Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment. The circuit board assembly comprises a first substrate, a second substrate, a chip and a first power module. The first substrate and the second substrate are oppositely arranged at an interval, a power supply part and a conductive part are arranged on the first surface, facing the second substrate, of the first substrate, and the power supply part is electrically connected with the conductive part; the chip is arranged on the first surface, opposite to the first substrate, of the second substrate; the first power module is arranged on the second surface, facing the first substrate, of the second substrate; an input terminal is arranged on one surface, facing the first substrate, of the first power module, and the input terminal is electrically connected with the conductive piece; the first surface, facing the second substrate, of the first power module is provided with an output terminal, the output terminal is electrically connected with the chip, and the first power module is used for adjusting and filtering the voltage input by the input terminal and then outputting the voltage to the output terminal.

Description

Circuit board assembly and electronic equipment Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and electronic equipment. Background Art

[0002] With the continuous advancement of digitalization and intelligence in the information society, current computing infrastructure primarily provides high-performance computing power in the form of data centers. High-computing chips are the specific carriers of computing power. Advanced high-computing chips and dedicated artificial intelligence (AI) processors are driving the rapid development of AI.

[0003] Currently, high-computing chips feature tens of billions of transistors. As performance increases, so too does the exponentially growing power demand. Power supply has become a limiting factor in improving chip computing performance. Existing chip power supply solutions suffer from uneven current distribution within the power delivery network (PDN). Furthermore, long power supply links make it difficult to significantly reduce impedance. Furthermore, the long power supply links make it difficult to reduce inductance, resulting in a high rate of change in chip current, which in turn causes voltage fluctuations on the chip's power pins. These transient voltage fluctuations can lead to issues with the processor's transient performance and power consumption.

[0004] Summary of the Invention

[0005] The present application provides a circuit board assembly and an electronic device to improve the current balance of a power supply link of the circuit board assembly and shorten the path length of the power supply link, thereby improving the performance of the electronic device.

[0006] In a first aspect, the present application provides a circuit board assembly, which includes a first substrate, a second substrate, a chip, and a first power module. The first substrate and the second substrate are arranged opposite and spaced apart from each other. The first substrate includes a first surface facing the second substrate, and a power supply component and a conductive member are provided on the first surface of the first substrate. The power supply component and the conductive member are electrically connected. The second substrate includes a first surface facing away from the first substrate and a second surface facing the first substrate. The chip is provided on the first surface of the second substrate, and the first power module is provided on the second surface of the second substrate. The first power module is provided with an input terminal on the surface facing the first substrate, and the input terminal can be electrically connected to the conductive member. The first power module is provided with an output terminal on the first surface facing the second substrate, and the output terminal can be electrically connected to the chip. The first power module can be used to adjust the voltage input from the input terminal and output it to the output terminal after filtering.

[0007] In the present application, by arranging the power supply component and the chip on different substrates and making the input terminal and output terminal of the first power module located on opposite sides thereof, a solution of vertical power supply to the chip can be realized. This power supply solution can avoid the problem of different lengths of the power supply link to a certain extent, and can effectively shorten the path length of the power supply link, thereby reducing the impedance and inductance of the power supply link, reducing the circuit board loss and voltage fluctuation, and thus helping to improve the performance of electronic equipment.

[0008] In some embodiments, the first power module may include a voltage regulator and one or more filter capacitors, which may be packaged as an integrated structure. The voltage regulator is used to regulate the voltage input from the input terminal and output it to the filter capacitor so that the regulated voltage can match the operating voltage of the chip; the filter capacitor is used to filter the voltage output by the voltage regulator and output it to the output terminal to improve the stability of the voltage output by the first power module to the chip.

[0009] For example, the voltage regulator and the filter capacitor may be packaged as one body by way of ball grid array packaging.

[0010] In some embodiments, the conductive member is an elastic conductive member that elastically abuts against the input terminal of the first power module, thereby achieving electrical connection with the input terminal. By designing the conductive member as an elastic structure, when multiple first power modules are provided, the different deformation forms of the corresponding multiple conductive members can be utilized to compensate for the tolerances of the first power modules, thereby ensuring that the input terminal of each first power module can be reliably electrically connected to the corresponding conductive member.

[0011] Exemplarily, the conductive member includes a spring, a spring pin, a conductive adhesive layer, and the like.

