Thermal management integrated module and automotive air conditioning system

Abstract

This application relates to the field of automotive air conditioning technology, and more particularly to a thermal management integrated module and an automotive air conditioning system. The thermal management integrated module includes a compressor, a liquid-cooled condenser, and a plate evaporator. The compressor includes an intake cover and an exhaust cover opposite to each other in a first direction, with an intake port on the intake cover and an exhaust port on the exhaust cover. The liquid-cooled condenser includes condenser plate bodies; the first end of the condenser plate body contacts the compressor's exhaust cover, so that the intake port of the condenser plate body directly connects to the exhaust port of the exhaust cover. The plate evaporator includes evaporator plate bodies; the first end of the evaporator plate body contacts the compressor's intake cover, so that the outlet port of the evaporator plate body directly connects to the intake port of the intake cover. The thermal management integrated module of this application solves the problems of existing thermal management integrated modules, such as large module size, inconvenience for vehicle layout, complex installation, and high leakage risk.

Description

Technical Field

[0001] This application relates to the field of automotive air conditioning technology, and in particular to a thermal management integrated module and an automotive air conditioning system. Background Technology

[0002] As the automotive industry continues to develop, consumers are placing increasing demands on the functionality of vehicles, as well as on passenger cabin space. In this context, achieving more functions within a limited space makes modular integration increasingly important and demanding.

[0003] For existing thermal management integrated module refrigerant circuits, an aluminum flow channel plate or valve plate is usually required as a base. The compressor, plate evaporator, liquid-cooled condenser and other components are installed on the aluminum flow channel plate or valve plate, and the components are connected by pipelines.

[0004] However, existing thermal management integrated modules are bulky in actual deployment, which is not conducive to vehicle layout, and the installation is complicated with a high risk of leakage. Summary of the Invention

[0005] The purpose of this application is to provide a thermal management integrated module and an automotive air conditioning system, thereby solving the problems of existing thermal management integrated modules having a large design volume, which is not conducive to vehicle layout, and having complex installation and high leakage risk.

[0006] According to a first aspect of this application, a thermal management integrated module is provided, comprising a compressor, a liquid-cooled condenser, and a plate evaporator; the compressor includes an intake cover and an exhaust cover facing each other in a first direction, the intake cover having an intake port and the exhaust cover having an exhaust port; the liquid-cooled condenser includes a condenser plate body, the condenser plate body including a plurality of condenser plates arranged along the first direction; the condenser plate body having an intake port facing a first end of the compressor, the first end of the condenser plate body contacting the exhaust cover of the compressor, such that the intake port of the condenser plate body is directly connected to the exhaust port of the exhaust cover; the plate evaporator includes an evaporator plate body, the evaporator plate body including a plurality of evaporator plates arranged along the first direction; the evaporator plate body having an outlet port facing a first end of the compressor, the first end of the evaporator plate body contacting the intake cover of the compressor, such that the outlet port of the evaporator plate body is directly connected to the intake port of the intake cover.

[0007] In any of the above technical solutions, the compressor, the liquid-cooled condenser, and the plate evaporator are all cylindrical; when viewed along the first direction, the compressor can cover the liquid-cooled condenser and the plate evaporator.

[0008] In any of the above technical solutions, further, the first end of the condenser plate body is directly connected to the exhaust cover of the compressor, or the condenser plate body and the exhaust cover of the compressor are integrally formed; the first end of the evaporator plate body is directly connected to the suction cover of the compressor, or the evaporator plate body and the suction cover of the compressor are integrally formed.

[0009] In any of the above technical solutions, the thermal management integrated module further includes a shut-off valve, a liquid storage tank, and a first electronic expansion valve; the shut-off valve is integrated on the outer side of the condenser plate body, the liquid storage tank is integrated on the outer side of the compressor, and the first electronic expansion valve is integrated on the outer side of the evaporator plate body; the outer side of the condenser plate body has a liquid outlet, and the outer side of the evaporator plate body has a liquid inlet; the liquid outlet of the condenser plate body is directly connected to the inlet of the shut-off valve, the outlet of the shut-off valve is connected to the inlet of the liquid storage tank, the outlet of the liquid storage tank is connected to the inlet of the first electronic expansion valve, and the outlet of the first electronic expansion valve is directly connected to the liquid inlet of the evaporator plate body.

