High-speed cooling foam plastic forming device and use method thereof

Abstract

The invention discloses a high-speed cooling foam plastic forming device and a using method thereof.The high-speed cooling foam plastic forming device comprises a supporting frame, and a lower mold is fixedly connected to the inner side of the supporting frame. The high-speed cooling foam plastic forming device has the beneficial effects that by arranging a rack, a fourth steam hole and a fixed rotating rod, the rack can return to the inner side of a cooling inner ring frame, the rack drives a meshed gear to rotate, and the cooling effect is improved; the gear rotates to drive a fixed rotating rod on the inner side to rotate and adjust, the fixed rotating rod rotates to drive a heat dissipation air duct on the outer side to rotate and adjust the air blowing angle of the heat dissipation air duct, and synchronous air blowing and cooling are conducted on the lower mold and the upper mold, so that the cooling efficiency is improved; the cooling side of the semiconductor chilling plate cools the cold guide rod, and the first fan blows air into the connecting air bellow, cools the air and blows cold air, so that the cooling efficiency of the lower die and the upper die is improved.

Description

Technical Field

[0001] The invention relates to the technical field of foam molding, in particular to a high-speed cooling foam molding device and a use method thereof. Background Art

[0002] Foam molding is a plastic processing technology, mainly involving the molding process of foam plastics. Foam molding is a process in which the plastic raw materials are heated to a molten state, and then a foaming agent is added to form a large number of tiny bubbles in the molten material, and then molded and cooled and solidified to finally obtain a foam plastic product with a microporous structure. In the foam molding process, steam mainly plays the role of heating and expanding the plastic. The high temperature of steam can make thermoplastics soften, melt and expand rapidly, thereby forming the desired foam plastic product. The steam temperature required for foam molding is generally between 110℃ and 120℃. This temperature range can make thermoplastics reach an ideal softening and melting state, while avoiding excessive temperature. The problem of excessive expansion of plastic or inability to completely melt and expand the plastic due to too low temperature is solved. The steam pressure required for foam molding is generally between 0.4MPa and 0.6MPa. The higher the steam pressure, the greater its kinetic energy, the faster the plastic expands and the faster the molding speed. However, too high steam pressure can also have adverse effects on the molded products, such as dimensional instability and rough surface. Therefore, it is necessary to reasonably control the steam pressure. However, after multiple injection moldings, the upper and lower molds of the existing foam molding device often generate a lot of heat. The traditional foam molding device does not have the function of cooling the upper mold, and the cooling efficiency of the lower mold is not high enough. The upper and lower mold temperatures are high, and the time required for cooling is long, which reduces the production efficiency. Summary of the invention

[0003] The object of the present invention is to provide a high-speed cooling foam molding device and a method of using the same, so as to solve the problem that after multiple injection moldings, the upper mold and the lower mold of the existing foam molding device mentioned in the above background technology often generate a large amount of heat, the traditional foam molding device does not have the function of cooling the upper mold, the cooling efficiency of the lower mold is not high enough, the temperature of the upper mold and the lower mold is high, and the time required for cooling is long, which reduces the production efficiency.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-speed cooling foam molding device, comprising a support frame, a lower mold is fixedly connected to the inner side of the support frame, a plurality of annular cooling liquid-conducting pipes are fixedly connected to the interior of the lower mold at equal intervals, a connecting liquid tank is fixedly connected to both sides of the lower mold, the connecting liquid tank and the annular cooling liquid-conducting pipes are connected through a water pipe, a liquid-feeding pump is installed on one side of the support frame, one of the connecting liquid tanks is connected to the output end of the liquid-feeding pump through a liquid pipe, a drain pipe is fixedly connected to one side of the other connecting liquid tank, the input end of the liquid-feeding pump is fixedly connected to the liquid inlet pipe, a No. 1 hydraulic cylinder is installed on the top of the support frame, The output end of the No. 1 hydraulic cylinder is fixedly connected to the upper mold, and a plurality of No. 1 steam holes are equidistantly opened at the bottom of the upper mold. A No. 1 steam inlet pipe is fixedly connected to the interior of the upper mold, and the No. 1 steam inlet pipe is slidably connected to the support frame. The inner side of the support frame is fixedly connected to a cooling inner ring frame, and a plurality of inner fixed frames are equidistantly fixedly connected to the inner side of the cooling inner ring frame. The inner side of the inner fixed frame is rotatably connected to a fixed rotating rod, and the outer side of the fixed rotating rod is fixedly connected to a heat dissipation air duct, and the heat dissipation air duct is rotatably connected to the inner fixed frame. The inner side of the cooling inner ring frame is fixedly connected to an annular inner bellows, and the inner side of the annular inner bellows is fixedly connected to an inner heat dissipation blower head.

