Probe unit manufacturing method, probe unit, probe mounting body, and electrical inspection device

Abstract

A method for manufacturing a probe unit according to one embodiment of the present invention is a method for manufacturing a probe unit which is mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit board and which is provided with a probe (11) capable of coming into contact with the surface of the electronic circuit board, using a base (10) having a positioning mechanism for determining the position in the electrical inspection device, the relative position and orientation of the tip of the probe (11) with respect to the base (10) are adjusted, and the probe (11) is fixed to the base (10) while the relative position is maintained.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a probing unit, a probing unit, a probe mounting body and an electrical inspection device. Background Art

[0002] An electrical inspection device is used to inspect the electrical characteristics of a printed circuit board. For example, a device including a probe capable of contacting the surface of an electronic circuit board and a microscope capable of magnifying and observing the vicinity of the tip of the probe (see Japanese Patent Application Laid-Open No. 4-158541).

[0003] In this conventional electrical inspection device, after the probe is brought close to the surface of the electronic circuit board, the tip of the probe is positioned so as to appropriately contact with a predetermined electrode on the electronic circuit board while being observed with a microscope. In the electrical inspection device, a two-wire probe is mounted on the tip of a positioner responsible for the positioning via an accessory, and the accessory has a rotating mechanism for rotating the two-wire probe around a plumb line. The electrical inspection device can perform accurate and efficient detection by means of the rotating mechanism.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: (Japanese) Patent Publication No. 4-158541 Summary of the invention

[0007] Technical problem to be solved by the invention

[0008] In the above-mentioned conventional electrical inspection device, since the positioning operation is directly performed on the actual electronic circuit substrate mounted on the electrical inspection device, there is a case where the probes are pressed against the substrate, which may cause unnecessary damage to the substrate.

[0009] Furthermore, due to positioning on the electrical inspection device, the electrical inspection device may not be able to perform electrical measurements that are originally intended, which may reduce the operating rate of the device.

[0010] The present invention is made based on such circumstances, and an object of the present invention is to provide a method for manufacturing a probe unit, a probe unit, a probe head mounting body, and an electrical inspection device in which the tip of a probe can be positioned with high accuracy and does not require positioning on an electrical inspection device.

[0011] Technical solutions for solving technical problems

[0012] In a manufacturing method of a probe unit according to one embodiment of the present invention, the probe unit is mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit substrate and is provided with a probe capable of contacting the surface of the electronic circuit substrate. The method is characterized in that a base having a positioning mechanism for determining a position in the electrical inspection device is used to adjust the relative position and posture of the front end of the probe relative to the base, maintain the relative position and fix the probe to the base.

[0013] A probing unit according to another embodiment of the present invention can be mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, and is characterized in that it comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; the base having: a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe; and a fixing mechanism capable of fixing the position and posture of the front end of the probe at a desired position.

[0014] A probe mounting body of another embodiment of the present invention can be installed in an electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, and is characterized in that it comprises a probing unit and a probe mounting base for fixing the probing unit, wherein the probing unit comprises: a base having a positioning mechanism for determining the position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; and the probe mounting base having a positioning object of the positioning mechanism.

[0015] An electrical inspection device according to another embodiment of the present invention inspects the electrical characteristics of an electronic circuit substrate, and is characterized in that it comprises a probing unit and an inspection head for fixing the probing unit, wherein the probing unit comprises: a base having a positioning mechanism for determining the position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; and the inspection head having a positioning object for the positioning mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic perspective view showing a probe unit according to an embodiment of the present invention.

[0017] Figure 2 Yes means Figure 1 Schematic enlarged view of the front end portion of the probe.

[0018] Figure 3 It means it is equipped with Figure 1 A schematic three-dimensional view of a probe mounting body of a probing unit.

[0019] Figure 4This is a flowchart showing a method for manufacturing a probe unit according to one embodiment of the present invention.

[0020] Figure 5 It means manufacturing Figure 1 Schematic perspective view of a positioning fixture used when probing a unit.

[0021] Figure 6 It means that Figure 1 The detection unit is set at Figure 5 A schematic three-dimensional diagram of the state of the positioning fixture.

[0022] Figure 7 It means Figure 1 Schematic perspective views of various embodiments of the scanning unit.

[0023] Figure 8 Yes means Figure 7 A schematic partial perspective view of a probe unit in the middle of manufacturing. DETAILED DESCRIPTION

[0024] In a manufacturing method of a probe unit according to one embodiment of the present invention, the probe unit is mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit substrate and is provided with a probe capable of contacting the surface of the electronic circuit substrate. The method is characterized in that a base having a positioning mechanism for determining a position in the electrical inspection device is used to adjust the relative position and posture of the front end of the probe relative to the base, maintain the relative position and fix the probe to the base.

