Heat dissipation control method and device of GOB LED display screen

Abstract

The invention provides a heat dissipation control method and device of a GOB LED display screen, a computer readable medium and electronic equipment. Obtaining a display parameter of the GOB LED display screen, and determining a heat parameter corresponding to the display screen at present according to the display parameter; determining at least one heat dissipation device corresponding to the heat parameter according to the corresponding relationship between the heat dissipation device and the heat parameter; performing heat dissipation fitting on the display screen according to a heat dissipation device, and determining a heat dissipation mode corresponding to the heat dissipation device; and controlling the heat dissipation device to dissipate heat of the display screen according to the heat dissipation mode. And the current heat parameter is accurately calculated, so that the selection of the heat dissipation device is matched with the actual heat load of the display screen. The proper heat dissipation device and the working mode thereof are determined according to the heat parameters, the heat dissipation efficiency can be optimized, overheating of equipment is avoided, the service life is prolonged, and the stability and reliability of the display effect are ensured. Intelligentization and automation of heat dissipation management are achieved, and the overall performance and safety of the system are improved.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a heat dissipation control method, device, computer-readable medium and electronic device for a GOB LED display screen. Background Art

[0002] Glue On Board (GOB) is a special LED display packaging method. After fixing the LED lamp beads on the PCB (printed circuit board), a special optical thermal conductive nano-scale glue potting material is used to fill the gaps between the lamp beads to form a tightly connected and highly protected whole. This packaging method not only enhances the connection strength between the lamp beads and the PCB board, but also improves the protection performance and heat dissipation capacity of the LED display. Although the GOB packaging technology uses a special optical thermal conductive nano-scale glue potting material, the heat dissipation performance of this material still needs to be continuously optimized. It is necessary to find new materials with better heat dissipation performance and lower cost to improve the heat dissipation efficiency of GOB LED display screens. However, existing GOB LED display screens often face the problems of low heat dissipation efficiency, high cost and energy consumption. Summary of the invention

[0003] The embodiments of the present application provide a heat dissipation control method, device, computer-readable medium and electronic device for a GOB LED display screen, thereby at least to a certain extent solving the problems of low heat dissipation efficiency and high cost and energy consumption.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0005] According to one aspect of the present application, a heat dissipation control method for a GOB LED display screen is provided, comprising: obtaining display parameters of the GOB LED display screen, the display parameters including screen size, pixel density, operating voltage, brightness information, and display duration; determining, based on the display parameters, thermal parameters for characterizing a current thermal state of the display screen; determining, based on a correspondence between a heat dissipation device and the thermal parameters, at least one heat dissipation device corresponding to the thermal parameters; performing heat dissipation fitting on the display screen based on the heat dissipation device, and determining a heat dissipation mode corresponding to the heat dissipation device; and controlling the heat dissipation device to dissipate heat from the display screen based on the heat dissipation mode.

[0006] In the present application, based on the aforementioned scheme, the method of determining the thermal parameters used to characterize the current thermal state of the display screen according to the display parameters includes: determining the voltage parameters of the display screen according to the operating voltage and the rated voltage in the display parameters; determining the brightness parameters used to characterize the brightness state of the display screen according to the brightness information in the display parameters; and determining the thermal parameters used to characterize the current thermal state of the display screen according to the voltage parameters and the brightness parameters.

[0007] In the present application, based on the aforementioned scheme, determining at least one heat dissipation device corresponding to the thermal parameter according to the correspondence between the heat dissipation device and the thermal parameter includes: obtaining the correspondence between the preset heat dissipation device and the thermal parameter; determining at least one heat dissipation device corresponding to the thermal parameter according to the thermal parameter and the correspondence.

[0008] In the present application, based on the aforementioned scheme, the heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device, including: obtaining the heat dissipation power corresponding to the heat dissipation device; fitting the thermal parameters and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.

[0009] In the present application, based on the aforementioned scheme, controlling the heat dissipation device to dissipate heat for the display screen according to the heat dissipation method includes: obtaining the working time and working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat for the display screen according to the working time and working mode.

[0010] In the present application, based on the above-mentioned solution, it also includes: acquiring temperature data output by the temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.

[0011] In the present application, based on the above-mentioned solution, it also includes: real-time monitoring of the operating status of the heat dissipation device, and automatic alarm if an abnormality is found.

