Die bonder positioning control method, system and device and readable storage medium

Abstract

The invention discloses a die bonder positioning control method, a die bonder positioning control system, die bonder positioning control equipment and a readable storage medium. The die bonder positioning control method comprises the following steps: S101, acquiring an initial coordinate of a specified positioning point of a to-be-processed PCB (Printed Circuit Board); s102, importing the initial coordinates into a preset PCB (Printed Circuit Board) positioning model to carry out coordinate optimization processing so as to obtain an optimized PCB positioning model; s103, when the PCB is positioned and processed, according to the coordinate data of the plurality of positioning points in the PCB positioning model, controlling a servo moving mechanism to move the current corresponding positioning point of the PCB to a position right below a CCD (Charge Coupled Device) device in sequence, so as to obtain a marked image of the corresponding positioning point; s104, performing PCB positioning calibration according to the marked images of the plurality of positioning points acquired by the CC D device; and S105, when the positioning calibration of the PCB is successful, carrying out chip welding work according to the coordinate data of all the welding disc points in the PCB positioning model. According to the invention, the positioning processing efficiency can be improved and the positioning error rate can be reduced, so that the production efficiency of the die bonder is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor die bonders, and in particular to a die bonder positioning control method, system, device and readable storage medium. Background Art

[0002] At present, in the production and manufacturing of Mini LED display screens, a die bonder is often used to position and solder chips on the PCB boards to be processed. The current positioning method of the die bonder requires manual positioning of the positioning points and the pad points of the four edge corners of each PCB board to be processed one by one to determine the positioning position of the PCB to be processed, so as to facilitate the subsequent chip soldering work on the pad points of the positioned PCB board, wherein the pad points are located in the area surrounded by the four positioning points. However, the above positioning method is relatively cumbersome, with low positioning processing efficiency and high positioning error rate, which greatly affects the production efficiency of the die bonder. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a positioning control method, system, device and readable storage medium for a die bonding machine with a simple positioning method, which can improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the die bonding machine.

[0004] In order to solve the above technical problems, the present invention provides a positioning control method for a die bonding machine, comprising: S101, obtaining the initial coordinates of a designated positioning point of a PCB board to be processed; S102, importing the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model; S103, when the PCB board is positioned and processed, according to the coordinate data of multiple positioning points in the PCB board positioning model, successively controlling a servo moving mechanism to move the current corresponding positioning point of the PCB board to just below a CCD device to obtain a marked image of the corresponding positioning point; S104, performing PCB positioning calibration according to the marked images of multiple positioning points obtained by the CCD device; S105, when the PCB board positioning calibration is successful, performing chip welding according to the coordinate data of all pad points in the PCB board positioning model.

[0005] As an improvement of the above scheme, the step of obtaining the initial coordinates of the designated positioning point of the PCB board to be processed includes: obtaining an initial positioning control instruction; controlling the servo moving mechanism to drive the PCB board located on the workbench to move according to the initial positioning control instruction until the designated positioning point of the PCB board moves to directly below the CCD device; judging whether the initial mark image of the designated positioning point obtained by the CCD device is located in the CCD acquisition area, if it is judged to be yes, it indicates that the initial positioning calibration is successful, and the initial coordinates of the designated positioning point are calculated according to the travel data of the servo moving mechanism; if it is judged to be no, it indicates that the initial positioning calibration is unsuccessful, and the initial positioning work of the designated positioning point is performed again.

[0006] As an improvement of the above scheme, the steps of constructing the preset PCB board positioning model include: obtaining a template positioning control instruction; controlling the servo moving mechanism to drive the PCB board to move according to the template positioning control instruction until multiple positioning points and multiple designated pad points of the PCB board are successively moved to the position directly below the CCD device; judging whether the marked image of the positioning point or pad point obtained by the CCD device is located in the CCD acquisition area; if it is judged as yes, it means that the positioning point or pad point is successfully positioned, and the coordinate data of the corresponding positioning point or pad point is calculated according to the corresponding stroke data of the servo moving mechanism; if it is judged as no, it means that the positioning point or pad point is unsuccessful, and the positioning work of the positioning point or pad point is performed again; constructing the preset PCB board positioning model according to the coordinate data and marked image of the successfully positioned positioning point, the coordinate data of the pad point and the preset pad point design rules.

[0007] As an improvement of the above-mentioned scheme, the step of importing the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model includes: performing difference calculation based on the initial coordinates of the specified positioning point and the starting coordinates of the starting positioning point in the preset PCB board positioning model to obtain positioning difference data; performing coordinate update optimization on all positioning points and pad points in the preset PCB board positioning model based on the positioning difference data to obtain a PCB board positioning model after coordinate update optimization.

[0008] As an improvement of the above scheme, the step of performing PCB positioning calibration based on the mark images of multiple positioning points acquired by the CCD device includes: performing similarity pairing on the mark image of each positioning point acquired by the CCD device and the mark image of the corresponding positioning point in the PCB board positioning model to obtain a similarity pairing result; judging whether the similarity pairing results of all positioning points are equal to a preset similarity threshold; if the judgment is yes, it indicates that the PCB board positioning calibration is successful; if the judgment is no, it indicates that the PCB board positioning calibration is unsuccessful, and returns to step S101.

