Circuit board, lens module and manufacturing method of circuit board

Abstract

The invention provides a circuit board, which comprises a connecting area, the connecting area comprises a main body part, a heating part and a cooling part, and the heating part and the cooling part are arranged in the main body part at an interval; the heating part is used for generating heat, and the cooling part is used for absorbing heat. The circuit board comprises a dielectric layer, a resistance layer and a circuit layer, the dielectric layer and the circuit layer are located on the main body part, the heating part and the cooling part, the circuit layer is located on the surface of the dielectric layer, and the resistance layer is located on the heating part. The invention further provides a lens module and a manufacturing method of the circuit board.

Description

Technical Field

[0001] The present application relates to the field of variable aperture technology, and in particular to a circuit board, a lens module, and a method for manufacturing the circuit board. Background Art

[0002] The lens module has different requirements for light transmission in different application scenarios, and the light transmission needs to be changed by changing the size of the aperture. Usually, a coil is set on the circuit board to change the aperture size through the principle of electromagnetic induction. The above structure is complex and occupies a large volume, and the thickness of the circuit board is also thick. Summary of the invention

[0003] The present application provides a circuit board, including a connection area, the connection area including a main body, a heating part and a cooling part, the heating part and the cooling part are arranged in the main body at intervals; the heating part is used to generate heat, and the cooling part is used to absorb heat. The circuit board includes a dielectric layer, a resistor layer and a circuit layer, the dielectric layer and the circuit layer are both located in the main body, the heating part and the cooling part, the circuit layer is located on the surface of the dielectric layer, and the resistor layer is located in the heating part.

[0004] In some embodiments of the present application, the circuit board includes a dielectric layer, a resistor layer, a thermally conductive column, a circuit layer, a phase change layer and an insulating layer; the dielectric layer, the circuit layer and the insulating layer are all located in the main body, multiple heating parts and multiple cooling parts; the circuit layer is located on the surface of the dielectric layer and / or the resistor layer, and the insulating layer covers the dielectric layer and the circuit layer; the resistor layer and the thermally conductive column are located in the heating part, and the phase change layer is located in the cooling part.

[0005] In some embodiments of the present application, each heating part includes a dielectric layer, a resistor layer, a circuit layer and an insulating layer; the resistor layer is located on the surface of the dielectric layer, and the circuit layer is electrically connected to the resistor layer; the thermal conductive column is located on the surface of the resistor layer away from the dielectric layer, and the thermal conductive column is exposed to the insulating layer.

[0006] In some embodiments of the present application, the heating portion further includes a protective layer, the protective layer covers the heat-conducting column, and the protective layer is exposed to the insulating layer.

[0007] In some embodiments of the present application, each cooling part includes a dielectric layer, a circuit layer, a phase change layer and an insulating layer. The circuit layer is located on the surface of the dielectric layer, the phase change layer is buried in the circuit layer, and the circuit layer is exposed to the insulating layer.

[0008] In some embodiments of the present application, the cooling part further includes a sealing layer and a protective layer. The sealing layer seals the phase change layer in the circuit layer, and the protective layer located in the cooling part covers the surface of the sealing layer exposed to the insulating layer.

[0009] The present application provides a lens module, including an aperture and a circuit board, wherein the aperture is provided with a first through hole, and the material of the aperture is memory metal; the circuit board is provided with a second through hole, the connection area is connected to the aperture, the second through hole is arranged corresponding to the first through hole, and the heating part and the cooling part are arranged around the second through hole.

[0010] In some embodiments of the present application, the lens module further includes a temperature sensor, which is disposed on the main body and electrically connected to the circuit layer, and is used to detect the temperature of the aperture.

[0011] The present application also provides a method for manufacturing a circuit board, comprising: providing a circuit substrate, divided into a first area and a second area, the circuit substrate comprising a dielectric layer, a circuit layer, a resistor layer, a thermally conductive column and a thermally conductive layer, the dielectric layer and the circuit layer are located in the first area and the second area; the circuit layer is located on the surface of the dielectric layer; the resistor layer is located in the first area and on the surface of the dielectric layer, and the thermally conductive column is located on the surface of the resistor layer; the thermally conductive layer is connected to the circuit layer located in the first area and is surrounded to form a plurality of blind holes; insulating layers are covered on two opposite surfaces of the circuit substrate, and the thermally conductive columns, the thermally conductive layer and the blind holes are exposed to the insulating layers; a phase change layer is filled in the blind holes, and a sealing layer is used to seal the phase change layer; and a protective layer is formed on the thermally conductive columns and the sealing layer.