[0025] In the manufacturing method of the probe unit of the present invention, since the base has a positioning mechanism for determining the position in the electrical inspection device, the position of the base on the electrical inspection device is not easily offset. Moreover, in the manufacturing method of the probe unit, the relative position and posture of the front end of the probe are adjusted and fixed relative to the base. Therefore, if the manufacturing method of the probe unit is used, as long as the base is mounted on the electrical inspection device, the front end of the probe can be pre-positioned in a manner that can contact the surface of the electronic circuit substrate, and there is no need to position the front end of the probe on the electrical inspection device.

[0026] The probe may be fixed using an adhesive.

[0027] It may be that when adjusting the relative position and posture of the front end of the probe, a positioning fixture is used that can position and fix the base through the positioning mechanism, and the positioning fixture has a position adjustment mark for adjusting the relative position and posture of the front end of the probe with respect to the base.

[0028] The position adjustment mark may be an electrical pattern having a known impedance, and when the relative position and posture of the tip of the probe are adjusted, the relative position and posture are adjusted so that the impedance measured by the probe approaches the known value.

[0029] It may be that the base has: a position adjustment mechanism, which can adjust the position and posture of the front end of the probe; a fixing mechanism, which can fix the position and posture of the front end of the probe at a desired position; the positioning fixture has a micro-motion mechanism for controlling the position adjustment mechanism, and when the relative position and posture of the front end of the probe are adjusted, the position adjustment mechanism is controlled by the micro-motion mechanism.

[0030] A probing unit according to another embodiment of the present invention can be mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, and is characterized in that it comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; the base having: a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe; and a fixing mechanism capable of fixing the position and posture of the front end of the probe at a desired position.

[0031] A probe mounting body of another embodiment of the present invention can be installed in an electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, and is characterized in that it comprises a probing unit and a probe mounting base for fixing the probing unit, wherein the probing unit comprises: a base having a positioning mechanism for determining the position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; and the probe mounting base having a positioning object of the positioning mechanism.

[0032] The positioning object may be a convex portion protruding from the surface of the probe mounting base, and the positioning mechanism may be a concave portion or a through hole that fits with the convex portion.

[0033] The base may include: a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe;

[0034] A fixing mechanism can fix the position and posture of the front end of the probe at a desired position.

[0035] The detection unit may be detachable relative to the probe mounting base.

[0036] Another embodiment of the electrical inspection device of the present invention inspects the electrical characteristics of an electronic circuit substrate, and is characterized in that it has a probing unit and an inspection head for fixing the probing unit, wherein the probing unit has: a base having a positioning mechanism for determining the position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; and the inspection head having a positioning object of the positioning mechanism.

[0037] The positioning object may be a convex portion protruding from the surface of the inspection head, and the positioning mechanism may be a concave portion or a through hole that fits with the convex portion.

[0038] The base may include: a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe; and a fixing mechanism capable of fixing the position and posture of the front end of the probe at a desired position.

[0039] The detection unit may be detachable relative to the inspection head.

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. It should be noted that, regarding the numerical values ​​described in this specification, only one of the upper limit value and the lower limit value described may be adopted, or the upper limit value and the lower limit value may be arbitrarily combined.

[0041] [First embodiment]

[0042] A method for manufacturing a probe unit according to an embodiment of the present invention is a method for manufacturing a probe unit mounted in an electrical inspection device for inspecting electrical characteristics of an electronic circuit board. First, a probe unit manufactured by the method for manufacturing a probe unit and which is another embodiment of the present invention will be described.

[0043] [Exploration Unit]

[0044] Figure 1 The probe unit 1 shown is a probe unit that can be mounted on an electrical inspection device that inspects electrical characteristics of an electronic circuit board. The probe unit 1 includes a base 10 and a probe pin 11 .

[0045] like Figure 1 As shown, the base 10 has a rectangular and plate-shaped base 12 in a plan view, a first block 13 stacked on the base 12, a second block 14 stacked on the first block 13, a third block 15 stacked on the second block 14, and a fourth block 16 stacked on the third block 15.

[0046] In addition, the probe 11 is fixed to the base 10 and can contact the surface of the electronic circuit substrate. In the probe unit 1, the probe 11 is fixed to the fourth block 16 of the base 10. Figure 2As shown, the probe 11 has a signal probe 11a and a pair of ground probes 11b arranged across the signal probe 11a at its front end. The three probes in total contact the surface of the electronic circuit substrate to inspect the electrical characteristics. It should be noted that the number of probes is an example, and in the present invention, the number of probes is not limited to 3.

[0047] In the detection unit 1, the base 10 has: a positioning mechanism that determines the position in the electrical inspection device; a position adjustment mechanism that can adjust the position and posture of the front end of the probe 11; and a fixing mechanism that can fix the position and posture of the front end of the probe 11 at a desired position.

