Energy storage power supply
By setting up the heat dissipation structure of the shell of the portable energy storage power supply and combining the use of the fan, the problem of poor energy storage power supply in the existing technology has been solved, and the more efficient heat dissipation effect and lighter weight are achieved.
Patent Information
- Application Number
- CN202411633032.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-05
- Filing Date
- 2024-11-14
- Publication Date
- 2025-01-28
Smart Images

Figure CN119383923A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of energy storage technology, and in particular to an energy storage power supply. Background Art
[0002] With the improvement of living standards, users have higher and higher requirements on the protection level and high power of portable power supplies.
[0003] As the protection level of current portable energy storage is improved, the corresponding result is that the heat dissipation volume of the energy storage power supply is large, which cannot effectively cool down, resulting in poor heat dissipation capacity. Summary of the invention
[0004] In view of this, the present application aims to solve one of the problems in the related art at least to a certain extent. To this end, the purpose of the present application is to provide an energy storage power supply.
[0005] The present application provides an energy storage power supply. The energy storage power supply includes: a housing, a battery module, an inverter, and a fan. The housing has an installation cavity, and the housing is formed with a heat dissipation structure; the battery module is installed in the installation cavity; the inverter is installed in the installation cavity, thermally coupled with the heat dissipation structure, and electrically connected to the battery module; the fan is installed on the outside of the housing, and the fan forms a flow of air through the heat dissipation structure.
[0006] In some embodiments, the heat dissipation structure includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are disposed on the bottom, side and / or top of the housing.
[0007] In some embodiments, the plurality of heat dissipation fins are radially arranged and form an installation space in the middle, and the fan is installed in the installation space.
[0008] In some embodiments, the arrangement density of the heat sink fins changes gradually from dense to sparse from the center to the periphery, and the arrangement height of the heat sink fins changes gradually from low to high from the center to the periphery.
[0009] In some embodiments, the fan is a centrifugal fan or an axial flow fan.
[0010] In some embodiments, the heat dissipation structure further includes a protrusion, which is located in the installation cavity and fixedly disposed on the housing, and the protrusion is thermally coupled to a power element of the inverter.
[0011] In some embodiments, a heat-conducting layer is provided between the protrusion and the power element, and the protrusion is thermally coupled to the power element of the inverter through the heat-conducting layer.
[0012] In certain embodiments, the thickness of the heat-conducting layer is less than 1 mm, and the thermal conductivity of the heat-conducting layer is greater than 3 W / M / K.
[0013] In some embodiments, the energy storage power supply further includes a foot pad, the bottom of the shell has a foot pad, and the foot pad is used to contact an external support surface so that the bottom of the shell is spaced apart from the external support surface.
[0014] In some embodiments, the energy storage power supply further includes a first cover plate, which is fixedly mounted on the outer side of the housing and covers the fan arrangement, and the first cover plate is provided with ventilation holes.
[0015] In some embodiments, the first cover plate covers the heat dissipation structure, the first cover plate includes a first base plate and a first side plate surrounding the first base plate, an air duct is formed between the heat dissipation structure and the first cover plate, the ventilation holes include first ventilation holes and second ventilation holes, the air duct is arranged between the first ventilation holes and the second ventilation holes, the first base plate is provided with the first ventilation holes, and the first side plate is provided with the second ventilation holes.
[0016] In some embodiments, the energy storage power supply further includes a foot pad, which is disposed on a side of the first cover plate opposite to the fan, and the foot pad is used to contact an external support surface so that the bottom of the first cover plate is spaced apart from the external support surface.
[0017] In some embodiments, the energy storage power supply also includes a foot pad, and the bottom plate of the cover plate is provided with a perforation corresponding to the foot pad. The foot pad is fixed to the bottom of the cover plate and the shell through the perforation, and the foot pad is used to contact the external support surface so that the bottom of the cover plate is spaced apart from the external support surface.
[0018] In some embodiments, the shell includes a first shell and a second shell, the first shell and the second shell are interlocked to form the installation cavity; the inverter is fixed on the first shell, a heat dissipation structure is provided on the first shell, and the battery module is fixed on the second shell.
[0019] In some embodiments, the first shell is an aluminum alloy shell, the inner side of the first shell is thermally coupled to the inverter, and the heat dissipation structure is formed on the outer side of the first shell.
[0020] In certain embodiments, the first shell is anodized.
[0021] In some embodiments, the first shell is provided with a receiving cavity, and the inverter is fixedly installed in the receiving cavity.
[0022] In some embodiments, a panel is disposed on the second shell, and a power output port is disposed on the panel.
[0023] In some embodiments, the first shell and the second shell are buckled together, and the first shell is arranged on the lower side of the second shell.
[0024] In some embodiments, a temperature sensor is installed on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start or stop or the speed of the fan based on the temperature of the heat dissipation structure.
[0025] In some embodiments, the energy storage power supply further includes a semiconductor refrigeration element, the semiconductor refrigeration element includes a hot end and a cold end, the cold end is thermally coupled to the inverter, and the hot end is thermally coupled to the heat dissipation structure.
[0026] In some embodiments, the heat dissipation structure has a mounting groove on a side facing the inverter, and the semiconductor cooling element is installed in the mounting groove.
[0027] In some embodiments, the outer wall of the installation cavity has a heat dissipation opening, and the heat dissipation structure is installed on the heat dissipation opening.
[0028] In some embodiments, the heat dissipation structure includes a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration component is installed on the mounting portion, and the fixed flange is fixed to the outer wall of the mounting cavity through a connecting member to close the heat dissipation port through the heat dissipation structure.
[0029] In some embodiments, the energy storage power supply further includes a heat dissipation bracket, the inverter includes a circuit board, and the power element is provided on the circuit board; the heat dissipation bracket is installed on the housing, the heat dissipation bracket fixes the circuit board and is thermally coupled with the power element, and the heat dissipation bracket is also thermally coupled with the heat dissipation structure.
[0030] In some embodiments, the heat dissipation bracket includes a base and a second cover plate. The base includes a second bottom plate and two second side plates, and the two second side plates are respectively connected to the two ends of the second bottom plate; a thermal pad is provided between the second bottom plate and the power element; the second cover plate is connected to the two second side plates, and a limiter for limiting the battery module is provided on the second cover plate.
[0031] In some embodiments, the energy storage power supply further includes a heat pipe, and the heat pipe is thermally coupled to the heat dissipation structure.
[0032] The energy storage power supply of the present application has a heat dissipation structure formed in the part of the housing located in the installation cavity, and the inverter is thermally coupled with the heat dissipation structure, and the fan is installed on the outside of the housing, and the fan forms a flow of air to flow through the heat dissipation structure. Compared with the natural heat dissipation method, the heat dissipation effect of the inverter of the present application is better, and the weight of the inverter is lighter. The introduction of the fan improves the heat dissipation efficiency, and the housing has a heat dissipation function and a supporting function, saving the internal space and production cost of the energy storage power supply.
