Thin-plate water-cooling heat sink device and preparation method thereof

Abstract

The invention discloses a thin-plate water-cooling heat sink device. The device comprises a heat sink main body, the water nozzle is positioned on the side of the heat sink body; a main heat dissipation flow channel area; the transition flow channel area is connected with the first water nozzle and the main heat dissipation flow channel area; the transition flow channel area is connected with the second water nozzle and the main heat dissipation flow channel area; the fins are located in the main heat dissipation flow channel area; a heat load surface of the heat sink body; and the friction welding surface is welded on the heat sink main body through a friction stir welding process. The cylindrical heat dissipation fluid is converted into the planar heat dissipation fluid in the heat sink, the thickness of the heat sink is greatly reduced, meanwhile, the fin structure in the heat sink plate is combined, the heat dissipation efficiency can be greatly improved, the trend and the arrangement form of water channels can be flexibly designed according to heat source distribution of a thermal device through the friction stir welding process, and the heat dissipation efficiency is improved. And the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] The present invention specifically relates to a thin plate water-cooled heat sink, belongs to the technical field of heat exchange, and can be used for heat dissipation of electronic components with high heat flux density. Background Art

[0002] With the development of science and technology, more powerful and more integrated electronic components are constantly being designed. In order to ensure that high-power electronic components can continue to work stably in a high heat flux density environment, an efficient and reliable heat dissipation solution is essential. Compared with natural convection cooling, air cooling and other heat dissipation forms, water cooling can better meet the heat dissipation needs of electronic components.

[0003] In many water-cooling scenarios, there are strict restrictions on the size and weight of the heat sink. The traditional method of preparing heat sinks by boring holes in materials to process water channels has a large flow resistance of the fluid in the water channel, and the contact area between the fluid and the material is small, resulting in insufficient heat dissipation capacity. In addition, the outlet and inlet of the heat sink are generally connected to the nozzle, and the diameter of the water flow also limits the thickness reduction of the heat sink. How to achieve the design and preparation of thin-plate heat sinks has become the key to solving the application of high heat flux density electronic components.

[0004] Friction stir welding can effectively reduce the pores and slag inclusions produced in traditional fusion welding, and has the characteristics of small joint deformation, automated welding process, and high joint quality. At the same time, compared with other welding processes, the heat input in the process of friction stir welding is lower, and high-quality connection of various materials can be achieved. It is currently widely used in the field of light metals such as magnesium and aluminum. Before friction stir welding, the workpiece to be welded is fixed, and a non-consumable tool with a stirring needle and a shoulder is rotated at high speed and pressed into the workpiece to be welded. When the shoulder contacts the surface of the workpiece, the heat generated by the friction between the workpiece and the stirring tool, and the heat input increases with the increase in the amount of downward pressure, which puts the metal material in a thermoplastic state. The stirring tool runs in a predetermined direction to complete the welding process. In general, friction stir welding is a solid-state connection process that uses a tool that does not consume the tool to connect two face-to-face workpieces without melting the workpiece material. Therefore, it would be a better choice to use the new process of friction stir welding to prepare a water-cooled heat sink device. Summary of the invention

[0005] The purpose of the present invention is to provide a thin plate water-cooled heat sink to solve the problems of large thickness and insufficient heat dissipation capacity of traditional water-cooled heat sinks.

[0006] To achieve the above-mentioned objectives, the present invention provides a thin plate water-cooled heat sink device, comprising a heat sink body; a plurality of water nozzles located on the side of the heat sink body; a main heat dissipation channel area; a first transition channel area connecting the first water nozzle and the main heat dissipation channel area; a second transition channel area connecting the second water nozzle and the main heat dissipation channel area; and fins located in the main heat dissipation channel area, wherein the heat dissipation fluid enters through the first water nozzle, passes through the first transition channel area, the main heat dissipation channel area, and the second transition channel area in sequence, and is retained by the second water nozzle to realize the circulation of the heat dissipation fluid in the heat sink device.

[0007] Furthermore, the heat load surface of the heat sink body is welded to the friction welding surface on the heat sink body by a friction stir welding process.

[0008] Furthermore, the first transition flow channel area and the second transition flow channel area also include one or more of a circular hole flow channel, a wedge-shaped flow channel, and a fan-shaped flow channel.

[0009] Furthermore, the diameter of the circular hole flow channel is not less than the fluid diameter D in any of the multiple water nozzles.