[0009] As an improvement of the above scheme, the step of performing chip welding according to the coordinate data of all pad points in the PCB board positioning model includes: controlling the servo moving mechanism in sequence according to the coordinate data of each pad point in the PCB board positioning model to move the corresponding pad point of the PCB board to directly below the CCD device; judging whether the marked image of the pad point acquired by the CCD device is located in the CCD acquisition area, if the judgment is yes, it means that the pad point positioning calibration is successful, and the chip welding work is performed on the pad point, if the judgment is no, it means that the pad point positioning calibration is unsuccessful, and returns to step S101.

[0010] As an improvement of the above solution, the pad point design rule includes matrix data of the pad points, row spacing data and column spacing data between the pad points, and row and column positions of designated pad points.

[0011] The present invention also provides a positioning control system for a die bonding machine, which is used to implement the above-mentioned positioning control method for a die bonding machine, including: an initial positioning acquisition module, which is used to acquire the initial coordinates of a designated positioning point of a PCB board to be processed; a PCB board positioning optimization module, which is used to import the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model; a positioning drive module, which is used to control a servo moving mechanism to move the current corresponding positioning point of the PCB board to the bottom of a CCD device according to the coordinate data of multiple positioning points in the PCB board positioning model during the PCB board positioning processing, so as to obtain a marked image of the corresponding positioning point; a positioning calibration processing module, which is used to perform PCB positioning calibration according to the marked images of multiple positioning points acquired by the CCD device; and a positioning processing processing module, which performs chip welding according to the coordinate data of all pad points in the PCB board positioning model when the PCB board positioning calibration is successful.

[0012] The present invention also provides a computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above method when executing the computer program.

[0013] The present invention also provides a computer-readable storage medium on which a computer program is stored, and the computer program implements the steps of the above method when executed by a processor.

[0014] The implementation of the present invention has the following beneficial effects:

[0015] The positioning method of the present invention is simple. The initial coordinates of a single positioning point of the PCB board are obtained to optimize and update the preset PCB board positioning model. The PCB board to be processed is automatically positioned through the optimized and updated PCB board positioning model. When the PCB board is automatically positioned successfully, the chip welding work can be carried out through the coordinate data of all the pad points in the PCB board positioning model to improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the crystal bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a flow chart of the positioning control method of the die bonding machine of the present invention;

[0017] Figure 2 1 is a flow chart of the steps of obtaining the initial coordinates of the designated positioning points of the PCB board to be processed according to the present invention:

[0018] Figure 3 It is a flow chart of the steps of constructing the preset PCB board positioning model of the present invention;

[0019] Figure 4 It is a structural schematic diagram of the positioning control system of the die bonding machine of the present invention;

[0020] Figure 5 It is a structural schematic diagram of the initial positioning acquisition module of the present invention;

[0021] Figure 6 It is a structural schematic diagram of a PCB board positioning construction module of the present invention. DETAILED DESCRIPTION

[0022] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.

[0023] like Figure 1 As shown, a specific embodiment of the present invention provides a positioning control method for a die bonding machine, comprising:

[0024] S101, obtaining the initial coordinates of the designated positioning points of the PCB board to be processed;

[0025] It should be noted that when positioning and processing different types of PCBs is performed, the initial coordinates of the designated positioning points of the PCB board of this type are first obtained, and the initial coordinates are used as the starting coordinates of the PCB board of this type.

[0026] S102, importing the initial coordinates into a preset PCB board positioning model to perform coordinate optimization processing to obtain an optimized PCB board positioning model;

[0027] It should be noted that there are corresponding preset PCB board positioning models for different types of PCB boards. When batch processing of any type of PCB boards is required, the corresponding preset PCB board positioning model can be called in advance to achieve the positioning of the corresponding PCB boards. The preset PCB board positioning model includes all positioning points and the marking images of the positioning points of the type of PCB board and the coordinate data of all pad points.

[0028] Specifically, the step of importing the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model includes:

[0029] Step 1: performing difference calculation based on the initial coordinates of the designated positioning point and the starting coordinates of the starting positioning point in the preset PCB board positioning model to obtain positioning difference data;

[0030] Step 2: performing coordinate update optimization on all positioning points and pad points in the preset PCB board positioning model according to the positioning difference data to obtain a PCB board positioning model after coordinate update optimization.

[0031] It should be noted that the initial coordinates (i.e., the starting coordinates) of the designated positioning points of this type of PCB board are imported into the preset PCB positioning model, and the difference calculation is performed between the initial coordinates of the designated coordinate point and the starting coordinates of the corresponding positioning point in the preset PCB positioning model to obtain the positioning difference data between the two, i.e., the coordinate data difference between the two.