[0012] In some embodiments, the circuit board assembly may further include a support member supported between the first substrate and the second substrate, with the height of the support member being less than the sum of the height of the conductive member in the released state and the height of the first power module. This design allows the conductive member to be in a compressed, energy-storing state while also reducing the risk of excessive compression of the conductive member through the restraint of the support member, thereby improving the structural reliability of the conductive member and, in turn, the reliability of the electrical connection between the conductive member and the input terminal of the first power module.

[0013] In some embodiments, the first substrate has a first mounting hole, and the second substrate is provided with a second mounting hole opposite to the first mounting hole. The first substrate and the second substrate can be relatively fixed by fasteners installed in the first mounting hole and the second mounting hole.

[0014] In one implementation, a nut matching the fastener may be fixed at a position of the first surface of the second substrate corresponding to the first mounting hole, and an end of the fastener may be locked in the nut, thereby fixing the first substrate and the second substrate.

[0015] In some embodiments, the power supply component may include a power supply terminal and a second power module, wherein an input terminal of the second power module is electrically connected to the power supply terminal, and an output terminal of the second power module is electrically connected to the conductive member. The second power module may be configured to regulate the voltage provided by the power supply terminal and output it to the conductive member, which in turn outputs the voltage to the first power module through the conductive member.

[0016] In some embodiments, the power supply component is a power supply terminal, which is electrically connected to the conductive member.

[0017] In some embodiments, the first substrate includes a circuit board and a metal plate, with the circuit board and the metal plate being stacked together. The surface of the circuit board facing away from the metal plate serves as the first surface of the first substrate. This type of first substrate has excellent thermal conductivity, allowing it to quickly dissipate heat generated by the first substrate and the electronic devices mounted thereon.

[0018] In some embodiments, the circuit board assembly further includes a first heat sink disposed on a side of the first substrate facing away from the second substrate, with the first heat sink in thermal contact with the first substrate. Heat generated by the electronic components on the first substrate during operation is transferred to the first substrate, where it is then further transferred from the first substrate to the first heat sink, where it is dissipated to the outside world, thereby dissipating heat and cooling the first substrate and the electronic components disposed thereon.

[0019] In a specific implementation, the first heat sink may be fixed to a surface of the first substrate facing away from the second substrate by welding.

[0020] In a specific implementation, the first radiator can be a heat pipe, which can not only dissipate heat for the first substrate, but also achieve temperature uniformity, thereby improving the temperature consistency of various areas of the first substrate, and further achieving a balanced heat dissipation effect for the first substrate and the electronic devices arranged thereon.

[0021] In some embodiments, the circuit board assembly further includes a second heat sink, which is disposed on a side of the chip facing away from the second substrate and in thermal contact with the chip. Heat generated by the chip during operation is thus transferred to the second heat sink and dissipated to the outside through the second heat sink, thereby dissipating heat and cooling the chip.

[0022] In a specific implementation, the second heat sink may be a liquid cooling plate, which can continuously dissipate the heat generated by the chip to the outside by circulating the cooling medium inside the liquid cooling plate, thereby achieving continuous heat dissipation of the chip.

[0023] In a second aspect, the present application further provides an electronic device comprising a housing and a circuit board assembly according to any of the embodiments of the first aspect, the circuit board assembly being disposed within the housing. Because the length of the power supply link to the chip in the circuit board assembly is shortened, circuit board losses are reduced, and voltage fluctuations are minimized, the performance of the electronic device is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0025] FIG2 is a side view of a circuit board assembly 300 provided in an embodiment of the present application;

[0026] FIG3 is a schematic structural diagram of a first power module 340 provided in an embodiment of the present application;

[0027] FIG4 is a schematic structural diagram of another circuit board assembly provided in an embodiment of the present application.

[0028] Reference numerals:

[0029] Existing technology part: 100-housing; 200-circuit board; 210-chip; 220-power supply component;

[0030] Embodiments of the present application: 100-housing; 300-circuit board assembly; 310-first substrate; 310a-first surface of the first substrate; 311-circuit board; 312-metal plate; 320-second substrate; 320a-first surface of the second substrate; 320b-second surface of the second substrate; 330-chip; 340-first power module; 341-input terminal; 342-output terminal; 343-voltage regulator; 344-filter capacitor; 350-power supply component; 351-power supply terminal; 352-second power module; 360-conductive member; 370-support member; 380-first radiator; 381-evaporation section; 382-condensation section; 390-second radiator. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments set forth herein. The same figure marks in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all explained with reference to the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of this application. The drawings in the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0032] It should be noted that the following description sets forth specific details to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways than those described herein, and those skilled in the art may make similar generalizations without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0033] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Referring to Figure 1 , in this embodiment of the present application, the electronic device can be a computer device with a processor chip, such as a server, desktop computer, personal computer, etc., or it can also be a portable electronic device with a processor, such as a mobile phone, tablet computer, or in-vehicle device. This embodiment of the present application uses a server as an example for description.

