High-power charger with better heat dissipation effect

Abstract

The invention relates to the technical field of chargers, and discloses a high-power charger with a better heat dissipation effect, which comprises a mainboard and an electrical element arranged on the mainboard, and further comprises a shell, a partition plate is fixedly connected in the shell, and the shell and the partition plate are matched to form an air inlet area and a heat dissipation area. The mainboard is installed in the heat dissipation area, a heat dissipation mechanism is installed in the air inlet area and comprises a plurality of heat dissipation air pipes arranged on the two sides of the mainboard, one ends of the heat dissipation air pipes are communicated with the air inlet area, and the other ends of the heat dissipation air pipes vertically penetrate into the heat dissipation area and are provided with heat dissipation holes. According to the high-power charger with the better heat dissipation effect, the multiple heat dissipation air pipes are arranged on the two sides of the main board, the heat dissipation air pipes are driven to swing when the heat dissipation fan rotates, the air outlet direction is changed in real time, the air blowing range is widened, and meanwhile after air enters the heat dissipation air pipes, the flow speed is increased through compression of the heat dissipation holes; and the heat dissipation effect on the mainboard and the electrical elements can be further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chargers, and in particular to a high-power charger with better heat dissipation effect. Background Art

[0002] The charger is a charging device that uses high-frequency power supply technology and advanced intelligent dynamic adjustment charging technology. The charger is mainly composed of a shell, a motherboard and electrical components. A high-power charger will have a cooling fan inside the shell to prevent the electrical components from overheating when working for a long time.

[0003] At present, most fans are installed on one side of the motherboard, blowing air horizontally from one side to the other side. However, since the electrical components on the motherboard are of different sizes, the large-sized electrical components near the air supply end will block the electrical components on the rear side from contacting the wind, making it difficult to effectively blow air into the shell. In addition, since the ventilation hole design of the shell needs to meet the dust and rainproof effect when used outdoors, the air intake is limited, resulting in heat accumulation when the high-power charger works for a long time, affecting the working performance of the charger. Therefore, we propose a high-power charger with better heat dissipation effect. Summary of the invention

[0004] The present invention is proposed in view of the above-mentioned problem that due to the different sizes of electrical components on the mainboard, the large-sized electrical components close to the air supply end will block the electrical components on the rear side from contacting the wind, making it difficult to effectively blow air inside the shell.

[0005] Therefore, the purpose of the present invention is to provide a high-power charger with better heat dissipation effect, and its purpose is to solve the problem that due to the different sizes of electrical components on the mainboard, the large-sized electrical components close to the air supply end will block the electrical components on the rear side from contacting the wind, making it difficult to effectively blow air inside the shell.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: A high-power charger with better heat dissipation effect, comprising a mainboard and electrical components installed thereon, and also comprising a shell, a partition is fixedly connected to the shell, the shell and the partition cooperate to form an air inlet area and a heat dissipation area, the mainboard is installed in the heat dissipation area, and a heat dissipation mechanism is installed in the air inlet area;

[0007] The heat dissipation mechanism includes a plurality of heat dissipation ducts arranged on both sides of the mainboard, one end of the heat dissipation duct is connected to the air inlet area, and the other end vertically penetrates into the heat dissipation area and is provided with a heat dissipation hole. The heat dissipation mechanism also includes two heat dissipation fans, and the heat dissipation fans are transmission-connected with a cross bar, and the cross bar is used to drive the heat dissipation duct to swing.

[0008] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, an air inlet hole is opened at the bottom of the shell, and a protective net is fixedly connected to the bottom of the shell.

[0009] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, the heat dissipation air duct is rotatably connected to the partition, the bottom of the heat dissipation air duct is open, and the heat dissipation hole is an inferior arc structure.

[0010] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, wherein: the cooling fan is fixedly installed on the bottom of the shell, and a fan gear is coaxially connected to the cooling fan, one side of the fan gear is meshingly connected with a transmission gear, one side of the transmission gear is rotatably connected to the partition, and the other side is eccentrically connected to a lever, and the lever is slidably matched with the cross bar.

[0011] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, the bottom of the partition is fixedly connected to two guide rails, the cross bar is slidably connected to the guide rails, one end of the cross bar is fixedly connected to a rack, and the lower end of the heat dissipation air duct is fixedly connected to a gear ring meshing with the rack.

[0012] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, an air outlet is opened on the top of the shell, and a protective cover with a U-shaped structure is fixedly connected to the top of the shell.

[0013] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, baffles are hinged at both ends of the protective cover.

[0014] As a preferred solution of the high-power charger with better heat dissipation effect described in the present invention, a heat conducting plate is fixedly connected to the top of the shell, a plurality of heat dissipation fins are fixedly connected to the heat conducting plate, the heat dissipation fins pass through the shell and are connected and fixed to the protective cover, and the heat dissipation fins cooperate with the protective cover to form a plurality of heat dissipation channels.