[0032] According to the positioning difference data, the coordinate data of all positioning points and pad points in the preset PCB board positioning model are uniformly updated and optimized to obtain the latest coordinate data of the updated and optimized PCB board positioning model and all positioning points and pad points, thereby improving the positioning accuracy of the PCB board, reducing the positioning error, and facilitating the subsequent batch processing of such PCB boards through the latest coordinate data. For example, the initial coordinates of the upper left corner positioning point of the PCB board are (0,2), and the four positioning points in the preset PCB board positioning model are: the coordinates of the upper left corner positioning point are (0,0), the coordinates of the lower left corner positioning point are (0,100), the coordinates of the upper right corner positioning point are (100,0), and the coordinates of the lower right corner positioning point are (100,100); according to the difference calculation between the initial coordinates of the upper left corner positioning point and the upper left corner positioning coordinates in the model, the positioning difference data (0,2) can be obtained, and the coordinates of the positioning points in the preset model are updated and optimized by the positioning difference data, so that the four positioning points obtained are: the coordinates of the upper left corner positioning point are (0,2), the coordinates of the lower left corner positioning point are (0,102), the coordinates of the upper right corner positioning point are (100,2), and the coordinates of the lower right corner positioning point are (100,102), and accordingly, the coordinate data of all pad points are also updated and optimized.

[0033] S103, when the PCB board is positioned and processed, the servo moving mechanism is controlled in sequence to move the corresponding positioning point of the current PCB board to just below the CCD device according to the coordinate data of multiple positioning points in the PCB board positioning model, so as to obtain a marking image of the corresponding positioning point;

[0034] It should be noted that when the PCB board is positioned, the servo moving mechanism is controlled in sequence according to the coordinate data of multiple positioning points (i.e., the positioning points at the four corners of the PCB) in the positioning model of the PCB board to move the corresponding positioning points of the current PCB board to the bottom of the CCD device, so as to collect images of its collection area through the CCD device, thereby obtaining the marked images of the positioning points at the four corners, i.e., the image type of the positioning points of the PCB board. The servo moving mechanism includes servo drive devices in the X-axis direction and the Y-axis direction.

[0035] S104, performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device;

[0036] Specifically, the step of performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device includes:

[0037] Step 1: perform similarity pairing on the marked image of each positioning point acquired by the CCD device and the marked image of the corresponding positioning point in the PCB board positioning model to obtain a similarity pairing result;

[0038] Step 2: determine whether the similarity pairing results of all positioning points are equal to a preset similarity threshold. If so, it indicates that the PCB board positioning calibration is successful. If not, it indicates that the PCB board positioning calibration is unsuccessful, and return to step S101.

[0039] It should be noted that, by performing similarity pairing of the marker image of each currently acquired positioning point with the marker image of the corresponding positioning point in the PCB board positioning model, the similarity pairing result of the positioning points at the corresponding positions is obtained, such as the similarity pairing result between the two upper left corner positioning points. When the similarity pairing results of all positioning points are equal to the preset similarity threshold, it means that the PCB board is successfully positioned, and the subsequent chip welding work can be performed on the pad point of the PCB board. Otherwise, it means that the positioning calibration of the PCB board is unsuccessful, and an alarm signal is issued, and the staff performs maintenance processing and returns to step S101 to re-position the PCB board. Among them, the similarity threshold is preferably 100% to improve the positioning accuracy of the PCB board and ensure the positioning accuracy of the current PCB board, so as to perform high-precision chip welding work on it.

[0040] S105, when the PCB board positioning calibration is successful, chip welding is performed according to the coordinate data of all pad points in the PCB board positioning model.

[0041] Specifically, the step of performing chip welding according to the coordinate data of all pad points in the PCB board positioning model includes:

[0042] Step 1: Controlling the servo moving mechanism in sequence according to the coordinate data of each pad point in the PCB board positioning model to move the corresponding pad point of the PCB board to the position directly below the CCD device;

[0043] Step 2, determine whether the marked image of the pad point obtained by the CCD device is located in the CCD acquisition area. If it is judged to be yes, it means that the pad point positioning calibration is successful, and the chip welding work is performed on the pad point. If it is judged to be no, it means that the pad point positioning calibration is unsuccessful, and return to step S101.

[0044] It should be noted that, generally, when the four positioning points of the PCB board are calibrated successfully, the PCB board is in the correct positioning position. However, in order to further improve the high-precision chip welding work of the pad points and avoid affecting the accuracy of chip welding work due to abnormal electronic control devices or program abnormalities. The present invention sequentially controls a servo moving mechanism to move the corresponding pad point of the PCB board to the position directly below the CCD device according to the coordinate data of each pad point in the PCB board positioning model, and sequentially obtains the mark image of each pad point through the CCD device; since the CCD acquisition area of ​​the CCD device has been adjusted to a suitable range in advance, when the mark image of the pad point is all located within the CCD acquisition area, it means that the pad point positioning calibration is successful, and at this time, the pad point is subjected to high-precision chip welding, and the above positioning calibration and chip welding are sequentially performed on each pad point subsequently, and when the current PCB board positioning processing is completed, the next PCB board executes the step work of steps S103 to S105; otherwise, it means that the pad point positioning calibration is unsuccessful, and an alarm signal is issued, and a staff member performs maintenance processing and returns to steps S101 to S105 until all pad points are successfully positioned and calibrated, and the chip welding work is completed.

