Packaging structure, manufacturing method thereof and electronic equipment

Abstract

The invention discloses a packaging structure, a manufacturing method thereof and electronic equipment. The packaging structure comprises a first assembly, a second assembly and a packaging body. The first assembly comprises a first substrate and a first electronic device arranged on the first surface of the first substrate; the second assembly comprises a second substrate, a second electronic device arranged on the first surface of the second substrate, and a third electronic device arranged on the second surface of the second substrate; the first component is connected to the first substrate, the second component is connected to the first component, the first surface of the first substrate is opposite to the first surface of the second substrate, and the packaging body covers the first component and the second component and exposes the outer surface of the third electronic device. The packaging structure provided by the invention is small in size and good in heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and more specifically, to a packaging structure and a manufacturing method thereof and an electronic device. Background Art

[0002] In traditional packaging structures, when there are many electronic devices and some of them have heat dissipation requirements, the electronic devices are usually laid flat on a substrate, which results in a larger packaging size and poor heat dissipation effect for some electronic devices. Summary of the invention

[0003] One object of the present application is to provide a packaging structure and a manufacturing method thereof and a new technical solution for electronic equipment.

[0004] According to a first aspect of the present application, a packaging structure is provided, including:

[0005] A first component, the first component comprising a first substrate and a first electronic device disposed on a first surface of the first substrate;

[0006] A second component, the second component comprising a second substrate and a second electronic device disposed on a first surface of the second substrate, and a third electronic device disposed on a second surface of the second substrate;

[0007] The second component is connected to the first component, and the first surface of the first substrate is opposite to the first surface of the second substrate. The package covers the first component and the second component and exposes the outer surface of the third electronic device.

[0008] Optionally, the first electronic component and the second electronic component are arranged to be spaced apart from each other.

[0009] Optionally, a connecting piece is further provided on the first surface of the first substrate, and the second substrate is connected and fixed to the first substrate via the connecting piece.

[0010] Optionally, the connecting member is a solder ball, a copper core ball or a copper column.

[0011] According to a second aspect of the present application, a method for manufacturing a packaging structure is provided, which is applied to the packaging structure described in the first aspect, comprising:

[0012] Mounting a first electronic device on a first surface of a first substrate to form a first assembly;

[0013] Mounting a second electronic device on the first surface of the second substrate; and mounting a third electronic device on the second surface of the second substrate to form a second assembly;

[0014] Connecting the second component to the first component, and making the first surface of the first substrate face the first surface of the second substrate;

[0015] The first component and the second component are plastic-sealed to form a packaging body, and the outer surface of the third electronic device is exposed from the packaging body.

[0016] Optionally, the manufacturing method further comprises:

[0017] A connecting piece is arranged on the first surface of the first substrate, and the second component is fixedly stacked on the first component through the connecting piece.

[0018] Optionally, the manufacturing method further comprises:

[0019] Arranging a pre-welding structure on the first surface of the second substrate, and making the position of the pre-welding structure correspond to the position of the connecting member;

[0020] The second component is fixedly connected to the first component by welding the pre-welded structure and the connecting piece.

[0021] Optionally, mounting a third electronic device on the second surface of the second substrate comprises:

[0022] The third electronic device is soldered to the second surface of the second substrate through a plurality of solder balls, and an underfill is arranged between the solder balls.

[0023] Optionally, exposing the outer surface of the third electronic device from the package body comprises:

[0024] Grinding the surface of the plastic package body to expose the outer surface of the third electronic device; or

[0025] An isolation film is laid on the outer surface of the third electronic device before plastic packaging, and the isolation film is removed after plastic packaging to expose the outer surface of the third electronic device.

[0026] According to a third aspect of the present application, an electronic device is provided, comprising: the packaging structure described in the first aspect.

[0027] According to one embodiment of the present application, the present application reduces the packaging volume of the packaging structure and improves its heat dissipation performance by respectively arranging multiple first electronic devices, multiple second electronic devices and a third electronic device on different surfaces of a first substrate and a second substrate, and stacking and fixing the first component and the second component on each other, while exposing the outer surface of the third electronic device to the packaging body.

[0028] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0030] Figure 1 It is a schematic diagram of a packaging structure provided by this application.

