Switch unit

Abstract

The invention relates to a switching unit (100), comprising:-a power module (102); -an upper bus (130) and a lower bus (128) connected to each power module (102) so as to distribute a DC voltage (UDC) to the latter, the upper and lower buses each comprising a first plate; and-at least one capacitor (136) having two terminals respectively welded to the two busbars (128, 130); characterized in that the upper bus bar (130) and the lower bus bar (128) are stacked on each other, and it comprises a bracket (132) of the upper bus bar (130) and the lower bus bar (128), the bracket comprising a bottom (134) on which a first plate of the stacked bus bars (128, 130) is located, the first plate of the lower bus bar (128) having an aperture (902) exposing a connection portion (904) of the first plate of the upper bus bar (130), and the bottom (134) having an aperture (908) exposing a connection portion (904) of the first plate of the upper bus bar (130). The hole exposes at least a portion of the connection portion (910) of the first plate of the lower bus bar (128) and the hole (902) of the first plate of the lower bus bar (128) so as to connect a first terminal (138) of the capacitor (136) to the connection portion (910) of the lower bus bar (128) through the hole (908) of the bottom (134) on one hand, and to connect a second terminal (140) of the capacitor (136) to the connection portion (904) of the upper bus bar (130) through the hole (908) of the bottom (134) and the hole (902) of the lower bus bar (128) on the other hand.

Description

Technical Field

[0001] The invention relates to a switch unit, in particular to an inverter associated with a motor. Background Art

[0002] The prior art discloses a switch unit, comprising:

[0003] - Power modules;

[0004] - a first busbar, called the upper busbar, and a second busbar, called the lower busbar, connected to each power module in order to distribute a DC voltage to the latter, the upper busbar and the lower busbar each comprising a first plate; and

[0005] - At least one capacitor having two terminals welded to the first and second busbars, respectively.

[0006] The welding of capacitors requires the use of potentially bulky equipment and access to the busbars. Due to welding constraints, the busbars are therefore usually placed at a certain distance from each other.

[0007] However, it is generally desirable for the switching unit to be as compact as possible.

[0008] It may therefore be desirable to provide a switching unit that allows overcoming at least some of the above-mentioned problems and limitations. Summary of the invention

[0009] According to a first aspect of the present invention, there is provided a switch unit, the switch unit comprising:

[0010] - Power modules;

[0011] - a first busbar, called the upper busbar, and a second busbar, called the lower busbar, connected to each power module in order to distribute a DC voltage to the latter, the upper busbar and the lower busbar each comprising a first plate; and

[0012] - at least one capacitor, two terminals of which are welded to the first and second busbars, respectively;

[0013] Characterized in that the upper busbar and the lower busbar are stacked on each other and that it comprises a bracket for the upper busbar and the lower busbar, the bracket comprising a bottom on which the first plate of the stacked busbars is located, the first plate of the lower busbar having a hole exposing a portion of the first plate of the upper busbar called the connection portion, and the bottom having a hole exposing a portion of the first plate of the lower busbar called the connection portion and at least a portion of the hole of the first plate of the lower busbar, so as to connect the first terminal of the capacitor to the connection portion of the lower busbar through the hole of the bottom on the one hand and to connect the second terminal of the capacitor to the connection portion of the upper busbar through the hole of the bottom and the hole of the lower busbar on the other hand.

[0014] By means of the present invention, the busbars are stacked, thus taking up little space while being easily connected to the capacitors.

[0015] According to its first aspect, the present invention may further comprise one or more of the following optional features in any technically possible combination.

[0016] Optionally, two terminals of the capacitor are welded to the first plate of the upper busbar and the first plate of the lower busbar, respectively.

[0017] Optionally, the first plate of the upper busbar and the first plate of the lower busbar are planar.

[0018] Optionally, the connection portion of the first plate of the lower bus bar has a smaller thickness than the remaining portion of the first plate of the lower bus bar.

[0019] Also optionally, the first plate of the upper busbar has a protrusion extending into the hole of the first plate of the lower busbar.

[0020] Also optionally, the protrusion has a planar lower connecting wall, the thickness of which is less than the thickness of the remaining portion of the first plate of the upper busbar.