[0034] The electronic device may include a housing 100 and a circuit board 200, wherein the circuit board 200 is disposed in the housing 100, and the chip 210 is disposed on the circuit board 200. In addition to the chip 210, a power supply component 220 and other electronic devices may also be provided on the circuit board 200, and the power supply component may be used to provide power to the chip 210 and other electronic devices. In this embodiment, the chip 210 may be a graphics processing unit (GPU), a central processing unit (CPU), a system on chip (SoC), or other chips with logic computing capabilities, or other types of application-specific integrated circuits (ASICs), programmable logic devices such as field programmable gate arrays (FPGAs), transistor logic devices, hardware components, or any combination thereof.

[0035] Taking GPUs as an example, existing GPUs have tens of billions of transistors. As performance increases, so do power demands, which have become the limiting factor in GPU computing performance. As chip power consumption and size increase, the power links between the chip's power pins and the power supply components vary in length. The length of the power link affects the link impedance, which in turn affects the current in the link. This leads to uneven current distribution between the power links corresponding to different chip power pins. Furthermore, excessively long power links not only increase impedance but also make it difficult to reduce parasitic inductance, resulting in a high rate of change in chip current, which in turn causes voltage fluctuations at the chip's power pins. These transient voltage fluctuations can lead to issues with the processor's transient performance and power consumption.

[0036] In view of this, embodiments of the present application provide a circuit board assembly applicable to the aforementioned electronic devices. This circuit board assembly can address the issues of excessively long and unevenly distributed power supply links in the aforementioned circuit boards, thereby reducing the impedance and inductance of the power supply link, thereby reducing losses in the circuit board and lowering voltage fluctuations, thereby improving the performance of the electronic devices. The circuit board assembly provided in the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0037] FIG2 is a side view of a circuit board assembly 300 provided in an embodiment of the present application. Referring to FIG2 , in an embodiment of the present application, the circuit board assembly 300 may include a first substrate 310, a second substrate 320, a chip 330, and a first power module 340. The first substrate 310 and the second substrate 320 are arranged opposite to each other, and there is a gap between them. The first substrate 310 has a first surface 310a facing the second substrate 320. The first surface 310a of the first substrate 310 may be provided with a power supply component 350 and a conductive member 360, and the power supply component 350 and the conductive member 360 are electrically connected. The second substrate 320 can serve as a carrier for the chip 330 and the first power module 340, and provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip 330 and the first power module 340.

[0038] In some embodiments, the first substrate 310 can be a metal substrate. Leveraging the excellent thermal conductivity of a metal substrate, heat generated by the electronic components mounted on the first substrate 310 during operation can be dissipated to the outside world as quickly as possible. The first substrate 310 includes a stacked circuit board 311 and a metal plate 312. The side of the circuit board 311 facing away from the metal plate 312 serves as the first surface 310a of the first substrate 310. This allows the power supply 350 and the conductive member 360 to be electrically connected via traces on the circuit board 311. The metal plate 312 can be made of a metal with high thermal conductivity, such as copper or aluminum.

[0039] In other embodiments, the first substrate 310 may also be a copper-clad ceramic substrate, which can also achieve good heat dissipation for electronic devices disposed thereon. For example, the first substrate 310 may be a direct bonding copper (DBC) ceramic substrate or an active metal brazing (AMB) ceramic substrate. In this embodiment, the copper surface of the first substrate 310 may serve as the first surface 310a of the first substrate 310, and the power supply component 350 and the conductive member 360 may be electrically connected via traces formed on the copper surface.