[0048] (Positioning mechanism)

[0049] The positioning mechanism is formed on the base 12 of the base 10. Specifically, Figure 1 As shown, the positioning mechanism is composed of a pair of through holes 12a. The through holes 12a engage with the protrusions 21 in the probe mounting body 2 or the protrusions in the electrical inspection device described later. It should be noted that the positioning mechanism may also be a recessed portion that engages with the protrusions instead of the through holes 12a.

[0050] The positioning mechanism can also be implemented by one through hole 12a. However, in the case of being implemented by one through hole 12a, the base 10 becomes easy to rotate after positioning. A method of suppressing rotation by making the top view shape of the through hole 12a a polygon (for example, a triangle or a quadrilateral) can be considered, but it is preferred to provide a plurality of through holes 12a. By providing a plurality of through holes 12a, the rotation of the base 10 can be more reliably suppressed. Among them, it is more preferred to provide the positioning mechanism as a pair of through holes 12a. If it is composed of more than three through holes 12a, the base 10 becomes larger and the operability of the exploration unit 1 may decrease.

[0051] It should be noted that if the base 10 is simply fitted into the protrusion, the base 10 may be detached due to force majeure during inspection, so the base 10 preferably has a mechanism for fixing it so as not to be detached from the electrical inspection device, for example, by a base fixing screw 12c.

[0052] (Position adjustment mechanism)

[0053] In the probe unit 1, the position adjustment mechanism is composed of a combination of a base body 12 and first to fourth blocks 13 to 16. The structure will be described below.

[0054] On the base 12, a first guide rail portion 12b extending in the width direction is provided on one side of the stacked first module 13, and a first cutout 13a engaged with the first guide rail portion 12b is provided on the first block 13. Through the engagement of the two, the first block 13 can move in the width direction of the base 12 and can be adjusted in the width direction relative to the base 12. The second block 14 to the fourth block 16 are directly or indirectly stacked on the first block 13, so the first block 13 to the fourth block 16 as a whole can be adjusted in the width direction relative to the base 12. As a result, the probe 11 fixed to the fourth block 16 can also be adjusted in the width direction relative to the base 12.

[0055] A second rail portion 13b extending in the length direction of the substrate 12 is provided on one side of the first block 13 on which the second block 14 is stacked, and a second notch 14a engaged with the second rail portion 13b is provided in the second block 14. Through the engagement of the two, the second block 14 can move in the length direction of the substrate 12 and can be adjusted in the length direction relative to the substrate 12. The third block 15 and the fourth block 16 are directly or indirectly stacked on the second block 14, so that the second block 14 to the fourth block 16 as a whole can be adjusted in the length direction relative to the substrate 12. As a result, the probe 11 fixed to the fourth block 16 can also be adjusted in the length direction relative to the substrate 12.

[0056] The second block 14 is provided with a protrusion 14b protruding in the longitudinal direction of the substrate 12. The third block 15 is stacked on the protrusion 14b. The stacking surface of the protrusion 14b on which the third block 15 is stacked is an arched shape with a central bulge relative to the width direction of the substrate 12. The third block 15 can slide on the stacking surface relative to the width direction of the substrate 12, and if the third block 15 is slid, the third block 15 can be tilted relative to the width direction of the substrate 12. This tilting causes the probe 11 to rotate around its central axis via the fourth block 16, and can adjust the contact state of a signal probe 11a and a pair of ground probes 11b with the surface (needle contact position) of the electronic circuit substrate.

[0057] The center axis of the arch (the imaginary center axis of the stacking surface) is preferably located on a plane that passes through the front end of the probe 11 and is parallel to the bottom surface of the substrate 12, and is arranged parallel to the guide rail of the second guide rail portion 13b. By constructing the stacking surface in this way, the contact state of the probe 11 can be adjusted with the front end of the probe 11 as the center, so that the change in the coordinate position of the front end of the probe 11 can be reduced. That is, the coordinate position and contact state of the front end of the probe 11 can be adjusted independently, so the position adjustment of the probe 11 can be easily performed. In addition, the "front end" includes its vicinity in addition to the accurate front end position. In addition, "parallel" includes, in addition to accurate parallelism, for example, the case of an inclination of less than ±3 degrees.

[0058] Through the above structure, the probe 11 can be adjusted in the width direction and the length direction relative to the base 12, and the contact state with the surface of the electronic circuit substrate can be adjusted. In addition, when it is necessary to adjust the height direction relative to the base 12, for example, the adjustment can be performed by inserting an adjustment plate of the desired height between the third block 15 and the fourth block 16.

[0059] (Fixed mechanism)

[0060] In the exploration unit 1, the fixing mechanism is composed of fixing screws. Specifically, the fixing mechanism is composed of a first fixing screw 13c that fixes the first block 13 to the base 12, a second fixing screw 14c that fixes the second block 14 to the first block 13, a third fixing screw 15c that fixes the third block 15 to the second block 14, and a fourth fixing screw 16c that fixes the fourth block 16 to the third block 15.