[0045] The positioning method of the present invention is simple. The initial coordinates of a single positioning point of a PCB board are obtained to optimize and update a preset PCB board positioning model. The PCB board to be processed is automatically positioned through the optimized and updated PCB board positioning model. When the PCB board is automatically positioned successfully, the pad point calibration detection work and chip welding work can be performed through the coordinate data of all pad points in the PCB board positioning model to improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the die bonding machine.

[0046] like Figure 2 As shown, the step of obtaining the initial coordinates of the designated positioning point of the PCB board to be processed includes:

[0047] S201, obtaining an initial positioning control instruction;

[0048] S202, controlling the servo moving mechanism to drive the PCB board on the workbench to move according to the initial positioning control instruction until the designated positioning point of the PCB board moves to a position directly below the CCD device;

[0049] It should be noted that for batch processing of different types of PCB boards, the staff can input the initial positioning control instructions through the touch device of the crystal display machine in advance, and control the servo moving mechanism through the initial positioning control instructions to drive the PCB board located on the workbench to move, so that the designated positioning point of the PCB board (such as the upper left corner positioning point) is moved to the bottom of the CCD device to locate the starting position of this type of PCB board.

[0050] S203, determine whether the initial mark image of the designated positioning point obtained by the CCD device is located in the CCD acquisition area. If it is judged to be yes, it means that the initial positioning calibration is successful, and the initial coordinates of the designated positioning point are calculated according to the travel data of the servo moving mechanism. If it is judged to be no, it means that the initial positioning calibration is unsuccessful, and the initial positioning work of the designated positioning point is performed again.

[0051] It should be noted that when all the initial mark images acquired by the CCD device are located within the CCD acquisition area, it means that the initial positioning calibration is successful, and the designated positioning point of the PCB board has been moved to the starting coordinate position. The designated positioning point is used as the starting position for the positioning processing of this type of PCB board. The coordinate data of the designated positioning point can be calculated according to the travel data in the X-axis and Y-axis directions fed back by the servo moving mechanism, that is, the starting coordinate data of the starting positioning point of the PCB board; otherwise, it means that the initial positioning calibration is unsuccessful, and an alarm signal is issued. The staff needs to re-perform the initial positioning work of the designated positioning point on this type of PCB board until the accurate starting coordinates of the PCB board are obtained, thereby updating and optimizing the coordinates of the preset PCB board positioning model to obtain the optimized PCB board positioning model.

[0052] like Figure 3 As shown, the steps of constructing the preset PCB board positioning model include:

[0053] S301, obtaining template positioning control instructions;

[0054] S302, controlling the servo moving mechanism to drive the PCB board to move according to the template positioning control instruction, until the multiple positioning points and the multiple designated pad points of the PCB board are successively moved to the position directly below the CCD device;

[0055] It should be noted that for each type of batch processing of PCB boards, the staff can first construct a corresponding PCB board positioning model. Among them, the staff can input the template positioning control command through the touch device of the crystal display machine, and control the servo moving mechanism to drive the PCB board located on the workbench to move through the template positioning control command, so that the multiple positioning points of the PCB board (the positioning points located at the four corners) are successively moved to the bottom of the CCD device and the multiple designated pad points of the PCB board are successively moved to the bottom of the CCD device, so as to obtain the mark image of the corresponding positioning point or pad point through the CCD device, thereby performing the PCB positioning acquisition work.

[0056] S303, judging whether the mark image of the positioning point or pad point acquired by the CCD device is located in the CCD acquisition area, if it is judged to be yes, it means that the positioning point or pad point is successfully positioned, and the coordinate data of the corresponding positioning point or pad point is calculated according to the corresponding stroke data of the servo moving mechanism, if it is judged to be no, it means that the positioning point or pad point is not successfully positioned, and the positioning work of the positioning point or pad point is performed again;

[0057] It should be noted that, when all the marked images of the positioning points acquired by the CCD device are located within the CCD acquisition area, it means that the positioning point is successfully positioned, and the coordinate data of the corresponding positioning point is calculated according to the corresponding travel data of the servo moving mechanism; accordingly, when all the marked images of the pad points acquired by the CCD device are located within the CCD acquisition area, it means that the flipping point is successfully positioned, and the coordinate data of the corresponding pad points are calculated according to the corresponding travel data of the servo moving mechanism; when not all the marked images of the positioning points or pad points acquired by the CCD device are located within the CCD acquisition area, it means that the positioning point or flipping point is not successfully positioned, and an alarm signal is issued at this time. The staff needs to re-enter the positioning control instruction to control the servo moving mechanism to drive the PCB to move and re-position the positioning point or pad point until the positioning point and the pad point are successfully positioned and the corresponding coordinate data are acquired, thereby improving the accuracy of the positioning processing of the PCB board.

[0058] S304, constructing a preset PCB board positioning model according to the coordinate data and the mark image of the successfully positioned positioning point, the coordinate data of the pad point and the preset pad point design rules.

