Bill-of-material anomaly detection method and system, electronic equipment and storage medium
During the manufacturing process of printed circuit board, it automatically detects whether there are abnormalities in the components with common pads in the bill of materials, which solves the problem of patch failure and improves production efficiency and product quality.
Patent Information
- Application Number
- CN202411515039.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-02-07
AI Technical Summary
During the manufacturing process of printed circuit boards, there is an abnormality in the components of the common pads in the bill of materials, resulting in patch failure and increasing production costs and manufacturing cycles.
By obtaining the material list of printed circuit boards, determine the material range of each component, and determine whether there are at least 2 components common pads based on these ranges. If it exists, it is determined that the components with common pads are on the same component on the bill of materials are abnormal.
It realizes automatic detection of whether there are any abnormalities in the components with common pads in the bill of materials, without manual inspection, and improves production efficiency and product quality.
Smart Images
Figure CN119397989A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a bill of materials anomaly detection method, system, electronic device and storage medium. Background Art
[0002] In the production process of modern electronic products, PCB (Printed Circuit Board) is the carrier of electronic components, and the rationality of its design is directly related to the performance, reliability and manufacturing cost of the product. Pad sharing is an important PCB design method, which is mainly used to achieve multiple electronic components sharing the same soldering area to simplify wiring, improve wiring density, reduce PCB area and reduce manufacturing costs.
[0003] The common pad design is usually used in electronic products that require high-density integration and refined layout, such as smartphones, tablets, medical devices, etc. By sharing pads, these products can accommodate more electronic components on a limited PCB area while reducing the number of solder joints and connecting wires, thereby improving product reliability and performance. Although the common pad design brings many advantages, if there are multiple components with common pads in the bill of materials (BOM) at the same time, the problem of patch failure will occur, resulting in increased production costs and manufacturing cycles.
[0004] Therefore, how to automatically detect whether there is an abnormality in the bill of materials that components with common pads are loaded at the same time is a technical problem that technical personnel in this field currently need to solve. Summary of the invention
[0005] The purpose of the present application is to provide a bill of materials anomaly detection method, system, electronic device and storage medium, which can automatically detect whether there is an anomaly in the bill of materials where components with common pads are loaded at the same time.
[0006] In order to solve the above technical problems, the present application provides a method for detecting anomalies in a bill of materials, comprising:
[0007] Get the bill of materials for the printed circuit board;
[0008] Determine the material range corresponding to each component in the bill of materials; wherein the material range is used to describe the physical space range occupied by the components when mounted on the printed circuit board;
[0009] Determine whether there are at least two components with a common pad in the bill of materials according to the material range;
[0010] If so, it is determined that there is an anomaly in the bill of materials that components with common pads are loaded at the same time.
[0011] Optionally, judging whether there are at least two components sharing a pad in the bill of materials according to the material range includes:
[0012] Calculating the material range overlap rate between components according to the material range;
[0013] If the material range overlap rate is greater than a preset overlap rate, it is determined that there are at least two components in the bill of materials that share a solder pad.
[0014] Optionally, before calculating the material range overlap rate between components according to the material range, the method further includes:
[0015] Determine the mounting density according to the number of components in the bill of materials and the size of the printed circuit board;
[0016] The preset overlap rate is set according to the mounting density; wherein the mounting density is positively correlated with the preset overlap rate.
[0017] Optionally, the bill of materials includes a material size list and a surface mount technology document, and determining the material range corresponding to each component in the bill of materials includes:
[0018] Read the size information of each component in the bill of materials from the material size list;
[0019] Reading mounting position information of each component in the bill of materials from the surface mount technology file;
[0020] The material range corresponding to each component in the bill of materials is determined according to the size information and the mounting position information.