[0033] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:
[0035] Figure 1 It is a schematic diagram of the structure of an energy storage power supply in some embodiments of the present application;
[0036] Figure 2 It is a schematic diagram of the disassembled structure of an energy storage power supply in certain embodiments of the present application;
[0037] Figure 3 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0038] Figure 4 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0039] Figure 5 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0040] Figure 6 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0041] Figure 7 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0042] Figure 8 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0043] Fig. 9 It is a partial structural schematic diagram of an energy storage power supply in some embodiments of the present application;
[0044] Fig.10 It is a partial structural schematic diagram of an energy storage power supply in certain embodiments of the present application.
[0045] Main markings in the attached drawings:
[0046] Energy storage power supply 100;
[0047] Shell 10, bottom 101, side 102, top 103, installation cavity 11, heat dissipation structure 12, heat dissipation fins 121, second clamping member 1211, first connecting column 1212, installation space 1201, protrusion 122, heat-conducting layer 123, semiconductor cooling member 124, heat-insulating member 125, installation groove 126, installation portion 127, fixed flange 128, sealing member 129, first shell 13, first clamping member 131, accommodating cavity 132, second shell 14, second clamping member 141; battery module 20, protection plate 21 ; Inverter 30, circuit board 31, power element 311, thermal pad 312, transformer 3111, inductor 3112, heat dissipation bracket 32, base 321, second bottom plate 3211, accommodating groove 32111, second side plate 3212, heat dissipation fins 32121, second cover plate 322, limiter 3221, insulating plate 33; fan 40, first clamping member 41; foot pad 50; first cover plate 60, ventilation hole 61, first ventilation hole 611, second ventilation hole 612, first bottom plate 62, first side plate 63, through hole 64. DETAILED DESCRIPTION
[0048] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0049] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0050] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, and may refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection, or mutual communication; direct connection, indirect connection through an intermediate medium, internal connection between two elements, or interaction between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0051] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0052] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0053] Please also read Figures 1 to 4 The present application discloses an energy storage power supply 100. The energy storage power supply 100 includes a housing 10, a battery module 20, an inverter 30 and a fan 40. The housing 10 has an installation cavity 11, and the housing 10 is formed with a heat dissipation structure 12. The battery module 20 is installed in the installation cavity 11. The inverter 30 is installed in the installation cavity 11, thermally coupled with the heat dissipation structure 12, and electrically connected to the battery module 20. The fan 40 is installed on the outside of the housing 10, and the fan 40 forms a flow of air to flow through the heat dissipation structure 12.
[0054] It is understandable that, since the battery module 20 has a large heat capacity and a relatively small heat generation, the battery module 20 can be cooled by natural heat dissipation, while the inverter 30 has a large heat generation, and the heat dissipation structure 12 formed on the housing 10 needs to cooperate with the fan 40 to cool it down. Since the heat generated during the operation of the inverter 30 will be transferred to the heat dissipation structure 12, the heat is transferred to the outside through the fan 40, which reduces the temperature of the inverter 30, thereby ensuring the cooling effect of the energy storage power supply.
[0055] That is, the energy storage power supply 100 of the present application can use the shell 10 as a support frame and a heat sink at the same time, without the need to set up an additional heat sink, thereby reducing the overall height and volume of the energy storage power supply 100 and achieving high protection for the inverter 30.
[0056] The housing 10 of the present application may be made of metal, so that the energy storage power supply 100 is more sturdy and durable.
[0057] The inverter 30 and the heat dissipation structure 12 may be thermally coupled in a manner that the inverter 30 is directly thermally connected to the heat dissipation structure 12 , or may be thermally connected indirectly via an intermediate connection component.
[0058] The inverter 30 and the battery module 20 may be electrically connected in a direct or indirect manner. For example, the battery module 20 may be electrically connected to the inverter 30 indirectly through a battery protection board. The battery protection board may provide protection against overvoltage, overtemperature, overcurrent, etc., and may open or close the electrical connection between the battery and the outside.
[0059] In this way, the housing 10 of the energy storage power supply 100 of the present application is formed with a heat dissipation structure 12, and the inverter 30 is thermally coupled with the heat dissipation structure 30, and the fan 40 is installed on the outside of the housing 10, and the fan 40 forms a flow of air to flow through the heat dissipation structure 12. Compared with the natural heat dissipation method, the heat dissipation effect of the inverter 30 of the present application is better, and the weight of the inverter 30 is lighter. The introduction of the fan 40 improves the heat dissipation efficiency, and the housing 10 has a heat dissipation function and a supporting function, saving the internal space and production cost of the energy storage power supply 100.
[0060] See also Figure 4 In some embodiments, the heat dissipation structure 12 includes a plurality of heat dissipation fins 121 . The plurality of heat dissipation fins 121 are disposed on the bottom 101 , the side 102 and / or the top 103 of the housing 10 .
[0061] Specifically, multiple heat dissipation fins 121 are arranged on the bottom 101, side 102 and / or top 103 of the shell 10, including the following situations: (1) multiple heat dissipation fins 121 are arranged at any one position of the bottom 101, side 102 or top 103 of the shell 10; (2) multiple heat dissipation fins 121 are arranged at any two positions of the bottom 101, side 102 or top 103 of the shell 10; (3) multiple heat dissipation fins 121 are all arranged on the bottom 101, side 102 and top 103 of the shell 10.
[0062] See also Figure 4 When a plurality of heat dissipation fins 121 are arranged at the bottom 101 of the housing 10 of the energy storage power supply 100, the overall appearance of the energy storage power supply 100 can be improved. In addition, since the heat dissipation fins 121 are arranged at the bottom 101 of the housing 10 of the energy storage power supply 100, it is not easy for the user to touch the heat dissipation fins 121 and get hot when picking up the energy storage power supply 100.
[0063] In addition, a plurality of heat dissipation fins 121 are arranged at the bottom 101 of the housing 10 of the energy storage power supply 100, which can also prevent rainwater from entering the installation cavity 11, and has a better waterproof effect. In this way, when the energy storage power supply 100 is used in an outdoor environment, moisture in the air can be prevented from entering the installation cavity 11 on rainy or humid days, causing the circuit board 31 in the inverter 30 to be short-circuited and damaged.
[0064] When a plurality of heat dissipation fins 121 are arranged on the side 102 or the top 103 , the electronic components inside the mounting cavity 11 can dissipate heat from the side 102 and the top 103 of the housing 10 , and the heat dissipation methods and heat dissipation channels are more diversified.
[0065] In some embodiments, the plurality of heat dissipation fins 121 are radially arranged and a mounting space 1201 is formed in the middle thereof, and the fan 40 is installed in the mounting space 1201 .
[0066] Specifically, Figure 4 As shown, the fan 40 may be provided with a first clamping member 41, and the heat sink 121 may be provided with a second clamping member 1211 that cooperates with the first clamping member 41, and the fan 40 is installed at the center of the heat sink 121 through the first clamping member 41 and the second clamping member 1211 being engaged and connected. The first clamping member 41 may be a clamping column, and the second clamping member 1211 may be a clamping hole, or the first clamping member 41 may be a clamping hole, and the second clamping member 1211 may be a clamping column, which is not limited here.