[0031] Figure 2 It is a structural schematic diagram of the first component provided in this application.

[0032] Figure 3 It is a structural schematic diagram of the second component provided in this application.

[0033] Figure 4 It is a schematic diagram of a structure in which the first component and the second component provided in the present application are stacked together.

[0034] Figure 5 It is a schematic diagram of the structure of the first component and the second component after plastic sealing provided by the present application.

[0035] Description of reference numerals:

[0036] 1. First substrate; 2. First electronic device; 3. Second substrate; 4. Second electronic device; 5. Third electronic device; 51. External surface; 6. Connector; 7. Pre-welding structure; 8. Package. DETAILED DESCRIPTION

[0037] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0038] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0039] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0040] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0041] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] like Figures 1 to 5As shown, according to the first aspect of the present application, a packaging structure is provided, including: a first component, a second component and a packaging body 8; the first component includes a first substrate 1 and a first electronic device 2 arranged on the first surface of the first substrate 1; the second component includes a second substrate 3 and a second electronic device 4 arranged on the first surface of the second substrate 3, and a third electronic device 5 arranged on the second surface of the second substrate 3; the second component is connected to the first component, and the first surface of the first substrate 1 is opposite to the first surface of the second substrate 3, the packaging body 8 covers the first component and the second component, and exposes the outer surface 51 of the third electronic device 5.

[0043] Specifically, in this embodiment, the first electronic device 2 is arranged on the first surface of the first substrate 1, the second electronic device 4 and the third electronic device 5 are arranged on the first surface and the second surface of the second substrate 3 respectively, and the first component and the second component are stacked and connected, so that the packaging structure is compared with the structure in the prior art in which the first electronic device 2, the second electronic device 4 and the third electronic device 5 are all laid flat on the substrate, and the packaging body 8 of the entire packaging structure is greatly reduced.

[0044] Furthermore, the present application exposes the outer surface 51 of the third electronic device 5 to the packaging body 8. At the same time, in the actual packaging process, the second surface of the first substrate 1 is usually not covered by the plastic packaging body, while other devices are usually covered by the plastic packaging body, so that the heat dissipation performance of the third electronic device 5 and even the entire packaging structure is improved, while taking into account the stability of the packaging structure.

[0045] Among them, the third electronic device 5 is usually an electronic device with high heat dissipation requirements, such as a logic chip or other high-performance chip that needs to perform a large amount of calculations, while the first electronic device 2 and the second electronic device 4 can be chips or components with low heat dissipation requirements, and this application does not limit this. In addition, the outer surface 51 of the third electronic device 5 usually refers to the side away from the second surface of the second substrate 3. In actual applications, the area where the third electronic device 5 is exposed to the package body 8 can be designed according to the heat dissipation method of the third electronic device 5.

[0046] In the above structure, the number of the first electronic device 2, the second electronic device 4 and the third electronic device 5 can be designed according to the specific application scenario of the packaging structure. In practical applications, the first electronic device 2 and the second electronic device 4 are usually provided in plurality, and the connection between the first component and the second component includes both physical connection and electrical connection, so that a circuit can be formed between the first component and the second component to realize the overall function. Among them, the third electronic device 5 is usually a high-performance chip, so the chip size is usually large, and can be designed as one, so that the size of the packaging structure is basically similar to the size of the third electronic device 5, and the volume is miniaturized.

[0047] Alternatively, if Figure 1 , Figures 4 to 5 As shown, the first electronic component 2 and the second electronic component 4 are arranged spaced apart from each other.

[0048] Specifically, in the present embodiment, the first electronic device 2 and the second electronic device 4 are arranged at intervals from each other, which means that there is a certain gap between the devices, so as to avoid mutual interference between the two devices or the multiple devices affecting the overall performance of the package structure, thereby improving the reliability of the package structure. When there are multiple first electronic devices 2 and second electronic devices 4, respectively, each first electronic device 2 can be arranged flat on the first surface of the first substrate 1, and each second electronic device 4 can be arranged flat on the first surface of the second substrate 3. When the second substrate 3 is stacked on the first substrate 1, each first electronic device 2 and each second electronic device 4 are staggered or opposite to each other, so as to further reduce the volume of the package structure.