[0040] In an embodiment of the present application, the power supply component 350 can be electrically connected to the power module of the electronic device. Depending on the power supply voltage of the power module, the power supply component 350 can have different implementation forms. For example, when the power supply voltage of the power module is 48V, the power supply component 350 may include a power supply terminal 351 and a second power module 352, wherein the power supply terminal 351 is electrically connected to the power module, the input end of the second power module 352 is electrically connected to the power supply terminal 351, and the output end of the second power module 352 is electrically connected to the conductive member 360, and the second power module 352 is used to adjust the voltage provided by the power supply terminal and transmit it to the conductive member 360. For example, the second power module 352 can be used to adjust the 48V voltage provided by the power module to a voltage of 12V and then output it. Exemplarily, the second power module 352 can be an intermediate bus converter (IBC) or the like.

[0041] Of course, if the power supply voltage of the power module itself is low, for example 12V, the power supply component 350 does not need to be provided with a second power module 352 for voltage conversion. In this case, the power supply component 350 is the power supply terminal 351.

[0042] In some possible embodiments, the first surface 310a of the first substrate 310 may further be provided with other electronic components, such as a capacitor 313 or an inductor (not shown in the figure). The capacitor 313 or the inductor may be connected between the power supply component 350 and the conductive member 360 to filter the output voltage of the power supply component 350, thereby improving the stability of the output voltage of the power supply component 350.

[0043] Continuing with FIG2 , in the embodiment of the present application, the second substrate 320 may be a circuit board. The second substrate 320 includes a first surface 320a and a second surface 320b disposed opposite each other. The first surface 320a of the second substrate 320 is the surface facing away from the first substrate 310, and the second surface 320b of the second substrate 320 is the surface facing the first substrate 310. Alternatively, the second surface 320b of the second substrate 320 is disposed opposite the first surface 310a of the first substrate 310. In a specific implementation, the chip 330 may be disposed on the first surface 320a of the second substrate 320, and the first power module 340 may be disposed on the second surface 320b of the second substrate 320. The chip 330 and the first power module 340 may be disposed opposite each other in the thickness direction of the second substrate 320.

[0044] As mentioned above, the chip 330 may be any one or more of a GPU, a CPU, an ASIC, and an FPGA. The chip 330 may be fixed to the first surface 320a of the second substrate 320 by welding or other methods.

[0045] The first power module 340 can be welded and fixed to the second surface 320b of the second substrate 320. The number of first power modules 340 can be one or more. If there are multiple first power modules 340, the multiple first power modules 340 can be arranged in an orderly or random manner on the second surface 320b of the second substrate 320. Each first power module 340 has an input terminal 341 and an output terminal 342. The input terminal 341 is located on the side of the first power module 340 facing away from the second substrate 320, and the output terminal 342 is located on the side of the first power module 340 facing the second substrate 320. In other words, the input terminal 341 and the output terminal 342 are respectively disposed on opposite sides of the first power module 340.

[0046] Continuing with FIG2 , solder pads are provided on the first surface 320a of the second substrate 320 at locations corresponding to the output terminals 342 of the first power module 340. The output terminals 342 are soldered to the solder pads to achieve electrical connection with the second substrate 320. Furthermore, vias 321 are provided on the second substrate 320 at locations corresponding to the solder pads. The vias 321 penetrate the second substrate 320 along the thickness of the second substrate 320, thereby electrically connecting the solder pads to the chip 330 provided on the first surface 320a of the second substrate 320, thereby achieving electrical connection between the output terminals 342 and the chip 330.

[0047] It should be noted that the via 321 can be provided in the form of a through hole or a blind buried hole. The specific setting method is not limited and is shown in the figure for example only.

[0048] Because the second surface 320b of the second substrate 320 is positioned opposite the first surface 310a of the first substrate 310, the input terminal 341 of the first power module 340 is positioned toward the first surface 310a of the first substrate 310, thereby enabling electrical connection between the input terminal 341 and the conductive member 360 disposed on the first surface 310a of the first substrate 310. This allows the power supply component 350 to be electrically connected to the input terminal 341 of the first power module 340 via the conductive member 360. Furthermore, by properly positioning the conductive member 360 on the first surface 310a of the first substrate 310, the input terminal 341 of the first power module 340 and the conductive member 360 can also be positioned opposite each other. Specifically, the projection of the conductive member 360 on the second surface 320b of the second substrate 320 can cover or partially cover the input terminal 341 of the first power module 340, thereby simplifying the electrical connection between the input terminal 341 and the conductive member 360.