[0021] Optionally, determining a material range corresponding to each component in the bill of materials according to the size information and the mounting position information includes:
[0022] Determine the length and width of the component according to the size information;
[0023] Determine the coordinates of the center point of the component according to the mounting position information;
[0024] The material range corresponding to each component in the bill of materials is determined according to the component length, the component width and the component center point coordinates; wherein the shape of the material range is a rectangle, the length of the rectangle is equal to the component length, the width of the rectangle is equal to the component width, and the center of the rectangle is the component center point coordinates.
[0025] Optionally, after determining that the bill of materials has an abnormality in which components with common pads are simultaneously loaded, the method further includes:
[0026] Set the components with common pads in the bill of materials as abnormal components;
[0027] Abnormal prompt information is generated according to the identification of the abnormal component, so as to correct the bill of materials according to the abnormal prompt information.
[0028] Optionally, after determining whether there are at least two components with a common pad in the bill of materials according to the material range, the method further includes:
[0029] If any two components in the bill of materials do not share a pad, it is determined that there is no abnormality in the bill of materials, and a corresponding patch program is generated.
[0030] The present application also provides a bill of materials anomaly detection system, comprising:
[0031] A material acquisition module, used to obtain the bill of materials of the printed circuit board;
[0032] A range determination module, used to determine the material range corresponding to each component in the bill of materials; wherein the material range is used to describe the physical space range occupied by the component when it is mounted on the printed circuit board;
[0033] An anomaly detection module, used for judging whether there are at least two components sharing a pad in the bill of materials according to the material range;
[0034] The result output module is used to determine that there is an abnormality in that the components with common pads in the bill of materials are simultaneously loaded if there are at least two components with common pads in the bill of materials.
[0035] The present application also provides a storage medium on which a computer program is stored, and when the computer program is executed, the steps of the above-mentioned bill of materials anomaly detection method are implemented.
[0036] The present application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor calls the computer program in the memory, the steps of executing the above-mentioned bill of materials anomaly detection method are implemented.
[0037] The present application provides a method for detecting anomalies in a bill of materials. The method obtains the bill of materials of a printed circuit board and determines the material range corresponding to each component in the bill of materials. The material range reflects the physical space range occupied by the component when it is mounted on the printed circuit board. According to the material range of each component, the present application can detect the situation where components in the bill of materials share pads. If there are at least two components sharing pads, it means that there is an anomaly in the bill of materials that components sharing pads are loaded at the same time. The above process does not require manual inspection of the bill of materials, and can automatically detect whether there is an anomaly in the bill of materials that components sharing pads are loaded at the same time. The present application also provides a system for detecting anomalies in a bill of materials, a storage medium, and an electronic device, which have the above-mentioned beneficial effects and are not repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0039] Figure 1 A flowchart of a method for detecting anomalies in a bill of materials provided in an embodiment of the present application;
[0040] Figure 2 A comparison diagram of an original process and an improved process provided in an embodiment of the present application;
[0041] Figure 3 A schematic diagram of a component with a common solder pad provided in an embodiment of the present application;
[0042] Figure 4 A flow chart of a common pad detection algorithm provided in an embodiment of the present application;
[0043] Figure 5 A schematic diagram of the structure of a bill of materials anomaly detection system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0044] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0045] See below Figure 1 , Figure 1 A flowchart of a method for detecting anomalies in a bill of materials provided in an embodiment of the present application.
[0046] Specific steps may include:
[0047] S101: Obtain a bill of materials for a printed circuit board;
[0048] The present embodiment can be applied to electronic devices with data analysis functions, and the material range of each component in the bill of materials is analyzed to determine whether there is an abnormality in the bill of materials. The bill of materials includes information about the materials.
[0049] S102: Determine the material range corresponding to each component in the bill of materials;
[0050] The material range is used to describe the physical space occupied by components when mounted on a printed circuit board, that is, the area occupied by the components on the printed circuit board. After determining the material range corresponding to each component, the degree of overlap of the material ranges of the components in the bill of materials can be compared to determine whether there is a common solder pad.
[0051] S103: Determine whether there are at least two components sharing a pad in the bill of materials according to the material range; if so, proceed to S104; if not, end the process.