[0021] Also optionally, the bracket has fastening pins, and the first plate of the upper busbar has holes for receiving the fastening pins, the fastening pins being staked to fasten the first plate of the busbar to the bracket.

[0022] Also optionally, the first plate of the lower busbar is held between the first plate of the upper busbar and the bracket.

[0023] Also optionally, the lower busbar is designed to have a high potential, and the upper busbar is designed to have a low potential.

[0024] Also optionally, the bracket has pins for positioning the first plate of the lower busbar.

[0025] Also optionally, the positioning pins are arranged to hold the first plate of the lower busbar in a position perpendicular to the fastening pins.

[0026] Also optionally, the positioning pin is parallel to the fastening pin.

[0027] Also optionally, each power module implements a switching arm designed to perform a conversion between a DC voltage and an AC voltage.

[0028] Also optionally, the switch unit also includes a circuit for cooling the power module, the cooling circuit including a cooling housing defining a channel for a coolant flow, the cooling housing having an upper cooling surface and a lower cooling surface, both of which are cooled by the coolant flow through the channel, and the power module is pressed against the upper cooling surface to be cooled.

[0029] Also optionally, the first plate of the upper busbar is in thermal contact with the lower cooling surface.

[0030] Optionally, the cooling housing further comprises an inlet duct for coolant to enter the cooling housing and an outlet duct for coolant to flow out of the cooling housing, the inlet duct and the outlet duct each having a section, the sections of the inlet duct and the sections of the outlet duct protruding substantially parallel to each other in the same direction.

[0031] Optionally, a first insulating layer is inserted between the first plates of the upper busbar and the lower busbar.

[0032] Optionally, a second insulating layer is located between the top of the first plate of the upper busbar and the lower surface of the cooling housing.

[0033] According to a second aspect of the present invention, there is also provided an inverter comprising the switch unit according to the first aspect of the present invention.

[0034] Optionally, the inverter further comprises a housing, in which the switch unit is located, the housing having two channel holes, the section of the inlet duct being inserted into one of the two channel holes, and the section of the outlet duct being inserted into the other of the two channel holes.

[0035] According to a third aspect of the present invention, there is further provided a mobile device comprising the switch unit according to the first aspect of the present invention or the inverter according to the second aspect of the present invention.

[0036] A mobile device is, for example, a motor or engine driven land vehicle, train, airplane or drone.

[0037] A motor- or engine-driven land vehicle is, for example, a motor vehicle, a motorcycle, a motorized bicycle or a motorized wheelchair. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention will be better understood from the following description, which is provided by way of example only and with reference to the accompanying drawings, in which:

[0039] - Figure 1 is a cross-sectional view of an example of a switch unit implementing the present invention,

[0040] - Figure 2 is a 3D view of the switch unit,

[0041] - Figure 3 is a 3D view of the switch unit with the control plate, cover, and spring system removed.

[0042] - Figure 4 is a 3D view of the capacitor of the switching unit,

[0043] - Figure 5 is a flow chart of a method for manufacturing a capacitor,

[0044] - Figure 6It is a three-dimensional cross-sectional view of the busbar and busbar bracket of the switch unit.

[0045] - Figure 7 A 3D view of the busbars of a switch unit, its brackets and capacitors, in which the fastening pins can be seen before they are riveted.

[0046] - Figure 8 is similar to Figure 7 View of the fastening pin after riveting.

[0047] - Fig. 9 This is a 3D view of the busbar bracket from above.

[0048] - Fig.10 is a three-dimensional cross-sectional view of the busbar of the switch unit, its bracket and the capacitor, showing the connection of the capacitor to the busbar,

[0049] - Fig.11 is a flow chart of the method of welding capacitors,

[0050] - Fig.12 is a cross-sectional view of one of the capacitors, the busbar and its bracket, showing a step of the welding method,

[0051] - Fig.13 is a 3D view of the switch cell power module control pins and their environment,

[0052] - Fig.14 is a 3D view of a variation of the control pin,

[0053] - Fig.15 It is shown Fig.14 A 3D view of the protrusion of the control pin,

[0054] - Fig.16 is a flow chart of a method of manufacturing a switching unit,

[0055] - Fig.17 is a 3D cross-sectional view of the electrical system housing the switchgear, such as an inverter, and

[0056] - Fig.18 is a block diagram of a method for assembling an electrical system. DETAILED DESCRIPTION

[0057] In the following description and claims, various components and elements will be spatially positioned relative to each other with reference to an orthogonal coordinate system XYZ in an arbitrary orientation, which includes an X direction, a Y direction, and a Z direction. For clarity, the X direction will be referred to as the left-right direction (in the figures, the X direction arrow points to the left), the Y direction will be referred to as the front-back direction (in the figures, the Y direction arrow points to the back), and the Z direction will be referred to as the up-down direction (in the figures, the Z direction arrow points to the top).