[0012] According to one aspect of the present application, a heat dissipation control device for a GOB LED display screen is provided, comprising:

[0013] An acquisition unit, used to acquire display parameters of the GOB LED display screen, wherein the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration;

[0014] A parameter unit, used to determine a thermal parameter for characterizing a current thermal state of the display screen according to the display parameter;

[0015] A device unit, configured to determine at least one heat dissipation device corresponding to the heat parameter according to a correspondence between the heat dissipation device and the heat parameter;

[0016] A fitting unit, used to perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine a heat dissipation mode corresponding to the heat dissipation device;

[0017] The heat dissipation unit is used to control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.

[0018] In the present application, based on the aforementioned scheme, the method of determining the thermal parameters used to characterize the current thermal state of the display screen according to the display parameters includes: determining the voltage parameters of the display screen according to the operating voltage and the rated voltage in the display parameters; determining the brightness parameters used to characterize the brightness state of the display screen according to the brightness information in the display parameters; and determining the thermal parameters used to characterize the current thermal state of the display screen according to the voltage parameters and the brightness parameters.

[0019] In the present application, based on the aforementioned scheme, determining at least one heat dissipation device corresponding to the thermal parameter according to the correspondence between the heat dissipation device and the thermal parameter includes: obtaining the correspondence between the preset heat dissipation device and the thermal parameter; determining at least one heat dissipation device corresponding to the thermal parameter according to the thermal parameter and the correspondence.

[0020] In the present application, based on the aforementioned scheme, the heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device, including: obtaining the heat dissipation power corresponding to the heat dissipation device; fitting the thermal parameters and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.

[0021] In the present application, based on the aforementioned scheme, controlling the heat dissipation device to dissipate heat for the display screen according to the heat dissipation method includes: obtaining the working time and working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat for the display screen according to the working time and working mode.

[0022] In the present application, based on the above-mentioned solution, it also includes: acquiring temperature data output by the temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.

[0023] In the present application, based on the above-mentioned solution, it also includes: real-time monitoring of the operating status of the heat dissipation device, and automatic alarm if an abnormality is found.

[0024] According to one aspect of the present application, a computer-readable medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the heat dissipation control method of the GOB LED display screen described in the above embodiment is implemented.

[0025] According to one aspect of the present application, an electronic device is provided, comprising: one or more processors; a storage device for storing one or more programs, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation control method of the GOB LED display as described in the above embodiments.

[0026] According to one aspect of the present application, a computer program product or a computer program is provided, the computer program product or the computer program includes computer instructions, and the computer instructions are stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the heat dissipation control method of the GOB LED display provided in the above-mentioned various optional implementations.

[0027] In the technical solution of the present application, the display parameters of the GOB LED display are obtained, and the thermal parameters corresponding to the display are currently determined according to the display parameters; at least one heat sink corresponding to the thermal parameters is determined according to the corresponding relationship between the heat sink and the thermal parameters; the display is heat-fitted according to the heat sink to determine the heat dissipation method corresponding to the heat sink; according to the heat dissipation method, the heat sink is controlled to dissipate heat from the display. By accurately calculating the current thermal parameters, it is ensured that the selection of the heat sink matches the actual heat load of the display. By determining the appropriate heat sink and its working mode according to the thermal parameters, the heat dissipation efficiency can be optimized to avoid overheating of the equipment, extend the service life, achieve more efficient energy utilization, reduce energy consumption, and at the same time improve the user experience and ensure the stability and reliability of the display effect. The intelligent and automated heat dissipation management is realized, and the overall performance and safety of the system are improved.

[0028] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A flow chart of a method for controlling heat dissipation of a GOB LED display screen in an embodiment of the present application is schematically shown.

[0031] Figure 2A flowchart for determining thermal parameters in one embodiment of the present application is schematically shown.

[0032] Figure 3 A schematic diagram of a heat dissipation control device for a GOB LED display screen in an embodiment of the present application is schematically shown.

