Holding member, application and manufacturing method thereof, and semiconductor manufacturing apparatus and method

Abstract

The invention provides a holding member, an application and a manufacturing method thereof, and a semiconductor manufacturing apparatus and a semiconductor manufacturing method, which can easily take down a held object after adsorption release without damaging the adsorption force of the holding member. A holding member (10) in which suction holes (10a) for sucking and holding an object (W) to be held are formed, a plurality of recesses (10c) are formed on the surface of a holding region (10R) in which the object (W) to be held is held by the suction holes (10a), and the surface of the holding region (10R) other than the plurality of recesses (10c) is a roughened surface (10d).

Description

Technical Field

[0001] The present invention relates to a holding member, a conveying device, a cutting table, a cutting device, a semiconductor manufacturing device, a method for manufacturing a holding member, and a method for manufacturing a semiconductor device. Background Art

[0002] Conventionally, as shown in Patent Document 1, an adsorption member for adsorbing parts is used in a cleaning device or a film forming device. This adsorption member adsorbs one or more parts on the same adsorption surface and includes an adsorption layer and a support. In addition, the adsorption layer includes a ceramic porous body, and the adsorption and detachment with the parts are improved by adjusting the average pore diameter.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2017-183535 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] On the other hand, from the viewpoints of water resistance, tracking of warping of the held object, or preventing positional displacement of the held object, elastic resins (rubber materials) such as silicone resins or fluorine resins are used in the holding member (holding layer) for holding the held object. In addition, adsorption holes for adsorbing and holding the held object are formed in the holding member.

[0008] However, when the adsorption force used to hold the object is increased, the object will adhere to the holding member even after the adsorption by the adsorption hole is released. In addition, due to the surface stickiness or dirt of the holding member, the larger the contact area between the holding member and the object, the greater the adhesion force. Furthermore, when the contact surfaces of the object and the holding member are smooth, vacuum adhesion occurs. In addition, when the holding member is wetted with water, the concave and convex surfaces of the contact surfaces are filled with water, and the adhesion force increases. In this way, when the object is attached to the holding member, it is impossible to remove the object from the holding member, resulting in a situation where the object cannot be transported.

[0009] Therefore, the present invention has been made to solve the above-mentioned problems, and a main subject thereof is to easily remove the held object after the suction is released without impairing the suction force of the holding member.

[0010] [Technical means to solve the problem]

[0011] That is, the holding component of the present invention is formed with an adsorption hole for adsorbing and holding the held object, and the holding component is characterized in that a plurality of recesses are formed on the surface of a holding area for holding the held object by means of the adsorption holes, and the surface other than the plurality of recesses in the holding area is a roughened surface.

[0012] [Effects of the Invention]

[0013] According to the present invention thus constituted, the held object can be easily removed after the suction is released without impairing the suction force of the holding member. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram which shows the structure of the cutting device which concerns on one Embodiment of this invention.

[0015] Figure 2 It is a cross-sectional view schematically showing the structure of the cutting table according to the embodiment.

[0016] Figure 3 (a) is a plan view schematically showing the structure of a substrate of the embodiment, and Figure 3 (b) is a plan view schematically showing the structure of the holding member of the embodiment.

[0017] Figure 4 It is a partially enlarged plan view schematically showing the structure of the holding member according to the embodiment.

[0018] Figure 5 It is a partially enlarged cross-sectional view schematically showing the structure of the holding member according to the embodiment.

[0019] Figure 6 It is a plan view schematically showing the structure of a holding member according to a modified embodiment.

[0020] Figure 7 It is a partially enlarged plan view schematically showing the structure of a holding member according to a modified embodiment.

[0021] Figure 8 It is a partially enlarged cross-sectional view schematically showing the structure of a holding member according to a modified embodiment.