[0005] As a preferred solution of the present invention: the cooling inner ring frame is slidably connected to the inside with an inner sliding ring, the inner side of the inner sliding ring is equidistantly fixedly connected with a plurality of fixed inner blocks, the fixed inner blocks are slidably connected to the cooling inner ring frame, the inner side of the cooling inner ring frame is slidably connected with a plurality of racks, one side of the fixed inner block is fixedly connected to the rack, the outer side of the fixed rotating rod is fixedly connected with a gear, and the gear is meshingly connected with the rack.

[0006] As a preferred solution of the present invention: a plurality of No. 2 hydraulic cylinders are equidistantly installed inside the cooling inner ring frame, the output end of the No. 2 hydraulic cylinder is fixedly connected to the inner sliding ring, the internal sliding connection of the fixed inner block is provided with a limiting rod, and the limiting rod is fixedly connected to the cooling inner ring frame.

[0007] As a preferred solution of the present invention: an annular air cavity is provided inside the cooling inner ring frame, and the annular air cavity is connected to the heat dissipation air duct through a connecting air duct.

[0008] As a preferred solution of the present invention: one side of the support frame is fixedly connected to a fixed side frame, the top of the fixed side frame is fixedly connected to a connecting bellows, a plurality of cooling rods are equidistantly fixedly connected to the inside of the connecting bellows, a semiconductor refrigeration plate is installed on the top of the connecting bellows, the cooling side of the semiconductor refrigeration plate is connected to the cooling rod, a No. 1 fan is installed on the top of the fixed side frame, the input end of the No. 1 fan is fixedly connected to a filter air duct, and the output end of the No. 1 fan is connected to the connecting bellows through an air duct.

[0009] As a preferred solution of the present invention: the connecting bellows is connected to the annular inner bellows via a No. 2 connecting air duct, the connecting bellows is connected to the annular air cavity via a No. 1 connecting air duct, and a No. 2 fan cooperating with the semiconductor refrigeration plate is installed on the top of the connecting bellows.

[0010] As a preferred solution of the present invention: a ejection plate is arranged inside the lower mold, a ejection cylinder is installed inside the lower mold, the output end of the ejection cylinder is fixedly connected to the ejection plate, a steam pipe is opened inside the lower mold, a plurality of No. 3 steam holes are opened equidistantly on the top of the steam pipe, and a plurality of No. 2 steam holes cooperating with the No. 3 steam holes are opened equidistantly inside the ejection plate.

[0011] As a preferred solution of the present invention: a No. 2 steam cavity is opened inside the lower mold, the No. 1 steam cavity is connected to the No. 2 steam cavity by a steam pipe, and a plurality of No. 4 steam holes are opened at equal intervals on the inner side of the lower mold, and the No. 4 steam holes are connected to the No. 2 steam cavity.

[0012] As a preferred solution of the present invention: a limiting slide bar is symmetrically fixedly connected to the top of the upper mold, and the limiting slide bar is slidably connected to the support frame.

[0013] A method for using a high-speed cooling foam molding device comprises the following steps:

[0014] S1. The device is centrally controlled through an external controller, and the device is powered on through an external power supply. The upper mold is driven to move downward through the output end of the No. 1 hydraulic cylinder, and the upper mold and the lower mold are molded together. The foam molding material is placed in the lower mold in advance, and steam is injected into the No. 1 steam cavity through the steam pipe. The steam is blown out through the No. 3 steam hole and the No. 2 steam hole in the ejector plate. The steam in the No. 1 steam cavity enters the No. 2 steam cavity, and heats the material in the lower mold through the No. 4 steam hole on the inner side of the No. 2 steam cavity. Steam is injected into the upper mold through the No. 1 steam inlet pipe, and sprayed out through the No. 1 steam hole to heat the material between the lower mold and the upper mold, and perform foam molding.