[0033] Figure 4 A schematic diagram of the structure of a computer system suitable for implementing an electronic device of an embodiment of the present application is shown. DETAILED DESCRIPTION

[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0035] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0036] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0037] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0038] The implementation details of the technical solution of this application are described in detail below:

[0039] Figure 1 The flowchart of the heat dissipation control method of the GOB LED display screen according to one embodiment of the present application is shown. Figure 1 As shown, the heat dissipation control method of the GOB LED display screen includes at least steps S110 to S150, which are described in detail as follows:

[0040] In step S110, the display parameters of the GOB LED display screen are obtained, and the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration.

[0041] In one embodiment of the present application, display parameters of the GOB LED display screen are obtained, specifically including screen size, pixel density, operating voltage, brightness information, and display duration.

[0042] In one embodiment of the present application, the screen size includes the diagonal size of the display screen, usually in inches. For example, the display screen size is 55 inches. Obtain the operating voltage of the display screen, which is usually provided by the manufacturer, and common values ​​are 5V, 12V or higher. The brightness information is the brightness of the display screen (in nit). It can be obtained through test equipment or from the product manual. Record the working time of the display screen, usually in hours, which can be obtained through system logs or monitoring software. After collecting all the above parameters, it can provide a basis for subsequent thermal parameter calculations and the selection of heat dissipation devices.

[0043] In step S120, a thermal parameter for characterizing a current thermal state of the display screen is determined according to the display parameter.

[0044] like Figure 2 As shown, in one embodiment of the present application, determining a thermal parameter for characterizing a current thermal state of the display screen according to the display parameter includes:

[0045] S210, determining a voltage parameter of the display screen according to the operating voltage and the rated voltage in the display parameters;

[0046] S220, determining a brightness parameter for characterizing a brightness state of the display screen according to the brightness information in the display parameter;

[0047] S230: Determine a thermal parameter for characterizing a current thermal state of the display screen according to the voltage parameter and the brightness parameter.

[0048] In an embodiment of the present application, according to the operating voltage Vol_tim and the rated voltage Vol_rea in the display parameters, the voltage parameter Par_vol of the display screen is determined as:

[0049]

[0050] Here, α represents the mode coefficient, which is adjusted according to the usage of the screen. For example, different values ​​are set when the screen displays content dynamically or statically. Indicates the power factor, taking into account the phase difference between current and voltage, which is used to affect the actual power calculation. In this embodiment, the voltage parameter is used to indicate the difference between the current working voltage of the display screen and the rated voltage, so as to measure the energy consumption of the display screen through the voltage parameter, and then measure the working status of the display screen.

[0051] In an embodiment of the present application, according to the brightness information Bri_tmi, the rated brightness Bri_rae of the display screen and the ambient light parameter Par_env, the brightness parameter Par_rig is determined as:

[0052]

[0053] Among them, the brightness information indicates the actual brightness of the display, expressed in candelas per square meter (cd / m2). The rated brightness is used as a benchmark brightness value, which is usually the recommended brightness of the display under specific conditions. The ambient light parameter indicates the light intensity of the surrounding environment, which affects the readability and brightness setting of the screen. By calculating the brightness parameter, the relationship between the actual brightness and the standard brightness is adjusted, combined with the brightness impact under actual usage conditions, which helps to evaluate the power consumption and heat generation of the display.

[0054] In one embodiment of the present application, according to the screen size A, pixel density ρ, voltage parameter Par_vol, brightness parameter Par_rig and display duration T in the display parameters, the thermal parameter currently corresponding to the display screen is determined as:

[0055] Par_hra=ρ·A·Par_vol·Par_rig·log2T

[0056] The above process can effectively improve the performance and energy efficiency of the display while improving the user experience through parameters such as screen area, power density, pixel density, ambient temperature, brightness and operating voltage. Dynamically adjusting brightness to adapt to ambient light, optimizing power consumption based on usage patterns, and effectively managing heat from long-term display can extend the life of the device and prevent overheating. Taking these factors into consideration, thermal parameters provide real-time feedback on the operating status of the device, promoting the development of thermal management systems and fault warnings.

[0057] In step S130, at least one heat dissipation device corresponding to the thermal parameter is determined according to the correspondence between the heat dissipation device and the thermal parameter.

[0058] In one embodiment of the present application, determining at least one heat dissipation device corresponding to the thermal parameter according to the correspondence between the heat dissipation device and the thermal parameter includes:

[0059] Obtaining a correspondence between a preset heat dissipation device and a thermal parameter;

[0060] At least one heat dissipation device corresponding to the thermal parameter is determined according to the thermal parameter and the corresponding relationship.