[0010] Furthermore, the first transition flow channel area and the second transition flow channel area are designed as a circular hole flow channel, a wedge-shaped flow channel, and a fan-shaped flow channel in sequence to achieve a smooth transition from a circular flow channel to a planar flow channel.

[0011] Furthermore, the cross-sectional areas of the first transition flow channel region and the second transition flow channel region at any position along the fluid direction are not less than the fluid cross-sectional area of ​​any of the water nozzles to avoid excessive fluid resistance.

[0012] Furthermore, fins are provided in the main heat dissipation channel area, the fins are located on one side of the heat load surface, and the fins are an array combination of one or more of thin sheets, columns, and diamonds.

[0013] Furthermore, the material of the device is a metal material that can be processed by friction welding process, and the metal material is one or more of aluminum alloy, stainless steel, and copper.

[0014] Furthermore, the present invention also provides a method for manufacturing the above-mentioned thin plate water-cooled heat sink device, including manufacturing the main heat dissipation flow channel area, the wedge-shaped flow channel, and the fan-shaped flow channel on the friction welding surface of the heat sink body by mechanical processing, and then welding a thin plate covering the flow channel on the friction welding surface using a stir friction welding process.

[0015] First, the present invention can significantly increase the contact area between the fluid and the heat surface and improve the heat dissipation efficiency by transitioning the cylindrical heat dissipation fluid into a planar heat dissipation fluid in the heat sink and combining it with the fin structure set in the main heat dissipation flow channel area. Secondly, the cylindrical heat dissipation fluid is converted into a planar heat dissipation fluid, which can significantly reduce the design thickness of the heat sink. Finally, the stir friction welding process can flexibly design the direction and arrangement of the water channel according to the heat source distribution of the thermal device, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of a thin plate water-cooled heat sink device according to an embodiment of the present invention.

[0017] Figure 2 It is a schematic structural diagram of a thin plate water-cooled heat sink device according to an embodiment of the present invention.

[0018] Figure 3 It is a schematic structural diagram of the transition flow channel area according to an embodiment of the present invention. DETAILED DESCRIPTION

[0019] The following will be combined with the attached embodiment of the present invention Figure 1 ~Attached Figure 3 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.

[0020] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0021] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0022] like Figure 1 As shown, the present invention provides a thin plate water-cooled heat sink device, and its specific structural decomposition schematic diagram is as follows Figure 2As shown, it includes a heat sink body (2); a water nozzle (3) and a water nozzle (4) located on the side of the heat sink body; a main heat dissipation flow channel area (5); a transition flow channel area (6) connecting the water nozzle (3) and the main heat dissipation flow channel area (5); a transition flow channel area (7) connecting the water nozzle (4) and the main heat dissipation flow channel area (5); fins (8) located in the main heat dissipation flow channel area; a heat load surface (A) of the heat sink body; and a friction welding surface (B) welded to the heat sink body (2) by a stir friction welding process.

[0023] The thickness of the thin plate water-cooled heat sink (1) is 15 mm, the thickness of the heat load surface (A) of the main heat dissipation flow channel area (5) is 5.5 mm, the thickness of the friction welding surface (B) is 5.5 mm, and the flow channel area height is 4 mm. The thickness of the thin plate water-cooled heat sink (1) is less than the maximum outer diameter of the water nozzle (3) and the water nozzle (4) of φ22 mm.

[0024] The water nozzle (3) and the water nozzle (4) are straight-through water nozzle joints of NSC, which are fixed to the heat sink body (2) through pipe threads, and the inner cavity diameter of the water nozzle is φ8mm.

[0025] The transitional flow channel area (6) and the transitional flow channel area (7) include a circular hole flow channel (10), a wedge-shaped flow channel (11) and a fan-shaped flow channel (12). The circular hole flow channel (10) has a diameter of φ8 mm. The wedge-shaped flow channel (11) has a height of 12 mm and a width of 25 mm. The fluid is transitioned to the fan-shaped flow channel (12) at an angle of 30°, and then to the main heat dissipation flow channel area (5). The circular hole, wedge-shaped and fan-shaped flow channels are connected in sequence between the two transitional flow channel areas in order to reduce the fluid pressure in the flow channel area and realize a smooth transition from the circular flow channel to the planar flow channel.

[0026] The height of the main heat dissipation channel area (5) is 4 mm. Fins (8) are arranged in the channel area to divide the channel area into 9 microchannels, and the width of the microchannels is 1.5 mm.