[0015] S2. When cooling is required after the foam molding is completed, the output end of the No. 1 hydraulic cylinder drives the upper mold to move upward, and the upper mold is separated from the lower mold. During cooling, air is blown into the connecting bellows through the No. 1 fan, and the cooling rod is cooled by the side of the semiconductor refrigeration plate. After the cooling rod is cooled, the air circulating in the connecting bellows is cooled, and the cold air enters the No. 2 connecting air duct and the No. 1 connecting air duct, and the cold air enters the annular inner bellows and blows through each inner heat dissipation blowing head on the inside, and the upper mold on the inner side of the cooling inner ring frame is blown to dissipate heat. The cold air in the annular air cavity enters the heat dissipation air duct through the connecting air duct and is blown out through the heat dissipation air duct;

[0016] S3, the output end of the No. 2 hydraulic cylinder drives the inner sliding ring and the fixed inner block to adjust the height position, the fixed inner block drives the rack to slide on the inner side of the cooling inner ring frame, the rack moves and drives the gear to rotate, the gear rotates and drives the inner fixed rotating rod to rotate, the fixed rotating rod drives the outer cooling duct to rotate and adjust the angle, and adjust the blowing angle of the cooling duct;

[0017] S4. Cooling air is blown to the inner sides of the upper and lower molds at the same time to dissipate heat. External coolant is pumped in through a liquid delivery pump and enters the annular cooling liquid pipe through one of the connecting liquid tanks to further cool the lower mold. The ejector plate is driven upward by the output end of the ejector cylinder to facilitate ejection of the foamed material in the lower mold and facilitate material removal.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention realizes that the rack is on the inner side of the cooling inner ring frame by arranging a rack, a No. 4 steam hole and a fixed rotating rod, and the rack drives the meshing gear to rotate, and when the gear rotates, it drives the inner fixed rotating rod to rotate and adjust, and when the fixed rotating rod rotates, it drives the outer heat dissipation air duct to rotate and adjust, and the blowing angle of the heat dissipation air duct is adjusted, and the lower mold and the upper mold are cooled synchronously by blowing, thereby improving the cooling efficiency, and by arranging a cooling rod and a semiconductor refrigeration plate, the cooling side of the semiconductor refrigeration plate cools the cooling rod, and the No. 1 fan blows air into the connected bellows to cool the wind, and blows cold air to improve the cooling efficiency of the lower mold and the upper mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the internal structure of the present invention;

[0020] Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 For the present invention Figure 1 Enlarged view of point B in the middle;

[0022] Figure 4 For the present invention Figure 1 Enlarged view of point C in the middle;

[0023] Figure 5 It is a top view of the inner sliding ring of the present invention.