[0067] Since the fan 40 is installed on the outside of the housing 10, the fan 40 forms a flowing air to flow through the heat dissipation structure 12 to form a heat dissipation channel, thereby achieving a heat dissipation effect on the inverter 30 in the installation cavity 11. In other words, since one end of a plurality of heat dissipation fins 121 encloses the installation space 1201, the fan 40 is installed in the installation space 1201, and during the rotation of the fan 40, the heat dissipation airflow can contact the heat dissipation fins 121 from all directions, which is more conducive to improving the heat dissipation effect of the heat dissipation fins 121.
[0068] At this time, regardless of whether the heat dissipation fins 121 are arranged at the bottom 101, the side 102 or the top 103 of the shell 10, the fan 40 can be arranged at the outer center of the shell 10, and the heat dissipation fins 121 can be arranged at intervals around the fan 40, thereby forming a shorter and more direct heat dissipation channel, forming a larger heat dissipation area, and achieving a better heat dissipation effect.
[0069] See also Figure 5 In some embodiments, the arrangement density of the heat sink fins 121 changes gradually from dense to sparse from the center to the periphery, and the arrangement height of the heat sink fins 121 changes gradually from low to high from the center to the periphery.
[0070] Specifically, from the central inner area of the heat sink fins 121, since this part is close to the heat source and has a large heat generating power, the heat sink fins 121 are designed to be relatively dense. This dense layout of the heat sink fins 121 can increase the heat dissipation area within a limited space, thereby more efficiently absorbing and conducting heat. Although the heat sink fins 121 are relatively dense, the height of the heat sink fins 121 is relatively low. On the one hand, this can ensure a reasonable layout within the limited internal space, avoiding the heat sink fins 121 being too high and occupying too much space, affecting the installation and layout of other components. On the other hand, the lower height of the heat sink fins 121 also helps to transfer heat to the outside faster, avoiding heat accumulation in the central inner area of the heat sink fins 121, and facilitating the heat to diffuse to the surroundings of the outside of the housing 10, resulting in better heat dissipation.
[0071] In the outer area of the heat sink 121 relative to the central inner area, the height of the heat sink 121 is relatively high. This is because the outer space of the heat sink 121 is relatively spacious, and the higher heat sink 121 can better exchange heat with the surrounding air and improve the heat dissipation efficiency. At the same time, the outer heat sink 121 is relatively sparse, which can reduce the weight of the entire radiator while ensuring the heat dissipation effect. The sparse layout of the heat sink fins 121 can reduce the use of materials and reduce costs, and also make the radiator lighter and easier to install and carry.
[0072] The gradient angle of the inner heat dissipation fins 121 and the outer heat dissipation fins 121 from dense to sparse may range from (10° to 15°).
[0073] In this way, the energy storage power supply 100 of the present application can effectively achieve the effect of heat uniformity through the gradient design of the heat sink fins 121, which are dense and low in the interior and tall and sparse in the exterior. After the heat is generated from the heat source such as the inverter 30, it is first quickly absorbed and conducted by the dense heat sink fins 121 located in the central inner area of the housing 10, and then gradually diffuses to the outside. Since the heat sink fins 121 in the outer area are higher and sparse, they can better exchange heat with the air, so that the heat is evenly dissipated to the surrounding environment, avoiding local overheating.
[0074] At the same time, the gradient design of the heat dissipation fins 121, which are dense and low in the interior and high and sparse in the exterior, can also achieve the purpose of weight reduction while ensuring the heat dissipation performance, and is conducive to the overall lightweight design of the portable power high-protection inverter.
[0075] In certain embodiments, the fan 40 is a centrifugal fan or an axial flow fan.
[0076] Specifically, when the axial flow fan is working, the blades push the air to flow in the same direction as the axis, that is, the air inlet direction is parallel to the air outlet direction. Axial flow fans can usually provide a large air volume, which helps to quickly remove the heat inside the energy storage power supply and achieve effective heat dissipation. The structure of the axial flow fan is relatively simple and the manufacturing cost is low, so it has a high cost-effectiveness in use. Axial flow fans are suitable for the heat dissipation needs of most energy storage power supplies, especially in situations where a large air volume is required for rapid heat dissipation.
[0077] When the centrifugal fan is working, the blades push the air to flow in a direction perpendicular to the axis (i.e. radial direction), that is, the air inlet direction is perpendicular to the air outlet direction. Centrifugal fans can generate higher wind pressure, which helps to discharge heat from the inside of the energy storage power supply, especially suitable for occasions with long heat dissipation channels or large heat dissipation resistance. Centrifugal fans can change the flow direction of the airflow so that it is discharged perpendicular to the axis direction, which is very useful in certain specific heat dissipation designs. Under the same size and other comparable performance, the noise of centrifugal fans is usually lower than that of axial fans, which helps to improve the overall user experience of the energy storage power supply. Centrifugal fans are suitable for heat dissipation occasions where the airflow needs to be rotated 90 degrees for discharge or where a higher wind pressure is required.
[0078] When the fan 40 is a centrifugal fan, since the air inlet direction of the centrifugal fan is perpendicular to the air outlet direction, the centrifugal fan can achieve effective air flow in a smaller space. This means that in the design of the energy storage power supply 100, the position and direction of the centrifugal fan can be arranged more flexibly to adapt to the spatial layout inside the energy storage power supply 100. Therefore, by optimizing the layout and direction of the fan, the limited space inside the energy storage power supply can be more effectively utilized. For example, the centrifugal fan can be installed on the side or top of the power supply to avoid taking up too much space in front, behind or at the bottom of the energy storage power supply 100. This layout not only reduces the overall volume of the energy storage power supply 100, but also helps to reduce the height of the energy storage power supply 100, making the structure of the energy storage power supply 100 more compact and more portable.
[0079] That is, due to the characteristic that the air inlet direction of the centrifugal fan is perpendicular to the air outlet direction, the space can be used more flexibly in the design of the energy storage power supply 100, thereby effectively reducing the overall volume and height of the energy storage power supply 100. This design not only improves the compactness and portability of the energy storage power supply 100, but also helps to improve the heat dissipation efficiency of the energy storage power supply 100 and extend its service life.
[0080] In addition, the fan 40 can achieve an IP68 protection level through a glue filling process and vacuum coating of the printed circuit board assembly inside the fan 40, so that the fan 40 has extremely high dustproof and waterproof performance, can adapt to various harsh working environments, and ensure the normal heat dissipation and operation of the energy storage power supply 100.
[0081] See also Figure 5 In some embodiments, the heat dissipation structure 12 further includes a protrusion 122 . The protrusion 122 is located in the mounting cavity 11 and is fixedly disposed on the housing 10 . The protrusion 122 is thermally coupled to the power element of the inverter 30 .
[0082] It can be understood that when two solid surfaces are in contact, the heat transfer between the two solids will be hindered due to factors such as surface roughness and gaps. This obstacle is the contact thermal resistance.
[0083] Since the contact area between the protrusion 122 and the power element 311 of the inverter 30 is relatively large, and the design of the protrusion 122 may help reduce the presence of gaps and air, the contact thermal resistance between the inverter 30 and the housing 10 can be reduced. This means that the obstacles encountered during the transfer of heat between the inverter 30 and the housing 10 will be reduced, thereby improving the heat dissipation efficiency of the power element 311 of the inverter 30.