[0049] As can be seen from the above description, the voltage output by the power supply component 350 is transmitted to the input terminal 341 of the first power module 340 via the conductive member 360. After being processed by the first power module 340, it is output to the chip 330 via its output terminal 342. The voltage processing by the first power module 340 includes regulating and filtering the voltage input from the input terminal 341 before outputting it to the output terminal 342. This allows the first power module 340 to provide the chip 330 with a stable voltage that matches the operating voltage of the chip 330.

[0050] In the embodiment of the present application, since the input terminal 341 and the output terminal 342 of the first power module 340 are located on opposite sides thereof, a design of vertical power supply to the chip is realized. Compared with the horizontal power supply scheme in which the power module and the chip are arranged on the same side of the substrate, the vertical power supply scheme can circumvent the problem of different lengths of the power supply link to a certain extent, and can effectively shorten the path length of the power supply link, thereby reducing the impedance and inductance of the power supply link, reducing the circuit board loss and voltage fluctuation, and thus helping to improve the performance of the electronic device. It has been verified that the impedance of the circuit board assembly 300 provided in the embodiment of the present application can be reduced by about 30% compared to the impedance generated by the horizontal power supply scheme, and the circuit board loss can also be reduced by about 30%.

[0051] Continuing with FIG. 2 , in some embodiments, the conductive member 360 may be an elastic conductive member. When the first substrate 310 and the second substrate 320 are assembled, the conductive member 360 may abut against the input terminal 341 of the first power module 340, thereby achieving electrical connection between the conductive member 360 and the input terminal 341. This design, on the one hand, reduces the difficulty of electrically connecting the conductive member 360 to the input terminal 341. On the other hand, when there are multiple first power modules 340, some tolerances inevitably exist between the multiple first power modules 340, which may result in differences in the distance between each first power module 340 and the first surface 310a of the first substrate 310. By utilizing the deformable nature of the conductive member 360, each conductive member 360 can be deformed in different states to compensate for this difference, thereby ensuring that the input terminal 341 of each first power module 340 is reliably electrically connected to the corresponding conductive member 360, thereby improving the reliability of the circuit board assembly 300.

[0052] The specific type of the conductive member 360 is not limited, including but not limited to a spring, a spring pin, a conductive adhesive layer, etc.

[0053] In addition, the circuit board assembly 300 may also include a support member 370, the two ends of which are respectively in contact with the first surface 310a of the first substrate 310 and the second surface 320b of the second substrate 320, so as to be supported between the first substrate 310 and the second substrate 320, and the support member 370 is arranged to avoid the electronic devices (including power supply components 350, conductive components 360, etc.) on the first surface 310a of the first substrate 310 and the electronic devices (including first power modules 340, etc.) on the second surface 320b of the second substrate 320, so that the support member 370 can be used to limit the distance between the first substrate 310 and the second substrate 320.

[0054] Along the stacking direction of the first substrate 310 and the second substrate 320, the height of the support member 370 is less than the sum of the height of the conductive member 360 in the energy release state and the height of the first power module 340. In this way, after the first substrate 310 and the second substrate 320 are assembled, the conductive member 360 can be placed in a compressed energy storage state, and the risk of the conductive member 360 being over-compressed can be reduced through the restriction of the support member 370, thereby improving the structural reliability of the conductive member 360, and further improving the electrical connection reliability between the conductive member 360 and the input terminal 341 of the first power module 340.

[0055] In some embodiments, there may be one or more supporting members 370. In the case where there are multiple supporting members 370, the multiple supporting members 370 may be evenly distributed between the first substrate 310 and the second substrate 320 to improve the supporting effect.

[0056] In the embodiment of the present application, the first substrate 310 and the second substrate 320 can be relatively fixed by a fastener (not shown in the figure). For example, the first substrate 310 has a first mounting hole, and the second substrate 320 has a second mounting hole at a position opposite the first mounting hole, and the fastener is installed in the first mounting hole and the second mounting hole. A nut matching the fastener can be fixedly provided at the position of the first surface 320a of the second substrate 320 corresponding to the second mounting hole, and the end of the fastener can be locked into the nut, thereby fixing the first substrate 310 and the second substrate 320.

[0057] In some other embodiments, the first substrate 310 and the second substrate 320 may be fixed by bonding. For example, a sealant may be filled between the first substrate 310 and the second substrate 320 to fix the relative positions of the first substrate 310 and the second substrate 320 using the sealant.