[0058] With reference to the drawings, one example of a switch unit 100 embodying the present invention will now be described.

[0059] refer to Figure 1 The switch unit 100 first includes a plurality of power modules 102. In the illustrated example, three power modules 102 are provided. The power modules 102 are placed side by side with each other, for example.

[0060] The switch unit 100 further includes a controller circuit board 104 for controlling the power module 102. The controller circuit board 104 is located above the power module 102, for example.

[0061] The switch unit 100 further includes a circuit 106 for cooling the power module 102 .

[0062] The cooling circuit 106 includes a cooling housing 108 defining a channel 110 for coolant flow. The cooling housing 108 has an upper cooling surface 112 and a lower cooling surface 113, both of which are cooled by the coolant flow through the channel 110. Thus, the power module 102 is pressed against the upper cooling surface 112 to be cooled.

[0063] In order to keep the power module 102 pressed against the upper cooling surface 112, the switch unit 100, for example, first comprises a cover 114 located above the power module 102, for example between the controller circuit board 104 and the power module 102. The cover 114 is fastened to the cooling housing 108, for example, by screws. The switch unit 100 also includes a spring system inserted between the cover 114 and the power module 102. The spring system is therefore designed to abut against the cover 114 and push the power module 102 toward the upper cooling surface 112. For each power module 102, the spring system, for example, comprises a leaf spring 116, which is compressed between the cover 114 and the power module 102.

[0064] The cooling circuit 106 further comprises an inlet duct 118 for coolant entering the cooling housing 108 and an outlet duct 120 for coolant flowing out of the cooling housing 108. The ducts 118, 120 are for example located on the right and left sides of the cooling housing 108, respectively, and extend vertically downwards from the latter.

[0065] The switch unit 100 also includes a busbar called a positive busbar 128 and a busbar called a negative busbar 130, which are stacked on top of each other. Thus, one of the two busbars 128, 130 forms a lower busbar, while the other forms an upper busbar. The busbar called the positive busbar 130 and the busbar called the negative busbar 128 each include a first plate and a second plate, the first plate being made of the same material as the second plate and being formed integrally with the second plate.

[0066] In the example described, the first plate of each of the two busbars is a flat plate.

[0067] For example, the first plate of the positive busbar 128 is located below the first plate of the negative busbar 130, and the first plate of the negative busbar 130 is located below the cooling housing 108. Therefore, the positive busbar 128 forms the lower busbar and the negative busbar 130 forms the upper busbar. The opposite configuration is also possible.

[0068] Furthermore, a second plate of the positive busbar 128 and a second plate of the negative busbar 130 are placed along one side of the cooling housing 108 .

[0069] The positive busbar 128 is designed to have a high potential, and the negative busbar 130 is designed to have a low potential lower than the high potential, so the busbars 128 and 130 are designed to have a DC voltage U between them. DC .

[0070] The busbars 128, 130 are connected to each power module 102 via at least one connection terminal extending from their second plates so as to provide a DC voltage U DC Assigned to the latter.

[0071] In order to hold the busbars 128, 130 in place, the switch unit 100 comprises, for example, a bracket 132, which is made in particular of an electrical insulator, for example of plastic. More precisely, the bracket 132 has a bottom 134 on which the first plates of the busbars 128, 130 are located. The bracket 132 is fastened to the cooling housing 108 in such a way that the first plates of the busbars 128, 130 are located between the lower cooling surface 113 of the cooling housing 108 and the bottom 134 of the bracket 132. The busbars 128, 130 can thus be cooled by the lower cooling surface 113.

[0072] The switch unit 100 further includes capacitors 136, each of which includes capacitors connected to the busbars 128, 130 to receive a DC voltage U DC The capacitors 136 are designed to smooth the DC voltage U DC , and are often referred to as DC link capacitors.