[0059] It should be noted that the pad point design rules include the matrix data of such pad points, the row spacing data and column spacing data between the pad points, and the row and column positions of the specified pad points. The coordinate data of all pad points can be calculated according to the coordinate data of the specified pad points and the preset pad point rules. For example, the matrix data of the pad points in the embodiment of the present invention is (10X10), the spacing data between the pad points is 1 and the column spacing data is 1, and the row and column positions of the pad points of the four specified edge corners are: the row and column positions of the pad points in the upper left corner are (1,1), the row and column positions of the pad points in the lower left corner are (10,1), the row and column positions of the pad points in the upper right corner are (1,10), and the row and column positions of the pad points in the lower right corner are (10,10). According to the coordinate data of the pad points at the four edge corners, the row and column positions of the pad points at the four edge corners, the row and column spacing data and column spacing data between the pad points, and the matrix data of the pad points, the coordinate data of all pad points can be calculated.

[0060] The corresponding preset PCB board positioning model can be constructed through the known coordinate data and mark images of all positioning points and the coordinate data of all pad points. When the PCB board positioning processing is subsequently performed, the preset PCB board positioning model and the starting coordinate data can be used to realize automatic positioning processing, so as to improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the die bonding machine.

[0061] like Figure 4 As shown, the present invention also provides a die bonding machine positioning control system, which is used to implement the above-mentioned die bonding machine positioning control method, including:

[0062] The initial positioning acquisition module 1 is used to obtain the initial coordinates of the designated positioning points of the PCB board to be processed;

[0063] It should be noted that when positioning and processing different types of PCBs is performed, the initial coordinates of the designated positioning points of the PCB board of this type are first obtained, and the initial coordinates are used as the starting coordinates of the PCB board of this type.

[0064] PCB board positioning optimization module 2, used for importing the initial coordinates into a preset PCB board positioning model to perform coordinate optimization processing to obtain an optimized PCB board positioning model;

[0065] It should be noted that there are corresponding preset PCB board positioning models for different types of PCB boards. When batch processing of any type of PCB boards is required, the corresponding preset PCB board positioning model can be called in advance to achieve the positioning of the corresponding PCB boards. The preset PCB board positioning model includes all positioning points and the marking images of the positioning points of the type of PCB board and the coordinate data of all pad points.

[0066] Specifically, the step of importing the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model includes:

[0067] Step 1: performing difference calculation based on the initial coordinates of the designated positioning point and the starting coordinates of the starting positioning point in the preset PCB board positioning model to obtain positioning difference data;

[0068] Step 2: performing coordinate update optimization on all positioning points and pad points in the preset PCB board positioning model according to the positioning difference data to obtain a PCB board positioning model after coordinate update optimization.

[0069] It should be noted that the initial coordinates (i.e., the starting coordinates) of the designated positioning points of this type of PCB board are imported into the preset PCB positioning model, and the difference calculation is performed between the initial coordinates of the designated coordinate point and the starting coordinates of the corresponding positioning point in the preset PCB positioning model to obtain the positioning difference data between the two, i.e., the coordinate data difference between the two.

[0070] According to the positioning difference data, the coordinate data of all positioning points and pad points in the preset PCB board positioning model are uniformly updated and optimized to obtain the latest coordinate data of the updated and optimized PCB board positioning model and all positioning points and pad points, thereby improving the positioning accuracy of the PCB board, reducing the positioning error, and facilitating the subsequent batch processing of such PCB boards through the latest coordinate data. For example, the initial coordinates of the upper left corner positioning point of the PCB board are (0,2), and the four positioning points in the preset PCB board positioning model are: the coordinates of the upper left corner positioning point are (0,0), the coordinates of the lower left corner positioning point are (0,100), the coordinates of the upper right corner positioning point are (100,0), and the coordinates of the lower right corner positioning point are (100,100); according to the difference calculation between the initial coordinates of the upper left corner positioning point and the upper left corner positioning coordinates in the model, the positioning difference data (0,2) can be obtained, and the coordinates of the positioning points in the preset model are updated and optimized by the positioning difference data, so that the four positioning points obtained are: the coordinates of the upper left corner positioning point are (0,2), the coordinates of the lower left corner positioning point are (0,102), the coordinates of the upper right corner positioning point are (100,2), and the coordinates of the lower right corner positioning point are (100,102), and accordingly, the coordinate data of all pad points are also updated and optimized.

[0071] The positioning drive module 3 is used to control the servo moving mechanism to move the corresponding positioning point of the current PCB board to the bottom of the CCD device according to the coordinate data of multiple positioning points in the positioning model of the PCB board during the positioning processing of the PCB board, so as to obtain the marking image of the corresponding positioning point;

[0072] It should be noted that when the PCB board is positioned, the servo moving mechanism is controlled in sequence according to the coordinate data of multiple positioning points (i.e., the positioning points at the four corners of the PCB) in the positioning model of the PCB board to move the corresponding positioning points of the current PCB board to the bottom of the CCD device, so as to collect images of its collection area through the CCD device, thereby obtaining the marked images of the positioning points at the four corners, i.e., the image type of the positioning points of the PCB board. The servo moving mechanism is a servo drive device in the X and Y axis directions.

