Power device and electronic speed controller module thereof
Through the use of ceramic substrates in the new energy vehicle power device, heat exports, solving the problem of low heat dissipation efficiency caused by the concentration of heat dissipation surfaces in existing technologies, and realized high -efficiency heat dissipation and insulation, suitable for lightweight design.
Patent Information
- Application Number
- CN202410652588.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-27
- Filing Date
- 2024-05-24
- Publication Date
- 2025-01-28
AI Technical Summary
In the existing new energy vehicle power plants, the heat dissipation surface of IGBT or MOSFET power components is concentrated, resulting in low heat dissipation efficiency. Especially in air-cooled structures, it is difficult to take into account both efficient heat dissipation and lightweight design.
The ceramic substrate is used to pass the heat generated by the power device to the outside of the shell. The thermal conductivity of the ceramic substrate and the inner wall of the module shell can be achieved to achieve efficient heat dissipation, and at the same time insulating the power device and the shell.
Improved the heat dissipation efficiency of power devices, reduced the overall weight, enhanced the insulation effect, and suitable for lightweight design needs.
Smart Images
Figure CN119383824A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of power technology, and in particular to a power device and an electric adjustment module thereof. Background Art
[0002] At present, most new energy vehicles on the market use IGBT (Insulated Gate Bipolar Transistor) or other MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) power components, with concentrated heat dissipation surfaces. However, for motor controllers with air-cooling structures, concentrated heat dissipation surfaces are a disadvantage. The motor controllers of electric aircraft can use the wind flow during flight for air cooling, while liquid cooling will increase the weight of the coolant. Therefore, air cooling is often used based on lightweight design. Using a non-centralized heat dissipation mode can obtain a larger heat dissipation area, thereby improving heat dissipation efficiency, while also taking into account the insulation treatment of high-voltage components. Summary of the invention
[0003] The purpose of the present application is to provide a power device and an electric adjustment module thereof. The present application utilizes a ceramic substrate to transfer the heat generated by the power device to the outside of the housing, with high heat dissipation efficiency, while insulating the power device and the housing.
[0004] In order to solve the above technical problems, the present application provides an electric adjustment module, including: a PCB board; a plurality of transistors, the transistors are arranged at intervals along the edge of the PCB board; a module housing, the module housing is sleeved outside the PCB board, wherein the transistor is connected to a ceramic substrate facing the side of the module housing, and the ceramic substrate and the inner wall of the module housing form heat conduction for conducting away the heat generated by the transistor.
[0005] The present application provides a power device, including a motor module and the above-mentioned electric control module.
[0006] Optionally, thermal conductive silicone grease is coated between the ceramic substrate and the inner wall of the module housing.
[0007] Optionally, the transistor is vertically placed on an edge of the PCB board and a heat dissipation surface of the transistor is perpendicular to a plane of the PCB board.
[0008] Optionally, the ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor is welded to the copper-clad portion of the ceramic substrate.
[0009] Optionally, the PCB board is a regular hexagonal structure, and the transistor is centrally symmetrical with the center of the PCB board as the origin.
[0010] Optionally, it comprises a plurality of heat sinks, the module housing presents a regular hexagonal structure, the module housing (3) surrounds the PCB board, the outer side of the module housing is surrounded by the plurality of heat sinks, and the outer edges of the plurality of heat sinks present a circular structure.
[0011] Optionally, the ceramic substrate has a thickness of at least 0.9 mm.
[0012] Optionally, the transistor is a silicon carbide MOSFET.
[0013] Optionally, the transistor includes a pair of high-voltage pins, a gap is provided at an edge of the PCB board to form an air groove, and the pair of high-voltage pins are welded on both sides of the gap.
[0014] The present application utilizes a ceramic substrate to transfer the heat generated by the power device to the outside of the housing, with high heat dissipation efficiency, while insulating the power device and the housing. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 Shown is a schematic diagram of the structure of the electric adjustment module according to an embodiment of the present application;
[0016] Figure 2 Shown is a schematic diagram of the structure of the PCB board of the electric adjustment module according to an embodiment of the present application. DETAILED DESCRIPTION
[0017] The following embodiments further illustrate the technical solution of the present application. It is to be understood that the specific embodiments described herein are only used to explain the present application. It should also be noted that, for ease of description, only the parts related to the present application are shown in the drawings, not all.
[0018] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0019] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0020] The following describes embodiments of the present application with reference to the accompanying drawings. Figure 1 to Figure 2 As shown, the electric adjustment module of the embodiment of the present application includes: a PCB board 1, a plurality of transistors 2 and a module housing 3, wherein the transistors 2 are arranged at intervals along the edge of the PCB board 1, and the module housing 3 is sleeved outside the PCB board 1, wherein the transistor 2 is connected to a ceramic substrate (not shown in the figure) on the side facing the module housing 3, and the ceramic substrate and the inner wall of the module housing 3 form heat conduction for conducting away the heat generated by the transistor 2.