[0010] In any of the above technical solutions, the condenser plate body further includes a recessed first clearance portion, and the shut-off valve is disposed in the first clearance portion; the evaporator plate body includes a recessed second clearance portion, and the first electronic expansion valve is disposed in the second clearance portion.

[0011] In any of the above technical solutions, the thermal management integrated module further includes a first pipeline and a second pipeline; the outlet of the shut-off valve is connected to the inlet of the liquid storage tank through the first pipeline; the outlet of the liquid storage tank is connected to the inlet of the first electronic expansion valve through the second pipeline; the first pipeline and the second pipeline are in contact with or share the same wall with the side wall of the compressor.

[0012] In any of the above technical solutions, the thermal management integrated module further includes a second electronic expansion valve, a first inlet pipe, a first outlet pipe, a second outlet pipe, a second inlet pipe, and a third pipeline; one end of the first inlet pipe is connected to the exhaust port of the exhaust cover, and the other end is connected to the condenser plate body; one end of the first outlet pipe is connected to the first inlet pipe, and the other end is connected to the inlet of the third pipeline; the condenser plate body is configured to avoid the first inlet pipe and the first outlet pipe; one end of the second outlet pipe is connected to the intake port of the intake cover, and the other end is connected to the evaporator plate body; one end of the second inlet pipe is connected to the second outlet pipe, and the other end is connected to the outlet of the second electronic expansion valve; the evaporator plate body is configured to avoid the second inlet pipe and the second outlet pipe; the outlet of the third pipeline is connected to the inlet of the second electronic expansion valve.

[0013] In any of the above technical solutions, the second electronic expansion valve is further integrated into the outer side of the evaporator plate body; the evaporator plate body forms a recessed third clearance portion, and the second electronic expansion valve is disposed in the third clearance portion; the third pipeline is in contact with or shares a wall with the side wall of the compressor.

[0014] In any of the above technical solutions, the thermal management integrated module further includes a first pressure-temperature sensor and a second pressure-temperature sensor; the condenser plate body forms a recessed fourth clearance portion, and the first pressure-temperature sensor is disposed in the fourth clearance portion to detect data information in the first air inlet pipe; the evaporator plate body forms a recessed fifth clearance portion, and the second pressure-temperature sensor is disposed in the fifth clearance portion to detect data information in the second air outlet pipe.

[0015] According to a second aspect of this application, an automotive air conditioning system is provided, including a thermal management integrated module as described above; the thermal management integrated module is disposed in the front compartment of the vehicle.

[0016] The thermal management integrated module of this application includes a compressor, a liquid-cooled condenser, and a plate evaporator. The compressor includes an intake cover and an exhaust cover facing each other in a first direction. The intake cover has an intake port, and the exhaust cover has an exhaust port. The liquid-cooled condenser includes a condenser plate body, which includes multiple condenser plates arranged along the first direction. An intake port is located at the first end of the condenser plate body facing the compressor, and the first end of the condenser plate body contacts the exhaust cover of the compressor, so that the intake port of the condenser plate body directly connects with the exhaust port of the exhaust cover. The plate evaporator includes an evaporator plate body, which includes multiple evaporator plates arranged along the first direction. An outlet port is located at the first end of the evaporator plate body facing the compressor, and the first end of the evaporator plate body contacts the intake cover of the compressor, so that the outlet port of the evaporator plate body directly connects with the intake port of the intake cover.

[0017] Based on the above technical features, the beneficial effects of this application are as follows:

[0018] The thermal management integrated module of this application adopts a cylindrical design, with the liquid-cooled condenser and plate evaporator directly contacting and docking with the left and right end covers of the compressor. There are no gaps between the three, and no separate physical pipes or pipe flow plates are required for connection, reducing the overall size of the product and making the overall structure compact. At the same time, it also reduces the risk of system leakage, improves the ease of assembly, and facilitates subsequent maintenance.

