The wafer processing method according to claim 9, characterized in that: The method further includes: calculating the loss thickness of the gasket in the support wheel according to the offset, and determining the service life of the gasket according to the loss thickness.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer processing method according to any one of claims 7 to 10 are implemented.

12. A computer program product, characterized in that The method comprises computer instructions for instructing a computing device to execute the method according to any one of claims 7 to 10.

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