[0061] In one embodiment of the present application, the characteristics of different heat dissipation devices are collected and recorded in advance, including heat dissipation capacity (such as thermal conductivity, heat dissipation area), applicable power range, working environment conditions, etc. According to the calculated heat parameters, the range of heat parameters is divided (such as low, medium, and high heat), and a threshold is set for each range. According to the range of heat parameters, a suitable heat dissipation device is mapped. For example: low heat parameters correspond to small fans and heat conducting plates; medium heat parameters correspond to aluminum radiators and liquid cooling systems; high heat parameters correspond to high-efficiency heat dissipation fans and liquid cooling devices.

[0062] After the thermal parameters are calculated, at least one heat sink corresponding to the thermal parameters is determined based on the thermal parameters and the corresponding relationship for subsequent heat dissipation control. Through the above steps, a reasonable corresponding relationship between the thermal parameters and the heat sink can be effectively established, thereby providing support for the thermal management of the device.

[0063] In step S140, heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine a heat dissipation method corresponding to the heat dissipation device.

[0064] In one embodiment of the present application, heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine the heat dissipation mode corresponding to the heat dissipation device, including:

[0065] Obtaining the heat dissipation power corresponding to the heat dissipation device;

[0066] The thermal parameters and the heat dissipation power are fitted to determine the heat dissipation mode corresponding to the heat dissipation device.

[0067] In one embodiment of the present application, for each heat dissipation device, its maximum heat dissipation power is collected, that is, the heat that can be effectively dissipated under specific conditions. Linear regression is used to describe the relationship between heat dissipation power, thermal parameters, and heat dissipation time. Environmental factors, heat dissipation device characteristics, and working conditions are considered during fitting. According to the fitting results, combined with the matching of heat dissipation power and required heat dissipation capacity, the duration corresponding to each heat dissipation device in the heat dissipation method is determined.

[0068] In actual use, the effectiveness of the selected heat dissipation method is verified by monitoring the heat dissipation effect (such as temperature change). The heat dissipation method or heat dissipation device is adjusted according to the actual situation to optimize the heat dissipation performance. Finally, the heat dissipation power and heat dissipation method corresponding to the heat dissipation device are output, where the heat dissipation method includes the working mode and working time.

[0069] By accurately matching the heat dissipation power and thermal parameters, more efficient heat dissipation can be achieved, which can prevent equipment from overheating and extend its service life. Optimizing the heat dissipation solution can effectively reduce energy consumption, especially when dynamically adjusting the heat dissipation method, which helps save electricity. The ability to flexibly select and adjust the heat dissipation method according to specific needs enhances the adaptability of the system and meets a variety of application scenarios. In summary, this process ensures the effectiveness of heat dissipation management through a systematic approach, which has a significant positive impact on improving equipment performance and user satisfaction.

[0070] In step S150, the heat dissipation device is controlled to dissipate heat from the display screen according to the heat dissipation method.

[0071] In one embodiment of the present application, according to the heat dissipation mode, controlling the heat dissipation device to dissipate heat from the display screen includes:

[0072] Obtaining the working time and working mode corresponding to each heat dissipation device in the heat dissipation method;

[0073] According to the working time and working mode, the heat dissipation device is controlled to dissipate heat from the display screen.

[0074] In one embodiment of the present application, the working time and working mode of each heat dissipation device are obtained. The working time includes the continuous working time after startup, and the working mode may be a constant mode, a variable speed mode, or an intermittent mode. For example, the working time: such as automatically shutting down the fan after 10 minutes of startup; the working mode: such as selecting the low speed mode of the fan or the constant flow of the liquid cooling system. According to the working time and working mode, the heat dissipation device is controlled to dissipate heat from the display screen.

[0075] Optionally, the actual working status of the heat dissipation device is monitored and compared with the preset working hours and modes to ensure that the system operates as expected.

[0076] Optionally, the working time and working mode are dynamically adjusted according to the real-time temperature and thermal effect. For example, after the temperature drops, the fan is switched to a low speed mode or the liquid cooling system works intermittently.