[0052] Specifically, after determining the material range corresponding to each component, the material ranges of the components in the bill of materials can be compared in pairs to determine whether there are at least two components that share a pad. If any two components in the bill of materials do not share a pad, it is determined that there is no anomaly in the bill of materials, and a corresponding patch program is generated.
[0053] S104: Determine that there is an anomaly in the bill of materials that components with common pads are loaded at the same time.
[0054] After determining that there are at least two components with common pads in the bill of materials, it can be determined that there is an anomaly in the bill of materials where components with common pads are loaded at the same time. This process can troubleshoot and solve the common pad problem closer to the source, improve product design quality, and reduce manufacturing costs.
[0055] This embodiment obtains the bill of materials of the printed circuit board and determines the material range corresponding to each component in the bill of materials, which reflects the physical space range occupied by the components when mounted on the printed circuit board. According to the material range of each component, this embodiment can detect the situation of components sharing pads in the bill of materials. If there are at least two components sharing pads, it means that there is an abnormality in the bill of materials that components sharing pads are loaded at the same time. The above process does not require manual inspection of the bill of materials, and can automatically detect whether there is an abnormality in the bill of materials that components sharing pads are loaded at the same time.
[0056] As for Figure 1 Further introduction to the corresponding embodiment can be made by judging whether there are at least two components with common pads in the following manner: calculating the material range overlap rate between the components according to the material range; if the material range overlap rate is greater than the preset overlap rate, judging that there are at least two components with common pads in the bill of materials. If the overlap rate of the material ranges corresponding to any two components is less than or equal to the preset overlap rate, it can be judged that there are no components with common pads in the bill of materials.
[0057] The above embodiment sets a preset overlap rate to avoid misjudgment caused by the close arrangement of components. Specifically, before determining whether the overlap rate of the material range corresponding to at least two components is greater than the preset overlap rate, a fixed value (such as 5%) can be used as the preset overlap rate, or the preset overlap rate can be set according to the mounting density.
[0058] Furthermore, before calculating the material range overlap rate between components according to the material range, the mounting density can also be determined according to the number of components in the bill of materials and the size of the printed circuit board; the preset overlap rate is set according to the mounting density; wherein the mounting density is positively correlated with the preset overlap rate. Specifically, in this embodiment, the ratio of the number of components to the size (i.e., area) of the printed circuit board can be used as the mounting density.
[0059] As a feasible implementation method, the process of determining whether there are at least two components in the bill of materials that share a pad can be achieved in the following manner: divide the components in the bill of materials into multiple material subsets, and determine whether the material subsets meet the preset conditions; if so, determine that there are at least two components in the bill of materials that share a pad. The above preset conditions are: at least two components in the same material subset share a pad. If all material subsets do not meet the preset conditions, it means that there is no abnormality in the bill of materials that components with common pads are loaded at the same time. In this embodiment, material subsets can be obtained by dividing the components according to their mounting positions on the printed circuit board, for example, components mounted in the upper left area, upper right area, lower left area, and lower right area are divided into different material subsets. The above method can reduce the amount of calculation for material range comparison and improve the efficiency of detecting abnormalities in the bill of materials.
[0060] As for Figure 1 Further introduction to the corresponding embodiment, the bill of materials includes a material size list and a surface mount technology file, and the material range corresponding to each component in the bill of materials can be determined in the following manner: reading the size information of each component in the bill of materials from the material size list; reading the mounting position information of each component in the bill of materials from the surface mount technology file; and determining the material range corresponding to each component in the bill of materials based on the size information and the mounting position information. In addition, this embodiment can also read the material size list and the surface mount technology file from the electronic document management system.