[0049] For example, Figure 4 As shown, when the first electronic device 2 and the second electronic device 4 have high-sized and low-sized devices respectively, the low-sized devices are arranged relatively to each other and the high-sized devices are staggered with each other to optimize the overall height of the packaging structure, while also improving the integration of the packaging structure and facilitating the line connection between the devices.

[0050] Optionally, a connecting member 6 is further provided on the first surface of the first substrate 1 , and the second substrate 3 is connected and fixed to the first substrate 1 via the connecting member 6 .

[0051] Specifically, in this embodiment, the connector 6 can electrically connect the first component and the second component on the one hand, and can also support and fix the second substrate 3 to a certain extent on the other hand, thereby ensuring the reliability of the packaging structure. The connector 6 can be made of a conductive material with a certain rigidity, such as copper, etc., and this application does not limit this. In addition, the number of connectors 6 can be one or more, and their distribution positions can be set on the peripheral side of the first substrate 1, or at a free position, and ensure that they can correspond to the free position on the second substrate 3 to avoid interference with the second electronic device 4.

[0052] Alternatively, if Figure 1 , Figure 2 , Figures 4 to 5 As shown, the connecting member 6 is a solder ball, a copper core ball or a copper column.

[0053] Specifically, in this embodiment, the connector 6 can be set as a solder ball, which is convenient for implanting the solder ball into the first substrate 1 after the first electronic device 2 is mounted, thereby reducing the process difficulty. Based on the manufacturing requirements, a copper core ball can be used, which has a copper core inside and is coated with tin material outside, which can not only improve the supporting performance of the connector 6, but also ensure the connection requirements of the first component and the second component.

[0054] In addition, in some embodiments, if the height dimension of the first electronic device 2 or the second electronic device 4 is relatively high, the connector 6 may be configured as a copper column to ensure that the gap dimension between the first substrate 1 and the second substrate 3 can meet the design requirements.

[0055] Alternatively, if Figure 2 As shown, the height dimension of the connecting member 6 is greater than the height dimension of the first electronic component 2 .

[0056] Specifically, in this embodiment, the height dimension of the connector 6 is at least greater than the height dimension of the first electronic device 2, so that when the second component is connected to the first component, it can be ensured that the distance between the first substrate 1 and the second substrate 3 can meet certain design requirements, thereby avoiding mutual interference between the first electronic device 2 and the second electronic device 4.

[0057] Alternatively, if Figure 3 As shown, the size of the third electronic device 5 is equal to the size of the second substrate 3 .

[0058] Specifically, in some embodiments, when the size of the third electronic device 5 is relatively large, the size of the second substrate 3 in the present application can be designed to be the same as the size of the third electronic device 5, so that the size of the packaged packaging structure is similar to the size of the third electronic device 5, thereby reducing the package size. Among them, the size of the first substrate 1 is usually also designed to be similar to the size of the second substrate 3, and the first electronic devices 2 and the second electronic devices 4 are reasonably arranged on the first substrate 1 and the second substrate 3 according to their respective numbers and sizes, thereby improving the compactness of the packaging structure.

[0059] According to the second aspect of the present application, Figures 1 to 5 As shown, a method for manufacturing a packaging structure is provided, which is applied to the packaging structure of the first aspect, comprising:

[0060] First, refer to Figure 2 , the first electronic device 2 can be mounted on the first surface of the first substrate 1 to form a first assembly. The mounting of the first electronic device 2 can be achieved by SMT (Surface Mount Technology), which has the advantages of high assembly density, high reliability, easy automation and reduced cost. In addition, multiple first electronic devices 2 can be mounted, which can be chips or other components, and are reasonably arranged on the first surface of the first substrate 1 according to actual needs.

[0061] Next, refer to Figure 3, mount the second electronic device 4 on the first surface of the second substrate 3; and mount the third electronic device 5 on the second surface of the second substrate 3 to form a second assembly. The third electronic device 5 can be mounted on the second surface of the second substrate 3 by a flip-chip soldering process, and then the second electronic device 4 can be mounted on the first surface of the second substrate 3 by SMT, which can be done according to actual conditions. In addition, the number of the first electronic devices 2 can be multiple, and they can also be chips or other components, which can be reasonably arranged on the first surface of the second substrate 3 according to actual needs.