[0021] Specifically, the transistor 2 is arranged at intervals on the edge of the PCB 1 (Printed Circuit Board, PCB) to reduce the heat generated in the middle of the power board, so that the motor corresponding to the electric adjustment module can be assembled close to the middle of the power board, reducing the overall assembly difficulty and assembly volume. Preferably, the transistor 2 is placed vertically on the edge of the PCB 1, and the heat dissipation surface of the transistor 2 is perpendicular to the plane of the PCB 1. The heat dissipation surface is the side facing the module housing 3, which is either the side where the wafer of the transistor 2 as a power semiconductor is located, or the side where the metal heat dissipation surface of the packaged insulated dual-gate transistor 2 is located, or the side with the largest area of the transistor 2, and the heat dissipation surface faces the periphery of the PCB 1. Further, the ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor 2 is welded to the copper-clad part of the ceramic substrate, thereby achieving the heat conduction effect between the heat dissipation surface of the transistor 2 and the copper-clad part of the ceramic substrate, without the need to use thermal conductive silicone grease, reducing costs. The embodiment of the present application uses a ceramic substrate to conduct the heat generated by the power device, and at the same time uses the insulation effect of the ceramic substrate to insulate the power device and the housing.
[0022] Furthermore, thermal conductive silicone grease is coated between the ceramic substrate and the inner wall of the module housing 3 to enhance the thermal conductivity. Furthermore, the PCB board 1 is a regular hexagonal structure, and the transistor 2 is centrally symmetrical with the center of the PCB board 1 as the origin. The electric adjustment module includes a plurality of heat sinks 4, the module housing 3 presents a regular hexagonal structure, the module housing 3 surrounds the PCB board 1, the outer side of the module housing 3 is surrounded by a plurality of heat sinks 4, and the outer edges of the plurality of heat sinks 4 present a circular structure to match the circular structure of the motor. The PCB board 1 is designed as a regular hexagonal structure, which can effectively reduce the weight of the heat dissipation housing and is conducive to the lightweight design of the power system. In this embodiment, the transistors 2 are divided into six groups with the same composition structure, with the center of the PCB board 1 as the origin, and are evenly distributed on the six edges of the PCB board 1 in a fan-shaped arrangement of 60° adjacent to each other, so that the transistors 2 form an overall centrally symmetrical layout. Through the centrally symmetrical layout, the current loop impedance of the three phases of the electric adjustment module is consistent.
[0023] The thickness of the ceramic substrate is at least 0.9 mm to ensure the best insulation effect. Preferably, transistor 2 preferably uses silicon carbide MOSFET. Compared with ordinary transistors, silicon carbide MOSFET has higher voltage resistance and thermal conductivity, fast switching speed, and small switching loss. It can increase the switching speed and reduce motor heating. The use of silicon carbide MOSFET can select a higher voltage platform. Under the same power, the bus current and three-phase current can be reduced, thereby reducing the corresponding wiring harness weight. In addition, the increase in voltage can also speed up the charging speed.
[0024] Furthermore, the transistor 2 includes a pair of high-voltage pins, and a gap is provided at the edge of the PCB board 1 to form an air slot, and a pair of high-voltage pins are welded on both sides of the gap. The center distance between the two high-voltage pins is 5.04mm. Since the PCB board 1 needs to provide a connecting pad, the actual creepage distance is only 2.5mm. By opening the air slot, the creepage distance of more than 4mm can be achieved under the protection level of the controller IP67.
[0025] The embodiment of the present application also provides a power device, including a motor module and the electric adjustment module in the above embodiment. The electric adjustment module of the power device of the present application uses a ceramic substrate to conduct heat generated by the power device to improve the heat dissipation efficiency, and at the same time insulates the power device and the housing.
[0026] The above embodiments are merely illustrative of the principles and effects of the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the purpose of the present application. Therefore, all equivalent modifications or changes made by a person with ordinary knowledge in the relevant technical field without departing from the purpose disclosed in the present application shall still be covered by the claims of the present application.
Claims
1. An electric adjustment module, characterized in that: include: A PCB board (1); a plurality of transistors (2), the transistors (2) being arranged at intervals along the edge of the PCB board (1); and a module housing (3), the module housing (3) being sleeved outside the PCB board (1), wherein the transistors (2) are connected to a ceramic substrate on the side facing the module housing (3), and the ceramic substrate and the inner wall of the module housing (3) form heat conduction for conducting heat generated by the transistors (2).
2. The electric adjustment module according to claim 1, characterized in that: Thermal conductive silicone grease is coated between the ceramic substrate and the inner wall of the module housing (3).
3. The electric adjustment module according to claim 1, characterized in that: The transistor (2) is vertically placed on the edge of the PCB board (1) and the heat dissipation surface of the transistor (2) is perpendicular to the plane of the PCB board (1).
4. The electric adjustment module according to claim 1, characterized in that: The ceramic substrate is partially coated with copper foil, and the heat dissipation surface of the transistor (2) is welded to the copper-clad portion of the ceramic substrate.
5. The electric adjustment module according to claim 1, characterized in that: The PCB board (1) is a regular hexagonal structure, and the transistor (2) is centrally symmetrical with the center of the PCB board (1) as the origin.
6. The electric adjustment module according to claim 5, characterized in that: It comprises a plurality of heat sinks (4), the module housing (3) presents a regular hexagonal structure, the module housing (3) surrounds the PCB board (1), the outer side of the module housing (3) is surrounded by the plurality of heat sinks, and the outer edges of the plurality of heat sinks present a circular structure.
7. The electric adjustment module according to claim 1, characterized in that: The ceramic substrate has a thickness of at least 0.9 mm.
8. The electric adjustment module according to claim 1, characterized in that: The transistor (2) is a silicon carbide MOSFET.
9. The electric adjustment module according to claim 1, characterized in that: The transistor (2) comprises a pair of high-voltage pins, a gap is provided on the edge of the PCB board (1) to form an air groove, and the pair of high-voltage pins are welded on both sides of the gap.
10. A power device, characterized in that: It comprises a motor module and an electric adjustment module as claimed in any one of claims 1 to 9.