[0073] Capacitors 136 are, for example, placed below the busbars 128, 130, particularly below the bottom 134 of the bracket 132, with their terminals 138, 140 passing through the bottom 134 of the bracket to reach the busbars 128, 130, as will be described in more detail below.

[0074] refer to Figure 2 Each power module 102 is designed to implement a DC voltage U DC and the corresponding AC voltage (such as the phase voltage of the motor).

[0075] Therefore, each power module 102 has an external connector 202 designed to carry this AC voltage. The external connector 202 takes the form of a planar rod, for example, preferably with a thickness of at least 0.8 mm.

[0076] The switch unit 100 further comprises a magnetic core 204 of a current sensor surrounding each external connector 202. The magnetic core 204 is annular and has a gap in which a Hall effect sensor may be placed, for example, to measure the current.

[0077] In order to hold the magnetic core 204 in place, the switch unit 100 further comprises a frame 206 carrying the magnetic core 204. The frame 206 is, for example, overmolded around the magnetic core and is fastened to the cooling housing 108, for example by screws.

[0078] refer to Figure 3 In addition to the AC external connector 202, each power module 102 also includes an external connector 302, called a positive connector, and an external connector 304, called a negative connector, which are designed to be connected to the positive busbar 128 and the negative busbar 130, respectively. These external connectors 302, 304 take the form of a planar bar, preferably with a thickness of at least 0.8 mm. In the example shown, two negative external connectors 304 are provided for each power module 102.

[0079] To perform the voltage conversion, each power module 102 implements, for example, a switching arm and therefore comprises in a housing 305 two switches 306, 308 connected to one another at a midpoint, the switches 306, 308 themselves being connected to the AC external connector 202 in order to deliver an AC voltage thereto. The switching arm is connected between the external connectors 302, 304 in order to deliver a DC voltage U DC For clarity, these switches 306, 308 are Figure 3 It is schematically shown for a single power module 102 in FIG. 1 , but not shown in other modules.

[0080] Each switch 306 , 308 is preferably a controllable semiconductor switch, for example a switch based on a transistor such as a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or indeed an Insulated Gate Bipolar Transistor (IGBT) or even a Gallium Nitride Field Effect Transistor (GaN FET).

[0081] Each power module 102 also has control pins 312, in particular allowing the controller board 104 to control the switching of the switches 306, 308. These control pins 312 are bent so as to have a horizontal section extending outside the housing 305 of the power module 102 and a vertical section rising up to the controller board 104.

[0082] refer to Figure 4, each capacitor 136 includes a body 402 , and each terminal 138 , 140 includes an inner portion 404 in the body 402 and an outer portion 406 outside the body 402 and protruding from the body 402 .

[0083] The body 402 includes, for example, a capacitor 408 and an overmolded portion 410 covering the capacitor 408. The capacitor 408 is a portion of the capacitor 136 that stores electrical energy. The overmolded portion 410 is made of, for example, resin. Therefore, the inner portion 404 of each terminal 138, 140 extends into the overmolded portion 410, for example, so as to engage with the capacitor 408.

[0084] The outer portion 406 of each terminal 138, 140 firstly has a support portion 412. The support portion 412 is, for example, continuous with the inner portion 404. The support portion 412 is, for example, planar.

[0085] The outer portion 406 of each terminal 138, 140 also has a connection portion 414, which is designed to be welded to a corresponding one of the busbars 128, 130, as will be described in detail below. The connection portion 414 is attached to the support portion 412 by bending and is away from the body 402. The connection portion 414 has an upper surface intended to be pressed against the associated busbar 128, 130 so as to be welded thereto, for example by laser welding.

[0086] In order to prevent the heat generated by welding from passing through the connection portion 414 and reaching the main body 402, the outer portion 406 of each terminal 138, 140 also has a protective portion 416, which is attached to the connection portion 414 by bending so as to be folded between the connection portion 414 and the main body 402. For example, the bending surface between the connection portion 414 and the protective portion 416 is positioned toward the bending between the support portion 412 and the connection portion 414.