[0073] A positioning calibration processing module 4 is used to perform PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device;

[0074] Specifically, the step of performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device includes:

[0075] Step 1: perform similarity pairing on the marked image of each positioning point acquired by the CCD device and the marked image of the corresponding positioning point in the PCB board positioning model to obtain a similarity pairing result;

[0076] Step 2: determine whether the similarity pairing results of all positioning points are equal to a preset similarity threshold. If it is determined to be yes, it indicates that the PCB board positioning calibration is successful. If it is determined to be no, it indicates that the PCB board positioning calibration is unsuccessful, and the initial positioning acquisition module is executed again.

[0077] It should be noted that, by performing similarity pairing of the marker image of each currently acquired positioning point with the marker image of the corresponding positioning point in the PCB board positioning model, the similarity pairing result of the positioning points at the corresponding positions is obtained, such as the similarity pairing result between the two upper left corner positioning points. When the similarity pairing results of all positioning points are equal to the preset similarity threshold, it means that the PCB board is successfully positioned, and the subsequent chip welding work can be performed on the pad point of the PCB board. Otherwise, it means that the positioning calibration of the PCB board is unsuccessful, and an alarm signal is issued, and the staff performs maintenance and re-performs the work of all the above modules to re-position the PCB board. Among them, the similarity threshold is preferably 100% to improve the positioning accuracy of the PCB board and ensure the positioning accuracy of the current PCB board, so as to perform high-precision chip welding work on it.

[0078] The positioning processing module 5 performs chip welding according to the coordinate data of all pad points in the positioning model of the PCB board when the positioning and calibration of the PCB board is successful.

[0079] Specifically, the step of performing chip welding according to the coordinate data of all pad points in the PCB board positioning model includes:

[0080] Step 1: Controlling the servo moving mechanism in sequence according to the coordinate data of each pad point in the PCB board positioning model to move the corresponding pad point of the PCB board to the position directly below the CCD device;

[0081] Step 2, determine whether the marked image of the pad point obtained by the CCD device is located in the CCD acquisition area. If it is judged to be yes, it means that the pad point positioning calibration is successful, and the chip welding work is performed on the pad point. If it is judged to be no, it means that the pad point positioning calibration is unsuccessful, and the above model work is repeated.

[0082] It should be noted that, generally, when the four positioning points of the PCB board are calibrated successfully, the PCB board is in the correct positioning position. However, in order to further improve the high-precision chip welding work of the pad points and avoid affecting the accuracy of chip welding work due to abnormal electronic control devices or program abnormalities. The present invention sequentially controls a servo moving mechanism to move the corresponding pad point of the PCB board to the position directly below the CCD device according to the coordinate data of each pad point in the PCB board positioning model, and sequentially obtains the mark image of each pad point through the CCD device; because the CCD acquisition area of ​​the CCD device has been adjusted to a suitable range in advance, when the mark image of the pad point is all located in the CCD acquisition area, it means that the pad point positioning calibration is successful, and at this time, the pad point is subjected to high-precision chip welding, and the positioning calibration and chip welding work are sequentially performed on each pad point subsequently; when the current PCB board positioning processing is completed, the next PCB board executes the work of the positioning driving module, the positioning calibration processing module and the positioning processing module; otherwise, it means that the pad point positioning calibration is unsuccessful, and an alarm signal is issued, and a staff member performs maintenance processing and re-performs the work of all the above modules until all pad points are successfully positioned and calibrated, and the chip welding work is completed.

[0083] like Figure 5 As shown, the initial positioning acquisition module 1 includes:

[0084] An initial positioning acquisition unit 11 is used to acquire an initial positioning control instruction;

[0085] An initial positioning driving unit 12, used for controlling the servo moving mechanism to drive the PCB board located on the workbench to move according to the initial positioning control instruction, until the designated positioning point of the PCB board moves to the position directly below the CCD device;

[0086] It should be noted that for batch processing of different types of PCB boards, the staff can input the initial positioning control instructions through the touch device of the crystal display machine in advance, and control the servo moving mechanism through the initial positioning control instructions to drive the PCB board located on the workbench to move, so that the designated positioning point of the PCB board (such as the upper left corner positioning point) is moved to the bottom of the CCD device to locate the starting position of this type of PCB board.

[0087] The initial positioning calibration processing unit 13 is used to determine whether the initial mark image of the designated positioning point obtained by the CCD device is located in the CCD acquisition area. If it is determined to be yes, it indicates that the initial positioning calibration is successful, and the initial coordinates of the designated positioning point are calculated based on the travel data of the servo moving mechanism. If it is determined to be no, it indicates that the initial positioning calibration is unsuccessful, and the initial positioning work of the designated positioning point is performed again.

[0088] It should be noted that when all the initial mark images acquired by the CCD device are located within the CCD acquisition area, it means that the initial positioning calibration is successful, and the designated positioning point of the PCB board has been moved to the starting coordinate position. The designated positioning point is used as the starting position for the positioning processing of this type of PCB board. The coordinate data of the designated positioning point can be calculated according to the travel data in the X-axis and Y-axis directions fed back by the servo moving mechanism, that is, the starting coordinate data of the starting positioning point of the PCB board; otherwise, it means that the initial positioning calibration is unsuccessful, and an alarm signal is issued. The staff needs to re-perform the initial positioning work of the designated positioning point on this type of PCB board until the accurate starting coordinates of the PCB board are obtained, thereby updating and optimizing the coordinates of the preset PCB board positioning model to obtain the optimized PCB board positioning model.

