A two-component epoxy resin adhesive and its preparation method and application

Abstract

The present invention belongs to the technical field of epoxy resin adhesives, and discloses a two-component epoxy resin adhesive, its preparation method and application. The two-component epoxy resin adhesive includes component A and component B; component A includes 40-50 parts of epoxy resin, 40-45 parts of the first filler, 6-8 parts of diluent, 2-3 parts of the first thixotropic agent, and 0.5-1 part of coupling agent; the epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin and epoxy toughening resin; component B includes 70-75 parts of the second filler, 20-25 parts of curing agent, 5-6 parts of additive, and 1-2 parts of the second thixotropic agent; the curing agent is a mixture of polyetheramine and m-xylene diamine; the mass ratio of component A to component B is 1:1-3:1. The two-component epoxy resin adhesive provided by the present invention is completely cured within 20 h at 20-30 °C, can also achieve a rapid reaction under the condition of low temperature of 0-10 °C, and also has high strength and high temperature resistance.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resins, and in particular to a two-component epoxy resin adhesive and its preparation method and application. Background Art

[0002] Due to factors such as pouring technology and decoration construction during the building process, as well as temperature changes, load effects, and material aging during use, materials such as concrete, stone, and steel have defects such as cracks and pores in their structures. These defects not only affect the aesthetic appearance of the structure but may also reduce the load-bearing capacity of the structure and cause safety problems. Therefore, it is of great significance to reinforce and repair the above materials in a timely manner.

[0003] The crack repair adhesive is required to have good permeability, low curing temperature, short curing time, high strength, and high bonding force. In terms of the curing time, the existing technology requires a long curing time and low strength, which affects the construction progress and also the curing and forming effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a two-component epoxy resin adhesive and its preparation method and application to solve the problem of long curing time of the existing crack repair adhesives.

[0005] To achieve the above-mentioned invention purpose, the present invention provides the following technical solutions

[0006] The present invention provides a two-component epoxy resin adhesive, comprising component A and component B;

[0007] Component A includes the following raw materials for preparation in parts by weight:

[0008] 40 - 50 parts of epoxy resin,

[0009] 40 - 45 parts of the first filler,

[0010] 6 - 8 parts of diluent,

[0011] 2 - 3 parts of the first thixotropic agent,

[0012] 0.5 - 1 part of coupling agent;

[0013] The epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin, and epoxy toughening resin;

[0014] Component B includes the following raw materials for preparation in parts by weight:

[0015] 70 - 75 parts of the second filler,

[0016] 20 - 25 parts of curing agent,

[0017] 5 - 6 parts of additive,

[0018] 1 - 2 parts of the second thixotropic agent;

[0019] The curing agent is a mixture of polyetheramine and m - xylylenediamine;

[0020] The mass ratio of component A to component B is 1 - 3:1.

[0021] Preferably, in the above - mentioned two - component epoxy resin adhesive, the mass ratio of the liquid epoxy bisphenol A resin, the semi - solid epoxy bisphenol A resin, and the epoxy toughening resin is 5.5 - 6.5:2.5 - 3.5:0.5 - 1.5.

[0022] Preferably, in the above - mentioned two - component epoxy resin adhesive, the first filler and the second filler are independently silica powder.

[0023] Preferably, in the above - mentioned two - component epoxy resin adhesive, the diluent is polypropylene glycol diglycidyl ether.

[0024] Preferably, in the above - mentioned two - component epoxy resin adhesive, the coupling agent is a silane coupling agent.

[0025] Preferably, in the above - mentioned two - component epoxy resin adhesive, the mass ratio of polyetheramine to m - xylylenediamine is 5 - 10:1 - 3.

[0026] Preferably, in the above - mentioned two - component epoxy resin adhesive, the additive is one or two of N - aminoethyl piperazine and wood cellulose.

[0027] Preferably, in the above - mentioned two - component epoxy resin adhesive, the first thixotropic agent and the second thixotropic agent are independently fumed silica.

[0028] The present invention also provides a preparation method of a two - component epoxy resin adhesive, comprising the following steps:

[0029] Mix the first filler, epoxy resin, and coupling agent for dispersion, and then add the first thixotropic agent and the diluent to obtain component A;

[0030] Mix the second filler, curing agent, additive, and second thixotropic agent to form component B;

[0031] Package component A and component B separately.

[0032] The present invention also provides an application of the two - component epoxy resin adhesive in repairing the crack defects of building materials.