[0084] For details, please combine Figure 3 The power elements 311 of the inverter 30 include elements such as a transformer 3111 and an inductor 3112. The power elements 311 such as the transformer 3111 and the inductor 3112 can be installed as close to the protrusion 122 on the housing 10 as possible to fully utilize the protrusion 122 to reduce the contact thermal resistance between the inverter 30 and the housing 10.
[0085] Therefore, the protrusion 122 set at the bottom of the installation cavity 11 of the present application can be thermally coupled and contacted with the power element 311 of the inverter 30, thereby reducing the contact thermal resistance between the inverter 30 and the shell 10 and improving the heat dissipation efficiency of the power element 311 of the inverter 30.
[0086] See also Figure 6 In some embodiments, a heat conducting layer 123 is disposed between the protrusion 122 and the power element 311 . The protrusion 122 is thermally coupled to the power element 311 of the inverter 30 through the heat conducting layer 123 .
[0087] Specifically, the heat-conducting layer 123 may be a heat-conducting pad, a heat-conducting gel, or a heat-conducting structure formed by other high heat-conducting materials, which is not limited here.
[0088] In this way, the energy storage power supply 100 of the present application can be provided with a heat-conducting layer between the protrusion 122 on the inner side of the shell 10 and the power element 311. The heat-conducting layer is made of a flexible material, which can make the power element 311 of the inverter 30 fit more closely with the protrusion 122, thereby accelerating the heat conduction process between the inverter 30 and the protrusion 122, thereby accelerating the heat conduction of the inverter 30 to the shell 10 for heat dissipation.
[0089] In some embodiments, the thickness of the heat-conducting layer 123 is less than 1 mm, and the thermal conductivity of the heat-conducting layer 123 is greater than 3 W / M / K.
[0090] It is understandable that since the height of the heat-conducting layer 123 is too high, the heat conduction efficiency between the inverter 30 and the protrusion 122 will be reduced.
[0091] Therefore, the thickness of the heat-conducting layer 123 of the present application can be set to be less than 1 mm, and at the same time, the thermal conductivity of the heat-conducting layer 123 is greater than 3W / M / K, which can ensure the heat conduction efficiency between the inverter 30 and the protrusion 122, thereby ensuring that heat can be quickly transferred from the power components such as the circuit board components of the inverter 30 to the housing 10.
[0092] In other words, the present application sets the protrusion 122 on the inner side of the housing 10 inside the installation cavity 11, which can reduce the setting height of the heat conductive layer 123, so that the heat conduction efficiency between the inverter 30 and the housing 10 is optimized.
[0093] See also Figure 1 In some embodiments, the energy storage power supply 100 further includes a foot pad 50. The bottom 101 of the housing 10 has a foot pad 50, and the foot pad 50 is used to contact the external support surface so that the bottom 101 of the housing 10 is spaced apart from the external support surface.
[0094] Specifically, a foot pad 50 is provided at the bottom 101 of the shell 10. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply 100, and the appearance is beautiful. On the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0095] In addition, the energy storage power supply 100 of the present application is supported by the foot pad 50 , and the fan 40 is not easily touched by a human body, thereby improving the safety of the use of the energy storage power supply 100 .
[0096] Optionally, there are four foot pads 50, and the four foot pads 50 are respectively located at the four corners of the housing 10. This can ensure the stability of the energy storage power supply 100 on the external support surface. Of course, in other embodiments of the present invention, the number of foot pads 50 can also be adjusted according to actual needs and is not limited to four.
[0097] See also Figure 2 In some embodiments, the energy storage power supply 100 further includes a first cover plate 60. The first cover plate 60 is fixedly mounted on the outside of the housing 10 and covers the fan 40. The first cover plate 60 is provided with a ventilation hole 61.
[0098] That is, the setting position of the first cover plate 60 corresponds to the setting position of the fan 40. When the fan 40 is installed on the bottom 101 of the housing 10, the first cover plate 60 is also covered on the bottom 101 of the housing 10. When the fan 40 is installed on the side 102 of the housing 10, the first cover plate 60 is also covered on the side 102 of the housing 10. When the fan 40 is installed on the top 103 of the housing 10, the first cover plate 60 is also covered on the top 103 of the housing 10.
[0099] Among them, the first cover plate 60 of the present application is fixedly mounted on the outside of the housing 10 and covers the fan 40 and the heat dissipation fins 121, which can prevent the fan 40 and the heat dissipation fins 121 from being exposed, can protect the fan 40, and can also prevent the user from touching the heat dissipation fins 121 when taking the energy storage power supply 100 and causing burns. At the same time, the first cover plate 60 also has a certain aesthetic effect. The first cover plate 60 can be fixedly mounted on the outside of the housing 10 by screws or other components, which is not limited here.
[0100] The first cover plate 60 of the present application is provided with ventilation holes 61 , and the heat generated by the inverter 30 can be dissipated to the outside through the ventilation holes 61 on the first cover plate 60 by the action of the fan 40 , thereby achieving a heat dissipation effect on the heat conducted from the inverter 30 to the housing 10 .
[0101] In some embodiments, the first cover plate 60 includes a first bottom plate 62 and a first side plate 63 surrounding the first bottom plate 62. An air duct is formed between the heat dissipation structure 12 and the first cover plate 60, and the ventilation holes 61 include first ventilation holes 611 and second ventilation holes 612. The air duct is arranged between the first ventilation holes 611 and the second ventilation holes 612. The first bottom plate 62 is provided with the first ventilation holes 611, and the first side plate 63 is provided with the second ventilation holes 612.
[0102] Specifically, the first cover plate 60 is provided with a first ventilation hole 611 and a second ventilation hole 612 at the same time, that is, when the first cover plate 60 is provided with ventilation holes in two directions, an independent air duct can be formed between the first cover plate 60 and the shell 10, so that the energy storage power supply 100 of the present application can dissipate heat faster.
[0103] like Figure 4 As shown, the number of the first ventilation holes 611 can be multiple, and the multiple first ventilation holes 611 are arranged in an array. The number of the second ventilation holes 612 can also be multiple, and the multiple second ventilation holes 612 can also be arranged in an array. It can be understood that the more the number of the first ventilation holes 611 and the second ventilation holes 612 or the larger the aperture, the better the ventilation effect, thereby making the final heat dissipation effect better.
[0104] In this way, the energy storage power supply 100 of the present application can form an independent air duct between the first cover plate 60 and the shell 10 through the first ventilation hole 611 and the second ventilation hole 612 on the first cover plate 60, so that the heat dissipation effect of the heat dissipation structure 12 on the shell 10 is better.
[0105] In some embodiments, the first ventilation hole 611 is an air inlet, and the second ventilation hole 612 is an air outlet; or, the second ventilation hole 612 is an air inlet, and the first ventilation hole 611 is an air outlet.