[0012] In some embodiments of the present application, part of the circuit layer located in the second area is exposed to the insulating layer, and the protection layer further covers the circuit layer located in the second area and exposed to the insulating layer.

[0013] The circuit board provided in the embodiment of the present application can control the current size of the resistance layer located in the heating part to control the amount of heat generated by the resistance layer, and cooperate with the cooling part to adjust the temperature. The temperature is regulated by current, and the temperature change is continuous. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 An exploded view of the lens module provided in an embodiment of the present application.

[0015] Figure 2 A schematic top view of a circuit board provided in an embodiment of the present application.

[0016] Figure 3 for Figure 2 The schematic cross-sectional view of the circuit board along the AA direction is shown.

[0017] Figure 4 for Figure 2 The schematic cross-sectional view of the circuit board along direction BB is shown.

[0018] Figure 5 for Figure 2 The schematic cross-sectional view of the circuit board along the CC direction is shown.

[0019] Figure 6 A schematic cross-sectional view of a copper clad laminate provided in an embodiment of the present application.

[0020] Figure 7 For Figure 6 A cross-sectional schematic diagram of forming through holes and blind vias on a copper clad board is shown.

[0021] Figure 8 For Figure 7 A schematic cross-sectional view of the blind hole after a heat conducting layer is formed therein is shown.

[0022] Fig. 9 For Figure 8 The structure shown is a schematic cross-sectional view of a circuit substrate formed after circuit fabrication.

[0023] Fig.10 For etching Fig. 9 A schematic cross-sectional view of a portion of the resistor layer is shown.

[0024] Fig.11 For Fig.10 The schematic cross-sectional view of the circuit substrate is shown after two opposite surfaces thereof are covered with insulating layers.

[0025] Fig.12 For Fig.11 The cross-sectional schematic diagram is shown after the phase change layer is filled in the blind hole and the phase change layer is sealed with a sealing layer.

[0026] Fig.13 For Fig.12 The structure shown in the figure is obtained after forming a protective layer. Figure 2 The schematic cross-sectional view of the circuit board along the DD direction is shown.

[0027] Main component symbols

[0028]

[0029] DETAILED DESCRIPTION

[0030] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0032] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0033] See also Figure 1 , the embodiment of the present application provides a module, the module includes a circuit board 100 with adjustable temperature, the circuit board 100 is connected to the components in the module so that the temperature of the components changes. Specifically, the embodiment of the present application provides a lens module 200 with a variable aperture 240, which may include a lens 210, a base 220, a circuit board 100, a fixing member 230, an aperture 240, a gasket 250 and a protective cover 260 arranged in sequence, and the lens module 200 also includes an image sensor (not shown), and the image sensor is electrically connected to the circuit board 100. The base 220 may be arranged around the lens 210 and used to carry the circuit board 100; the fixing member 230 may be located between the aperture 240 and the circuit board 100, and used to fix the aperture 240 and the circuit board 100, and the aperture 240 is located at one end of the lens 210; the gasket 250 is located between the aperture 240 and the protective cover 260; the protective cover 260 is located on the top of the lens 210, and used to protect the lens 210.

[0034] The material of the aperture 240 is memory metal, and the circuit board 100 can control the size of the aperture 240 by changing the temperature, thereby controlling the amount of light passing through the lens module 200. In some embodiments, the material of the aperture 240 expands when the temperature rises and contracts when the temperature drops, thereby changing the size of the aperture 240; in other embodiments, the material of the aperture 240 can also contract when the temperature rises and expand when the temperature drops, thereby changing the size of the aperture 240. In this embodiment, the material of the aperture 240 is nickel-titanium alloy, and the crystal structure of nickel-titanium alloy is different at temperatures greater than 40°C and less than 40°C, and the morphology changes. This embodiment is only for illustration, and in other embodiments, it can be adjusted according to the material of the specific memory metal. In other embodiments, the specific structure of the module is not limited to the lens module 200.