[0024] In the figure: 1, support frame; 2, lower die; 3, No. 1 hydraulic cylinder; 4, upper die; 5, limit slide bar; 6, No. 1 steam inlet pipe; 7, No. 1 steam hole; 8, cooling inner ring frame; 9, No. 1 fan; 10, No. 1 steam cavity; 11, steam pipe; 12, ejector cylinder; 13, ejector plate; 14, No. 2 steam hole; 15, No. 3 steam hole; 16, No. 2 steam cavity; 17, No. 4 steam hole; 18, annular cooling liquid pipe; 19, connecting liquid tank; 20, liquid delivery pump; 21, drainage Tube; 22, annular air cavity; 23, connecting air duct; 24, internal fixed frame; 25, heat dissipation air cylinder; 26, fixed rotating rod; 27, gear; 28, rack; 29, inner sliding ring; 30, fixed inner block; 31, limit rod; 32, No. 2 hydraulic cylinder; 33, annular inner bellows; 34, internal heat dissipation blower head; 35, fixed side frame; 36, connecting bellows; 37, No. 1 connecting air duct; 38, No. 2 connecting air duct; 39, cooling rod; 40, semiconductor refrigeration plate; 41, No. 2 fan. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figures 1 to 5The present invention provides a technical solution: a high-speed cooling foam molding device, comprising a support frame 1, a lower mold 2 is fixedly connected to the inner side of the support frame 1, a plurality of annular cooling liquid-conducting pipes 18 are fixedly connected to the interior of the lower mold 2 at equal intervals, a connecting liquid tank 19 is fixedly connected to both sides of the lower mold 2, the connecting liquid tank 19 and the annular cooling liquid-conducting pipe 18 are connected through a water pipe, a liquid-feeding pump 20 is installed on one side of the support frame 1, one of the connecting liquid tanks 19 is connected to the output end of the liquid-feeding pump 20 through a liquid pipe, a side of the other connecting liquid tank 19 is fixedly connected to a drain pipe 21, an input end of the liquid-feeding pump 20 is fixedly connected to a liquid inlet pipe, a No. 1 hydraulic cylinder 3 is installed on the top of the support frame 1, an upper mold 4 is fixedly connected to the output end of the No. 1 hydraulic cylinder 3, a plurality of No. 1 steam holes 7 are evenly opened at the bottom of the upper mold 4, The interior of the upper mold 4 is fixedly connected with a steam inlet pipe No. 6, which is slidably connected to the support frame 1, and the inner side of the support frame 1 is fixedly connected with a cooling inner ring frame 8, and the inner side of the cooling inner ring frame 8 is fixedly connected with multiple inner fixed frames 24 at equal intervals, and the inner side of the inner fixed frame 24 is rotatably connected with a fixed rotating rod 26, and the outer side of the fixed rotating rod 26 is fixedly connected with a heat dissipation air tube 25, and the heat dissipation air tube 25 is rotatably connected to the inner side of the inner fixed frame 24, and the inner side of the cooling inner ring frame 8 is fixedly connected with an annular inner bellows 33, and the inner side of the annular inner bellows 33 is fixedly connected with an inner heat dissipation blowing head 34, and cold air is blown into the annular inner bellows 33 on the inner side of the cooling inner ring frame 8, and the cold air is blown through the inner heat dissipation blowing head 34 on the inner side of the annular inner bellows 33, so as to blow cold air to the upper mold 4 located on the inner side of the cooling inner ring frame 8 for heat dissipation.

[0027] Among them, the inner sliding ring 29 is slidably connected to the inside of the cooling inner ring frame 8, and a plurality of fixed inner blocks 30 are equidistantly fixedly connected to the inner side of the inner sliding ring 29. The fixed inner blocks 30 are slidably connected to the cooling inner ring frame 8. A plurality of racks 28 are slidably connected to the inner side of the cooling inner ring frame 8. One side of the fixed inner block 30 is fixedly connected to the rack 28. A gear 27 is fixedly connected to the outer side of the fixed rotating rod 26. The gear 27 is meshed with the rack 28. The rack 28 slides on the inner side of the cooling inner ring frame 8, and the rack 28 drives the meshed gear 27 to rotate. When the gear 27 rotates, it drives the inner fixed rotating rod 26 and the heat dissipation wind tube 25 to rotate and adjust, so as to adjust the blowing angle of the heat dissipation wind tube 25.

[0028] Among them, multiple No. 2 hydraulic cylinders 32 are equidistantly installed inside the cooling inner ring frame 8, the output end of the No. 2 hydraulic cylinder 32 is fixedly connected to the inner sliding ring 29, the internal sliding connection of the fixed inner block 30 is connected to the limiting rod 31, the limiting rod 31 is fixedly connected to the cooling inner ring frame 8, the output end of the No. 2 hydraulic cylinder 32 drives the inner sliding ring 29 to slide in the cooling inner ring frame 8, and drives the inner fixed inner block 30 and the rack 28 to move and adjust through the inner sliding ring 29.

[0029] Among them, an annular air cavity 22 is opened inside the cooling inner ring frame 8, and the annular air cavity 22 is connected to the heat dissipation air tube 25 through the connecting air duct 23. The cold air in the annular air cavity 22 enters the heat dissipation air tube 25 through the connecting air duct 23, and the cold air is blown through the heat dissipation air tube 25 to complete the cold air heat dissipation treatment of the lower mold 2 and the upper mold 4.