[0061] In this embodiment, the material range corresponding to each component is a rectangle, and the material size list includes the length and width of the rectangular material range corresponding to each component. The surface mount technology file SMT (Surface Mount Technology) includes the mounting position information of each component, and the mounting position information can be the coordinates of the corner points of the rectangular material range, or the coordinates of the center point of the rectangular material range. Specifically, in this embodiment, the material range can be determined in the following manner: determine the component length and component width according to the size information, determine the component center point coordinates according to the mounting position information, and determine the material range corresponding to each component in the bill of materials according to the component length, the component width and the component center point coordinates; wherein the shape of the material range is a rectangle, the length of the rectangle is equal to the component length, the width of the rectangle is equal to the component width, and the center of the rectangle is the component center point coordinate.
[0062] As for Figure 1Further introduction to the corresponding embodiment, after determining that there is an abnormality in that components with common pads are loaded simultaneously in the bill of materials, the components with common pads in the bill of materials can also be set as abnormal components; and abnormal prompt information is generated based on the identification of the abnormal components so that the bill of materials can be corrected based on the abnormal prompt information.
[0063] After determining the abnormal components, the above process can generate abnormal prompt information containing the identification of all abnormal components. This embodiment can also transmit the abnormal prompt information to the terminal device of the staff so that the staff can correct the bill of materials according to the abnormal prompt information. Multiple components share the same pad, so the information of these components may need to be listed in the bill of materials at the same time. When correcting the bill of materials, the description and classification of the relevant components can be checked multiple times.
[0064] The process described in the above embodiment is explained below through an embodiment in actual application.
[0065] Although the common pad design brings many advantages, there are also some problems in practical applications. Among them, a key problem is that the common pad design does not allow multiple devices to be loaded at the same time. If it is found that there are components involved in the common pad design in the BOM that are loaded at the same time, the patch will fail. This failure directly increases the production cost and manufacturing cycle. In the production of printed circuit boards, hand-glued boards are usually used to simulate the patch detection of the problem of simultaneous loading of common pads. The hand-glued board is a tool used to simulate the actual patch process. It can produce a simulation board that is the same as the actual printed circuit board based on the printed circuit board design file and the bill of materials. By simulating the patch process on the hand-glued board, possible problems such as poor welding and incorrect component position can be discovered and solved in advance, thereby improving production efficiency and product quality. In the related art, a hand-glued board is usually used to detect the problem of simultaneous loading of common pads, but this method is inefficient and cannot automatically detect anomalies in the bill of materials.
[0066] See also Figure 2 , Figure 2 A comparison chart of the original process and the improved process provided in the embodiment of the present application; the R&D end performs SCH drawing and BOM publishing, and the factory end performs programming software writing, cardboard production, and machine patch operations. If there is a problem of simultaneously loading components with common pads; in the original process, manual review during SCH (circuit schematic) drawing, BOM publishing, programming software writing, and cardboard production may reveal this problem, and manual review during machine patching will inevitably reveal this problem; in the improved process, automatic review during BOM publishing can accurately discover problems. It can be seen that this solution can be used in the process to discover and deal with problems earlier.
[0067] The original process had the following flaws in R&D: When dealing with common pad issues, the schematic part usually needs to be checked separately, which not only increases labor costs, but can also cause problems to flow into the factory due to errors such as sending the wrong schematic. In addition, the format of the bill of materials (BOM) is usually based on the material number, which makes the BOM format difficult to check. In addition, the amount of information in the bill of materials is huge, so it is generally not checked at this stage. If these problems are not resolved at an early stage, a series of consequences will result, such as increasing the number of engineering change notices (ECNs), emergency handling of patch issues, etc., which will affect production schedules and costs.
[0068] The original process had the following defects in the factory: When writing the patch software, the software could only place the materials in the specified position according to the information in the bill of materials (BOM) and surface mount technology (SMT) files, but would not accurately check whether there was overlap between the materials. When using the cardboard for manual comparison, there was a high probability of finding problems, but since the production line was about to start, it was necessary to contact the R&D department to solve these problems. If the problems were found after the patch was placed, the production line would not be able to start normally.