[0015] Beneficial effects of the present invention:

[0016] 1. The present invention arranges a plurality of heat dissipation ducts on both sides of the mainboard. When the heat dissipation ducts discharge air, they can evenly and effectively blow air to the electrical components on the mainboard. When the heat dissipation fan rotates, the heat dissipation ducts are driven to swing, and the air outlet direction is changed in real time to increase the blowing range. At the same time, after the air enters the heat dissipation duct, it is compressed by the heat dissipation holes to increase the flow rate, which can further improve the heat dissipation effect on the mainboard and electrical components.

[0017] 2. The present invention can absorb the heat in the heat dissipation area through the heat conduction plate and transfer it to each heat dissipation fin. The air in the shell passes through the heat dissipation channel when discharged to the outside, so that the air can take away the heat on the heat dissipation fins, and the heat dissipation effect is further improved through the composite heat dissipation method.

[0018] 3. In the present invention, when the protective cover is exhausting, the baffle is automatically opened by the airflow, so that the air in the shell is quickly discharged to the outside. When the protective cover stops exhausting, the baffle automatically falls down to shield and protect the empty slot of the protective cover, thereby improving the safety protection effect of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0020] in:

[0021] Figure 1 This is a schematic diagram of the overall structure of a high-power charger with better heat dissipation effect according to the present invention.

[0022] Figure 2 This is a schematic diagram of the internal structure of the shell of a high-power charger with better heat dissipation effect of the present invention.

[0023] Figure 3 This is a schematic diagram of the heat dissipation structure of a high-power charger with better heat dissipation effect according to the present invention.

[0024] Figure 4 This is a schematic diagram of the heat dissipation duct structure of a high-power charger with better heat dissipation effect according to the present invention.

[0025] Figure 5 This is a schematic diagram of the disassembly of the transmission gear and crossbar structure of the high-power charger with better heat dissipation effect of the present invention.

[0026] Figure 6 This is a schematic diagram of the protective cover and heat conducting plate structure of a high-power charger with better heat dissipation effect of the present invention.

[0027] Description of reference numerals:

[0028] 1. Main board; 2. Shell; 201. Partition; 202. Air inlet area; 203. Heat dissipation area; 204. Protective net; 205. Guide rail; 3. Heat dissipation mechanism; 301. Heat dissipation duct; 302. Heat dissipation hole; 303. Cooling fan; 304. Fan gear; 305. Transmission gear; 306. Lever; 307. Cross bar; 308. Rack; 309. Gear ring; 4. Protective cover; 401. Baffle; 5. Heat conduction plate; 501. Heat dissipation fin; 502. Heat dissipation channel. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0030] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] Example 1

[0032] Reference Figure 1-5 , which is the first embodiment of the present invention, provides a high-power charger with better heat dissipation effect. The high-power charger with better heat dissipation effect includes a mainboard 1 and electrical components installed thereon, and also includes a shell 2. A partition 201 is fixedly connected to the shell 2. The shell 2 and the partition 201 cooperate to form an air inlet area 202 and a heat dissipation area 203. The mainboard 1 is installed in the heat dissipation area 203, and a heat dissipation mechanism 3 is installed in the air inlet area 202.

[0033] The heat dissipation mechanism 3 includes a plurality of heat dissipation ducts 301 arranged on both sides of the mainboard 1. One end of the heat dissipation duct 301 is connected to the air inlet area 202, and the other end vertically penetrates into the heat dissipation area 203 and is provided with a heat dissipation hole 302. The heat dissipation mechanism 3 also includes two heat dissipation fans 303. The heat dissipation fans 303 are transmission-connected with a cross bar 307, and the cross bar 307 is used to drive the heat dissipation duct 301 to swing.

[0034] In the above technical solution, when the cooling fan 301 rotates, air is sucked into the air inlet area 202 through the bottom of the shell 2, and the flowing air enters the cooling air duct 301 and is ejected through the cooling holes 302. Since the cooling air ducts 301 are arranged on both sides of the mainboard 1 and are arranged at equal intervals, the flowing air can effectively blow air to the electrical components on the mainboard 1. At the same time, the cooling fan 303 drives the cross bar 307 to swing back and forth, and the cross bar 307 drives the cooling air duct 301 to swing, thereby changing the air outlet direction in real time, thereby further improving the heat dissipation effect on the mainboard 1.

[0035] An air inlet hole is opened at the bottom of the shell 2, and a protective net 204 is fixedly connected to the bottom of the shell 2.

[0036] In the above technical solution, the air inlet hole is composed of a plurality of rectangular holes arranged at equal intervals, which can ensure that when the cooling fan 303 rotates, the outside world provides an effective amount of air to the air inlet area 202. The protective net 204 is composed of a rectangular frame and a mesh connected thereto. The fixed frame can block dust floating from the outside world. The mesh and the fixed frame cooperate to prevent foreign objects from entering the shell 2.