[0061] For example, when the first fixing screw 13 c is loosened, the position of the first block 13 can be adjusted relative to the base 12 , and when the first fixing screw 13 c is tightened, the first block 13 is fixed relative to the base 12 and cannot move.

[0062] Each fixing screw may be provided in multiple numbers according to the size of the block to be fixed, etc. Figure 1 The probe unit 1 shown is provided with two first fixing screws 13c.

[0063] The probe unit 1 can adjust the position and posture of the front end of the probe 11 in advance, so it is not necessary to readjust the position and posture of the front end of the probe 11 after being installed in the electrical inspection device.

[0064] [Probe mounting body]

[0065] like Figure 3 As shown, the probe unit 1 can be mounted on an electrical inspection device via a probe mounting body 2. The probe mounting body 2 is another embodiment of the present invention.

[0066] The probe mounting body 2 is a probe mounting body that can be mounted on an electrical inspection device for inspecting the electrical characteristics of an electronic circuit board Y. The probe mounting body 2 is, for example, Figure 3 As shown, the probe can be mounted on a probe mounting body mounting portion X of an electrical inspection device to inspect the electrical characteristics of an electronic circuit board Y.

[0067] The probe mounting body 2 includes a probe unit 1 and a probe mounting base 20 to which the probe unit 1 is fixed.

[0068] <Exploration Unit>

[0069] As mentioned above, the probe unit 1 is Figure 1The probe unit of the present invention is shown. That is, the probe unit 1 comprises: a base 10 having a positioning mechanism for determining the position in the electrical inspection device; a probe 11, which is fixed to the base 10 and can contact the surface of the electronic circuit substrate Y. In addition, the base 10 has: a position adjustment mechanism that can adjust the position and posture of the front end of the probe 11; a fixing mechanism that can fix the position and posture of the front end of the probe 11 at a desired position. The positioning mechanism, the position adjustment mechanism and the fixing mechanism can be Figure 1 The probe unit 1 shown is constructed in the same manner, so a detailed description thereof will be omitted.

[0070] The probing unit 1 can easily finely adjust the position and posture of the tip of the probe 11 , so that the relative position and posture of the probe mounting body 2 and even the electrical inspection device can be adjusted with high accuracy and efficiency.

[0071] Preferably, the probe unit 1 can be detached from the probe mounting base 20. Figure 3 The probe mounting body 2 shown in the figure can carry up to twelve probe units 1. Figure 3 Six of the probe units 1 are mounted in the probe mounting body 20. If the probe unit 1 is detachable, the mounting position and number of the probe units 1 can be changed according to the structure of the electronic circuit substrate Y while using the same probe mounting base 20. Therefore, one probe mounting body 2 can be used to handle a variety of electronic circuit substrates Y.

[0072] <Probe mounting base>

[0073] The probe mounting base 20 is provided with a positioning target of the positioning mechanism. Figure 1 The positioning mechanism of the detection unit 1 shown is a through hole 12a, and the positioning object is Figure 3 As shown, the convex portion 21 protrudes from the surface of the probe mounting base 20, and the through hole 12a fits into the convex portion 21. By configuring the positioning mechanism and the positioning object in this way, positioning can be easily performed, and the probe unit 1 can be mounted on the probe mounting base 20 with high accuracy.

[0074] In addition, the probe mounting base 20 has a threaded hole 22 for fixing the probe unit 1. By tightening the base fixing screw 12c in the threaded hole 22, the base 10 of the probe unit 1 is fixed to the probe mounting base 20, and the probe unit 1 can be prevented from being separated from the probe mounting base 20 due to force majeure during inspection.

[0075] like Figure 3As shown, in the probe mounting body 2, the electronic circuit board Y is located on the side of the probe mounting base 20 opposite to the surface on which the probe unit 1 is mounted. Therefore, the probe mounting base 20 has a contact hole 23, so that the probe 11 passes through the contact hole 23 and contacts the surface of the electronic circuit board Y. It should be noted that Figure 3 In the probe mounting body 2 shown, one contact hole 23 is prepared for each probe unit 1, but one contact hole 23 may be prepared for a plurality of probe units 1. In this case, the contact holes 23 are prepared for a plurality of probe units 1, and a plurality of probes 11 are inserted through one contact hole 23 in parallel.

[0076] When the probe unit 1 of the present invention is mounted on an electrical inspection device, a positioning target having the positioning mechanism is required. However, by mounting the probe unit 1 on the electrical inspection device via the probe mounting body 2, the probe unit 1 of the present invention can be mounted on an existing electrical inspection device that does not have a positioning target.

[0077] [Manufacturing method of the probe unit]

[0078] This method of manufacturing a probe unit is a method of manufacturing a probe unit including a probe needle 11 capable of contacting a surface of an electronic circuit board, and uses a base 10 having a positioning mechanism for determining a position in the electrical inspection device.

