Adjustable computer support capable of adjusting position of semiconductor heat dissipation structure

Abstract

The invention relates to an adjustable computer support capable of adjusting the position of a semiconductor heat dissipation structure. The adjustable computer support comprises a support mechanism and a heat dissipation mechanism. The support mechanism comprises two supporting assemblies and a folding assembly, and the two ends of the folding assembly are hinged to the two supporting assemblies respectively. The supporting assembly comprises a bottom frame, a containing frame and a supporting rod, one end of the bottom frame is rotatably connected with one end of the containing frame, a bottom telescopic plate is slidably installed in the bottom frame, a top telescopic plate is slidably installed in the containing frame, one end of the supporting rod is hinged to the containing frame, the other end of the supporting rod is hinged to the bottom telescopic plate, and the hinge point between the supporting rod and the bottom telescopic plate is movable. The heat dissipation mechanism comprises two telescopic rods and a heat dissipation assembly, the two telescopic rods are installed on the two supporting assemblies, the heat dissipation assembly is installed on the two telescopic rods, and the positions of the two telescopic rods and the heat dissipation assembly can be adjusted; the heat dissipation assembly is composed of a semiconductor chilling plate, an aluminum heat conduction plate and a fan which are sequentially arranged. The device has the functions of fixed-point heat dissipation and foldable storage, can be adjusted according to user requirements, and is convenient for users to use.

Description

Technical Field

[0001] The invention relates to the technical field of computer brackets, and in particular to an adjustable computer bracket capable of adjusting the position of a semiconductor heat dissipation structure. Background Art

[0002] Laptop stands are used to place laptops. The designs of laptop stands on the market often fail to balance portability and the convenience of folding and storage. Although some stands have a folding function, they are still large in size after being folded, which is not conducive to quick storage or carrying. In addition, some lightweight stands sacrifice certain stability and durability while pursuing portability. Therefore, how to achieve lightweight portability while maintaining the stability of the stand has become a technical problem that needs to be solved urgently.

[0003] In addition, in terms of heat dissipation efficiency, the heat dissipation method adopted by most laptop stands is relatively simple, mainly by increasing the space at the bottom of the computer to increase air circulation, but when the computer is running at high load or working for a long time, the cooling effect of this passive heat dissipation method is not ideal. In addition, the heat dissipation stands on the market generally lack specificity and cannot accurately dissipate heat from the heating parts of the computer, resulting in low heat dissipation efficiency and energy waste. Although some heat dissipation stands equipped with fans can provide stronger heat dissipation effects, they are also accompanied by noise and additional energy consumption problems. These problems reveal the deficiencies in the heat dissipation design of existing laptop stands, especially in application scenarios that require efficient heat dissipation. How to effectively control heat has become a new technical issue. Summary of the invention

[0004] In order to solve the problems existing in the prior art, the present invention proposes an adjustable computer stand that can adjust the position of a semiconductor heat dissipation structure. The stand takes into account the portability when going out and the heat dissipation of a laptop computer, and has the functions of fixed-point heat dissipation and foldable storage, which is convenient for users to use.

[0005] The present invention is implemented as follows: an adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure comprises a stand mechanism and a heat dissipation mechanism;

[0006] The support mechanism comprises two support components arranged in a bilaterally symmetrical manner and a folding component located between the two support components, and two ends of the folding component are respectively hinged to the two support components;

[0007] The support assembly comprises a base frame, a placement frame, and a support rod. One end of the base frame and one end of the placement frame are rotatably connected. Both the base frame and the placement frame are hollow structures. A bottom telescopic plate is slidably installed in the hollow structure of the base frame along its axial direction, so that the base frame can be telescoped at the other end; a top telescopic plate is slidably installed in the hollow structure of the placement frame along its axial direction, so that the placement frame can be telescoped at the other end; one end of the support rod is hinged to the back side of the placement frame, and the other end is hinged to the bottom telescopic plate. The hinge point between the support rod and the bottom telescopic plate is movable, and the base frame, the support rod, and the placement frame form a triangular support structure;