[0035] Please also read Figure 2 , the circuit board 100 is divided into a connection area M and an extension area N. The extension area N protrudes from the connection area M and is used to be electrically connected to an external circuit. The aperture 240 has a first through hole 242, and a second through hole 1112 corresponding to the first through hole 242 is opened on the connection area M, that is, the central axis of the first through hole 242 is the same as the central axis of the second through hole 1112, and light can pass through the first through hole 242 and the second through hole 1112. The change in the size of the first through hole 242 can change the amount of light entering the lens 210.

[0036] The connection area M includes a main body 111, a plurality of heating parts 113 and a plurality of cooling parts 115. The main body 111 is annular and surrounds a second through hole 1112. The plurality of heating parts 113 and the plurality of cooling parts 115 are sequentially arranged on the main body 111 and surround the second through hole 1112, that is, arranged in the manner of heating part 113, cooling part 115, heating part 113, cooling part 115, etc. The plurality of heating parts 113 and the plurality of cooling parts 115 are both connected to the surface of the aperture 240. The heating part 113 is used to generate heat and transfer it toward the aperture 240 to increase the temperature of the aperture 240; the plurality of cooling parts 115 are used to absorb the heat of the aperture 240 to reduce the temperature of the aperture 240. The plurality of heating parts 113 and the plurality of cooling parts 115 interact with each other to balance the temperature of the aperture 240 so that the size of the aperture 240 is maintained within a suitable range.

[0037] Please also read Figure 3 , Figure 4 as well as Figure 5 The circuit board 100 may include a dielectric layer 21, a resistor layer 22, a heat-conducting column 23, a circuit layer 24, a phase change layer 25, and an insulating layer 26. The dielectric layer 21, the circuit layer 24, and the insulating layer 26 are all located in the main body 111, the plurality of heating parts 113, the plurality of cooling parts 115, and the extension area N; the insulating layer 26 is located on the outer surface of the circuit board 100, and is used to cover the circuit layer 24, the dielectric layer 21, and the resistor layer 22; the resistor layer 22 and the heat-conducting column 23 are located in the heating part 113, and the phase change layer 25 is located in the cooling part 115.

[0038] See also Figure 3 The main body 111 may include a dielectric layer 21, a resistor layer 22, a circuit layer 24, and an insulating layer 26. The resistor layer 22 and the circuit layer 24 are located on the surface of the insulating layer 26, and the insulating layer 26 covers the dielectric layer 21, the resistor layer 22, and the circuit layer 24. In some embodiments, the resistor layer 22 may be omitted, and a heating element (not shown) may be provided to connect the circuit layer 24 to generate and transfer heat.

[0039] See also Figure 4Each heating part 113 may include a dielectric layer 21, a resistor layer 22, a heat-conducting column 23, a circuit layer 24 and an insulating layer 26. The resistor layer 22 is located on the surface of the dielectric layer 21, the heat-conducting column 23 is located on the surface of the resistor layer 22 and is exposed to the insulating layer 26, and the heat-conducting column 23 exposed to the insulating layer 26 is used to connect with the aperture 240. The circuit layer 24 is electrically connected to the resistor layer 22, and the resistor layer 22 can generate heat during the power-on process, and the heat is quickly transferred to the aperture 240 through the heat-conducting column 23. The resistor layer 22 and the circuit layer 24 used for conducting with the resistor layer 22 are not limited to being located on two opposite surfaces of the dielectric layer 21, and the circuit layer 24 can enable the resistor layer 22 to generate heat. The material of the resistor layer 22 is an alloy material with a high resistivity, such as NiP alloy.

[0040] The heating part 113 may further include a protective layer 29 , which is located on the surface of the thermally conductive column 23 . The protective layer 29 located on the heating part 113 is used to cover the surface of the thermally conductive column 23 exposed to the insulating layer 26 , and can play a role in rapid heat conduction and preventing oxidation of the thermally conductive column 23 .

[0041] See also Figure 5 Each cooling portion 115 may include a dielectric layer 21, a circuit layer 24, a phase change layer 25, a resistor layer 22, and an insulating layer 26. The circuit layer 24 and the resistor layer 22 are located on the surface of the dielectric layer 21, the phase change layer 25 is buried in the circuit layer 24, the circuit layer 24 is exposed to the insulating layer 26, and the circuit layer 24 exposed to the insulating layer 26 is used to connect with the aperture 240. The circuit layer 24 connected to the aperture 240 can quickly absorb the heat of the aperture 240 and transfer it to the phase change layer 25 buried in the circuit layer 24.