[0030] Among them, a fixed side frame 35 is fixedly connected to one side of the support frame 1, a connecting bellows 36 is fixedly connected to the top of the fixed side frame 35, a plurality of cooling rods 39 are fixedly connected at equal intervals inside the connecting bellows 36, a semiconductor refrigeration plate 40 is installed on the top of the connecting bellows 36, and the cooling side of the semiconductor refrigeration plate 40 is connected to the cooling rod 39, a No. 1 fan 9 is installed on the top of the fixed side frame 35, a filter air duct is fixedly connected to the input end of the No. 1 fan 9, and the output end of the No. 1 fan 9 is connected to the connecting bellows 36 through an air duct, the cooling side of the semiconductor refrigeration plate 40 cools the cooling rod 39, and the wind circulating in the connecting bellows 36 is cooled by the cooling rod 39, and a cold air cooling treatment is performed.

[0031] Among them, the connecting bellows 36 and the annular inner bellows 33 are connected by a No. 2 connecting air duct 38, and the connecting bellows 36 and the annular air chamber 22 are connected by a No. 1 connecting air duct 37. A No. 2 fan 41 cooperating with the semiconductor refrigeration plate 40 is installed on the top of the connecting bellows 36. The No. 2 fan 41 blows air to dissipate heat on the side of the semiconductor refrigeration plate 40 to improve the refrigeration efficiency of the semiconductor refrigeration plate 40, and cools the cooling rod 39 on the side cooled by the semiconductor refrigeration plate 40.

[0032] Among them, a ejection plate 13 is arranged inside the lower mold 2, a ejection cylinder 12 is installed inside the lower mold 2, the output end of the ejection cylinder 12 is fixedly connected to the ejection plate 13, a steam pipe 11 is opened inside the lower mold 2, a plurality of No. 3 steam holes 15 are equidistantly opened at the top of the steam pipe 11, a plurality of No. 2 steam holes 14 cooperating with the No. 3 steam holes 15 are equidistantly opened inside the ejection plate 13, the steam in the No. 1 steam cavity 10 enters the lower mold 2 through the No. 3 steam hole 15 and the No. 2 steam hole 14, and the material is subjected to high-temperature foaming treatment.

[0033] Among them, a No. 2 steam cavity 16 is opened inside the lower mold 2, and the No. 1 steam cavity 10 is connected to the No. 2 steam cavity 16 through a steam pipe. A plurality of No. 4 steam holes 17 are equidistantly opened on the inner side of the lower mold 2, and the No. 4 steam holes 17 are connected to the No. 2 steam cavity 16. The steam in the No. 2 steam cavity 16 enters the lower mold 2 through the No. 4 steam holes 17 to complete the material foaming molding work.

[0034] Among them, the top of the upper mold 4 is symmetrically fixedly connected with a limit slide bar 5, the limit slide bar 5 is slidably connected to the support frame 1, the output end of the No. 1 hydraulic cylinder 3 drives the upper mold 4 to move, and the upper mold 4 drives the limit slide bar 5 to slide within the support frame 1 to improve the adjustment stability of the upper mold 4.

[0035] A method for using a high-speed cooling foam molding device comprises the following steps:

[0036] S1, centrally control the device through an external controller, power on the device through an external power supply, drive the upper mold 4 to move downward through the output end of the No. 1 hydraulic cylinder 3, the upper mold 4 and the lower mold 2 are molded, and the foam molding material is placed in the lower mold 2 in advance, and steam is injected into the No. 1 steam cavity 10 through the steam pipe 11, and the steam is blown out through the No. 3 steam hole 15 and the No. 2 steam hole 14 in the top plate 13, and the steam in the No. 1 steam cavity 10 enters the No. 2 steam cavity 16, and heats the material in the lower mold 2 through the No. 4 steam hole 17 on the inner side of the No. 2 steam cavity 16, and injects steam into the upper mold 4 through the No. 1 steam inlet pipe 6, and sprays out through the No. 1 steam hole 7, so as to heat the material between the lower mold 2 and the upper mold 4, and perform foam molding;

[0037] S2. When cooling is required after the foam molding is completed, the output end of the No. 1 hydraulic cylinder 3 drives the upper mold 4 to move upward, and the upper mold 4 is separated from the lower mold 2. During cooling, air is blown into the connecting bellows 36 through the No. 1 fan 9, and the cooling rod 39 is cooled by the side of the semiconductor refrigeration plate 40. After the cooling rod 39 cools down, the air circulating in the connecting bellows 36 is cooled down, and the cold air enters the No. 2 connecting air duct 38 and the No. 1 connecting air duct 37, and the cold air enters the annular inner bellows 33 and blows through each inner heat dissipation blowing head 34 on the inside, and the upper mold 4 on the inner side of the cooling inner ring frame 8 is blown and dissipated. The cold air in the annular air cavity 22 enters the heat dissipation air cylinder 25 through the connecting air duct 23 and is blown out through the heat dissipation air cylinder 25;