[0106] That is, the first vent 611 of the present application can be used as an air inlet or an air outlet, and is responsible for introducing external cold air into the interior of the power supply when used as an air inlet, or for exhausting internal hot air when used as an air outlet. The second vent 612 can also be used as an air inlet or an air outlet, and is responsible for introducing external cold air into the interior of the power supply when used as an air inlet, or for exhausting internal hot air when used as an air outlet, depending on the heat dissipation requirements of the energy storage power supply 100 and the air flow path inside the energy storage power supply 100.
[0107] Among them, the present application can control whether the two ventilation holes are used as air inlets or air outlets by controlling the direction of the fan 40.
[0108] Furthermore, a grille may be provided on the first ventilation hole 611 or the second ventilation hole 612, which can not only dissipate heat for the energy storage power supply 100, but also prevent foreign matter from entering the first cover plate 60 of the energy storage power supply 100.
[0109] In some embodiments, the energy storage power supply 100 includes a foot pad. The foot pad is disposed on a side of the first cover plate 60 opposite to the fan 40. The foot pad is used to contact an external support surface so that the bottom of the first cover plate 60 is spaced apart from the external support surface.
[0110] That is, the present application can directly provide a foot pad at the bottom of the first cover plate 60. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply 100, and the appearance is beautiful. On the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0111] Optionally, there are four foot pads 50, and the four foot pads 50 are respectively located at the four corners of the first cover plate 60. This can ensure the stability of the energy storage power supply 100 on the external support surface. Of course, in other embodiments of the present invention, the number of foot pads 50 can also be adjusted according to actual needs and is not limited to four.
[0112] See also Figure 2 and Figure 4In some embodiments, the energy storage power supply 100 includes a foot pad 50. A first bottom plate 62 of the first cover plate 60 is provided with a through hole 64 corresponding to the foot pad 50. The foot pad 50 is fixedly arranged on the bottom of the first cover plate 60 with the housing 10 through the through hole 64, and the foot pad 50 is used to contact the external support surface so that the bottom of the first cover plate 60 is spaced from the external support surface.
[0113] In one embodiment, Figure 4 As shown, when a heat sink 121 is provided on the bottom of the shell 10, a first connecting column 1212 may be provided on the heat sink 121, and a first connecting hole corresponding to the first connecting column 1212 may be provided on the foot pad 50. The foot pad 50 may cooperate with the first connecting column 1212 through the first connecting hole to be fixed to the bottom of the shell 10, so that the pressure exerted on the foot pad 50 can be directly transmitted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further prevent the first cover plate 60 from being crushed.
[0114] In another embodiment, when a heat sink 121 is provided on the bottom of the shell 10, a second connecting hole may also be provided on the heat sink 121, and a second connecting column 52 corresponding to the second connecting hole may be provided on the foot pad 50. The foot pad 50 can cooperate with the second connecting hole through the second connecting column 52 to be fixed to the bottom of the shell 10, so that the pressure on the foot pad 50 can be directly transmitted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further prevent the first cover plate 60 from being crushed.
[0115] In another embodiment, the foot pad 50 may be provided with a first clamping column corresponding to the through hole 64, and the shell 10 may be provided with a second clamping column with a clamping hole corresponding to the clamping column, so that the first clamping column can pass through the through hole 64 and engage with the second clamping column, so that the foot pad 50 can be passed through the first cover plate 60 and firmly installed together with the shell 10, so that the pressure on the foot pad 50 can be directly transmitted to the shell 10, and will not be borne by the first cover plate 60, which can effectively further prevent the first cover plate 60 from being crushed.
[0116] Similarly, it can be known that a foot pad 50 is provided at the bottom of the first cover plate 60. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful. On the other hand, it can enable the driving airflow between the fan 40 and the heat dissipation structure 12 to circulate in a relatively sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0117] Optionally, there are four foot pads 50, and the four foot pads 50 are respectively located at the four corners of the first cover plate 60. This can ensure the stability of the energy storage power supply 100 on the external support surface. Of course, in other embodiments of the present invention, the number of foot pads 50 can also be adjusted according to actual needs and is not limited to four.
[0118] See also Figure 2 In some embodiments, the housing 10 includes a first housing 13 and a second housing 14, which are engaged with each other to form a mounting cavity 11. The inverter 30 is fixed to the first housing 13, a heat dissipation structure 12 is provided on the first housing 13, and the battery module 20 is fixed to the second housing 14.
[0119] Specifically, the first housing 13 is a lower housing, the second housing 14 is an upper housing, the first housing 13 may be provided with a first engaging member 131, and the second housing 14 may be provided with a second engaging member 141 engaged with the first engaging member 131. The first engaging member 131 may be as follows: Figure 3 The hollow first clamping column shown in the figure, the second clamping member 141 can be as follows Figure 2 A solid second clamping column is shown corresponding to the first clamping column.
[0120] The first shell 13 and the second shell 14 of the present application can both be die-cast, which has a simple structure and is easy to manufacture.
[0121] The housing 10 of the present application is designed as a spliced structure formed by splicing a first housing 13 and a second housing 14 , which facilitates the assembly of the energy storage power supply 100 .
[0122] It is understandable that when the housing 10 is designed as a splicing structure, the corresponding heat dissipation structure 12 on the housing 10 may be a splicing structure or may not be a splicing structure, which is not limited here.
[0123] See also Figure 4 In some embodiments, the first shell 13 is an aluminum alloy shell, the inner side of the first shell 13 is thermally coupled to the inverter 30 , and a heat dissipation structure 12 is formed on the outer side of the first shell 13 .
[0124] It can be understood that the first housing 13 is an aluminum alloy housing, and the aluminum alloy has good thermal conductivity, so the first housing 13 made of aluminum alloy also has good heat dissipation performance. Since a heat dissipation structure 12 is formed on the outside of the first housing 13, the heat dissipation structure 12 is also made of aluminum alloy, and the corresponding heat dissipation performance of the heat dissipation structure 12 of the present application is also good.
[0125] In addition, since aluminum alloy has a lower density and higher strength than traditional metal materials such as steel and copper, the first shell 13 made of aluminum alloy has better strength and is not easily damaged.
[0126] In some embodiments, the first housing 13 is anodized.
[0127] Specifically, performing anodizing treatment on the first shell 13 can improve the corrosion resistance of the first shell 13 and at the same time improve the surface emissivity, thereby improving the radiation capacity of the first shell 13 .
[0128] See also Figure 3 and Figure 5 In some embodiments, the first housing 13 is provided with a receiving cavity 132 , and the inverter 30 is fixedly installed in the receiving cavity 132 .
[0129] Specifically, the inverter 30 may be fixedly installed in the accommodating cavity 132 by screws or bolts, or may be fixedly installed in the accommodating cavity 132 by other methods, which is not limited here.
[0130] In this way, the inverter 30 of the present application can be fixedly installed in the accommodating cavity 132, so that heat can be dissipated through the heat dissipation structure 12 formed on the outer side of the first shell 13, thereby achieving a better heat dissipation effect.
[0131] See also Figure 1 and Figure 2 In some embodiments, a panel 142 is disposed on the second shell 14 , and a power output port 1421 is disposed on the panel 142 .