[0042] The cooling part 115 may further include a sealing layer 28 and a protective layer 29. The sealing layer 28 seals the phase change layer 25 in the circuit layer 24. The protective layer 29 located in the cooling part 115 covers the surface of the sealing layer 28 exposed to the insulating layer 26, which can achieve rapid heat conduction and prevent the sealing layer 28 from oxidation.

[0043] The material of the phase change layer 25 is a phase change material (PCM), that is, a material that changes its state and provides latent heat without changing its temperature. The process of changing physical properties is called a phase change process, and the phase change material will absorb or release a large amount of latent heat. The phase change material absorbs heat when it has a tendency to change from solid to liquid or from liquid to gas, and releases heat when it has a tendency to change from gas to liquid or from liquid to solid.

[0044] See also Figure 3 or Figure 4The extension region N includes a finger portion 132, which may include a dielectric layer 21, a resistor layer 22, a circuit layer 24, and a protective layer 29. The resistor layer 22 is located on the surface of the dielectric layer 21, the circuit layer 24 is located on the surface of the resistor layer 22, and the protective layer 29 covers the circuit layer 24. The finger portion 132 is used to be electrically connected to an external circuit.

[0045] In this embodiment, the resistance layer 22 is also located in the main body 111, the heating part 113, the cooling part 115 and the extension area N. The resistance layer 22 located in the heating part 113 is used to generate heat, and the resistance layer 22 located in the main body 111, the cooling part 115 and the extension area N is not used for heat generation, but can play a role in rapid heat conduction.

[0046] Please refer again Figure 2 The lens module 200 may further include a temperature sensor 30, which is disposed on the main body 111 and electrically connected to the circuit layer 24. The temperature sensor 30 is used to detect the temperature of the aperture 240 and transmit the temperature information to the circuit board 100.

[0047] The image sensor may be electrically connected to the extension area N. The image sensor is used to receive the light flux entering the lens module 200 and feed it back to the circuit board 100. The circuit board 100 controls the current size passing through the resistor layer 22 located at the heating part 113 according to the size of the light flux and the temperature of the aperture 240 to adjust the temperature of the aperture 240, thereby adjusting the size of the first through hole 242 of the aperture 240.

[0048] Specifically, in this embodiment, the size of the aperture 240 increases when the temperature rises, and decreases when the temperature decreases. When the circuit board 100 determines that the light flux is small, the size of the aperture 240 needs to be increased, and the circuit board 100 controls the current of the resistor layer 22 of the heating part 113 to increase so that the resistor layer 22 generates a certain amount of heat, and the heat is transferred to the aperture 240. When the size of the aperture 240 reaches the target range, the image sensor generates feedback to the circuit board 100, and the circuit board 100 controls the resistor layer 22 of the heating part 113 to stop or reduce the current. Since the heat of the aperture 240 will not disappear instantly, the size of the aperture 240 may increase due to the large amount of heat. The cooling part 115 can absorb the excess heat of the aperture 240 and maintain the temperature stability, so that the size of the aperture 240 is maintained within a suitable range. When the circuit board 100 determines that the light flux is large, the size of the aperture 240 needs to be reduced. The circuit board 100 controls the resistor layer 22 of the heating part 113 to stop the current. The aperture 240 can absorb the excess heat of the aperture 240 through the cooling part 115 and the heating part 113 to reduce the temperature of the aperture 240, so that the size of the aperture 240 is reduced. In other embodiments, when the temperature increases, the size of the aperture 240 decreases, and when the temperature decreases, the size of the aperture 240 increases. The above adjustment process is reversed, and it will not be repeated here.

[0049] The lens module 200 provided in the embodiment of the present application can control the current of the resistor layer 22 located in the heating part 113 according to the temperature of the aperture 240, control the heat generated by the resistor layer 22, and cooperate with the cooling part 115 to adjust the temperature of the aperture 240, thereby adjusting the size of the aperture 240 made of memory metal, and then changing the luminous flux of the lens module 200. The structure of the lens module 200 is compact and small, and the height of the lens module 200 can be reduced; in addition, the temperature change of the circuit board 100 is continuous, and the size of the aperture 240 can also be changed continuously, without the problem of mechanical opening and closing accuracy.