[0038] S3, the output end of the second hydraulic cylinder 32 drives the inner sliding ring 29 and the fixed inner block 30 to adjust the height position, the fixed inner block 30 drives the rack 28 to slide on the inner side of the cooling inner ring frame 8, the rack 28 drives the gear 27 to rotate when it moves, the gear 27 drives the inner fixed rotating rod 26 to rotate when it rotates, the fixed rotating rod 26 drives the outer cooling air cylinder 25 to rotate and adjust the angle, and adjust the blowing angle of the cooling air cylinder 25;

[0039] S4. Cooling air is blown to the inner sides of the upper mold 4 and the lower mold 2 at the same time to dissipate heat. External coolant is pumped in by the liquid delivery pump 20 and enters the annular cooling liquid pipe 18 through one of the connecting liquid tanks 19 to further cool the lower mold 2. The ejecting plate 13 is driven upward by the output end of the ejecting cylinder 12 to facilitate ejection of the foamed material in the lower mold 2 and facilitate material removal.

[0040] Specifically, when in use, the device is centrally controlled by an external controller, and the device is powered on by an external power supply. The upper mold 4 is driven to move downward by the output end of the No. 1 hydraulic cylinder 3, and the upper mold 4 is molded with the lower mold 2. The foam molding material is placed in the lower mold 2 in advance, and steam is injected into the No. 1 steam cavity 10 through the steam pipe 11. The steam is blown out through the No. 3 steam hole 15 and the No. 2 steam hole 14 in the top plate 13. The steam in the No. 1 steam cavity 10 enters the No. 2 steam cavity 16, and is pushed to the lower mold through the No. 4 steam hole 17 inside the No. 2 steam cavity 16. 2, steam is injected into the upper mold 4 through the No. 1 steam inlet pipe 6, and is ejected through the No. 1 steam hole 7 to heat the material between the lower mold 2 and the upper mold 4 for foaming. When cooling is required after foaming, the output end of the No. 1 hydraulic cylinder 3 drives the upper mold 4 to move upward, and the upper mold 4 is separated from the lower mold 2. During cooling, air is blown into the connecting bellows 36 through the No. 1 fan 9, and the cooling side of the semiconductor refrigeration sheet 40 is cooled to cool the cooling rod 39. After the cooling rod 39 is cooled, the air circulating in the connecting bellows 36 is cooled, and the cold air enters the second The cold air enters the annular inner bellows 33 through the connecting air duct 38 and the connecting air duct 37, and is blown through the inner heat dissipation blowing heads 34 on the inner side to dissipate heat to the upper mold 4 on the inner side of the cooling inner ring frame 8. The cold air in the annular air cavity 22 enters the heat dissipation air cylinder 25 through the connecting air duct 23, and is blown out through the heat dissipation air cylinder 25. The output end of the No. 2 hydraulic cylinder 32 drives the inner sliding ring 29 and the fixed inner block 30 to adjust the height position. The fixed inner block 30 drives the rack 28 to slide on the inner side of the cooling inner ring frame 8, and the rack 28 drives the gear 27 to rotate when it moves. When the gear 27 rotates, the fixed rotating rod 26 on the inside is driven to rotate, and the fixed rotating rod 26 drives the heat dissipation air cylinder 25 on the outside to adjust the angle of rotation, and the blowing angle of the heat dissipation air cylinder 25 is adjusted, and cold air is blown to the inner sides of the upper mold 4 and the lower mold 2 at the same time to dissipate heat, and the external coolant is pumped in through the liquid feeding pump 20, and enters the annular cooling liquid pipe 18 through one of the connecting liquid tanks 19, and the lower mold 2 is further cooled. The ejection plate 13 is driven to move upward through the output end of the ejection cylinder 12, so that the material after foaming in the lower mold 2 can be ejected and the material can be taken out conveniently.