[0019] In other words, compared with traditional integrated module solutions, the thermal management integrated module of this application greatly reduces the number of parts, reduces the space required for the integrated module, saves materials, shortens the assembly and installation time, improves overall production efficiency, and also reduces the risk of refrigerant leakage.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram showing the overall structure of the thermal management integrated module according to an embodiment of this application is provided.

[0023] Figure 2 Show Figure 1 Another structural diagram from another perspective;

[0024] Figure 3 Show Figure 2 Another structural diagram from another perspective;

[0025] Figure 4 Show Figure 3 Another structural diagram from another perspective;

[0026] Figure 5 Show Figure 1 The front view;

[0027] Figure 6 Show Figure 5 A schematic diagram of the AA cross-sectional structure;

[0028] Figure 7 Show Figure 1 Side view;

[0029] Figure 8 A schematic diagram of the refrigerant circuit of the thermal management integrated module according to an embodiment of this application is shown.

[0030] Icons: 100-Compressor; 110-Exhaust cover; 120-Suction cover; 200-Liquid-cooled condenser; 210-Condenser plate body; 211-First clearance section; 212-Fourth clearance section; 300-Plate evaporator; 310-Evaporator plate body; 311-Second clearance section; 312-Third clearance section; 313-Fifth clearance section; 400-Stop valve; 500-Liquid receiver; 600-First electronic expansion valve; 700-First pressure and temperature sensor; 800-Second pressure and temperature sensor; 900-Second electronic expansion valve; 10-First pipeline; 20-Second pipeline; 30-Third pipeline; 40-First inlet pipe; 50-First outlet pipe; 60-Second outlet pipe; 70-Second inlet pipe; 80-Long bolt. Detailed Implementation

[0031] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0032] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0033] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0034] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0035] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0036] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0037] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0038] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0039] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0040] Prior to this application, existing thermal management integrated module refrigerant circuits typically required an aluminum flow channel plate or valve plate as a base, onto which components such as the compressor, plate evaporator, and liquid-cooled condenser were mounted, and the components were connected by piping. However, in practice, existing thermal management integrated modules are bulky, which is inconvenient for vehicle layout, and their installation is complex, posing a significant risk of leakage.

[0041] In view of this, the first aspect of this application provides a thermal management integrated module, thereby solving the aforementioned technical problems existing in existing thermal management integrated modules. Referring below... Figures 1 to 8 This application describes a thermal management integrated module according to some embodiments.

[0042] like Figures 1 to 4 As shown, the thermal management integrated module of this application includes a compressor 100, a liquid-cooled condenser 200, and a plate evaporator 300. The compressor 100 includes an intake cover 120 and an exhaust cover 110 facing each other in a first direction (see [reference]). Figure 6The air intake cover 120 has an air intake port, and the air exhaust cover 110 has an air exhaust port. The liquid-cooled condenser 200 includes a condenser plate body 210, which includes a plurality of condenser plates arranged along a first direction. The condenser plate body 210 has an air inlet at its first end facing the compressor 100, and the first end of the condenser plate body 210 contacts the exhaust cover 110 of the compressor 100, so that the air inlet of the condenser plate body 210 is directly connected to the exhaust outlet of the exhaust cover 110. The plate evaporator 300 includes an evaporator plate body 310, which includes a plurality of evaporator plates arranged along a first direction. The evaporator plate body 310 has an air outlet at its first end facing the compressor 100, and the first end of the evaporator plate body 310 contacts the suction cover 120 of the compressor 100, so that the air outlet of the evaporator plate body 310 is directly connected to the suction outlet of the suction cover 120.

[0043] The thermal management integrated module of this application adopts a cylindrical design, with the liquid-cooled condenser 200 and plate evaporator 300 directly contacting and docking with the left and right end caps of the compressor 100. There are no gaps between the three, and no separate physical pipelines or pipeline flow plates are required for connection, reducing the external envelope size of the product and thus making the overall structure compact. At the same time, it also reduces the risk of system leakage, improves the ease of assembly, and facilitates subsequent maintenance.