[0062] Next, refer to Figure 4 , and then connect the second component to the first component, and make the first surface of the first substrate 1 face the first surface of the second substrate 3. After the second component is connected to the first component, the first electronic device 2 and the second electronic device 4 are arranged opposite to each other and have a gap, and the third electronic device 5 faces the outside of the entire structure to meet its heat dissipation requirements.

[0063] Finally, reference Figure 1 and Figure 5 , the first component and the second component are plastic-sealed to form a package 8, and the outer surface 51 of the third electronic device 5 is exposed to the package 8. During the plastic sealing process, the plastic sealing body covers the entire first component and the second component, and can fill the gap between the first electronic device 2 and the second electronic device 4, so that the various parts of the entire packaging structure are more stable and their service life is improved. The outer surface 51 of the third device exposing the package 8 will not affect the stability of the entire structure, and can also diffuse the heat of the third electronic device 5 to meet its heat dissipation requirements.

[0064] The manufacturing method of the packaging structure provided by the present application is simple, easy to operate, has low manufacturing cost, fewer processes, and is suitable for mass production. In addition, the packaging structure manufactured by the manufacturing method provided by the present application has the advantages of small size and good heat dissipation performance.

[0065] Alternatively, if Figure 2 As shown, the manufacturing method further includes: arranging a connector 6 on the first surface of the first substrate 1 , and fixing the second component on the first component through the connector 6 .

[0066] Specifically, the arrangement of the connector 6 makes it easier to connect the first substrate 1 with the second substrate 3, and can achieve physical and electrical connection between the first substrate 1 and the second substrate 3, which not only improves the stability of the packaging structure, but also ensures the functionality of the packaging structure. When the connector 6 is a solder ball or a copper core ball, the ball planting process can be performed after the first electronic device 2 is mounted, which is simple and easy to operate.

[0067] Alternatively, if Figure 3As shown, the manufacturing method also includes: setting a pre-welding structure 7 on the first surface of the second substrate 3, and making the position of the pre-welding structure 7 correspond to the position of the connecting member 6; and fixing the second component to the first component by welding the pre-welding structure 7 and the connecting member 6.

[0068] Specifically, the provision of the connector 6 facilitates the connection between the first component and the second component. In some embodiments, when the height dimension of the connector 6 is not sufficient to reserve a dimension between the first substrate 1 and the second substrate 3 to accommodate the first electronic device 2 and the second electronic device 4, after the second electronic device 4 is mounted, a pre-soldering structure 7, such as a small-sized solder ball, can be further provided on the first surface of the first substrate 1. On the one hand, this can facilitate the welding connection between the first substrate 1 and the second substrate 3 through the connector 6 and the pre-soldering structure 7, and on the other hand, it can also increase the distance dimension between the first substrate 1 and the second substrate 3.

[0069] Alternatively, if Figure 3 As shown, mounting the third electronic device 5 on the second surface of the second substrate 3 includes: soldering the third electronic device 5 to the second surface of the second substrate 3 through a plurality of solder balls, and providing an underfill between the solder balls.

[0070] Specifically, in this embodiment, when the third electronic device 5 is connected to the second surface of the second substrate 3 through a plurality of solder balls, there is a risk of short circuit if the density of the solder balls is high, and when mounting the second electronic device 4, the solder balls are also prone to short circuit with each other due to melting. The present application provides an underfill between the solder balls, thereby improving the mounting stability of the third electronic device 5 and ensuring the reliability of its performance.

[0071] Among them, the bottom fill is a material that uses chemical glue (the main component is epoxy resin) to fill the bottom of the chip in the BGA (Ball Grid Array) packaging mode. It uses the form of heating and curing to fill a large area of ​​the gap at the bottom of the solder ball (generally covering more than 80%), thereby achieving the purpose of reinforcement and enhancing the anti-drop performance between the third electronic device 5 and the second substrate 3. The application principle of the bottom fill is to use capillary action to make the glue flow quickly into the bottom of the solder ball, and the minimum space for capillary flow is 10um. This also meets the minimum electrical characteristics requirements between the pad and the solder ball in the welding process, because the glue will not flow through a gap below 4um, so the electrical safety characteristics of the welding process are guaranteed.