[0079] like Figure 4 As shown, the manufacturing method of the probe unit adjusts the relative position and posture of the tip of the probe 11 with respect to the base 10 ( S1 ), and fixes the probe 11 to the base 10 while maintaining the relative position ( S2 ).

[0080] <S1>

[0081] In the manufacturing method of the probe unit, if Figure 5 and Figure 6 As shown, when the relative position and posture of the front end of the probe 11 are adjusted, a positioning fixture 3 is used which can position and fix the base 10 through the positioning mechanism.

[0082] The positioning fixture 3 has a fixture base 30, a positioning object (protrusion 31) of the positioning mechanism of the detection unit 1, a micro-motion mechanism (a first micrometer 33, a second micrometer 34 and a third micrometer 35) for controlling the position adjustment mechanism of the detection unit 1, and a position adjustment mark 36 for adjusting the relative position and posture of the front end of the probe 11 relative to the base 10 (the positioning mechanism of the base 10).

[0083] (Location object)

[0084] The positioning object simulates a positioning object used when the probe unit 1 is mounted on an electrical inspection device. Figure 3 In the case of the probe mounting body 2 shown, the positioning object provided in the positioning fixture 3 is the same structure as the positioning object provided in the probe mounting body 2. That is, the positioning object provided in the positioning fixture 3 is a convex portion 31 protruding from the surface of the fixture base 30, and the through hole 12a is fitted into the convex portion 31. In addition, since the probe mounting base 20 has a threaded hole 22 for fixing the probe unit 1, the threaded hole 32 for fixing the probe unit 1 is also provided in the fixture base 30.

[0085] (Micro-motion mechanism)

[0086] The micro-motion mechanism Figure 5 and Figure 6 The positioning fixture 3 shown is composed of a first micrometer 33, a second micrometer 34 and a third micrometer 35. In the manufacturing method of the detection unit, when the relative position and posture of the front end of the probe 11 are adjusted, the position adjustment mechanism is controlled by the micro-motion mechanism. By using the micro-motion mechanism in this way, the position and posture of the front end of the probe 11 are easily fine-tuned, so the relative position and posture can be adjusted with high precision and efficiency.

[0087] The tip of the first micrometer 33 contacts the side surface of the first block 13 of the base 10 of the probe unit 1 and can press the first block 13 in the width direction of the base 12. Thus, the tip of the probe 11 can be slightly moved in the width direction of the base 12.

[0088] The tip of the second micrometer 34 contacts the rear surface of the second block 14 of the base 10 of the probe unit 1 and can press the second block 14 in the longitudinal direction of the base 12. Thus, the tip of the probe 11 can be slightly moved in the longitudinal direction of the base 12.

[0089] The front end of the third micrometer 35 contacts the side surface of the third block 15 of the base 10 of the probe unit 1, and can press the third block 15 in the width direction of the base 12. As described above, the stacking surface of the protrusion 14b on which the third block 15 is stacked is an arched shape with a central bulge relative to the width direction of the base 12, so when the third block 15 is pressed by the third micrometer 35, the probe 11 can be rotated around its central axis.

[0090] As described above, by using the micro-motion mechanism, the relative position of the front end of the probe 11 can be adjusted by using the first micrometer 33 and the second micrometer 34, and the posture of the front end of the probe 11 can be adjusted by using the third micrometer 35. Figure 1In the embodiment shown, each micrometer is configured to be adjusted by pressing each block, but each micrometer may also be configured to be pushable and pullable. By adopting a pushable and pullable structure, position adjustment can be made easier.

[0091] (Position adjustment mark)

[0092] The position adjustment mark 36 is arranged in such a manner that the relative position observed from the positioning object becomes the same relative position as the needle contact position on the surface of the electronic circuit substrate observed from the positioning object in the electrical inspection device. By arranging in this manner, if the probe unit 1 whose relative position and posture of the front end of the probe 11 are adjusted on the positioning fixture 3 so that the probe 11 properly contacts the position adjustment mark 36 is mounted on the electrical inspection device, the probe 11 properly contacts the surface of the electronic circuit substrate without adjusting the position and posture again. Therefore, by using the positioning fixture 3, the front end of the probe 11 can be positioned with high precision before the probe unit 1 is mounted on the electrical inspection device.

[0093] like Figure 2 As shown in the figure, a position adjustment mark 36 is prepared for each probe. The smaller the size of the position adjustment mark 36, the higher the adjustment accuracy. However, if the position adjustment mark 36 is small, the adjustment itself becomes difficult. Therefore, the position adjustment mark 36 adopts the minimum adjustable size. For example, the position adjustment mark 36 can be set to a rectangle with a width of 0.1 mm or more and 0.2 mm or less and a length of 0.3 mm or more and 0.5 mm or less.