[0041] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0042] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0043] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-speed cooling foam molding device, characterized in that: The invention comprises a support frame (1), wherein the inner side of the support frame (1) is fixedly connected to a lower mold (2), the interior of the lower mold (2) is fixedly connected to a plurality of annular cooling liquid-conducting pipes (18) at equal intervals, both sides of the lower mold (2) are fixedly connected to a connecting liquid box (19), the connecting liquid box (19) and the annular cooling liquid-conducting pipes (18) are connected via a water pipe, a liquid-feeding pump (20) is installed on one side of the support frame (1), one of the connecting liquid boxes (19) is connected to the output end of the liquid-feeding pump (20) via a liquid pipe, a side of the other connecting liquid box (19) is fixedly connected to a drain pipe (21), the input end of the liquid-feeding pump (20) is fixedly connected to a liquid inlet pipe, a No. 1 hydraulic cylinder (3) is installed on the top of the support frame (1), the output end of the No. 1 hydraulic cylinder (3) is fixedly connected to an upper mold (4 ), a plurality of No. 1 steam holes (7) are equidistantly provided at the bottom of the upper mold (4), a No. 1 steam inlet pipe (6) is fixedly connected inside the upper mold (4), the No. 1 steam inlet pipe (6) is slidably connected to the support frame (1), a cooling inner ring frame (8) is fixedly connected on the inner side of the support frame (1), a plurality of inner fixed frames (24) are equidistantly fixedly connected on the inner side of the cooling inner ring frame (8), a fixed rotating rod (26) is rotatably connected on the inner side of the inner fixed frame (24), a heat dissipation air duct (25) is fixedly connected on the outer side of the fixed rotating rod (26), the heat dissipation air duct (25) is rotatably connected to the inner fixed frame (24), an annular inner bellows (33) is fixedly connected on the inner side of the cooling inner ring frame (8), and an inner heat dissipation blower head (34) is fixedly connected on the inner side of the annular inner bellows (33).

2. A high-speed cooling foam molding device according to claim 1, characterized in that: The cooling inner ring frame (8) is slidably connected to an inner sliding ring (29), and a plurality of fixed inner blocks (30) are equidistantly fixedly connected to the inner side of the inner sliding ring (29). The fixed inner blocks (30) are slidably connected to the cooling inner ring frame (8), and a plurality of racks (28) are slidably connected to the inner side of the cooling inner ring frame (8), and one side of the fixed inner block (30) is fixedly connected to the rack (28). A gear (27) is fixedly connected to the outer side of the fixed rotating rod (26), and the gear (27) is meshingly connected to the rack (28).

3. A high-speed cooling foam molding device according to claim 2, characterized in that: A plurality of No. 2 hydraulic cylinders (32) are equidistantly installed inside the cooling inner ring frame (8), the output end of the No. 2 hydraulic cylinder (32) is fixedly connected to the inner sliding ring (29), the internal sliding connection of the fixed inner block (30) is provided with a limit rod (31), and the limit rod (31) is fixedly connected to the cooling inner ring frame (8).

4. A high-speed cooling foam molding device according to claim 3, characterized in that: An annular air cavity (22) is provided inside the cooling inner ring frame (8), and the annular air cavity (22) is connected to a heat dissipation air cylinder (25) via a connecting air duct (23).

5. A high-speed cooling foam molding device according to claim 4, characterized in that: A fixed side frame (35) is fixedly connected to one side of the support frame (1), a connecting bellows (36) is fixedly connected to the top of the fixed side frame (35), a plurality of cooling rods (39) are fixedly connected at equal intervals inside the connecting bellows (36), a semiconductor refrigeration plate (40) is installed on the top of the connecting bellows (36), a cooling side of the semiconductor refrigeration plate (40) is connected to the cooling rod (39), a No. 1 fan (9) is installed on the top of the fixed side frame (35), an input end of the No. 1 fan (9) is fixedly connected to a filter duct, and an output end of the No. 1 fan (9) is connected to the connecting bellows (36) via an air duct.

6. A high-speed cooling foam molding device according to claim 5, characterized in that: The connecting bellows (36) is connected to the annular inner bellows (33) via a No. 2 connecting air duct (38), and the connecting bellows (36) is connected to the annular air cavity (22) via a No. 1 connecting air duct (37). A No. 2 fan (41) that cooperates with the semiconductor refrigeration plate (40) is installed on the top of the connecting bellows (36).