[0058] FIG3 is a schematic diagram of the structure of the first power module 340 provided in an embodiment of the present application. Referring to FIG3 , in an embodiment of the present application, the first power module 340 may include a voltage regulator module 343 (VRM) and one or more filter capacitors 344. The voltage regulator 343 and the one or more filter capacitors 344 may be packaged into an integrated structure. For example, the voltage regulator 343 and the filter capacitor 344 may be packaged into one by a ball grid array (BGA).

[0059] The input terminal of the voltage regulator 343 is electrically connected to the input terminal 341 of the first power module 340, or the input terminal of the voltage regulator 343 can be used as the input terminal 341 of the first power module 340. The output terminal of the filter capacitor 344 is electrically connected to the output terminal 342 of the first power module 340, or the output terminal of the filter capacitor 344 can be used as the output terminal 342 of the entire first power module 340. The output terminal of the voltage regulator 343 is electrically connected to the input terminal of the filter capacitor 344. The voltage regulator 343 is used to regulate the voltage input from the input terminal 341 and output it to the filter capacitor 344 so that the regulated voltage matches the operating voltage of the chip 330. The filter capacitor 344 is used to filter the voltage output from the voltage regulator 343 and output it to the output terminal 342, thereby improving the stability of the voltage output from the first power module 340 to the chip 330 and helping to improve the operating reliability of the chip 330.

[0060] As previously mentioned, the voltage output by the power supply component 350 to the first power module 340 is approximately 12V, while the operating voltage of the chip 330 is between 0.6V and 1V. For example, if the operating voltage of the chip 330 is 0.9V, the voltage regulator 343 can be used to regulate the 12V voltage input from the input terminal 341 to 0.9V before outputting it to the filter capacitor 344.

[0061] In addition, the specific type of the filter capacitor 344 is not limited, such as including but not limited to tantalum capacitors, ceramic capacitors, etc.

[0062] FIG4 is a schematic structural diagram of another circuit board assembly provided in an embodiment of the present application. Referring to FIG4 , in an embodiment of the present application, the circuit board assembly 300 may further include a first heat sink 380. The first heat sink 380 may be provided on the side of the first substrate 310 facing away from the second substrate 320, and the first heat sink 380 is in thermal contact with the first substrate 310. After the heat generated by the electronic devices on the first substrate 310 during operation is transferred to the first substrate 310, it may be further transferred from the first substrate 310 to the first heat sink 380, and the first heat sink 380 may dissipate heat to the outside, thereby achieving heat dissipation and cooling of the first substrate 310 and the electronic devices arranged thereon. In a specific implementation, the first heat sink 380 may be fixed to the side surface of the first substrate 310 facing away from the second substrate 320 by welding.

[0063] In one embodiment, the first heat sink 380 may be a heat pipe, which not only dissipates heat from the first substrate 310 but also achieves a uniform temperature distribution, thereby improving the temperature consistency of various regions of the first substrate 310 and achieving a balanced heat dissipation effect for the first substrate 310 and the electronic devices disposed thereon. The heat pipe may include an evaporation section 381 and a condensation section 382. The evaporation section 381 is in thermal contact with the first substrate 310, so that the cooling medium within the evaporation section 381 absorbs heat from the first substrate 310, thereby dissipating heat and cooling the first substrate 310. Simultaneously, the cooling medium within the evaporation section 381 evaporates due to the heat and becomes gaseous. The gaseous cooling medium flows to the condensation section 382 of the heat pipe, where it releases heat and condenses into a liquid, which then returns to the evaporation section 381. This reciprocating cycle achieves continuous heat dissipation and temperature uniformity for the first substrate 310.

[0064] In other embodiments, the first radiator 380 may be an air-cooled radiator. In this case, the first radiator 380 may be provided with fins on the side facing away from the first substrate 310. This effectively increases the surface area of ​​the first radiator 380, thereby improving the heat exchange efficiency between the first radiator 380 and the outside air, and further enhancing the heat dissipation capacity of the first radiator 380.

[0065] Continuing with FIG4 , the circuit board assembly 300 may further include a second heat sink 390. The second heat sink 390 may be disposed on a side of the chip 330 facing away from the second substrate 320, with the second heat sink 390 in thermal contact with the chip 330. In this way, heat generated by the chip 330 during operation can be transferred to the second heat sink 390 and dissipated to the outside through the second heat sink 390, thereby dissipating heat and cooling the chip 330.