[0132] That is, the energy storage power supply 100 of the present application can output electric energy to the outside through the electric energy output port 1421 provided on the panel 142 of the second shell 14 .
[0133] In some embodiments, the first shell 13 and the second shell 14 are buckled together, and the first shell 13 is disposed on the lower side of the second shell 14 .
[0134] That is to say, the shell 10 of the present application can be assembled from two half shells that are buckled together, and the structure is simple, and the shell 10 is easy to mass produce.
[0135] In addition, since the heat dissipation structure 12 is arranged on the outside of the first shell 13, and the first shell 13 is arranged on the lower side of the second shell 14, the energy storage power supply 100 of the present application is equivalent to setting the heat dissipation structure 12 below the shell 10, which is not easy to be accidentally contacted with the heat dissipation structure 12, and the heat dissipation structure 12 can be protected from being damaged.
[0136] In some embodiments, a temperature sensor is installed on the heat dissipation structure 12 to detect the temperature of the heat dissipation structure 12. The energy storage power supply 100 controls the start and stop or the speed of the fan 40 based on the temperature of the heat dissipation structure 12.
[0137] That is, the energy storage power supply 100 of the present application can also be installed with a temperature sensor on the shell 10. After the temperature sensor detects that the temperature of the heat dissipation structure 12 is greater than or equal to the first threshold, the energy storage power supply 100 can automatically control the fan 40 to start, ensuring that the temperature of the heat dissipation structure 12 is not too high, thereby facilitating timely heat dissipation of the energy storage power supply 100.
[0138] When the temperature sensor detects that the temperature of the heat dissipation structure 12 is less than or equal to the second threshold, the energy storage power supply 100 can automatically control the fan 40 to stop working, so as to improve the heat dissipation efficiency of the fan 40 and save energy consumption.
[0139] The first threshold may be, for example, 38°, 39°, 40°, 43°, 45°, 48°, 50°, 51°, 55° or 60°, which is not limited here.
[0140] The second threshold may be, for example, 28°, 29°, 29.5°, 30°, 31°, 34°, 35°, 36°, 37° or 38°, which is not limited here.
[0141] In this way, the present application can timely sense the temperature of the heat dissipation structure 12 by setting a temperature sensor on the heat dissipation structure 12, so that the energy storage power supply 100 can timely control the fan 40 to start to start heat dissipation, and timely control the fan 40 to stop working to stop heat dissipation.
[0142] See also Figure 7 In some embodiments, the energy storage power supply 100 further includes a semiconductor cooling element 124. The semiconductor cooling element 124 includes a hot end and a cold end, the cold end is thermally coupled to the inverter 30, and the hot end is thermally coupled to the heat dissipation structure 12.
[0143] It can be understood that the heat dissipation structure 12 may include a semiconductor refrigeration element 124. The semiconductor refrigeration technology is a high-efficiency refrigeration and heat pump technology that uses semiconductor materials as refrigerants and produces a refrigeration effect through the action of electric current. This technology has the advantages of energy saving, environmental protection, small size and good refrigeration effect, and has been widely used in various fields. The principle of semiconductor refrigeration technology is to achieve refrigeration through current transmission and the thermoelectric effect of semiconductor materials. When current passes through a semiconductor material, one side of the semiconductor material becomes hot and the other side becomes cold. This is because the carriers of the semiconductor material generate energy transfer under the action of the thermoelectric field. Using this effect, heat can be transferred from the cold side to the hot side, thereby achieving a refrigeration effect.
[0144] In this embodiment, the cold end of the semiconductor refrigeration component 124 is thermally connected to the inverter 30, and the hot end is thermally connected to the heat dissipation structure 12. The air at the hot end of the semiconductor refrigeration component 124 is transferred to the outside through the heat dissipation structure 12 and the fan 40, thereby achieving the purpose of cold end cooling and reducing the temperature of the inverter 30, thereby ensuring the cooling effect of the energy storage power supply 100.
[0145] At the same time, since the semiconductor refrigeration component 124 can accurately control the temperature, the temperature of the shell 10 can adjust the power consumption parameters of the semiconductor refrigeration component 124 according to user needs, so as to achieve intelligent adjustment of the temperature of the shell 10 and improve the user experience.
[0146] refer to Figure 7 As shown, the heat dissipation structure 12 also includes a heat preservation member 125 surrounding the semiconductor refrigeration member 124. It is understandable that, since the semiconductor refrigeration member 124 cools at one end and heats at the other end during operation, the heat preservation member 125 is required to prevent the outside from affecting the performance of the semiconductor refrigeration member 124. The heat preservation member 125 needs to be made of an insulating material with low thermal conductivity and good compression performance, such as pearl cotton, foam, etc. Of course, in other embodiments of the present invention, the material of the heat preservation member 125 can also be adjusted according to actual needs, and is not limited to the above limitations.
[0147] Optionally, the thickness of the insulation component 125 is determined according to the compression performance of the insulation material, and is generally 1.5 to 2 times the thickness of the semiconductor refrigeration component 124. It is filled between the inverter 30 and the heat dissipation structure 12. The compression filling ensures better insulation performance through the compression force of the heat dissipation structure 12 locked from bottom to top.
[0148] See also Figure 8 In some embodiments, the heat dissipation structure 12 has a mounting groove 126 on a side facing the inverter 30 , and the semiconductor cooling element 124 is installed in the mounting groove 126 .
[0149] It can be understood that the heat dissipation structure 12, as a support for the semiconductor cooling element 124 and the fan 40, can make the heat dissipation structure 12, the semiconductor cooling element 124 and the fan 40 form a heat dissipation whole, which is convenient for assembly. Installing the semiconductor cooling element 124 in the installation groove 126 can increase the contact area between the hot end of the semiconductor cooling element 124 and the heat dissipation structure 12, thereby facilitating the heat dissipation effect of the heat dissipation structure 12 on the hot end of the semiconductor cooling element 124.
[0150] Optionally, the size of the mounting groove 126 is slightly larger than the size of the semiconductor refrigeration component 124, and the depth of the mounting groove 126 is between 0.1mm-0.2mm. The main purpose is to position the semiconductor refrigeration component 124. At the same time, thermal conductive material is applied to the contact position between the mounting groove 126 and the semiconductor refrigeration component 124 to eliminate thermal resistance. Generally, the thermal conductive material is a fluid thermal conductive material such as silicone grease.
[0151] See also Figure 4 In some embodiments, the outer wall of the installation cavity 11 has a heat dissipation port 15 , and the heat dissipation structure 12 is installed on the heat dissipation port 15 .
[0152] Specifically, the heat dissipation structure 12 can be fixedly mounted on the heat dissipation opening 15 by means of screws or bolts.
[0153] In this way, the heat dissipation structure 12 of the present application can be installed on the heat dissipation opening 15 of the outer wall of the installation cavity 11 , so as to dissipate heat from the inverter 30 through the heat dissipation opening 15 .
[0154] See also Figure 4 and Figure 8 In some embodiments, the heat dissipation structure 12 may include a mounting portion 127 and a fixing flange 128 disposed around the mounting portion 127. The mounting portion 127 extends into the heat dissipation port 15, the semiconductor cooling element 124 is mounted on the mounting portion 127, and the fixing flange 128 is fixed to the outer wall of the mounting cavity 11 through a connector to close the heat dissipation port 15 through the heat dissipation structure 12.