[0089] like Figure 6 As shown, the PCB board positioning optimization module includes a PCB board positioning construction module 6, and the PCB board positioning construction module 6 includes:

[0090] A positioning acquisition unit 61, used to acquire a template positioning control instruction;

[0091] A positioning drive unit 62, used for controlling the servo moving mechanism to drive the PCB board to move according to the template positioning control instruction, until the multiple positioning points and the multiple designated pad points of the PCB board are successively moved to the position directly below the CCD device;

[0092] It should be noted that for each type of batch processing of PCB boards, the staff can first construct a corresponding PCB board positioning model. Among them, the staff can input the template positioning control command through the touch device of the crystal display machine, and control the servo moving mechanism to drive the PCB board located on the workbench to move through the template positioning control command, so that the multiple positioning points of the PCB board (the positioning points located at the four corners) are successively moved to the bottom of the CCD device and the multiple designated pad points of the PCB board are successively moved to the bottom of the CCD device, so as to obtain the mark image of the corresponding positioning point or pad point through the CCD device, thereby performing the PCB positioning acquisition work.

[0093] The positioning calibration processing unit 63 is used to determine whether the mark image of the positioning point or pad point acquired by the CCD device is located in the CCD acquisition area. If it is determined to be yes, it means that the positioning point or pad point is successfully positioned, and the coordinate data of the corresponding positioning point or pad point is calculated according to the corresponding stroke data of the servo moving mechanism. If it is determined to be no, it means that the positioning point or pad point is not successfully positioned, and the positioning work of the positioning point or pad point is performed again;

[0094] It should be noted that, when all the marked images of the positioning points acquired by the CCD device are located within the CCD acquisition area, it means that the positioning point is successfully positioned, and the coordinate data of the corresponding positioning point is calculated according to the corresponding travel data of the servo moving mechanism; accordingly, when all the marked images of the pad points acquired by the CCD device are located within the CCD acquisition area, it means that the flipping point is successfully positioned, and the coordinate data of the corresponding pad points are calculated according to the corresponding travel data of the servo moving mechanism; when not all the marked images of the positioning points or pad points acquired by the CCD device are located within the CCD acquisition area, it means that the positioning point or flipping point is not successfully positioned, and an alarm signal is issued at this time. The staff needs to re-enter the positioning control instruction to control the servo moving mechanism to drive the PCB to move and re-position the positioning point or pad point until the positioning point and the pad point are successfully positioned and the corresponding coordinate data are acquired, thereby improving the accuracy of the positioning processing of the PCB board.

[0095] The positioning construction unit 64 is used to construct a preset PCB board positioning model according to the coordinate data and mark image of the positioning point that is successfully positioned, the coordinate data of the pad point and the preset pad point design rules.

[0096] It should be noted that the pad point design rules include the matrix data of such pad points, the row spacing data and column spacing data between the pad points, and the row and column positions of the specified pad points. The coordinate data of all pad points can be calculated according to the coordinate data of the specified pad points and the preset pad point rules. For example, the matrix data of the pad points in the embodiment of the present invention is (10X10), the spacing data between the pad points is 1 and the column spacing data is 1, and the row and column positions of the pad points of the four specified edge corners are: the row and column positions of the pad points in the upper left corner are (1,1), the row and column positions of the pad points in the lower left corner are (10,1), the row and column positions of the pad points in the upper right corner are (1,10), and the row and column positions of the pad points in the lower right corner are (10,10). According to the coordinate data of the pad points at the four edge corners, the row and column positions of the pad points at the four edge corners, the row and column spacing data and column spacing data between the pad points, and the matrix data of the pad points, the coordinate data of all pad points can be calculated.

[0097] The corresponding preset PCB board positioning model can be constructed through the known coordinate data and mark images of all positioning points and the coordinate data of all pad points. When the PCB board positioning processing is subsequently performed, the preset PCB board positioning model and the starting coordinate data can be used to realize automatic positioning processing, so as to improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the die bonding machine.

[0098] The present invention also provides a computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above method when executing the computer program.

[0099] The present invention also provides a computer-readable storage medium on which a computer program is stored, and the computer program implements the steps of the above method when executed by a processor.

[0100] In summary, the positioning method of the present invention is simple. The initial coordinates of a single positioning point of the PCB board are obtained to optimize and update the preset PCB board positioning model. The PCB board to be processed is automatically positioned through the optimized and updated PCB board positioning model. When the PCB board is automatically positioned successfully, the pad point calibration and detection work and chip welding work can be performed through the coordinate data of all pad points in the PCB board positioning model to improve the positioning processing efficiency and reduce the positioning error rate, thereby improving the production efficiency of the die bonding machine.