[0069] In view of the defects existing in the above-mentioned related technologies, this application provides a solution for automatically detecting the problem of simultaneous loading of common pads based on the position and coordinates of materials in the BOM. It does not need to detect whether there is a problem of common loading of common pads through a hand-made rubber plate, but tries to discover and solve such problems at the source. If this embodiment is applied to the operation process, the problem can be discovered and solved in time at the R&D department, and the inspection can be automated to avoid the difficulty of manual inspection of existing information.
[0070] See also Figure 3 , Figure 3 A schematic diagram of a component with a common solder pad provided in an embodiment of the present application, wherein component A and component B share the same soldering area (the solder pad in the lower left corner); component A has a length of X1, a width of Y1, and a corner point coordinate of (Xa, Ya); component B has a length of X2, a width of Y2, and a corner point coordinate of (Xb, Yb).
[0071] The material range of component A is (Xa, Ya), (Xa+X1, Ya+Y1), (Xa+X1, Ya), (Xa, Ya+Y1); the material range of component B is (Xb, Yb), (Xb-X2, Yb-Y2), (Xb-X2, Yb), (Xb, Yb-Y2); based on the above material range, it can be determined whether the areas occupied by components A and B overlap, and then whether there is a problem of common solder pads and common parts. For example, if the overlap rate of the material range of components A and B is greater than 5%, there is a problem of common solder pads and common parts.
[0072] The above process can be implemented by a computer program, and the process is as follows:
[0073] The corresponding point sets are set according to the material range of the components, and two point sets are selected from all point sets to perform overlapping area detection operations until all possible point set combinations are traversed.
[0074] The process of the overlapping area detection operation is as follows: receive two point sets as input and create two all-black canvases of size 100000×100000. Fill the polygonal area defined by the first point set with white on the first canvas, and fill the polygonal area defined by the second point set with white on the second canvas. Calculate the intersection of the two canvases and check whether there are white pixels in the intersection. If there are white pixels, it means that the areas defined by the two point sets overlap. If the areas defined by the two point sets overlap, calculate the ratio of the overlapping area to the convex hull area of the smaller point set. If this ratio is greater than a given preset overlap rate (such as 5%), it is determined that there is a problem of common pads and common parts; if the overlap ratio is not greater than the threshold, it is determined that there is no problem of common pads and common parts. This embodiment calculates each given material range, compares them two by two to determine whether there is a common area, and if there is a common area, determines whether the overlap rate of the overlapping area is less than 5%. This embodiment uses the coordinates and actual size of the components to calculate whether there is an intersection area in the geometric position of the components, thereby identifying the common pad problem.
[0075] See also Figure 4 , Figure 4 A flowchart of a common pad detection algorithm provided in an embodiment of the present application, the specific process is as follows: obtain the SMT file (including material code and coordinates) and the material size list (including material code and size), and establish a table connection between the SMT file and the material size list and the bill of materials BOM (including position number and material code). Based on the SMT file and the material size list and the bill of materials BOM, a table generation operation is performed to obtain a material geometry position table, which includes detailed information such as material code, coordinates and size. The material geometry position table is used as the input of the geometric overlap check algorithm to detect whether there is an overlapping area, and the overlap rate of the overlapping area is compared with the overlap rate of the reasonable area of the material (the default is 5%) and the result is output to detect whether there is a common pad. The overlap rate of the reasonable area of the material as the input parameter is determined according to the material size tolerance (the default is 5%).
[0076] The above method can realize the simultaneous identification of all components in the BOM, and the input parameters of the algorithm include: material size tolerance and material reasonable overlap area. Material size tolerance refers to the impact caused by tolerance in the production process, which is reflected in the positive and negative tolerances in position and size. In order to avoid misjudgment when the devices are closely arranged, this tolerance can be added to any position in the production process. On the other hand, the reasonable overlap area of materials refers to the situation where misjudgment is prevented when the devices are closely arranged by setting an overlap threshold. These two parameters jointly ensure the accuracy and reliability of the production process. The common pad design plays an important role in the manufacture of electronic products, and the common pad detection algorithm provided in this embodiment is of great significance for improving the efficiency and quality of electronic product manufacturing.