[0155] It can be understood that the heat dissipation structure 12 is an independent module that is locked to the outer wall of the installation cavity through a connector. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful. On the other hand, it can make the cold end of the semiconductor refrigeration component 124 fit tightly on the inverter 30, thereby improving the cooling effect on the inverter 30.
[0156] Optional, reference Fig. 9 As shown, a seal 129 is sleeved on the mounting portion 127. The outer wall of the seal 129 abuts against the inner wall of the heat dissipation opening 15 of the housing 10. Thus, the connection sealing performance between the heat dissipation structure 12 and the housing 10 can be improved, thereby preventing external dirt or liquid from entering the energy storage power supply 100 and reducing the failure rate of the energy storage power supply 100.
[0157] Optionally, the heat dissipation structure 12 is an integral die casting. Thus, the heat dissipation fins 121, the mounting portion 127 and the fixing flange 128 can be formed in one step, which facilitates the manufacture of the heat dissipation structure 12 and helps to reduce the weight of the heat dissipation structure 12, thereby facilitating the lightweight design of the energy storage power supply.
[0158] See also Fig. 9 In some embodiments, the energy storage power supply 100 further includes a heat dissipation bracket 32. The inverter 30 includes a circuit board 31, on which a power element 311 is disposed. The heat dissipation bracket 32 is mounted on the housing 10, the heat dissipation bracket 32 fixes the circuit board 31 and is thermally coupled to the power element 311, and the heat dissipation bracket 32 is also thermally coupled to the heat dissipation structure 12.
[0159] It can be understood that fixing the circuit board 31 on the heat dissipation bracket 32 can protect the power element 311. The heat dissipation bracket 32 is thermally connected to the circuit board 31, and the heat dissipation bracket 32 is thermally connected to the heat dissipation structure 12. In the actual working process, the heat generated by the power element 311 on the circuit board 31 can be transferred from the circuit board 31 to the heat dissipation bracket 32, and then dissipated to the outside by the heat dissipation structure 12 and the fan 40, which can improve the cooling effect of the inverter 30, thereby ensuring the heat dissipation effect of the energy storage power supply 100.
[0160] Optionally, the heat dissipation bracket 32 is provided with heat dissipation fins 32121. The heat dissipation fins 32121 provided on the heat dissipation bracket 32 can play a role in heat dissipation. The use of the heat dissipation fins 32121 in conjunction with the heat dissipation structure 12 can ensure the cooling effect on the inverter 30, thereby ensuring that the energy storage power supply 100 has a good heat dissipation function. In the embodiment of the present invention, the number and area of the heat dissipation fins 32121 can be selected according to actual needs, so that it has a relatively small area while ensuring the heat dissipation effect, thereby facilitating the lightweight design of the energy storage power supply.
[0161] See also Fig.10 In some embodiments, the heat dissipation bracket 32 includes a base 321 and a second cover plate 322. The base 321 includes a second bottom plate 3211 and two second side plates 3212, and the two second side plates 3212 are respectively connected to the two ends of the second bottom plate 3211. A thermal pad 312 is provided between the second bottom plate 3211 and the power element 311, and the second cover plate 322 is connected to the two second side plates 3212, and a stopper 3221 for limiting the battery module 20 is provided on the second cover plate 322.
[0162] Understandably, reference Fig. 9 As shown, the base 321 is formed as a U-shaped plate, and a thermal pad 312 is provided between the second bottom plate 3211 and the circuit board 31. The second side plate 3212 is provided with a heat dissipation fin 32121, through which the heat generated by the power element 311 on the circuit board 31 can be quickly conducted to the heat dissipation bracket 32, and then quickly dissipated through the heat dissipation fin 32121, thereby ensuring the heat dissipation effect of the circuit board 31.
[0163] The second cover plate 322 is provided with a limiter 3221 for limiting the battery module 20. The limiter 3221 can prevent the inverter 30 from shaking relative to the battery module 20, and can provide positioning for the installation of the inverter 30, which can facilitate assembly and improve the reliability of the energy storage power supply.
[0164] Optional, reference Fig.10As shown, a receiving groove 32111 is provided on the second bottom plate 3211, and the receiving groove 32111 is used to receive the semiconductor refrigeration component 124. The size of the receiving groove 32111 is slightly larger than the size of the semiconductor refrigeration component 124, and the depth of the receiving groove 32111 is between 0.1mm and 0.2mm. The main purpose is to position the semiconductor refrigeration component 124, and at the same time, a heat-conducting material is applied at the position where the receiving groove 32111 contacts the semiconductor refrigeration component 124 to eliminate the heat resistance. Generally, the heat-conducting material is a heat-conducting material with fluidity such as silicone grease. In this way, the positioning effect of the semiconductor refrigeration component 124 can be improved, and the heat dissipation effect of the semiconductor refrigeration component 124 on the heat dissipation bracket 32 can be reflected.
[0165] Optional, reference Fig.10 As shown, the inverter 30 also includes an insulating plate 33. The insulating plate 33 is sandwiched between the second bottom plate 3211 and the circuit board 31, and the insulating plate 33 is provided with a avoidance hole 351 corresponding to the thermal pad 312. It can be understood that the additional insulating plate 33 can ensure the insulation between the circuit board 31 and the second bottom plate 3211, avoid the phenomenon of short circuit caused by the heat dissipation bracket 32 being charged, thereby improving the working reliability of the energy storage power supply. The avoidance hole 351 provided on the insulating plate 33 can ensure that the thermal pad 312 directly stops on the second bottom plate 3211, and ensures that the heat on the circuit board 31 can be quickly transferred to the heat dissipation bracket 32, which is beneficial to improve the heat dissipation efficiency of the inverter 30.
[0166] In some embodiments, the energy storage power supply 100 further includes a heat pipe, which is thermally coupled to the heat dissipation structure 12 .
[0167] Specifically, the heat pipe is generally a closed copper tube with a phase change medium inside, and the heat pipe has a very strong thermal conductivity. In the present application, the heat pipe is arranged in the accommodating cavity 132 and attached to the heat dissipation structure 12. The heat generation mainly comes from the inverter 30. Different power components 311 of the inverter 30 have different heat generation, which will cause different temperatures in different areas of the heat dissipation structure 12, and extremely high temperature areas may appear.
[0168] Therefore, the present application can conduct the heat from the high-temperature area to the low-temperature area through the heat pipe, thereby achieving uniform heat dissipation of the heat dissipation structure 12, which can better dissipate heat and achieve a better heat dissipation effect.
[0169] See also Figure 2 In some embodiments, the battery module 20 may be disposed above the inverter 30 , and a protection plate 21 may be provided on a side of the battery module 20 opposite to the inverter 30 , and the protection plate 21 is used to protect the battery module 20 .
[0170] In detail, the protection plate 21 can prevent the inverter 30 or other external objects from directly contacting the battery module 20, thereby avoiding physical damage that may be caused by friction, collision or extrusion. This is crucial to maintaining the structural integrity of the battery module 20 and extending its service life.