[0033] Through the above - mentioned technical solutions, compared with the prior art, the present invention has the following beneficial effects:

[0034] (1) In the present invention, a nucleophilic addition reaction occurs between the amino group of the polyetheramine in Component B and the oxygen atom in the epoxy resin of Component A. Meanwhile, to ensure complete curing within 24 hours, N-aminoethylpiperazine and m-xylenediamine are added as accelerators to accelerate the reaction rate. The polyetheramine serves as the main curing agent; the lignocellulose is an additive to enhance the structural crosslinking effect and can improve the structural strength of the glue after curing.

[0035] (2) The two-component epoxy resin glue provided by the present invention can achieve complete curing within 20 hours at 20 - 30 °C; the complete curing time can be as low as 24 hours even under low-temperature conditions of 0 - 10 °C, and it also has high strength and high temperature resistance. Detailed implementation mode

[0036] The present invention provides a two-component epoxy resin glue, comprising Component A and Component B;

[0037] Component A includes the following raw materials for preparation in parts by weight:

[0038] 40 - 50 parts of epoxy resin,

[0039] 40 - 45 parts of the first filler,

[0040] 6 - 8 parts of diluent,

[0041] 2 - 3 parts of the first thixotropic agent,

[0042] 0.5 - 1 part of coupling agent;

[0043] The epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi-solid epoxy bisphenol A resin, and epoxy toughening resin;

[0044] Component B includes the following raw materials for preparation in parts by weight:

[0045] 70 - 75 parts of the second filler,

[0046] 20 - 25 parts of curing agent,

[0047] 5 - 6 parts of additive,

[0048] 1 - 2 parts of the second thixotropic agent;

[0049] The curing agent is a mixture of polyetheramine and m-xylenediamine;

[0050] The mass ratio of Component A to Component B is 1 - 3:1, preferably 1.3 - 2.7:1, further preferably 1.5 - 2.5:1, and more preferably 1.8 - 2:1.

[0051] In the present invention, the weight part of the epoxy resin in Component A is preferably 40 - 50 parts, further preferably 42 - 47 parts, and more preferably 44 - 45 parts.

[0052] In the present invention, the weight part of the first filler in the component A is preferably 40-45 parts, more preferably 41-44 parts, and still more preferably 42-43 parts.

[0053] In the present invention, the weight part of the diluent in the component A is preferably 6-8 parts, more preferably 6.3-7.8 parts, and still more preferably 6.8-7.5 parts.

[0054] In the present invention, the weight part of the first thixotropic agent in the component A is preferably 2-3 parts, more preferably 2.2-2.7 parts, and still more preferably 2.5-2.6 parts.

[0055] In the present invention, the weight part of the coupling agent in the component A is preferably 0.5-1 part, more preferably 0.6-0.9 part, and still more preferably 0.7-0.8 part.

[0056] In the present invention, the weight part of the second filler in the component B is preferably 70-75 parts, more preferably 71-74 parts, and still more preferably 72-73 parts.

[0057] In the present invention, the weight part of the curing agent in the component B is preferably 20-25 parts, more preferably 21-24 parts, and still more preferably 22-23 parts.

[0058] In the present invention, the weight part of the additive in the component B is preferably 5-6 parts, more preferably 5.2-5.8 parts, and still more preferably 5.4-5.5 parts.

[0059] In the present invention, the weight part of the second thixotropic agent in the component B is preferably 1-2 parts, more preferably 1.2-1.8 parts, and still more preferably 1.4-1.6 parts.

[0060] In the present invention, the liquid epoxy bisphenol A resin is preferably the Nanya 128E liquid epoxy bisphenol A resin; the semi-solid epoxy bisphenol A resin is preferably the Nanya 134 semi-solid epoxy bisphenol A resin; the epoxy toughening resin is preferably the Evonik 2364 epoxy toughening resin.

[0061] In the present invention, the liquid epoxy bisphenol A resin is used as the basic low-viscosity material, which is convenient for subsequent addition of other fillers or additives; the addition of the epoxy toughening resin can improve the rigidity of the cured colloid, providing toughness and crosslinking density; the addition of the semi-solid epoxy bisphenol A resin can improve the molecular weight, and the large molecular weight structure is superior to the liquid epoxy bisphenol A resin in terms of weather resistance and structure, but adding excessive semi-solid epoxy bisphenol A resin will result in high viscosity.