[0044] In other words, compared with traditional integrated module solutions, the thermal management integrated module of this application greatly reduces the number of parts, reduces the space required for the integrated module, saves materials, shortens the assembly and installation time, improves overall production efficiency, and also reduces the risk of refrigerant leakage.

[0045] Furthermore, in the embodiments of this application, such as Figures 1 to 4 As shown, the compressor 100, liquid-cooled condenser 200, and plate evaporator 300 are all cylindrical; when viewed along the first direction, the compressor 100 can cover the liquid-cooled condenser 200 and the plate evaporator 300. That is to say, the cross-sectional area of ​​the liquid-cooled condenser 200 and the plate evaporator 300 is smaller than the cross-sectional area of ​​the compressor exhaust cover 110 and the suction cover 120. This arrangement can not only further reduce the outer size of the product, but also facilitate the assembly of subsequent pipelines and components.

[0046] Furthermore, in the embodiments of this application, such as Figures 1 to 4As shown, the thermal management integrated module also includes a shut-off valve 400, a liquid receiver 500, and a first electronic expansion valve 600. The shut-off valve 400 is integrated on the outer side of the condenser plate body 210, the liquid receiver 500 is integrated on the outer side of the compressor 100, and the first electronic expansion valve 600 is integrated on the outer side of the evaporator plate body 310. The outer side of the condenser plate body 210 has a liquid outlet, and the outer side of the evaporator plate body 310 has a liquid inlet. The liquid outlet of the condenser plate body 210 is directly connected to the inlet of the shut-off valve 400, the outlet of the shut-off valve 400 is connected to the inlet of the liquid receiver 500, the outlet of the liquid receiver 500 is connected to the inlet of the first electronic expansion valve 600, and the outlet of the first electronic expansion valve 600 is directly connected to the liquid inlet of the evaporator plate body 310.

[0047] It should be noted that the shut-off valve 400 of this application can be directly integrated into the outer part of the condenser plate body 210 (multiple condenser plates); or the liquid-cooled condenser 200 includes the condenser plate body 210 (multiple condenser plates) and a condenser shell sleeved on the outside of the condenser plate body 210, with the shut-off valve 400 integrated into the outer part of the condenser shell. Similarly, the first electronic expansion valve 600 of this application can be directly integrated into the outer part of the evaporator plate body 310 (multiple evaporator plates); or the plate evaporator 300 includes the evaporator plate body 310 (multiple evaporator plates) and an evaporator shell sleeved on the outside of the evaporator plate body 310, with the first electronic expansion valve 600 integrated into the outer part of the evaporator shell.

[0048] Preferably, in the embodiments of this application, such as Figures 1 to 4 As shown, the thermal management integrated module also includes a first pipeline 10 and a second pipeline 20. The outlet of the shut-off valve 400 is connected to the inlet of the liquid storage tank 500 through the first pipeline 10; the outlet of the liquid storage tank 500 is connected to the inlet of the first electronic expansion valve 600 through the second pipeline 20; the first pipeline 10 and the second pipeline 20 are in contact with or share the same wall with the side wall of the compressor 100. Thus, there are no gaps between the shut-off valve 400, the liquid storage tank 500, the first electronic expansion valve 600, the first pipeline 10, and the second pipeline 20, and the compressor 100, the liquid-cooled condenser 200, and the plate evaporator 300, thereby further reducing the outer envelope size of the product and making the overall structure more compact.

[0049] Furthermore, in the embodiments of this application, such as Figure 2 As shown, the condenser plate body 210 forms a recessed first clearance portion 211, and the shut-off valve 400 is disposed in the first clearance portion 211; as Figure 3As shown, the evaporator plate body 310 forms a recessed second clearance portion 311, and the first electronic expansion valve 600 is disposed in the second clearance portion 311. In this way, the space saved by the recesses on the outer sides of the condenser plate body 210 and the evaporator plate body 310 is just enough for the installation of external components, thereby further reducing the size of the thermal management integrated module.