[0008] The folding assembly comprises a folding frame, the folding frame comprises at least one folding unit, each folding unit comprises two folding rods that are rotatable in a cross shape, and the folding rods of two adjacent folding units are hinged by a rotating pin; one folding rod at both ends of the folding assembly is hinged to the bottom frame at a fixed point, and the other folding rod is slidably hinged to the bottom frame;

[0009] The heat dissipation mechanism includes two telescopic rods and a heat dissipation component, the two telescopic rods are installed on two supporting components, and the heat dissipation component is installed on the two telescopic rods, and the positions of the two telescopic rods and the heat dissipation component are adjustable; the heat dissipation component is composed of a semiconductor refrigeration sheet, an aluminum heat conductive plate, and a fan arranged in sequence, the aluminum heat conductive plate and the semiconductor refrigeration sheet are adhered by a heat conductive gel, and the fan is connected to the aluminum heat conductive plate by electric wires and fixed by screws.

[0010] In the above technical solution, preferably, a plurality of positioning holes are arranged on the bottom telescopic plate along its axial direction, and a fixing hole is arranged on the bottom frame and at the hollow structure, and a button can be inserted into the fixing hole and a positioning hole in sequence to fix the bottom frame and the bottom telescopic plate with adjusted position.

[0011] In the above technical solution, it is further preferred that the support rod is hinged to a fixing column at one end hinged to the bottom telescopic plate, and the fixing column is inserted into the positioning hole.

[0012] In the above technical solution, preferably, a long strip slot is opened on the base frame, a sliding part is slidably arranged in the long strip slot, the sliding part is hinged to a folding rod at both ends of the folding assembly, and a first fixing part is fixedly arranged at a fixed point on the base frame, and the first fixing part is hinged to another folding rod at both ends of the folding assembly.

[0013] In the above technical solution, preferably, a rotating shaft connecting piece is fixedly provided on the base frame, and one end of the placement rack is hinged to the rotating shaft connecting piece.

[0014] In the above technical solution, preferably, a second fixing portion is fixedly provided on the back side of the placement rack, and one end of the support rod is hinged to the second fixing portion.

[0015] In the above technical solution, preferably, a groove is opened on the front side of the placement rack, and a baffle is rotatably connected in the groove. When not in use, the baffle is completely located in the groove, and when in use, the baffle is rotated to be perpendicular to the front side of the placement rack.

[0016] In the above technical solution, it is further preferred that a semicircular notch is provided at one end of the groove away from the baffle rotation connection.

[0017] In the above technical solution, preferably, the top telescopic plate is provided with a long strip slot along its axial direction and through the left and right sides, and the placement rack is provided with a long strip notch matching the long strip slot through the left and right sides at the hollow structure;

[0018] The telescopic rod passes through the long strip notches of the two placing racks and / or the long strip slots of the two top telescopic plates, and is installed on the two placing racks and / or the two top telescopic plates through a fixing assembly.

[0019] In the above technical solution, it is further preferred that hooks are provided at the upper and lower ends of the heat dissipation component, and the heat dissipation component is connected to the two telescopic rods through the hooks;

[0020] The fixing assembly includes a limiter and a third fixing part, a limit countersunk hole is provided on one side of the limiter, one end of each telescopic rod is inserted into the limit countersunk hole, the bottom end of the limiter is rotatably connected to the third fixing part, the third fixing part is a toothed structure, a plurality of plug-in holes are respectively provided on the back of the placement rack and the back of the top telescopic plate along their respective axial directions, and the teeth of the third fixing part can be plugged into the plug-in holes to install and fix the telescopic rod;

[0021] Except for one end connected to the limiting member, each telescopic rod is provided with limiting rings on the left and right sides of the two placement racks and / or the two top telescopic plates and the left and right sides of the heat dissipation assembly to limit the telescopic rod and the heat dissipation assembly.

[0022] The advantages and positive effects of the present invention are:

[0023] 1. In the adjustable computer stand of the present invention, the position of the semiconductor heat dissipation mechanism can be automatically adjusted according to actual needs. The heat dissipation mechanism only acts on the heating part of the laptop computer, which effectively improves the heat dissipation efficiency of the laptop computer and the energy utilization rate of the heat dissipation process, reduces energy consumption and improves efficiency, which is in line with the concept of green development.