[0077] Optionally, the working time and mode of each heat dissipation device are recorded, the impact on the heat dissipation effect is analyzed, and the control instructions and strategies are optimized based on the data.

[0078] Through the above steps, the working time and mode of the heat dissipation device can be effectively controlled to ensure that the display screen remains within a safe temperature range and improve the overall heat dissipation efficiency.

[0079] In one embodiment of the present application, the method further includes: acquiring temperature data output by a temperature sensor; and dynamically adjusting a working state of the heat dissipation device according to the temperature data.

[0080] In one embodiment of the present application, a temperature sensor is installed to monitor the temperature of the display screen and the surrounding environment in real time to ensure accurate temperature data. According to the real-time temperature feedback, the working state of the heat dissipation device is dynamically adjusted to ensure the maximum heat dissipation effect. For example, when the temperature drops, the fan speed is reduced to save energy and extend the life of the equipment.

[0081] Optionally, a fault monitoring mechanism is provided to timely detect the working status of the heat dissipation device and to issue an alarm when a fault occurs, so as to ensure the safety of the system.

[0082] Optionally, visual feedback of real-time temperature and heat dissipation status is provided through the user interface to enhance the user experience and control over the device status.

[0083] Through the above steps, the heat dissipation device can be effectively controlled to ensure that the display screen maintains a suitable temperature under different working environments, thereby improving the performance and stability of the system.

[0084] In one embodiment of the present application, it also includes: real-time monitoring of the operating status of the heat dissipation device, and automatic alarm if an abnormality is found.

[0085] In one embodiment of the present application, a temperature sensor, a flow sensor, a current sensor, a wind speed sensor, etc. are integrated in the heat dissipation device to monitor key parameters in real time. A data acquisition system is set up to regularly read sensor data and upload it to a central control unit for processing. The threshold and range of normal operation are set. If the sensor data exceeds the set threshold, an alarm mechanism is triggered.

[0086] Set up the alarm mechanism and support multiple alarm modes, including but not limited to: visual alarm: display warning information on the control interface; sound alarm: sound an alarm through a buzzer; remote notification: send alarm information to relevant personnel via SMS or email.

[0087] When an abnormality occurs, the fault information and related data are recorded to facilitate subsequent analysis and troubleshooting of the fault cause. According to the set automatic response strategy, the system can automatically adjust the working mode of the cooling device, such as increasing the fan speed or starting the backup cooling device, to deal with the abnormal situation. The operating status of the cooling device is updated in real time on the user interface, including the current temperature, working mode and alarm status, for user monitoring.

[0088] Through the above steps, the system can regularly remind users to perform equipment maintenance according to the operating time and status, reducing the possibility of failure. It can realize real-time monitoring and abnormal alarm of the heat dissipation device, improve the reliability of the system, and ensure that the equipment operates within a safe range.

[0089] In the technical solution of the present application, the display parameters of the GOB LED display are obtained, and the thermal parameters corresponding to the display are currently determined according to the display parameters; at least one heat sink corresponding to the thermal parameters is determined according to the corresponding relationship between the heat sink and the thermal parameters; the display is heat-fitted according to the heat sink to determine the heat dissipation method corresponding to the heat sink; according to the heat dissipation method, the heat sink is controlled to dissipate heat from the display. By accurately calculating the current thermal parameters, it is ensured that the selection of the heat sink matches the actual heat load of the display. By determining the appropriate heat sink and its working mode according to the thermal parameters, the heat dissipation efficiency can be optimized to avoid overheating of the equipment, extend the service life, achieve more efficient energy utilization, reduce energy consumption, and at the same time improve the user experience and ensure the stability and reliability of the display effect. The intelligent and automated heat dissipation management is realized, and the overall performance and safety of the system are improved.

[0090] The following describes an embodiment of the device of the present application, which can be used to execute the heat dissipation control method of the GOB LED display screen in the above embodiment of the present application. It can be understood that the device can be a computer program (including program code) running in a computer device, for example, the device is an application software; the device can be used to execute the corresponding steps in the method provided in the embodiment of the present application. For details not disclosed in the embodiment of the device of the present application, please refer to the embodiment of the heat dissipation control method of the GOB LED display screen in the above embodiment of the present application.