[0066] In addition, a heat-conducting medium can be provided between the chip 330 and the second heat sink 390. The heat-conducting medium can fill the micro gaps generated by the uneven surface when the chip 330 contacts the second heat sink 390, thereby reducing the heat transfer resistance and helping to improve the heat dissipation effect of the chip 330.

[0067] In one embodiment, the second heat sink 390 may be a liquid cooling plate, which can continuously dissipate the heat generated by the chip 330 to the outside by circulating the cooling medium therein, thereby achieving continuous heat dissipation of the chip 330 .

[0068] It is worth mentioning that when the second radiator 390 is a liquid cooling plate and the first radiator 380 is a heat pipe, the edge of the second radiator 390 can be set beyond the second substrate 320, and the condensing section 382 of the first radiator 380 can be bent relative to its evaporating section 381 toward the second radiator 390, so that the condensing section 382 of the first radiator 380 is in thermal contact with the part of the second radiator 390 that exceeds the second substrate 320, so that the second radiator 390 can be used to quickly cool down the cooling medium in the condensing section 382 of the first radiator 380.

[0069] Of course, in other embodiments, the second radiator 390 may also be an air-cooled radiator. In this case, the second radiator 390 may be provided with fins on the side facing away from the second substrate 320. This effectively increases the surface area of ​​the second radiator 390, thereby improving the heat exchange efficiency between the second radiator 390 and the outside air, and further enhancing the heat dissipation capacity of the second radiator 390.

[0070] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board assembly, characterized in that: It includes a first substrate, a second substrate, a chip and a first power module, wherein the first substrate and the second substrate are arranged opposite to each other and spaced apart, wherein: The first substrate comprises a first surface facing the second substrate, a power supply component and a conductive member are disposed on the first surface of the first substrate, and the power supply component is electrically connected to the conductive member; The second substrate comprises a first surface facing away from the first substrate and a second surface facing the first substrate; The chip is arranged on the first surface of the second substrate; The first power module is arranged on the second surface of the second substrate. The first power module is provided with an input terminal on a surface facing the first substrate, and the input terminal is electrically connected to the conductive member. The first power module is provided with an output terminal on a surface facing the second substrate, and the output terminal is electrically connected to the chip. The first power module is used for adjusting the voltage input by the input terminal and outputting it to the output terminal.

2. The circuit board assembly according to claim 1, wherein: The first power module includes a voltage regulator and at least one filter capacitor, and the voltage regulator and the at least one filter capacitor are packaged into an integrated structure; The voltage regulator is used to adjust the voltage input from the input terminal and then output it to the filter capacitor; The filter capacitor is used to filter the voltage output by the voltage regulator and then output it to the output terminal.

3. The circuit board assembly according to claim 1 or 2, characterized in that: The conductive member is an elastic conductive member, and the conductive member abuts against the input terminal.

4. The circuit board assembly according to claim 3, wherein: The circuit board assembly further includes a support member, which is supported between the first substrate and the second substrate, and a height of the support member is less than a sum of a height of the conductive member in an energy release state and a height of the first power module.

5. The circuit board assembly according to claim 3 or 4, characterized in that: The first substrate has a first mounting hole, and the second substrate has a second mounting hole at a position opposite to the first mounting hole. The first substrate and the second substrate are relatively fixed by fasteners installed in the first mounting hole and the second mounting hole.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The power supply component includes a power supply terminal and a second power module, wherein an input end of the second power module is electrically connected to the power supply terminal, an output end of the second power module is electrically connected to the conductive member, and the second power module is used to adjust a voltage input to the power supply terminal.

7. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The power supply component is a power supply terminal, and the power supply terminal is electrically connected to the conductive member.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The first substrate includes a circuit board and a metal plate. The circuit board and the metal plate are stacked, and a surface of the circuit board facing away from the metal plate is formed as a first surface of the first substrate.

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that: The circuit board assembly further includes a first heat sink, which is disposed on a side of the first substrate facing away from the second substrate.

10. The circuit board assembly according to any one of claims 1 to 9, characterized in that: The circuit board assembly further includes a second heat sink, which is arranged on a side of the chip facing away from the second substrate.

11. An electronic device, characterized in that: It comprises a housing and a circuit board assembly as claimed in any one of claims 1 to 10, wherein the circuit board assembly is arranged in the housing.

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