[0087] The outer portion 406 of each terminal 138 , 140 further includes, for example, at least one auxiliary support portion 418 , which is attached to the connecting portion 414 by bending so as to protrude toward the body 402 , for example vertically downward as in the example shown.

[0088] The auxiliary support portion 418 has an end opposite to the connecting portion 414, which end is in contact with the main body 402 and, for example, extends into the main body 402. For example, this end is engaged in the overmolded portion 410, as in the example shown.

[0089] Furthermore, the end portion preferably has a hook 420, i.e. a protrusion. The protrusion is covered by the overmolded portion 410 in the protruding direction of the auxiliary support portion 418, i.e. vertically in the example shown. When the auxiliary support portion 418 is pulled parallel to the protruding direction, the hook 420 limits the risk of the auxiliary support portion 418 being pulled out of the overmolded portion 410 and the risk of the connection portion 414 being deformed.

[0090] Thus, the connecting portion 414 is carried by the supporting portion 412 and, where appropriate, by one or more auxiliary supporting portions 418 .

[0091] Preferably, each terminal 138, 140, or at least an outer portion 406 thereof, is formed from a single folded flat sheet.

[0092] refer to Figure 5 , one example of a method 600 of manufacturing capacitor 136 will now be described.

[0093] In step 602, terminals 138, 140 are obtained, for each of which the protection portion 416 is continuous with the connection portion 414. For example, each obtained terminal 138, 140 is planar and, for example, cut from a board. Therefore, before folding the board, the outer portion 406 and the inner portion 404 are coplanar and continuous with each other.

[0094] In step 604, the outer portion 406 is bent between the protective portion 416 and the connecting portion 414 so that the protective portion 416 is located below the connecting portion 414. In step 604, other bending operations may also be performed on the outer portion 406 of the terminal 138, 140 to have, for example, Figure 4 For example, after the protective portion 416 has been folded under the connecting portion 414, one or more auxiliary support portions 418 can be bent relative to the connecting portion 414. Finally, again for example, the entirety of the inner portion 404 and the support portion 412 can be bent relative to the connecting portion 414.

[0095] In step 606, the inner portion 404 of the terminal 138, 140 is secured to the capacitive device 408. Thus, the protective portion 416 is located between the connecting portion 414 and the body 402, which is free of the overmolded portion 410.

[0096] In step 608 , an overmold portion 410 is formed around the capacitive device 408 , around the inner portion 404 of the terminal 138 , 140 , and around the hook 420 , if provided for this purpose.

[0097] Reference Figure 6, an insulating layer 502 is provided, for example, above the first plate of the upper busbar 130 to insulate it from the cooling housing 108. Similarly, an insulating layer 504 is interposed between the busbars 128, 130.

[0098] Reference Figure 7 The bracket 132 has fastening pins 702, which are respectively received in holes produced in the first plate of the upper busbar 130. The fastening pins 702 protrude upward from the bottom 134 of the bracket 132, for example.

[0099] The bracket 132 also has, for example, pins 704 for positioning the lower busbar 128. Each positioning pin 704 penetrates into a corresponding hole of the first plate of the lower busbar 128 and allows the lower busbar 128 to be held in place. In particular, the positioning pins 704 are arranged to hold the first plate of the lower busbar 128 in a position perpendicular to the fastening pins 702. For example, the positioning pins 704 extend parallel to the fastening pins 702, i.e., extend upward.

[0100] Reference Figure 8 , the fastening pins 702 are each riveted to fasten the first plate of the upper busbar 130 to the bracket 132. In doing so, the lower busbar 128 is held in place because its first plate is clamped between the first plate of the upper busbar 130 and the bottom 134 of the bracket 132. Riveting includes deforming the end of each locating pin 704, for example while hot, to form a seat for the first plate of the upper busbar 130.

[0101] refer to Fig. 9 For each capacitor 136, the first plate of the lower busbar 128 has a hole 902 (e.g. a window or even a cutout) which exposes a portion 904 of the first plate of the upper busbar 130. This portion 904 is designed to be connected to one of the terminals 138, 140 of the capacitor 136 and is referred to hereinafter as "connection portion 904".

[0102] The connection portion 904 of the upper bus bar 130 has, for example, a protrusion 906 extending into the hole 902 of the first plate of the lower bus bar 128 .