[0091] Figure 3 A block diagram of a heat dissipation control device for a GOB LED display screen according to an embodiment of the present application is shown.

[0092] Reference Figure 3 As shown, a heat dissipation control device for a GOB LED display screen according to an embodiment of the present application includes:

[0093] An acquisition unit 310 is used to acquire display parameters of the GOB LED display screen, wherein the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration;

[0094] A parameter unit 320, configured to determine a thermal parameter for characterizing a current thermal state of the display screen according to the display parameter;

[0095] A device unit 330, configured to determine at least one heat dissipation device corresponding to the heat parameter according to a correspondence between the heat dissipation device and the heat parameter;

[0096] A fitting unit 340, configured to perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine a heat dissipation mode corresponding to the heat dissipation device;

[0097] The heat dissipation unit 350 is used to control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.

[0098] In the present application, based on the aforementioned scheme, the method of determining the thermal parameters used to characterize the current thermal state of the display screen according to the display parameters includes: determining the voltage parameters of the display screen according to the operating voltage and the rated voltage in the display parameters; determining the brightness parameters used to characterize the brightness state of the display screen according to the brightness information in the display parameters; and determining the thermal parameters used to characterize the current thermal state of the display screen according to the voltage parameters and the brightness parameters.

[0099] In the present application, based on the aforementioned scheme, determining at least one heat dissipation device corresponding to the thermal parameter according to the correspondence between the heat dissipation device and the thermal parameter includes: obtaining the correspondence between the preset heat dissipation device and the thermal parameter; determining at least one heat dissipation device corresponding to the thermal parameter according to the thermal parameter and the correspondence.

[0100] In the present application, based on the aforementioned scheme, the heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device, including: obtaining the heat dissipation power corresponding to the heat dissipation device; fitting the thermal parameters and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.

[0101] In the present application, based on the aforementioned scheme, controlling the heat dissipation device to dissipate heat for the display screen according to the heat dissipation method includes: obtaining the working time and working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat for the display screen according to the working time and working mode.

[0102] In the present application, based on the above-mentioned solution, it also includes: acquiring temperature data output by the temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.

[0103] In the present application, based on the above-mentioned solution, it also includes: real-time monitoring of the operating status of the heat dissipation device, and automatic alarm if an abnormality is found.

[0104] In the technical solution of the present application, the display parameters of the GOB LED display are obtained, and the thermal parameters corresponding to the display are currently determined according to the display parameters; at least one heat sink corresponding to the thermal parameters is determined according to the corresponding relationship between the heat sink and the thermal parameters; the display is heat-fitted according to the heat sink to determine the heat dissipation method corresponding to the heat sink; according to the heat dissipation method, the heat sink is controlled to dissipate heat from the display. By accurately calculating the current thermal parameters, it is ensured that the selection of the heat sink matches the actual heat load of the display. By determining the appropriate heat sink and its working mode according to the thermal parameters, the heat dissipation efficiency can be optimized to avoid overheating of the equipment, extend the service life, achieve more efficient energy utilization, reduce energy consumption, and at the same time improve the user experience and ensure the stability and reliability of the display effect. The intelligent and automated heat dissipation management is realized, and the overall performance and safety of the system are improved.

[0105] Figure 4 A schematic diagram of the structure of a computer system suitable for implementing an electronic device of an embodiment of the present application is shown.

[0106] It should be noted that the computer system 400 of the electronic device shown in the figure is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0107] The computer system 400 includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 402 or the program loaded from the storage part 408 to the random access memory (RAM) 403, such as executing the method described in the above embodiment. In the RAM 403, various programs and data required for system operation are also stored. The CPU 401, the ROM 402 and the RAM 403 are connected to each other through the bus 404. The input / output (I / O) interface 405 is also connected to the bus 404.

[0108] The following components are connected to the I / O interface 405: an input section 406 including a keyboard, a mouse, etc.; an output section 407 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 408 including a hard disk, etc.; and a communication section 409 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 409 performs communication processing via a network such as the Internet. A drive 410 is also connected to the I / O interface 405 as needed. A removable medium 411, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 410 as needed so that a computer program read therefrom is installed into the storage section 408 as needed.

[0109] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication section 409, and / or installed from a removable medium 411. When the computer program is executed by a central processing unit (CPU) 401, various functions defined in the system of the present application are executed.