[0022] [Explanation of Symbols]

[0023] 2: Substrate storage unit

[0024] 3: Transport mechanism (loader)

[0025] 4: Cutting table

[0026] 5: Cutting off mechanism

[0027] 6: Unloader (conveying device)

[0028] 7: Inspection workbench

[0029] 8: Check the camera

[0030] 9a: Pallet for good products

[0031] 9b: Pallets for defective products

[0032] 10: Keep the components

[0033] 10a: Adsorption hole

[0034] 10b: Bag

[0035] 10c: concave part

[0036] 10d: Roughened surface

[0037] 10e: Second recess

[0038] 10M: Knife avoidance groove

[0039] 10R: Retention Zone

[0040] 10S: Contact area

[0041] 31: Guide rail

[0042] 40: Keep the subject

[0043] 40a: Suction flow path

[0044] 50: Processing fluid supply department

[0045] 51: Spindle

[0046] 52: Rotating Knife

[0047] 61: Maintaining Department

[0048] 62: Mobile mechanism

[0049] 100: Cutting device (semiconductor manufacturing equipment)

[0050] 100A: Supply module (module)

[0051] 100B: Cut off module (module)

[0052] 100C: Check module (module)

[0053] 101: Side

[0054] 102: Inner surface

[0055] CTL: Control Department

[0056] P: Cut products (semiconductor devices)

[0057] W: Substrate (object to be held, object to be transported, object to be cut)

[0058] Wx: Product Department

[0059] Wy: Non-product department DETAILED DESCRIPTION

[0060] Next, the technology of the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following technology.

[0061] The holding component of technology 1 of the present invention is formed with an adsorption hole that adsorbs and holds the held object, and the holding component is characterized in that a plurality of recesses are formed on the surface of a holding area for holding the held object by means of the adsorption holes, and the surface other than the plurality of recesses in the holding area is a roughened surface.

[0062] If such a holding member is used, a plurality of recesses are formed on the surface of the holding region for holding the object to be held, so that the contact area between the holding member and the object to be held can be reduced, thereby reducing the adhesion force. In addition, since the surface other than the plurality of recesses in the holding region is a roughened surface, the adhesion force caused by vacuum adhesion and the like can be reduced. Therefore, the object to be held can be easily removed after the adsorption is released without damaging the adsorption force of the holding member.

[0063] If the adsorption hole is connected to the outer space of the holding area through a plurality of recesses formed in the holding area, the adsorption force of the holding member may be reduced. In order to solve the above problem, the holding member of the technology 2 of the present invention is based on the structure of the technology 1, wherein it is ideal that the plurality of recesses are formed so that the adsorption hole is not connected to the outer space of the holding area when the held object is held.

[0064] As a specific embodiment of the holding member, a structure in which a plurality of recesses are regularly formed, a structure in which a plurality of recesses are irregularly formed, or a structure in which a plurality of recesses are formed in an amorphous manner can be considered. Here, the structure in which a plurality of recesses are regularly formed can easily process the holding member. Therefore, the holding member of the technology 3 of the present invention is based on the structure of the technology 1 or technology 2, wherein it is ideal that the plurality of recesses are in a lattice shape, a stripe shape, or a dot shape when viewed from above.

[0065] The conveying device of the fourth aspect of the present invention is characterized in that it includes: a holding portion that sucks and holds the conveying object; and a moving mechanism that moves the holding portion, wherein the holding portion has a holding member having a structure of any one of the first to third aspects.

[0066] According to the above configuration, the object to be transported can be easily removed after the suction is released without impairing the suction force of the holding member, so the object to be transported can be reliably transported to a predetermined position.

[0067] A cutting table according to a fifth aspect of the present invention sucks and holds an object to be cut, and the cutting table is characterized in having a holding member having a structure according to any one of the first to third aspects.

[0068] According to the above structure, the object to be cut can be easily removed after the adsorption is released without impairing the adsorption force of the holding member, so that the position of the object to be cut can be prevented from being shifted during cutting, and the cut object to be cut can be easily removed after the adsorption is released.

[0069] The cutting device of technology 6 of the present invention is characterized in that it includes: a cutting workbench that adsorbs and holds the cutting object; and a cutting mechanism that cuts the cutting object held on the cutting workbench, and the cutting workbench has a holding component with a structure of any one of technologies 1 to 3.