[0072] Alternatively, if Figure 1As shown, the outer surface 51 of the third electronic device 5 is exposed from the packaging body 8, including: surface grinding of the plastic packaging body to expose the outer surface 51 of the third electronic device 5; or, laying an isolation film on the outer surface 51 of the third electronic device 5 before plastic packaging, and removing the isolation film after plastic packaging to expose the outer surface 51 of the third electronic device 5.

[0073] Specifically, when the first component and the second component are plastic-sealed, since part of the structure of the third electronic device 5 also needs to be plastic-sealed at the same time, the plastic-sealed body needs to be filled onto the third electronic device 5. The present application removes part of the plastic-sealed body of the outer surface 51 of the third electronic device 5 so that the outer surface 51 can expose the plastic-sealed body to meet the heat dissipation requirements. Among them, the removal method can adopt surface grinding, which has a low process cost and can control the grinding depth, which is conducive to the standardization of the packaging structure. When the isolation film is used for removal, the outer surface 51 of the third electronic device 5 can be completely exposed while avoiding damage to the third electronic device 5, thereby improving the safety of the process.

[0074] According to a third aspect of the present application, an electronic device is provided, comprising: the packaging structure of the first aspect.

[0075] Specifically, in this embodiment, the electronic device manufactured using the packaging structure provided by the first aspect of the present application has the advantages of small size and good heat dissipation performance, which is conducive to the integration of the device.

[0076] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0077] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A packaging structure, characterized in that: include: A first component, the first component comprising a first substrate and a first electronic device disposed on a first surface of the first substrate; A second component, the second component comprising a second substrate and a second electronic device disposed on a first surface of the second substrate, and a third electronic device disposed on a second surface of the second substrate; The second component is connected to the first component, and the first surface of the first substrate is opposite to the first surface of the second substrate. The package covers the first component and the second component and exposes the outer surface of the third electronic device.

2. The packaging structure according to claim 1, characterized in that: The first electronic device and the second electronic device are spaced apart from each other.

3. The packaging structure according to claim 1, characterized in that: A connecting piece is also provided on the first surface of the first substrate, and the second substrate is connected and fixed to the first substrate via the connecting piece.

4. The packaging structure according to claim 3, characterized in that: The connecting piece is a solder ball, a copper core ball or a copper column.

5. A method for manufacturing a packaging structure, applied to the packaging structure according to any one of claims 1 to 4, characterized in that: include: Mounting a first electronic device on a first surface of a first substrate to form a first assembly; Mounting a second electronic device on the first surface of the second substrate; and mounting a third electronic device on the second surface of the second substrate to form a second assembly; The second component is stacked on the first component, and the first surface of the first substrate is opposite to the first surface of the second substrate; The first component and the second component are plastic-sealed to form a packaging body, and the outer surface of the third electronic device is exposed from the packaging body.

6. The method for manufacturing a packaging structure according to claim 5, characterized in that: Also includes: A connecting member is arranged on the first surface of the first substrate, and the second component is fixedly connected to the first component through the connecting member.

7. The method for manufacturing a packaging structure according to claim 6, characterized in that: Also includes: Arranging a pre-welding structure on the first surface of the second substrate, and making the position of the pre-welding structure correspond to the position of the connecting member; The second component is fixedly connected to the first component by welding the pre-welded structure and the connecting piece.

8. The method for manufacturing a packaging structure according to claim 5, characterized in that: The third electronic device is mounted on the second surface of the second substrate, comprising: The third electronic device is soldered to the second surface of the second substrate through a plurality of solder balls, and an underfill is arranged between the solder balls.

9. The method for manufacturing a packaging structure according to claim 5, characterized in that: The step of exposing the outer surface of the third electronic device to the package body comprises: Grinding the surface of the plastic package body to expose the outer surface of the third electronic device; or An isolation film is laid on the outer surface of the third electronic device before plastic packaging, and the isolation film is removed after plastic packaging to expose the outer surface of the third electronic device.

10. An electronic device, characterized in that: include: The packaging structure according to any one of claims 1 to 4.

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