[0103] Again, for each capacitor 136, the bottom 134 of the bracket 132 has a hole 908 (e.g., a window or even a cutout) that exposes a portion 910 of the first plate of the lower busbar 128. This portion 910 is designed to be connected to the other of the terminals 138, 140 of the capacitor 136, and is referred to hereinafter as the "connection portion 910". Preferably, the connection portion 910 of the first plate of the lower busbar 128 has a smaller thickness than the rest of the first plate of the lower busbar 128, and is, for example, at least 25% smaller in thickness. For example, the connection portion 910 has a thickness of at most 0.6 mm, while the first plate of the lower busbar 128 has a thickness of at least 1 mm around the connection portion 910. This smaller thickness makes it easier to solder the terminals 138, 140 of the capacitor 136.

[0104] The hole 908 of the bottom 134 further exposes the hole 902 of the first plate of the lower busbar 128. Therefore, the connection portion 904 of the first plate of the upper busbar 130, in particular the protrusion 906, is exposed through the hole 908 of the bottom 134 and through the hole 902 of the first plate of the lower busbar 128.

[0105] The protrusion 906 has, for example, a connection plane lower wall 912. Preferably, the connection wall 912 has a smaller thickness than the rest of the first plate of the upper busbar 130, and for example, a thickness of at least 25% less. For example, the connection wall 912 has a thickness of at most 0.6 mm, while the first plate of the lower busbar 128 has a thickness of at least 1 mm around the protrusion 906. This smaller thickness makes it easier to solder the terminals 138, 140 of the capacitor 136.

[0106] Furthermore, for each connection portion 910 of the first plate of the lower bus bar 128 , the first plate of the upper bus bar 130 has a hole (eg, a window or even a cutout) exposing the connection portion 910 .

[0107] refer to Fig.10 For each capacitor 136, one of the terminals (the negative terminal 140 in the illustrated example) is connected to the connection portion 904 of the upper busbar 130, more specifically, to the connection wall 912 of the protrusion 906, for example, by welding. The other terminal (the positive terminal 138 in the illustrated example) is connected to the connection portion 910 of the lower busbar 128, for example, by welding.

[0108] refer to Fig.11 , one example of a method 1100 for welding the capacitor 136 to the bus bars 128 , 130 will now be described.

[0109] In step 1102, the terminals 138, 140 of the capacitor 136 are pressed against the busbars 128, 130, respectively. For example, the connecting portions 414 of the terminals 138, 140 are respectively abutted against the connecting wall 912 of the protrusion 906 of the upper busbar 130 and the connecting portion 910 of the lower busbar 128. Preferably, the abutment is plane to plane, for example, abutting at least 20 mm. 2 of board.

[0110] In step 1104 , in order to weld each terminal 138 , 140 to the bus bar 128 , 130 against which the terminal 138 , 140 is pressed, a laser beam is transmitted to the bus bar 128 , 130 opposite the crimped terminal 138 , 140 .

[0111] Reference Fig.12 , laser beam 1202 is emitted by laser 1204 along direction 1206, sequentially passing through busbars 128, 130, connection portion 414 of crimping terminals 138, 140, protection portion 416 of crimping terminals 138, 140, and body 402 of capacitor 136. Therefore, direction 1206 is perpendicular to connection portion 414.

[0112] Furthermore, the presence of the hole in the first plate of the upper busbar 130 allows the laser beam to directly reach the connection 910 of the first plate of the lower busbar 128 in order to weld it to the terminal of the capacitor 136 against which it is pressed.

[0113] refer to Fig.13 In the frame 206, for each control pin 312, a notch 1302 for positioning the control pin 312 is provided. For the sake of clarity, the positioning notch 1302 is only used for one control pin in the figure.

[0114] By means of the positioning notch, the position of the control pin 312 can be ensured, which makes it easier to connect the control pin 312 to the circuit board 104. In addition, when such connection is achieved by forced insertion, the positioning notch 1302 reduces the risk of the control pin 312 being twisted during its forced insertion.

[0115] For example, the positioning recess 1302 has two walls 1304, 1306, between which an angle of between 80° and 100°, preferably between 90° and 95°, more preferably 90°, is formed in order to correctly position the control pin 312. The control pin 312 therefore has an end section 1308 terminating in an end 1310. The control pin 312 is designed to be inserted via its end 1310 into a corresponding receiving hole of the circuit board 104. This end section 1308 is, for example, straight (vertical in the example shown) and has a positioning portion 1312 having a length of at least 5 mm and extending over its entire length from each wall 1304, 1306 of the positioning recess 1302 by at most 0.5 mm.