[0070] With the above structure, the object to be cut can be easily removed after the adsorption is released without damaging the adsorption force of the holding member, thereby preventing the object from being displaced during cutting, and the cut object can be easily removed from the cutting table after the adsorption is released.

[0071] The semiconductor manufacturing device of technology 7 of the present invention is a device for manufacturing singulated semiconductor devices by cutting a substrate on which a plurality of semiconductor devices are formed. The semiconductor manufacturing device is characterized in that it includes: a cutting workbench for adsorbing and holding the substrate; a cutting mechanism for cutting the substrate held on the cutting workbench; and a conveying mechanism for conveying the singulated semiconductor devices from the cutting workbench, wherein the cutting workbench or the conveying mechanism has a holding member having a structure of any one of technologies 1 to 3.

[0072] According to the above structure, the singulated semiconductor device can be easily removed after the adsorption is released without damaging the adsorption force of the holding member. Therefore, when the cutting table has a holding member having a structure of any one of the above techniques 1 to 3, the position of the cutting object can be prevented from being shifted during cutting, and the singulated semiconductor device can be easily removed from the cutting table after the adsorption is released. In addition, when the transport mechanism has a holding member having a structure of any one of the above techniques 1 to 3, the singulated semiconductor device can be reliably transported to a predetermined position after the adsorption is released.

[0073] The manufacturing method of the retaining member of technology 8 of the present invention is a method for manufacturing a retaining member having a structure as any one of technologies 1 to 3, characterized in that the surface other than the plurality of recesses in the retaining region is irradiated with laser to form the roughened surface.

[0074] With the above structure, the surface of the holding area can be roughened to form a roughened surface, and dirt on the surface of the holding area can be burned off. In particular, by irradiating the roughening with laser after forming the recess, dirt on the surface caused by the formation of the recess can be burned off.

[0075] The method for manufacturing a holding member according to a ninth aspect of the present invention is based on the structure of the eighth aspect, wherein the plurality of recesses are preferably formed by irradiating a surface of the holding region with a laser.

[0076] According to the above structure, not only the roughened surface is formed but also the recessed portion is formed using a laser, so the manufacturing process of the holding member can be simplified.

[0077] The method for manufacturing a semiconductor device according to technology 10 of the present invention is a method for manufacturing a semiconductor device using the semiconductor manufacturing device according to technology 7, and is characterized in that the substrate held on the cutting workbench is cut by the cutting mechanism, and the semiconductor device singulated is carried out by the conveying mechanism.

[0078] <One embodiment of the present invention>

[0079] Hereinafter, one embodiment of the cutting device of the present invention will be described with reference to the drawings.

[0080] In addition, for the sake of easy understanding, the following drawings are schematically depicted with appropriate omission or exaggeration. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

[0081] <Overall Structure of Cutting Device 100>

[0082] The cutting device 100 of the present embodiment is a device that cuts a substrate W as a cutting object and separates the substrate W into a plurality of cut products P.

[0083] Here, as the substrate W, for example, a flip chip substrate or a sealed substrate can be listed. The so-called flip chip substrate is a substrate to which electronic components such as semiconductor chips, resistor elements, capacitor elements, etc. are connected via a flip chip. In addition, the so-called sealed substrate is a substrate that is resin-molded in a manner such that at least the electronic components are sealed with resin, to which electronic components such as semiconductor chips, resistor elements, capacitor elements, etc. are connected. As a substrate constituting a sealed substrate, a lead frame or a printed wiring board can be used. In addition, a semiconductor substrate (including semiconductor chips such as silicon chips), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, etc. can also be used. In addition, wiring may or may not be applied to the substrate constituting the sealed substrate.