[0050] The plate heat exchanger in this application primarily adopts an irregularly shaped plate design, directly breaking away from traditional plate heat exchanger designs. This design offers greater flexibility than conventional square plate heat exchangers, addressing the issue of insufficient space in the vehicle's integrated modules. Furthermore, when the liquid-cooled condenser 200 includes a condenser housing, the condenser housing can be designed based on the contour of the irregularly shaped plate. Similarly, when the plate evaporator 300 includes an evaporator housing, the evaporator housing can be designed based on the contour of the irregularly shaped plate.

[0051] As described above, the thermal management integrated module of this application can be used in R290 refrigerant circuits, and when the second electronic expansion valve 900 is installed, it can be used in R134A refrigerant circuits. Figure 8 This is a system architecture diagram of this application. The thermal management integrated module includes an electric compressor 100, a plate evaporator 300, a liquid-cooled condenser, a liquid receiver 500, a first electronic expansion valve 600, a second electronic expansion valve 900, a shut-off valve 400, and sensors. The first pressure-temperature sensor 700 (high-pressure pressure-temperature sensor) is located at the discharge port of the compressor 100. After passing through the high-pressure pressure-temperature sensor, the refrigerant splits into two paths. Loop 1: The refrigerant passes through the second electronic expansion valve 900 and enters the suction port of the compressor 100. Loop 2: The refrigerant passes through the liquid-cooled condenser 200, then enters the shut-off valve 400, and after passing through the shut-off valve 400, enters the liquid receiver 500. After exiting the liquid receiver 500, it passes through the first electronic expansion valve 600 and enters the plate evaporator 300. Then, at the location of the low-pressure pressure-temperature sensor (second pressure-temperature sensor 800), it merges with Loop 1 and enters the compressor 100.

[0052] In the embodiments of this application, such as Figure 6As shown, the thermal management integrated module also includes a second electronic expansion valve 900, a first inlet pipe 40, a first outlet pipe 50, a second outlet pipe 60, a second inlet pipe 70, and a third pipe 30. One end of the first inlet pipe 40 is connected to the exhaust port of the exhaust cover 110, and the other end is connected to the condenser plate body 210. One end of the first outlet pipe 50 is connected to the first inlet pipe 40, and the other end is connected to the inlet of the third pipe 30. The condenser plate body 210 is configured to avoid the first inlet pipe 40 and the first outlet pipe 50. One end of the second outlet pipe 60 is connected to the intake port of the suction cover 120, and the other end is connected to the evaporator plate body 310. One end of the second inlet pipe 70 is connected to the second outlet pipe 60, and the other end is connected to the outlet of the second electronic expansion valve 900. The outlet of the third pipe 30 is connected to the inlet of the second electronic expansion valve 900. The evaporator plate body 310 is configured to avoid the second air inlet pipe 70 and the second air outlet pipe 60.

[0053] As described above, the first intake pipe 40 and the first outlet pipe 50 are directly integrated with the exhaust cover 110 of the compressor 100, eliminating the need for physical piping, thus reducing the product's size, minimizing the risk of system leakage, and saving materials. Furthermore, the first intake pipe 40 and the first outlet pipe 50 do not extend beyond the outer envelope of the condenser plate body 210. Similarly, the second outlet pipe 60 and the second intake pipe 70 are directly integrated with the suction cover 120 of the compressor 100, eliminating the need for physical piping, thus reducing the product's size, minimizing the risk of system leakage, and saving materials. Furthermore, the second outlet pipe 60 and the second intake pipe 70 do not extend beyond the outer envelope of the evaporator plate body 310.

[0054] Furthermore, in the embodiments of this application, such as Figure 3 As shown, the second electronic expansion valve 900 is integrated on the outer side of the evaporator plate body 310; the evaporator plate body 310 forms a recessed third clearance portion 312, and the second electronic expansion valve 900 is disposed in the third clearance portion 312; thus, the space saved by the recess on the outer side of the evaporator plate body 310 is just enough for the installation of the second electronic expansion valve 900, thereby further reducing the size of the thermal management integrated module.

[0055] Furthermore, the third pipe 30 contacts or shares a wall with the side wall of the compressor 100. This eliminates any gaps between the third pipe 30 and the compressor 100, further reducing the overall size of the product and making the overall structure more compact.