[0027] In this embodiment, the material of the thin plate water-cooled heat sink (1) is 6063 aluminum alloy. In some embodiments, other materials such as 6082 aluminum-magnesium alloy, 7075 aviation aluminum alloy, etc. may also be used.

[0028] In some embodiments, metal aluminum Al, Mg, and Si with a purity greater than 99.99% are used as raw materials. Before weighing, the oxide film on the surface of the particles is removed by sandpaper polishing. The surface stains are removed by ultrasonic cleaning with anhydrous ethanol solution. After being accurately weighed according to the target composition ratio, they are placed in the furnace. Two vacuum pumps of different specifications are used to evacuate the furnace to 7×10 -6Pa, and finally filled with high-purity argon as a protective gas. Since the alloy is easily oxidized at high temperatures, hydrogen purification is carried out by vacuuming, and the pumping and washing are repeated three times to reduce the oxygen content in the furnace as much as possible. When smelting metal raw materials, the temperature is controlled at 1350℃~1540℃ until all metal particles are melted and can flow evenly in the crucible to obtain an aluminum alloy with uniform composition and no obvious segregation. The high entropy alloy ingot is machined into the required T-shaped structure welding rod, and the T-shaped welding rod and the workpiece to be welded are placed on the workbench of the stir friction welding equipment and fixed with a clamp. During the welding process, the relative position of the welding rod does not change; a truncated cone-shaped stirring needle is selected to perform single-pass welding perpendicular to the stir friction welding rod; after the welding is completed, the clamp is opened and the overlapped plate is removed. Among them, the upper end of the T-shaped structure, that is, the width parallel to the welding part, should be consistent with the shoulder width of the selected stirring head. The length of the welding rod is consistent with the length of the plate to be welded (that is, the heat load surface and friction welding surface of the heat sink body). Since the aluminum plate to be welded in this experiment is a regular rectangular 6063 aluminum alloy plate, the second side of the welding rod adopts a rectangular structure with a thickness of 3 mm. The friction stir welding process of this embodiment adopts a T-shaped welding rod, which effectively improves the flow of the metal in the welding joint, thereby making the weld on the thin plate water-cooled heat sink device have no obvious defects.

[0029] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A thin plate water-cooled heat sink device, characterized in that: The device comprises, A heat sink body; a plurality of water nozzles located on the side of the heat sink body; a main heat dissipation flow channel area; a first transition flow channel area connecting the first water nozzle and the main heat dissipation flow channel area; a second transition flow channel area connecting the second water nozzle and the main heat dissipation flow channel area; fins located in the main heat dissipation flow channel area, wherein the heat dissipation fluid enters through the first water nozzle, passes through the first transition flow channel area, the main heat dissipation flow channel area, and the second transition flow channel area in sequence, and is retained by the second water nozzle to realize the circulation of the heat dissipation fluid in the heat sink device.

2. The device according to claim 1, characterized in that The heat load surface of the heat sink body is welded to the friction welding surface on the heat sink body by a friction stir welding process.

3. The device according to claim 1, characterized in that The first transition flow channel area and the second transition flow channel area also include one or more of a circular hole flow channel, a wedge-shaped flow channel, and a fan-shaped flow channel.

4. The device according to claim 3, characterized in that The diameter of the circular hole flow channel is not less than the diameter of the fluid in any of the multiple water nozzles.

5. The device according to claim 3, characterized in that The first transition flow channel area and the second transition flow channel area are designed as a circular hole flow channel, a wedge-shaped flow channel, and a fan-shaped flow channel in sequence to achieve a smooth transition from a circular flow channel to a planar flow channel.

6. The device according to claim 1, characterized in that The cross-sectional areas of the first transition flow channel area and the second transition flow channel area at any position along the fluid direction are not less than the fluid cross-sectional area of ​​any of the water nozzles to avoid excessive fluid resistance.

7. The device according to claim 1, characterized in that The main heat dissipation channel area is provided with fins, the fins are located on one side of the heat load surface, and the fins are an array combination of one or more of thin sheets, columns, and diamonds.

8. The device according to claim 1, characterized in that The material of the device is a metal material that can be processed by a stir friction welding process, and the metal material is one or more of aluminum alloy, stainless steel, and copper.

9. The method for preparing the device according to any one of claims 1 to 8, characterized in that: After the main heat dissipation channel area, the wedge-shaped channel and the fan-shaped channel are manufactured on the friction welding surface of the heat sink body by means of mechanical processing, a thin plate covering the channel is welded on the friction welding surface by using a stir friction welding process.

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