7. A high-speed cooling foam molding device according to claim 6, characterized in that: A ejection plate (13) is provided inside the lower mold (2), a ejection cylinder (12) is installed inside the lower mold (2), the output end of the ejection cylinder (12) is fixedly connected to the ejection plate (13), a steam pipe (11) is provided inside the lower mold (2), a plurality of No. 3 steam holes (15) are equidistantly provided at the top of the steam pipe (11), and a plurality of No. 2 steam holes (14) cooperating with the No. 3 steam holes (15) are equidistantly provided inside the ejection plate (13).

8. A high-speed cooling foam molding device according to claim 7, characterized in that: A No. 2 steam cavity (16) is provided inside the lower mold (2), the No. 1 steam cavity (10) and the No. 2 steam cavity (16) are connected via a steam pipe, and a plurality of No. 4 steam holes (17) are provided at equal intervals on the inner side of the lower mold (2), and the No. 4 steam holes (17) are connected to the No. 2 steam cavity (16).

9. A high-speed cooling foam molding device according to claim 8, characterized in that: The top of the upper mold (4) is symmetrically fixedly connected to a limiting slide bar (5), and the limiting slide bar (5) is slidably connected to the support frame (1).

10. A method for using a high-speed cooling foam molding device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, centrally controlling the device through an external controller, energizing the device through an external power supply, driving the upper mold (4) to move downward through the output end of the No. 1 hydraulic cylinder (3), closing the upper mold (4) with the lower mold (2), placing foam molding material in advance in the lower mold (2), injecting steam into the No. 1 steam cavity (10) through the steam pipe (11), blowing out through the No. 3 steam hole (15) and the No. 2 steam hole (14) in the ejector plate (13), the steam in the No. 1 steam cavity (10) enters the No. 2 steam cavity (16), and heats the material in the lower mold (2) through the No. 4 steam hole (17) on the inner side of the No. 2 steam cavity (16), injecting steam into the upper mold (4) through the No. 1 steam inlet pipe (6), and blowing out through the No. 1 steam hole (7), heating the material between the lower mold (2) and the upper mold (4), and performing foam molding; S2. When cooling is required after the foam molding is completed, the output end of the No. 1 hydraulic cylinder (3) drives the upper mold (4) to move upward, and the upper mold (4) is separated from the lower mold (2). During cooling, air is blown into the connecting bellows (36) through the No. 1 fan (9), and the cooling rod (39) is cooled by the side of the semiconductor refrigeration plate (40). After the cooling rod (39) is cooled, the air circulating in the connecting bellows (36) is cooled, and the cold air enters the No. 2 connecting air duct (38) and the No. 1 connecting air duct (37). The cold air enters the annular inner bellows (33) and blows through the internal heat dissipation blowing heads (34) on the inner side, and the upper mold (4) on the inner side of the cooling inner ring frame (8) is cooled by blowing. The cold air in the annular air cavity (22) enters the heat dissipation air cylinder (25) through the connecting air duct (23) and is blown out through the heat dissipation air cylinder (25); S3, the output end of the second hydraulic cylinder (32) drives the inner sliding ring (29) and the fixed inner block (30) to adjust the height position, the fixed inner block (30) drives the rack (28) to slide on the inner side of the cooling inner ring frame (8), the rack (28) drives the gear (27) to rotate when it moves, the gear (27) drives the inner fixed rotating rod (26) to rotate when it rotates, the fixed rotating rod (26) drives the outer heat dissipation air cylinder (25) to rotate and adjust the angle, so as to adjust the blowing angle of the heat dissipation air cylinder (25); S4, cooling air is blown to the inner sides of the upper mold (4) and the lower mold (2) at the same time to dissipate heat, external cooling liquid is pumped in through a liquid delivery pump (20), and enters the annular cooling liquid conduction pipe (18) through one of the connecting liquid boxes (19), so as to further cool the lower mold (2), and the ejection plate (13) is driven to move upward through the output end of the ejection cylinder (12), so as to facilitate ejection of the foamed material in the lower mold (2) and facilitate material removal.

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