[0094] In S1 , the relative position and posture of the tip of the probe 11 are adjusted so that the tip of the probe 11 is in proper contact with the position adjustment mark 36 . This adjustment can be performed while visually observing the tip of the probe 11 with a microscope, for example.

[0095] In order to adjust with higher accuracy, an electrical pattern with known impedance can be used as the position adjustment mark 36. In this case, when adjusting the relative position and posture of the tip of the probe 11, the relative position and posture can be adjusted so that the impedance measured by the probe 11 approaches the known value.

[0096] When a known impedance is measured by the probe unit 1 whose relative position and posture are accurately adjusted, the measurement result should be a known value. If the relative position and posture are adjusted so that the impedance approaches the known value using this principle, the high-precision adjustment can be compensated.

[0097] The electrical pattern may be one, but by preparing a plurality of them and sequentially replacing them to confirm the impedance measured by the probe 11, a more accurate adjustment can be made. When using a plurality of electrical patterns, the relative position and posture can be adjusted with the first electrical pattern, and the second and subsequent electrical patterns can be used as verification of the probing unit 1 after the probe 11 is fixed to the base 10 (S2).

[0098] It should be noted that when the relative position and posture of the front end of the probe 11 with respect to the base 10 are adjusted, the adjustment is performed in a state where the fixing mechanism of the probe unit 1 , ie, the first fixing screw 13 c to the fourth fixing screw 16 c , is loosened.

[0099] <S2>

[0100] The probe 11 can be fixed to the base 10 by tightening the first fixing screw 13c to the fourth fixing screw 16c, which are the fixing mechanism of the probe unit 1. By fixing the probe unit 1 to the base 10, even if the probe unit 1 is removed from the positioning fixture 3, the change of the relative position and posture of the probe 11 can be suppressed. Therefore, when the probe unit 1 is mounted on the electrical inspection device, it can be properly contacted with the surface of the electronic circuit substrate without adjusting the position and posture again.

[0101] As described above, it is possible to manufacture the probe unit 1 in which the relative position and posture of the probe 11 are adjusted.

[0102] [Second embodiment]

[0103] A method for manufacturing a probe unit according to another embodiment of the present invention is a method for manufacturing a probe unit which is mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit substrate and has a probe 11 capable of contacting a surface of the electronic circuit substrate. Figure 7 and Figure 8 As shown, a base 17 having a positioning mechanism for determining the position in the electrical inspection device is used, such as Figure 4 As shown, the relative position and posture of the front end of the probe 11 with respect to the base 17 are adjusted (S1), and the relative position is maintained and the probe 11 is fixed to the base 17 (S2).

[0104] <Exploration Unit>

[0105] By using the manufacturing method of the probe unit, the Figure 7 The probe unit 4 shown in the figure. The probe unit 4 can be mounted on the electrical inspection device via a probe mounting body or directly, similarly to the probe unit 1 of the first embodiment.

[0106] exist Figure 7In the probe unit 4 shown, the base 17 is formed integrally. It should be noted that this does not prevent the base 17 of the probe unit 4 from being composed of a plurality of blocks, but the relative positions between the plurality of blocks are fixed.

[0107] like Figure 7 As shown, the positioning mechanism of the base 17 is composed of a pair of through holes 12a. In addition, the base 17 has a mechanism for fixing the electrical inspection device in a manner that does not separate from the base fixing screw 12c. The structure of the through hole 12a and the base fixing screw 12c can be constructed in the same manner as the probe unit 1 of the first embodiment, so detailed description is omitted.

[0108] like Figure 7 As shown, the detection unit 4 has a plurality of probes 11 ( Figure 7 The plurality of conductive sheets are fixed to the base 17 by an adhesive layer 18 (three in the figure).

[0109] <S1>

[0110] In the manufacturing method of the probe unit, multiple probes 11 are positioned using, for example, a robot arm so that the relative position of the front end of the probe 11 with respect to the positioning mechanism becomes the same relative position as the needle contact position on the surface of the electronic circuit substrate observed from the positioning object in the electrical inspection device.

[0111] In this positioning, a positioning fixture can be used in the same manner as in the first embodiment. The positioning fixture has a fixture base, a positioning object of the positioning mechanism of the detection unit 4, and a position adjustment mark for adjusting the relative position and posture of the front end of the probe 11. It should be noted that the positioning fixture does not require a micro-motion mechanism. Other structures can be constructed in the same manner as the positioning fixture 3 of the first embodiment, so detailed description is omitted.

[0112] When a robot is used, the following method may be adopted: the coordinates of the positioning mechanism, for example, the coordinates of the center of the through hole 12a, are recognized and the tip of the probe 11 is controlled to a desired position and angle using the coordinates as a starting point. In this case, a positioning jig is not required.