[0024] 2. The adjustable computer stand of the present invention can be applied to laptop computers of all sizes at present by adjusting the length of the base frame and the placement frame; at the same time, by adjusting the angle between the base frame and the placement frame, the adjustable computer stand can adjust the angle of the laptop computer to ensure that the computer screen can be at the best angle; the base frame and the placement frame are both hollow in design, which are used to place the corresponding telescopic plates, so that the corresponding telescopic plates can slide in the base frame and the placement frame; by fixing the position of the telescopic rod, placing the semiconductor heat dissipation mechanism at the position where heat dissipation is required and fixing it, the purpose of fixed-point heat dissipation can be achieved.

[0025] 3. The heat dissipation component of the present invention integrates advanced semiconductor cooling sheets, aluminum heat conductive plates and fans. Different from traditional fan heat dissipation, the semiconductor heat dissipation component can achieve higher heat dissipation efficiency for fixed parts in a shorter time.

[0026] 4. The base frame, placement frame, folding frame and telescopic rod of the present invention all have the function of telescopic transformation, so that the entire bracket can be easily folded and stored when not in use, and the volume occupied is only one-sixth of the traditional notebook radiator, which greatly improves the convenience of carrying. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, all the drawings required to be used in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention.

[0028] Figure 1 The structure of the adjustable computer stand provided by the embodiment of the present invention is shown in FIG. Figure 1 ;

[0029] Figure 2 The structure of the adjustable computer stand provided by the embodiment of the present invention is shown in FIG. Figure 2 ;

[0030] Figure 3 is a schematic structural diagram of a support assembly provided by an embodiment of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the cooperation between the bottom frame and the bottom telescopic plate provided by an embodiment of the present invention;

[0032] Figure 5 is a schematic structural diagram of a base frame provided by an embodiment of the present invention;

[0033] Figure 6 is a schematic structural diagram of a bottom telescopic plate provided in an embodiment of the present invention;

[0034] Figure 7It is a front structural schematic diagram of the cooperation between the placement rack and the top telescopic plate provided in an embodiment of the present invention;

[0035] Figure 8 The back structure diagram of the placement rack and the top telescopic plate provided in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0036] Fig. 9 The back structure diagram of the placement rack and the top telescopic plate provided in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0037] Fig.10 is a schematic diagram of the structure of a placement rack provided by an embodiment of the present invention;

[0038] Fig.11 is a schematic structural diagram of a top telescopic plate provided in an embodiment of the present invention;

[0039] Fig.12 is a schematic structural diagram of a support rod provided by an embodiment of the present invention;

[0040] Fig.13 is a schematic diagram of the structure of a folding assembly provided by an embodiment of the present invention;

[0041] Fig.14 The back structure diagram of the placement rack and the fixing assembly provided in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0042] Fig.15 The back structure diagram of the placement rack and the fixing assembly provided in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0043] Fig.16 is a schematic structural diagram of a third fixing portion provided by an embodiment of the present invention;

[0044] Fig.17 This is a schematic diagram of the structure of the adjustable computer stand provided by an embodiment of the present invention after being stored;

[0045] Fig.18 It is a structural schematic diagram of an adjustable computer stand with an open placement rack provided by an embodiment of the present invention;

[0046] Fig.19 It is a structural schematic diagram of an adjustable computer stand with support rods installed according to an embodiment of the present invention;

[0047] Fig. 20 It is a structural schematic diagram of an adjustable computer stand with a folding assembly unfolded according to an embodiment of the present invention;

[0048] Fig.21 It is a structural schematic diagram of an adjustable computer stand with a telescopic rod installed according to an embodiment of the present invention;

[0049] Fig. 22 The structure of the adjustable computer stand with the heat dissipation assembly installed is shown in FIG. Figure 1 ;

[0050] Fig.23 The structure of the adjustable computer stand with the heat dissipation assembly installed is shown in FIG. Figure 2 .