[0050] See also Figures 5 to 13 , and combined with Figure 2 The present application also provides a method for manufacturing a circuit board 100. Figure 2 The cross section of the circuit board shown in the figure along the DD direction is used as an example for explanation. The manufacturing method may include the following steps:

[0051] Step S1: Please refer to Figure 6 , providing a copper-clad board 40, including a first copper layer 41, a resistor layer 22, a dielectric layer 21 and a second copper layer 43 which are stacked.

[0052] The copper clad laminate 40 can be divided into a first region I and a second region II. The first region I is used to form a connection region M later, and the second region II is used to form an extension region N later.

[0053] In other embodiments, the resistance layer 22 may also be formed by electroplating, printing, pressing alloy materials, etc.

[0054] Step S2: Please refer to Figure 7 A second through hole 1112 and a plurality of blind holes 45 are formed on the copper clad board 40 . The second through hole 1112 penetrates the copper clad board 40 . The blind holes 45 penetrate the first copper layer 41 , the resistor layer 22 and the dielectric layer 21 . The second copper layer 43 is exposed to the blind holes 45 .

[0055] The second through hole 1112 and the blind hole 45 are both located in the first zone I. A plurality of blind holes 45 are dispersed around the second through hole 1112 , and the area where the blind holes 45 are located is subsequently used to form a cooling portion 115 .

[0056] Step S3: Please refer to Figure 8 A heat conducting layer 27 is formed on the inner wall of the blind hole 45 , and the heat conducting layer 27 connects the first copper layer 41 and the second copper layer 43 .

[0057] The heat conducting layer 27 may be formed on the inner wall of the blind hole 45 by electroplating. The material of the heat conducting layer 27 may be metal. The material of the heat conducting layer 27 may be the same as that of the circuit layer 24 , such as copper.

[0058] Step S4: Please refer to Fig. 9 The first copper layer 41 is wired to form a first wiring layer 241 and a plurality of heat-conducting pillars 23 , and the second copper layer 43 is wired to form a second wiring layer 243 , so as to form a wiring substrate 50 .

[0059] The heat-conducting column 23 is located in the first area I. The heat-conducting column 23 is located on the surface of the resistor layer 22 . A plurality of heat-conducting columns 23 and a plurality of blind holes 45 are sequentially spaced and distributed around the second through hole 1112 .

[0060] In this embodiment, the first circuit layer 241 and the second circuit layer 243 together form the circuit layer 24. In other embodiments, the number of layers of the circuit layer 24 is not limited to two, and may be one or more layers.

[0061] The first circuit layer 241 may be located in the second region II, and a portion of the first circuit layer 241 located in the second region II may also be used to form the finger portion 132 . The second circuit layer 243 may be located in the first region I and the second region II.

[0062] Step S5: Please refer to Fig.10 , etching exposes a portion of the heat conducting pillars 23 and the resistor layer 22 of the first circuit layer 241 .

[0063] The resistance layer 22 located at the periphery of the second through hole 1112, the resistance layer 22 located in the edge area of ​​the first zone I and the second zone II are etched, the resistance layer 22 located in the connecting area of ​​the first zone I and the second zone II is etched, and the resistance layer 22 located in the first zone I and the resistance layer 22 located in the second zone II are spaced apart.

[0064] Step S6: Please refer to Fig.11 , covering the insulating layer 26 , the heat conducting pillars 23 , the blind holes 45 and the heat conducting layer 27 are exposed on the insulating layer 26 .

[0065] The insulating layer 26 covers two opposite surfaces of the circuit substrate 50, and the insulating layer 26 is located in the first area I and the second area II. The insulating layer 26 covers the first circuit layer 241, the second circuit layer 243, the dielectric layer 21, and the resistor layer 22. The heat-conducting pillar 23 is exposed to the insulating layer 26 and is spaced apart from the insulating layer 26. The insulating layer 26 is arranged around the blind hole 45, and the first circuit layer 241 located around the heat-conducting layer 27 can also be exposed to the insulating layer 26; the first circuit layer 241 and / or the second circuit layer 243 used to form the finger portion 132 are exposed to the insulating layer 26.

[0066] Step S7: Please refer to Fig.12 , the phase change layer 25 is filled in the blind hole 45 , and the phase change layer 25 is sealed with a sealing layer 28 .