[0037] The heat dissipation duct 301 is rotatably connected to the partition plate 201 , the bottom of the heat dissipation duct 301 is open, and the heat dissipation hole 302 is an inferior arc structure.

[0038] In the above technical solution, after the cooling fan 303 drives the outside air into the air inlet area 202, the air volume in the air inlet area 202 increases, so that the air enters the cooling air duct 301 and is ejected through the cooling holes 302. Multiple cooling air ducts 301 cooperate to blow air from both sides of the mainboard 1, thereby effectively blowing air to the electrical components on the mainboard 1 and improving the heat dissipation effect.

[0039] Among them, the air fills the heat dissipation duct 301 and then sprays out through the heat dissipation holes 302. As the cross-sectional area of ​​the air flow channel decreases, the air flow rate increases to form a pressure difference, which reduces the air temperature, thereby helping to further improve the heat dissipation effect of the motherboard 1.

[0040] The cooling fan 303 is fixedly installed at the bottom of the shell 2, and a fan gear 304 is coaxially connected to the cooling fan 303. A transmission gear 305 is meshedly connected to one side of the fan gear 304. One side of the transmission gear 305 is rotationally connected to the partition 201, and the other side is eccentrically connected to a lever 306. The lever 306 slides with the cross bar 307.

[0041] In the above technical solution, the diameter of the transmission gear 305 is larger than the diameter of the fan gear 304, and the fan gear 304 is used to drive the transmission gear 305 to perform a deceleration motion. Each time the tooth portion of the fan gear 304 engages with the transmission gear 305 once, it drives the transmission gear 305 to transmit a certain angle. The lever 306 drives the cross bar 307 to move a moving distance, so that the cross bar 307 drives the heat dissipation duct 301 to rotate a certain angle, thereby changing the air outlet direction. When the lever 306 rotates one circle, the cross bar 307 makes a reciprocating movement, causing the heat dissipation duct 301 to swing back and forth, thereby further improving the heat dissipation effect of the motherboard 1.

[0042] The two crossbars 307 move in opposite directions, so that the heat dissipation ducts 301 on both sides of the mainboard 1 swing in opposite directions, so that all electrical components on the mainboard 1 can be in contact with the flowing air in real time.

[0043] Two guide rails 205 are fixedly connected to the bottom of the partition 201, and the cross bar 307 is slidably connected to the guide rails 205. One end of the cross bar 307 is fixedly connected to a rack 308, and the lower end of the heat dissipation air duct 301 is fixedly connected to a gear ring 309 meshing with the rack 308.

[0044] In the above technical solution, the guide rail 205 limits the movement of the cross bar 307, so that the cross bar 307 slides straight, and the rack 308 slides with the partition 201. When the cross bar 307 moves, the rack 308 drives the gear ring 308 to rotate, thereby driving the heat dissipation duct 301 to rotate.

[0045] An air outlet is provided on the top of the shell 2 , and a U-shaped protective cover 4 is fixedly connected to the top of the shell 2 .

[0046] In the above technical solution, the air outlet is opened in the middle position of the top of the shell 2, and the air flowing in the heat dissipation area 203 is guided to flow to the outside through the empty groove of the protective cover 4, so that the air containing heat in the heat dissipation area 203 is discharged. At the same time, the setting of the protective cover 4 can prevent rainwater, dust, etc. from falling directly into the shell 2.

[0047] It can be understood that since the volume of air expands and its density decreases after being heated, the exhausted hot air will flow upward. At the same time, the shell 2 takes in air through the bottom, which can prevent the exhausted hot air from being sucked into the heat dissipation area 203 again, ensuring that the air inhaled is the outside air at normal temperature, which helps to improve the heat dissipation effect.

[0048] During use, when the cooling fan 303 rotates, the outside air is sucked into the air inlet area 202 through the air inlet hole. After the air enters the cooling air duct 301, it is ejected through the cooling hole 302. At the same time, the fan gear 304 and the transmission gear 305 intermittently drive the lever 306 to rotate. The lever 306 and the cross bar 307 cooperate to drive the rack 308 to move back and forth intermittently. The rack 308 and the gear ring 309 cooperate to drive the cooling air duct 301 to swing. The cooling air ducts 301 cooperate to blow air evenly and effectively to the electrical components on the mainboard 1, thereby taking away the heat on the electrical components and discharging it to the outside through the port of the protective cover 4.

[0049] Example 2

[0050] Reference Figure 6 , which is the second embodiment of the present invention. This embodiment is different from the first embodiment in that baffles 401 are hinged at both ends of the protective cover 4.