[0051] In the figure:

[0052] 10. Support assembly; 101. Base frame; 1011. Fixing hole; 1012. Long strip notch; 1013. Sliding part; 1014. First fixing part; 1015. Rotating shaft connector; 1016. Button; 102. Placement rack; 1021. Second fixing part; 1022. Groove; 1023. Baffle; 1024. Notch; 1025. Long strip notch; 1026. Plug-in hole; 103. Support rod; 1031. Fixing column; 104. Bottom telescopic plate; 1041. Positioning hole; 105. Top telescopic plate; 1051. Long strip slot;

[0053] 20. folding assembly; 201. folding rod;

[0054] 30. Telescopic rod;

[0055] 40. heat dissipation component; 401. semiconductor cooling sheet; 402. aluminum heat conducting plate; 403. fan; 404. hook; 405. limit ring;

[0056] 50. Fixing assembly; 501. Limiting member; 502. Third fixing portion. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical scheme and advantages of the present invention clearer, the specific scheme of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0058] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0059] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] See also Figures 1 to 16 An embodiment of the present invention provides an adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure, comprising a stand mechanism and a heat dissipation mechanism, wherein the stand mechanism is responsible for supporting a laptop computer, and the heat dissipation mechanism is responsible for dissipating heat from the laptop computer.

[0061] The support mechanism includes two support components 10 arranged symmetrically on the left and right and a folding component 20 located between the two support components 10. The two ends of the folding component 20 are respectively hinged to the two support components 10. The telescopic length of the folding component 20 is adjusted to adjust the distance between the two support components 10.

[0062] The support assembly 10 includes a base frame 101, a placement frame 102, and a support rod 103. One end of the base frame 101 is rotatably connected to one end of the placement frame 102. Both the base frame 101 and the placement frame 102 are hollow structures. A bottom telescopic plate 104 is slidably installed along the axial direction in the hollow structure of the base frame 101, so that the base frame 101 can be telescoped at the other end, and the telescope of the bottom telescopic plate 104 can be used to adjust the length of the base frame 101; a top telescopic plate 105 is slidably installed along the axial direction in the hollow structure of the placement frame 102, so that the placement frame 102 can be telescoped at the other end, and the telescope of the top telescopic plate 105 can be used to adjust the length of the placement frame 102; one end of the support rod 103 is hinged to the back side of the placement frame 102, and the other end is hinged to the bottom telescopic plate 104. The hinge point between the support rod 103 and the bottom telescopic plate 104 is movable, and the base frame 101, the support rod 103, and the placement frame 102 form a triangular support structure, which is stable.

[0063] The folding assembly 20 includes a folding frame, which includes at least one folding unit, each folding unit includes two rotatable folding rods 201 in a cross shape, and the folding rods 201 of two adjacent folding units are hinged by a rotating pin; one folding rod 201 at both ends of the folding assembly 20 is hinged to the base frame 101 at a fixed point, and the other folding rod 201 is slidably hinged to the base frame 101.

[0064] The heat dissipation mechanism includes two telescopic rods 30 and a heat dissipation assembly 40. The two telescopic rods 30 are installed on two supporting assemblies 10, and the heat dissipation assembly 40 is installed on the two telescopic rods 30. The positions of the two telescopic rods 30 and the heat dissipation assembly 40 are adjustable; the heat dissipation assembly 40 is composed of a semiconductor cooling sheet 401, an aluminum heat conductive plate 402, and a fan 403 arranged in sequence. The aluminum heat conductive plate 402 is bonded to the semiconductor cooling sheet 401 by a heat conductive gel, and the fan 403 is connected to the aluminum heat conductive plate 402 by an electric wire and fixed by screws.

[0065] By partially hollowing out the base frame 101 and the placement frame 102 on the traditional laptop computer stand, the base frame 101 and the placement frame 102 can be retracted and stored, which can greatly improve the adaptability and portability of the stand and the heat dissipation problem of the laptop computer. The heat can be accurately dissipated according to the parts of the computer that need heat dissipation, greatly improving the heat dissipation efficiency and heat dissipation effect.

[0066] Specifically, a plurality of positioning holes 1041 are arranged on the bottom telescopic plate 104 along its axial direction, and a fixing hole 1011 is arranged on the bottom frame 101 and at the hollow structure. A button 1016 can be inserted into the fixing hole 1011 and one of the positioning holes 1041 in sequence to fix the bottom frame 101 and the bottom telescopic plate 104 with adjusted position. When in use, the telescopic length of the bottom telescopic plate 104 is adjusted first, and then the button 1016 is inserted into the fixing hole 1011 and the corresponding positioning hole 1041.