[0077] See also Figure 5 , Figure 5 A schematic diagram of the structure of a bill of materials anomaly detection system provided in an embodiment of the present application, the system may include:
[0078] A material acquisition module 501 is used to acquire a bill of materials for a printed circuit board;
[0079] The range determination module 502 is used to determine the material range corresponding to each component in the bill of materials; wherein the material range is used to describe the physical space range occupied by the component when mounted on the printed circuit board;
[0080] An abnormality detection module 503 is used to determine whether there are at least two components with a common pad in the bill of materials according to the material range;
[0081] The result output module 504 is used to determine that there is an abnormality in that the components with the same pads are simultaneously loaded if at least two components with the same pads exist in the bill of materials.
[0082] This embodiment obtains the bill of materials of the printed circuit board and determines the material range corresponding to each component in the bill of materials, which reflects the physical space range occupied by the components when mounted on the printed circuit board. According to the material range of each component, this embodiment can detect the situation of components sharing pads in the bill of materials. If there are at least two components sharing pads, it means that there is an abnormality in the bill of materials that components sharing pads are loaded at the same time. The above process does not require manual inspection of the bill of materials, and can automatically detect whether there is an abnormality in the bill of materials that components sharing pads are loaded at the same time.
[0083] Furthermore, the process of the abnormality detection module 503 judging whether there are at least two components sharing a solder pad in the bill of materials based on the material range includes: calculating the material range overlap rate between components based on the material range; if the material range overlap rate is greater than a preset overlap rate, determining that there are at least two components sharing a solder pad in the bill of materials.
[0084] Furthermore, it also includes:
[0085] The overlap rate calculation module is used to determine the mounting density according to the number of components in the bill of materials and the size of the printed circuit board before calculating the material range overlap rate between components according to the material range; and is also used to set the preset overlap rate according to the mounting density; wherein the mounting density is positively correlated with the preset overlap rate.
[0086] Further, the bill of materials includes a material size list and surface mount technology documents;
[0087] The process of the range determination module 502 determining the material range corresponding to each component in the bill of materials includes: reading the size information of each component in the bill of materials from the material size list; reading the mounting position information of each component in the bill of materials from the surface mount technology file; and determining the material range corresponding to each component in the bill of materials based on the size information and the mounting position information.
[0088] Furthermore, the process in which the range determination module 502 determines the material range corresponding to each component in the bill of materials according to the size information and the mounting position information includes: determining the component length and the component width according to the size information; determining the component center point coordinates according to the mounting position information; determining the material range corresponding to each component in the bill of materials according to the component length, the component width and the component center point coordinates; wherein the shape of the material range is a rectangle, the length of the rectangle is equal to the component length, the width of the rectangle is equal to the component width, and the center of the rectangle is the component center point coordinates.
[0089] Furthermore, it also includes:
[0090] The abnormal prompt module is used to set the components with common pads in the bill of materials as abnormal components after determining that there is an abnormality in that components with common pads are loaded at the same time in the bill of materials; it is also used to generate abnormal prompt information according to the identification of the abnormal components, so as to correct the bill of materials according to the abnormal prompt information.
[0091] Furthermore, the result output module 504 is also used to determine whether there are at least two components in the bill of materials that share a pad according to the material range, and if any two components in the bill of materials do not share a pad, determine that there is no abnormality in the bill of materials and generate a corresponding patch program.
[0092] Since the embodiments of the system part correspond to the embodiments of the method part, please refer to the description of the embodiments of the method part for the embodiments of the system part, which will not be repeated here.
[0093] The present application also provides a storage medium on which a computer program is stored, and when the computer program is executed, the steps provided in the above embodiment can be implemented. The storage medium may include: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and other media that can store program codes.