[0062] In the present invention, the mass ratio of the liquid epoxy bisphenol A resin, the semi-solid epoxy bisphenol A resin, and the epoxy toughening resin is preferably 5.5 to 6.5: 2.5 to 3.5: 0.5 to 1.5, more preferably 5.7 to 6.3: 2.7 to 3.3: 0.7 to 1.3, and still more preferably 6: 3: 1.

[0063] In the present invention, the first filler and the second filler are each independently preferably silica powder.

[0064] In the present invention, the diluent is preferably polypropylene glycol diglycidyl ether.

[0065] In the present invention, the coupling agent is preferably a silane coupling agent.

[0066] In the present invention, the silane coupling agent is preferably methyltriethoxysilane; methyltriethoxysilane can improve the interfacial activity between the glue and the substrate and enhance the adhesion.

[0067] In the present invention, the mass ratio of the polyetheramine and m-xylenediamine is preferably 5 to 10: 1 to 3, more preferably 6 to 9: 1.5 to 2.5, and still more preferably 7 to 8: 2 to 2.2.

[0068] In the present invention, the additive is preferably one or two of N-aminoethylpiperazine and wood cellulose.

[0069] In the present invention, the first thixotropic agent and the second thixotropic agent are each independently preferably fumed silica.

[0070] The present invention also provides a method for preparing a two-component epoxy resin adhesive, comprising the following steps:

[0071] Mix the first filler, the epoxy resin, and the coupling agent for dispersion, and then add the first thixotropic agent and the diluent to obtain component A;

[0072] Mix the second filler, the curing agent, the additive, and the second thixotropic agent to form component B;

[0073] Package component A and component B separately.

[0074] The present invention also provides an application of the two-component epoxy resin adhesive in repairing crack defects of building materials.

[0075] In the present invention, the building materials preferably include concrete columns, ceramics, stones, or steel.

[0076] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0077] Embodiment 1

[0078] A two-component epoxy resin adhesive, comprising component A and component B;

[0079] Component A includes the following raw materials for preparation by weight:

[0080] Epoxy resin (a mixture of Nanya 128E liquid epoxy bisphenol A resin, Nanya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin, the mass ratio of Nanya 128E liquid epoxy bisphenol A resin, Nanya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin is 6:3:1) 45 parts,

[0081] The first filler (silica powder) 44 parts,

[0082] Diluent (polypropylene glycol diglycidyl ether) 7.5 parts,

[0083] The first thixotropic agent (fumed silica) 3 parts,

[0084] Silane coupling agent (methyltriethoxysilane) 0.5 part;

[0085] Component B includes the following raw materials for preparation by weight:

[0086] The second filler (silica powder) 73 parts,

[0087] Curing agent (a mixture of polyetheramine and m-xylene diamine, the mass ratio of polyetheramine and m-xylene diamine is 7:2) 20 parts,

[0088] Additive (a mixture of N-aminoethylpiperazine and wood cellulose, the mass ratio of N-aminoethylpiperazine and wood cellulose is 4:3) 5 parts,

[0089] The second thixotropic agent (fumed silica) 2 parts;

[0090] The mass ratio of component A and component B is 2:1;

[0091] The preparation method of the two-component epoxy resin adhesive includes the following steps:

[0092] Put the first filler into the mixture of epoxy resin and silane coupling agent, disperse and stir evenly; put in the first thixotropic agent and diluent to obtain component A;

[0093] Add the second filler to the homogeneous mixture of the curing agent, additives and the second thixotropic agent to form Component B;

[0094] Pack Component A and Component B separately.

[0095] Comparative Example 1

[0096] Under the condition that other conditions in Example 1 remain unchanged, modify the composition of the epoxy resin to be a mixture of Nanya 128E liquid epoxy bisphenol A resin and Nanya 134 semi-solid epoxy bisphenol A resin, and the mass ratio of Nanya 128E liquid epoxy bisphenol A resin to Nanya 134 semi-solid epoxy bisphenol A resin is 5:3.

[0097] Comparative Example 2

[0098] Under the condition that other conditions in Example 1 remain unchanged, modify the mass ratio of Nanya 128E liquid epoxy bisphenol A resin, Nanya 134 semi-solid epoxy bisphenol A resin and Evonik 2364 epoxy toughening resin in the epoxy resin to 6:1:1.