[0067] The support rod 103 is hinged to a fixing column 1031 at one end hinged to the bottom telescopic plate 104, and the fixing column 1031 is inserted into the positioning hole 1041, so that the hinge point between the support rod 103 and the bottom telescopic plate 104 can be moved, and the angle of the placement rack 102 can be adjusted.

[0068] The base frame 101 is provided with a long strip slot 1012, in which a sliding part 1013 is slidably arranged, and the sliding part 1013 is hinged to a folding rod 201 at both ends of the folding assembly 20. The base frame 101 is fixedly provided with a first fixing part 1014 at a fixed point, and the first fixing part 1014 is hinged to another folding rod 201 at both ends of the folding assembly 20. In this embodiment, the lower end of the sliding part 1013 is stuck in the long strip slot 1012, and the height of the lower end of the sliding part 1013 is greater than the height of the bottom telescopic plate 104, so that there is a gap between the sliding part 1013 and the bottom telescopic plate 104, thereby avoiding the sliding collision problem between the two. The first fixing part 1014 is welded to the base frame 101.

[0069] A rotating shaft connecting member 1015 is fixedly provided on the base frame 101, and one end of the placement frame 102 is hinged to the rotating shaft connecting member 1015. In this embodiment, the rotating shaft connecting member 1015 is welded to the base frame 101.

[0070] A second fixing portion 1021 is fixedly disposed on the back of the placement rack 102, and one end of the support rod 103 is hinged to the second fixing portion 1021. In this embodiment, the second fixing portion 1021 is welded to the placement rack 102.

[0071] A groove 1022 is provided on the front of the placement rack 102, and a baffle 1023 is rotatably connected in the groove 1022. When not in use, the baffle 1023 is completely located in the groove 1022, and when in use, the baffle 1023 is rotated to be perpendicular to the front of the placement rack 102. In this embodiment, the baffle 1023 is located on the placement rack 102 to achieve a rotatable and adjustable storage function. A semicircular notch 1024 is provided at one end of the groove 1022 away from the baffle 1023 for rotatable connection, so as to facilitate the operation of rotating the baffle 1023.

[0072] The top telescopic plate 105 is provided with a long strip slot 1051 along its axial direction and passing through the left and right sides, and the placement rack 102 is provided with a long strip notch 1025 that cooperates with the long strip slot 1051 at the hollow structure passing through the left and right sides; the telescopic rod 30 passes through the long strip notches 1025 of the two placement racks 102 and / or the long strip slots 1051 of the two top telescopic plates 105, and is installed on the two placement racks 102 and / or the two top telescopic plates 105 through the fixing assembly 50.

[0073] Hooks 404 are provided at the upper and lower ends of the heat dissipation component 40, and the heat dissipation component 40 is connected to the two telescopic rods 30 through the hooks 404; the fixing component 50 includes a limit member 501 and a third fixing part 502, and a limit countersunk hole is provided on one side of the limit member 501, and one end of each telescopic rod 30 is inserted into the limit countersunk hole, and the bottom end of the limit member 501 is rotatably connected to the third fixing part 502, and the third fixing part 502 is a tooth-shaped structure, and a plurality of plug-in holes 1026 are respectively provided on the back side of the placement rack 102 and the back side of the top telescopic plate 105 along their respective axial directions, and the teeth of the third fixing part 502 can be plugged into the plug-in holes 1026 to install and fix the telescopic rod 30; the third fixing part 502 is installed on the placement rack 102 or the top telescopic plate 105 by the user after the user determines the installation position.

[0074] Except for one end of each telescopic rod 30 connected to the limiting member 501, limiting rings 405 are provided on the left and right sides of the two placement racks 102 and / or the two top telescopic plates 105, and on the left and right sides of the heat dissipation assembly 40 to limit the telescopic rod 30 and the heat dissipation assembly 40.