[0084] Specifically, the cutting device 100 is as follows: Figure 1 As shown, the cutting device 100 includes a supply module 100A for supplying a substrate W, a cutting module 100B for cutting the substrate W, and an inspection module 100C for inspecting the cut products P that have been cut and singulated as components. Each component is detachable and replaceable relative to other components. In addition, when the substrate W is a substrate on which a plurality of semiconductor devices are formed, the cutting device 100 can be called a semiconductor manufacturing device for manufacturing singulated semiconductor devices.

[0085] The operation control of the cutting device 100 including the modules 100A to 100C shown below is performed by the control unit CTL provided in the supply module 100A. The control unit CTL may also be provided in the modules 100B and 100C other than the supply module 100A. In addition, the control unit CTL may be divided into a plurality of modules and provided in at least two modules among the supply module 100A, the cutting module 100B and the inspection module 100C.

[0086] The supply module 100A supplies the substrate W to be cut from the outside and receives the substrate W. The supply module 100A is provided with a substrate receiving section 2 for receiving the substrate W. The substrate W is transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. In addition, the loader 3 transports the substrate W to the cutting module 100B using a guide rail 31. The cutting device 100 of this embodiment includes three substrate receiving sections 2, but the number of the substrate receiving sections 2 is not particularly limited.

[0087] The cutting module 100B cuts the substrate W into a plurality of cut products P. The cutting module 100B includes a cutting table 4 that sucks and holds the substrate W as a cutting target, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4 .

[0088] The cutting mechanism 5 is formed by installing a rotating knife 52 on a main shaft 51. Then, by moving the cutting workbench 4 and the cutting mechanism 5 relative to each other, the substrate W is cut by the rotating knife 52 and singulated into cut products P. Here, in order to suppress the friction heat generated when the substrate W is cut, cutting water as a processing fluid is supplied to the rotating knife 52 and the substrate W by the processing fluid supply unit 50. Then, the singulated cut products P are transported from the cutting module 100B to the inspection module 100C by the transport mechanism (unloader) 6. In addition, the unloader 6 has: a holding portion 61 that respectively adsorbs and holds a plurality of cut products P as transport objects, and a moving mechanism 62 that moves the holding portion 61. The cutting device 100 of this embodiment includes two cutting mechanisms 5, but the cutting mechanism 5 may also be one.

[0089] The inspection module 100C takes an image of the cut products P that have been singulated by the cutting module 100B and inspects them. The inspection module 100C includes an inspection workbench 7 that absorbs and holds a plurality of cut products P as inspection objects, and an inspection camera 8 that takes an image of the plurality of cut products P held on the inspection workbench 7. Then, in the inspection module 100C, the cut products P that have been singulated are divided into good products and defective products based on the image obtained by the inspection camera 8. Then, by a transfer mechanism (not shown), good products are transferred and stored in a good product tray 9a, and defective products are transferred and stored in a defective product tray 9b (see FIG. 1 ). Figure 1 ).

[0090] <Structure of the holding member 10 for sucking and holding the substrate W or the plurality of cut products P>

[0091] Then, in this embodiment, if Figure 2 to Figure 5 As shown, a holding member 10 for sucking and holding a substrate W or a plurality of cut products P is provided on at least one of the cutting table 4, the holding portion 61 of the unloader 6, or the inspection table 7. The holding member 10 is made of an elastic resin (rubber material) such as silicone resin or fluorine resin.

[0092] exist Figure 2 to Figure 5 , the cutting table 4 is shown to have a holding member 10 , and the holding member 10 is formed with a knife avoidance groove 10M for allowing the rotating knife 52 to retreat during cutting.

[0093] Here, if Figure 3As shown in (a), the substrate W has a product portion Wx used as a product after cutting, and a non-product portion Wy not used as a product after cutting. In addition, the product portion Wx is cut into individual pieces to form a cut product P. In this embodiment, a plurality of product portions Wx are arranged in a central portion, for example, in a vertical and horizontal matrix (for example, a rectangular shape as a whole), and a non-product portion Wy is arranged at the periphery of the plurality of product portions Wx. In addition, the configuration of each of the product portion Wx and the non-product portion Wy is not limited to the above. For example, the non-product portion Wy may also be arranged outside the periphery of the substrate W.