[0056] Additionally, in the embodiments of this application, such as Figure 2 As shown, the condenser plate body 210 forms a recessed fourth clearance portion 212, and the first pressure and temperature sensor 700 is disposed in the fourth clearance portion 212 to detect data information in the first intake pipe 40; as Figure 4As shown, the evaporator plate body 310 forms a recessed fifth clearance portion 313, and the second pressure and temperature sensor 800 is disposed in the fifth clearance portion 313 to detect data information in the second exhaust pipe 60.

[0057] Similarly, the space saved by the recesses on the outer sides of the evaporator plate body 310 and the condenser plate body 210 is just enough to accommodate the first pressure and temperature sensor 700 and the second pressure and temperature sensor 800, thereby further reducing the size of the thermal management integrated module. Likewise, the plate heat exchanger of this application mainly adopts an irregularly shaped plate design, directly breaking away from the traditional plate heat exchanger design. It offers greater flexibility than conventional square plate single plates, thus addressing the issue of insufficient space for the integrated module in the vehicle. Similarly, when the liquid-cooled condenser 200 includes a condenser shell, the condenser shell can be designed based on the contour of the irregularly shaped plate. Likewise, when the plate evaporator 300 includes an evaporator shell, the evaporator shell can be designed based on the contour of the irregularly shaped plate.

[0058] In summary, the highly integrated module of this application is characterized by its high degree of integration, eliminating the need for separate physical piping connections, reducing the product's external envelope size, simplifying installation, reducing the risk of system leakage, and saving materials. This application integrates the plate heat exchanger gas and piping onto the electric compressor cover plate, reducing piping installation, lowering costs, and also reducing the risk of system leakage. Furthermore, the plate heat exchanger plates utilize an irregularly shaped plate design, minimizing the size of the integrated module to meet the customer's space requirements within the vehicle.

[0059] Furthermore, it is worth mentioning in the embodiments of this application that, as Figure 6 and Figure 7 As shown, the first end of the condenser plate body 210 is directly welded to the exhaust cover 110 of the compressor 100, or the condenser plate body 210 and the exhaust cover 110 of the compressor 100 are integrally formed. Similarly, the first end of the evaporator plate body 310 is directly welded to the suction cover 120 of the compressor 100, or the evaporator plate body 310 and the suction cover 120 of the compressor 100 are integrally formed.

[0060] like Figure 7 As shown, the thermal management integrated module of this application mainly consists of three parts, namely... Figure 7 The assembly consists of three parts: A, B, and C. Part A integrates the plate evaporator 300 and a portion of the compressor 100 (including the suction cover 120), while part C integrates the liquid-cooled condenser 200 and the exhaust cover 110 of the compressor 100. Additionally, components and piping located on the outer sides of the liquid-cooled condenser 200, plate evaporator 300, and compressor 100 are correspondingly integrated onto these components. During assembly, parts A, B, and C are connected using long bolts 80.

[0061] According to a second aspect of this application, an automotive air conditioning system is provided, including the thermal management integrated module as described above. The thermal management integrated module of this application is suitable for a secondary loop architecture and is located in the front compartment of the vehicle.

[0062] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the scope of the technology disclosed in this application, or make equivalent substitutions for some of the technical features. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application.