[0075] The extension and retraction process of the adjustable computer stand is as follows:

[0076] The bottom frame 101, the placement frame 102, the folding frame, and the telescopic rod 30 can all be telescopically transformed; the bottom frame 101 is provided with a button 1016, and the telescopic length of the bottom telescopic plate 104 can be adjusted by adjusting the button 1016, thereby completing the telescopic transformation of the bottom frame 101, that is, adjusting the length of the bottom frame 101; the placement frame 102 is provided with a top telescopic plate 105, and the telescopic transformation of the placement frame 102 is completed by adjusting the telescopic length of the top telescopic plate 105, that is, adjusting the length of the placement frame 102; the bottom frame 101 is provided with a sliding portion 1013 and a first fixing portion 1014, and the sliding portion 1013 and the first fixing portion 1014 are respectively hinged to a folding rod 201 By sliding the sliding part 1013 in the long strip slot 1012 of the bottom frame 101, the telescopic transformation of the folding frame is adjusted, and then the support assembly 10 is adjusted, which is more flexible and adjustable; the back of the placement frame 102 and the back of the top telescopic plate 105 are hollow structures with multiple plug holes 1026 to accommodate the installation of the third fixing part 502. After the third fixing part 502 is assembled with the limiting member 501, the telescopic rod 30 is inserted into the limiting countersunk hole and fixed to the placement frame 102 and / or the top telescopic plate 105. The telescopic rod 30 is adjusted according to the spacing between the two support assemblies 10, thereby completing the telescopic transformation of the telescopic rod 30, that is, the length adjustment of the telescopic rod 30.

[0077] The adjustment process of the heat dissipation mechanism position is as follows:

[0078] Adjust according to the heat dissipation position required by the user's laptop computer. First, adjust the support component 10 of the adjustable computer stand according to the size of the laptop computer, then find the position of the laptop computer that needs heat dissipation, adjust the specific position of the two telescopic rods 30 on the placement frame 102 and / or the top telescopic plate 105, and use the third fixing part 502 and the limiter 501 to fix the two telescopic rods 30 to the appropriate position of the placement frame 102 and / or the top telescopic plate 105, then pinch the two telescopic rods 30 to install the heat dissipation component 40 on the two telescopic rods 30, and adjust the heat dissipation component 40 left and right according to the required heat dissipation position, and after determining the position of the heat dissipation component 40, fix the heat dissipation component 40 on the two telescopic rods 30 through the limiter ring 405, and fix the telescopic rods 30 through the limiter ring 405.

[0079] In summary, the adjustable computer stand of the present invention is provided with a base frame 101, a placement frame 102, a support rod 103, a folding frame, a telescopic rod 30, and a heat dissipation component 40. When in use, the base frame 101, the placement frame 102, the folding frame, the telescopic rod 30, and the heat dissipation component 40 are adjusted to a state suitable for office use, such as Figure 18 to Figure 23 When not in use, it can be folded and contracted together for easy carrying. Fig.17When in use, the user can pull the button 1016 of the bottom frame 101 to extend the bottom frame 101, extend the folding frame to reach the required support structure, adjust the length of the placement frame 102 so that the laptop can be stably placed on the placement frame 102, and adjust the angle of the placement frame 102 so that the laptop display screen is kept at a height that is convenient for the user to use, and place the lower end of the support rod 103 at a suitable position on the bottom frame 101, then find the position where the laptop needs to dissipate heat, fix the two telescopic rods 30 at the appropriate positions of the placement frame 102 and / or the top telescopic plate 105 according to the required position, and then place the heat dissipation component 40 on the telescopic rod 30, and then adjust the heat dissipation component 40 to the required position according to the position where the laptop needs to dissipate heat, and then fix the heat dissipation component 40 by using the limit ring 405 to complete the adjustment.

[0080] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are within the scope of the technical solution of the present invention.