[0101] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A positioning control method for a die bonding machine, characterized in that: include: S101, obtaining the initial coordinates of the designated positioning points of the PCB board to be processed; S102, importing the initial coordinates into a preset PCB board positioning model to perform coordinate optimization processing to obtain an optimized PCB board positioning model; S103, when the PCB board is positioned and processed, the servo moving mechanism is controlled in sequence to move the corresponding positioning point of the current PCB board to just below the CCD device according to the coordinate data of multiple positioning points in the PCB board positioning model, so as to obtain a marking image of the corresponding positioning point; S104, performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device; S105, when the PCB board positioning calibration is successful, chip welding is performed according to the coordinate data of all pad points in the PCB board positioning model.

2. The positioning control method of a die bonding machine according to claim 1, characterized in that: The step of obtaining the initial coordinates of the designated positioning points of the PCB board to be processed comprises: Get initial positioning control instructions; Controlling the servo moving mechanism to drive the PCB board on the workbench to move according to the initial positioning control instruction until the designated positioning point of the PCB board moves to a position directly below the CCD device; Determine whether the initial mark image of the designated positioning point acquired by the CCD device is located within the CCD acquisition area. If it is determined to be yes, it indicates that the initial positioning calibration is successful. Calculate the initial coordinates of the designated positioning point based on the travel data of the servo moving mechanism. If it is determined to be no, it indicates that the initial positioning calibration is unsuccessful. Perform the initial positioning of the designated positioning point again.

3. The positioning control method of a die bonding machine according to claim 1, characterized in that: The steps of constructing the preset PCB board positioning model include: Get template positioning control instructions; Controlling the servo moving mechanism to drive the PCB to move according to the template positioning control instruction until the multiple positioning points and the multiple designated pad points of the PCB move to the position directly below the CCD device in sequence; Determine whether the mark image of the positioning point or pad point acquired by the CCD device is located in the CCD acquisition area. If it is determined to be yes, it means that the positioning point or pad point is successfully positioned, and calculate the coordinate data of the corresponding positioning point or pad point according to the corresponding stroke data of the servo moving mechanism. If it is determined to be no, it means that the positioning point or pad point is not successfully positioned, and the positioning work of the positioning point or pad point is performed again; A preset PCB board positioning model is constructed based on the coordinate data and mark image of the successfully positioned positioning point, the coordinate data of the pad point and the preset pad point design rules.

4. The positioning control method of a die bonding machine according to claim 1, characterized in that: The step of importing the initial coordinates into a preset PCB board positioning model for coordinate optimization processing to obtain an optimized PCB board positioning model comprises: Perform difference calculation based on the initial coordinates of the designated positioning point and the starting coordinates of the starting positioning point in the preset PCB board positioning model to obtain positioning difference data; The coordinates of all the positioning points and pad points in the preset PCB board positioning model are updated and optimized according to the positioning difference data to obtain the PCB board positioning model after the coordinates are updated and optimized.

5. The positioning control method of a die bonding machine according to claim 1, characterized in that: The step of performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device includes: Performing similarity pairing on the marked image of each positioning point acquired by the CCD device and the marked image of the corresponding positioning point in the PCB board positioning model to obtain a similarity pairing result; It is determined whether the similarity pairing results of all positioning points are equal to the preset similarity threshold. If it is determined to be yes, it indicates that the PCB board positioning calibration is successful. If it is determined to be no, it indicates that the PCB board positioning calibration is unsuccessful, and the process returns to step S101.

6. The positioning control method of a die bonding machine according to claim 1, characterized in that: The step of performing chip welding according to the coordinate data of all pad points in the PCB board positioning model comprises: Controlling the servo moving mechanism in sequence according to the coordinate data of each pad point in the PCB board positioning model to move the corresponding pad point of the PCB board to a position directly below the CCD device; Determine whether the marked image of the pad point obtained by the CCD device is located in the CCD acquisition area. If it is determined to be yes, it means that the pad point positioning calibration is successful, and chip welding is performed on the pad point. If it is determined to be no, it means that the pad point positioning calibration is unsuccessful, and return to step S101.

7. The positioning control method of a die bonding machine according to claim 3, characterized in that: The pad point design rule includes matrix data of the pad points, row spacing data and column spacing data between the pad points, and row and column positions of designated pad points.

8. A positioning control system for a die bonding machine, characterized in that: A method for controlling the positioning of a die bonder according to any one of claims 1 to 7, comprising: An initial positioning acquisition module is used to obtain the initial coordinates of a designated positioning point of the PCB board to be processed; A PCB board positioning optimization module is used to import the initial coordinates into a preset PCB board positioning model to perform coordinate optimization processing to obtain an optimized PCB board positioning model; A positioning drive module is used to control the servo moving mechanism to move the corresponding positioning point of the current PCB board to the bottom of the CCD device according to the coordinate data of multiple positioning points in the positioning model of the PCB board during the positioning processing of the PCB board, so as to obtain a marking image of the corresponding positioning point; A positioning calibration processing module, used for performing PCB positioning calibration according to the mark images of multiple positioning points acquired by the CCD device; The positioning processing module performs chip welding according to the coordinate data of all pad points in the PCB board positioning model when the PCB board positioning calibration is successful.

9. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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