[0113] like Figure 8 As shown, a slide rail 17a for guiding the probe 11 may be provided at the portion of the base 17 where the probe 11 is fixed. The same number of slide rails 17a is provided as the number of probes 11. That is, one slide rail 17a is provided for each probe 11. By providing the slide rail 17a in this manner, the relative position and posture can be adjusted simultaneously and with high precision with respect to the front ends of a plurality of probes 11.

[0114] <S2>

[0115] In the manufacturing method of the probe unit, an adhesive is used to fix the probe 11. Figure 7 When one probe unit 4 includes a plurality of probes 11, the intervals between the probes 11 tend to become narrow, as in the probe unit 4 shown in FIG. 1 . When the intervals between adjacent probes 11 are narrow, for example, when screwing is performed, it may be difficult to firmly fix each probe 11. In contrast, by using an adhesive, the probes 11 can be easily fixed even when the intervals between adjacent probes 11 are narrow.

[0116] As the adhesive, an instant adhesive is preferably used. By setting the adhesive as an instant adhesive, the time for maintaining the relative position can be shortened, and the occurrence of positional deviation of the probe 11 can be suppressed. Among them, as the adhesive, a UV-curing instant adhesive is more preferably used. The UV-curing instant adhesive can control the start of curing by UV irradiation, so the probe 11 can be quickly fixed after the relative position and posture adjustment of the front end of the probe 11 are completed.

[0117] [Other embodiments]

[0118] The embodiments do not limit the structure of the present invention. Therefore, the embodiments can omit, replace or add the constituent elements of each part of the embodiments based on the description of this specification and technical common sense, and these should be interpreted as belonging to the scope of the present invention.

[0119] In the first embodiment, the case where the base is composed of a rectangular plate-shaped base and first to fourth blocks when viewed from above is described, but the structure and the shapes of the components are not limited to the above structure. As long as the base has a positioning mechanism for determining the position in the electrical inspection device, a position adjustment mechanism that can adjust the position and posture of the front end of the probe, and a fixing mechanism that can fix the position and posture of the front end of the probe at a desired position, other structures can be adopted.

[0120] In the above embodiment, the positioning object is a convex part protruding from the surface of the probe mounting base or the electrical inspection device, and the positioning mechanism of the detection unit is a concave part or a through hole that fits with the convex part. However, other structures can also be adopted. For example, the positioning mechanism of the detection unit can be a convex part, and the positioning object of the probe mounting base or the electrical inspection device can be a concave part.

[0121] In the above embodiment, the fixing mechanism is described as being composed of a fixing screw, but the fixing mechanism is not limited thereto. Other fixing mechanisms include, for example, a pressing fixing mechanism based on an eccentric cam, a latch such as a claw, and a mechanism combining the pressing of the latch with a spring.

[0122] In the above embodiment, the case where the probing unit of the present invention is installed in the electrical inspection device via the probe mounting body is described, but the probing unit of the present invention can also be directly installed in the electrical inspection device. An electrical inspection device directly mounted with the probing unit of the present invention is also another embodiment of the present invention. That is, the electrical inspection device of another embodiment of the present invention is an electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, comprising a probing unit and an inspection head for fixing the probing unit, wherein the probing unit comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting the surface of the electronic circuit substrate; and the inspection head having a positioning object of the positioning mechanism.

[0123] In this electrical inspection device, the probe unit is directly mounted on the electrical inspection device without a probe mounting base, etc., so that the influence of manufacturing tolerance of the probe mounting base, etc., can be eliminated. Therefore, the relative position and posture of the probe after adjustment are less likely to have errors.

[0124] Preferably, the positioning object is a convex portion protruding from the surface of the inspection head, and the positioning mechanism is a concave portion or a through hole that fits with the convex portion. By configuring the positioning mechanism and the positioning object in this way, positioning can be easily performed, and the probe unit can be installed on the electrical inspection device with high accuracy.

[0125] Preferably, the base has: a position adjustment mechanism that can adjust the position and posture of the front end of the probe; and a fixing mechanism that can fix the position and posture of the front end of the probe at a desired position. Figure 1 The probe unit 1 shown has the same structure. Figure 1 The probe unit 1 shown in the figure can easily finely adjust the position and posture of the tip of the probe 11, so that the relative position and posture in the electrical inspection device can be adjusted with high accuracy and efficiency.

[0126] Preferably, the probe unit is detachable relative to the inspection head. If the probe unit is detachable, the mounting position and number of the probe unit can be changed while using the same electrical inspection device according to the structure of the electronic circuit substrate. Therefore, one electrical inspection device can be used to handle a variety of electronic circuit substrates.

[0127] Industrial Applicability

[0128] As described above, in the method for manufacturing the probe unit, the probe unit, the probe mounting body, and the electrical inspection device according to one embodiment of the present invention, the tip of the probe can be positioned with high accuracy, and positioning on the electrical inspection device is not required.