[0094] Therefore, if Figure 3 As shown in (b) , the knife avoidance grooves 10M are formed in a grid pattern corresponding to the product portions Wx and the non-product portions Wy, and the rectangular region surrounded by the knife avoidance grooves 10M serves as a holding region 10R for holding each product portion Wx of the substrate W.

[0095] Furthermore, when the holding portion 61 of the unloader 6 that sucks and holds the plurality of singulated cut products P has a holding member 10, the holding regions 10R are formed corresponding to the plurality of cut products P. Furthermore, when the inspection table 7 that sucks and holds the plurality of singulated cut products P has a holding member 10, the holding regions 10R are formed corresponding to the plurality of cut products P.

[0096] The holding member 10 is provided with an adsorption hole 10a for adsorbing and holding the substrate W or the plurality of cut products P. In the present embodiment, in order to enhance the adsorption force of the adsorption hole 10a, the opening size of the adsorption side opening of the adsorption hole 10a is enlarged to form a pocket portion 10b. In addition, the adsorption hole 10a and the pocket portion 10b are formed on the inner side of each holding area 10R in a plan view. In addition, Figure 2 to Figure 5 The bag portion 10b is rectangular in plan view, but the shape of the bag portion 10b in plan view is not limited thereto. Figure 2 It is connected to the suction flow path 40a formed on the workbench body (in the middle).

[0097] Moreover, if Figure 4 and Figure 5 As shown in FIG. 1 , a plurality of recesses 10c are formed on the surface of a holding region 10R for holding a substrate W or a plurality of cut products P using suction holes 10a on the holding member 10. The plurality of recesses 10c reduce the contact area between the surface of the holding region 10R and the substrate W. By forming the plurality of recesses 10c, the contact area is, for example, 50% to 60% when the contact area when the recesses 10c are not formed is set to 100%.

[0098] In addition, the plurality of recesses 10c are formed so that the adsorption holes 10a are not connected to the outer space of the holding area 10R when the substrate W or the plurality of cut products P are held. Specifically, the plurality of recesses 10c are in a grid shape, a stripe shape, or a dot shape when viewed from above. Figure 4 The example in which the plurality of recesses 10c are arranged in a dot shape is shown. Here, the width and depth of each recess 10c are preferably reduced to a size that does not trap foreign matter in the recess 10c and is not affected by the cutting (production of the cut product P) and the wear caused by cleaning of the substrate W. Specifically, the width and depth of each recess 10c are considered to be, for example, several 10 μm to several 100 μm, respectively.

[0099] Furthermore, if Figure 4 and Figure 5 As shown, in the holding region 10R, the surface of the holding member 10 other than the plurality of recesses 10c is a roughened surface 10d. This roughened surface 10d improves the peeling relative to vacuum bonding. The roughened surface 10d of this embodiment is formed by irradiating the surface other than the plurality of recesses 10c in the holding region 10R with laser. In addition, the roughened surface 10d has concavities and convexities smaller than the width and depth of the recesses 10c, for example, in the form of stripes with a pitch of several 10 μm.

[0100] <Method of Manufacturing Holding Member 10>

[0101] Next, an example of a method for manufacturing the holding member 10 according to the present embodiment will be described.

[0102] First, the holding member 10 formed with the suction holes 10a and the pockets 10b is prepared. In the case of the holding member 10 used for the cutting table 4, the knife avoidance groove 10M for allowing the rotary knife 52 to retreat is formed.

[0103] Then, a plurality of recesses 10c are formed by irradiating the surface of the holding region 10R in the holding member 10 with laser. Here, in consideration of workability, the plurality of recesses 10c may be formed by irradiating the laser without distinguishing between the suction holes 10a and the pockets 10b (or the knife avoidance grooves 10M when there are knife avoidance grooves 10M).