[0094] The present application also provides an electronic device, which may include a memory and a processor, wherein a computer program is stored in the memory, and when the processor calls the computer program in the memory, the steps provided in the above embodiment may be implemented. Of course, the electronic device may also include various network interfaces, power supplies and other components.
[0095] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of this application.
[0096] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.
Claims
1. A method for detecting anomalies in a bill of materials, characterized in that: include: Get the bill of materials for the printed circuit board; Determine the material range corresponding to each component in the bill of materials; wherein the material range is used to describe the physical space range occupied by the components when mounted on the printed circuit board; Determine whether there are at least two components with a common pad in the bill of materials according to the material range; If so, it is determined that there is an anomaly in the bill of materials that components with common pads are loaded at the same time.
2. The method for detecting anomalies in a bill of materials according to claim 1, characterized in that: Judging whether there are at least two components sharing a pad in the bill of materials according to the material range includes: Calculating the material range overlap rate between components according to the material range; If the material range overlap rate is greater than a preset overlap rate, it is determined that there are at least two components in the bill of materials that share a solder pad.
3. The method for detecting anomalies in a bill of materials according to claim 2, characterized in that: Before calculating the material range overlap rate between components according to the material range, the method further includes: Determine the mounting density according to the number of components in the bill of materials and the size of the printed circuit board; The preset overlap rate is set according to the mounting density; wherein the mounting density is positively correlated with the preset overlap rate.
4. The method for detecting anomalies in a bill of materials according to claim 1, characterized in that: The bill of materials includes a material size list and surface mount technology documents, and determines the material range corresponding to each component in the bill of materials, including: Read the size information of each component in the bill of materials from the material size list; Reading mounting position information of each component in the bill of materials from the surface mount technology file; The material range corresponding to each component in the bill of materials is determined according to the size information and the mounting position information.
5. The method for detecting anomalies in a bill of materials according to claim 4, characterized in that: Determining a material range corresponding to each component in the bill of materials according to the size information and the mounting position information includes: Determine the length and width of the component according to the size information; Determine the coordinates of the center point of the component according to the mounting position information; The material range corresponding to each component in the bill of materials is determined according to the component length, the component width and the component center point coordinates; wherein the shape of the material range is a rectangle, the length of the rectangle is equal to the component length, the width of the rectangle is equal to the component width, and the center of the rectangle is the component center point coordinates.
6. The method for detecting anomalies in a bill of materials according to claim 1, characterized in that: After determining that the bill of materials has an abnormality in which components with common pads are loaded at the same time, the method further includes: Set the components with common pads in the bill of materials as abnormal components; Abnormal prompt information is generated according to the identification of the abnormal component, so as to correct the bill of materials according to the abnormal prompt information.
7. The method for detecting anomalies in a bill of materials according to claim 1, characterized in that: After determining whether there are at least two components sharing a pad in the bill of materials according to the material range, the method further includes: If any two components in the bill of materials do not share a pad, it is determined that there is no abnormality in the bill of materials, and a corresponding patch program is generated.
8. A bill of materials anomaly detection system, characterized in that: include: A material acquisition module, used to obtain the bill of materials of the printed circuit board; A range determination module, used to determine the material range corresponding to each component in the bill of materials; wherein the material range is used to describe the physical space range occupied by the component when it is mounted on the printed circuit board; An anomaly detection module, used for judging whether there are at least two components sharing a pad in the bill of materials according to the material range; The result output module is used to determine that there is an abnormality in that the components with common pads in the bill of materials are simultaneously loaded if there are at least two components with common pads in the bill of materials.
9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the processor calls the computer program in the memory, the steps of the method for detecting anomalies in a bill of materials as claimed in any one of claims 1 to 7 are implemented.
10. A storage medium, characterized in that: The storage medium stores computer executable instructions, and when the computer executable instructions are loaded and executed by the processor, the steps of the material bill anomaly detection method as described in any one of claims 1 to 7 are implemented.