[0116] therefore, Fig.13 The control pin 312 shown is designed, for example, to be freely (non-compulsory) inserted into a receiving hole and then soldered to the circuit board 104 .

[0117] Reference Fig.14 , another example of an embodiment is shown.

[0118] In this other example, the control pin 312 is designed, for example, to be forcibly inserted into a receiving hole of the circuit board 104 .

[0119] For this purpose, the end section 1308 has a part 1402 for forced insertion, the width of which is greater than the receiving hole of the circuit board. For example, the part 1402 for forced insertion includes two rods, which are connected at their ends and separated by a space in their middle.

[0120] Preferably, the frame 206 has at least one chamfer 1404 for guiding the control pin 312, more particularly its elbow, towards the positioning notch 1302. Thus, the chamfer 1404 makes it easier to insert the control pin 312 into the positioning notch 1302, in particular vertically.

[0121] Reference Fig.15 The end section 1308 also has a protrusion 1502 protruding perpendicular to the vertical direction so as to be located above the support portion in the vertical direction, preferably less than 0.1 mm away from the frame 206 in the vertical direction, and preferably in contact with the frame 206.

[0122] Thus, during forced insertion of the control pin 312, the projection 1502 abuts against the support portion, which allows a reaction to be applied to the pin. This avoids the need to temporarily provide a removable support during the forced insertion operation. In particular, the absence of such a temporary abutment greatly simplifies the tool used to perform forced insertion.

[0123] The protrusion 1502 is located, for example, between the portion 1402 for forced insertion and the positioning portion 1312 .

[0124] refer to Fig.16 , the method 1600 for manufacturing the switch unit 100 includes, for example, the following steps.

[0125] In step 1602 , a power module 102 having a control pin 312 protruding from a housing 305 is obtained.

[0126] In step 1604 , a circuit board 104 is obtained, wherein one hole receives each control pin 312 .

[0127] In step 1606, the power module 102 is fastened to the cooling housing of the support frame 206. During this fastening operation, the power module 102 is lowered vertically so that the control pins 312, which are guided in particular by the chamfers 1502, penetrate into the positioning recesses 1302, respectively.

[0128] In step 1608 , the circuit board 104 is vertically lowered toward the power module 102 , so that the control pins located in the positioning recesses are respectively inserted into the receiving holes.

[0129] refer to Fig.17 , the switch unit 100 is, for example, designed to form a part of an electrical system, such as an inverter 1702 .

[0130] The inverter 1702 comprises, for example, an electromagnetic compatibility (EMC) filter 1704 connected between the two busbars 128 , 130 and a housing (referred to as an overall housing 1706 ) in which the EMC filter 1704 and the switch unit 100 are placed.

[0131] The overall housing 1706 includes, for example, a main portion 1708 having an upper hole 1710 and a cover (not shown) designed to close the upper hole 1710. The overall housing 1706 also includes, for example, a lower hole 1712 for the capacitor 136 to pass through and a cover 1714 for closing the lower hole 1712.

[0132] The inlet duct 118 and the outlet duct 120 have two sections 1716, 1718, respectively, which protrude substantially parallel to each other in the same direction.

[0133] The overall housing 1706 then has two holes 1720, 1722 for the passage of the segments 1716, 1718, respectively. Each hole 1720, 1722 has, for example, a seal 1724, 1726 intended to interact with an inserted segment 1716, 1718.

[0134] Thus, the segments 1716, 1718 have respective ends 1728, 1730 outside the overall housing 1706, which are designed to be connected to a system for circulating a coolant. These ends 1728, 1730 may, for example, have an inlet chamfer. Thus, the connection of the cooling circuit is made outside the overall housing 1706 in order to reduce the risk of leakage into the overall housing in the event of a poor seal of the connection.

[0135] refer to Fig.18 , a method 1800 for assembling the electrical system 1702 will now be described.