[0104] After forming the plurality of recesses 10c, the surface other than the plurality of recesses 10c in the holding region 10R of the holding member 10 is irradiated with laser to form a roughened surface 10d. Here, in consideration of processability, the surface of the holding region 10R may be roughened by irradiating with laser without distinguishing between the plurality of recesses 10c, the adsorption holes 10a, and the pockets 10b (or the knife avoidance grooves 10M in the case of the knife avoidance grooves 10M).

[0105] Since the roughened surface 10d is formed by irradiating the laser beam in the above manner, the dirt on the surface of the holding region 10R can be burned off. In particular, by irradiating the laser beam for roughening after forming the recessed portion 10c, the dirt on the surface generated by the formation of the recessed portion 10c can be burned off. Based on the above, the holding member 10 having a plurality of recessed portions 10c and the roughened surface 10d is manufactured.

[0106] <Effects of the present embodiment>

[0107] According to the cutting device 100 of the present embodiment, since a plurality of recesses 10c are formed on the surface of the holding region 10R that holds the substrate W or the cut product P, the contact area between the holding member 10 and the substrate W can be reduced to reduce the adhesion force, and the substrate W or the cut product P can be easily removed after the suction is released. In addition, since the surface other than the plurality of recesses 10c in the holding region 10R is made into a roughened surface 10d, the adhesion force caused by vacuum adhesion or the like can be reduced, and the substrate W or the cut product P can be easily removed after the suction is released. Therefore, the substrate W or the cut product P can be easily removed after the suction is released without impairing the adhesion force of the holding member 10.

[0108] <Other Modified Embodiments>

[0109] In addition, the present invention is not limited to the above-described embodiments.

[0110] For example, in the embodiment, the holding member 10 is used on at least one of the cutting workbench 4, the unloading machine 6 or the inspection workbench 7 of the cutting device 100, but in addition to this, as long as there is an adsorption mechanism for adsorbing and holding the substrate W or the cut product P, the holding member 10 of the embodiment can also be used in this adsorption mechanism.

[0111] The holding member 10 of the above-described embodiment can also be applied to semiconductor manufacturing equipment other than the cutting device 100, for example, a resin molding equipment such as compression molding or transfer molding, or an inspection equipment for inspecting an inspection object such as a semiconductor device.

[0112] In addition, as a method for forming the recessed portion 10c, other than the method of irradiating with laser light, for example, it may be formed by mechanical processing such as cutting, may be formed by chemical treatment using a chemical solution, or may be formed by mold transfer molding.

[0113] Furthermore, as a method for forming the roughened surface 10 d , in addition to the method of irradiating with laser light, for example, it may be formed by machining such as cutting, may be formed by sandblasting, or may be formed by die transfer molding.

[0114] Furthermore, in the above-described embodiment, the holding member 10 has the pocket portion 10 b , but may also have a structure without the pocket portion 10 b .

[0115] In addition, when the holding member 10 is used for the cutting table 4, as shown in FIG. Figure 6 to Figure 8 As shown, a plurality of second recesses 10e may be formed on the surface of the contact region 10S that contacts the non-product portion Wy generated by cutting the substrate W in the holding member 10. The plurality of second recesses 10e reduce the contact area between the surface of the contact region 10S and the non-product portion Wy. By forming the plurality of second recesses 10e, the contact area is, for example, 20% to 30% when the contact area when the second recesses 10e are not formed is set to 100%. In addition, Figure 6 to Figure 8 In the figure, the recessed portion 10c and the roughened surface 10d of the above-described embodiment are omitted.

[0116] In addition, when the non-product portion Wy is in contact with the contact region 10S, the plurality of second recesses 10e are in communication with the outside of the contact region 10S. Here, the term "in communication with the outside of the contact region 10S" includes: the second recesses 10e extend to the outside of the non-product portion Wy when viewed from above and the second recesses 10e are open on the surface of the holding member 10, or the second recesses 10e are covered by the non-product portion Wy when viewed from above, but Figure 8 As shown, the second recess 10e opens on the side surface 101 of the holding member 10 or the inner surface 102 of the tool avoidance groove 10M. In addition, in a plan view, the two ends of the second recess 10e may be connected to the outside of the contact area 10S, or one end of the second recess 10e may be connected to the outside of the contact area 10S. In addition, in the case of a structure in which one end of the second recess 10e is connected to the outside of the contact area 10S, it is ideal that one end on the side where the machining fluid is supplied is connected to the outside of the contact area 10S.