[0129] Description of Reference Numerals

[0130] 1, 4: exploration unit;

[0131] 10: base;

[0132] 11: probe;

[0133] 11a: signal probe;

[0134] 11b: Grounding probe;

[0135] 12: matrix;

[0136] 12a: through hole;

[0137] 12b: first guide rail portion;

[0138] 12c: base fixing screw;

[0139] 13: The first piece;

[0140] 13a: first incision;

[0141] 13b: second guide rail portion;

[0142] 13c: first fixing screw;

[0143] 14: The second piece;

[0144] 14a: second incision;

[0145] 14b: protrusion;

[0146] 14c: second fixing screw;

[0147] 15: The third piece;

[0148] 15c: third fixing screw;

[0149] 16: The fourth piece;

[0150] 16c: fourth fixing screw;

[0151] 17: base;

[0152] 17a: slide rail;

[0153] 18: adhesive layer;

[0154] 2: Probe mounting body;

[0155] 20: probe mounting base;

[0156] 21: convex part;

[0157] 22: threaded hole;

[0158] 23: contact hole;

[0159] 3: Positioning fixture;

[0160] 30: fixture base;

[0161] 31: convex part;

[0162] 32: threaded hole;

[0163] 33: First micrometer;

[0164] 34: Second micrometer;

[0165] 35: Third micrometer;

[0166] 36: Position adjustment mark;

[0167] X: probe mounting body mounting part;

[0168] Y: Electronic circuit substrate.

Claims

1. A method for manufacturing a probe unit, the probe unit being mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit substrate and comprising a probe capable of contacting a surface of the electronic circuit substrate, characterized in that: Using a base having a positioning mechanism for determining a position in the electrical inspection device, the relative position and posture of the tip of the probe with respect to the base are adjusted, the relative position is maintained, and the probe is fixed to the base.

2. The method for manufacturing the probe unit according to claim 1, The probe is fixed using an adhesive.

3. A method for manufacturing a probe unit according to claim 1 or 2, When adjusting the relative position and posture of the front end of the probe, a positioning fixture is used to position and fix the base through the positioning mechanism. The positioning fixture has a position adjustment mark for adjusting the relative position and posture of the front end of the probe with respect to the base.

4. The method for manufacturing the probe unit according to claim 3, The position adjustment mark is an electrical pattern having a known impedance, When the relative position and posture of the tip of the probe are adjusted, the relative position and posture are adjusted so that the impedance measured by the probe approaches the known value.

5. The method for manufacturing the probe unit according to claim 3, The base has: a position adjustment mechanism, which can adjust the position and posture of the front end of the probe; a fixing mechanism, which can fix the position and posture of the front end of the probe at a desired position; The positioning fixture has a micro-motion mechanism for controlling the position adjustment mechanism. When the relative position and posture of the front end of the probe are adjusted, the position adjustment mechanism is controlled by the micro-motion mechanism.

6. A probe unit capable of being mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit board, characterized in that: The device comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting a surface of the electronic circuit substrate; The base has a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe and a fixing mechanism capable of fixing the position and posture of the front end of the probe at a desired position.

7. A probe mounting body capable of being mounted on an electrical inspection device for inspecting electrical characteristics of an electronic circuit board, characterized in that: A probe unit and a probe mounting base for fixing the probe unit are provided. The probe unit comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting a surface of the electronic circuit substrate; The probe mounting base includes a positioning target of the positioning mechanism.

8. The probe mounting body according to claim 7, The positioning object is a convex portion protruding from the surface of the probe mounting base, The positioning mechanism is a recessed portion or a through hole that fits with the protruding portion.

9. The probe mounting body according to claim 7 or 8, The base has: a position adjustment mechanism, which can adjust the position and posture of the front end of the probe; The fixing mechanism can fix the position and posture of the front end of the probe at a desired position.

10. The probe mounting body according to claim 7 or 8, The detection unit can be installed and removed relative to the probe mounting base.

11. An electrical inspection device for inspecting the electrical characteristics of an electronic circuit substrate, characterized in that: A detection unit and an inspection head for fixing the detection unit are provided. The probe unit comprises: a base having a positioning mechanism for determining a position in the electrical inspection device; a probe fixed to the base and capable of contacting a surface of the electronic circuit substrate; The inspection head includes a positioning object of the positioning mechanism.

12. The electrical inspection device according to claim 11, The positioning object is a convex portion protruding from the surface of the inspection head, The positioning mechanism is a recessed portion or a through hole that fits with the protruding portion.

13. The electrical inspection device according to claim 11 or 12, The base has a position adjustment mechanism capable of adjusting the position and posture of the front end of the probe and a fixing mechanism capable of fixing the position and posture of the front end of the probe at a desired position.

14. The electrical inspection device according to claim 11 or 12, The probe unit is detachable relative to the inspection head.

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