[0067] The phase change layer 25 is located in the blind hole 45 surrounded by the heat conductive layer 27 , and the sealing layer 28 is sealed on the surface of the heat conductive layer 27 to seal the phase change layer 25 in the blind hole 45 .

[0068] Step S8: Please refer to Fig.13 and Figure 2 , a protective layer 29 is formed on the thermal conductive pillar 23 and the sealing layer 28 .

[0069] The protective layer 29 is a conductive material with stable chemical properties, such as gold. The protective layer 29 also covers the first circuit layer 241 and / or the second circuit layer 243 exposed to the insulating layer 26 to form the finger portion 132, thereby obtaining the circuit board 100. The first area I is the connection area M, and the second area II is the extension area N.

[0070] In other embodiments, the method for manufacturing the circuit board 100 is not limited to the above steps, and the manufacturing steps and corresponding structures may be adjusted according to actual needs.

[0071] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A circuit board, characterized in that: The circuit board comprises: Connecting area; The connection area includes a main body, a heating part and a cooling part, wherein the heating part and the cooling part are arranged in the main body at intervals; The heating part is used to generate heat, and the cooling part is used to absorb heat; Among them, the circuit board includes a dielectric layer, a resistor layer and a circuit layer, the dielectric layer and the circuit layer are both located in the main body, the heating part and the cooling part, the circuit layer is located on the surface of the dielectric layer, and the resistor layer is located in the heating part.

2. The circuit board according to claim 1, characterized in that: The circuit board further includes a heat-conducting column and a phase change layer. The heat-conducting column is located in the heating part and connected to the resistance layer; the phase change layer is located in the cooling part.

3. The circuit board according to claim 2, characterized in that: Each of the heating parts includes the dielectric layer, the resistor layer, the circuit layer and the insulating layer; the resistor layer is located on the surface of the dielectric layer, and the circuit layer is electrically connected to the resistor layer; the thermally conductive column is located on the surface of the resistor layer away from the dielectric layer, and the thermally conductive column is exposed to the insulating layer.

4. The circuit board according to claim 3, characterized in that: The heating portion further includes a protection layer, the protection layer covers the heat conductive column, and the protection layer is exposed to the insulating layer.

5. The circuit board according to any one of claims 2 to 4, characterized in that: Each of the cooling parts includes the dielectric layer, the circuit layer, the phase change layer and the insulating layer. The circuit layer is located on the surface of the dielectric layer, the phase change layer is buried in the circuit layer, and the circuit layer is exposed to the insulating layer.

6. The circuit board according to claim 5, characterized in that: The cooling part further includes a sealing layer and a protective layer. The sealing layer seals the phase change layer in the circuit layer. The protective layer located in the cooling part covers the surface of the sealing layer exposed to the insulating layer.

7. A lens module, characterized in that: include: An aperture is provided with a first through hole, and the aperture is made of memory metal; as well as The circuit board described in any one of claims 1-6, wherein the circuit board is provided with a second through hole, the connection area is connected to the aperture, the second through hole is arranged corresponding to the first through hole, and the heating part and the cooling part are arranged around the second through hole.

8. The lens module according to claim 7, characterized in that: The lens module also includes a temperature sensor, which is arranged on the main body and electrically connected to the circuit layer. The temperature sensor is used to detect the temperature of the aperture.

9. A method for manufacturing a circuit board, characterized in that: include: A circuit substrate is provided, which is divided into a first area and a second area. The circuit substrate comprises a dielectric layer, a circuit layer, a resistor layer, a heat-conducting column and a heat-conducting layer. The dielectric layer and the circuit layer are located in the first area and the second area; the circuit layer is located on the surface of the dielectric layer; the resistor layer is located in the first area and on the surface of the dielectric layer, and the heat-conducting column is located on the surface of the resistor layer; the heat-conducting layer is connected to the circuit layer located in the first area and is surrounded to form a plurality of blind holes; An insulating layer is covered on two opposite surfaces of the circuit substrate, and the heat-conducting pillar, the heat-conducting layer and the blind hole are exposed in the insulating layer; Filling a phase change layer in the blind hole and sealing the phase change layer with a sealing layer; and A protective layer is formed on the heat-conducting pillar and the sealing layer.

10. The method for manufacturing a circuit board according to claim 9, characterized in that: A portion of the circuit layer located in the second area is exposed to the insulating layer, and the protection layer further covers the circuit layer located in the second area and exposed to the insulating layer.

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