[0171] In addition, in some cases, the inverter 30 may generate electromagnetic interference or electrical noise. The protection board 21 can act as an electrical barrier to reduce the impact of these interferences on the battery module 20 and ensure that the battery module 20 can work stably and safely.
[0172] In addition, the battery module 20 generates heat during operation, and the inverter 30 may also be a heat source. The protection plate 21 can play a heat insulation role to a certain extent, reduce the heat exchange between the battery module 20 and the inverter 30, and help maintain the battery module within a suitable operating temperature range.
[0173] If the inverter 30 fails or has an abnormality, such as short circuit, overheating, etc., the protection board 21 can serve as an additional safety barrier to prevent these faults from causing direct damage to the battery module 20. It can also reduce safety risks such as fire and explosion to a certain extent.
[0174] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.
Claims
1. An energy storage power supply, characterized in that: include: A housing, wherein the housing has a mounting cavity and a heat dissipation structure is formed on the housing; A battery module, wherein the battery module is installed in the installation cavity; an inverter, the inverter being installed in the installation cavity, thermally coupled to the heat dissipation structure, and electrically connected to the battery module; and A fan is installed on the outside of the shell, and the fan forms flowing air to flow through the heat dissipation structure.
2. The energy storage power supply according to claim 1, characterized in that: The heat dissipation structure includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the bottom, side and / or top of the housing.
3. The energy storage power supply according to claim 2, characterized in that: The plurality of heat dissipation fins are radially arranged and a mounting space is formed in the middle, and the fan is mounted in the mounting space.
4. The energy storage power supply according to claim 2, characterized in that: The arrangement density of the heat dissipation fins changes gradually from dense to sparse from the center to the surroundings, and the arrangement height of the heat dissipation fins changes gradually from low to high from the center to the surroundings.
5. The energy storage power supply according to claim 1, characterized in that: The fan is a centrifugal fan or an axial flow fan.
6. The energy storage power supply according to claim 2, characterized in that: The heat dissipation structure further includes a protrusion, which is located in the installation cavity and fixedly arranged on the housing, and the protrusion is thermally coupled to the power element of the inverter.
7. The energy storage power supply according to claim 6, characterized in that: A heat-conducting layer is provided between the protrusion and the power element, and the protrusion is thermally coupled to the power element of the inverter through the heat-conducting layer.
8. The energy storage power supply according to claim 7, characterized in that: The thickness of the heat-conducting layer is less than 1 mm, and the thermal conductivity of the heat-conducting layer is greater than 3 W / M / K.
9. The energy storage power supply according to claim 1, characterized in that: The energy storage power supply further includes a foot pad, the bottom of the shell has a foot pad, and the foot pad is used to contact an external support surface so that the bottom of the shell is spaced apart from the external support surface.
10. The energy storage power supply according to claim 1, characterized in that: The energy storage power supply further includes a first cover plate, which is fixedly mounted on the outer side of the housing and covers the fan arrangement, and a ventilation hole is provided on the first cover plate.
11. The energy storage power supply according to claim 10, characterized in that: The first cover plate covers the heat dissipation structure, the first cover plate includes a first base plate and a first side plate surrounded by the first base plate, an air duct is formed between the heat dissipation structure and the first cover plate, the ventilation holes include first ventilation holes and second ventilation holes, the air duct is arranged between the first ventilation holes and the second ventilation holes, the first base plate is provided with the first ventilation holes, and the first side plate is provided with the second ventilation holes.
12. The energy storage power supply according to claim 10, characterized in that: The energy storage power supply further includes a foot pad, which is arranged on a side of the first cover plate opposite to the fan, and the foot pad is used to contact an external support surface so that the bottom of the first cover plate is spaced apart from the external support surface.
13. The energy storage power supply according to claim 10, characterized in that: The energy storage power supply also includes a foot pad, and the bottom plate of the cover plate is provided with a perforation corresponding to the foot pad. The foot pad is fixed to the bottom of the cover plate with the shell through the perforation, and the foot pad is used to contact the external support surface so that the bottom of the cover plate is spaced apart from the external support surface.
14. The energy storage power supply according to claim 1, characterized in that: The shell includes a first shell and a second shell, the first shell and the second shell are buckled together to form the installation cavity; the inverter is fixed on the first shell, a heat dissipation structure is provided on the first shell, and the battery module is fixed on the second shell.
15. The energy storage power supply according to claim 14, characterized in that: The first shell is an aluminum alloy shell, the inner side of the first shell is thermally coupled to the inverter, and the heat dissipation structure is formed on the outer side of the first shell.
16. The energy storage power supply according to claim 15, characterized in that: The first shell is anodized.
17. The energy storage power source according to claim 14, characterized in that: The first shell is provided with a containing cavity, and the inverter is fixedly installed in the containing cavity.
18. The energy storage power source according to claim 14, characterized in that: The second shell is provided with a panel, and the panel is provided with an electric energy output port.
19. The energy storage power source according to claim 14, characterized in that: The first shell and the second shell are buckled together, and the first shell is arranged on the lower side of the second shell.
20. The energy storage power source according to claim 1, characterized in that: A temperature sensor is installed on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start or stop or the speed of the fan based on the temperature of the heat dissipation structure.
21. The energy storage power source according to claim 1, characterized in that: The energy storage power supply further includes a semiconductor refrigeration component, which includes a hot end and a cold end. The cold end is thermally coupled to the inverter, and the hot end is thermally coupled to the heat dissipation structure.
22. The energy storage power source according to claim 21, characterized in that: The heat dissipation structure has a mounting groove on one side facing the inverter, and the semiconductor cooling element is mounted in the mounting groove.
23. The energy storage power source according to claim 21, characterized in that: The outer wall of the installation cavity is provided with a heat dissipation opening, and the heat dissipation structure is installed on the heat dissipation opening.
24. The energy storage power source according to claim 23, characterized in that: The heat dissipation structure includes a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration component is mounted on the mounting portion, and the fixed flange is fixed to the outer wall of the mounting cavity through a connecting member to close the heat dissipation port through the heat dissipation structure.
25. The energy storage power source according to any one of claims 1 to 24, characterized in that: The energy storage power supply also includes a heat dissipation bracket, The inverter comprises a circuit board, on which the power element is arranged; The heat dissipation bracket is installed on the housing, the heat dissipation bracket fixes the circuit board and is thermally coupled with the power element, and the heat dissipation bracket is also thermally coupled with the heat dissipation structure.
26. The energy storage power source according to claim 25, characterized in that: The heat dissipation bracket comprises: A base, the base comprising a second bottom plate and two second side plates, the two second side plates are respectively connected to two ends of the second bottom plate; a thermal pad is provided between the second bottom plate and the power element; and The second cover plate is connected to the two second side plates, and a limiting member for limiting the battery module is disposed on the second cover plate.
27. The energy storage power source according to claim 1, characterized in that: The energy storage power supply further includes a heat pipe, and the heat pipe is thermally coupled to the heat dissipation structure.
Citation Information
Cited By
Energy storage power supply
CN120978308A