[0051] In the above technical solution, the upper end of the baffle 401 is hinged to the inner wall of the protective cover 4. When the protective cover 4 is exhausting, the airflow drives the baffle 401 to automatically rotate outward and open to facilitate the discharge of hot air. When the heat dissipation work is stopped, the baffle 401 is placed vertically under the action of gravity to block the port of the protective cover 4, thereby preventing foreign matter from entering the shell 2 through the empty slot of the protective cover 4.

[0052] During actual use, a fixing plate is provided on one side of the baffle 401 facing the middle of the protective cover 4. The fixing plate is connected and fixed to the protective cover 4. The fixing plate limits the rotation direction of the baffle 401 and can block rainwater at the same time to prevent rainwater from entering the shell 2 through the protective cover 4, thereby improving the protection effect.

[0053] The remaining structures are the same as those of Example 1.

[0054] Example 3

[0055] Reference Figure 6 , which is the third embodiment of the present invention. This embodiment is different from the second embodiment in that: a heat conducting plate 5 is fixedly connected to the top of the shell 2, and a plurality of heat dissipating fins 501 are fixedly connected to the heat conducting plate 5. The heat dissipating fins 501 pass through the shell 2 and are fixedly connected to the protective cover 4, and the heat dissipating fins 501 cooperate with the protective cover 4 to form a plurality of heat dissipating channels 502.

[0056] In the above technical solution, the heat conducting plate 5 and the heat dissipating fins 501 are both made of copper materials with good heat absorption effect. Since the heat generated by the electrical components on the mainboard 1 will be concentrated in the upper part of the heat dissipation area 203, the heat is absorbed by the heat conducting plate 5 and then transferred to each heat dissipating fin 501. When the air flows outward in the heat dissipation channel 502, it can take away part of the heat on the heat dissipating fin 501, thereby realizing heat dissipation in multiple ways.

[0057] The remaining structures are the same as those of Example 1.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A high-power charger with better heat dissipation effect, comprising a mainboard (1) and electrical components mounted thereon, characterized in that: It also comprises a shell (2), a partition (201) being fixedly connected inside the shell (2), the shell (2) and the partition (201) cooperating to form an air inlet area (202) and a heat dissipation area (203), the main board (1) being installed in the heat dissipation area (203), and a heat dissipation mechanism (3) being installed in the air inlet area (202); The heat dissipation mechanism (3) comprises a plurality of heat dissipation ducts (301) arranged on both sides of the mainboard (1); one end of the heat dissipation duct (301) is connected to the air inlet area (202); the other end vertically penetrates into the heat dissipation area (203) and is provided with a heat dissipation hole (302); the heat dissipation mechanism (3) also comprises two heat dissipation fans (303); a cross bar (307) is transmission-connected to the heat dissipation fan (303); the cross bar (307) is used to drive the heat dissipation duct (301) to swing.

2. The high-power charger with better heat dissipation effect according to claim 1, characterized in that: An air inlet hole is provided at the bottom of the shell (2), and a protective net (204) is fixedly connected to the bottom of the shell (2).

3. The high-power charger with better heat dissipation effect according to claim 1, characterized in that: The heat dissipation duct (301) is rotatably connected to the partition (201), the bottom of the heat dissipation duct (301) is open, and the heat dissipation hole (302) is an inferior arc structure.

4. The high-power charger with better heat dissipation effect according to claim 1, characterized in that: The cooling fan (303) is fixedly installed at the bottom of the shell (2), and a fan gear (304) is coaxially connected to the cooling fan (303). One side of the fan gear (304) is meshingly connected to a transmission gear (305). One side of the transmission gear (305) is rotationally connected to the partition (201), and the other side is eccentrically connected to a lever (306). The lever (306) is slidably matched with a cross bar (307).

5. The high-power charger with better heat dissipation effect according to claim 1, characterized in that: The bottom of the partition (201) is fixedly connected to two guide rails (205), the cross bar (307) is slidably connected to the guide rails (205), one end of the cross bar (307) is fixedly connected to a rack (308), and the lower end of the heat dissipation duct (301) is fixedly connected to a gear ring (309) meshing with the rack (308).

6. The high-power charger with better heat dissipation effect according to claim 1, characterized in that: An air outlet is provided on the top of the shell (2), and a protective cover (4) with a U-shaped structure is fixedly connected to the top of the shell (2).

7. The high-power charger with better heat dissipation effect according to claim 6, characterized in that: Baffles (401) are hingedly connected at both ends of the protective cover (4).

8. The high-power charger with better heat dissipation effect according to claim 6, characterized in that: A heat conducting plate (5) is fixedly connected to the top of the shell (2), a plurality of heat dissipation fins (501) are fixedly connected to the heat conducting plate (5), the heat dissipation fins (501) pass through the shell (2) and are fixedly connected to the protective cover (4), and the heat dissipation fins (501) cooperate with the protective cover (4) to form a plurality of heat dissipation channels (502).

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