[0136] In step 1802, the switch unit 100 is inserted into the main housing 1706 through the upper hole 1710. At this time, the sections 1716, 1718 of the conduits 118, 120 are respectively inserted into the holes 1720, 1722 formed in the main part 1708 to guide the positioning of the switch unit 100 in the main housing 1706.

[0137] In step 1804 , the switch unit 100 is fastened to the main portion 1708 of the overall housing 1706 , for example by a threaded connection.

[0138] In step 1806 , the upper hole 1710 of the main portion 1708 is closed by a cover (not shown) of the overall housing 1706 .

[0139] In summary, it will be noted that the present invention is not limited to the above-described embodiments. In particular, it will be apparent to those skilled in the art that various modifications may be made to the above-described embodiments based on the teachings just disclosed to them.

[0140] In particular, the order of the steps of the above-described method can be changed into any technically possible order.

[0141] In the detailed description of the invention provided above, the terms used must not be construed to limit the invention to the embodiments described in this specification, but must be construed to include all equivalents that those skilled in the art can provide by applying their general knowledge to the implementation of the teachings just disclosed to them.

Claims

1. A switch unit (100), comprising: - Power module (102); - a first busbar (130), called the upper busbar, and a second busbar (128), called the lower busbar, which are connected to each power module (102) in order to distribute a DC voltage (U DC ), the upper busbar and the lower busbar each include a first plate; and - at least one capacitor (136) having two terminals welded to the first busbar (130) and the second busbar (128), respectively; The invention is characterized in that an upper busbar (130) and a lower busbar (128) are stacked on each other, and it includes a bracket (132) for the upper busbar (130) and the lower busbar (128), the bracket including a bottom (134), a first plate of the stacked busbars (128, 130) is located on the bottom, the first plate of the lower busbar (128) has a hole (902), the hole exposes a part of the first plate of the upper busbar (130), called a connecting portion (904), and the bottom (134) has a hole (908), the hole (908) exposes a first plate of the lower busbar (128). A portion of a plate, referred to as a connecting portion (910), exposes at least a portion of the hole (902) of the first plate of the lower busbar (128) so as to connect the first terminal (138) of the capacitor (136) to the connecting portion (910) of the lower busbar (128) through the hole (908) of the bottom (134) on the one hand, and to connect the second terminal (140) of the capacitor (136) to the connecting portion (904) of the upper busbar (130) through the hole (908) of the bottom (134) and the hole (902) of the lower busbar (128) on the other hand.

2. The switch unit (100) according to claim 1, wherein: The connecting portion (910) of the first plate of the lower bus bar (128) has a smaller thickness than the remaining portion of the first plate of the lower bus bar (128).

3. The switch unit (100) according to claim 1 or 2, wherein: The first plate of the upper busbar (130) has a protrusion (906) extending into the hole (902) of the first plate of the lower busbar (128).

4. The switch unit (100) according to claim 3, wherein: The protrusion (906) has a planar lower connecting wall (912), the thickness of which is less than the thickness of the remaining portion of the first plate of the upper busbar (130).

5. The switch unit (100) according to any one of claims 1 to 4, wherein: The bracket (132) has a fastening pin (702), and wherein the first plate of the upper busbar (130) has a hole for receiving the fastening pin (702), the fastening pin (702) being riveted to fasten the first plate of the busbar (130) to the bracket (132).

6. The switch unit (100) according to claim 5, wherein: The first plate of the lower bus bar (128) is held between the first plate of the upper bus bar (130) and the bracket (132).

7. The switch unit (100) according to any one of claims 1 to 6, wherein: The bracket (132) has a pin (704) for positioning the first plate of the lower bus bar (128).

8. The switch unit (100) according to any one of claims 1 to 7, further comprising a circuit (106) for cooling the power module, the cooling circuit (106) comprising a cooling housing (108) defining a channel (110) for a coolant flow, the cooling housing (108) having an upper cooling surface (112) and a lower cooling surface (113), both of which are cooled by the coolant flow through the channel (110), the power module (102) being pressed against the upper cooling surface (112) to be cooled, and wherein, The first plate of the upper busbar (130) is in thermal contact with the lower cooling surface (113).

9. An inverter comprising the switch unit according to any one of claims 1 to 8. 10 . A mobile device, comprising the switch unit according to claim 1 or the inverter according to claim 9 .

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