Claims

1. An adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure, comprising a stand mechanism and a heat dissipation mechanism; The support mechanism comprises two support components arranged symmetrically on both sides and a folding component located between the two support components, and the two ends of the folding component are respectively hinged to the two support components; the characteristics are: The support assembly comprises a base frame, a placement frame, and a support rod. One end of the base frame and one end of the placement frame are rotatably connected. Both the base frame and the placement frame are hollow structures. A bottom telescopic plate is slidably installed in the hollow structure of the base frame along its axial direction, so that the base frame can be telescoped at the other end; a top telescopic plate is slidably installed in the hollow structure of the placement frame along its axial direction, so that the placement frame can be telescoped at the other end; one end of the support rod is hinged to the back side of the placement frame, and the other end is hinged to the bottom telescopic plate. The hinge point between the support rod and the bottom telescopic plate is movable, and the base frame, the support rod, and the placement frame form a triangular support structure; The folding assembly comprises a folding frame, the folding frame comprises at least one folding unit, each folding unit comprises two folding rods that are rotatable in a cross shape, and the folding rods of two adjacent folding units are hinged by a rotating pin; one folding rod at both ends of the folding assembly is hinged to the bottom frame at a fixed point, and the other folding rod is slidably hinged to the bottom frame; The heat dissipation mechanism includes two telescopic rods and a heat dissipation component, the two telescopic rods are installed on two supporting components, and the heat dissipation component is installed on the two telescopic rods, and the positions of the two telescopic rods and the heat dissipation component are adjustable; the heat dissipation component is composed of a semiconductor refrigeration sheet, an aluminum heat conductive plate, and a fan arranged in sequence, the aluminum heat conductive plate and the semiconductor refrigeration sheet are adhered by a heat conductive gel, and the fan is connected to the aluminum heat conductive plate by electric wires and fixed by screws.

2. The adjustable computer stand capable of adjusting the position of the semiconductor heat dissipation structure according to claim 1, characterized in that: The bottom telescopic plate is provided with a plurality of positioning holes along its axial direction, and the bottom frame is provided with a fixing hole at the hollow structure. A button can be inserted into the fixing hole and a positioning hole in sequence to fix the bottom frame and the bottom telescopic plate with adjusted positions.

3. The adjustable computer stand capable of adjusting the position of the semiconductor heat dissipation structure according to claim 2, characterized in that: The support rod is hinged to a fixing column at one end hinged to the bottom telescopic plate, and the fixing column is inserted into the positioning hole.

4. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 1, characterized in that: The base frame is provided with a long strip slot, a sliding part is slidably arranged in the long strip slot, the sliding part is hinged to a folding rod at both ends of the folding assembly, and the base frame is fixedly provided with a first fixing part at a fixed point, the first fixing part is hinged to another folding rod at both ends of the folding assembly.

5. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 1, characterized in that: A rotating shaft connecting piece is fixedly arranged on the base frame, and one end of the placing frame is hinged to the rotating shaft connecting piece.

6. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 1, characterized in that: A second fixing portion is fixedly arranged on the back side of the placement rack, and one end of the support rod is hinged to the second fixing portion.

7. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 1, characterized in that: A groove is provided on the front of the placement rack, and a baffle is rotatably connected in the groove. When not in use, the baffle is completely located in the groove. When in use, the baffle is rotated to be perpendicular to the front of the placement rack.

8. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 7, characterized in that: A semicircular notch is formed at one end of the groove which is away from the baffle for rotation connection.

9. The adjustable computer stand capable of adjusting the position of a semiconductor heat dissipation structure according to claim 1, characterized in that: The top telescopic plate is provided with a long strip slot along its axial direction and through the left and right sides, and the placement rack is provided with a long strip notch matching the long strip slot through the left and right sides at the hollow structure; The telescopic rod passes through the long strip notches of the two placing racks and / or the long strip slots of the two top telescopic plates, and is installed on the two placing racks and / or the two top telescopic plates through a fixing assembly.

10. The adjustable computer stand capable of adjusting the position of the semiconductor heat dissipation structure according to claim 9, characterized in that: The upper and lower ends of the heat dissipation component are provided with hooks, and the heat dissipation component is connected to the two telescopic rods through the hooks; The fixing assembly includes a limiter and a third fixing part, a limit countersunk hole is provided on one side of the limiter, one end of each telescopic rod is inserted into the limit countersunk hole, the bottom end of the limiter is rotatably connected to the third fixing part, the third fixing part is a toothed structure, a plurality of plug-in holes are respectively provided on the back of the placement rack and the back of the top telescopic plate along their respective axial directions, and the teeth of the third fixing part can be plugged into the plug-in holes to install and fix the telescopic rod; Except for one end connected to the limiting member, each telescopic rod is provided with limiting rings on the left and right sides of the two placement racks and / or the two top telescopic plates and the left and right sides of the heat dissipation assembly to limit the telescopic rod and the heat dissipation assembly.

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