[0099] Conduct performance tests on the two-component epoxy resin adhesives prepared in Example 1 and Comparative Examples 1-2. The process of the performance test: Take 4 concrete (naturally cured for 7 days), marble, ceramic, and stainless steel substrates with a length of 20 cm and a width of 1 cm, and bond them respectively with the two-component epoxy resin adhesives prepared in Example 1 and Comparative Examples 1-2. The bonding area is 1 cm × 1 cm. The specific method can refer to GB / T7124-2008; The results are shown in Table 1.

[0100] Table 1 Performance test results of the two-component epoxy resin adhesives in Example 1 and Comparative Examples 1-2

[0101]

[0102]

[0103] As can be seen from Table 1, the two-component epoxy resin adhesive prepared in Example 1 has a suitable viscosity and high shear strength during application, can adapt to bonding and repairing various materials, and can also ensure that the service performance after repair does not decrease; the two-component epoxy resin adhesive prepared in Comparative Example 1 lacks Evonik 2364 epoxy toughening resin, which will lead to a high viscosity of the finished product, difficult to penetrate, and at the same time cause the structure to be too rigid and easy to break, resulting in a decrease in strength; the proportion of Nanya 134 semi-solid epoxy bisphenol A resin in the two-component epoxy resin adhesive prepared in Example 3 is low, making the bonding force of the finished product insufficient and the strength of the structure not an ideal value, and it is easy to break. Among them, the test results of the concrete meet the strength index of the safety appraisal standard for concrete crack repair adhesives in GB50728-2011.

[0104] Comparative Example 3

[0105] Under the condition that other conditions in Example 1 remain unchanged, the curing agent (a mixture of polyetheramine and m-xylene diamine, and the mass ratio of polyetheramine to m-xylene diamine is 14:1) was modified.

[0106] Comparative Example 4

[0107] Under the condition that other conditions in Example 1 remain unchanged, the curing agent was modified to a single polyetheramine.

[0108] In addition, the curing time of the two-component epoxy resin adhesives prepared in Example 1 and Comparative Examples 3-4 was tested, and the curing times of the two-component epoxy resin adhesives prepared in Example 1 and Comparative Examples 3-4 are shown in Table 2.

[0109] Table 2 Curing times of the two-component epoxy resin adhesives in Example 1 and Comparative Examples 3-4

[0110]

[0111]

[0112] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements can be made without departing from the principle of the present invention, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A two-component epoxy resin adhesive, characterized in that, It includes component A and component B; The said component A includes the following raw materials for preparation in parts by weight: 40 - 50 parts of epoxy resin, 40 - 45 parts of the first filler, 6 - 8 parts of diluent, 2 - 3 parts of the first thixotropic agent, 0.5 - 1 part of coupling agent; The said epoxy resin is a mixture of liquid epoxy bisphenol A resin, semi - solid epoxy bisphenol A resin and epoxy toughening resin; The said component B includes the following raw materials for preparation in parts by weight: 70 - 75 parts of the second filler, 20 - 25 parts of curing agent, 5 - 6 parts of additive, 1 - 2 parts of the second thixotropic agent; The said curing agent is a mixture of polyetheramine and m - xylylenediamine; The mass ratio of the said polyetheramine to m - xylylenediamine is 5 - 10:1 - 3; The said additive is one or two of N - aminoethylpiperazine and wood cellulose; The mass ratio of the said liquid epoxy bisphenol A resin, semi - solid epoxy bisphenol A resin and epoxy toughening resin is 5.5 - 6.5:2.5 - 3.5:0.5 - 1.5; The mass ratio of the said component A to component B is 1 - 3:

1.

2. The two-component epoxy resin glue according to claim 1, wherein The said first filler and second filler are silica powder.

3. The two-component epoxy resin glue according to claim 2, wherein The said diluent is polypropylene glycol diglycidyl ether.

4. The two-component epoxy resin adhesive according to claim 3, wherein The said coupling agent is silane coupling agent.

5. The two-component epoxy resin adhesive according to claim 1, characterized in that, The said first thixotropic agent and second thixotropic agent are fumed silica.

6. The preparation method of the two-component epoxy resin adhesive according to any one of claims 1 to 5, characterized in that, It includes the following steps: Mix the first filler, epoxy resin and coupling agent for dispersion, and then add the first thixotropic agent and diluent to obtain component A; Mix the second filler, curing agent, additive and second thixotropic agent to form component B; Pack component A and component B separately.

7. Application of the two - component epoxy resin adhesive according to any one of claims 1 - 5 in repairing the crack defects of building materials.

Images