[0110] It should be noted that the computer-readable medium shown in the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by an instruction execution system, device or device or used in combination with it. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, wherein a computer-readable computer program is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0111] The flowchart and block diagram in the accompanying drawings illustrate the possible architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. Wherein, each box in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and the above-mentioned module, program segment, or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0112] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. The names of these units do not, in some cases, constitute limitations on the units themselves.

[0113] According to one aspect of the present application, a computer program product or a computer program is provided, the computer program product or the computer program comprising computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the methods provided in the above-mentioned various optional implementations.

[0114] As another aspect, the present application also provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or may exist independently without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the method described in the above embodiment.

[0115] It should be noted that, although several modules or units of the equipment for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into being embodied by multiple modules or units.

[0116] Through the description of the above implementation methods, it is easy for those skilled in the art to understand that the example implementation methods described here can be implemented by software or by combining software with necessary hardware. Therefore, the technical solution according to the implementation methods of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the implementation methods of the present application.

[0117] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0118] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A heat dissipation control method for a GOB LED display, characterized in that: include: Obtain display parameters of the GOB LED display screen, including screen size, pixel density, operating voltage, brightness information, and display duration; Determining, according to the display parameter, a thermal parameter for characterizing a current thermal state of the display screen; Determining at least one heat dissipation device corresponding to the thermal parameter according to a correspondence between the heat dissipation device and the thermal parameter; According to the heat dissipation device, heat dissipation fitting is performed on the display screen to determine a heat dissipation mode corresponding to the heat dissipation device; According to the heat dissipation method, the heat dissipation device is controlled to dissipate heat from the display screen.

2. The method according to claim 1, characterized in that Determining, according to the display parameter, a thermal parameter for characterizing a current thermal state of the display screen, including: Determining the voltage parameters of the display screen according to the operating voltage and the rated voltage in the display parameters; Determining a brightness parameter for characterizing a brightness state of the display screen according to the brightness information in the display parameter; A thermal parameter for characterizing a current thermal state of the display screen is determined according to the voltage parameter and the brightness parameter.

3. The method according to claim 1, characterized in that Determining at least one heat dissipation device corresponding to the heat parameter according to a correspondence between the heat dissipation device and the heat parameter includes: Obtaining a correspondence between a preset heat dissipation device and a thermal parameter; At least one heat dissipation device corresponding to the thermal parameter is determined according to the thermal parameter and the corresponding relationship.

4. The method according to claim 1, characterized in that: According to the heat dissipation device, heat dissipation fitting is performed on the display screen to determine the heat dissipation mode corresponding to the heat dissipation device, including: Obtaining the heat dissipation power corresponding to the heat dissipation device; The thermal parameters and the heat dissipation power are fitted to determine the heat dissipation mode corresponding to the heat dissipation device.

5. The method according to claim 1, characterized in that According to the heat dissipation mode, controlling the heat dissipation device to dissipate heat from the display screen includes: Obtaining the working time and working mode corresponding to each heat dissipation device in the heat dissipation method; According to the working time and working mode, the heat dissipation device is controlled to dissipate heat from the display screen.

6. The method according to claim 1, characterized in that Also includes: Get the temperature data output by the temperature sensor; The working state of the heat dissipation device is dynamically adjusted according to the temperature data.

7. The method according to claim 1, characterized in that Also includes: Monitor the operating status of the cooling device in real time and automatically alarm if any abnormality is found.

8. A heat dissipation control device for a GOB LED display screen, characterized in that: include: An acquisition unit, used to acquire display parameters of the GOB LED display screen, wherein the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration; A parameter unit, used to determine a thermal parameter for characterizing a current thermal state of the display screen according to the display parameter; A device unit, configured to determine at least one heat dissipation device corresponding to the heat parameter according to a correspondence between the heat dissipation device and the heat parameter; A fitting unit, used to perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine a heat dissipation mode corresponding to the heat dissipation device; The heat dissipation unit is used to control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.

9. A computer readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the heat dissipation control method of the GOB LED display screen according to any one of claims 1 to 7 is implemented.

10. An electronic device, characterized in that: include: one or more processors; A storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation control method of the GOB LED display screen as described in any one of claims 1 to 7.

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