[0117] Specifically, the plurality of second recesses 10e are in a grid, stripe or dot shape when viewed from above. Figure 7 and Figure 8 An example of setting a plurality of second recesses 10e in a grid shape is shown. Here, it is ideal that the width and depth of each second recess 10e are reduced to a degree that foreign matter is not captured in the second recess 10e, and the dimensions are not affected by the cutting of the substrate W (production of the cut product P) and the wear caused by cleaning. Specifically, it is considered that the width and depth of each second recess 10e are, for example, several 10μm to several 100μm. It is considered that the spacing between the plurality of second recesses 10e is, for example, several 10μm. The plurality of second recesses 10e can be formed by laser irradiation, can be formed by mechanical processing such as cutting, can be formed by chemical treatment using a liquid medicine, or can be formed by mold transfer molding.

[0118] In this way, since a plurality of second recesses 10e are formed on the surface of the contact region 10S that contacts the non-product portion Wy, the contact area between the holding member 10 and the non-product portion Wy can be reduced, and the adhesion force can be reduced, thereby making it easy to remove the non-product portion Wy. In addition, since the plurality of second recesses 10e are connected to the outside of the contact region 10S, the processing fluid can easily flow between the holding member 10 and the non-product portion Wy, and the non-product portion Wy can be easily removed. Therefore, the non-product portion Wy generated by cutting the substrate W can be prevented from being attached to the holding member 10. In addition, the supply amount of the processing fluid can be reduced, thereby saving the processing fluid.

[0119] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Claims

1. A holding member having an adsorption hole formed thereon for adsorbing and holding an object to be held, wherein: A plurality of recesses are formed on the surface of a holding region for holding the object to be held by the adsorption holes. The surface of the holding region other than the plurality of recessed portions is a roughened surface.

2. The holding member according to claim 1, wherein: The plurality of recessed portions are formed so that the adsorption holes are not communicated with a space outside the holding region in a state where the held object is held.

3. The holding member according to claim 1 or 2, wherein: The plurality of recesses are in a lattice shape, a stripe shape or a dot shape in a plan view.

4. A conveying device, comprising: A holding part, which absorbs and holds the transported object; as well as A moving mechanism moves the holding portion, The holding portion has the holding member according to any one of claims 1 to 3.

5. A cutting table that absorbs and holds the object to be cut, and The cutting table includes the holding member according to any one of claims 1 to 3.

6. A cutting device, comprising: Cutting table, which absorbs and holds the object to be cut; as well as A cutting mechanism cuts the object to be cut held on the cutting table, The cutting table includes the holding member according to any one of claims 1 to 3.

7. A semiconductor manufacturing device for cutting a substrate on which a plurality of semiconductor devices are formed to manufacture individual semiconductor devices, the semiconductor manufacturing device comprising: A cutting workbench, which absorbs and holds the substrate; A cutting mechanism for cutting the substrate held on the cutting table; as well as a transport mechanism for transporting the singulated semiconductor devices from the cutting table; The cutting table or the conveying mechanism includes the holding member according to any one of claims 1 to 3.

8. A method for manufacturing a retaining member, the method being a method for manufacturing a retaining member as claimed in any one of claims 1 to 3, wherein The roughened surface is formed by irradiating a surface of the holding region other than the plurality of recessed portions with laser light. 9 . The method for manufacturing a holding member according to claim 8 , wherein the plurality of recessed portions are formed by irradiating a surface of the holding region with laser light.

10. A method for manufacturing a semiconductor device, using the semiconductor manufacturing apparatus according to claim 7, wherein The substrate held on the cutting table is cut by the cutting mechanism, and The semiconductor devices separated into pieces are carried out by the transport mechanism.

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