Claims

1. A thermal management integrated module, characterized in that, The thermal management integrated module includes a compressor, a liquid-cooled condenser, and a plate evaporator; The compressor includes an intake cover and an exhaust cover that are opposite to each other in a first direction. The intake cover has an intake port and the exhaust cover has an exhaust port. The liquid-cooled condenser includes a condenser plate body, which includes a plurality of condenser plates arranged along the first direction; the condenser plate body has an air inlet at the first end facing the compressor, and the first end of the condenser plate body is in contact with the exhaust cover of the compressor, so that the air inlet of the condenser plate body is directly connected to the exhaust outlet of the exhaust cover. The plate evaporator includes an evaporator plate body, which includes a plurality of evaporator plates arranged along the first direction; the evaporator plate body has an air outlet at the first end facing the compressor, and the first end of the evaporator plate body is in contact with the suction cover of the compressor, so that the air outlet of the evaporator plate body is directly connected to the suction port of the suction cover. The compressor, the liquid-cooled condenser, and the plate evaporator are all cylindrical; When viewed along the first direction, the compressor is able to cover the liquid-cooled condenser and the plate evaporator; The thermal management integrated module also includes a shut-off valve, a liquid storage tank, and a first electronic expansion valve; The shut-off valve is integrated on the outer side of the condenser plate body, the liquid storage tank is integrated on the outer side of the compressor, and the first electronic expansion valve is integrated on the outer side of the evaporator plate body. The outer side of the condenser plate body has a liquid outlet, and the outer side of the evaporator plate body has a liquid inlet; the liquid outlet of the condenser plate body is directly connected to the inlet of the shut-off valve, the outlet of the shut-off valve is connected to the inlet of the liquid storage tank, the outlet of the liquid storage tank is connected to the inlet of the first electronic expansion valve, and the outlet of the first electronic expansion valve is directly connected to the liquid inlet of the evaporator plate body.

2. The thermal management integrated module according to claim 1, characterized in that, The first end of the condenser plate body is directly connected to the exhaust cover of the compressor, or the condenser plate body and the exhaust cover of the compressor are integrally formed. The first end of the evaporator plate body is directly connected to the suction cover of the compressor, or the evaporator plate body and the suction cover of the compressor are integrally formed.

3. The thermal management integrated module according to claim 1, characterized in that, The condenser plate body forms a recessed first clearance portion, and the shut-off valve is disposed in the first clearance portion; The evaporator plate body forms a recessed second clearance portion, and the first electronic expansion valve is disposed in the second clearance portion.

4. The thermal management integrated module according to claim 1, characterized in that, The thermal management integrated module also includes a first pipeline and a second pipeline; The outlet of the shut-off valve is connected to the inlet of the liquid storage tank via a first pipeline; the outlet of the liquid storage tank is connected to the inlet of the first electronic expansion valve via a second pipeline. The first pipeline and the second pipeline are in contact with or share the same wall as the side wall of the compressor.

5. The thermal management integrated module according to claim 1, characterized in that, The thermal management integrated module also includes a second electronic expansion valve, a first air inlet pipe, a first air outlet pipe, a second air outlet pipe, a second air inlet pipe, and a third pipeline; One end of the first intake pipe is connected to the exhaust port of the exhaust cover, and the other end is connected to the condenser plate body; one end of the first exhaust pipe is connected to the first intake pipe, and the other end is connected to the inlet of the third pipe; the condenser plate body is configured to avoid the first intake pipe and the first exhaust pipe. One end of the second air outlet pipe is connected to the air inlet of the air inlet cover, and the other end is connected to the evaporator plate body; one end of the second air inlet pipe is connected to the second air outlet pipe, and the other end is connected to the outlet of the second electronic expansion valve. The evaporator plate body is configured to avoid the second air inlet pipe and the second air outlet pipe; the outlet of the third pipe is connected to the inlet of the second electronic expansion valve.

6. The thermal management integrated module according to claim 5, characterized in that, The second electronic expansion valve is integrated into the outer side of the evaporator plate body; The evaporator plate body forms a recessed third clearance portion, and the second electronic expansion valve is disposed in the third clearance portion; The third pipeline is in contact with or shares a wall with the side wall of the compressor.

7. The thermal management integrated module according to claim 5, characterized in that, The thermal management integrated module also includes a first pressure-temperature sensor and a second pressure-temperature sensor. The condenser plate body forms a recessed fourth clearance portion, and the first pressure and temperature sensor is disposed in the fourth clearance portion to detect data information in the first intake pipe. The evaporator plate body forms a recessed fifth clearance portion, and the second pressure and temperature sensor is disposed in the fifth clearance portion to detect data information in the second outlet pipe.

8. An automotive air conditioning system, characterized in that, Includes the thermal management integrated module as described in any one of claims 1-7; The thermal management integrated module is located in the front compartment of the vehicle.

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